JP2015202644A5 - - Google Patents

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Publication number
JP2015202644A5
JP2015202644A5 JP2014083633A JP2014083633A JP2015202644A5 JP 2015202644 A5 JP2015202644 A5 JP 2015202644A5 JP 2014083633 A JP2014083633 A JP 2014083633A JP 2014083633 A JP2014083633 A JP 2014083633A JP 2015202644 A5 JP2015202644 A5 JP 2015202644A5
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JP
Japan
Prior art keywords
region
heating resistor
electrodes
resistor layer
electrode
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Application number
JP2014083633A
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English (en)
Japanese (ja)
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JP2015202644A (ja
JP6289234B2 (ja
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Priority to JP2014083633A priority Critical patent/JP6289234B2/ja
Priority claimed from JP2014083633A external-priority patent/JP6289234B2/ja
Priority to US14/683,470 priority patent/US9216575B2/en
Publication of JP2015202644A publication Critical patent/JP2015202644A/ja
Publication of JP2015202644A5 publication Critical patent/JP2015202644A5/ja
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Publication of JP6289234B2 publication Critical patent/JP6289234B2/ja
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JP2014083633A 2014-04-15 2014-04-15 記録素子基板及び液体吐出装置 Active JP6289234B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014083633A JP6289234B2 (ja) 2014-04-15 2014-04-15 記録素子基板及び液体吐出装置
US14/683,470 US9216575B2 (en) 2014-04-15 2015-04-10 Recording-element substrate and liquid ejection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014083633A JP6289234B2 (ja) 2014-04-15 2014-04-15 記録素子基板及び液体吐出装置

Publications (3)

Publication Number Publication Date
JP2015202644A JP2015202644A (ja) 2015-11-16
JP2015202644A5 true JP2015202644A5 (enExample) 2017-05-18
JP6289234B2 JP6289234B2 (ja) 2018-03-07

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ID=54264362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014083633A Active JP6289234B2 (ja) 2014-04-15 2014-04-15 記録素子基板及び液体吐出装置

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US (1) US9216575B2 (enExample)
JP (1) JP6289234B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3212419B1 (en) * 2014-10-30 2019-12-04 Hewlett-Packard Development Company, L.P. Ink jet printhead
JP6598658B2 (ja) * 2015-01-27 2019-10-30 キヤノン株式会社 液体吐出ヘッドの素子基板及び液体吐出ヘッド
US10035346B2 (en) * 2015-01-27 2018-07-31 Canon Kabushiki Kaisha Element substrate and liquid ejection head
JP7037334B2 (ja) 2017-02-17 2022-03-16 キヤノン株式会社 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置
JP6942537B2 (ja) * 2017-06-29 2021-09-29 キヤノン株式会社 液体吐出ヘッド
CN111433036B (zh) * 2017-12-08 2022-03-04 惠普发展公司，有限责任合伙企业 流体分配模具及其制造方法
JP2020006632A (ja) * 2018-07-11 2020-01-16 キヤノン株式会社 記録素子基板、液体吐出装置及び記録素子基板の製造方法
JP7114380B2 (ja) * 2018-07-20 2022-08-08 キヤノン株式会社 素子基板および液体吐出ヘッド

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132259A (en) 1979-04-02 1980-10-14 Canon Inc Liquid jet recording method
JP2562439B2 (ja) * 1986-11-07 1996-12-11 キヤノン株式会社 液体噴射記録ヘッドおよび液体噴射方法
JPS63191644A (ja) 1987-02-04 1988-08-09 Seiko Epson Corp インクジエツト記録装置
JPH04173249A (ja) * 1990-11-07 1992-06-19 Fuji Xerox Co Ltd サーマルインクジェットヘッド
JPH05208496A (ja) * 1992-01-31 1993-08-20 Ricoh Co Ltd インクジェット式印字ヘッド
US6729715B2 (en) * 2002-08-14 2004-05-04 Hewlett-Packard Development Company, L.P. Fluid ejection
JP4161668B2 (ja) * 2002-10-08 2008-10-08 ソニー株式会社 液体吐出ヘッド及び液体吐出装置
US7458661B2 (en) * 2005-01-25 2008-12-02 The Regents Of The University Of California Method and apparatus for promoting the complete transfer of liquid drops from a nozzle
JP4582225B2 (ja) 2008-08-15 2010-11-17 ソニー株式会社 液体吐出装置及び液体吐出方法

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