JP2015191897A5 - - Google Patents
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- JP2015191897A5 JP2015191897A5 JP2014065621A JP2014065621A JP2015191897A5 JP 2015191897 A5 JP2015191897 A5 JP 2015191897A5 JP 2014065621 A JP2014065621 A JP 2014065621A JP 2014065621 A JP2014065621 A JP 2014065621A JP 2015191897 A5 JP2015191897 A5 JP 2015191897A5
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- 239000007788 liquid Substances 0.000 claims description 93
- 238000004140 cleaning Methods 0.000 claims description 83
- 239000000758 substrate Substances 0.000 claims description 29
- 239000011261 inert gas Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
本発明は、基板に処理を行う基板処理システムおよび配管を洗浄する配管洗浄方法に関する。 The present invention relates to a substrate processing system for processing a substrate and a piping cleaning method for cleaning piping.
半導体ウエハ等の基板に種々の処理を行うために基板処理装置が用いられている。例えば、特許文献１に記載された基板処理装置は、処理液で基板を処理する複数の処理ユニットと、これらの処理ユニットに処理液を供給する処理液供給部とを含む。処理液供給部は、複数の処理液供給モジュールを含む。基板の処理時には、複数の処理液供給モジュールのいずれかから配管を通して各処理ユニットのノズルに処理液が供給される。ノズルから処理液が基板に吐出される。 2. Description of the Related Art A substrate processing apparatus is used to perform various processes on a substrate such as a semiconductor wafer. For example, the substrate processing apparatus described in Patent Document 1 includes a plurality of processing units that process a substrate with a processing liquid, and a processing liquid supply unit that supplies the processing liquid to these processing units. The processing liquid supply unit includes a plurality of processing liquid supply modules. When processing the substrate, the processing liquid is supplied from one of the plurality of processing liquid supply modules to the nozzle of each processing unit through the piping. A processing liquid is discharged from the nozzle onto the substrate.
このような基板処理装置を工場等に設置した場合には、基板処理装置の稼動前に、配管およびノズル等の内部に存在するパーティクル（塵埃）等の汚染物を除去しなければならない。また、基板処理装置の使用により生じた配管等への付着物を適当な時期に除去しなければならない。そのため、基板処理装置の配管等を洗浄する必要がある。 When such a substrate processing apparatus is installed in a factory or the like, contaminants such as particles (dust) existing inside pipes and nozzles must be removed before the substrate processing apparatus is operated. Also, it must be removed by Ri resulting deposits on the pipe or the like for use in a substrate processing apparatus at an appropriate time. Therefore, it is necessary to clean the piping of the substrate processing apparatus.
図１３の洗浄ユニット１においては、洗浄液タンク１１，１１ａに互いに異なる種類の洗浄液または互いに異なる濃度の洗浄液を貯留することができる。例えば、第１洗浄液としてＳＣ１を用い、第２洗浄液として純水を用い、第３洗浄液としてＳＣ２を用い、第４洗浄液として純水を用いる。この場合、第１洗浄液による配管洗浄と並行して洗浄液タンク１１において第２洗浄液の準備を行うことができる。また、第３洗浄液による配管洗浄と並行して洗浄液タンク１１ａにおいて第４洗浄液の準備を行うことができる。したがって、複数の洗浄液を用いて短時間で配管を洗浄することが可能になる。 In the cleaning unit 1 of FIG. 13, different types of cleaning liquids or cleaning liquids having different concentrations can be stored in the cleaning liquid tanks 11 and 11a. For example, SC1 is used as the first cleaning liquid, pure water is used as the second cleaning liquid, SC2 is used as the third cleaning liquid, and pure water is used as the fourth cleaning liquid. In this case, the second cleaning liquid can be prepared in the cleaning liquid tank 11 in parallel with the pipe cleaning with the first cleaning liquid. In addition, the fourth cleaning liquid can be prepared in the cleaning liquid tank 11a in parallel with the pipe cleaning with the third cleaning liquid. Therefore, it is possible to clean the piping in a short time using a plurality of cleaning liquids.
［４］他の実施の形態
（ａ）上記の第１の実施の形態において、第１洗浄液としてＳＣ１を用い、第２洗浄液として純水を用い、第３洗浄液としてＳＣ２を用い、第４洗浄液として純水を用いてもよい。この場合には、第１洗浄液および第２洗浄液について図２のステップＳ1〜Ｓ８を行った後、第３洗浄液および第４洗浄液についてステップＳ１〜Ｓ８を行い、その後、ステップＳ９〜Ｓ１３を行う。それにより、ＳＣ１を用いて処理液タンク２１および配管Ｐ１３，Ｐ１５〜Ｐ１７のパーティクルを洗浄し、ＳＣ２を用いて処理液タンク２１および配管Ｐ１３，Ｐ１５〜Ｐ１７の金属系汚染物を洗浄することができる。
[4] Other Embodiments (a) In the first embodiment described above, SC1 is used as the first cleaning liquid, pure water is used as the second cleaning liquid, SC2 is used as the third cleaning liquid, and the fourth cleaning liquid is used as the fourth cleaning liquid. Pure water may be used. In this case, after performing steps S1 to S8 in FIG. 2 for the first and second cleaning liquids, steps S1 to S8 are performed for the third and fourth cleaning liquids, and then steps S9 to S13 are performed. Thereby, particles in the processing liquid tank 21 and the pipes P13, P15 to P17 can be cleaned using SC1, and metal-based contaminants in the processing liquid tank 21 and the pipes P13, P15 to P17 can be cleaned using SC2. .
Claims (7)
前記基板処理装置に配管を通して処理液を供給する処理液供給ユニットと、
洗浄ユニットとを備え、
前記処理液供給ユニットは、基板の処理時に、前記処理液を貯留する処理液タンクを含み、
前記基板処理装置は、基板の処理時に、基板に前記処理液を供給する処理ユニットを含み、
前記処理液タンクと前記処理ユニットとは前記配管により接続され、
前記洗浄ユニットは、前記配管の洗浄時に、第１洗浄液を前記処理液供給ユニットの前記処理液タンクに供給した後に、第２洗浄液の準備を行い、準備された前記第２洗浄液を前記処理液タンクに供給するように構成され、
前記処理液供給ユニットは、前記配管の洗浄時に、前記洗浄ユニットから供給された前記第１洗浄液を前記処理液タンクに貯留した後、前記処理液タンク内の前記第１洗浄液を前記配管を通して前記処理ユニットに供給することにより前記配管を洗浄し、前記洗浄ユニットから供給された前記第２洗浄液を前記処理液タンクに貯留した後、前記処理液タンク内の前記第２洗浄液を前記配管を通して前記処理ユニットに供給することにより前記配管を洗浄するように構成され、
前記洗浄ユニットは、前記第１洗浄液による前記配管の洗浄と並行して前記第２洗浄液の準備を行う、基板処理システム。 A substrate processing apparatus for processing the substrate;
A processing liquid supply unit for supplying a processing liquid to the substrate processing apparatus through a pipe;
A cleaning unit,
The processing liquid supply unit includes a processing liquid tank that stores the processing liquid when processing a substrate,
The substrate processing apparatus includes a processing unit that supplies the processing liquid to the substrate when processing the substrate,
The processing liquid tank and the processing unit are connected by the pipe,
The cleaning unit prepares a second cleaning liquid after supplying the first cleaning liquid to the processing liquid tank of the processing liquid supply unit when cleaning the pipe, and the prepared second cleaning liquid is used as the processing liquid tank. Configured to supply
The processing liquid supply unit stores the first cleaning liquid supplied from the cleaning unit in the processing liquid tank when cleaning the pipe, and then passes the first cleaning liquid in the processing liquid tank through the pipe. The pipe is cleaned by supplying to the unit, the second cleaning liquid supplied from the cleaning unit is stored in the processing liquid tank, and then the second cleaning liquid in the processing liquid tank is passed through the pipe to the processing unit. Configured to wash the piping by supplying to
The substrate processing system, wherein the cleaning unit prepares the second cleaning liquid in parallel with the cleaning of the pipe with the first cleaning liquid.
前記供給経路を開閉する開閉装置とをさらに備え、
前記開閉装置は、前記洗浄ユニットから前記処理液タンクへの前記第１洗浄液の供給時に前記供給経路を開き、前記処理液タンクへの前記第１洗浄液の供給後に前記供給経路を閉じる、請求項１記載の基板処理システム。 A supply path for supplying the first cleaning liquid and the second cleaning liquid from the cleaning unit to the processing liquid tank;
An opening / closing device for opening and closing the supply path;
The opening / closing device opens the supply path when the first cleaning liquid is supplied from the cleaning unit to the processing liquid tank, and closes the supply path after the first cleaning liquid is supplied to the processing liquid tank. The substrate processing system as described.
前記洗浄ユニットは、前記循環経路による前記第１洗浄液の循環と並行して前記第２洗浄液の準備を行う、請求項１〜３のいずれか一項に記載の基板処理システム。 The processing liquid supply unit further includes a circulation path for circulating the first cleaning liquid in the processing liquid tank through a filter,
The substrate processing system according to claim 1, wherein the cleaning unit prepares the second cleaning liquid in parallel with circulation of the first cleaning liquid through the circulation path.
前記洗浄ユニットは、前記複数の処理液タンクに接続可能に構成される、請求項１〜５のいずれかに記載の基板処理システム。 The processing liquid supply unit includes a plurality of the processing liquid tanks,
The substrate processing system according to claim 1, wherein the cleaning unit is configured to be connectable to the plurality of processing liquid tanks.
前記処理液供給ユニットは、基板の処理時に、前記処理液供給ユニットの処理液タンクから配管を通して前記基板処理装置の処理ユニットに処理液を供給するように構成され、
前記配管洗浄方法は、
前記配管の洗浄時に、洗浄ユニットから前記処理液供給ユニットの前記処理液タンクに第１洗浄液を供給するステップと、
前記処理液タンクへの前記第１洗浄液の供給後、前記処理液タンクから前記配管を通して前記基板処理装置の前記処理ユニットに前記第１洗浄液を供給することにより前記配管を洗浄するステップと、
前記第１洗浄液による前記配管の洗浄と並行して前記洗浄ユニットにおいて第２洗浄液の準備を行うステップと、
前記第１洗浄液による前記配管の洗浄後、前記洗浄ユニットから前記処理液タンクに前記第２洗浄液を供給するステップと、
前記処理液タンクへの前記第２洗浄液の供給後、前記処理液タンクから前記配管を通して前記処理ユニットに前記第２洗浄液を供給することにより前記配管を洗浄するステップとを含む、配管洗浄方法。 A piping cleaning method for cleaning piping in a substrate processing apparatus and a processing liquid supply unit,
The processing liquid supply unit is configured to supply a processing liquid to a processing unit of the substrate processing apparatus through a pipe from a processing liquid tank of the processing liquid supply unit when processing the substrate.
The pipe cleaning method is:
Supplying a first cleaning liquid from a cleaning unit to the processing liquid tank of the processing liquid supply unit when cleaning the piping;
After supplying the first cleaning liquid to the processing liquid tank, cleaning the pipe by supplying the first cleaning liquid from the processing liquid tank to the processing unit of the substrate processing apparatus through the pipe;
Preparing the second cleaning liquid in the cleaning unit in parallel with the cleaning of the pipe with the first cleaning liquid;
Supplying the second cleaning liquid from the cleaning unit to the processing liquid tank after cleaning the pipe with the first cleaning liquid;
Cleaning the pipe by supplying the second cleaning liquid from the processing liquid tank to the processing unit through the pipe after the second cleaning liquid is supplied to the processing liquid tank.
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014065621A JP6186298B2 (en) | 2014-03-27 | 2014-03-27 | Substrate processing system and piping cleaning method |
| CN201580012432.7A CN106104762B (en) | 2014-03-10 | 2015-02-26 | Base plate processing system and pipeline cleaning method |
| KR1020187037875A KR102049193B1 (en) | 2014-03-10 | 2015-02-26 | Substrate processing system and tubing cleaning method |
| US15/124,252 US20170014873A1 (en) | 2014-03-10 | 2015-02-26 | Substrate processing system and pipe cleaning method |
| KR1020167028100A KR101842824B1 (en) | 2014-03-10 | 2015-02-26 | Substrate processing system and tubing cleaning method |
| PCT/JP2015/001010 WO2015136872A1 (en) | 2014-03-10 | 2015-02-26 | Substrate processing system and tubing cleaning method |
| CN201811416745.0A CN109285800B (en) | 2014-03-10 | 2015-02-26 | Substrate processing system and pipe cleaning method |
| KR1020187007915A KR20180033594A (en) | 2014-03-10 | 2015-02-26 | Substrate processing system and tubing cleaning method |
| TW104107388A TWI628007B (en) | 2014-03-10 | 2015-03-09 | Substrate processing system and method of cleaning pipe |
| TW109134990A TWI760883B (en) | 2014-03-10 | 2015-03-09 | Substrate processing apparatus |
| TW107118516A TWI709443B (en) | 2014-03-10 | 2015-03-09 | Substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014065621A JP6186298B2 (en) | 2014-03-27 | 2014-03-27 | Substrate processing system and piping cleaning method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017148044A Division JP6347875B2 (en) | 2017-07-31 | 2017-07-31 | Substrate processing system and piping cleaning method |
Publications (3)
| Publication Number | Publication Date |
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| JP2015191897A JP2015191897A (en) | 2015-11-02 |
| JP2015191897A5 true JP2015191897A5 (en) | 2017-02-09 |
| JP6186298B2 JP6186298B2 (en) | 2017-08-23 |
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| JP2014065621A Active JP6186298B2 (en) | 2014-03-10 | 2014-03-27 | Substrate processing system and piping cleaning method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6535649B2 (en) * | 2016-12-12 | 2019-06-26 | 株式会社荏原製作所 | Substrate processing apparatus, discharge method and program |
| JP6984431B2 (en) * | 2018-01-19 | 2021-12-22 | 東京エレクトロン株式会社 | Channel cleaning method and channel cleaning device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004267965A (en) * | 2003-03-11 | 2004-09-30 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and method for changeover of processing liquid |
| JP2012200712A (en) * | 2011-03-28 | 2012-10-22 | Kuraray Co Ltd | Piping washing method |
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