JP2015201326A - Method of manufacturing organic electroluminescent device, organic electroluminescent device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity of a color filter by simplifying a process of forming the color filter.SOLUTION: An organic electroluminescent device includes: an element substrate 10; a first organic electroluminescent element 30B and a second organic electroluminescent element 30G provided in the element substrate 10; a sealing layer 34 laminated on the first organic electroluminescent element 30B and the second organic electroluminescent element 30G; and a colored layer 36B laminated on the sealing layer 34. The colored layer 36B is provided so as to overlap the first organic electroluminescent element 30B in plan view and not to overlap the second organic electroluminescent element 30G in plan view.

Description

  The present invention relates to a method for manufacturing an organic electroluminescent device, an organic electroluminescent device manufactured by the manufacturing method, and an electronic apparatus equipped with the organic electroluminescent device.

  For example, an organic electroluminescence device in which a color filter layer is formed on an element substrate having an organic electroluminescence element has been proposed (Patent Document 1).

  In the organic electroluminescence device of Patent Document 1, an element substrate on which an organic electroluminescence element is formed and a sealing substrate disposed opposite to the element substrate are bonded with a resin layer (a seal layer, a filling layer, or the like). It has a configuration. The organic electroluminescent element is covered with a sealing layer (a protective film, a gas barrier layer, etc.), and a color filter layer is formed on the sealing layer. The color filter layer has a blue colored layer, a green colored layer, and a red colored layer, and enhances the color purity of light emitted from the organic electroluminescence element. The sealing layer prevents oxygen and moisture from entering the organic electroluminescence element. That is, since the sealing layer suppresses intrusion of moisture or the like into the organic electroluminescence element, the color filter layer can be formed on the sealing layer.

  In the organic electroluminescence device of Patent Document 1, since the color filter layer is formed on the element substrate, the color filter layer is disposed closer to the organic electroluminescence element than in the case where the color filter layer is formed on the sealing substrate. And extraction efficiency of light emitted from the organic electroluminescence element can be improved.

JP 2008-66216 A

In the organic electroluminescence device of Patent Document 1, it is necessary to form the color filter layer at a low temperature so that the organic electroluminescence element does not deteriorate. For this reason, when the color filter layer is formed at a low temperature, the adhesive strength between the color filter layer and the adhesive layer is weaker than when the color filter layer is formed at a high temperature, and the color filter layer and the adhesive layer are easily peeled off. There was a problem.
In addition, in the process of forming the color filter layer, it is necessary to form at least a blue colored layer, a green colored layer, and a red colored layer, and the process of forming the color filter layer becomes long and productivity is poor. There was a problem.
Furthermore, when the organic electroluminescence element and the colored layer are combined, the color purity of the extracted light can be improved, but there is also a problem that the luminance is lowered as compared with the case where there is no colored layer.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An organic electroluminescence device according to this application example includes a first substrate, a first organic electroluminescence element and a second organic electroluminescence element provided on the first substrate, and the first organic electroluminescence device. A luminescent element and a sealing layer stacked on the second organic electroluminescent element; and a color filter stacked on the sealing layer, wherein the color filter is planarly viewed with the first organic electroluminescent element. It overlaps and it is provided so that it may not overlap with said 2nd organic electroluminescent element by planar view.

  The color filter is provided so as to overlap in plan view with the first organic electroluminescence element and not in plan view with the second organic electroluminescence element. That is, a color filter is formed on the first organic electroluminescence element, and no color filter is formed on the second organic electroluminescence element. Therefore, compared with the case where a color filter is formed on the second organic electroluminescence element, the process of forming the color filter is simplified, and the productivity of the process of forming the color filter can be increased.

  Application Example 2 In the organic electroluminescence device according to the application example, the organic electroluminescence device further includes an adhesive layer and a second substrate, and the second substrate is bonded to the first organic electroluminescence element in a region overlapping in plan view. It is preferable that the second substrate is bonded to the sealing layer via the adhesive layer in a region bonded to the color filter via a layer and overlapping the second organic electroluminescence element in plan view.

  The adhesive layer is bonded to the first substrate by a portion bonded to the color filter and a portion bonded to the sealing layer. For example, even if the adhesive strength between the color filter and the adhesive layer is weak, the adhesive layer has a portion that is adhered to the sealing layer, so the adhesive layer is adhered only to the color filter layer As compared with the above, the adhesive strength between the adhesive layer and the first substrate can be increased.

  Application Example 3 In the organic electroluminescence device according to the application example described above, the sealing is provided between a region overlapping the first organic electroluminescence element in plan view and a region overlapping the second organic electroluminescence element in plan view. It is preferable to further comprise a transparent layer formed on the stop layer.

  When a transparent layer formed on the sealing layer is provided between the region overlapping the first organic electroluminescence element in plan view and the region overlapping the second organic electroluminescence element in plan view, the first organic electroluminescence element A first concave portion surrounded by the sealing layer and the transparent layer is formed in the region overlapping in plan view, and a region surrounded by the sealing layer and the transparent layer in the region overlapping with the second organic electroluminescence element is formed. Two recesses are formed.

  The first recess serves as a container for forming a color filter. By filling the first recess with the color filter, the color filter can be stably formed in a region overlapping the first organic electroluminescence element in plan view. it can. Further, at least a part of the side surface of the color filter can be protected by the transparent layer. Further, the second recess may be a container filled with the adhesive layer, and the adhesive strength between the adhesive layer and the sealing layer may be increased by the anchor effect of the adhesive layer filled in the second recess.

  Application Example 4 In the organic electroluminescence device according to the application example described above, the first organic electroluminescence element is a first pixel that is covered with an insulating film and exposed through a first opening provided in the insulating film. The second organic electroluminescence element has a second pixel electrode covered with the insulating film and exposed through a second opening provided in the insulating film, and the color filter includes A first end portion is provided between a region overlapping the first organic electroluminescence element in plan view and a region overlapping the second organic electroluminescence element in plan view, and the insulating film includes the first end portion. The color filter has a thickness that is equal to or greater than the dimension between the first end and the second end. There is Masui.

  The film thickness of the color filter corresponds to the size of the color filter in the direction from the first substrate to the second substrate. The dimension between the first end and the second end corresponds to the separation distance between the color filter and the second end in a direction orthogonal to the direction from the first substrate toward the second substrate.

  When the film thickness of the color filter is set to be greater than or equal to the dimension between the first end and the second end, a line connecting the top and second ends of the color filter and the first substrate to the second substrate The angle formed by the direction toward and perpendicular to the direction is greater than 45 degrees. That is, the angle formed by the line connecting the top and the second end of the color filter and the direction from the first substrate toward the second substrate is less than 45 degrees.

  Therefore, light having an angle smaller than 45 degrees with respect to the direction from the first substrate toward the second substrate passes through the top of the color filter (outside the color filter) and enters the second end. It becomes like this. Light having an angle of 45 degrees or more with respect to the direction from the first substrate toward the second substrate passes under the top of the color filter (inside the color filter) and enters the second end. .

  Therefore, light having an angle of 45 degrees or more with respect to the direction from the first substrate toward the second substrate passes through (inside) the color filter, and the luminance is weakened by the light absorption of the color filter. Is incident on the end of the. Therefore, to reduce the influence of light having an angle of 45 degrees or more with respect to the direction from the first substrate toward the second substrate incident on the second end and reflected by the second end. Can do.

  Application Example 5 In the organic electroluminescence device according to the application example described above, it is preferable that the second organic electroluminescence element has a light emitting area smaller than that of the first organic electroluminescence element.

  The light emission area of the second organic electroluminescence element is made smaller than that of the first organic electroluminescence element. That is, when the light emission area of the first organic electroluminescence element is made larger than that of the second organic electroluminescence element, the first organic electroluminescence element has the same light emission area as that of the second organic electroluminescence element, for example. The current load (for example, current density) to the organic electroluminescence element can be reduced.

  Application Example 6 An electronic apparatus according to this application example includes the organic electroluminescence device described in the application example.

  The organic electroluminescent device described in the application example has a stronger adhesive strength between the first substrate and the adhesive layer than the case where the color filter is formed on the second organic electroluminescent element, and the first substrate is removed from the adhesive layer. It becomes difficult to peel off, and the reliability of the organic electroluminescence device can be improved. Therefore, the reliability of the electronic apparatus provided with the organic electroluminescence device described in the application example can be increased. For example, the organic electroluminescence device described in the above application example can be applied to an electronic device having a display unit such as a head-mounted display, a head-up display, an electronic viewfinder of a digital camera, a portable information terminal, or a navigator.

  Application Example 7 A method for manufacturing an organic electroluminescence device according to this application example includes a step of forming a first organic electroluminescence element and a second organic electroluminescence element on a first substrate, and the first organic electroluminescence element. And a step of laminating a sealing layer on the second organic electroluminescence element, and the sealing layer so as not to overlap the first organic electroluminescence element in plan view and to overlap the second organic electroluminescence element in plan view. And a step of laminating a color filter thereon.

  A color filter is formed so as to overlap with the first organic electroluminescence element in plan view and not to overlap with the second organic electroluminescence element in plan view. That is, a color filter is formed on the first organic electroluminescence element side, and no color filter is formed on the second organic electroluminescence element side. Therefore, compared with the case where a color filter is formed on the second organic electroluminescence element side, the process of forming the color filter is simplified, and the productivity of the process of forming the color filter can be increased.

  Application Example 8 In the method for manufacturing an organic electroluminescence device according to the application example, in a region overlapping the first organic electroluminescence element in plan view, the second substrate is bonded to the color filter via an adhesive layer, In a region overlapping the second organic electroluminescence element in plan view, it is preferable to further include a step of bonding the second substrate to the sealing layer via the adhesive layer.

  The second substrate is bonded to the portion of the first substrate where the color filter is formed and the portion of the first substrate where the sealing layer is formed via an adhesive layer. For example, even if the adhesive strength between the portion of the first substrate where the color filter is formed and the adhesive layer becomes weak, the adhesive layer is adhered to the portion of the first substrate where the sealing layer is formed. Therefore, the adhesive strength between the second substrate and the first substrate can be increased as compared with the case where the first substrate is adhered only to the portion where the color filter is formed.

  Application Example 9 In the method for manufacturing an organic electroluminescence device according to the application example, it is preferable that the color filter and the sealing layer are formed at a temperature of 110 ° C. or less.

  By forming the color filter and the sealing layer at a low temperature of 110 ° C. or lower, deterioration (thermal deterioration) of the organic light emitting layer can be suppressed.

1 is a schematic plan view showing an outline of an organic electroluminescence device according to Embodiment 1. FIG. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the organic electroluminescence device according to the first embodiment. The schematic plan view which shows the state of the component of a sub pixel. FIG. 4 is a schematic cross-sectional view of the organic electroluminescence device taken along line BB in FIG. 3. The schematic plan view which shows the state of a color filter layer. The schematic sectional drawing of the organic electroluminescent apparatus along the AA line of FIG. (A) is a schematic sectional drawing of the area | region C enclosed with the broken line of FIG. 3, (b) is a schematic sectional drawing of the area | region D enclosed with the broken line of FIG. The process flow which shows the manufacturing method of an organic electroluminescent apparatus. The schematic sectional drawing which shows the state after passing through each process of the process flow shown in FIG. The schematic sectional drawing which shows the state after passing through each process of the process flow shown in FIG. FIG. 4 is a schematic cross-sectional view showing the structure of an organic electroluminescence device according to Embodiment 2. FIG. 5 is a schematic plan view showing a state of a color filter layer according to Embodiment 2. FIG. 6 is a schematic plan view showing a state of a color filter layer according to Embodiment 3. FIG. 6 is a schematic plan view showing a state of a color filter layer according to Embodiment 4. FIG. 6 is a schematic plan view showing an arrangement state of sub-pixels of an organic electroluminescence device according to a fifth embodiment. The schematic plan view which shows the state of the partition arrange | positioned at the color filter layer. The schematic plan view which shows the state of the colored layer arrange | positioned at the color filter layer. FIG. 7 is a schematic diagram of a head mounted display according to a sixth embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. Such an embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the technical idea of the present invention. In each of the following drawings, the scale of each layer or each part is made different from the actual scale so that each layer or each part can be recognized on the drawing.

(Embodiment 1)
"Outline of organic electroluminescence equipment"
The organic electroluminescence (hereinafter referred to as EL) device 100 according to the first embodiment is a self-luminous microdisplay suitable for a display unit of a head-mounted display described later.
FIG. 1 is a schematic plan view showing an outline of the organic EL device according to the present embodiment. FIG. 2 is an equivalent circuit diagram showing an electrical configuration of the organic EL device according to the present embodiment.
First, with reference to FIG.1 and FIG.2, the outline | summary of the organic EL apparatus 100 which concerns on this embodiment is demonstrated.

As shown in FIG. 1, the organic EL device 100 according to this embodiment includes an element substrate 10 and a protective substrate 40. Both substrates are bonded by an adhesive layer 42 (see FIG. 4) described later.
The element substrate 10 is an example of the “first substrate” in the present invention. The protective substrate 40 is an example of the “second substrate” in the present invention.

The element substrate 10 has a display region E in which sub-pixels 18B that emit blue light, sub-pixels 18G that emit green light, and sub-pixels 18R that emit red light are arranged. In the organic EL device 100, a pixel 19 including the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R is used as a display unit to provide a full color display.
In the following description, the sub pixel 18B, the sub pixel 18G, and the sub pixel 18R may be referred to as a sub pixel 18.

  A plurality of external connection terminals 103 are arranged along the first side of the element substrate 10. Between the plurality of external connection terminals 103 and the display area E, a data line driving circuit 15 is provided. A scanning line driving circuit 16 is provided between the second and third sides that are orthogonal to the first side and face each other, and the display region E.

  The protective substrate 40 is smaller than the element substrate 10 and is disposed so that the external connection terminals 103 are exposed. The protective substrate 40 is a translucent insulating substrate, and for example, a quartz substrate or a glass substrate can be used. In the present embodiment, the light transmittance of the protective substrate 40 is preferably 80% or more, more preferably 90% or more. The protective substrate 40 has a role of protecting the later-described organic EL element 30 (see FIG. 2) disposed in the display area E from being damaged, and is provided wider than the display area E.

  Hereinafter, the direction along the first side is defined as the X direction. A direction along the other two sides (second side and third side) orthogonal to the first side and facing each other is defined as a Y direction. A direction from the element substrate 10 toward the protective substrate 40 is defined as a Z direction. Further, viewing from the protective substrate 40 side along the Z direction is referred to as a plan view.

In the display area E, a color filter layer 36 is provided. The color filter layer 36 includes a colored layer 36B that transmits blue light (hereinafter referred to as a blue colored layer 36B), a colored layer 36R that transmits red light (hereinafter referred to as a red colored layer 36R), It has the partition wall 37 (refer FIG. 4) mentioned later. The colored layer 36B is disposed in the sub-pixel 18B and has a stripe shape extending in the Y direction. The red colored layer 36R is disposed in the sub-pixel 18R and has a stripe shape extending in the Y direction.
The blue colored layer 36B is an example of the “color filter” in the present invention.

  As shown in FIG. 2, the organic EL device 100 includes a scanning line 12 and a data line 13 that intersect with each other, and a power supply line 14. The scanning line 12 is electrically connected to the scanning line driving circuit 16, and the data line 13 is electrically connected to the data line driving circuit 15. In addition, a sub-pixel 18 is provided in an area partitioned by the scanning line 12 and the data line 13.

  The sub-pixel 18 includes an organic EL element 30 and a pixel circuit 20 that controls driving of the organic EL element 30.

  The organic EL element 30 includes a pixel electrode 31, a light emitting functional layer 32, and a counter electrode 33. The pixel electrode 31 functions as an anode that supplies holes to the light emitting functional layer 32. The counter electrode 33 functions as a cathode that supplies electrons to the light emitting functional layer 32. The holes supplied from the pixel electrode 31 and the electrons supplied from the counter electrode 33 are combined in the light emitting functional layer 32, and the light emitting functional layer 32 emits white light.

  The organic EL element 30 includes a first organic EL element 30B disposed in the sub pixel 18B, a second organic EL element 30G disposed in the sub pixel 18G, and a third organic EL element 30R disposed in the sub pixel 18R. Consists of.

  The pixel circuit 20 includes a switching transistor 21, a capacitor 22, and a driving transistor 23. The two transistors 21 and 23 can be configured using, for example, n-channel or p-channel transistors.

  The gate of the switching transistor 21 is electrically connected to the scanning line 12. The source of the switching transistor 21 is electrically connected to the data line 13. The drain of the switching transistor 21 is electrically connected to the gate of the driving transistor 23.

  The drain of the driving transistor 23 is electrically connected to the pixel electrode 31 of the organic EL element 30. The source of the driving transistor 23 is electrically connected to the power supply line 14. A capacitor 22 is electrically connected between the gate of the driving transistor 23 and the power supply line 14.

  At the timing when the scanning line 12 is driven and the switching transistor 21 is turned on, the potential based on the image signal supplied from the data line 13 is held in the capacitor 22 via the switching transistor 21. The on / off state of the driving transistor 23 is determined according to the potential of the capacitor 22, that is, the gate potential of the driving transistor 23. When the driving transistor 23 is turned on, a current corresponding to the gate potential flows from the power supply line 14 to the organic EL element 30 through the driving transistor 23. The organic EL element 30 emits light according to the amount of current flowing through the light emitting functional layer 32.

"Overview of sub-pixels"
FIG. 3 is a schematic plan view showing the state of the constituent elements of the sub-pixel. In FIG. 3, the reflective layer 25, the pixel electrode 31, and the opening 28CT of the insulating film 28 (see FIG. 4) among the components of the sub-pixel 18 are illustrated, and the other components are not illustrated. .
Further, as will be described later, the pixel electrode 31 is provided for each sub-pixel 18, and the light emitting functional layer 32 and the counter electrode 33 are provided continuously over the plurality of sub-pixels 18. The light-emitting functional layer 32 and the counter electrode 33 are not divided for each sub-pixel 18, but for convenience, it is described that the organic EL element 30 is provided for each sub-pixel 18. Furthermore, the reflective layer (first reflective layer) 25 may be formed continuously over the plurality of subpixels 18 or may be formed for each subpixel 18.
Next, an outline (state of components) of the sub-pixel 18 will be described with reference to FIG.

Although details will be described later, the reflective layer 25, the pixel electrode 31, and the insulating film 28 are arranged in this order in the Z direction (see FIG. 4).
As shown in FIG. 3, the reflective layer 25 is disposed across the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R. That is, the reflective layer 25 is disposed over the entire display area E. The reflective layer 25 has an opening 25CT in each of the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R.
The reflective layer 25 forms part of the power supply line 14.

An island-shaped pixel electrode 31 is disposed in each of the sub-pixels 18. Specifically, the pixel electrode 31B is disposed in the sub pixel 18B, the pixel electrode 31G is disposed in the sub pixel 18G, and the pixel electrode 31R is disposed in the sub pixel 18R. The pixel electrode 31 is disposed so as to overlap the opening 25CT of the reflective layer 25 in plan view. Although not shown, a contact portion for electrically connecting the pixel electrode 31 and the driving transistor 23 is provided inside the opening 25CT of the reflective layer 25.
The pixel electrode 31B is an example of the “first pixel electrode” in the present invention, and the pixel electrode 31G is an example of the “second pixel electrode” in the present invention.

An insulating film 28 is provided so as to cover the peripheral edge of the pixel electrode 31. An opening 28CT that exposes the pixel electrode 31 is formed in the insulating film 28. Specifically, an opening 28BCT that exposes the pixel electrode 31B is formed in the subpixel 18B, an opening 28GCT that exposes the pixel electrode 31G is formed in the subpixel 18G, and an opening 28RCT that exposes the pixel electrode 31R is formed in the subpixel 18R. Is formed.
The opening 28BCT is an example of the “first opening” in the present invention, and the opening 28GCT is an example of the “second opening” in the present invention. The opening 28CT is a general term for the opening 28BCT, the opening 28GCT, and the opening 28RCT.

Further, the opening 28GCT has an end portion G1 along the Y direction disposed on the side close to the sub pixel 18B, and an end portion G2 along the Y direction disposed on the side close to the sub pixel 18R. .
The end G1 is an example of the “second end” in the present invention.

  As will be described in detail later, the light emitting functional layer 32 and the counter electrode 33 are sequentially laminated on the pixel electrode 31 exposed through the opening 28CT to form the organic EL element 30 (see FIG. 4). Specifically, in the sub-pixel 18B, the light emitting functional layer 32 and the counter electrode 33 are sequentially stacked on the pixel electrode 31B exposed through the opening 28BCT to form the first organic EL element 30B. In the sub-pixel 18G, the light emitting functional layer 32 and the counter electrode 33 are sequentially stacked on the pixel electrode 31G exposed through the opening 28GCT, thereby forming the second organic EL element 30G. In the sub-pixel 18R, the light emitting functional layer 32 and the counter electrode 33 are sequentially stacked on the pixel electrode 31R exposed through the opening 28RCT to form the third organic EL element 30R.

  Holes are supplied to the light emitting functional layer 32 from the pixel electrode 31 exposed through the opening 28CT, and the light emitting functional layer 32 (organic EL element 30) emits light. That is, the region where the opening 28CT is provided is a region where the organic EL element 30 is formed, and becomes the light emitting region V1 where the light emitting functional layer 32 emits light.

  In the region covered with the insulating film 28, supply of holes from the pixel electrode 31 to the light emitting functional layer 32 is suppressed, and light emission of the light emitting functional layer 32 is suppressed. That is, the region where the insulating film 28 is provided becomes a light emission suppression region V2 in which light emission of the light emitting functional layer 32 is suppressed.

"Cross-sectional structure of organic EL device"
FIG. 4 is a schematic cross-sectional view of the organic EL device along the line BB in FIG. FIG. 5 corresponds to FIG. 3 and is a schematic plan view showing a state of the color filter layer.
FIG. 5 also shows the opening 25CT of the reflective layer 25 and the opening 28CT of the insulating film 28 in order to clarify the position where the color filter layer 36 is formed.
Next, a cross-sectional structure of the organic EL device 100 will be described with reference to FIGS. 4 and 5.

  As shown in FIG. 4, in the organic EL device 100, the element substrate 10, the adhesive layer 42, and the protective substrate 40 are sequentially stacked in the Z direction.

  The element substrate 10 includes a substrate 11, a reflective layer 25 that is sequentially stacked on the substrate 11 in the Z direction, an optical distance adjustment layer 26, an organic EL element 30, a sealing layer 34, and a color filter layer 36. Have.

The substrate 11 is a substrate made of, for example, silicon, the scanning line 12, the data line 13, the power supply line 14, the data line driving circuit 15, the scanning line driving circuit 16, the switching transistor 21, the capacitor 22, and the driving transistor 23 (FIG. 2). Is a transistor substrate formed by a known technique.
Note that the base material of the substrate 11 is not limited to silicon, and may be a light-transmitting insulating substrate such as quartz or glass.

  The reflective layer 25 is one of the pair of reflective layers that reflects the light emitted from the light emitting functional layer 32. The reflective layer 25 is formed of a material having a high reflectance, and is disposed across the plurality of subpixels 18. As a material for forming the reflective layer 25, for example, aluminum or silver can be used. In the present embodiment, the light reflectance of the reflective layer 25 is preferably 40% or more, more preferably 80% or more.

  The optical distance adjustment layer 26 includes a first insulating film 26a, a second insulating film 26b, and a third insulating film 26c. The first insulating film 26a is provided on the reflective layer 25 and is disposed in the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R. The second insulating film 26b is provided on the first insulating film 26a and is disposed in the sub-pixel 18G and the sub-pixel 18R. The third insulating film 26c is provided on the second insulating film 26b and is disposed in the sub-pixel 18R.

  That is, the optical distance adjustment layer 26 of the sub-pixel 18B is configured by the first insulating film 26a, and the optical distance adjustment layer 26 of the sub-pixel 18G is configured by the first insulating film 26a and the second insulating film 26b. The optical distance adjustment layer 26 of the pixel 18R includes a first insulating film 26a, a second insulating film 26b, and a third insulating film 26c. As a result, the film thickness of the optical distance adjustment layer 26 increases in the order of the sub pixel 18B, the sub pixel 18G, and the sub pixel 18R.

As described above, the organic EL element 30 includes the pixel electrode 31, the light emitting functional layer 32, and the counter electrode 33 that are sequentially stacked in the Z direction.
The pixel electrode 31 is made of a light transmissive material such as ITO (Indium Tin Oxide), and is formed in an island shape for each sub-pixel 18. In the present embodiment, the light transmittance of the pixel electrode 31 is preferably 50% or more, more preferably 80% or more.

  The light emitting functional layer 32 is disposed so as to cover the entire display area E. The light emitting functional layer 32 includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and the like, which are sequentially stacked in the Z direction. The organic light emitting layer emits light having red, green, and blue light components. The organic light emitting layer may be composed of a single layer or a plurality of layers (for example, a blue light emitting layer that emits blue light and a yellow light emitting layer that emits light including red and green).

  The counter electrode 33 is disposed so as to cover the entire display area E. The counter electrode 33 is made of, for example, an alloy of magnesium and silver and has light transmittance and light reflectivity. The counter electrode 33 is the other reflective layer of the pair of reflective layers that reflects the light emitted from the light emitting functional layer 32. In the present embodiment, the light transmittance of the counter electrode 33 is preferably 20% or more, more preferably 30% or more, and the light reflectance of the counter electrode 33 is preferably 20% or more, more preferably 50% or more. .

  The insulating film 28 is made of, for example, silicon oxide and is disposed so as to cover the peripheral edge of the pixel electrode 31. As described above, the insulating film 28 has the opening 28CT that exposes the pixel electrode 31, and the region in which the opening 28CT is provided is the light emitting region V1 in which the light emitting functional layer 32 emits light (the region in which the organic EL element 30 is formed). The region where the insulating film 28 is provided becomes a light emission suppression region V2 in which light emission of the light emitting functional layer 32 is suppressed.

  The sealing layer 34 includes a first sealing layer 34a, a planarization layer 34b, and a second sealing layer 34c that are sequentially stacked in the Z direction. The gas barrier property of the sealing layer 34 is not particularly limited as long as the organic EL element 30 can be protected from oxygen and water in the atmosphere, but the oxygen permeability is 0.01 cc / m 2 /. The water vapor permeability is preferably 7 × 10 −3 g / m 2 / day or less, more preferably 5 × 10 −4 g / m 2 / day or less, particularly 5 × 10 −6 g / m 2 / day or less. preferable. The light transmittance of the sealing layer 34 is preferably 80% or more with respect to the light emitted from the counter electrode 33. The sealing layer 34 covers the organic EL element 30 and is provided on substantially the entire surface of the element substrate 10. The sealing layer 34 is provided with an opening (not shown) for exposing the external connection terminal 103 (see FIG. 1).

  The first sealing layer 34a and the second sealing layer 34c are made of, for example, silicon oxynitride formed using a known technique such as plasma CVD (Chemical Vapor Deposition), and have a high barrier against moisture and oxygen. It has sex.

  The planarization layer 34b is made of, for example, an epoxy resin or a coating-type inorganic material (such as silicon oxide). The planarization layer 34b covers defects (pinholes, cracks), foreign matters, and the like of the first sealing layer 34a, and forms a flat surface.

  As shown in FIGS. 4 and 5, the color filter layer 36 is provided on the second sealing layer 34c. The color filter layer 36 includes a blue colored layer 36 </ b> B, a red colored layer 36 </ b> R, and a partition wall 37.

The partition wall 37 is made of a translucent material (for example, acrylic resin) and has translucency. The partition 37 is, for example, a material obtained by removing a coloring material from the color filter layer 36, and the same main material is used for the color filter layer 36. The light transmittance of the partition wall 37 is preferably 80% or more with respect to the light emitted from the counter electrode 33. The partition wall 37 is disposed on the second sealing layer 34c in the light emission suppression region V2 and has a stripe shape extending in the Y direction. Specifically, the partition wall 37 is provided between the region overlapping the first organic EL element 30B (opening 28BCT) in plan view and the region overlapping the second organic EL element 30G (opening 28GCT) in plan view. 28GCT) and a region overlapping the third organic EL element 30R (opening 28RCT) and a region overlapping the first organic EL element 30B (opening 28BCT) and a third organic EL element 30R. It is disposed on the second sealing layer 34c between the (opening 28RCT) and the region overlapping in plan view. As shown in FIG. 4, the partition wall 37 is provided so as to be in contact with at least a part of the side surface of the blue colored layer 36B and at least a part of the side surface of the red colored layer 36R. The partition 37 may be configured to protect at least part of the blue colored layer 36B and the red colored layer 36R.
The partition wall 37 is an example of the “transparent layer” in the present invention.

The blue colored layer 36B is disposed in the sub-pixel 18B and is formed so as to cover a part of the partition wall 37 in plan view. The blue colored layer 36B overlaps the first organic EL element 30B (opening 28BCT) in plan view, and has a stripe shape extending in the Y direction. The blue colored layer 36B has an end B1 along the Y direction on the sub-pixel 18G side.
The end B1 is an example of the “first end” in the present invention.

  The red colored layer 36R is disposed in the sub-pixel 18R and is formed so as to cover a part of the partition wall 37 in plan view. The red colored layer 36R overlaps with the third organic EL element 30R (opening 28RCT) in plan view, and has a stripe shape extending in the Y direction. The red colored layer 36R has an end portion R1 along the Y direction on the sub-pixel 18G side.

In the sub-pixel 18G, the partition wall 37 is provided in the light emission suppression region V2, and the coloring layer is not provided in the light emission region V1 (second organic EL element 30G). In other words, the blue colored layer 36B and the red colored layer 36R are provided so as not to overlap the second organic EL element 30G in plan view.
Further, the sub-pixel 18G has a recess C2 surrounded by the partition wall 37 and the second sealing layer 34c.

As shown in FIG. 4, an adhesive layer 42 is disposed between the element substrate 10 and the protective substrate 40. The adhesive layer 42 has a role of adhering the element substrate 10 and the protective substrate 40 and is made of, for example, an epoxy resin or an acrylic resin.
In the subpixel 18B, the protective substrate 40 is bonded to the colored layer 36B via the adhesive layer 42 in a region overlapping the first organic EL element 30B in plan view. In the subpixel 18R, in the region overlapping the third organic EL element 30R in plan view, the protective substrate 40 is bonded to the colored layer 36R via the adhesive layer 42.

  In the subpixel 18G, in the region overlapping the second organic EL element 30G in plan view, the protective substrate 40 is bonded to the second sealing layer 34c via the adhesive layer 42. Specifically, in the sub-pixel 18G, the adhesive layer 42 is filled in the concave portion C2 surrounded by the partition wall 37 and the second sealing layer 34c, and the protective substrate 40 and the second sealing layer 34c are bonded. .

Although details will be described later, the color filter layer 36 is a resin (for example, an acrylic resin) formed at a low temperature of 110 ° C. or lower in order to suppress thermal degradation of the organic EL element 30. When the color filter layer 36 is formed at a low temperature of 110 ° C. or lower, the adhesion strength between the color filter layer 36 and the adhesive layer 42 is higher than when the color filter layer 36 is formed at a temperature higher than 110 ° C. become weak. Further, the second sealing layer 34 c (sealing layer 34) is also formed at a low temperature of 110 ° C. or lower in order to suppress thermal degradation of the organic EL element 30. The second sealing layer 34c is made of an inorganic material (for example, silicon oxynitride), and has higher adhesive strength with the adhesive layer 42 than the color filter layer 36 made of resin.
In the sub-pixel 18G, since the adhesive layer 42 is adhered to the portion (second sealing layer 34c) made of an inorganic material, the adhesive layer 42 is adhered to the portion (color filter layer 36) made entirely of resin. Compared with the case where it is made, the adhesive strength of the element substrate 10 and the contact bonding layer 42 can be strengthened.

  Further, in the sub-pixel 18G, since the adhesive layer 42 is filled in the recess C2 surrounded by the partition wall 37 and the second sealing layer 34c, the anchor effect of the adhesive layer 42 filled in the recess C2 is achieved. Thus, the adhesive strength between the element substrate 10 and the adhesive layer 42 can be increased as compared with the case where the adhesive layer 42 is not filled in the recess C2.

Furthermore, since the contact area (adhesion area) between the element substrate 10 and the adhesive layer 42 is increased by the recess C2 formed in the sub-pixel 18G, it is bonded to the element substrate 10 as compared with the case where the recess C2 is not formed. The adhesive strength with the layer 42 can be increased.
Thus, by not forming the colored layer on the sub-pixel 18G, the adhesive strength between the element substrate 10 and the adhesive layer 42 is increased compared with the case where the colored layer is formed on the sub-pixel 18G, and the element substrate 10 is bonded. The layer 42 can be made difficult to peel off.

"Optical resonance structure"
In the light emitting region V1, a reflective layer 25 having light reflectivity, an optical distance adjusting layer 26, a pixel electrode 31, a light emitting functional layer 32, and a counter electrode 33 are sequentially stacked in the Z direction. The light emitted from the light emitting functional layer 32 is repeatedly reflected between the reflective layer 25 and the counter electrode 33, and has a specific wavelength (resonance wavelength) corresponding to the optical distance between the reflective layer 25 and the counter electrode 33. Is amplified and emitted as display light from the protective substrate 40 in the Z direction.

  The optical distance adjustment layer 26 has a role of adjusting the optical distance between the reflective layer 25 and the counter electrode 33. In the sub-pixel 18B, the film thickness of the optical distance adjustment layer 26 is set so that the resonance wavelength (peak wavelength at which the luminance is maximum) is, for example, 470 nm. In the sub-pixel 18G, the film thickness of the optical distance adjustment layer 26 is set so that the resonance wavelength is, for example, 540 nm. In the subpixel 18R, the film thickness of the optical distance adjustment layer 26 is set so that the resonance wavelength is, for example, 610 nm.

  As a result, blue light having a peak wavelength of 470 nm is emitted from the subpixel 18B, green light having a peak wavelength of 540 nm is emitted from the subpixel 18G, and red light having a peak wavelength of 610 nm from the subpixel 18R. Is emitted. In other words, the organic EL device 100 has an optical resonance structure that amplifies the intensity of light of a specific wavelength, and the sub-pixel 18B extracts a blue light component from the white light emitted from the light emitting functional layer 32, and the sub-pixel 18G. The green light component is extracted from the white light emitted from the light emitting functional layer 32, and the red light component is extracted from the white light emitted from the light emitting functional layer 32 in the sub-pixel 18R.

  The sub-pixel 18G can emit green light with excellent color purity without providing a colored layer due to the optical resonance structure. Furthermore, since the colored layer is not provided in the sub-pixel 18G, the luminance emitted from the sub-pixel 18G can be increased as compared with the case where the colored layer is provided.

  In the sub-pixel 18B, the color purity of the blue light emitted from the sub-pixel 18B is enhanced by combining the optical resonance structure and the blue colored layer 36B. In the sub-pixel 18R, the color purity of red light emitted from the sub-pixel 18R is increased by combining the optical resonance structure and the red colored layer 36R.

"Preferable color layer thickness"
FIG. 6 is a schematic cross-sectional view of the organic EL device taken along the line AA in FIG. 1, and schematically shows the state of light emitted from the organic EL element. FIG. 7A is a schematic cross-sectional view of a region C surrounded by a broken line in FIG. FIG.7 (b) is a schematic sectional drawing of the area | region D enclosed with the broken line of FIG.
In FIG. 6, the reflective layer 25, the organic EL element 30, and the sealing layer 34 among the components of the element substrate 10 are illustrated, and other components of the element substrate 10 are not illustrated. In FIG. 7, the element substrate 10 is illustrated, and the adhesive layer 42 and the protective substrate 40 are not illustrated.

  As shown in FIG. 6, most of the light L <b> 1 emitted from the organic EL element 30 is emitted as light L <b> 2 (refracted light) from the protective substrate 40 to the atmosphere 71, and the light emitted from the organic EL element 30. Part of L1 is reflected at the interface between the protective substrate 40 and the atmosphere 71 and travels toward the element substrate 10 as light L3 (reflected light).

  Assuming that the angle formed by the light L1 and the Z direction is θ1, the angle formed by the light L2 and the Z direction is θ2, the refractive index of the protective substrate 40 is n1, and the refractive index of the atmosphere 71 is n2, the Snell's law indicates Equation (1) holds.

  n1sinθ1 = n2sinθ2 (1)

  From the equation (1), the angle θ1 formed by the light L1 and the Z direction is expressed by the following equation (2).

θ1 = sin ⁻¹ ((n2sin θ2) / n1) (2)

  The condition that the angle θ2 formed by the light L2 and the Z direction is larger than 90 degrees is that the light L1 is not emitted toward the atmosphere 71, that is, the light L1 is totally reflected at the interface between the protective substrate 40 and the atmosphere 71. It corresponds to a condition. That is, in the equation (2), the angle θ1 when the angle θ2 is 90 degrees is the critical angle α at which the total reflection of the light L1 occurs at the interface between the protective substrate 40 and the atmosphere 71.

  When the refractive index n1 (approximately 1.4 to 1.5) of the protective substrate 40, the refractive index n2 (approximately 1) of the atmosphere 71, and the angle θ2 (90 degrees) when total reflection occurs are substituted into the equation (2). The critical angle α at which total reflection of the light L1 occurs at the interface between the protective substrate 40 and the atmosphere 71 can be obtained. The critical angle α in the present embodiment is approximately 45 degrees.

  When the angle θ1 formed by the light L1 and the Z direction is a critical angle α (approximately 45 degrees), the light L1 is totally reflected at the interface between the protective substrate 40 and the atmosphere 71, and the element substrate 10 is formed as light L3 (reflected light). Head to the side.

  That is, when the angle θ1 is smaller than the critical angle α, a part of the light L1 emitted from the organic EL element 30 is reflected at the interface between the protective substrate 40 and the atmosphere 71 and travels toward the element substrate 10 side. When the angle θ1 is the critical angle α, the light L1 emitted from the organic EL element 30 is totally reflected at the interface between the protective substrate 40 and the atmosphere 71 and travels toward the element substrate 10 side. When the angle θ1 is larger than the critical angle α, the light L1 emitted from the organic EL element 30 is totally reflected at the interface between the protective substrate 40 and the atmosphere 71 and travels toward the element substrate 10 side.

For this reason, compared with the case where the angle θ1 is smaller than the critical angle α, when the angle θ1 is the same as or larger than the critical angle α, the luminance of the light L3 (reflected light) toward the element substrate 10 is increased. Become very large.
The angle θ1 formed by the light L1 and the Z direction is the same as the angle formed by the light L3 and the Z direction. For example, when the angle θ1 is the critical angle α (45 degrees), the light L3 whose angle with the Z direction is the critical angle α (45 degrees) is directed toward the element substrate 10, and when the angle θ1 is 70 degrees, the Z direction. The light L3 having an angle of 70 degrees is directed toward the element substrate 10 side.

When the light L3 reflected at the interface between the protective substrate 40 and the atmosphere 71 is incident on the end of the opening 28CT of the insulating film 28, the light L3 is reflected at the end of the opening 28CT of the insulating film 28 and goes toward the Z direction. The display may be adversely affected.
Specifically, the light L3 when the angle θ1 is equal to or larger than the critical angle α has a much larger luminance than the light L3 when the angle θ1 is smaller than the critical angle α. When the light L3 having the same angle or larger than the critical angle α is incident on the end of the opening 28CT of the insulating film 28, the light L3 is reflected at the end of the opening 28CT of the insulating film 28, which may adversely affect the display.

  In the sub-pixel 18B and the sub-pixel 18R, the end portion of the opening 28CT of the insulating film 28 is covered with the colored layers 36B and 36R. Since the light L3 reflected at the interface between the protective substrate 40 and the atmosphere 71 passes through the colored layers 36B and 36R, the luminance of the light is weakened and enters the end of the opening 28CT of the insulating film 28. There is little risk of adverse effects on

  In the sub-pixel 18G, since the end of the opening 28CT of the insulating film 28 is not covered with the colored layer, the light L3 reflected at the interface between the protective substrate 40 and the atmosphere 71 is compared with the sub-pixel 18B and the sub-pixel 18R. Therefore, if the light L3 enters the end of the opening 28CT of the insulating film 28, the display may be adversely affected. That is, in the sub-pixel 18G, the light L3 when the angle θ1 is the same as or larger than the critical angle α may adversely affect the display when entering the end of the opening 28CT of the insulating film 28.

In the present embodiment, the film thicknesses of the blue colored layer 36B and the red colored layer 36R are set so as to reduce the adverse effect on the display of the light L3 in the sub-pixel 18G. Details will be described below with reference to FIG.
In FIG. 7, when the angle θ <b> 1 formed with the Z direction is a critical angle α (approximately 45 degrees), the light L <b> 3 </ b> A is attached to the light reflected at the interface between the protective substrate 40 and the atmosphere 71. When the angle θ1 formed with the Z direction is larger than the critical angle α (approximately 45 degrees), the light reflected at the interface between the protective substrate 40 and the atmosphere 71 is denoted by L3B.
That is, in FIG. 7, the angle formed between the light L3A and the Z direction is approximately 45 degrees, and the angle formed between the light L3B and the Z direction is larger than approximately 45.

  As shown in FIG. 7A, a partition wall 37 is disposed at the boundary between the sub-pixel 18B and the sub-pixel 18G, and a blue coloring layer 36B covers a part of the partition wall 37 on the sub-pixel 18B side. Has been placed. When the light L3A and the light L3B pass through the blue colored layer 36B and enter the end G1 of the opening 28GCT, the luminance of the light L3A and the light L3B is reduced, and the opening 28CT of the insulating film 28 The light reflected by the end G1 is less likely to adversely affect the display.

  Since the angle formed between the light L3A and the Z direction is a critical angle α (approximately 45 degrees), the thickness (dimension in the Z direction) BD1 of the blue colored layer 36B is set to the end B1 of the blue colored layer 36B and the opening 28GCT. When it is larger than the distance (dimension in the X direction) BD2 from the end portion G1, the light L3A passes through the blue colored layer 36B and enters the end portion G1 of the opening 28GCT. Furthermore, under the condition that the film thickness (Z-direction dimension) BD1 of the blue colored layer 36B is larger than the distance (X-direction dimension) BD2 between the end B1 of the blue colored layer 36B and the end G1 of the opening 28GCT, Z The light L3B whose angle formed with the direction is larger than the critical angle α (approximately 45 degrees) also passes through the blue colored layer 36B and enters the end G1 of the opening 28GCT.

Therefore, the light L3A and the light L3B are absorbed by the blue colored layer 36B, and the luminance of the light L3A and the light L3B incident on the end G1 of the opening 28CT of the insulating film 28 is weakened. The light reflected by the end portion G1 of 28CT is less likely to adversely affect the display.
Therefore, in this embodiment, the film thickness BD1 of the blue colored layer 36B is larger than the distance BD2 between the end B1 of the blue colored layer 36B and the end G1 of the opening 28GCT. That is, the film thickness BD1 of the blue colored layer 36B is preferably larger than the distance BD2 between the end B1 of the blue colored layer 36B and the end G1 of the opening 28GCT.

  Similarly, as shown in FIG. 7B, the film thickness (Z-direction dimension) RD1 of the red colored layer 36R is set to the distance (X between the end R1 of the red colored layer 36R and the end G2 of the opening 28GCT. When the direction dimension is larger than BD2, the light L3A passes through the red colored layer 36R and enters the end G2 of the opening 28GCT. Furthermore, under the condition that the film thickness (Z-direction dimension) BD1 of the red colored layer 36R is larger than the distance (X-direction dimension) RD2 between the end R1 of the red colored layer 36R and the end G2 of the opening 28GCT, Z The light L3B whose angle formed with the direction is larger than the critical angle α (approximately 45 degrees) also passes through the red colored layer 36R and enters the end G2 of the opening 28GCT.

Accordingly, the light L3A and the light L3B are absorbed by the red colored layer 36R, and the luminance of the light L3A and the light L3B incident on the end portion G2 of the opening 28CT of the insulating film 28 is weakened. The light reflected by the end portion G2 of 28CT is less likely to adversely affect the display.
Therefore, in this embodiment, the film thickness RD1 of the red colored layer 36R is larger than the distance RD2 between the end R1 of the red colored layer 36R and the end G2 of the opening 28GCT. That is, the film thickness RD1 of the red colored layer 36R is preferably larger than the distance RD2 between the end R1 of the red colored layer 36R and the end G2 of the opening 28GCT.

"Method for manufacturing organic EL device"
FIG. 8 is a process flow showing the method for manufacturing the organic EL device. 9 and 10 are schematic cross-sectional views showing a state after each step of the process flow shown in FIG.
The outline of the method for manufacturing the organic EL device 100 will be described below with reference to FIGS.

  As shown in FIG. 8, the method of manufacturing the organic EL device 100 includes a step of forming the pixel electrode 31 (Step S <b> 1), a step of forming the insulating film 28 (Step S <b> 2), and a step of forming the light emitting functional layer 32. (Step S3), the step of forming the counter electrode 33 (Step S4), the step of forming the sealing layer 34 (Step S5), the step of forming the partition wall 37 (Step S6), and the blue colored layer 36B The process (step S7) and the process (step S8) of forming the red colored layer 36R are included.

As shown in FIG. 9A, in step S1, for example, ITO is deposited by a known sputtering method, and is patterned using a known dry etching technique, thereby subpixel 18B, subpixel 18G, and subpixel. An island-shaped pixel electrode 31 is formed on each of 18R.
Specifically, in the sub-pixel 18B, the pixel electrode 31B is formed on the optical distance adjustment layer 26 configured by the first insulating film 26a. In the sub-pixel 18G, the pixel electrode 31G is formed on the optical distance adjustment layer 26 composed of the first insulating film 26a and the second insulating film 26b. In the sub-pixel 18R, the pixel electrode 31R is formed on the optical distance adjustment layer 26 constituted by the first insulating film 26a, the second insulating film 26b, and the third insulating film 26c.

  As shown in FIG. 9B, in step S2, for example, silicon oxide is deposited by a known technique of plasma CVD (Chemical Vapor Deposition), and patterned by using a known technique of dry etching, whereby the peripheral edge of the pixel electrode 31 is obtained. An insulating film 28 is formed to cover the part. In the insulating film 28, an opening 28BCT that exposes the pixel electrode 31B of the sub-pixel 18B, an opening 28GCT that exposes the pixel electrode 31G of the sub-pixel 18G, and an opening 28RCT that exposes the pixel electrode 31R of the sub-pixel 18R are formed. . The region where the openings 28BCT, 28GCT, and 28RCT are provided becomes the light emission region V1, and the region where the insulating film 28 is provided becomes the light emission suppression region V2.

  As shown in FIG. 9C, in step S3, for example, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and the like are sequentially deposited by a known technique, for example, to form the light emitting functional layer 32. Form.

  As shown in FIG. 9D, in step S4, an alloy of magnesium and silver is deposited by, for example, a known sputtering method, and the counter electrode 33 is formed. By thinning an alloy of magnesium and silver to approximately 20 nm or less, the counter electrode 33 having both light reflectivity and light transmissivity can be formed.

Thus, the organic EL element 30 in which the pixel electrode 31, the light emitting functional layer 32, and the counter electrode 33 are stacked in the light emitting region V1 is formed through Steps S1 to S4. That is, in steps S1 to S4, the first organic EL element 30B is formed in the light emitting region V1 of the sub pixel 18B, the second organic EL element 30G is formed in the light emitting region V1 of the sub pixel 18G, and the light emission of the sub pixel 18R. The third organic EL element 30R is formed in the region V1.
In addition, step S1-step S4 mentioned above are examples of "the process of forming a 1st organic electroluminescent element and a 2nd organic electroluminescent element" in this invention.

  As shown in FIG. 9E, in step S5, for example, silicon oxynitride is deposited by plasma CVD of a known technique to form a first sealing layer 34a that covers the organic EL element 30. Subsequently, an epoxy resin or an inorganic material (silicon oxide) is applied and formed and baked to form the planarization layer 34b. Subsequently, for example, silicon oxynitride is deposited by plasma CVD of a known technique to form the second sealing layer 34c.

  The planarization layer 34b is made of a material that is more flexible than the first sealing layer 34a, and is less likely to crack and can be formed thicker. For example, when there is a foreign matter that causes a defect in the first sealing layer 34a, the foreign matter is embedded (covered) with the planarization layer 34b and adversely affects the second sealing layer 34c that is subsequently formed. It will not be. That is, even if a defect such as a pinhole or a crack occurs in the first sealing layer 34a, the defect is covered with the planarization layer 34b, and a defect such as a pinhole or a crack hardly occurs in the second sealing layer 34c. Become.

The first sealing layer 34a, the planarization layer 34b, and the second sealing layer 34c are formed at a temperature lower than 110 ° C. or 110 ° C. so that the light emitting functional layer 32 is not thermally deteriorated. That is, the process temperature of the step of forming the first sealing layer 34a, the planarization layer 34b, and the second sealing layer 34c is 110 ° C. or less.
As described above, in step S5, the organic EL element 30 (the first organic EL element 30B, the second organic EL element 30G, and the third organic EL element 30B) is formed by the first sealing layer 34a, the planarization layer 34b, and the second sealing layer 34c. This is a step of forming a sealing layer 34 covering the organic EL element 30R).

  As shown in FIG. 10A, in step S6, a transparent photosensitive resist, specifically, a light-transmitting photosensitive resist containing a sensitizer is applied, and this is applied by a photolithography method. The barrier ribs 37 are formed by exposure, development, and baking.

  Specifically, a transparent photosensitive resin layer is formed by applying a transparent photosensitive resist by spin coating and drying. The transparent photosensitive resin layer is made of, for example, a negative photosensitive acrylic resin, and the region irradiated with light (exposed) is insolubilized. The transparent photosensitive resin layer is made of the same material as the photosensitive resin layer used in the step of forming a blue colored layer 36B and a red colored layer 36R described later. The region where the partition wall 37 is formed is irradiated with light (exposed), and for example, a developer is discharged from the nozzle to remove the unexposed photosensitive resin layer. Subsequently, for example, pure water is discharged from a nozzle, and the insolubilized photosensitive resin layer is washed and then baked and cured to form partition walls 37. The partition 37 is fired at a temperature of 110 ° C. or lower than 110 ° C. so that the light emitting functional layer 32 is not thermally deteriorated. That is, the process temperature of the step of forming the partition 37 is 110 ° C. or lower.

  The partition wall 37 is formed in the light emission suppression region V2. That is, the stripe-shaped partition walls 37 extending in the Y direction are respectively provided on the boundary between the sub-pixel 18B and the sub-pixel 18G, the boundary between the sub-pixel 18G and the sub-pixel 18R, and the boundary between the sub-pixel 18B and the sub-pixel 18R. Form. As a result, a recess C1 surrounded by the partition 37 and the second sealing layer 34c is formed in the subpixel 18B, and a recess surrounded by the partition 37 and the second sealing layer 34c is formed in the subpixel 18G. C2 is formed, and the concave portion C3 surrounded by the partition wall 37 and the second sealing layer 34c is formed in the sub-pixel 18R.

  The concave portion C1 and the concave portion C3 serve as a container (cell) for filling a photosensitive resist used in a subsequent process. By adjusting the depths (dimensions in the Z direction) of the concave portions C1 and C3, it is possible to improve the uniformity of the film thickness of the blue colored layer 36B and the red colored layer 36R to be formed in a later step.

  As shown in FIG. 10B, in step S7, a photosensitive resist containing a blue color material (for example, a pigment) is applied and pre-baked to form a blue photosensitive resin layer, which is formed by a photolithography method. Then, it is exposed to light, developed, and baked to form a blue colored layer 36B overlapping the first organic EL element 30B in plan view on the second sealing layer 34c (sealing layer 34).

  Specifically, a blue photosensitive resin layer is formed by applying a photosensitive resist containing a blue color material by spin coating and drying. The blue photosensitive resin layer is made of, for example, a negative photosensitive acrylic resin, and a portion irradiated with light (exposed) is insolubilized. The region where the blue colored layer 36B is to be formed is irradiated with light (exposed), and for example, a developer is discharged from the nozzle to remove the unexposed photosensitive resin layer. Subsequently, for example, pure water is discharged from a nozzle, and the insolubilized photosensitive resin layer is washed and then baked and cured to form a blue colored layer 36B having a predetermined shape. The blue colored layer 36B is formed (fired) at a temperature lower than 110 ° C. or lower than 110 ° C. so that the light emitting functional layer 32 is not thermally deteriorated. That is, the process temperature of the step of forming the blue colored layer 36B is 110 ° C. or lower.

  As shown in FIG. 10C, in step S8, a photosensitive resist containing a red color material (for example, a pigment) is applied and pre-baked to form a red photosensitive resin layer, which is formed by a photolithography method. Then, it is exposed to light, developed, and baked to form a red colored layer 36R overlapping the third organic EL element 30R in plan view on the second sealing layer 34c (sealing layer 34).

  Specifically, a photosensitive resist containing a red color material is applied by a spin coat method and dried to form a red photosensitive resin layer. The red photosensitive resin layer is made of, for example, a negative photosensitive acrylic resin, and a portion irradiated with light (exposed) is insolubilized. The region where the red colored layer 36R is to be formed is irradiated with light (exposed), for example, a developer is discharged from the nozzle, and the unexposed photosensitive resin layer is removed. Subsequently, for example, pure water is discharged from a nozzle, and the insolubilized photosensitive resin layer is washed and then baked and cured to form a red colored layer 36R having a predetermined shape. The red colored layer 36R is formed (fired) at a temperature of 110 ° C. or lower than 110 ° C. so that the light emitting functional layer 32 is not thermally deteriorated. That is, the process temperature of the step of forming the red colored layer 36R is 110 ° C. or lower.

Through step S6 and step S7, the blue colored layer 36B is formed so as to overlap the first organic EL element 30B in plan view and not to overlap the second organic EL element 30G in plan view. That is, step S6 and step S7 are an example of the “process for laminating color filters” in the present invention.
Further, through step S8, a red colored layer 36R is formed so as to overlap with the third organic EL element 30R in plan view and not to overlap with the second organic EL element 30G in plan view.

  In the manufacturing method of the present embodiment, a colored layer (for example, a green colored layer) that overlaps the second organic EL element 30G in plan view is not formed, and therefore, a colored layer is formed, for example, as compared with a case where a colored layer is formed. Since the number of steps is reduced by one step, the productivity of the color filter layer 36 can be increased and the manufacturing cost of the color filter layer 36 can be suppressed.

  Furthermore, although not shown in the drawings, in the manufacturing method of the present embodiment, an adhesive composed of an epoxy resin, an acrylic resin, or the like is disposed between the element substrate 10 and the protective substrate 40, and is cured to bond the adhesive layer. 42, and the step of bonding the element substrate 10 and the protective substrate 40 with the adhesive layer 42 is included. By the step of bonding the element substrate 10 and the protective substrate 40, the protective substrate 40 is bonded to the colored layer 36B via the adhesive layer 42 in a region overlapping the first organic EL element 30B in plan view, and the second organic EL element 30G. The protective substrate 40 is bonded to the sealing layer 34 (second sealing layer 34c) via the adhesive layer 42 in a region overlapping with the third organic EL element 30R in a region overlapping in plan view. The protective substrate 40 is bonded to the colored layer 36R.

As described above, in this embodiment, the following effects can be obtained.
(1) In the sub-pixel 18G, since the adhesive layer 42 is adhered to the portion (second sealing layer 34c) made of an inorganic material, the portion (color filter layer 36) in which the adhesive layer 42 is entirely made of resin. The adhesive strength between the element substrate 10 and the adhesive layer 42 can be increased compared to the case where the adhesive is adhered to the adhesive substrate 42).

  (2) Due to the anchor effect of the adhesive layer 42 filled in the recess C2 formed in the sub-pixel 18G, the element substrate 10 and the adhesive layer 42 are compared with the case where the recess C2 is not formed in the sub-pixel 18G. The adhesive strength of the can be increased.

  (3) Since the contact area (adhesion area) between the element substrate 10 and the adhesive layer 42 is increased by the recess C2 formed in the sub-pixel 18G, compared with the case where the recess C2 is not formed in the sub-pixel 18G. The adhesive strength between the element substrate 10 and the adhesive layer 42 can be increased.

  (4) Since the green color layer is not formed in the sub-pixel 18G, the number of processes for forming the color layer is reduced by one process compared with the case where the green color layer is formed. Thus, the manufacturing cost of the color filter layer 36 can be reduced.

  (5) Since the sealing layer 34 and the color filter layer 36 are formed at 110 ° C. or lower, thermal degradation of the light emitting functional layer 32 (organic EL element 30) can be suppressed.

  (6) Since the colored layer is not formed in the sub-pixel 18G, the light emitted from the second organic EL element 30G is not attenuated (absorbed) by the colored layer, and is compared with the case where the colored layer is formed. 2 The luminance of green light emitted from the organic EL element 30G can be increased.

  (7) The film thickness BD1 of the blue colored layer 36B is larger than the distance BD2 between the end B1 of the blue colored layer 36B and the end G1 of the opening 28GCT, and the light L3A and the light L3B are blue colored layer 36B. Since the luminance is weakened and enters the end G1 of the opening 28GCT, the light reflected by the end G1 of the opening 28GCT of the insulating film 28 is less likely to adversely affect the display.

  (8) The film thickness RD1 of the red colored layer 36R is larger than the distance RD2 between the end R1 of the red colored layer 36R and the end G2 of the opening 28GCT, and the light L3A and the light L3B are red colored layer 36R. Since the luminance is weakened and enters the end G2 of the opening 28GCT, the light reflected by the end G2 of the opening 28GCT of the insulating film 28 is less likely to adversely affect the display.

(Embodiment 2)
FIG. 11 is a diagram corresponding to FIG. 4 and a schematic cross-sectional view showing the structure of the organic EL device according to the second embodiment. FIG. 12 is a diagram corresponding to FIG. 5 and a schematic plan view showing a state of the color filter layer according to the present embodiment.

In the organic EL device 200 of the present embodiment, the area of the opening 28CT, that is, the area of the region where the organic EL element 30 is formed, becomes smaller in the order of the sub pixel 18B, the sub pixel 18R, and the sub pixel 18G. This is the main difference between the organic EL device 200 of the present embodiment and the organic EL device 100 of the first embodiment.
Below, with reference to FIG.11 and FIG.12, the outline | summary of the organic electroluminescent apparatus 200 which concerns on this embodiment is demonstrated centering around difference with Embodiment 1. FIG. In addition, about the component same as Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  As shown in FIGS. 11 and 12, the dimension of the sub-pixel 18 in the X direction is smaller in the order of the sub-pixel 18B, the sub-pixel 18R, and the sub-pixel 18G. The dimension of the sub-pixel 18 in the Y direction is the same for each of the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R. Accordingly, the area of the sub-pixel 18 decreases in the order of the sub-pixel 18B, the sub-pixel 18R, and the sub-pixel 18G.

  Furthermore, the dimension of the opening 28CT in the X direction is smaller in the order of the sub-pixel 18B, the sub-pixel 18R, and the sub-pixel 18G. The dimension in the Y direction of the opening 28CT is the same in each of the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R. Accordingly, the area of the opening 28CT decreases in the order of the sub pixel 18B, the sub pixel 18R, and the sub pixel 18G.

Since the organic EL element 30 is formed in the opening 28CT, the light emitting area of the organic EL element 30 decreases in the order of the first organic EL element 30B, the third organic EL element 30R, and the second organic EL element 30G.
Furthermore, the area of the sub-pixel 18B, the area of the opening 28BCT, and the area (light emission area) of the first organic EL element 30B are larger in the present embodiment than in the first embodiment. The area of the sub-pixel 18R, the area of the opening 28RCT, and the area of the third organic EL element 30R (light emission area) are also larger in this embodiment than in the first embodiment. The area of the sub-pixel 18G, the area of the opening 28GCT, and the area (light emission area) of the second organic EL element 30G are smaller in this embodiment than in the first embodiment.

  The sub-pixel 18B has a blue colored layer 36B having a stripe shape extending in the Y direction, and the sub-pixel 18R has a red colored layer 36R having a stripe shape extending in the Y direction. Yes. In the sub-pixel 18G, a colored layer is not disposed, and a recess C2 surrounded by the partition wall 37 and the second sealing layer 34c is formed.

  In the subpixel 18B, in a region overlapping the first organic EL element 30B in plan view, the protective substrate 40 is bonded to the colored layer 36B via the blue adhesive layer 42. In the subpixel 18R, the protective substrate 40 is bonded to the colored layer 36R via the blue adhesive layer 42 in a region overlapping the third organic EL element 30R in plan view.

  In the subpixel 18G, in the region overlapping the second organic EL element 30G in plan view, the protective substrate 40 is bonded to the second sealing layer 34c via the adhesive layer 42. Specifically, the adhesive layer 42 is filled in the recess C2 formed by the sub-pixel 18G 37 and the second sealing layer 34c, and the protective substrate 40 is bonded to the second sealing layer 34c via the adhesive layer 42. ing.

In the present embodiment, in addition to the effects (1) to (8) of the first embodiment described above, the following effects can be obtained.
(1) Since the area of the sub pixel 18B and the first organic EL element 30B and the area of the sub pixel 18R and the third organic EL element 30R are larger than those of the first embodiment, the light is emitted from the sub pixel 18B and the sub pixel 18R. The brightness of light can be increased. On the other hand, the area of the sub-pixel 18G is smaller than the areas of the sub-pixel 18B and the sub-pixel 18R, but the sub-pixel 18G has no colored layer and does not absorb light. Light having the same luminance as that of the sub-pixel 18B and the sub-pixel 18R can be emitted.
Therefore, a brighter display can be obtained as compared with the first embodiment.

(2) Since the area of the sub-pixel 18B and the first organic EL element 30B and the area of the sub-pixel 18R and the third organic EL element 30R are larger than those in the first embodiment, the sub-pixel 18B and the sub-pixel 18R are used in the embodiment. In the case of emitting light having the same luminance as 1, the current load (for example, current density) to the first organic EL element 30B and the third organic EL element 30R can be reduced as compared with the first embodiment.
Compared to the first embodiment, by reducing the current load (for example, current density) of the light emitting functional layer 32 of the first organic EL element 30B and the third organic EL element 30R, the first organic EL element 30B and the third organic EL element are reduced. Deterioration of the element 30R and heat generation of the first organic EL element 30B and the third organic EL element 30R can be suppressed.

Thus, in order to suppress deterioration of the organic EL element 30, the area of the organic EL element 30 is made larger than the area of the organic EL element 30 that emits other colors, and a colored layer is not formed. preferable.
For example, if the deterioration of the first organic EL element 30B is large, the area of the first organic EL element 30B is made larger than the areas of the second organic EL element 30G and the third organic EL element 30R, and the first organic EL element 30B is used. A configuration in which a colored layer is not formed on the EL element 30B is preferable. With such a configuration, current addition to the first organic EL element 30B can be reduced, and deterioration of the first organic EL element 30B can be suppressed.

(Embodiment 3)
FIG. 13 is a diagram corresponding to FIG. 5 and a schematic plan view showing a state of the color filter layer according to the third embodiment.
In FIG. 13, the blue colored layer 36 </ b> B, the red colored layer 36 </ b> R, the opening 25 </ b> CT of the reflective layer 25, and the opening 28 </ b> CT (region where the organic EL element 30 is formed) of the insulating film 28 are illustrated. It is omitted. Further, the red colored layer 36R is shown by a thick broken line in the drawing.
In the present embodiment, the shape of the blue colored layer 36 </ b> B is different from that of the first embodiment, and other configurations are the same as those of the first embodiment.

  Hereinafter, an outline of the color filter layer 36 of the organic EL device according to the present embodiment will be described with reference to FIG. 13, focusing on differences from the first embodiment. In addition, about the component same as Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

As shown in FIG. 13, the blue colored layer 36B extends in the X direction, which overlaps with the first organic EL element 30B (opening 28BCT) in the Y direction, which overlaps with the first organic EL element 30B (opening 28BCT), and the opening 25CT. And a blue colored layer 36B2.
The blue colored layer 36B1 extending in the Y direction is the same as the blue colored layer 36B of the first embodiment. That is, the blue colored layer 36B of the present embodiment is configured by adding the blue colored layer 36B2 extending in the X direction to the blue colored layer 36B of the first embodiment.

The blue colored layer 36B2 extending in the X direction is disposed so as to cover the opening 25CT of the subpixel 18G and the opening 25CT of the subpixel 18R, and the second organic EL element 30G (opening 28GCT) and the third organic EL element 30R ( The aperture 28RCT) is arranged so as not to overlap in plan view. For this reason, even if the blue colored layer 36B2 is disposed in the sub-pixel 18G or the sub-pixel 18R, the light emitted from the second organic EL element 30G or the third organic EL element 30R is influenced by the blue colored layer 36B2. Not receive.
Since the red colored layer 36R is disposed in the sub-pixel 18R, the blue colored layer 36B2 and the colored layer 36 are sequentially stacked in the opening 25CT of the sub-pixel 18R.

In the present embodiment, the opening 25CT of the sub-pixel 18B and the opening 25CT of the sub-pixel 18G are covered with a blue colored layer 36B2 in plan view. The 25 openings 25CT of the sub-pixel 18R are covered with a blue colored layer 36B2 and a red colored layer 36R in plan view.
In the first embodiment, the opening 25CT of the sub-pixel 18G is not covered with the colored layer, and this is also a difference between the present embodiment and the first embodiment.

  As described above, the contact portion for electrically connecting the pixel electrode 31 and the transistor 23 is provided inside the opening 25CT. That is, a component for electrically connecting the pixel electrode 31 and the transistor 23 inside the opening 25CT, for example, a contact hole, a conductive material filled in the contact hole, and a relay electrode overlapping the contact hole in plan view. Etc. are arranged. For this reason, inside the opening 25CT, various irregularities (steps) caused by components for electrically connecting the pixel electrode 31 and the transistor 23, and other components (for example, the counter electrode 33) and May cause unintended light in the light emitting functional layer 32 and may adversely affect the display by the light L3A and the light L3B reflected at the interface between the protective substrate 40 and the atmosphere 71. .

  In the present embodiment, the contact portion (opening 25CT) for electrically connecting the pixel electrode 31 and the transistor 23 is covered with at least one of the blue colored layer 36B2 and the red colored layer 36R. Even if unintended light is generated in the functional layer 32, the unintended light is absorbed by at least one of the blue colored layer 36B2 and the red colored layer 36R, so that adverse effects on the display can be reduced. Similarly, the light L3A and the light L3B reflected at the interface between the protective substrate 40 and the atmosphere 71 incident on the opening 25CT are also absorbed by at least one of the blue colored layer 36B2 and the red colored layer 36R. The adverse effect of can be reduced.

(Embodiment 4)
FIG. 14 is a diagram corresponding to FIG. 13 and is a schematic plan view showing a state of the color filter layer according to the fourth embodiment. In FIG. 14, in order to clarify the characteristics of the color filter layer 36 according to the present embodiment, the red colored layer 36R, the opening 25CT of the reflection layer 25, and the opening 28CT (organic EL element 30 of the insulating film 28 are formed. Area) is shown. Furthermore, in this embodiment and Embodiment 3, since the blue colored layer 36B and the partition 37 are the same, illustration is abbreviate | omitted in FIG.
In the present embodiment, the shape of the red colored layer 36 </ b> R is different from that of the third embodiment, and other configurations are the same as those of the third embodiment.

  Below, with reference to FIG. 14, the outline | summary of the color filter layer 36 of the organic EL apparatus which concerns on this embodiment is demonstrated centering on difference with Embodiment 3. FIG. In addition, about the component same as Embodiment 3, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  As shown in FIG. 14, the red colored layer 36R extends in the X direction, which overlaps with the third organic EL element 30R (opening 28RCT) in the Y direction and overlaps with the opening 25CT in plan view. And a red colored layer 36R2.

  The red colored layer 36R1 extending in the Y direction is the same as the red colored layer 36R of the third embodiment and the red colored layer 36R of the first embodiment. That is, the red colored layer 36R of the present embodiment is configured by adding the red colored layer 36R2 extending in the X direction to the red colored layer 36R of the third embodiment.

  The red colored layer 36R2 is disposed so as to cover the opening 25CT of the subpixel 18B and the opening 25CT of the subpixel 18G, and is flat with the first organic EL element 30B (opening 28BCT) and the second organic EL element 30G (opening 28GCT). Since they are arranged so as not to overlap with each other, light emitted from the first organic EL element 30B and the second organic EL element 30G is not affected by the red colored layer 36R2.

  Although not shown, since the blue color layer 36B2 extending in the X direction is disposed in the opening 25CT of the subpixel 18B, the opening 25CT of the subpixel 18G, and the opening 25CT of the subpixel 18R, the subpixel 18B A blue coloring layer 36B2 and a red coloring layer 36R2 are sequentially arranged in the opening 25CT, the opening 25CT of the sub-pixel 18G, and the opening 25CT of the sub-pixel 18R.

  In the present embodiment, a blue colored layer 36B2 and a red colored layer 36R2 are disposed in the opening 25CT of the subpixel 18B and the opening 25CT of the subpixel 18G. In the third embodiment, a blue colored layer 36B2 is disposed in the opening 25CT of the subpixel 18B and the opening 25CT of the subpixel 18G. This is the difference between the present embodiment and the third embodiment.

  In the present embodiment, when unintended light is generated inside the opening 25CT of the sub-pixel 18B or inside the opening 25CT of the sub-pixel 18G, the unintended light is emitted from the blue coloring layer 36B2 and the red coloring layer 36R2. Since both are absorbed, the adverse effect on unintended light display can be more strongly suppressed than in the third embodiment. Similarly, the light L3A and the light L3B reflected at the interface between the protective substrate 40 and the atmosphere 71 incident on the opening 25CT are also absorbed by both the blue colored layer 36B and the red colored layer 36R. As a result, the adverse effect on the display can be more strongly suppressed.

(Embodiment 5)
FIG. 15 is a schematic plan view illustrating an arrangement state of sub-pixels in the organic EL device according to the fifth embodiment. FIG. 16 corresponds to FIG. 15 and is a schematic plan view showing the state of the partition walls arranged in the color filter layer. FIG. 17 is a diagram corresponding to FIG. 15 and is a schematic plan view showing a state of the colored layer arranged in the color filter layer.

In the present embodiment, the shapes and arrangement states of the sub-pixel 18 and the color filter layer 36 are different from those in the first embodiment, and other configurations are the same as those in the first embodiment.
Hereinafter, an outline of the organic EL device according to this embodiment will be described with reference to FIGS. 15 to 17 focusing on differences from the first embodiment. In addition, about the component same as Embodiment 1, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  As shown in FIG. 15, the dimension of the sub-pixel 18G in the X direction is smaller than the dimension of the sub-pixel 18B and the sub-pixel 18R in the X-direction, and the dimension of the sub-pixel 18G in the Y-direction is the sub-pixel 18B and the sub-pixel 18R. Is the same as the dimension in the Y direction. That is, the area of the sub pixel 18G is smaller than each of the areas of the sub pixel 18B and the sub pixel 18R. The area of the sub-pixel 18B and the area of the sub-pixel 18R are the same.

  The sub pixels 18G are arranged along the Y direction. The sub pixels 18B and the sub pixels 18R are alternately arranged along the Y direction. In the X direction, subpixels 18G arranged along the Y direction and subpixels 18B and 18R alternately arranged in the Y direction are alternately arranged.

  In the organic EL device according to the present embodiment, the two sub-pixels 18G arranged in the Y direction and the sub-pixel 18B and the sub-pixel 18R adjacent to the two sub-pixels 18G serve as a display unit (pixel 19). Full color display is provided.

  The sub pixel 18G that emits green light has higher definition than the sub pixel 18B that emits blue light and the sub pixel 18R that emits red light. In the organic EL device according to the present embodiment, the resolution of the display can be artificially improved by increasing the definition of the sub-pixel 18G that emits green light.

  As shown in FIG. 16, the partition wall 37 extends in the Y direction across the contour of the sub pixel 18G along the Y direction (the boundary between the sub pixel 18G and the sub pixel 18B and the boundary between the sub pixel 18G and the sub pixel 18R). An extended portion and a portion extending in the X direction straddling the boundary between the sub-pixel 18B and the sub-pixel 18R along the X direction. As a result, the second organic EL element 30G is disposed inside the pair of partition walls 37 extending in the Y direction, and the first organic EL element 30B and the third organic EL are disposed inside the region surrounded by the partition walls 37. Element 30R is arranged.

  As shown in FIG. 17, the sub-pixel 18G is provided with a colored layer 36G (hereinafter referred to as a green colored layer) that transmits green light. Specifically, the sub-pixel 18G is provided with a green colored layer 36G having a stripe shape overlapping the second organic EL element 30G in plan view and extending in the Y direction. The sub-pixel 18R is provided with an island-like (rectangular) red colored layer 36R that overlaps the third organic EL element 30R in plan view. Although not shown, the green colored layer 36G and the red colored layer 36R are disposed so as to cover a part of the partition wall 37.

A colored layer is not formed on the sub-pixel 18B. Further, the sub-pixel 18B is formed with a recess C1 surrounded by the partition wall 37 and the second sealing layer 34c.
In the present embodiment, since the sub-pixel 18B has excellent color purity of the light component extracted by the optical resonance structure, it can emit blue light having excellent color purity without providing a colored layer. Furthermore, since the colored layer is not provided in the sub-pixel 18B, the luminance emitted from the sub-pixel 18B can be increased as compared with the case where the colored layer is provided.

  In the sub-pixel 18G, the color purity of the green light emitted from the sub-pixel 18G is enhanced by combining the optical resonance structure and the green colored layer 36G. In the sub-pixel 18R, the color purity of red light emitted from the sub-pixel 18R is increased by combining the optical resonance structure and the red colored layer 36R.

  In the subpixel 18B, the protective substrate 40 is bonded to the second sealing layer 34c via the adhesive layer 42 in a region overlapping the first organic EL element 30B in plan view. Specifically, in the sub-pixel 18B, the adhesive layer 42 is filled in the concave portion C1 surrounded by the partition wall 37 and the second sealing layer 34c, and the protective substrate 40 and the second sealing layer 34c are bonded. .

  In the subpixel 18G, in the region overlapping the second organic EL element 30G in plan view, the protective substrate 40 is bonded to the colored layer 36G via the adhesive layer 42. In the subpixel 18R, in the region overlapping the third organic EL element 30R in plan view, the protective substrate 40 is bonded to the colored layer 36R via the adhesive layer 42.

Also with this configuration, the following effects can be obtained.
(1) In the sub-pixel 18B, since the adhesive layer 42 is adhered to the portion (second sealing layer 34c) made of an inorganic material, the portion (color filter layer 36) in which the adhesive layer 42 is entirely made of resin. The adhesive strength between the element substrate 10 and the adhesive layer 42 can be increased compared to the case where the adhesive is adhered to the adhesive substrate 42).

  (2) Due to the anchor effect of the adhesive layer 42 filled in the recess C1 formed in the sub-pixel 18B, the element substrate 10 and the adhesive layer 42 are compared with the case where the recess C1 is not formed in the sub-pixel 18B. The adhesive strength of the can be increased.

  (3) Since the contact area (adhesion area) between the element substrate 10 and the adhesive layer 42 is increased by the recess C1 formed in the sub-pixel 18B, compared with the case where the recess C1 is not formed in the sub-pixel 18B. The adhesive strength between the element substrate 10 and the adhesive layer 42 can be increased.

  (4) Since the blue colored layer is not formed in the sub-pixel 18B, the number of steps of forming the colored layer is reduced by one step compared with the case of forming the blue colored layer. Thus, the manufacturing cost of the color filter layer 36 can be suppressed.

  (5) Since the colored layer is not formed in the sub-pixel 18B, the light emitted from the first organic EL element 30B is not attenuated (absorbed) by the colored layer, and is compared with the case where the colored layer is formed. The luminance of blue light emitted from one organic EL element 30B can be increased.

(Embodiment 6)
"Electronics"
FIG. 18 is a schematic diagram of a head mounted display as an example of an electronic apparatus.
As shown in FIG. 18, the head mounted display 1000 has two display units 1001 provided corresponding to the left and right eyes. The observer M can see characters and images displayed on the display unit 1001 by wearing the head mounted display 1000 on the head like glasses. For example, if an image in consideration of parallax is displayed on the left and right display units 1001, a stereoscopic video can be viewed and enjoyed.

  One of the organic EL devices according to Embodiments 1 to 5 described above is mounted on the display unit 1001. In the above embodiment, either the blue colored layer 36B or the green colored layer 36G constituting the color filter layer 36 is omitted, and the adhesive strength between the element substrate 10 and the adhesive layer 42 is increased, and the reliability of the organic EL device is improved. Sexuality is enhanced. Therefore, by mounting the organic EL device according to the above embodiment on the display unit 1001, a highly reliable head mounted display 1000 can be provided.

  Note that the electronic device on which any of the organic EL devices according to Embodiments 1 to 5 described above is mounted is not limited to the head mounted display 1000. For example, it may be mounted on an electronic device having a display unit such as a head-up display, an electronic viewfinder of a digital camera, a portable information terminal, or a navigator.

The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. Electronic equipment equipped with an organic light emitting device is also included in the technical scope of the present invention.
Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1)
In Embodiment 1, the green colored layer is omitted from the blue colored layer, the green colored layer, and the red colored layer. In Embodiment 5, the blue colored layer among the blue colored layer, the green colored layer, and the red colored layer is omitted.
Of the blue colored layer, the green colored layer, and the red colored layer, the omitted colored layer is not limited to the above-described one colored layer, and may be configured to omit the two colored layers.
Moreover, when it has four or more types of colored layers, the structure which abbreviate | omits three or more colored layers may be sufficient.

Note that the colored layer of the sub-pixel 18 to be omitted is selected based on at least one of the following (1) to (5).
(1) The colored layer of the sub-pixel 18 in which the color purity of the light component extracted by the optical resonance structure is excellent.
(2) The colored layer of the sub-pixel 18 in which the light emitting lifetime of the organic EL element 30 (light emitting functional layer 32) is short.
(3) The colored layer of the sub-pixel 18 that needs to increase the luminance of light emitted from the organic EL element 30 (light emitting functional layer 32).
(4) A colored layer of the sub-pixel 18 that needs to reduce the density of current flowing through the organic EL element 30 (light emitting functional layer 32).
(5) The colored layer of the sub-pixel 18 that needs to reduce the heat generated by the organic EL element 30 (light emitting functional layer 32).

(Modification 2)
Although the color filter layer 36 according to Embodiments 1 to 5 includes the partition walls 37, the color filter layer 36 may not include the partition walls 37.

(Modification 3)
The color filter layer 36 according to the first to fifth embodiments has an optical resonance structure, but may have a configuration not having an optical resonance structure. For example, an organic light emitting layer that emits blue light is disposed on the light emitting functional layer 32 of the first organic EL element 30B, and an organic light emitting layer that emits green light is disposed on the light emitting functional layer 32 of the second organic EL element 30G. The structure which arrange | positions the organic light emitting layer which emits red light in the light emission functional layer 32 of the 3rd organic EL element 30R may be sufficient.

  DESCRIPTION OF SYMBOLS 10 ... Element board | substrate, 11 ... Board | substrate, 12 ... Scan line, 13 ... Data line, 14 ... Power supply line, 15 ... Data line drive circuit, 16 ... Scan line drive circuit, 18, 18B, 18G, 18R ... Subpixel, 19 DESCRIPTION OF SYMBOLS 20 ... Pixel circuit, 21 ... Switching transistor, 22 ... Capacitor, 23 ... Driving transistor, 25 ... Reflective layer, 26 ... Optical distance adjusting layer, 26a ... First insulating film, 26b ... Second insulating film , 26c ... third insulating film, 28 ... insulating film, 28BCT, 28GCT, 28RCT ... opening, 30 ... organic EL element, 30B ... first organic EL element, 30G ... second organic EL element, 30R ... third organic EL element 31 ... Pixel electrode, 32 ... Light emitting functional layer, 33 ... Counter electrode, 34 ... Sealing layer, 34a ... First sealing layer, 34b ... Flattening layer, 34c ... Second sealing layer, 36 ... Color filter, 36B Blue colored layer, 36G ... green colored layer, 36R ... red coloring layer, 37 ... partition wall, 40 ... protective substrate, 42 ... adhesive layer, 100, 200 ... organic EL device.

Claims (9)

A first substrate;
A first organic electroluminescence element and a second organic electroluminescence element provided on the first substrate;
A sealing layer laminated on the first organic electroluminescence element and the second organic electroluminescence element;
A color filter laminated on the sealing layer;
Have
2. The organic electroluminescence device according to claim 1, wherein the color filter is provided so as to overlap with the first organic electroluminescence element in plan view and not to overlap with the second organic electroluminescence element in plan view. An adhesive layer and a second substrate;
In the region overlapping the first organic electroluminescence element in plan view, the second substrate is bonded to the color filter via the adhesive layer, and in the region overlapping the second organic electroluminescence element in plan view, the second substrate. The organic electroluminescent device according to claim 1, wherein the organic electroluminescent device is bonded to the sealing layer through the adhesive layer.   A transparent layer formed on the sealing layer is further provided between a region overlapping the first organic electroluminescence element in plan view and a region overlapping the second organic electroluminescence element in plan view. The organic electroluminescent device according to claim 1. The first organic electroluminescence element has a first pixel electrode covered with an insulating film and exposed through a first opening provided in the insulating film,
The second organic electroluminescence element has a second pixel electrode covered with the insulating film and exposed through a second opening provided in the insulating film,
The color filter has a first end portion between a region overlapping the first organic electroluminescence element in plan view and a region overlapping the second organic electroluminescence element in plan view,
The insulating film has a second end adjacent to the first end and forming a part of the second opening;
4. The organic electroluminescence according to claim 1, wherein a film thickness of the color filter is not less than a dimension between the first end and the second end. 5. apparatus.   5. The organic electroluminescence device according to claim 1, wherein the second organic electroluminescence element has a light emitting area smaller than that of the first organic electroluminescence element.   An electronic apparatus comprising the organic electroluminescence device according to claim 1. Forming a first organic electroluminescent element and a second organic electroluminescent element on a first substrate;
Stacking a sealing layer on the first organic electroluminescent element and the second organic electroluminescent element;
Laminating a color filter on the sealing layer so as to overlap with the first organic electroluminescence element in plan view and not to overlap with the second organic electroluminescence element in plan view;
The manufacturing method of the organic electroluminescent apparatus characterized by having.   In the region overlapping the first organic electroluminescence element in plan view, the second substrate is bonded to the color filter via an adhesive layer, and in the region overlapping the second organic electroluminescence element in plan view, the adhesive layer is interposed. The method of manufacturing an organic electroluminescence device according to claim 7, further comprising a step of bonding the second substrate to the sealing layer.   The method of manufacturing an organic electroluminescence device according to claim 7, wherein the color filter and the sealing layer are formed at a temperature of 110 ° C. or less.

Images