JP2015056335A - Electro-optical device, electronic apparatus, and method of manufacturing electro-optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optical device having excellent reliability and quality, an electronic apparatus including the electro-optical device, and a method of manufacturing the electro-optical device.SOLUTION: The electro-optical device includes: a substrate 10 having a first surface P1; an organic EL element 40 which is a light-emitting element arranged on the first surface P1; an inspection terminal 24 arranged between an arrangement region E of the organic EL element 40 and an outer edge of the substrate 10 on the first surface P1; and a sealing layer 50 which is a resin layer formed over at least the arrangement region E and covering the organic EL element 40. The sealing layer 50 covers the inspection terminal 24.

Description

  The present invention relates to an electro-optical device, an electronic apparatus including the electro-optical device, and a method for manufacturing the electro-optical device.

  2. Description of the Related Art Conventionally, in an electro-optical device, for example, an organic electroluminescence device (hereinafter referred to as an organic EL device), an element substrate on which an organic EL element serving as a light emitting pixel and a circuit for driving the organic EL element are formed is in the middle of manufacturing An inspection terminal for inspecting the organic EL element and the drive circuit and an external connection terminal for connecting to an external circuit are provided. During the manufacture of the organic EL device, the electrical characteristics of the organic EL element and the drive circuit were measured using the inspection terminal, and a defect was detected at an early stage. On the other hand, after the completion of the organic EL device, when the inspection terminal is exposed, the drive circuit breaks down due to static electricity entering from the outside through the inspection terminal, causing malfunction. Therefore, in Patent Document 1, a planarizing film made of an insulating layer is formed on the inspection terminal, and in Patent Document 2, a protective film for preventing deterioration of the light emitting pixel, for example, a resin layer is formed on the inspection terminal. By forming, malfunction was prevented.

JP 2010-33090 A JP 2010-160950 A

  However, since the inspection terminal in Patent Document 1 is provided adjacent to the light emitting pixel between the light emitting pixel and the drive circuit, the surface of the element substrate is caused by scratches caused by bringing the probe into contact with the inspection terminal during inspection. Concavities and convexities were formed on the film, and the film thickness was not uniform in the coating process when forming the subsequent color filter. Further, there is a problem that a defect occurs in the sealing layer for protecting the organic EL element, and the reliability quality of the organic EL device is lowered. In addition, since the inspection terminals in Patent Document 2 are provided for each light emitting pixel, there is a problem in reducing the reliability quality due to the scratch during the inspection and reducing the size of the organic EL device and miniaturizing the light emitting pixels. It was.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example An electro-optical device according to this application example includes a substrate having a first surface, a light-emitting element disposed on the first surface, and an arrangement of the light-emitting elements on the first surface. An inspection terminal disposed between the region and the outer edge of the substrate, and a resin layer formed over at least the arrangement region and covering the light emitting element, and the resin layer covers the inspection terminal. It is characterized by being.

  According to this application example, the inspection terminal is arranged between the light emitting element arrangement region and the outer edge of the substrate, and is covered with the resin layer. In addition, it is possible to suppress non-uniform film thickness in the coating process in the subsequent manufacturing process and the occurrence of defects in the sealing layer for protecting the organic EL element, and to reduce the influence of external static electricity or the like. In addition, the electro-optical device can be reduced in size as compared with the case where inspection terminals are provided corresponding to each light emitting element in the arrangement region. That is, a small electro-optical device having high reliability quality can be provided.

  In the electro-optical device according to the application example, the resin layer includes a color filter layer.

  According to this configuration, the inspection terminal is covered using the color filter layer, and the influence of static electricity from the outside can be reduced.

  In the electro-optical device according to the application example, the color filter layer includes at least blue, green, and red filter layers, and the inspection terminal is covered with at least one filter layer. To do.

  According to this configuration, the inspection terminal is covered with at least one of the blue, green, and red filter layers, so that the influence of static electricity from the outside can be reduced.

  In the electro-optical device according to the application example, the resin layer includes an organic buffer layer.

  According to this configuration, the inspection terminal is covered with the organic buffer layer, and it is possible to reduce the influence of irregularities such as scratches attached to the inspection terminal on the subsequent manufacturing process.

  In the electro-optical device according to the application example, the organic buffer layer is covered with an inorganic sealing layer.

  According to this configuration, it is possible to reduce the influence of moisture or the like on the inspection terminal by the inorganic sealing layer.

  In the electro-optical device according to the application example, the resin layer includes an optical adjustment layer.

  According to this configuration, the inspection terminal is covered with the optical adjustment layer, and the influence of external static electricity or the like can be reduced.

  In the electro-optical device according to the application example, the resin layer includes a first portion that covers the light emitting element, and a second portion that covers the inspection terminal, and the first portion; The second portion is separated from each other.

  According to this configuration, even if moisture enters through the resin layer of the second part, the first part of the resin layer covering the light emitting element and the second part of the resin layer covering the inspection terminal are mutually connected. Since they are separated from each other, moisture can be prevented from reaching the first portion of the resin layer covering the light emitting element, and deterioration of the characteristics of the light emitting element due to the influence of moisture can be prevented.

  In the electro-optical device according to the application example described above, the second portion is provided along an outer edge of the substrate so as to surround the first portion.

  According to this configuration, the first portion covering the light emitting element is surrounded by the second portion provided along the outer edge of the substrate, and thus covers the light emitting element through the resin layer of the second portion. Since it is possible to prevent moisture from reaching the resin layer of the first portion, it is possible to more reliably prevent deterioration of the characteristics of the light emitting element due to the influence of moisture.

  In the electro-optical device according to the application example, the light-emitting element includes a first electrode, a second electrode disposed to face the first electrode, and the first electrode and the second electrode. And a light emitting functional layer disposed therebetween.

  According to this configuration, it is possible to provide an electro-optical device including a light emitting element having high reliability quality.

  [Application Example] An electronic apparatus according to this application example includes the electro-optical device according to the application example described above.

  According to the configuration of this application example, it is possible to provide an electronic apparatus including an electro-optical device having high reliability quality.

  [Application Example] A method for manufacturing an electro-optical device according to this application example includes a substrate having a first surface, a light emitting element disposed on the first surface, and the light emission on the first surface. An electro-optical device manufacturing method comprising: an inspection terminal disposed between an element arrangement region and an outer edge of the substrate; and after forming the light emitting element on the first surface, And a step of forming a resin layer covering the light emitting element placement region and the inspection terminal.

  According to the method of this application example, the inspection terminal is arranged between the light emitting element arrangement region and the outer edge of the substrate, and the inspection terminal is covered with the resin layer. Suppresses the occurrence of defects in the coating layer in the subsequent manufacturing process due to the unevenness and the occurrence of defects in the sealing layer for protecting the organic EL element, and the influence of external static electricity, etc. Therefore, an electro-optical device including a light-emitting element having high reliability quality can be manufactured.

  In the method of manufacturing an electro-optical device according to the application example, the step of forming the resin layer includes a step of forming a color filter layer.

  According to this method, since the inspection terminal can be covered with the color filter layer in the step of forming the color filter layer facing the light emitting element, a low cost and high reliability quality can be achieved without requiring a new step. Can be manufactured.

  In the method of manufacturing an electro-optical device according to the application example, the step of forming the color filter layer includes forming at least a blue, green, and red filter layer, and the inspection terminal is formed by at least one filter layer. It is characterized by covering.

  According to this method, since the inspection terminal can be covered with at least one filter layer in the process of forming the blue, green and red filter layers, a new process is not required, and the cost is high and the reliability is high. An electro-optical device having high quality can be manufactured.

  In the method of manufacturing the electro-optical device according to the application example, the step of forming the resin layer includes a step of forming an organic buffer layer.

  According to this method, since the inspection terminal can be covered with the organic buffer layer in the step of forming the organic buffer layer, the electro-optical device having high reliability and low cost without requiring a new step. Can be manufactured.

  In the electro-optical device manufacturing method according to the application example, the step of forming the resin layer includes a step of forming an inorganic sealing layer that covers the organic buffer layer.

  According to this method, in the step of forming the inorganic sealing layer covering the organic buffer layer, the inorganic sealing layer is first formed on the inspection terminal, and the organic buffer layer is further formed thereon, and further thereon Since the inspection terminal can be covered by forming the inorganic sealing layer, an electro-optical device having high reliability quality can be manufactured at low cost without requiring a new process.

  In the electro-optical device manufacturing method according to the application example, the step of forming the resin layer includes a step of forming an optical adjustment layer.

  According to this method, since the inspection terminal can be covered with the optical adjustment layer in the step of forming the optical adjustment layer, an electro-optical device having a high reliability and a low cost without requiring a new step. Can be manufactured.

  In the electro-optical device manufacturing method according to the application example described above, the step of forming the resin layer may include a first portion of the resin layer that covers the light emitting element and a first portion of the resin layer that covers the inspection terminal. The two portions are formed apart from each other.

  According to this method, the moisture that enters through the second portion of the resin layer facing the outer edge of the substrate causes the first portion of the resin layer that covers the light emitting element and the second portion of the resin layer that covers the inspection terminal. Can be prevented from reaching the first portion of the resin layer covering the light emitting element, and an electro-optical device that prevents deterioration of the characteristics of the light emitting element due to moisture can be manufactured. it can.

  In the electro-optical device manufacturing method according to the application example, the second portion is formed along an outer edge of the substrate so as to surround the first portion.

  According to this method, the first part covering the light emitting element is formed so as to be surrounded by the second part provided along the outer edge of the substrate, whereby the resin of the second part facing the outer edge of the substrate. Since it is possible to prevent moisture entering through the layer from reaching the first portion of the resin layer covering the light emitting element, it is possible to manufacture an electro-optical device that more reliably prevents deterioration of characteristics of the light emitting element due to moisture. it can.

1 is a schematic plan view showing a configuration of an organic EL device as an electro-optical device according to a first embodiment. The schematic sectional drawing of the AA line of the organic electroluminescent apparatus shown in FIG. The schematic sectional drawing of the HH line | wire of the organic electroluminescent apparatus shown in FIG. It is a schematic block diagram of the mother board | substrate for manufacturing an organic EL apparatus, (a) is a schematic plan view which shows a mother board | substrate, (b) is a schematic plan view which shows arrangement | positioning of the element substrate in a mother board | substrate. The schematic sectional drawing which shows the structure of the organic electroluminescent apparatus concerning 2nd Embodiment, and is equivalent to the cross section of the AA line of FIG. The schematic sectional drawing which shows the structure of the organic electroluminescent apparatus which concerns on 3rd Embodiment, and corresponds to the cross section of the AA line of FIG. The schematic plan view which shows the structure of the organic electroluminescent apparatus which concerns on 4th Embodiment. The schematic sectional drawing of the BB line of the organic electroluminescent apparatus shown in FIG. Schematic which shows the head mounted display as an example of an electronic device.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

  In the following embodiments, for example, “on the substrate”, the case where the substrate is disposed so as to be in contact with the first surface P1 (the surface on the + Z-axis direction side) of the substrate, or the first of the substrate. When disposed on the surface P1 of the substrate via another component, or disposed so as to partially contact the first surface P1 of the substrate, and partially disposed via the other component. Represents the case.

(First embodiment)
<Electro-optical device>
First, as an example of the electro-optical device according to the first embodiment, an organic EL device will be described and described with reference to FIGS.
FIG. 1 is a schematic plan view showing a configuration of an organic EL device as an electro-optical device according to the first embodiment. 2 is a schematic cross-sectional view taken along line AA of the organic EL device shown in FIG. 1, and FIG. 3 is a schematic cross-sectional view taken along line HH of the organic EL device shown in FIG.
As shown in FIG. 1, the organic EL device 1 according to the first embodiment includes a light emitting pixel 62, a data line driving circuit 12, a scanning line driving circuit 14, an inspection circuit 16 on a first surface P <b> 1 of the substrate 10. An element substrate 100 provided with an external connection terminal 20 for electrical connection with an external circuit and a plurality of inspection terminals 24, a sealing substrate 80 for protecting the light emitting pixels 62, and the like, And a filler 70 (see FIG. 2), which is a resin layer that adheres the sealing substrate 80.

  The light emitting pixels 62 are arranged in a matrix in the arrangement region E of the element substrate 100. There are a light emitting pixel 62B that can emit blue (B) light, a light emitting pixel 62G that can emit green (G) light, and a light emitting pixel 62R that can emit red (R) light. The light emitting pixels 62 that can emit light of the same color are arranged in the vertical direction (Y-axis direction) in the drawing, and the light emitting pixels 62 that can emit light of different colors are B in the horizontal direction (X-axis direction) in the drawing. , G, R are repeatedly arranged in this order. Such an arrangement of the light emitting pixels 62 is called a stripe method, but is not limited to this. For example, the arrangement in the horizontal direction (X-axis direction) of the light emitting pixels 62 that can emit light of different colors does not have to be in the order of B, G, and R, and may be in the order of R, G, and B, for example.

  As shown in FIG. 2, each of the light emitting pixels 62B, 62G, and 62R includes an organic EL element 40 as a light emitting element and a color filter layer 60 (60B, 60G, 60R) corresponding to B, G, and R. The light emitted from the organic EL element 40 is converted into B, G, and R emission colors to enable full color display. In addition, an optical resonance structure that improves the luminance of a specific wavelength in the light emission wavelength range from the organic EL element 40 may be constructed for each of the light emitting pixels 62B, 62G, and 62R.

  In the organic EL device 1, the light emitting pixels 62B, 62G, and 62R function as sub-pixels. In the image display, the three light emitting pixels 62B, 62G, and 62R that can emit light corresponding to B, G, and R are used. One pixel unit is configured. Note that the configuration of the pixel unit is not limited to this, and the light emitting pixel 62 that can obtain a light emission color (including white) other than B, G, and R may be included in the pixel unit. Hereinafter, in the element substrate 100, the direction in which the light emitting pixels 62 of different colors are arranged is referred to as an X-axis direction, and the direction in which the light emitting pixels 62 of the same color are arranged is described as a Y-axis direction.

  The external connection terminals 20 are arranged in the X-axis direction along the first side of the element substrate 100 (side crossing the −Y-axis direction). Each of the data line driving circuit 12 and the scanning line driving circuit 14 for driving and controlling the plurality of light emitting pixels 62 is electrically connected by the wiring 22.

  The inspection terminal 24 includes a second side (a side that intersects the −X axis direction) orthogonal to the first side of the element substrate 100, a third side (a side that intersects the + X axis direction), and They are arranged in the Y-axis direction and the X-axis direction, respectively, along a fourth side (parallel to the + Y-axis direction) parallel to the first side. The inspection terminal 24 is provided between the arrangement region E of the light emitting pixels 62 and the outer edge portion of the element substrate 100, and is electrically connected to the scanning line driving circuit 14 and the inspection circuit 16 by the wiring 26. Yes.

  The data line driving circuit 12 is arranged between the external connection terminal 20 and the arrangement region E in the Y-axis direction and extends in the X-axis direction. The pair of scanning line driving circuits 14 are provided so as to face each other across the arrangement region E of the light emitting pixels 62 in the X-axis direction, and the second side and the third side that are orthogonal to the first side. And the arrangement region E of the light emitting pixels 62, and extends in the Y-axis direction. Further, the inspection circuit 16 is arranged between the inspection terminal 24 and the arrangement region E of the light emitting pixels 62 in the Y-axis direction, and extends in the X-axis direction.

  2 and 3, the element substrate 100 provided with the organic EL element 40 and the color filter layer 60 (filter layers (60B, 60G, 60R)) and the light-transmissive sealing substrate 80 are bonded to each other. Are bonded together by a filler 70 which is a resin layer having both properties and light transmittance. The light emitted from the organic EL element 40 passes through the corresponding filter layers 60B, 60G, and 60R and is emitted from the sealing substrate 80 side. That is, the organic EL device 1 has a top emission structure.

As the material of the substrate 10, since the organic EL device 1 has a top emission structure, not only a light-transmissive glass substrate but also an opaque ceramic substrate or semiconductor substrate can be used.
In the present embodiment, a semiconductor substrate is used as the substrate 10 of the element substrate 100. The semiconductor substrate is, for example, a silicon substrate.

Next, the configuration of the element substrate 100 will be described in detail with reference to FIGS.
As shown in FIG. 2, the element substrate 100 has a plurality of light emitting pixels 62 (62B, 62G, 62R) formed in the arrangement region E on the substrate 10, and the light emitting pixels 62 (62B, 62G, 62R) for reflecting the light emission, the insulating layer 34 for insulating the reflective layer 32 and the first electrode 41 of the organic EL element 40, the organic EL element 40, the sealing layer 50 as a resin layer, and The color filter layers 60 are stacked in this order.

  Here, the organic EL element 40 is formed in a configuration in which the light emitting functional layer 42 is disposed between the first electrode 41 and the second electrode 43 disposed to face the first electrode 41. In addition, each organic EL element 40 corresponding to the light emitting pixel 62 (62B, 62G, 62R) is disposed in an opening separated by the insulating film 30.

In the present embodiment, aluminum (Al) is used as a material for forming the reflective layer 32. Silicon nitride (SiN) is used as an insulating material for forming the insulating layer 34. Silicon oxide (SiO ₂ ) is used as an insulating material for forming the insulating film 30.

Next, the organic EL element 40 is formed in the opening formed by the insulating film 30.
First, the reflective layer 32 and the insulating layer 34 are laminated on the first surface P1 of the substrate 10, and the insulating film 30 is further laminated thereon, and an opening is formed by etching. Then, the 1st electrode 41 which is an anode is formed in the inside of an opening part. A transparent conductive film is used as an electrode material for forming the first electrode 41, for example, an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. The film thickness of the first electrode 41 is approximately 100 nm.

Next, the light emitting functional layer 42 is formed on the first electrode 41. The light-emitting functional layer 42 includes a light-emitting layer in which an organic semiconductor material is used as a light-emitting material. For example, a hole injection layer, a hole transport layer, a light-emitting layer, an electron stacked in order from the first electrode 41 side. It includes a transport layer, an electron injection layer, and the like. The structure of the light emitting functional layer 42 capable of obtaining white light emission is not particularly limited, and a known structure can be applied. For example, the light emitting functional layer 42 includes a laminated body in which light emitting layers that can obtain B (blue), G (green), and R (red) emission colors are stacked, or two layers of B (blue) and orange. It may include a laminate of a light emitting layer in which a pseudo white color is obtained by one light emission. Further, for the purpose of improving the light emission efficiency, an intermediate layer that assists or prevents the movement of holes and electrons as carriers injected into the light emitting layer may be included.
A method for forming each layer constituting the light emitting functional layer 42 is not particularly limited, and for example, a gas phase process such as a vacuum deposition method or a liquid phase process such as an ink jet method can be used. Alternatively, the light emitting functional layer 42 may be formed by combining both the gas phase process and the liquid phase process.

  Next, the second electrode 43 which is a common cathode is formed so as to cover the light emitting functional layer 42 over at least the arrangement region E. In the present embodiment, the second electrode 43 is formed by controlling the film thickness using, for example, an alloy containing Ag (MgAg or the like) so as to have light reflectivity and light transmissivity. The second electrode 43 is preferably formed by using a vapor phase process such as a vacuum evaporation method in consideration of damage to the light emitting functional layer 42 due to moisture or heat. Thereby, the organic EL element 40 is formed for each of the light emitting pixels 62B, 62G, and 62R.

  Next, the sealing layer 50 that covers the plurality of organic EL elements 40 formed in the arrangement region E is formed. In the present embodiment, the sealing layer 50 includes a first inorganic sealing layer 51 that covers the surface of the second electrode 43, an organic buffer layer 52, and a second inorganic sealing layer 53 that covers the organic buffer layer 52. Has been.

The first inorganic sealing layer 51 is difficult to transmit gas such as moisture and oxygen (gas barrier property) and can be transparent. For example, silicon oxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), acid It is formed using an inorganic compound such as a metal oxide such as silicon nitride (SiON) or titanium oxide (TiO ₂ ). As a forming method, it is preferable to use a vapor phase process capable of forming a dense film at a low temperature. For example, a high-density plasma film forming method such as a plasma CVD method or an ECR plasma sputtering method, a vacuum evaporation method, an ion plating method, or the like. The law can be mentioned. The film thickness of the first inorganic sealing layer 51 is approximately 200 nm to 400 nm.

  The surface of the first inorganic sealing layer 51 is uneven due to the influence of a structure such as the organic EL element 40 provided in the lower layer. In the present embodiment, in order to prevent a decrease in the sealing function of the second inorganic sealing layer 53 due to the unevenness or adhesion of foreign matters, at least in the arrangement region E of the surface of the first inorganic sealing layer 51. An organic buffer layer 52 that relaxes and flattens the unevenness is formed.

  The organic buffer layer 52 is, for example, an organic resin layer formed by applying a solution obtained by dissolving a transparent organic resin in a solvent, applying the solution by a printing method or a spin coating method, and drying the solution. Examples of the organic resin include an epoxy resin. Since the unevenness on the surface of the first inorganic sealing layer 51 is relaxed or the foreign matter attached to the first inorganic sealing layer 51 is covered and flattened, the film thickness is preferably 1 μm to 5 μm. In the embodiment, an organic buffer layer 52 having a thickness of about 3 μm was formed using an epoxy resin. In plan view, the arrangement area E and the data line driving circuit 12 are not covered in FIG. 3 without covering the external connection terminals 20 so as to cover the arrangement area E, the scanning line driving circuit 14 and the inspection terminal 24 in FIG. The first inorganic sealing layer 51 and the organic buffer layer 52 were formed so as to cover

Next, a second inorganic sealing layer 53 that covers the organic buffer layer 52 is formed. Similar to the first inorganic sealing layer 51, the second inorganic sealing layer 53 is formed using an inorganic compound that has both transparency and gas barrier properties and is excellent in water resistance and heat resistance. Examples of the inorganic compound include silicon oxide (SiO ₂ ), silicon nitride (Si ₃ N ₄ ), and silicon oxynitride (SiON). The second inorganic sealing layer 53 can be formed using the same method as the first inorganic sealing layer 51. The film thickness of the second inorganic sealing layer 53 is preferably in the range of 300 nm to 700 nm, and more preferably in the range of 200 nm to 400 nm so that cracks do not occur during film formation. Thereby, at least in the arrangement region E, the sealing layer 50 in which the first inorganic sealing layer 51 and the second inorganic sealing layer 53 are laminated with the organic buffer layer 52 interposed therebetween is completed.
Here, outside the arrangement region E, the second inorganic sealing layer 53 is in contact with the first inorganic sealing layer 51. More specifically, the second inorganic sealing layer 53 is in contact with the first inorganic sealing layer 51 outside the region where the inspection terminal 24, the scanning line driving circuit 14, and the inspection circuit 16 are provided.

  Next, the color filter layer 60 (filter layers (60B, 60G, 60R)) is formed on the sealing layer 50. The color filter layer 60 includes filter layers 60B, 60G, and 60R corresponding to the light emitting pixels 62B, 62G, and 62R. Each of the filter layers 60B, 60G, and 60R exposes a photosensitive resin layer obtained by, for example, applying and drying a solution containing a photosensitive resin material in which a coloring material such as a dye or pigment is dissolved or dispersed. -It is formed by developing.

  Accordingly, when the three color filter layers 60B, 60G, and 60R are formed, at least three times of exposure and development are performed. In FIG. 2, the filter layers 60B, 60G, and 60R are shown to have the same film thickness, but actually, when light emitted from the organic EL element 40 passes through the filter layers 60B, 60G, and 60R. In addition, the film thicknesses of the filter layers 60B, 60G, and 60R are adjusted within a range of 1.0 μm to 2.0 μm so that appropriate optical characteristics such as chromaticity and white balance can be obtained.

  The filter layers 60B, 60G, and 60R are exposed and developed so as to overlap the corresponding first electrodes 41 in plan view. Further, the boundary between adjacent filter layers may be located between the pixel electrodes, and may be exposed and developed so that a part of the other filter layer overlaps with one filter layer.

  In the present embodiment, white light emitted from the organic EL element 40 is transmitted through the filter layers 60B, 60G, and 60R, so that a desired light emission color can be obtained for each of the light emitting pixels 62B, 62G, and 62R. .

  The element substrate 100 including the organic EL element 40, the sealing layer 50, and the color filter layer 60 formed on the first surface P <b> 1 of the substrate 10 is interposed via a filler 70 having both adhesiveness and transparency. It is bonded to the sealing substrate 80. As the filler 70, for example, a thermosetting or photocurable epoxy resin material can be used. After the filler 70 is applied to the element substrate 100, the sealing substrate 80 is pressed against the element substrate 100, and the filler 70 is expanded to a predetermined range and then cured.

  Next, the configuration of the inspection terminal 24 will be described. As shown in FIG. 2, the element substrate 100 includes an inspection terminal 24, a scanning line driving circuit 14, and an area between the arrangement region E of the light emitting pixels 62 (62 B, 62 G, 62 R) on the substrate 10 and the outer edge portion of the substrate 10. Is formed. A sealing layer 50 including a first inorganic sealing layer 51, an organic buffer layer 52, and a second inorganic sealing layer 53 is formed on the inspection terminal 24 and the scanning line driving circuit 14.

  Therefore, since the inspection terminal 24 is covered with the sealing layer 50 and is not exposed, scanning due to static electricity generated when the sealing layer 50 and the color filter layer 60 are formed after the organic EL element 40 is formed. It is possible to prevent electrostatic breakdown of the line driving circuit 14, individual wirings, and the organic EL element 40. Further, the inspection terminal 24 is provided with the scanning line driving circuit 14 between the light emitting pixel 62 (62B, 62G, 62R) and the arrangement region E, and the distance between the inspection terminal 24 and the light emitting pixel 62 (62B, 62G, 62R) is set. Since they are arranged apart from each other, defects due to unevenness of the film thickness in the coating process due to unevenness of scratches generated when the electrical characteristics of the scanning line driving circuit 14 and the organic EL element 40 are inspected, and the sealing layer 50 The occurrence of defects can be reduced.

  The data line driving circuit 12 and the inspection circuit 16 are also covered with the sealing layer 50 after the electrical characteristics are inspected by the inspection terminal 24.

<Method of manufacturing electro-optical device>
Next, a method for manufacturing the organic EL device 1 as the electro-optical device according to the present embodiment will be described with reference to FIGS. FIG. 4 is a schematic configuration diagram of a mother substrate for manufacturing an organic EL device. FIG. 4A is a schematic plan view showing the mother substrate, and FIG. 4B is an arrangement of element substrates on the mother substrate. It is a schematic plan view.

  As described above, the element substrate 100 of the organic EL device 1 in this embodiment uses a semiconductor substrate as the substrate 10. In the actual manufacture of the organic EL device 1, a mother substrate W shown in FIG. The mother substrate W is, for example, a silicon wafer. On the mother substrate W, a plurality of element substrates 100 are laid out (impositioned) in a matrix, and the organic EL element 40, the sealing layer 50, the color filter layer 60, the peripheral circuit (the data line driving circuit 12, the scanning) described above. The line driving circuit 14, the inspection circuit 16), the inspection terminal 24, the external connection terminal 20, and the wirings 22 and 26 are formed. For example, the mother substrate W has a diameter of about φ25 cm, and the element substrate 100 has a diagonal length of about 14 mm or less. That is, the organic EL device 1 is a small self-luminous display device. The mother substrate W is provided with an orientation flat serving as a design reference when the element substrate 100 is laid out.

  In the manufacturing method of the organic EL device 1 according to the present embodiment, as shown in FIG. 2, first, on the first surface P <b> 1 of the substrate 10, there is a peripheral circuit around the arrangement region E where the organic EL element 40 is provided. (Data line driving circuit 12, scanning line driving circuit 14, inspection circuit 16), inspection terminal 24, external connection terminal 20, and wirings 22 and 26 are formed. That is, the peripheral circuit (the data line driving circuit 12, the scanning line driving circuit 14, and the inspection circuit 16), the inspection terminal 24, and the external connection terminal 20 are formed so as to surround the arrangement region E where the organic EL element 40 is provided. Thereafter, the probe is brought into contact with the inspection terminal 24 to inspect the electrical characteristics of the peripheral circuits (the data line driving circuit 12, the scanning line driving circuit 14, and the inspection circuit 16).

  Next, the reflective layer 32 and the insulating layer 34 are laminated in the arrangement region E where the organic EL element 40 is provided. Thereafter, the insulating film 30 is stacked over the entire substrate 10 and then the insulating film 30 is etched to form openings at positions corresponding to the light emitting pixels 62. Next, the organic EL element 40 is formed by laminating the first electrode 41, the light emitting functional layer 42, and the second electrode 43 in this order. Thereafter, the probe is brought into contact with the inspection terminal 24 to inspect the electrical characteristics of the organic EL element 40.

  Thereafter, the first inorganic sealing layer 51, the organic buffer layer 52, and the second inorganic sealing layer 53 are stacked in this order, and the sealing layer 50 that is a resin layer is placed on each of the element substrates 100 laid out on the mother substrate W. Each is formed so as to cover the arrangement region E, peripheral circuits (the data line driving circuit 12, the scanning line driving circuit 14, and the inspection circuit 16), a part of the wiring 22, the wiring 26, and the inspection terminal 24.

  As described above, the method of forming the color filter layer 60 on the sealing layer 50 is performed by repeating the process of exposing and developing the photosensitive resin layer at least three times corresponding to the B, G, and R filter colors. .

  Then, a resin material constituting the filler 70 is applied to each element substrate 100 on which the color filter layer 60 is formed by a printing method or the like, and the separated sealing substrate 80 is applied to each element substrate 100. The filler 70 is cured by being attached to the substrate 100. As a result, the organic EL device 1 is completed in a state laid out on the mother substrate W.

  Subsequently, as shown in FIGS. 4A and 4B, the mother substrate W is cut along a virtual cutting line SL, and each organic EL device 1 is taken out. As a method for cutting the mother substrate W, a dicing method, a laser cutting method, a streak-in scribing method, or the like can be employed.

  Note that the method of attaching the sealing substrate 80 to the element substrate 100 via the filler 70 is not limited to using the individual sealing substrate 80. For example, a transparent glass substrate having substantially the same shape and size as the mother substrate W is attached to the mother substrate W, and the glass substrate and the mother substrate W are cut to take out the individual organic EL devices 1. Also good.

According to the first embodiment, the following effects can be obtained.
According to the organic EL device 1 and the manufacturing method thereof, the inspection terminal 24 is disposed between the light emitting element arrangement region E and the outer edge of the substrate 10, and the inspection terminal 24 is covered with the sealing layer 50 that is a resin layer. Therefore, due to the influence of unevenness generated on the surface of the substrate 10 due to scratches at the time of inspection, film thickness non-uniformity in a coating process or the like in a subsequent manufacturing process or a defect in the sealing layer 50 for protecting the organic EL element 40 Can be suppressed, and the influence of static electricity or the like entering from the outside via the inspection terminal 24 can be reduced. Therefore, the organic EL device 1 having high reliability quality can be provided or manufactured.
In addition, since the inspection terminal 24 can be covered in the process of forming the sealing layer 50, the organic EL device 1 having high reliability and quality can be provided or manufactured at a low cost without requiring a new process. be able to.

(Second Embodiment)
Next, the configuration of the organic EL device 1a according to the second embodiment will be described with reference to FIG.
FIG. 5 is a schematic cross-sectional view illustrating the configuration of the organic EL device according to the second embodiment, and corresponds to a cross section taken along line AA in FIG.

  The organic EL device 1 a according to the second embodiment is different from the organic EL device 1 according to the first embodiment in the configuration of the resin layer formed on the inspection terminal 24. Accordingly, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 5, the color filter layer 60 is formed on the inspection terminal 24 by laminating the filter layers 60B, 60G, and 60R in this order from the inspection terminal 24 side. The filling material 70 is formed on the arrangement region E of the light emitting pixels 62 and the scanning line driving circuit 14. The color filter layer 60 is formed by the sealing layer 50 and the arrangement region E of the light emitting pixels 62 on which the organic EL elements 40 are formed and the scanning line driving circuit 14 (in the element substrate 100a, the data line driving circuit 12 and the inspection). When the color filter layer 60 is formed, the color filter layer 60 is formed on the inspection terminal 24 at the same time. In the present embodiment, the three color filter layers 60B, 60G, and 60R are formed on the inspection terminal 24. However, the present invention is not limited to this, and the inspection terminal 24 may be covered with at least one filter layer. . The order of the filter layers 60B, 60G, and 60R to be stacked is not limited to this, and the filter layers 60B, 60G, and 60R may be stacked on the inspection terminal 24 in the order of formation in the arrangement region E of the light emitting pixels 62.

  By adopting such a configuration, since the protective film by the color filter layer 60 (filter layers (60B, 60G, 60R)) is formed on the inspection terminal 24, the influence of static electricity from the outside can be reduced, The reliability quality of the organic EL device 1a can be ensured.

(Third embodiment)
Next, the configuration of the organic EL device 1b according to the third embodiment will be described with reference to FIG.
FIG. 6 is a schematic cross-sectional view illustrating the configuration of the organic EL device according to the third embodiment, and corresponds to a cross section taken along line AA in FIG.

  Similar to the organic EL device 1a according to the second embodiment, the organic EL device 1b according to the third embodiment is a resin formed on the inspection terminal 24 with respect to the organic EL device 1 according to the first embodiment. The layer structure is different. Accordingly, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 6, the color filter layer 60 is formed on the inspection terminal 24 by laminating the filter layers 60B, 60G, and 60R in this order from the inspection terminal 24 side. 70 is applied and bonded to the sealing substrate 80. In the manufacturing method of the organic EL device 1a, first, the arrangement region E of the light emitting pixels 62 in which the organic EL elements 40 are formed by the sealing layer 50 and the scanning line driving circuit 14 (in the element substrate 100a, the data line driving circuit 12 and the inspection) When the color filter layer 60 is formed, the color filter layer 60 is formed on the inspection terminal 24 at the same time. Then, after applying the filler 70 to the element substrate 100a, the sealing substrate 80 is pressed against the element substrate 100a, and the filler 70 is expanded to a predetermined range (a range including the inspection terminals 24) and then cured. That is, the inspection terminal 24 is covered with the filler 70 in addition to the color filter layer 60.

  In the present embodiment, the three color filter layers 60B, 60G, and 60R are formed on the inspection terminal 24. However, the present invention is not limited to this, and at least one filter layer may be used. The order of the filter layers 60B, 60G, and 60R to be stacked is not limited to this, and the filter layers 60B, 60G, and 60R may be stacked on the inspection terminal 24 in the order of formation in the arrangement region E of the light emitting pixels 62.

Further, instead of the color filter layer 60 (filter layers (60B, 60G, 60R)), Alq3 (Tris (8-hydroxyquinoline) aluminum) or silicon nitride (Si ₃ N) which is an optical adjustment layer constituting the organic EL element 40 is used. ₄ ), a nitride film such as silicon oxide (SiO ₂ ), titanium oxide (TiO ₂ ), or an oxide film may be used.

  With such a configuration, since the inspection terminal 24 is covered with the color filter layer 60 (filter layers (60B, 60G, 60R)) and the filler 70 on the inspection terminal 24, static electricity from the outside, etc. Can be reduced, and the reliability quality of the organic EL device 1b can be further improved. Moreover, since the filler 70 covers the side surface portion of the sealing layer 50, moisture entering from the side surface portion of the sealing layer 50 can be prevented, and deterioration of the characteristics of the optical element due to the influence of moisture can be prevented. That is, the organic EL device 1b having higher reliability quality can be provided or manufactured.

(Fourth embodiment)
Next, the configuration of the organic EL device 1c according to the fourth embodiment will be described with reference to FIGS. FIG. 7 is a schematic plan view showing the configuration of the organic EL device according to the fourth embodiment. FIG. 8 is a schematic cross-sectional view of the organic EL device shown in FIG.

  The organic EL device 1c according to the fourth embodiment is different from the organic EL device 1 according to the first embodiment in that a resin layer formed on the inspection terminal 24 and a resin layer formed on the organic EL element 40 are provided. The resin layers are separated and have different structures. Accordingly, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 7 and 8, the sealing layer 50 is a second portion that covers the inspection terminal 24 provided between the scanning line driving circuit 14 and the inspection circuit 16 and the outer edge portion of the element substrate 100c. The arrangement area G is separated from the arrangement area E of the light emitting pixels 62, the data line driving circuit 12, the scanning line driving circuit 14, and the inspection area 16. In addition, between the arrangement area F and the arrangement area G, a filler 70 for bonding the sealing substrate 80 is applied and cured.

With such a configuration, the arrangement that is the second part of the sealing layer 50 that covers the inspection terminal 24 with respect to the arrangement region F that is the first part of the sealing layer 50 that covers the organic EL element 40. Since the region G is separated, the moisture that enters through the sealing layer 50 in the arrangement region G facing the outer edge of the element substrate 100 c reaches the arrangement region F of the sealing layer 50 that covers the organic EL element 40. It is possible to prevent the deterioration of the characteristics of the organic EL element 40 due to the influence of moisture.
Here, the second inorganic sealing layer 53 is in contact with the first inorganic sealing layer 51 between the placement region F and the placement region G. Moreover, although the 1st inorganic sealing layer 51 and the 2nd inorganic sealing layer 53 are not formed between the arrangement | positioning area | region F and the arrangement | positioning area | region G, you may make it form, the arrangement | positioning area | region F and an arrangement | positioning area | region. The second inorganic sealing layer 53 may be in contact with the first inorganic sealing layer 51 over the region between G. According to such a configuration, it is not necessary to pattern the first inorganic sealing layer 51 and the second inorganic sealing layer 53 between the placement region F and the placement region G.

  In the present embodiment, the arrangement region G that covers the inspection terminal 24 is formed on the outer edge of the substrate 10 so as to surround three sides excluding the side where the data line driving circuit 12 of the arrangement region F in a substantially rectangular shape in plan view is arranged. However, it may have a frame shape surrounding the four sides of the arrangement area F.

  In addition, the sealing layer 50 formed separately from the placement region G and the placement region F that covers the inspection terminal 24 is only required to have the organic buffer layer 52 separated from the sealing layer 50, and the first inorganic sealing. The layer 51 and the second inorganic sealing layer 53 may be connected to each other.

(Fifth embodiment)
<Electronic equipment>
Next, an electronic apparatus according to an embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic view showing a head mounted display as an example of an electronic apparatus.

  As shown in FIG. 9, a head mounted display (HMD) 1000 as an electronic apparatus according to the present embodiment has two display units 1001 provided corresponding to the left and right eyes. The observer M can see characters and images displayed on the display unit 1001 by wearing the head mounted display 1000 on the head like glasses. For example, if an image in consideration of parallax is displayed on the left and right display units 1001, a stereoscopic video can be viewed and enjoyed.

  The display unit 1001 is mounted with either the organic EL device 1 or the organic EL devices 1a, 1b, and 1c that are the self-luminous display devices of the above-described embodiment. Accordingly, it is possible to provide a lightweight head mounted display 1000 having high reliability quality in the light emitting function.

The head mounted display 1000 is not limited to the configuration in which the observer M directly sees the display content of the display unit 1001, but may be configured to indirectly view the display content by a mirror or the like.
Further, the head mounted display 1000 is not limited to having the two display units 1001, and may be configured to include one display unit 1001 corresponding to either the left or right eye.

  The electronic device on which the organic EL device 1 is mounted is not limited to the head mounted display 1000. For example, an electronic device having a display unit such as a head-up display, an EVF (electronic viewer) of a digital camera, a portable information terminal, or a navigator can be given. Further, the present invention is not limited to the display unit, and the present invention can be applied to an illumination device and an exposure device.

  As described above, the mounting structure, the electro-optical device, and the electronic apparatus of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part has the same function. Any configuration can be substituted. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.

  DESCRIPTION OF SYMBOLS 1,1a, 1b, 1c ... Organic EL apparatus, 10 ... Board | substrate, 12 ... Data line drive circuit, 14 ... Scanning line drive circuit, 16 ... Inspection circuit, 20 ... External connection terminal, 22 ... Wiring, 24 ... Inspection terminal, 26 ... wiring, 30 ... insulating film, 32 ... reflective layer, 34 ... insulating layer, 40 ... organic EL element, 41 ... first electrode, 42 ... light emitting functional layer, 43 ... second electrode, 50 ... sealing layer, 51 ... 1st inorganic sealing layer, 52 ... Organic buffer layer, 53 ... 2nd inorganic sealing layer, 60 ... Color filter layer, 60B, 60G, 60R ... Filter layer, 62, 62B, 62G, 62R ... Luminescent pixel, 70 ... Filler, 80 ... Sealing substrate, 100, 100a, 100b, 100c ... Element substrate, 1000 ... Head mounted display, 1001 ... Display unit.

Claims (18)

A substrate having a first surface;
A light emitting device disposed on the first surface;
An inspection terminal disposed on the first surface between the light emitting element disposition region and the outer edge of the substrate;
A resin layer formed over at least the arrangement region and covering the light emitting element,
The electro-optical device, wherein the resin layer covers the inspection terminal.   The electro-optical device according to claim 1, wherein the resin layer includes a color filter layer.   The electro-optical device according to claim 2, wherein the color filter layer includes at least blue, green, and red filter layers, and the inspection terminal is covered with at least one filter layer.   The electro-optical device according to claim 1, wherein the resin layer includes an organic buffer layer.   The electro-optical device according to claim 4, wherein the organic buffer layer is covered with an inorganic sealing layer.   The electro-optical device according to claim 1, wherein the resin layer includes an optical adjustment layer. The resin layer has a first portion that covers the light emitting element, and a second portion that covers the inspection terminal,
The electro-optical device according to claim 1, wherein the first portion and the second portion are separated from each other.   The electro-optical device according to claim 7, wherein the second portion is provided along an outer edge of the substrate so as to surround the first portion.   The light emitting element includes a first electrode, a second electrode disposed to face the first electrode, and a light emitting functional layer disposed between the first electrode and the second electrode. The electro-optical device according to claim 1.   An electronic apparatus comprising the electro-optical device according to claim 1. A substrate having a first surface;
A light emitting device disposed on the first surface;
An inspection terminal disposed on the first surface between the light emitting element disposition region and an outer edge of the substrate;
After forming the light emitting element on the first surface,
Forming a resin layer covering the light emitting element placement region and the inspection terminal;
A method for manufacturing an electro-optical device.   12. The method of manufacturing an electro-optical device according to claim 11, wherein the step of forming the resin layer includes a step of forming a color filter layer.   13. The electro-optical device according to claim 12, wherein the step of forming the color filter layer forms at least a blue, green, and red filter layer, and covers the inspection terminal with at least one filter layer. Production method.   13. The method of manufacturing an electro-optical device according to claim 11, wherein the step of forming the resin layer includes a step of forming an organic buffer layer.   The method of manufacturing an electro-optical device according to claim 14, wherein the step of forming the resin layer includes a step of forming an inorganic sealing layer that covers the organic buffer layer.   12. The method of manufacturing an electro-optical device according to claim 11, wherein the step of forming the resin layer includes a step of forming an optical adjustment layer.   The step of forming the resin layer is characterized in that a first portion of the resin layer covering the light emitting element and a second portion of the resin layer covering the inspection terminal are formed apart from each other. The method of manufacturing an electro-optical device according to claim 11.   The method of manufacturing an electro-optical device according to claim 17, wherein the second part is formed along an outer edge of the substrate so as to surround the first part.

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