JP2015212827A5 - - Google Patents

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JP2015212827A5
JP2015212827A5 JP2015111587A JP2015111587A JP2015212827A5 JP 2015212827 A5 JP2015212827 A5 JP 2015212827A5 JP 2015111587 A JP2015111587 A JP 2015111587A JP 2015111587 A JP2015111587 A JP 2015111587A JP 2015212827 A5 JP2015212827 A5 JP 2015212827A5
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基板を走査方向に移動しながら、液体を介して前記基板に露光光を照射して、前記基板を露光する露光装置において、
像面に最も近い最終光学素子を有する投影光学系と、
複数の液体供給口と液体回収口と複数の気体供給口とを有し、前記最終光学素子を囲むように配置されたシール部材と、
前記複数の液体供給口から供給される液体の温度を調整する液体温調装置と、
前記複数の気体供給口から供給される気体の温度を調整する気体温調装置と、
を備え、
前記複数の液体供給口は、前記基板の表面が対向可能に配置され、且つ前記走査方向において前記最終光学素子から射出される露光光の光路空間の両側に配置され、
前記液体回収口は、前記基板の表面が対向可能に配置され、且つ前記光路空間に対して前記液体供給口の外側に、前記光路空間を囲むように配置され、
前記気体供給口は、前記基板の表面が対向可能に配置され、且つ前記光路空間に対して前記液体回収口の外側に、前記光路空間を囲むように配置されている露光装置。 In an exposure apparatus that exposes the substrate by irradiating the substrate with exposure light through a liquid while moving the substrate in the scanning direction.
A projection optical system having a final optical element closest to the image plane;
A seal member having a plurality of liquid supply ports, a liquid recovery port, and a plurality of gas supply ports, and arranged to surround the final optical element;
A liquid temperature adjusting device for adjusting the temperature of the liquid supplied from the plurality of liquid supply ports;
A gas temperature controller for adjusting the temperature of the gas supplied from the plurality of gas supply ports;
With
The plurality of liquid supply ports are disposed on opposite sides of the optical path space of the exposure light emitted from the final optical element in the scanning direction, so that the surfaces of the substrates can be opposed to each other.
The liquid recovery port is disposed so that the surface of the substrate can be opposed, and is disposed outside the liquid supply port with respect to the optical path space so as to surround the optical path space,
The gas supply port is an exposure apparatus that is disposed so that the surface of the substrate can face the gas supply port, and is disposed outside the liquid recovery port with respect to the optical path space so as to surround the optical path space. 前記気体温調装置は、前記気体供給口から供給される気体の温度と、前記光路空間に満たされた液体の温度とがほぼ等しくなるように、前記気体供給口から供給される気体の温度を調整する、請求項１に記載の露光装置。   The gas temperature control device adjusts the temperature of the gas supplied from the gas supply port so that the temperature of the gas supplied from the gas supply port is substantially equal to the temperature of the liquid filled in the optical path space. The exposure apparatus according to claim 1, which is adjusted. 前記気体温調装置は、前記気体供給口から供給される気体の温度と、前記基板の温度とがほぼ等しくなるように、前記気体供給口から供給される気体の温度を調整する、請求項１または２に記載の露光装置。   The gas temperature control device adjusts the temperature of the gas supplied from the gas supply port so that the temperature of the gas supplied from the gas supply port is substantially equal to the temperature of the substrate. Or the exposure apparatus of 2. 前記気体温調装置は、
第１気体供給口から供給される気体の温度を調整する第１気体温調装置と、
前記光路空間に対して前記第１気体供給口よりも外側に設けられた第２気体供給口から供給される気体の温度を調整する第２気体温調装置と、
を含む、請求項１に記載の露光装置。 The gas temperature control device is:
A first gas temperature controller for adjusting the temperature of the gas supplied from the first gas supply port;
A second gas temperature control device that adjusts the temperature of gas supplied from a second gas supply port provided outside the first gas supply port with respect to the optical path space;
The exposure apparatus according to claim 1, comprising: 前記第１気体温調装置は、前記第１気体供給口から供給される気体の温度と、前記光路空間に満たされた液体の温度とがほぼ等しくなるように、前記第１気体供給口から供給される気体の温度を調整する、請求項４に記載の露光装置。   The first gas temperature control device is supplied from the first gas supply port so that the temperature of the gas supplied from the first gas supply port is substantially equal to the temperature of the liquid filled in the optical path space. The exposure apparatus according to claim 4, wherein the temperature of the gas to be adjusted is adjusted. 前記第１気体温調装置は、前記第１気体供給口から供給される気体の温度と、前記基板の温度とがほぼ等しくなるように、前記第１気体供給口から供給される気体の温度を調整する、請求項４または５に記載の露光装置。   The first gas temperature control device adjusts the temperature of the gas supplied from the first gas supply port so that the temperature of the gas supplied from the first gas supply port is substantially equal to the temperature of the substrate. The exposure apparatus according to claim 4 or 5, which is adjusted. 前記液体温調装置は、前記液体供給口から前記光路空間に供給される液体の温度と、前記基板の温度とがほぼ等しくなるように、前記液体供給口から供給される液体の温度を調整する、請求項１から６のいずれか一項に記載の露光装置。   The liquid temperature adjusting device adjusts the temperature of the liquid supplied from the liquid supply port so that the temperature of the liquid supplied from the liquid supply port to the optical path space is substantially equal to the temperature of the substrate. An exposure apparatus according to any one of claims 1 to 6. 前記液体温調装置は、前記液体供給口から前記光路空間に供給される液体の温度と、前記露光装置を収容するチャンバの内部の温度と、がほぼ等しくなるように、前記液体供給口から供給される液体の温度を調整する、請求項１から７のいずれか一項に記載の露光装置。   The liquid temperature adjusting device is supplied from the liquid supply port so that the temperature of the liquid supplied from the liquid supply port to the optical path space is substantially equal to the temperature inside the chamber housing the exposure device. The exposure apparatus according to claim 1, wherein the temperature of the liquid to be adjusted is adjusted. 前記基板の温度を調整する基板温調装置をさらに備える、請求項１から８のいずれか一項に記載の露光装置。   The exposure apparatus according to any one of claims 1 to 8, further comprising a substrate temperature adjusting device that adjusts a temperature of the substrate. 前記基板温調装置は、前記液体供給口から供給される液体の温度と、前記基板の温度と、がほぼ等しくなるように、前記基板の温度を調整する、請求項９に記載の露光装置。   The exposure apparatus according to claim 9, wherein the substrate temperature adjusting device adjusts the temperature of the substrate so that the temperature of the liquid supplied from the liquid supply port is substantially equal to the temperature of the substrate. 前記基板温調装置は、前記基板を保持する基板ホルダに設けられたホルダ温調装置を含む、請求項９または１０に記載の露光装置。   The exposure apparatus according to claim 9 or 10, wherein the substrate temperature adjusting device includes a holder temperature adjusting device provided in a substrate holder that holds the substrate. 前記ホルダ温調装置は、前記基板ホルダのうち前記基板の裏面と対向する位置に設けられ前記基板に熱を放射する第１放射部を含む、請求項１１に記載の露光装置。   12. The exposure apparatus according to claim 11, wherein the holder temperature adjustment device includes a first radiation unit that is provided at a position facing the back surface of the substrate in the substrate holder and radiates heat to the substrate. 前記シール部材には、断熱構造が設けられている、請求項１から１２のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the seal member is provided with a heat insulating structure. 前記シール部材の前記液体と接触し得る部分、及び前記基板と対向する部分の少なくとも一部には、前記断熱構造が設けられている、請求項１３に記載の露光装置。   The exposure apparatus according to claim 13, wherein the heat insulating structure is provided in at least part of a portion of the seal member that can contact the liquid and a portion that faces the substrate. 前記シール部材の前記投影光学系と対向する部分に、前記断熱構造が設けられている、請求項１３または１４に記載の露光装置。   The exposure apparatus according to claim 13 or 14, wherein the heat insulating structure is provided in a portion of the seal member facing the projection optical system. 前記気体供給口を気体供給装置と接続する供給流路を囲むように、前記断熱構造が設けられている、請求項１３から１５のいずれか一項に記載の露光装置。   The exposure apparatus according to any one of claims 13 to 15, wherein the heat insulating structure is provided so as to surround a supply flow path that connects the gas supply port to a gas supply apparatus. 前記シール部材の温度を調整する機構をさらに備える、請求項１から１６のいずれか一項に記載の露光装置。   The exposure apparatus according to any one of claims 1 to 16, further comprising a mechanism for adjusting a temperature of the seal member. 請求項１から１７のいずれか一項に記載の露光装置を用いるデバイス製造方法。   A device manufacturing method using the exposure apparatus according to claim 1. 基板を走査方向に移動しながら、液体を介して前記基板に露光光を照射して、前記基板を露光する露光方法において、
像面に最も近い最終光学素子から露光光を射出することと、
前記基板の表面が対向可能に配置され、且つ前記走査方向において前記最終光学素子から射出される露光光の光路空間の両側に配置された複数の液体供給口から供給される液体の温度を調整することと、
前記基板の表面が対向可能に配置され、且つ前記光路空間に対して前記液体供給口の外側に、前記光路空間を囲むように配置された液体回収口から液体を回収することと、
前記基板の表面が対向可能に配置され、且つ前記光路空間に対して前記液体回収口の外側に、前記光路空間を囲むように配置された複数の気体供給口から供給される気体の温度を調整することと、
を含む露光方法。 In the exposure method of exposing the substrate by irradiating the substrate with exposure light through the liquid while moving the substrate in the scanning direction,
Emitting exposure light from the last optical element closest to the image plane;
The temperature of the liquid supplied from a plurality of liquid supply ports arranged on both sides of the optical path space of the exposure light emitted from the final optical element in the scanning direction is adjusted so that the surfaces of the substrate can be opposed to each other. And
Recovering a liquid from a liquid recovery port disposed so that the surface of the substrate can be opposed and outside the liquid supply port with respect to the optical path space so as to surround the optical path space;
The temperature of the gas supplied from a plurality of gas supply ports disposed so as to surround the optical path space is adjusted outside the liquid recovery port with respect to the optical path space. To do
An exposure method comprising: 前記気体の温度を調整することは、前記気体供給口から供給される気体の温度と、前記光路空間に満たされた液体の温度とがほぼ等しくなるように、前記気体供給口から供給される気体の温度を調整することを含む、請求項１９に記載の露光方法。   The temperature of the gas is adjusted by adjusting the gas supplied from the gas supply port so that the temperature of the gas supplied from the gas supply port is substantially equal to the temperature of the liquid filled in the optical path space. The exposure method according to claim 19, comprising adjusting the temperature of the exposure. 前記気体の温度を調整することは、前記気体供給口から供給される気体の温度と、前記基板の温度とがほぼ等しくなるように、前記気体供給口から供給される気体の温度を調整することを含む、請求項１９または２０に記載の露光方法。   The temperature of the gas is adjusted by adjusting the temperature of the gas supplied from the gas supply port so that the temperature of the gas supplied from the gas supply port is substantially equal to the temperature of the substrate. The exposure method according to claim 19 or 20, comprising: 前記気体の温度を調整することは、
第１気体供給口から供給される気体の温度を調整することと、
前記光路空間に対して前記第１気体供給口よりも外側に設けられた第２気体供給口から供給される気体の温度を調整することと、
を含む、請求項１９から２１のいずれか一項に記載の露光方法。 Adjusting the temperature of the gas,
Adjusting the temperature of the gas supplied from the first gas supply port;
Adjusting the temperature of the gas supplied from the second gas supply port provided outside the first gas supply port with respect to the optical path space;
The exposure method according to claim 19, comprising: 前記第１気体供給口から供給される気体の温度を調整することは、前記第１気体供給口から供給される気体の温度と、前記光路空間に満たされた液体の温度とがほぼ等しくなるように、前記第１気体供給口から供給される気体の温度を調整することを含む、請求項２２に記載の露光方法。   Adjusting the temperature of the gas supplied from the first gas supply port is such that the temperature of the gas supplied from the first gas supply port is substantially equal to the temperature of the liquid filled in the optical path space. The exposure method according to claim 22, further comprising adjusting a temperature of a gas supplied from the first gas supply port. 前記第１気体供給口から供給される気体の温度を調整することは、前記第１気体供給口から供給される気体の温度と、前記基板の温度とがほぼ等しくなるように、前記第１気体供給口から供給される気体の温度を調整することを含む、請求項２２または２３に記載の露光方法。   In adjusting the temperature of the gas supplied from the first gas supply port, the temperature of the gas supplied from the first gas supply port and the temperature of the substrate are substantially equal. 24. The exposure method according to claim 22 or 23, comprising adjusting the temperature of the gas supplied from the supply port. 前記液体の温度を調整することは、前記液体供給口から前記光路空間に供給される液体の温度と、前記基板の温度とがほぼ等しくなるように、前記液体供給口から供給される液体の温度を調整することを含む、請求項１９から２４のいずれか一項に記載の露光方法。   The temperature of the liquid is adjusted by adjusting the temperature of the liquid supplied from the liquid supply port so that the temperature of the liquid supplied from the liquid supply port to the optical path space is substantially equal to the temperature of the substrate. The exposure method according to any one of claims 19 to 24, comprising adjusting 前記液体の温度を調整することは、前記液体供給口から前記光路空間に供給される液体の温度と、露光装置を収容するチャンバの内部の温度と、がほぼ等しくなるように、前記液体供給口から供給される液体の温度を調整することを含む、請求項１９から２５のいずれか一項に記載の露光方法。   Adjusting the temperature of the liquid means that the temperature of the liquid supplied from the liquid supply port to the optical path space is substantially equal to the temperature inside the chamber containing the exposure apparatus. The exposure method according to any one of claims 19 to 25, comprising adjusting the temperature of the liquid supplied from the liquid crystal. 前記基板の温度を調整することをさらに含む、請求項１９から２６のいずれか一項に記載の露光方法。   27. The exposure method according to any one of claims 19 to 26, further comprising adjusting a temperature of the substrate. 前記基板の温度を調整することは、前記液体供給口から供給される液体の温度と、前記基板の温度と、がほぼ等しくなるように、前記基板の温度を調整することを含む、請求項２７に記載の露光方法。   28. Adjusting the temperature of the substrate includes adjusting the temperature of the substrate so that the temperature of the liquid supplied from the liquid supply port is substantially equal to the temperature of the substrate. An exposure method according to 1. 前記複数の液体供給口と前記液体回収口と前記複数の気体供給口とを有し、前記最終光学素子を囲むように配置されたシール部材の温度を調整することをさらに含む、請求項１９から２８のいずれか一項に記載の露光方法。   The method further includes adjusting a temperature of a seal member that includes the plurality of liquid supply ports, the liquid recovery port, and the plurality of gas supply ports, and is disposed so as to surround the final optical element. The exposure method according to any one of 28. 前記複数の液体供給口と前記液体回収口と前記複数の気体供給口とを有し、前記最終光学素子を囲むように配置されたシール部材には、断熱構造が設けられている、請求項１９から２９のいずれか一項に記載の露光方法。   The seal member having the plurality of liquid supply ports, the liquid recovery port, and the plurality of gas supply ports and disposed so as to surround the final optical element is provided with a heat insulating structure. 30. The exposure method according to any one of items 1 to 29. 請求項１９から３０のいずれか一項に記載の露光方法を用いるデバイス製造方法。   A device manufacturing method using the exposure method according to any one of claims 19 to 30.
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