JP2015198217A - Cleaning device and cleaning method of workpiece - Google Patents

Cleaning device and cleaning method of workpiece Download PDF

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Publication number
JP2015198217A
JP2015198217A JP2014076933A JP2014076933A JP2015198217A JP 2015198217 A JP2015198217 A JP 2015198217A JP 2014076933 A JP2014076933 A JP 2014076933A JP 2014076933 A JP2014076933 A JP 2014076933A JP 2015198217 A JP2015198217 A JP 2015198217A
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cleaning
workpiece
water layer
holding table
water
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森 竜彦
Tatsuhiko Mori
竜彦 森
淳 小松
Atsushi Komatsu
淳 小松
正道 片岡
Masamichi Kataoka
正道 片岡
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Disco Corp
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Disco Abrasive Systems Ltd
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Abstract

PROBLEM TO BE SOLVED: To prevent a contamination removed from a workpiece by cleaning from re-adhering to the upper surface of the workpiece.SOLUTION: Water is supplied by a water layer formation nozzle 61 to an upper surface 91 of a workpiece 90 held on a holding table 11, from above the holding table 11 rotating continuously by rotary means 12. A water layer is formed to cover the upper surface 91 of the workpiece 90 entirely, and a mixed fluid of the cleaning liquid and air is jetted from a cleaning nozzle 31 and brought into collision with the water layer formed by the water layer formation nozzle 61, thus destroying the water layer and cleaning the upper surface 91 of the workpiece 90. Readhesion of contamination to the workpiece, due to formation of a water layer, can thereby prevented, and since the water layer is destroyed to expose the upper surface of the workpiece, the upper surface of the workpiece can be cleaned reliably.

Description

本発明は、ワークを洗浄する洗浄装置及び洗浄方法に関する。   The present invention relates to a cleaning apparatus and a cleaning method for cleaning a workpiece.

切削や研削などの加工により発生した屑を除去するために、高圧エアーと洗浄液とを混合した2流体(混合流体)を洗浄ノズルからウェーハなどの円板状のワークの上面に噴射してワークを洗浄する方法が提案されている(例えば、特許文献1、特許文献2参照)。   In order to remove debris generated by machining such as cutting and grinding, two fluids (mixed fluid) mixed with high-pressure air and cleaning liquid are sprayed from the cleaning nozzle onto the upper surface of a disk-shaped workpiece such as a wafer. A cleaning method has been proposed (see, for example, Patent Document 1 and Patent Document 2).

特開2011−200785号公報JP 2011-200785 A 特開2008−80180号公報JP 2008-80180 A

しかし、混合流体に含まれる洗浄液の量は比較的少ないため、洗浄液が水玉となってワークの上面に付着する場合がある。特に、ワークの外周部分を洗浄する場合は、洗浄中にワークを回転させることによって発生する遠心力により、洗浄液がワークの外側に向かうため、ワークの中央部分には洗浄液が存在せず、ワークの上面が露出している。混合流体に含まれる洗浄液の一部は、洗浄によりワークから除去した屑を含んで霧状に飛散するため、霧状に飛散して浮遊する洗浄液がワークの中央部分に水玉となって付着すると、洗浄液に含まれる屑がワークの上面に再付着する場合がある。   However, since the amount of the cleaning liquid contained in the mixed fluid is relatively small, the cleaning liquid may become polka dots and adhere to the upper surface of the workpiece. In particular, when cleaning the outer periphery of the workpiece, the cleaning liquid is directed to the outside of the workpiece due to the centrifugal force generated by rotating the workpiece during cleaning. The top surface is exposed. A part of the cleaning liquid contained in the mixed fluid scatters in a mist shape including the debris removed from the work by cleaning. In some cases, debris contained in the cleaning liquid may adhere to the upper surface of the workpiece.

本発明は、このような問題にかんがみなされたもので、洗浄によりワークから除去した屑がワークの上面に再付着するのを防ぐことを目的とする。   The present invention has been considered in view of such a problem, and an object of the present invention is to prevent debris removed from a workpiece by cleaning from reattaching to the upper surface of the workpiece.

第一の発明は、円板状ワークを保持する保持テーブルと、該保持テーブルを連続回転させる回転手段と、該保持テーブルに保持された該ワークの上面に洗浄水と気体とを混合させた混合流体を噴射して該ワークの上面を洗浄する洗浄ノズルと、該洗浄ノズルを該保持テーブルの径方向に移動させる移動手段と、を備えた洗浄装置であって、該回転手段が連続回転させている該保持テーブルに保持された円板状ワークの上方から、該円板状ワークの該上面に水を供給し、該ワークの該上面の全面を覆う水層を形成する水層形成ノズルを備え、該水層形成ノズルによって形成された該水層に、該洗浄ノズルから噴射される混合流体を衝突させ、該水層を破壊して該ワークの該上面を洗浄する。   The first invention is a holding table for holding a disk-shaped workpiece, a rotating means for continuously rotating the holding table, and a mixture in which cleaning water and gas are mixed on the upper surface of the workpiece held on the holding table. A cleaning apparatus comprising: a cleaning nozzle that jets a fluid to clean the upper surface of the workpiece; and a moving unit that moves the cleaning nozzle in the radial direction of the holding table, wherein the rotating unit continuously rotates. A water layer forming nozzle for supplying water to the upper surface of the disk-shaped workpiece from above the disk-shaped workpiece held on the holding table and forming a water layer covering the entire upper surface of the workpiece; The mixed fluid ejected from the cleaning nozzle is made to collide with the aqueous layer formed by the aqueous layer forming nozzle, and the upper surface of the workpiece is cleaned by destroying the aqueous layer.

前記洗浄装置において、前記水層形成ノズルは、前記保持テーブルに保持される円板状ワークの上面に平行に一列に並べて配設された複数の供給口を備え、該複数の供給口が配設された長さは、前記回転手段が回転させる該保持テーブルに保持される円板状ワークの最外径の半径よりも長いことが好ましい。   In the cleaning apparatus, the water layer forming nozzle includes a plurality of supply ports arranged in a line in parallel with the upper surface of the disk-shaped workpiece held by the holding table, and the plurality of supply ports are arranged. It is preferable that the length made is longer than the radius of the outermost diameter of the disk-shaped workpiece | work hold | maintained at this holding table which the said rotation means rotates.

第二の発明は、前記洗浄装置を用いてワークを洗浄するワークの洗浄方法であって、前記水層形成ノズルによって、前記保持テーブルに保持された円板状ワークの前記上面の全面に前記水層を形成する水層形成工程と、前記水層形成工程で該水層を形成しながら、前記洗浄ノズルによって該上面に前記混合流体を噴射し、前記移動手段によって該洗浄ノズルを円板状ワークの該上面に平行に移動させ、該ワークの該上面を洗浄する洗浄工程と、
から構成される。
A second invention is a workpiece cleaning method for cleaning a workpiece using the cleaning device, wherein the water layer forming nozzle is used to apply the water to the entire upper surface of the disk-shaped workpiece held on the holding table. An aqueous layer forming step of forming a layer; and while forming the aqueous layer in the aqueous layer forming step, the mixed fluid is jetted onto the upper surface by the cleaning nozzle, and the cleaning nozzle is moved to a disk-shaped workpiece by the moving means A cleaning step of moving the upper surface of the workpiece in parallel with the upper surface of the workpiece;
Consists of

前記水層形成ノズルは、前記保持テーブルに保持される前記ワークの前記上面に平行に一列に並べて配設された複数の供給口を備え、該複数の供給口が配設された長さは、前記回転手段によって回転する該保持テーブルに保持される該ワークの最外径の半径よりも長いことが好ましい。   The water layer forming nozzle includes a plurality of supply ports arranged in a line in parallel with the upper surface of the work held by the holding table, and the length of the plurality of supply ports arranged is: It is preferable that the radius is longer than the outermost radius of the work held by the holding table rotated by the rotating means.

第二の発明は、上記洗浄装置を用いてワークを洗浄するワークの洗浄方法であって、前記水層形成ノズルによって、前記保持テーブルに保持された該ワークの前記上面の全面に前記水層を形成する水層形成工程と、前記水層形成工程で該水層を形成しながら、前記洗浄ノズルによって該ワークの該上面に前記混合流体を噴射し、前記移動手段によって該洗浄ノズルを該ワークの該上面に平行に移動させ、該ワークの該上面を洗浄する洗浄工程と、を備える。   A second invention is a work cleaning method for cleaning a work using the cleaning device, wherein the water layer is formed on the entire upper surface of the work held on the holding table by the water layer forming nozzle. Forming a water layer in the water layer forming step, and jetting the mixed fluid onto the upper surface of the workpiece by the cleaning nozzle, and moving the cleaning nozzle to the workpiece by the moving means. And a cleaning step of cleaning the upper surface of the workpiece by moving the upper surface of the workpiece in parallel.

本発明に係る洗浄装置及び洗浄方法によれば、水層形成ノズルから供給される水によってワークの上面全面に水層が形成されるので、洗浄により除去されたコンタミがワークに再付着するのを防ぐことができる。一方、洗浄ノズルによって洗浄される部分では、混合流体との衝突により水層が破壊されてワークの上面が露出するので、ワークの上面を確実に洗浄することができる。   According to the cleaning apparatus and the cleaning method of the present invention, the water layer is formed on the entire upper surface of the work by the water supplied from the water layer forming nozzle, so that the contamination removed by the cleaning is reattached to the work. Can be prevented. On the other hand, in the portion to be cleaned by the cleaning nozzle, the water layer is destroyed by collision with the mixed fluid and the upper surface of the workpiece is exposed, so that the upper surface of the workpiece can be reliably cleaned.

複数の供給口を、ワークの半径よりも長く一列に配置すれば、ワークの中央部分から外周部分に至る全体に水層を均一に形成することができ、洗浄により除去されたゴミがワークに再付着するのを確実に防ぐことができる。   If a plurality of supply ports are arranged in a line longer than the radius of the workpiece, a water layer can be uniformly formed from the center portion to the outer peripheral portion of the workpiece, and the dust removed by the cleaning is reapplied to the workpiece. It can be surely prevented from adhering.

洗浄装置を示す斜視図。The perspective view which shows a washing | cleaning apparatus. 洗浄装置を示す正面図及び平面図。The front view and top view which show a washing | cleaning apparatus. 別の洗浄装置を示す斜視図。The perspective view which shows another washing | cleaning apparatus. 別の洗浄装置を示す正面図及び平面図。The front view and top view which show another washing | cleaning apparatus.

図1に示す洗浄装置10は、切削装置や研削装置などの加工装置に組み込まれるか、または、単独の装置として使用されるもので、加工されたウェーハなどの円板状のワーク90を洗浄して、ワーク90の上面91に付着した切削屑や研削屑などのコンタミを除去する装置である。この洗浄装置10は、XY平面に平行にワーク90を保持する保持テーブル11と、XY平面に垂直な±Z方向に平行な回転軸29を中心として保持テーブル11を連続回転させる回転手段12と、保持テーブル11に保持されたワーク90の上面91を洗浄する洗浄手段13と、±Z方向に平行に洗浄手段13を移動させる昇降手段14と、±Y方向に洗浄手段13及び昇降手段14を移動させる移動手段15と、ワーク90の上面91に水層を形成する水層形成手段16と、ワーク90の搬出入時に水層形成手段16を退避させる退避手段17とを備えている。   A cleaning apparatus 10 shown in FIG. 1 is incorporated in a processing apparatus such as a cutting apparatus or a grinding apparatus or used as a single apparatus, and cleans a disk-shaped workpiece 90 such as a processed wafer. Thus, it is a device that removes contaminants such as cutting waste and grinding waste adhering to the upper surface 91 of the workpiece 90. The cleaning apparatus 10 includes a holding table 11 that holds a workpiece 90 parallel to the XY plane, a rotating unit 12 that continuously rotates the holding table 11 around a rotation axis 29 that is parallel to the ± Z direction perpendicular to the XY plane, Cleaning means 13 for cleaning the upper surface 91 of the workpiece 90 held on the holding table 11, lifting / lowering means 14 for moving the cleaning means 13 parallel to the ± Z direction, and moving the cleaning means 13 and the lifting / lowering means 14 in the ± Y direction The moving means 15 for moving, the water layer forming means 16 for forming a water layer on the upper surface 91 of the work 90, and the retracting means 17 for retracting the water layer forming means 16 when the work 90 is carried in and out.

保持テーブル11は、XY平面に平行な保持面に載置されたワーク90を吸引保持する。ワーク90を保持した保持テーブル11を回転手段12が回転させることにより、保持テーブル11とともに、ワーク90が回転軸29を中心として回転する。   The holding table 11 sucks and holds the workpiece 90 placed on a holding surface parallel to the XY plane. When the rotating means 12 rotates the holding table 11 holding the workpiece 90, the workpiece 90 rotates about the rotation axis 29 together with the holding table 11.

洗浄手段13は、図示しないエアー供給源に接続されるエアー取入口32と、図示しない洗浄水供給源に接続される洗浄水取入口33と、エアー取入口32から取り入れたエアーなどの気体と洗浄水取入口33から取り入れた純水などの洗浄水とを混合した混合流体を下方(−Z方向)に噴射する洗浄ノズル31と、YZ平面に垂直な±X方向に延びる棒状の支持部34とを備えている。   The cleaning means 13 includes an air intake 32 connected to an air supply source (not shown), a cleaning water intake 33 connected to a cleaning water supply source (not shown), and a gas such as air taken from the air intake 32 and cleaning. A cleaning nozzle 31 for injecting a mixed fluid mixed with cleaning water such as pure water taken from the water intake port 33 downward (−Z direction), and a rod-shaped support portion 34 extending in the ± X direction perpendicular to the YZ plane, It has.

昇降手段14は、±Z方向に平行なねじ軸41をモータ42が回転させることにより、ねじ軸41に係合した移動部43がガイド44に案内されて±Z方向に移動する構成となっている。支持部34の一端は、移動部43に固定され、移動部43の移動に伴って、洗浄手段13全体が±Z方向に移動する。昇降手段14が洗浄手段13を−Z方向に移動させると、洗浄手段13は、保持テーブル11に保持されたワーク90の上面91に近づき、逆に、昇降手段14が洗浄手段13を+Z方向に移動させると、洗浄手段13は、保持テーブル11に保持されたワーク90の上面91から遠ざかる。   The elevating means 14 is configured such that when the motor 42 rotates the screw shaft 41 parallel to the ± Z direction, the moving portion 43 engaged with the screw shaft 41 is guided by the guide 44 and moved in the ± Z direction. Yes. One end of the support part 34 is fixed to the moving part 43, and the entire cleaning means 13 moves in the ± Z direction as the moving part 43 moves. When the lifting / lowering means 14 moves the cleaning means 13 in the −Z direction, the cleaning means 13 approaches the upper surface 91 of the work 90 held on the holding table 11, and conversely, the lifting / lowering means 14 moves the cleaning means 13 in the + Z direction. When moved, the cleaning means 13 moves away from the upper surface 91 of the work 90 held on the holding table 11.

移動手段15は、例えばボールねじ機構を備え、昇降手段14を±Y方向に移動させることができる。昇降手段14の±Y方向の移動にともなって、洗浄手段13も±Y方向に移動する。移動手段15が昇降手段14及び洗浄手段13を−Y方向に移動させると、洗浄ノズル31は、回転軸29に近づき、逆に、移動手段15が昇降手段14及び洗浄手段13を+Y方向に移動させると、洗浄ノズル31は、回転軸29から遠ざかる。すなわち、洗浄ノズル31は、保持テーブル11の径方向に移動する。   The moving means 15 includes, for example, a ball screw mechanism, and can move the elevating means 14 in the ± Y directions. As the lifting / lowering means 14 moves in the ± Y direction, the cleaning means 13 also moves in the ± Y direction. When the moving means 15 moves the elevating means 14 and the cleaning means 13 in the −Y direction, the cleaning nozzle 31 approaches the rotating shaft 29, and conversely, the moving means 15 moves the elevating means 14 and the cleaning means 13 in the + Y direction. As a result, the cleaning nozzle 31 moves away from the rotating shaft 29. That is, the cleaning nozzle 31 moves in the radial direction of the holding table 11.

水層形成手段16は、図示しない洗浄水供給源に接続される取入口62と、取入口62から取り入れた純水などの洗浄水をワーク90の上面91に供給する水層形成ノズル61とを備えている。水層形成ノズル61は、保持テーブル11の上方(+Z方向側)に配置され、±X方向に長い箱型形状に形成され、その下面には複数の供給口63が±X方向に平行に一列に並べて形成されている。水層形成ノズル61の長さは、保持テーブル11の半径よりも長く、最も先端(−X)側の供給口63は、回転軸29付近に位置し、最も根元(+X)側の供給口63は、保持テーブル11に保持されるワーク90の外周よりも外側に位置している。すなわち、複数の供給口63が配設されている部分の長さは、ワーク90の最外径の半径よりも長い。回転手段12が回転させている保持テーブル11に保持されたワーク90の上面91に、一列に並んだ複数の供給口63から水を供給することができる。   The water layer forming means 16 includes an intake port 62 connected to a cleaning water supply source (not shown), and a water layer forming nozzle 61 that supplies cleaning water such as pure water taken from the intake port 62 to the upper surface 91 of the workpiece 90. I have. The water layer forming nozzle 61 is arranged above the holding table 11 (on the + Z direction side), is formed in a box shape that is long in the ± X direction, and a plurality of supply ports 63 are arranged in a row in parallel on the lower surface thereof in the ± X direction. It is formed side by side. The length of the water layer forming nozzle 61 is longer than the radius of the holding table 11, the supply port 63 on the most distal end (−X) side is located in the vicinity of the rotation shaft 29, and the supply port 63 on the most proximal (+ X) side. Is positioned outside the outer periphery of the workpiece 90 held by the holding table 11. That is, the length of the portion where the plurality of supply ports 63 are disposed is longer than the radius of the outermost diameter of the workpiece 90. Water can be supplied from a plurality of supply ports 63 arranged in a line to the upper surface 91 of the work 90 held by the holding table 11 rotated by the rotating means 12.

退避手段17は、±Z方向に平行に延びる棒状の支持部72と、支持部72から−X方向に平行に延びる棒状に形成され水層形成手段16を支持する腕部71と、±Z方向に平行な回動軸79を中心として支持部72を回転させるノズル旋回部73とを備えている。   The retracting means 17 includes a rod-like support portion 72 extending in parallel with the ± Z direction, an arm portion 71 formed in a rod shape extending in parallel to the −X direction from the support portion 72 and supporting the water layer forming means 16, and the ± Z direction. And a nozzle turning portion 73 that rotates the support portion 72 around a rotation shaft 79 parallel to the rotation shaft 79.

保持テーブル11にワーク90を載置する搬入時や、洗浄が終わったワーク90を保持テーブル11から搬出する搬出時に、ノズル旋回部73が支持部72を回転させることにより、腕部71及びそれに支持された水層形成手段16がXY平面に平行に回動し、水層形成手段16を保持テーブル11の上方から退避させることができる。   When carrying the workpiece 90 on the holding table 11 or carrying it out of the holding table 11, the nozzle turning unit 73 rotates the support portion 72 to support the arm portion 71 and the arm portion 71. The formed water layer forming means 16 rotates in parallel with the XY plane, and the water layer forming means 16 can be retracted from above the holding table 11.

次に、洗浄装置10を用いてワーク90を洗浄する洗浄方法について説明する。   Next, a cleaning method for cleaning the workpiece 90 using the cleaning apparatus 10 will be described.

(1)保持工程
保持工程では、まず、図2において二点鎖線で示したように、移動手段15が洗浄手段13を+Y方向に移動させ、退避手段17が水層形成手段16を回動させて、洗浄手段13及び水層形成手段16を保持テーブル11の上方から退避させる。次に、搬入手段(不図示)がワーク90を搬送して、保持テーブル11に載置し、載置されたワーク90を保持テーブル11が吸引保持する。保持テーブル11は、ワーク90の洗浄が終わるまで、ワーク90を保持した状態を保つ。
(1) Holding Step In the holding step, first, as indicated by a two-dot chain line in FIG. 2, the moving unit 15 moves the cleaning unit 13 in the + Y direction, and the retracting unit 17 rotates the water layer forming unit 16. Then, the cleaning means 13 and the water layer forming means 16 are retracted from above the holding table 11. Next, carry-in means (not shown) conveys the work 90 and places it on the holding table 11, and the holding table 11 sucks and holds the placed work 90. The holding table 11 keeps the work 90 held until the work 90 is cleaned.

(2)水層形成工程
水層形成工程では、図2に示すように、回転手段12が保持テーブル11を連続して回転させるとともに、退避手段17が水層形成手段16を回動させて、回転している保持テーブル11に保持されたワーク90の上方に水層形成手段16を位置付ける。そして、回転している保持テーブル11に保持されたワーク90の上面91に、水層形成手段16が水を供給し、ワーク90の中心部分から外周部分に至る上面91の全面を覆う水層を形成する。水層形成手段16が供給する水の量は、例えば1分当たり0.7リットルである。
(2) Water layer forming step In the water layer forming step, as shown in FIG. 2, the rotating means 12 continuously rotates the holding table 11, and the retracting means 17 rotates the water layer forming means 16, The water layer forming means 16 is positioned above the workpiece 90 held by the rotating holding table 11. And the water layer formation means 16 supplies water to the upper surface 91 of the workpiece | work 90 hold | maintained at the holding table 11 which is rotating, and the water layer which covers the whole surface of the upper surface 91 from the center part of the workpiece | work 90 to an outer peripheral part is formed. Form. The amount of water supplied by the water layer forming means 16 is, for example, 0.7 liter per minute.

(3)洗浄工程
洗浄工程は、水層形成工程と並行して実行される。移動手段15が洗浄手段13をワーク90の上面91に平行な−Y方向に移動させて、回転しているワーク90の上方に洗浄手段13を位置付け、ワーク90の上面91に洗浄ノズル31が混合流体を噴射する。エアー供給源82から洗浄手段13に供給されるエアーの量は、例えば1分当たり50リットルである。洗浄水供給源83から洗浄手段13に供給される洗浄水の量は、例えば1分当たり0.2リットルである。このように、洗浄手段13が噴射する混合流体に含まれる洗浄水の量は、気体の量に比べて非常に少ない。
(3) Cleaning process The cleaning process is executed in parallel with the water layer forming process. The moving unit 15 moves the cleaning unit 13 in the −Y direction parallel to the upper surface 91 of the workpiece 90, positions the cleaning unit 13 above the rotating workpiece 90, and the cleaning nozzle 31 mixes with the upper surface 91 of the workpiece 90. Inject fluid. The amount of air supplied from the air supply source 82 to the cleaning means 13 is, for example, 50 liters per minute. The amount of cleaning water supplied from the cleaning water supply source 83 to the cleaning means 13 is, for example, 0.2 liter per minute. Thus, the amount of cleaning water contained in the mixed fluid ejected by the cleaning means 13 is very small compared to the amount of gas.

噴射された混合流体は、ワーク90の上面91に形成されている水層に衝突し、衝突した部分の水層をエアーによって吹き飛ばす。これにより、その部分だけ水層が破壊され、ワーク90の上面91が露出する。露出したワーク90の上面91に混合流体が当たることにより、ワーク90の上面91が洗浄される。   The jetted mixed fluid collides with the water layer formed on the upper surface 91 of the workpiece 90, and blows off the collided water layer with air. Thereby, the water layer is destroyed only in that portion, and the upper surface 91 of the workpiece 90 is exposed. When the mixed fluid hits the exposed upper surface 91 of the workpiece 90, the upper surface 91 of the workpiece 90 is cleaned.

ワーク90の上面91を洗浄した混合流体に含まれる洗浄水の一部は、洗浄によりワーク90の上面91から除去したコンタミを含む状態で、霧状になって飛散する。しかし、ワーク90の上面91全面が水層で覆われているので、飛散した洗浄水は、ワーク90の上面91に水玉となって付着することなく、水層と合流して流れ去る。これにより、飛散した洗浄水に含まれるコンタミがワーク90の上面91に再付着するのを防ぐことができる。   A part of the cleaning water contained in the mixed fluid that has cleaned the upper surface 91 of the work 90 scatters in a mist state in a state including the contamination removed from the upper surface 91 of the work 90 by the cleaning. However, since the entire upper surface 91 of the work 90 is covered with the water layer, the scattered cleaning water flows together with the water layer without adhering to the upper surface 91 of the work 90 as polka dots. Thereby, it is possible to prevent contamination contained in the scattered cleaning water from reattaching to the upper surface 91 of the workpiece 90.

回転手段12が保持テーブル11を回転させ、移動手段15が洗浄手段13を±Y方向に移動させながら洗浄することにより、ワーク90の上面91全面が洗浄される。
また、例えば外周部分のエッジトリミング加工をしたワーク90を洗浄する場合には、移動手段15が洗浄手段13をワーク90の外周部分に位置付けている時間を長くすれば、ワーク90の外周部分を重点的に洗浄することができる。移動手段15が洗浄手段13をワーク90の外周部分に位置付けて洗浄している間であっても、水層形成手段16によって形成された水層が、ワーク90の中央付近を含む上面91全面を覆っているので、飛散した洗浄水に含まれるコンタミが、混合流体の当たらないワーク90の中央部分に再付着するのを防ぐことができる。
The rotating means 12 rotates the holding table 11 and the moving means 15 performs cleaning while moving the cleaning means 13 in the ± Y directions, whereby the entire upper surface 91 of the workpiece 90 is cleaned.
Further, for example, when cleaning the workpiece 90 that has been subjected to the edge trimming process on the outer peripheral portion, if the time during which the moving means 15 positions the cleaning means 13 on the outer peripheral portion of the work 90 is lengthened, the outer peripheral portion of the workpiece 90 is emphasized. Can be cleaned. Even while the moving unit 15 positions the cleaning unit 13 on the outer peripheral portion of the workpiece 90 and cleans it, the water layer formed by the water layer forming unit 16 covers the entire upper surface 91 including the vicinity of the center of the workpiece 90. Since it covers, the contamination contained in the scattered washing water can be prevented from reattaching to the central portion of the workpiece 90 where the mixed fluid does not contact.

水層形成手段16が供給する水の量が少なすぎると、ワーク90の上面91全面を水層で覆うことができず、コンタミの再付着を防ぐことができない。逆に、水層形成手段16が供給する水の量が多すぎると、水層が厚くなり、洗浄手段13が噴射した混合流体で水層を破壊できなくなるので、ワーク90を洗浄することができない。このため、水層形成手段16が供給する水の量は、1分当たり0.5リットル以上1.0リットル以下であることが好ましく、1分当たり0.7リットル程度が最も望ましい。   If the amount of water supplied by the water layer forming means 16 is too small, the entire upper surface 91 of the workpiece 90 cannot be covered with the water layer, and contamination reattachment cannot be prevented. Conversely, if the amount of water supplied by the water layer forming means 16 is too large, the water layer becomes thick and the water layer cannot be destroyed by the mixed fluid ejected by the cleaning means 13, so that the workpiece 90 cannot be cleaned. . For this reason, the amount of water supplied by the water layer forming means 16 is preferably 0.5 liter to 1.0 liter per minute, and most preferably about 0.7 liter per minute.

図3に示す洗浄装置10Aは、図1で説明した洗浄装置10の水層形成手段16に代えて、水層形成手段16Aを備えている。それ以外の点は、洗浄装置10と同様である。   A cleaning apparatus 10A shown in FIG. 3 includes an aqueous layer forming means 16A instead of the aqueous layer forming means 16 of the cleaning apparatus 10 described in FIG. The other points are the same as the cleaning device 10.

水層形成手段16Aは、図示しない洗浄水供給源に接続される取入口62と、取入口62から取り入れた洗浄水をワーク90の上面91に供給する水層形成ノズル61Aとを備えている。水層形成ノズル61Aは、直線状に水を供給するのではなく、回転軸29付近に点状に水を供給する点が、水層形成手段16の水層形成ノズル61と異なっている。   The water layer forming means 16 </ b> A includes an intake port 62 connected to a cleaning water supply source (not shown) and a water layer forming nozzle 61 </ b> A that supplies cleaning water taken from the intake port 62 to the upper surface 91 of the workpiece 90. The water layer forming nozzle 61 </ b> A is different from the water layer forming nozzle 61 of the water layer forming means 16 in that it does not supply water linearly but supplies water in the vicinity of the rotating shaft 29.

洗浄装置10Aを用いてワーク90を洗浄する洗浄方法は、基本的に洗浄装置10を用いる場合と同様である。すなわち、図4に示すように、水層形成工程において、回転手段12が保持テーブル11を回転させながら、保持テーブル11に保持されたワーク90の上面91に水層形成手段16が水を供給すると、回転軸29付近に供給された水は、遠心力によって外側に広がる。このため、水層形成手段16から水が直接供給されるワーク90の中心付近だけでなく、水層形成手段16から水が直接供給されないワーク90の外周付近にも、水層を形成することができる。   A cleaning method for cleaning the workpiece 90 using the cleaning apparatus 10A is basically the same as that when the cleaning apparatus 10 is used. That is, as shown in FIG. 4, when the water layer forming unit 16 supplies water to the upper surface 91 of the work 90 held by the holding table 11 while the rotating unit 12 rotates the holding table 11 in the water layer forming step. The water supplied near the rotating shaft 29 spreads outward by centrifugal force. For this reason, it is possible to form a water layer not only near the center of the work 90 to which water is directly supplied from the water layer forming means 16 but also near the outer periphery of the work 90 to which water is not directly supplied from the water layer forming means 16. it can.

なお、水層形成手段16が水を供給する位置は、水層形成手段16から供給される水によってワーク90の中心部分を含む上面91全面を覆う水層を形成できる位置であればよく、図4に示したように回転軸29から少し離れた位置であってもよい。水層形成手段16が水を供給する位置を回転軸29上に配置する場合は、洗浄手段13がワーク90の中央部分を洗浄するとき、退避手段17が水層形成手段16を回動させて、水層形成手段16が水を供給する位置を回転軸29上から少しずらすことにより、洗浄手段13と水層形成手段16とが干渉するのを防ぐ構成であってもよい。   The position where the water layer forming unit 16 supplies water may be a position where the water layer covering the entire upper surface 91 including the central portion of the workpiece 90 can be formed by the water supplied from the water layer forming unit 16. As shown in FIG. 4, the position may be a little away from the rotating shaft 29. In the case where the position where the water layer forming unit 16 supplies water is arranged on the rotation shaft 29, when the cleaning unit 13 cleans the central portion of the workpiece 90, the retracting unit 17 rotates the water layer forming unit 16. The water layer forming unit 16 may be configured to prevent the cleaning unit 13 and the water layer forming unit 16 from interfering with each other by slightly shifting the position where the water is supplied from the rotation shaft 29.

また、移動手段は、洗浄ノズルを平行移動させるのではなく、回動させる構成であってもよく、退避手段は、水層形成手段を回動させるのではなく、平行移動させて退避させる構成であってもよい。   In addition, the moving means may be configured to rotate the cleaning nozzle instead of moving it in parallel, and the retracting means is configured not to rotate the water layer forming means but to retract by moving in parallel. There may be.

10,10A 洗浄装置、
11 保持テーブル、12 回転手段、29 回転軸、
13 洗浄手段、31 洗浄ノズル、32 エアー取入口、33 洗浄水取入口、
34 支持部、
14 昇降手段、41 ねじ軸、42 モータ、43 移動部、44 ガイド、
15 移動手段、16,16A 水層形成手段、
61,61A 水層形成ノズル、62 取入口、63 供給口、
17 退避手段、71 腕部、72 支持部、73 ノズル旋回部、79 回動軸、
82 エアー供給源、83 洗浄水供給源、
90 ワーク、91 上面
10, 10A cleaning device,
11 holding table, 12 rotating means, 29 rotating shaft,
13 Cleaning means, 31 Cleaning nozzle, 32 Air intake port, 33 Cleaning water intake port,
34 support part,
14 Lifting means, 41 Screw shaft, 42 Motor, 43 Moving part, 44 Guide,
15 moving means, 16, 16A water layer forming means,
61, 61A water layer forming nozzle, 62 intake port, 63 supply port,
17 retraction means, 71 arm part, 72 support part, 73 nozzle turning part, 79 rotating shaft,
82 Air supply source, 83 Wash water supply source,
90 work, 91 top surface

Claims (3)

円板状ワークを保持する保持テーブルと、
該保持テーブルを連続回転させる回転手段と、
該保持テーブルに保持された該ワークの上面に洗浄水と気体とを混合させた混合流体を噴射して該ワークの上面を洗浄する洗浄ノズルと、
該洗浄ノズルを該保持テーブルの径方向に移動させる移動手段と、
を備えた洗浄装置であって、
該回転手段が連続回転させている該保持テーブルに保持された円板状ワークの上方から、該円板状ワークの該上面に水を供給し、該ワークの該上面の全面を覆う水層を形成する水層形成ノズルを備え、
該水層形成ノズルによって形成された該水層に、該洗浄ノズルから噴射される混合流体を衝突させ、該水層を破壊して該ワークの該上面を洗浄する、洗浄装置。
A holding table for holding a disk-shaped workpiece;
Rotating means for continuously rotating the holding table;
A cleaning nozzle for cleaning the upper surface of the workpiece by spraying a mixed fluid obtained by mixing cleaning water and gas on the upper surface of the workpiece held by the holding table;
Moving means for moving the cleaning nozzle in the radial direction of the holding table;
A cleaning device comprising:
Water is supplied to the upper surface of the disc-shaped workpiece from above the disc-shaped workpiece held by the holding table that is continuously rotated by the rotating means, and a water layer covering the entire upper surface of the workpiece is formed. It has a water layer forming nozzle to form,
A cleaning apparatus that causes the mixed fluid ejected from the cleaning nozzle to collide with the water layer formed by the water layer forming nozzle, destroys the water layer, and cleans the upper surface of the workpiece.
前記水層形成ノズルは、前記保持テーブルに保持される円板状ワークの上面に平行に一列に並べて配設された複数の供給口を備え、該複数の供給口が配設された長さは、前記回転手段が回転させる該保持テーブルに保持される円板状ワークの最外径の半径よりも長い、請求項1に記載の洗浄装置。   The water layer forming nozzle includes a plurality of supply ports arranged in a row in parallel with the upper surface of the disk-shaped workpiece held by the holding table, and the length of the plurality of supply ports arranged is The cleaning apparatus according to claim 1, wherein the cleaning device is longer than a radius of an outermost diameter of the disk-shaped workpiece held by the holding table rotated by the rotating means. 請求項1または2に記載の洗浄装置を用いてワークを洗浄するワークの洗浄方法であって、
前記水層形成ノズルによって、前記保持テーブルに保持された円板状ワークの前記上面の全面に前記水層を形成する水層形成工程と、
前記水層形成工程で該水層を形成しながら、前記洗浄ノズルによって該上面に前記混合流体を噴射し、前記移動手段によって該洗浄ノズルを円板状ワークの該上面に平行に移動させ、該ワークの該上面を洗浄する洗浄工程と、
を備える、ワークの洗浄方法。
A workpiece cleaning method for cleaning a workpiece using the cleaning device according to claim 1 or 2,
An aqueous layer forming step of forming the aqueous layer on the entire upper surface of the disc-shaped workpiece held on the holding table by the aqueous layer forming nozzle;
While forming the aqueous layer in the aqueous layer forming step, the mixed fluid is sprayed onto the upper surface by the cleaning nozzle, and the cleaning nozzle is moved in parallel to the upper surface of the disk-shaped workpiece by the moving means, A cleaning step of cleaning the upper surface of the workpiece;
A method for cleaning a workpiece.
JP2014076933A 2014-04-03 2014-04-03 Cleaning device and cleaning method of workpiece Pending JP2015198217A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209087A (en) * 2001-11-02 2003-07-25 Dainippon Screen Mfg Co Ltd Substrate treatment device
JP2007173621A (en) * 2005-12-22 2007-07-05 Sharp Corp Method for coating liquid membrane material to substrate
JP2012190868A (en) * 2011-03-09 2012-10-04 Tokyo Electron Ltd Two-fluid nozzle, substrate liquid processing device, substrate liquid processing method, and computer readable recording medium, in which substrate liquid processing program is recorded
JP2012216777A (en) * 2011-03-28 2012-11-08 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus and substrate treatment method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003209087A (en) * 2001-11-02 2003-07-25 Dainippon Screen Mfg Co Ltd Substrate treatment device
JP2007173621A (en) * 2005-12-22 2007-07-05 Sharp Corp Method for coating liquid membrane material to substrate
JP2012190868A (en) * 2011-03-09 2012-10-04 Tokyo Electron Ltd Two-fluid nozzle, substrate liquid processing device, substrate liquid processing method, and computer readable recording medium, in which substrate liquid processing program is recorded
JP2012216777A (en) * 2011-03-28 2012-11-08 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus and substrate treatment method

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