CN106003487A - Moulding die and material with low sealing property - Google Patents
Moulding die and material with low sealing property Download PDFInfo
- Publication number
- CN106003487A CN106003487A CN201610192105.0A CN201610192105A CN106003487A CN 106003487 A CN106003487 A CN 106003487A CN 201610192105 A CN201610192105 A CN 201610192105A CN 106003487 A CN106003487 A CN 106003487A
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- China
- Prior art keywords
- mould
- layer
- intermediate layer
- base material
- low adaptation
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3828—Moulds made of at least two different materials having different thermal conductivities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3807—Resin-bonded materials, e.g. inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
- B29C2033/385—Manufacturing moulds, e.g. shaping the mould surface by machining by laminating a plurality of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2909/00—Use of inorganic materials not provided for in groups B29K2803/00 - B29K2807/00, as mould material
- B29K2909/02—Ceramics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a moulding die for moulding products. The moulding die comprises a base material (10) made of metals; and a ceramic layer (20), which is arranged on the base material (10), comprises yttrium oxide, nitrogen, and positive ions of 4A group elements, and is used to contact the products. The moulding die also comprises a middle layer (30) arranged between the base material (10) and the ceramic layer (20). The hardness of the middle layer (30) is higher than that of the base material (10). The roughness of the middle layer (30) is stronger than that of the ceramic layer (20). After the surface of the moulding die is cleaned, the moulding die can be used to mould products again.
Description
Technical field
The present invention relates to the mould that used during a kind of moulding moulded product and low adaptation material.
Background technology
Patent documentation 1 (Japanese Unexamined Patent Publication 2011-79261 publication) discloses at the base material formed by pottery
(5) surface (8) is formed with the mould of release layer (4).
Summary of the invention
The problem that invention is to be solved
The release property of release layer (4) described in patent documentation 1, low adaptation and soil resistance are excellent.Separately
Outward, patent documentation 1 employs the base material formed by pottery, like this, can exist and be difficult to base material
Carry out machining, be difficult to base material is processed problems such as (easily crack, breach).At this
In application documents, " soil resistance " refers to, prevents the dirt of character that dirt adheres to and attachment from easily coming off
The character the two character of (being removed).The material showing low adaptation for something is considered tool
There is the soil resistance for this material.Based on this, be suitably used in present specification " soil resistance " and
" low adaptation " the two vocabulary.
The present invention proposes in view of the above-mentioned problems.It is a first object of the present invention to provide it is a kind of
Release property and low excellent adhesion and be not likely to produce the mould of crackle, breach.The present invention the second purpose
It is, it is provided that a kind of low excellent adhesion and be not likely to produce the low adaptation material of crackle, breach.
For solving the scheme of problem
The mould used when the mould of the present invention is by moulding moulded product, it is characterised in that bag
Include: metal base material；And ceramic layer, this ceramic layer is arranged on base material, comprise yittrium oxide,
Nitrogen and the cation of 4A race element, for contacting with products formed, this mould is cleaned at die surface
Followed by for moulding moulded product.
In above-mentioned mould, the mould of the present invention is characterised by, also includes between base material
And the adhesive layer between ceramic layer.
The mould used when the mould of the present invention is moulding moulded product, it is characterised in that bag
Include: metal base material；Ceramic layer, this ceramic layer comprises yittrium oxide, nitrogen and the cation of 4A race element,
For contacting with products formed；And intermediate layer, this intermediate layer between base material and ceramic layer, this molding
Mould is cleaned followed by for moulding moulded product at die surface.
In above-mentioned mould, the mould of the present invention is characterised by, also includes between base material
And the adhesive layer between intermediate layer.
In above-mentioned mould, the mould of the present invention is characterised by, also includes between
Adhesive layer between layer and ceramic layer.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer is with monolayer shape
Become.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer is with multilamellar shape
Become.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer is with multilamellar shape
Become, make between adhesive layer at least two intermediate layer in multiple intermediate layers.
In above-mentioned mould, the mould of the present invention is characterised by, adhesive layer is with monolayer shape
Become.
In above-mentioned mould, the mould of the present invention is characterised by, adhesive layer is with multilamellar shape
Become.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer has hardness
Higher than the hardness of base material and toughness more than the part of the toughness of ceramic layer.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer is at least being leaned on
The hardness of the surface portion of ceramic layer side is higher than the hardness of base material.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer includes buffering
Layer, the hardness of this cushion structure uprises along with going towards ceramic layer side from substrate side.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer includes passing through
Change the composition in intermediate layer and make hardness continually varying cushion.
In above-mentioned mould, the mould of the present invention is characterised by, intermediate layer include by
The nitride of M-A system (M is titanium, chromium, nickel, zirconium, aluminum or silicon, and A is nitrogen, carbon or oxygen), carbonization
The part that thing, oxide are formed.
In above-mentioned mould, the mould of the present invention is characterised by, adhesive layer include by titanium,
The part that chromium, nickel, zirconium, yttrium, aluminum, the monomer of silicon or their mixture are formed, or, including by
The part that the oxide of monomer or the oxide containing multiple monomers are formed.
The resin that the low adaptation material of the present invention is used when being for moulding moulded product has low closely sealed
The low adaptation material of property, it is characterised in that including: metal base material；And ceramic layer, this pottery
Enamel coating is arranged on base material, comprises yittrium oxide, nitrogen and the cation of 4A race element, for connecing with resin
Touch.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, also includes
Adhesive layer between base material and intermediate layer.
The resin that the low adaptation material of the present invention is used when being for moulding moulded product has low closely sealed
The low adaptation material of property, it is characterised in that including: metal base material；Ceramic layer, this ceramic layer
Comprise yittrium oxide, nitrogen and the cation of 4A race element, for contacting with resin；And intermediate layer, in this
Interbed is between base material and ceramic layer.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, also includes
Adhesive layer between base material and intermediate layer.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, also includes
Adhesive layer between layer and ceramic layer between.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
Formed with monolayer.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
Formed with multilamellar.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
Formed with multilamellar, make between adhesive layer at least two intermediate layer in multiple intermediate layers.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, adhesive layer
Formed with monolayer.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, adhesive layer
Formed with multilamellar.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
There is hardness higher than the hardness of base material and toughness more than the part of the toughness of ceramic layer.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
At least hardness in the surface portion by ceramic layer side is higher than the hardness of base material.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
Including cushion, the hardness of this cushion uprises along with going towards ceramic layer side from substrate side.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
Hardness continually varying cushion is made including the composition by change intermediate layer.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, intermediate layer
Including by the nitride of M-A system (M is titanium, chromium, nickel, zirconium, aluminum or silicon, and A is nitrogen, carbon or oxygen),
The part that carbide, oxide are formed.
In above-mentioned low adaptation material, the low adaptation material of the present invention is characterised by, adhesive layer
Including the part formed by titanium, chromium, nickel, zirconium, yttrium, aluminum, the monomer of silicon or their mixture, or
Person, the part formed including the oxide by monomer or the oxide containing multiple monomers.
Additionally, being meant that of " hardness " mentioned in present specification: use Shimano Inc
Make made " submicroscopic dynamic stiffness meter " (model: DUH-211S), at " pressure head: pyrometric cone
Pressure head (Berkovich type, between rib, angle is 115 °), from surface compression distance: 0.1 μm, load
Speed: setting value 80 (0.8758mN/sec), duration of load: 15sec " such measuring condition
Lower measured hardness.
The effect of invention
In accordance with the invention it is possible to provide release property and low excellent adhesion and be not likely to produce crackle, breach
Mould and low excellent adhesion and be not likely to produce the low adaptation material of crackle, breach.
From the following detailed description of the invention being understood based on accompanying drawing, specify the above-mentioned mesh of the present invention
And other purposes, feature, scheme, advantage.
Accompanying drawing explanation
Fig. 1 is the figure of the section of the mould representing one embodiment of the present invention.
Fig. 2 is the figure of the section of the mould of other embodiments representing the present invention.
Fig. 3 is the profile of an example of the structure representing intermediate layer in more detail.
Fig. 4 is the profile of other examples of the structure representing intermediate layer in more detail.
Fig. 5 is the profile of other examples of the structure representing intermediate layer in more detail.
Fig. 6 is that the demoulding evaluated by the mould representing the mould to one embodiment of the invention and comparative example
The figure of the experimental result obtained by after property.
Fig. 7 is to represent the forming action using the mould of one embodiment of the invention to carry out stipulated number
After the photo of bottom surface of this mould.
Fig. 8 is to represent this molding after using the mould of comparative example to carry out the forming action of stipulated number
The photo of the bottom surface of mould.
Fig. 9 A be the mould of the mould of one embodiment of the invention and comparative example before the forming
The photo of bottom surface, Fig. 9 B is to represent that the mould using one embodiment of the invention carries out stipulated number
Forming action after this mould bottom surface photo and use comparative example mould carry out
The photo of the bottom surface of this mould after the forming action of stipulated number.
Figure 10 A is the mould representing mould and the comparative example utilizing one embodiment of the invention
And the figure of the experimental result obtained by after using four kinds of resins to be evaluated bonding force, Figure 10 B is table
Show and utilize the mould of one embodiment of the invention and the mould of comparative example and use with above-mentioned
Identical resin is to the experiment obtained by bonding continuously after the relation between number of times and bonding force is evaluated
The figure of result.
Description of reference numerals
10 metal bases, 20 ceramic layers, 30 intermediate layers, 31,31A, 31B cushion, 32A, 32B,
32C, 32D adhesive layer.
Detailed description of the invention
Hereinafter, embodiments of the present invention are illustrated.It should be noted that sometimes to same or
The reference that suitable part mark is same, does not explain over and over again this part.
During it should be noted that embodiments described below is mentioned to number, amount etc., except there being spy
Outside different situation about recording, the scope of the present invention is not limited to this number, amount etc..Implement it addition, following
Each element in mode, in addition to the situation having special records, being not for the purpose of the present invention must
Must.
First, general description embodiments of the present invention.
The mould used when one embodiment of the present invention is moulding moulded product, comprising: metal
The base material of system；And ceramic layer, this ceramic layer is arranged on above-mentioned base material, comprise yittrium oxide, nitrogen and
The cation of 4A race element, for contacting with above-mentioned products formed.Can be at above-mentioned base material and above-mentioned pottery
Adhesive layer is set between Ceng.
It addition, the mould that a mode of the present invention is used when being moulding moulded product, comprising: golden
Belong to the base material of system；And ceramic layer, this ceramic layer comprises yittrium oxide, nitrogen and the cation of 4A race element,
For contacting with above-mentioned products formed, this mould also has between above-mentioned base material and above-mentioned ceramic layer
Intermediate layer.Alternatively, it is also possible to make adhesive layer between above-mentioned base material and intermediate layer.And, also may be used
So that adhesive layer is between above-mentioned intermediate layer and above-mentioned ceramic layer.
In addition it is also possible to be, when forming above-mentioned intermediate layer with multilamellar, make adhesive layer between above-mentioned multiple
Between at least two intermediate layer in intermediate layer.
Moreover, it can be, form above-mentioned adhesive layer with single or multiple lift.
It addition, in above-mentioned mould, above-mentioned intermediate layer has hardness and is higher than the hardness of above-mentioned base material also
And toughness is more than the part of the toughness of above-mentioned ceramic layer.It addition, above-mentioned intermediate layer is at least by above-mentioned pottery
The hardness of the surface portion of layer side is higher than the hardness of above-mentioned base material.
Alternatively, it is also possible to be, in above-mentioned mould, above-mentioned intermediate layer includes cushion, such as,
Its hardness of above-mentioned cushion uprises along with going towards above-mentioned ceramic layer side from above-mentioned substrate side.
Alternatively, it is also possible to be, in above-mentioned mould, it is configured to above-mentioned intermediate layer and includes adhesive layer.
Furthermore it is possible to arrange multiple cushion, the adhesive layer of single or multiple lift can be made between at least two
Between cushion.
Additionally, the most above-mentioned adhesive layer plays the effect of cushion.
It addition, such as, sometimes it is difficult to intermediate layer (cushion) and ceramic layer be connect with the adhesive layer of monolayer
Altogether.At this point it is possible to make multilamellar adhesive layer (such as, when configuring three layers, from ceramic layer side by
It is set to the first adhesive layer, the second adhesive layer, the 3rd adhesive layer) layer (cushion) and pottery between
Step by step intermediate layer and ceramic layer are joined together between Ceng (with reference to Fig. 5).
I.e., it is possible to utilize the material easily bonded with ceramic layer to form the first bonding that same ceramic layer contacts
Layer, and, utilize easily and material that intermediate layer (cushion) bonds forms same intermediate layer (cushion)
Other adhesive layers (being equivalent to above-mentioned 3rd adhesive layer) of contact.I.e., it is possible to as required, will bonding
Layer makes multi-ply construction.
Additionally, when the adhesive layer of above-mentioned multilamellar is set to three layers, it is possible to utilize the second adhesive layer by above-mentioned
First adhesive layer and above-mentioned 3rd adhesive layer are joined together, and this second adhesive layer is glued by easy and above-mentioned first
The material closing layer and the bonding of the 3rd adhesive layer is formed.
Sum it up, above-mentioned intermediate layer substantially cushion, above-mentioned intermediate layer (cushion) can be borrowed
Adhesive layer is helped to engage (adhesive layer additional to intermediate layer) with other layers.
It addition, such as in the example of the figure, above-mentioned intermediate layer can be made up of cushion and adhesive layer, above-mentioned
Intermediate layer becomes the intermediate layer (additional adhesive layer in intermediate layer) including above-mentioned adhesive layer.
Therefore, for the intermediate layer of the present invention, it is possible to by adhesive layer in the way of external or inherence
Mode is additional to the cushion essentially becoming intermediate layer.
Additionally, the intermediate layer of the present invention can simply be cushion, it is also possible to be only adhesive layer.
It addition, cushion has adhesive effect sometimes, adhesive layer has cushioning effect sometimes.
It addition, the cushion effect in above-mentioned intermediate layer (cushion or adhesive layer) is described.Above-mentioned pottery
Layer is thin layer, and for above-mentioned metal base material, hardness is big and toughness is little.Intermediate layer conduct is set
Relax the difference of the hardness of the rwo and the layer of the difference of toughness.
Hereinafter, accompanying drawing is utilized to be specifically described.
Fig. 1 is the figure of the section of the mould representing present embodiment.The mould of present embodiment
For moulding resin products formed etc., as it is shown in figure 1, this mould includes metal base 10 and pottery
Layer 20, this ceramic layer 20 is arranged on metal base 10, for contacting with products formed.
Metal base 10 can be by ferrous material (such as, rustless steel, carbon steel, steel alloy, alloy tool
Steel, high-speed steel, perhardened steel etc.) constitute, it is also possible to (copper system, aluminum system, superhard by the material of non-ferric system
Alloy system etc.) constitute.Thereby, it is possible to manufacture excellent in workability and be not likely to produce the metal of crackle, breach
Base material 10.
Ceramic layer 20 comprises yittrium oxide, nitrogen and the cation of 4A race element.Thus, it is provided that release property and low
The mould of excellent adhesion.Can also be that metal base 10 and ceramic layer 20 glue by not shown
Close layer to engage.
Metal base 10 can be formed by the existing intermetallic composite coating method such as machining, electro-discharge machining.
Ceramic layer such as can be formed by the physical vapor deposition such as sputtering method, ion plating method (PVD).
In the example in fig 1, the thickness of ceramic layer 20 is about 0.1 μm～5 μm.Metal base 10 and pottery
The thickness of the adhesive layer between enamel coating 20 is about 0.01 μm～1 μm.
Fig. 2 is the figure of the section of the mould representing other embodiments.At the embodiment shown in Fig. 2
In, mould is also equipped with the intermediate layer 30 between base material 10 and ceramic layer 20.Intermediate layer 30 has
Hardness higher than the hardness of metal base 10 and toughness more than the part of the toughness of ceramic layer 20.Thus, energy
Enough suppression ceramic layers 20 rupture, suppress ceramic layer 20 to peel off from metal base 10.
In the example in figure 2, the thickness in intermediate layer 30 is about 0.2 μm～5 μm.The thickness of ceramic layer 20
As the example of Fig. 1, it is about 0.1 μm～5 μm.
Then, Fig. 3 to Fig. 5 is utilized to illustrate in greater detail the structure in intermediate layer 30.In the example in figure 3,
Intermediate layer 30 has cushion 31A, 31B and adhesive layer 32A, 32B, in the example in fig. 4, intermediate layer
30 have cushion 31 and adhesive layer 32A, 32B, and in the example of fig. 5, intermediate layer 30 has cushion
31A, 31B and adhesive layer 32A～32D.
That is, cushion both can be such as Fig. 3, be made up of multilamellar as shown in Figure 5, it is also possible to as shown in Figure 4
It is made up of monolayer like that.For adhesive layer, both can be as shown in Figure 3, Figure 4 like that at cushion
Both sides are constituted by monolayer, it is also possible to the side at cushion is made up of multilamellar as shown in Figure 5, and
It is made up of monolayer at opposite side, it is also possible to constitute by multilamellar in the both sides of cushion.
Additionally, in the intermediate layer 30 of Fig. 5, it is also possible to substantially become intermediate layer cushion 31A,
The adhesive layer being made up of single or multiple lift is set between 31B.It addition, it is (substantial at above-mentioned cushion
Intermediate layer) be provided for other layers of bonding adhesive layer time, above-mentioned intermediate layer becomes and includes adhesive layer
Intermediate layer.
It addition, in the diagram, it is possible to cushion 31 and metal base 10 are directly joined together.And,
In the diagram, it is possible to cushion 31 and ceramic layer 20 are directly joined together.
Cushion and adhesive layer the most all can pass through the physical vapor deposition such as sputtering method, ion plating method (PVD)
Formed.
Preferably, the hardness of cushion along with metal base 10 side relatively low from hardness higher towards hardness
Ceramic layer 20 side go and uprise.Such as, for as Fig. 3, Fig. 5 be lit-par-lit structure cushion 31A,
For 31B, by making the hardness buffering less than ceramic layer 20 side of the cushion 31A of metal base 10 side
The hardness of layer 31B such that it is able to make hardness be changed stepwise.It addition, for being monolayer as shown in Figure 4
Structure cushion 31 for, it is possible to by change cushion thickness direction on composition (such as along with
Nitrogen concentration is reduced near metal base 10), make hardness consecutive variations.
Such as by M-A system, (M is titanium, chromium, nickel, zirconium, aluminum or silicon to cushion, and A is nitrogen, carbon or oxygen.)
Nitride, carbide, oxide constitute.
Adhesive layer such as includes titanium, chromium, nickel, zirconium, yttrium, aluminum, the monomer of silicon or their mixture,
Or the oxide including above-mentioned monomer or the oxide containing multiple above-mentioned monomers.
The material constituting cushion and the material constituting adhesive layer can suitably select and combine.This
Outward, the thickness (total) of cushion is about 0.2 μm～5 μm.
Then, utilize Fig. 6 that the raising of release property is illustrated by embodiments of the invention.Fig. 6 shows
Experimental result obtained by the following way, it may be assumed that make mould and the ratio of one embodiment of the invention
The mould (mould obtained by metal base implements plating hard chrome) of relatively example carries out stipulated number
Forming action, measures knockout press every time, thus evaluates release property.Including experiment described later,
The resin used in experiment is thermosetting resin (specifically, being epoxy resin).
Understand with reference to Fig. 6, compared with the mould of comparative example, use the molding of embodiments of the invention
Mould, it is possible to reduce knockout press, it is possible to utilize ceramic layer 20 to make the mould that release property is excellent.
Then, utilize Fig. 7, Fig. 8, the raising of low adaptation is illustrated by embodiments of the invention.
Fig. 7, Fig. 8 are to represent to use the mould of embodiments of the invention and the mould of comparative example to enter respectively
This mould after the forming action of row stipulated number (being 1000 times in Fig. 7, be 300 times in Fig. 8)
The photo of bottom surface.
With reference to Fig. 7, Fig. 8, the mould (Fig. 7) of embodiments of the invention carries out the molding of 1000 times
Obvious dirt does not the most occur after action, but the mould of comparative example (Fig. 8) carries out 300 times
Forming action after, in A portion, occur in that resin is adhered, B portion occur in that highlights (Japanese: Off
ラ ッ シ ュ) accumulation.And, there is variable color on the whole in die cavity bottom surface.Knowable to above result,
Ceramic layer 20 can be utilized to make the mould of low excellent adhesion.
So, according to the mould of present embodiment, it is possible to use ceramic layer 20 to make release property and low
The mould of excellent adhesion, and split by using metal base 10 that mould can be suppressed to produce
Stricture of vagina, breach.And, it is possible to utilize intermediate layer 30 to improve the joint between metal base 10 and ceramic layer 20
Structure, suppression ceramic layer 20 cracks, suppresses ceramic layer 20 to peel off from metal base 10.
Additionally, above-mentioned mould such as can use injection moulding, transfer molding, compression forming.
In the case of for transfer molding (or compression forming), it is possible to use resin material being provided with pottery
In the die cavity of layer, by be installed on the semiconductor chip sealing moulding (or compression forming) of substrate in this mould
The encapsulation (products formed) that the shape in chamber is corresponding is interior.
The low adaptation material of the present invention may be used for each mould discussed above.The present invention's is low
Adaptation material is in addition to for mould discussed above, moreover it can be used to following mould.The
The compression mold (one of forming machine) that one mould is used be arranged on tablet machine.Second mould is
The prepreg used during to manufacture carbon fibre reinforced plastic etc. carries out the mould of heating pressurization, or
It it is the mould of bar (plug) etc..
With reference to Fig. 9 A, Fig. 9 B, the low adaptation material (exploitation material) of embodiments of the invention is described
Reduce the situation of dirt attachment.As comparative example, employ by upper real at metal base (steel based material)
The mould that material (known materials) obtained by plating hard chrome is formed.Use by exploitation material shape
The mould become and the mould formed by known materials, carried out 250 forming action respectively.
For experimental result, compare with the A-stage of the die surface shown in Fig. 9 A, obtain Fig. 9 B
The state of the die surface after the molding illustrated.As shown in the photo in the left side of Fig. 9 B, for exploitation material,
The partially visible attachment slightly having resin dirt in bottom right.In addition, do not observe that resin is dirty
The attachment of thing.As shown in the photo on the right side of Fig. 9 B, for known materials, clearly visible in upper right portion
The attachment of the resin (unnecessary resin) of black.Continuous from the unnecessary resin direction to left down of attachment
Partially visible metallic luster out.This metallic luster is likely to be when the unnecessary resin of attachment is peeled off
Surface layer is taken out vestige left after stripping.The attachment of equally visible resin dirt in remaining part.From
From the point of view of color shown in photo, can speculate and the most visible tree in right lower quadrant office in exploitation material
Fat dirt is compared the resin dirt of this remaining part and is in the degree of equal or higher attachment.More than from
Content understands, and the low adaptation material of embodiments of the invention has the low close of excellence for thermosetting resin
Conjunction property.
With reference to Figure 10 A, Figure 10 B, the low adaptation material (exploitation material) of embodiments of the invention is described
Reduce the situation of dirt attachment.As comparative example, employ the mould formed by known materials.As
Shown in Figure 10 A, for any one resin in four kinds of resins, the bonding force between exploitation material and resin
The 28%～50% of the bonding force being all reduced between known materials and resin.As shown in Figure 10 B, for
For certain resin, the first time bonding after the surface of material is cleaned, exploitation material and resin it
Between bonding force be reduced between known materials and resin the 28% of bonding force.
These results represent, enter the surface (die surface) of the mould using low adaptation material
After row cleaning, it is possible to moulding moulded product on the premise of not carrying out so-called habitual molding.Habitual one-tenth
Being meant that of type, for releasing agent is attached to die surface purpose and use special resin (with
The different resin of resin used during moulding moulded product) molding that carries out.Therefore, it is possible at cleaning mold
The followed by moulding moulded product on surface, therefore, it is possible to improve the efficiency of molding engineering.Can also be according to low close
Characteristic relation between conjunction property material and resin, carries out habitual molding.
The resin used during as molding, can enumerate the thermosetting tree representated by above-mentioned epoxy resin
Fat.Mould and the low adaptation material of the present invention are applicable to thermoplastic resin.
The applicable object of the low adaptation material of the present invention is not limited to the shaping mould used during moulding moulded product
Tool.The low adaptation material of the present invention can be applicable to the manufacture of the resin used when moulding moulded product
Engineering, products formed molding engineering etc. in use mould, part, tool class, tool-class etc..
The low adaptation material of the present invention can be applicable to mix the part etc. used when resin manufactures, example
As, mixing, the part that the tabletting etc. of sheet material is used, tool class, tool-class.The present invention's is low close
That conjunction property material can be applicable to be used when manufacturing the intermediate such as prepreg, extend warmed-up pre-
Soak body or adjustment or block the part of body, tool class, tool-class etc..And, the present invention's is low close
Conjunction property material such as can be applicable to the injection moulding part such as nozzle, screw rod etc..
It is explained above embodiments of the present invention, it is to be understood that embodiment of disclosure is not
The illustration gone up in all respects, does not limit the present invention.The scope of the present invention depends on technical scheme, also wraps
Include the content equal with the content described in technical scheme and all changes carried out within the range.
Claims (32)
1. a mould, the mould used when it is moulding moulded product, it is characterised in that
This mould includes:
Metal base material；And
Ceramic layer, this ceramic layer is arranged on described base material, comprises yittrium oxide, nitrogen and 4A race element
Cation, for contacting with described products formed,
This mould is cleaned followed by for products formed described in molding at die surface.
Mould the most according to claim 1, wherein,
This mould also includes the adhesive layer between described base material and described ceramic layer.
3. a mould, the mould used when it is moulding moulded product, it is characterised in that
This mould includes:
Metal base material；
Ceramic layer, this ceramic layer comprises yittrium oxide, nitrogen and the cation of 4A race element, for described
Products formed contacts；And
Intermediate layer, this intermediate layer between described base material and described ceramic layer,
This mould is cleaned followed by for products formed described in molding at die surface.
Mould the most according to claim 3, wherein,
This mould also includes the adhesive layer between described base material and described intermediate layer.
Mould the most according to claim 3, wherein,
This mould also includes the adhesive layer between described intermediate layer and described ceramic layer.
Mould the most according to claim 3, wherein,
Described intermediate layer is formed with monolayer.
Mould the most according to claim 3, wherein,
Described intermediate layer is formed with multilamellar.
Mould the most according to claim 3, wherein,
Described intermediate layer is formed with multilamellar, makes in adhesive layer at least two in multiple described intermediate layers
Between interbed.
9. according to the mould according to any one of claim 2,4,5,8, wherein,
Described adhesive layer is formed with monolayer.
10. according to the mould according to any one of claim 2,4,5,8, wherein,
Described adhesive layer is formed with multilamellar.
11. moulds according to claim 3, wherein,
Described intermediate layer has hardness and is more than described ceramic layer higher than hardness and the toughness of described base material
The part of toughness.
12. moulds according to claim 3, wherein,
Described intermediate layer is at least higher than the hardness of described base material in the hardness of the surface portion by ceramic layer side.
13. moulds according to claim 3, wherein,
Described intermediate layer includes cushion, the hardness of this cushion along with from described substrate side towards described pottery
Enamel coating side is gone and is uprised.
14. moulds according to claim 3, wherein,
Described intermediate layer includes making hardness continually varying buffer by changing the composition in described intermediate layer
Layer.
15. moulds according to claim 3, wherein,
Described intermediate layer includes the part that the nitride by M-A system, carbide, oxide are formed, institute
Stating M is titanium, chromium, nickel, zirconium, aluminum or silicon, and described A is nitrogen, carbon or oxygen.
16. according to the mould according to any one of claim 2,4,5,8, wherein,
Described adhesive layer includes by titanium, chromium, nickel, zirconium, yttrium, aluminum, the monomer of silicon or their mixture
The part formed, or, including the oxide by described monomer or the oxide containing multiple described monomers
The part formed.
17. 1 kinds low adaptation materials, its resin used when being for moulding moulded product has low close
The low adaptation material of conjunction property, wherein,
This low adaptation material includes:
Metal base material；And
Ceramic layer, this ceramic layer is arranged on described base material, comprises yittrium oxide, nitrogen and 4A race element
Cation, for contacting with described resin.
18. low adaptation materials according to claim 17, wherein,
This low adaptation material also includes the adhesive layer between described base material and described ceramic layer.
19. 1 kinds low adaptation materials, its resin used when being for moulding moulded product has low close
The low adaptation material of conjunction property, wherein,
This low adaptation material includes:
Metal base material；
Ceramic layer, this ceramic layer comprises yittrium oxide, nitrogen and the cation of 4A race element, for described
Resin contacts；And
Intermediate layer, this intermediate layer is between described base material and described ceramic layer.
20. low adaptation materials according to claim 19, wherein,
This low adaptation material also includes the adhesive layer between described base material and described intermediate layer.
21. low adaptation materials according to claim 19, wherein,
This low adaptation material also includes the adhesive layer between described intermediate layer and described ceramic layer.
22. low adaptation materials according to claim 19, wherein,
Described intermediate layer is formed with monolayer.
23. low adaptation materials according to claim 19, wherein,
Described intermediate layer is formed with multilamellar.
24. low adaptation materials according to claim 19, wherein,
Described intermediate layer is formed with multilamellar, makes in adhesive layer at least two in multiple described intermediate layers
Between interbed.
25. according to the low adaptation material according to any one of claim 18,20,21,24, wherein,
Described adhesive layer is formed with monolayer.
26. according to the low adaptation material according to any one of claim 18,20,21,24, wherein,
Described adhesive layer is formed with multilamellar.
27. low adaptation materials according to claim 19, wherein,
Described intermediate layer has hardness and is more than described ceramic layer higher than hardness and the toughness of described base material
The part of toughness.
28. low adaptation materials according to claim 19, wherein,
Described intermediate layer is at least higher than described base material in the hardness of the surface portion by described ceramic layer side
Hardness.
29. low adaptation materials according to claim 19, wherein,
Described intermediate layer includes cushion, the hardness of this cushion along with from described substrate side towards described pottery
Enamel coating side is gone and is uprised.
30. low adaptation materials according to claim 19, wherein,
Described intermediate layer includes making hardness continually varying buffer by changing the composition in described intermediate layer
Layer.
31. low adaptation materials according to claim 19, wherein,
Described intermediate layer includes the part that the nitride by M-A system, carbide, oxide are formed, institute
Stating M is titanium, chromium, nickel, zirconium, aluminum or silicon, and described A is nitrogen, carbon or oxygen.
32. according to the low adaptation material according to any one of claim 18,20,21,24, wherein,
Described adhesive layer includes by titanium, chromium, nickel, zirconium, yttrium, aluminum, the monomer of silicon or their mixture
The part formed, or, including the oxide by described monomer or the oxide containing multiple described monomers
The part formed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015069468A JP6462454B2 (en) | 2015-03-30 | 2015-03-30 | Mold and low adhesion material |
| JP2015-069468 | 2015-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106003487A true CN106003487A (en) | 2016-10-12 |
Family
ID=57081965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610192105.0A Pending CN106003487A (en) | 2015-03-30 | 2016-03-30 | Moulding die and material with low sealing property |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6462454B2 (en) |
| KR (1) | KR20160117286A (en) |
| CN (1) | CN106003487A (en) |
| TW (1) | TW201703965A (en) |
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|---|---|---|---|---|
| JP6837506B2 (en) * | 2019-01-28 | 2021-03-03 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
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| TW200523219A (en) * | 2004-01-07 | 2005-07-16 | Asia Optical Co Inc | Multilayer core used in glass molding |
| JP2007187678A (en) * | 2007-03-14 | 2007-07-26 | Towa Corp | Evaluation method of adhesion |
| CN101291805A (en) * | 2006-04-11 | 2008-10-22 | 东和株式会社 | Low-adhesion material, mold for shaping resin and stainproof material |
| TW201117939A (en) * | 2009-10-09 | 2011-06-01 | Towa Corp | Low-adhesion material, stain-proof material, molding die, and processes for production thereof |
| CN202322973U (en) * | 2011-11-28 | 2012-07-11 | 机械科学研究总院先进制造技术研究中心 | Superhigh-temperature forming die |
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| JPH05116152A (en) * | 1991-05-20 | 1993-05-14 | Sodick Co Ltd | Ceramic forming mold |
| JP3996138B2 (en) * | 2004-03-26 | 2007-10-24 | Ｔｏｗａ株式会社 | Low adhesion material and resin mold |
| JP2006274478A (en) * | 2005-03-29 | 2006-10-12 | Mitsubishi Paper Mills Ltd | Papermaking chemical pulp having improved discoloration property |
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2015
- 2015-03-30 JP JP2015069468A patent/JP6462454B2/en active Active
-
2016
- 2016-02-17 TW TW105104551A patent/TW201703965A/en unknown
- 2016-03-29 KR KR1020160037507A patent/KR20160117286A/en not_active Application Discontinuation
- 2016-03-30 CN CN201610192105.0A patent/CN106003487A/en active Pending
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| TW200523219A (en) * | 2004-01-07 | 2005-07-16 | Asia Optical Co Inc | Multilayer core used in glass molding |
| CN101291805A (en) * | 2006-04-11 | 2008-10-22 | 东和株式会社 | Low-adhesion material, mold for shaping resin and stainproof material |
| JP2007187678A (en) * | 2007-03-14 | 2007-07-26 | Towa Corp | Evaluation method of adhesion |
| TW201117939A (en) * | 2009-10-09 | 2011-06-01 | Towa Corp | Low-adhesion material, stain-proof material, molding die, and processes for production thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6462454B2 (en) | 2019-01-30 |
| KR20160117286A (en) | 2016-10-10 |
| JP2016187941A (en) | 2016-11-04 |
| TW201703965A (en) | 2017-02-01 |
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