JP2017010750A - Organic el device, manufacturing method of the same, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL device capable of improving display quality, a manufacturing method of the same, and an electronic apparatus.SOLUTION: The organic EL device includes: a substrate 11; an organic EL element provided on the substrate 11; a negative electrode protective layer 34a, covering the organic EL element; an organic buffer layer 34b, provided on the negative electrode protective layer; a moisture sensor layer 45, provided on the organic buffer layer 34b; and a gas barrier layer 34c, provided on the organic buffer layer 34b and the moisture sensor layer 45.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an organic EL device, a method for manufacturing an organic EL device, and an electronic apparatus.

  The organic EL (electroluminescence) device has a light emitting element in which a light emitting layer made of an organic light emitting material is sandwiched between an anode (pixel electrode) and a cathode (counter electrode). In the organic EL device, for example, as described in Patent Document 1, a color filter is disposed on a light emitting element via a sealing layer. The sealing layer is laminated | stacked in order of the 1st inorganic sealing layer, the organic sealing layer, and the 2nd inorganic sealing layer from the light emitting layer side.

  In the method for manufacturing an organic EL device, a light emitting element is formed on a substrate, and a sealing layer is formed on the light emitting element. After forming the sealing layer, a color filter is formed, and a glass substrate is bonded through an adhesive to complete the organic EL device.

JP 2014-89804 A

  However, if moisture penetrates into the sealing layer during the manufacturing process, the light emitting element is adversely affected, and light emission is hindered to appear as a so-called dark spot, resulting in a display defect. In other words, there is a problem that it is desired to detect moisture that has entered the sealing layer (for example, between the second inorganic sealing layer and the organic sealing layer) with high accuracy.

  An aspect of the present invention has been made to solve at least a part of the above problems, and can be realized as the following forms or application examples.

  Application Example 1 An organic EL device according to this application example includes a first substrate, an organic EL element provided on the first substrate, a first inorganic sealing layer covering the organic EL element, and the first An organic sealing layer provided on one inorganic sealing layer, a moisture sensor layer provided on the organic sealing layer, and a second inorganic provided on the organic sealing layer and the moisture sensor layer And a sealing layer.

  According to this application example, since the moisture sensor layer is disposed on the organic sealing layer constituting the sealing layer, it is detected (determined) that moisture has entered when moisture has entered the sealing layer. It becomes possible. Therefore, for example, it can be removed as a defective product by appearance inspection. As a result, it is possible to prevent defective products (defective products) from circulating in the market.

  Application Example 2 In the organic EL device according to the application example, it is preferable that the moisture sensor layer is disposed in a non-display area on the organic sealing layer.

  According to this application example, since the moisture sensor layer is arranged in the non-display area, even when moisture enters the non-display area that cannot be identified as non-emission (dark spot), the moisture is detected with high accuracy. can do.

  Application Example 3 In the organic EL device according to the application example, it is preferable that the moisture sensor layer is disposed so as to surround a display region.

  According to this application example, since the moisture sensor layer is disposed on substantially the entire surface of the non-display area surrounding the display area, it is possible to detect the moisture even when the water penetrates into a part of the non-display area.

  Application Example 4 In the organic EL device according to the application example described above, it is preferable that the moisture sensor layer is a material that changes color when contacted with moisture.

  According to this application example, the moisture sensor layer is made of a material that changes color (reaction, alteration) when it comes into contact with moisture, so that moisture intrusion can be determined by appearance inspection.

  Application Example 5 In the organic EL device according to the application example described above, it is preferable that the moisture sensor layer is made of any material selected from alkali metals, alkaline earth metals, and organic dyes.

  According to this application example, since the material described above is used as the moisture sensor layer, it is possible to change the color when it comes into contact with moisture, and it is possible to determine defective or non-defective products by appearance inspection.

  Application Example 6 The organic EL device according to the application example includes a color filter provided on the second inorganic sealing layer and a second substrate bonded to the color filter via an adhesive. It is preferable.

  According to this application example, since the color filter, the adhesive, and the second substrate are provided on the second inorganic sealing layer, for example, when the color filter is formed, the photo is exposed to the atmosphere (exposed to the atmosphere). If moisture enters when performing a lithography technique, the moisture can be detected. Therefore, it can be determined whether it is a sealing defect.

  Application Example 7 An organic EL device manufacturing method according to this application example includes a step of forming an organic EL element on a first substrate, a step of forming a first inorganic sealing layer on the organic EL element, Forming an organic sealing layer on the first inorganic sealing layer; forming a moisture sensor layer on the organic sealing layer; and a second inorganic on the organic sealing layer and the moisture sensor layer. And a step of forming a sealing layer.

  According to this application example, since the moisture sensor layer is formed on the organic sealing layer constituting the sealing layer, it is possible to determine that moisture has entered when the moisture has entered the sealing layer. It becomes. Therefore, for example, it can be removed as a defective product by appearance inspection. As a result, it is possible to prevent defective products from entering the market.

  Application Example 8 In the method of manufacturing an organic EL device according to the application example, the step of forming the moisture sensor layer is a deposition using a mask in which a part of a region corresponding to a non-display region of the organic EL element is opened. It is formed by the method.

  According to this application example, since a mask in which a part of the region corresponding to the non-display region is opened is used, at least the central region (display region) of the mask and the surrounding region (part of the mask) are connected. It becomes possible. Therefore, it is possible to suppress the formation of the moisture sensor layer in the display area.

  Application Example 9 An electronic apparatus according to this application example includes the organic EL device described above.

  According to this application example, since the organic EL device described above is provided, an electronic apparatus capable of improving display quality can be provided.

FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the organic EL device. 1 is a schematic plan view showing the configuration of an organic EL device. FIG. 3 is a schematic plan view showing the arrangement of color filters and subpixels. The schematic plan view which shows the whole structure of an organic electroluminescent apparatus. FIG. 5 is a schematic cross-sectional view showing the structure of the organic EL device along line B-B ′ in FIG. 4. FIG. 4 is a schematic cross-sectional view showing the structure of a subpixel along the line A-A ′ in FIG. 3. The flowchart which shows the manufacturing method of an organic electroluminescent apparatus. The schematic sectional drawing which shows a one part manufacturing process among the manufacturing methods of an organic electroluminescent apparatus. The schematic sectional drawing which shows a one part manufacturing process among the manufacturing methods of an organic electroluminescent apparatus. The schematic plan view which shows a one part manufacturing process among the manufacturing methods of an organic electroluminescent apparatus. Schematic which shows the structure of the head mounted display as an electronic device.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

  In the following forms, for example, “on the substrate” is described, and unless otherwise specified, when arranged so as to be in contact with the substrate, or disposed on the substrate via other components. Or a case where a part is disposed on the substrate and a part is disposed via another component.

<Organic EL device>
First, the organic EL device of the present embodiment will be described with reference to FIGS. FIG. 1 is an equivalent circuit diagram showing an electrical configuration of the organic EL device. FIG. 2 is a schematic plan view showing the configuration of the organic EL device. FIG. 3 is a schematic plan view showing the arrangement of color filters and sub-pixels.

  As shown in FIG. 1, the organic EL device 100 according to this embodiment includes a plurality of scanning lines 12 and a plurality of data lines 13 that intersect each other, and a plurality of power supply lines 14 that are parallel to each of the plurality of data lines 13. And have. In addition, a scanning line driving circuit 16 to which a plurality of scanning lines 12 are connected and a data line driving circuit 15 to which a plurality of data lines 13 are connected are provided. Furthermore, it has the some sub pixel 18 arrange | positioned at matrix form corresponding to each cross | intersection part of the some scanning line 12 and the some data line 13. FIG.

  The sub pixel 18 includes an organic EL element 30 as a light emitting element and a pixel circuit 20 that controls driving of the organic EL element 30.

  The organic EL element 30 includes a pixel electrode 31, a counter electrode 33 as a common electrode, and a functional layer 32 as an organic light emitting layer provided between the pixel electrode 31 and the counter electrode 33. Such an organic EL element 30 can be electrically expressed as a diode. As will be described in detail later, the counter electrode 33 is formed as a common cathode across the plurality of sub-pixels 18.

  The pixel circuit 20 includes a switching transistor 21, a storage capacitor 22, and a driving transistor 23. The two transistors 21 and 23 can be configured using, for example, an n-channel or p-channel thin film transistor (TFT) or a MOS transistor.

  The gate of the switching transistor 21 is connected to the scanning line 12, one of the source or drain is connected to the data line 13, and the other of the source or drain is connected to the gate of the driving transistor 23.

  One of the source and drain of the driving transistor 23 is connected to the pixel electrode 31 of the organic EL element 30, and the other of the source and drain is connected to the power supply line 14. A storage capacitor 22 is connected between the gate of the driving transistor 23 and the power supply line 14.

  When the scanning line 12 is driven and the switching transistor 21 is turned on, the potential based on the image signal supplied from the data line 13 at that time is held in the storage capacitor 22 via the switching transistor 21.

  The on / off state of the driving transistor 23 is determined according to the potential of the storage capacitor 22, that is, the gate potential of the driving transistor 23. When the driving transistor 23 is turned on, a current corresponding to the gate potential flows from the power supply line 14 to the functional layer 32 sandwiched between the pixel electrode 31 and the counter electrode 33 via the driving transistor 23. The organic EL element 30 emits light according to the amount of current flowing through the functional layer 32.

  As shown in FIG. 2, the organic EL device 100 has an element substrate 10. The element substrate 10 is provided with a display area E0 (indicated by a one-dot chain line in the drawing) and a non-display area E3 outside the display area E0. The display area E0 has an actual display area E1 (indicated by a two-dot chain line in the figure) and a dummy area E2 surrounding the actual display area E1.

  In the actual display area E1, sub-pixels 18 as light-emitting pixels are arranged in a matrix. The sub-pixel 18 includes the organic EL element 30 as a light emitting element as described above, and blue (B), green (G), red (R) in accordance with the operation of the switching transistor 21 and the driving transistor 23. ) In any of the colors can be obtained.

  In the present embodiment, the sub-pixels 18 that can emit light of the same color are arranged in the first direction, and the second direction in which the sub-pixels 18 that can emit light of different colors intersect (orthogonal) the first direction. The so-called stripe-type sub-pixels 18 are arranged in an array. Hereinafter, the first direction is referred to as the Y direction, and the second direction is referred to as the X direction. The arrangement of the sub-pixels 18 on the element substrate 10 is not limited to the stripe method, and may be a mosaic method or a delta method.

  The dummy area E2 is provided with a peripheral circuit mainly for causing the organic EL elements 30 of the sub-pixels 18 to emit light. For example, as shown in FIG. 2, a pair of scanning line driving circuits 16 are provided extending in the Y direction at positions sandwiching the actual display area E1 in the X direction. An inspection circuit 17 is provided between the pair of scanning line driving circuits 16 at a position along the actual display area E1.

  A flexible circuit board (FPC) 43 for electrical connection with an external drive circuit is connected to one side (the lower side in the figure) parallel to the X direction of the element substrate 10. A driving IC 44 connected to the peripheral circuit on the element substrate 10 side through the wiring of the FPC 43 is mounted on the FPC 43. The driving IC 44 includes the data line driving circuit 15 described above, and the data line 13 and the power supply line 14 on the element substrate 10 side are electrically connected to the driving IC 44 via the FPC 43.

  Between the display area E0 and the outer edge of the element substrate 10, that is, in the non-display area E3, for example, a wiring 29 for applying a potential to the counter electrode 33 of the organic EL element 30 of each subpixel 18 is formed. The wiring 29 is provided on the element substrate 10 so as to surround the display area E0 except for the side portion of the element substrate 10 to which the FPC 43 is connected.

  Next, the planar arrangement of the sub-pixels 18, mainly the planar arrangement of the colored layers 36 (36B, 36G, 36R) and the convex portions 36a will be described with reference to FIG.

  As shown in FIG. 3, the sub-pixel 18B from which blue (B) light emission is obtained, the sub-pixel 18G from which green (G) light emission is obtained, and the sub-pixel 18R from which red (R) light emission is obtained are arranged in the X direction. They are arranged in order. The sub-pixels 18 that can emit light of the same color are arranged adjacent to each other in the Y direction. The three sub-pixels 18B, 18G, and 18R arranged in the X direction are displayed as one pixel 19.

  The pixel electrode 31 in the sub-pixel 18 has a substantially rectangular shape, and the longitudinal direction is arranged along the Y direction. The pixel electrode 31 may be referred to as pixel electrodes 31B, 31G, 31R (see FIG. 6) corresponding to the emission color. An insulating film 28 (see FIG. 6) is formed to cover the outer edges of the pixel electrodes 31B, 31G, and 31R. The planar shape of the opening 28a is also substantially rectangular.

  In FIG. 3, the arrangement of the sub-pixels 18B, 18G, and 18R of different colors is in the order of blue (B), green (G), and red (R) from the left side in the X direction, but is not limited thereto. It is not something. For example, in the X direction, the order may be red (R), green (G), and blue (B) from the left side.

  In the present embodiment, the light-transmissive convex portion 36a is formed by a photolithography method using a photosensitive resin material that does not include a coloring material. That is, the main material of the convex part 36a and the colored layers 36B, 36G, and 36R is the same.

  Next, the structure of the organic EL device will be described with reference to FIGS. FIG. 4 is a schematic plan view showing the overall structure of the organic EL device. FIG. 5 is a schematic cross-sectional view showing the structure of the organic EL device along the line B-B ′ in FIG. 4. FIG. 6 is a schematic cross-sectional view showing the structure of the sub-pixel along the line A-A ′ of FIG. 3.

  As shown in FIGS. 4 and 5, in the organic EL device 100, as described above, the driving transistor 23 (see FIG. 1) and the like are formed on the base material 11 as the first substrate constituting the element substrate 10. Furthermore, a functional layer 32 having an organic light emitting layer or the like is provided. The functional layer 32 is covered with a counter electrode 33 that functions as a cathode.

  On the counter electrode 33, a sealing layer 34 is formed over the counter electrode 33 and the entire substrate 11. The sealing layer 34 includes, from the substrate 11 side, a cathode protective layer 34a as a first inorganic sealing layer, an organic buffer layer 34b as an organic sealing layer, and a gas barrier layer 34c as a second inorganic sealing layer. It has a three-layer structure.

  A moisture sensor layer 45 is formed in a region surrounding the display region E in plan view between the organic buffer layer 34b and the gas barrier layer 34c. The display area E is an area including at least the actual display area E1 described above.

  The moisture sensor layer 45 uses a material that changes color by contact with moisture in order to detect moisture that has entered inside the sealing layer 34 (gas barrier layer 34c). Examples of the material of the moisture sensor layer 45 include alkali metals, alkaline earth metals, and organic dyes.

  Examples of the alkali metal include calcium, which reacts quickly with moisture and can detect moisture smaller than the value of moisture permeability necessary for the organic EL device 100.

  Examples of the alkaline earth metal include magnesium having a larger amount of water detectable than calcium. Note that either calcium or magnesium may be selected while confirming compatibility with the gas barrier layer 34c.

  The film thickness of the moisture sensor layer 45 is, for example, 5 nm to 1000 nm. A preferable range is, for example, 10 nm to 100 nm. As a method for forming the moisture sensor layer 45, a vacuum deposition method can be used.

  A gas barrier layer 34c is formed on the moisture sensor layer 45 and the organic buffer layer 34b. As described above, since the moisture sensor layer 45 is disposed on the organic buffer layer 34b, the moisture sensor layer 45 is discolored when moisture enters the sealing layer 34, so that it is detected (discriminated). ). Therefore, for example, it can be removed as a defective product by appearance inspection. As a result, it is possible to prevent defective products (defective products) from circulating in the market.

  A color filter 36 is formed on the sealing layer 34 including the gas barrier layer 34c so as to include the region of the functional layer 32 in plan view. In the color filter 36, a colored layer 36 such as a blue colored layer 36B, a green colored layer 36G, and a red colored layer 36R is disposed between the light-transmitting convex portions 36a. The material of the convex part 36a is, for example, an epoxy resin.

  On the color filter 36 and the gas barrier layer 34c, a counter substrate 41 as a second substrate is disposed via an adhesive 42. As the adhesive 42, for example, an epoxy resin can be used. The film thickness of the adhesive 42 is, for example, 5 μm to 10 μm. A preferable range is about 2 μm to 30 μm.

  The counter substrate 41 is made of a transparent substrate such as glass, for example, and is disposed to face the element substrate 10 with an adhesive 42 in order to protect the color filter 36 formed on the sealing layer 34 in the element substrate 10. .

  Next, the structure of the sub-pixels 18B, 18G, and 18R will be described with reference to FIG. As shown in FIG. 6, the organic EL device 100 includes a base material 11 as a first substrate, a reflective layer 25, a transparent layer 26, pixel electrodes 31 </ b> B, 31 </ b> G, 31 </ b> R, functions formed in order on the base material 11. A layer 32 and a counter electrode 33.

  Furthermore, the organic EL device 100 includes a sealing layer 34 that covers the counter electrode 33 and a color filter 36 that is formed on the sealing layer 34. In the present embodiment, the substrate 11 to the color filter 36 are referred to as an element substrate 10. In FIG. 6, the illustration of the configuration of the driving transistor 23 of the pixel circuit 20 in the element substrate 10 is omitted.

  The organic EL device 100 employs a top emission method in which light emitted from the functional layer 32 passes through the color filter 36 and is extracted from the counter substrate 41 side. Therefore, the base material 11 can use not only a transparent substrate such as glass but also an opaque substrate such as silicon and ceramics. The counter substrate 41 is a substrate such as transparent glass, for example.

  The reflective layer 25 formed on the base material 11 can use aluminum (Al), silver (Ag), or an alloy of these light reflective metals.

  The transparent layer 26 is intended to electrically insulate the pixel electrode 31 and the reflective layer 25 to be formed later, and for example, an inorganic insulating film such as silicon oxide (SiOx) can be used.

  An insulating film 28 is formed to cover the outer edge portions of the pixel electrodes 31B, 31G, and 31R. As a result, an opening 28a is formed on the pixel electrodes 31B, 31G, 31R. The insulating film 28 is formed to partition each of the pixel electrodes 31B, 31G, and 31R using, for example, an acrylic photosensitive resin.

  In the present embodiment, the insulating film 28 made of a photosensitive resin is formed to insulate the pixel electrodes 31B, 31G, and 31R from each other. However, each pixel electrode 31B is made of an inorganic insulating material such as silicon oxide. , 31G, 31R may be partitioned.

  The pixel electrodes 31B, 31G, 31R provided on the transparent layer 26 corresponding to the sub-pixels 18B, 18G, 18R are made of a transparent conductive film such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). The film thicknesses are different from each other. Specifically, the film thickness increases in the order of blue (B), green (G), and red (R).

  The functional layer 32 includes an organic light emitting layer from which white light can be obtained, and is formed in common across the sub-pixels 18B, 18G, and 18R. White light can be realized by combining organic light emitting layers that can emit blue (B), green (G), and red (R) light. Also, pseudo white light can be obtained by combining organic light emitting layers that can emit blue (B) and yellow (Y) light.

  As described above, the functional layers 32 of the sub-pixels 18R, 18B, and 18G emit white light, but the optical distances in the optical resonators of the sub-pixels 18B, 18G, and 18R are different as described later. Thereby, the spectrum of the light emitted from the counter electrode 33 is different.

  Although the internal emission spectrum of the functional layer 32 can be interpreted as being the same, the spectrum of light emitted using the resonant structure is different, and therefore, for convenience, the sub-pixel 18 emits light in different wavelength regions, that is, the sub-pixel. 18 describes that light emission of any one of red (R), green (G), and blue (B) can be obtained.

  Further, in the present embodiment, the sub-pixel 18 that can emit light of the same color or the sub-pixel 18 that can emit light of different colors is described according to the spectrum of light emitted using the resonance structure. It is.

  The counter electrode 33 covering the functional layer 32 is made of, for example, a magnesium silver (MgAg) alloy, and the film thickness is controlled so as to have both light transmission and light reflection.

  The sealing layer 34 has a structure in which a cathode protective layer 34a, an organic buffer layer 34b, and a gas barrier layer 34c are sequentially stacked from the counter electrode 33 side. In addition, the gas barrier property of the sealing layer 34 may be as long as the organic EL element 30 can be protected from oxygen and water in the atmosphere.

  The cathode protective layer 34a and the gas barrier layer 34c are formed using an inorganic material. As the inorganic material, it is difficult to pass moisture or oxygen, and examples thereof include SiOx (silicon oxide), SiNx (silicon nitride), SiOxNy (silicon oxynitride), and AlxOy (aluminum oxide).

  Examples of a method for forming the cathode protective layer 34a and the gas barrier layer 34c include a vacuum deposition method, an ion plating method, a sputtering method, and a CVD method. It is desirable to employ a vacuum deposition method or an ion plating method because it is difficult to damage the organic EL element 30 with heat or the like.

  The organic buffer layer 34b has transparency, and can be formed using, for example, a heat or ultraviolet curable epoxy resin, acrylic resin, urethane resin, or silicon resin. Alternatively, a coating-type inorganic material (such as silicon oxide) may be used. The organic buffer layer 34 b is formed by being laminated on the cathode protective layer 34 a that covers the plurality of organic EL elements 30.

  Since the surface of the cathode protective layer 34a is uneven due to the influence of the pixel electrodes 31B, 31G, 31R having different thicknesses, the organic buffer layer 34b is formed with a film thickness of 1 μm to 5 μm to alleviate the unevenness. Is preferred. As a result, the color filter 36 formed on the sealing layer 34 is hardly affected by the unevenness.

  The moisture sensor layer 45 described above is provided in a region surrounding the display region E in plan view on the organic buffer layer 34b. A gas barrier layer 34c is formed so as to cover the moisture sensor layer 45 and the organic buffer layer 34b. The gas barrier layer 34c is formed using the inorganic material described above.

  The color filter 36 includes a blue (B), green (G), and red (R) colored layers 36B, 36G, and 36R formed by a photolithography method on the sealing layer 34. The colored layers 36B, 36G, and 36R are formed corresponding to the sub-pixels 18B, 18G, and 18R, and on the sealing layer 34, the colored layers 36B, 36G, and 36R of the sub-pixels 18B, 18G, and 18R of different colors are formed. A light-transmissive convex portion 36a is provided therebetween. The height of the convex portion 36a on the sealing layer 34 is substantially equal to the film thickness of the colored layers 36B, 36G, and 36R.

  In the organic EL device 100 of the present embodiment, an optical resonator is configured between the reflective layer 25 and the counter electrode 33. Since the pixel electrodes 31B, 31G, and 31R have different film thicknesses for the sub-pixels 18B, 18G, and 18R, the optical distances in the respective optical resonators are different. As a result, in each of the sub-pixels 18B, 18G, and 18R, light having a resonance wavelength corresponding to each color is obtained.

  In addition, the adjustment method of the optical distance in an optical resonator is not limited to this, For example, the film thickness of the transparent layer 26 on the base material 11 and the transparent layer 26 are comprised for every sub pixel 18B, 18G, 18R. The materials may be different.

  Resonant light emitted from the optical resonators of the sub-pixels 18B, 18G, and 18R passes through the colored layers 36B, 36G, and 36R and is emitted from the transparent counter substrate 41 side. Since the color filter 36 is formed on the sealing layer 34, color mixing due to light leakage between the sub-pixels 18B, 18G, and 18R is reduced as compared with the case where the color filter 36 is formed on the counter substrate 41 side. The

  Such a structure of the sub-pixels 18B, 18G, and 18R can effectively reduce the color mixture as the planar size of the sub-pixels 18B, 18G, and 18R becomes smaller, that is, as the definition becomes higher.

<Method for manufacturing organic EL device>
Next, a method for manufacturing the organic EL device will be described with reference to FIGS. FIG. 7 is a flowchart showing a method for manufacturing the organic EL device. 8 to 10 are schematic plan views showing some manufacturing steps in the method for manufacturing the organic EL device.

  As shown in FIG. 7, the manufacturing method of the organic EL device 100 of the present embodiment includes an organic EL element forming step (step S11), a cathode protective layer forming step (step S12), and an organic buffer layer forming step (step S13). ), Moisture sensor layer forming step (step S14), gas barrier layer forming step (step S15), color filter forming step (step S16), appearance inspection step (step S17), and bonding step (step S18). And. As a method for forming the pixel circuit 20, the organic EL element 30, and the like on the substrate 11, a known method can be employed.

  Therefore, in FIGS. 8 to 10, the display of the configuration of the driving transistor 23 of the pixel circuit 20 on the base 11 is omitted. Hereinafter, the process before and after the characteristic part of the present invention will be described mainly.

  First, as shown in FIG. 7, in step S11, the organic EL element 30 is formed. Specifically, as shown in FIG. 8A, the organic EL element 30 is formed on the base material 11. As a method of forming the organic EL element 30, it can be formed using a known manufacturing technique.

  In step S12, the cathode protective layer 34a constituting the sealing layer 34 is formed. Specifically, as illustrated in FIG. 8B, the cathode protective layer 34 a is formed so as to cover the entire organic EL element 30 (counter electrode 33) and the base material 11. The cathode protective layer 34a is made of an inorganic material such as silicon oxide, for example. As a forming method, for example, a vacuum deposition method is used. The thickness of the cathode protective layer 34a is, for example, 200 nm to 400 nm.

  In step S13, the organic buffer layer 34b is formed. Specifically, as shown in FIG. 8C, a solution containing a transparent epoxy resin and an epoxy resin solvent is used on the cathode protective layer 34a, for example, by screen printing or spin coating. The organic buffer layer 34b made of an epoxy resin is formed by applying and drying the solution. The film thickness of the organic buffer layer 34b is, for example, 1 μm to 5 μm.

  In step S14, the moisture sensor layer 45 is formed. Specifically, as shown in FIG. 8D, a material that changes color when contacted with moisture, for example, calcium (Ca) is formed in the non-display area E3 on the organic buffer layer 34b. As a method for forming the moisture sensor layer 45, a vacuum deposition method using a mask 46 can be cited.

  As shown in FIG. 10, the film formation range of the moisture sensor layer 45 is an area (non-display area E3) surrounding the display area E on the organic buffer layer 34b. Note that the mask 46 to be used has slit-like connection portions at several places because it is impossible to make an opening hole around the entire periphery of the display region E. Therefore, the formed moisture sensor layer 45 is not connected by one film and has a slit-shaped non-film-formed portion.

  In step S15, the gas barrier layer 34c is formed. Specifically, as shown in FIG. 9E, an inorganic material such as silicon oxide is formed over the moisture sensor layer 45 and the organic buffer layer 34b. The forming method is, for example, a vacuum evaporation method. The thickness of the gas barrier layer 34c is, for example, 200 nm to 400 nm.

  In step S16, the color filter 36 is formed. Specifically, as shown in FIG. 9F, first, a convex portion 36a is formed on the gas barrier layer 34c (sealing layer 34). As a method for forming the convex portion 36a, first, a photosensitive resin material not containing a coloring material is applied and pre-baked using a spin coating method, thereby forming a photosensitive resin layer having a thickness of about 1 μm. The photosensitive resin material may be a positive type or a negative type.

  Next, the convex part 36a is formed on the sealing layer 34 by exposing / developing the photosensitive resin layer using a photolithography method. Thereby, the convex part 36a is formed between the colored layers 36B, 36G, 36R constituting the color filter 36. In the present embodiment, the convex portions 36a are formed in a matrix.

  Next, the colored layers 36B, 36G, and 36R are formed. First, a photosensitive resin containing a color material is applied to the entire surface of the base material 11 using a spin coating method or the like so as to cover the convex portion 36a. Next, the colored layer 36B is formed by performing exposure / development using a photolithography method. Thereafter, the colored layer 36G and the colored layer 36R are formed using the same method. As described above, the colored layers 36B, 36G, and 36R are formed between the convex portions 36a.

  In step S17, an appearance inspection is performed. Specifically, the color of the moisture sensor layer 45 is confirmed through the sealing layer 34 (gas barrier layer 34c). Here, if there is no change in the color (corrosion) of the moisture sensor layer 45, it is determined as a non-defective product. On the other hand, when the color of the moisture sensor layer 45 changes color (for example, black), it is determined as a defective product.

  When calcium reacts with moisture, the color changes to black as described above. When magnesium reacts with moisture, it turns white (cloudy).

  Further, since the photolithography method is used in forming the color filter 36, it is considered that moisture enters at this stage if there is a sealing defect. Therefore, it is desirable to perform an appearance inspection after the color filter 36 is formed.

  Thus, since it is completed as the organic EL device 100 and it is possible to determine whether moisture can enter before being distributed to the market as a product, for example, it becomes defective after being mounted on a head mounted display (HMD) as an electronic device. That can be suppressed.

  In step S18, the substrates are bonded together. Specifically, as shown in FIG. 9G, an adhesive 42 is supplied onto the element substrate 10. For example, an epoxy resin or an acrylic resin can be used as the adhesive 42.

  Thereafter, the element substrate 10 and the counter substrate 41 are bonded together. Specifically, as shown in FIG. 9H, the counter substrate 41 is pressed against the element substrate 10 side. Thus, the organic EL device 100 is completed.

<Electronic equipment>
Next, the electronic apparatus of this embodiment will be described with reference to FIG. FIG. 11 is a schematic diagram illustrating a configuration of a head mounted display (HMD) as an electronic apparatus.

  As shown in FIG. 11, the head mounted display 1000 includes the organic EL device 100, and is large enough to be held by a user's hand with a main body 115 having a shape like glasses. A control unit 200 having a thickness.

  The main body 115 and the control unit 200 are connected to be communicable by wire or wireless. In the present embodiment, the main body 115 and the control unit 200 are communicably connected via a cable 300. The main body 115 and the control unit 200 communicate image signals and control signals via the cable 300.

  The main body 115 includes a right-eye display unit 115A and a left-eye display unit 115B. The right-eye display unit 115A includes an image forming unit 120A that forms image light of a right-eye image. The left-eye display unit 115B includes an image forming unit 120B that forms image light of a left-eye image.

  The image forming unit 120 </ b> A is housed in the eyeglass-shaped body portion 115 in the vine portion (right side) of the eyeglasses. On the other hand, the image forming unit 120B is accommodated in a vine portion (left side) of the spectacle-type main body 115.

  The main body 115 is provided with a viewing portion 131A having light transparency. The visual recognition unit 131A emits the image light of the right-eye image toward the right eye of the user. Further, in the head mounted display 1000, the visual recognition part 131A has light permeability, and the surroundings can be visually recognized through the visual recognition part 131A.

  The main body 115 is provided with a viewing portion 131B having light transparency. The visual recognition unit 131B emits image light of the left-eye image toward the left eye of the user. Moreover, in the head mounted display 1000, the visual recognition part 131B has light transmittance, and the surroundings can be visually recognized through the visual recognition part 131B.

  The control unit 200 includes an operation unit 210 and an operation button unit 220. The user inputs an operation to the operation unit 210 and the operation button unit 220 of the control unit 200 and gives an instruction to the main body unit 115.

  According to such an electronic device, since the organic EL device 100 is provided, an electronic device with high display quality can be provided.

  In addition to the head-mounted display 1000, the electronic device on which the organic EL device 100 is mounted includes, for example, a head-up display (HUD), a projector, a smartphone, an EVF (Electrical View Finder), a mobile phone, a mobile computer, a digital It can be used for various electronic devices such as cameras, digital video cameras, in-vehicle devices, and lighting devices.

  As described above in detail, according to the organic EL device 100, the method for manufacturing the organic EL device 100, and the electronic apparatus of the present embodiment, the following effects can be obtained.

  (1) According to the organic EL device 100 of the present embodiment, since the moisture sensor layer 45 made of calcium or the like is formed so as to surround the display region E on the organic buffer layer 34b, the sealing layer 34 (gas barrier layer 34c) When moisture enters the inside), it is possible to detect (determine) that the moisture has entered due to the discoloration of the moisture sensor layer 45. Therefore, for example, it can be removed as a defective product by appearance inspection. As a result, it is possible to prevent defective products (sealing defective products) from being distributed to the market. In addition, since the moisture sensor layer 45 is formed in the non-display area E3, moisture can be detected with high accuracy even if it cannot be determined as non-emission (dark spot) as in the display area E.

  (2) According to the organic EL device 100 of the present embodiment, the moisture sensor layer 45 is formed on the entire surface of the organic buffer layer 34b so as to surround the display area E in a plan view. Even when moisture enters at a pinpoint, moisture can also be detected.

  (3) According to the method of manufacturing the organic EL device 100 of the present embodiment, since the mask 46 having a part of the region corresponding to the non-display region E3 is used, at least the central region (display region E) of the mask 46 is used. It becomes possible to connect the surrounding area. Therefore, the formation of the moisture sensor layer 45 in the display area E can be suppressed.

  (4) According to the electronic apparatus of the present embodiment, since the organic EL device 100 described above is provided, an electronic apparatus capable of improving display quality can be provided.

  The aspect of the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. It is included in the range. Moreover, it can also implement with the following forms.

(Modification 1)
As described above, the moisture sensor layer 45 is not limited to being formed in the non-display area E3, and may be formed in the display area E. In this case, since it is conceivable that the transmittance decreases, it is preferable to determine whether or not to form according to product specifications.

(Modification 2)
As described above, the material of the moisture sensor layer 45 is not limited to using alkali metal or alkaline earth metal, and for example, an organic dye may be used. Examples of organic dyes include anthocyanin dyes.

  DESCRIPTION OF SYMBOLS 10 ... Element board | substrate, 11 ... Base material as 1st board | substrate, 12 ... Scan line, 13 ... Data line, 14 ... Power supply line, 15 ... Data line drive circuit, 16 ... Scan line drive circuit, 17 ... Inspection circuit, 18 , 18B, 18G, 18R ... sub-pixel, 19 ... pixel, 20 ... pixel circuit, 21, 23 ... transistor, 22 ... storage capacitor, 25 ... reflection layer, 26 ... transparent layer, 28 ... insulating film, 28a ... opening, DESCRIPTION OF SYMBOLS 29 ... Wiring, 30 ... Organic EL element 31, 31B, 31G, 31R ... Pixel electrode, 32 ... Functional layer, 33 ... Counter electrode, 34 ... Sealing layer, 34a ... Cathode protective layer as 1st inorganic sealing layer 34b ... an organic buffer layer as an organic sealing layer, 34c ... a gas barrier layer as a second inorganic sealing layer, 36 ... a color filter, 36B ... a blue colored layer, 36G ... a green colored layer, 36R ... a red colored layer, 36a ... convex part, 41 ... first Counter substrate as a substrate, 42 ... Adhesive, 43 ... FPC, 44 ... Drive IC, 45 ... Moisture sensor layer, 46 ... Mask, 100 ... Organic EL device, 115 ... Main body, 115A ... Display unit for right eye, 115B Display unit for left eye, 120A ... Image forming unit, 120B ... Image forming unit, 131A ... Visual recognition unit, 131B ... Visual recognition unit, 200 ... Control unit, 210 ... Operation unit, 220 ... Operation button unit, 300 ... Cable, 1000 ... Head mounted display.

Claims (9)

A first substrate;
An organic EL element provided on the first substrate;
A first inorganic sealing layer covering the organic EL element;
An organic sealing layer provided on the first inorganic sealing layer;
A moisture sensor layer provided on the organic sealing layer;
A second inorganic sealing layer provided on the organic sealing layer and the moisture sensor layer;
An organic EL device comprising: The organic EL device according to claim 1,
The organic EL device, wherein the moisture sensor layer is arranged in a non-display area on the organic sealing layer. The organic EL device according to claim 1 or 2,
The organic EL device, wherein the moisture sensor layer is disposed so as to surround a display region. An organic EL device according to any one of claims 1 to 3,
2. The organic EL device according to claim 1, wherein the moisture sensor layer is a material that changes color when contacted with moisture. An organic EL device according to any one of claims 1 to 4,
The organic EL device according to claim 1, wherein the moisture sensor layer is made of any one of alkali metal, alkaline earth metal, and organic dye. An organic EL device according to any one of claims 1 to 5,
A color filter provided on the second inorganic sealing layer;
A second substrate bonded to the color filter via an adhesive;
An organic EL device comprising: Forming an organic EL element on the first substrate;
Forming a first inorganic sealing layer on the organic EL element;
Forming an organic sealing layer on the first inorganic sealing layer;
Forming a moisture sensor layer on the organic sealing layer;
Forming a second inorganic sealing layer on the organic sealing layer and the moisture sensor layer;
A method for producing an organic EL device, comprising: It is a manufacturing method of the organic EL device according to claim 7,
The step of forming the moisture sensor layer is formed by an evaporation method using a mask in which a part of a region corresponding to a non-display region of the organic EL element is opened.   An electronic apparatus comprising the organic EL device according to any one of claims 1 to 6.

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