CN103928372B - Corrosion-resistant wafer cleaning device - Google Patents
Corrosion-resistant wafer cleaning device Download PDFInfo
- Publication number
- CN103928372B CN103928372B CN201410161343.6A CN201410161343A CN103928372B CN 103928372 B CN103928372 B CN 103928372B CN 201410161343 A CN201410161343 A CN 201410161343A CN 103928372 B CN103928372 B CN 103928372B
- Authority
- CN
- China
- Prior art keywords
- chuck
- cleaning device
- wafer cleaning
- cavity
- erosion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a corrosion-resistant wafer cleaning device and relates to the field of semiconductor machining and manufacturing. The corrosion-resistant wafer cleaning device comprises a chuck and a cavity, wherein the chuck is used for bearing a wafer and provided with chuck locking holes communicated with the cavity, the cavity is detachably connected with the chuck, one or more gas channels communicated with the chuck locking holes are formed in the cavity in the axial direction, the gas channels are connected with an exhaust pipeline and an exhaust device in sequence, the exhaust pipeline is provided with a valve for controlling the exhaust device to be started or stopped, and when the exhaust device is started, gas in the chuck enters the gas channels and the exhaust pipeline through the chuck locking holes to be exhausted out of the chuck. According to the corrosion-resistant wafer cleaning device, by the additional arrangement of the exhaust pipeline and exhaust device, acid gas remaining in the wafer cleaning device can be exhausted in time to prevent metal parts in the device from being corroded and damaged, breakage of the wafer or breakdown of the device is avoided, enterprise cost is reduced, and product quality is improved at the same time.
Description
Technical field
The present invention relates to field of semiconductor processing and manufacturing, more particularly, it relates to a kind of etch-proof wafer
Clean device.
Background technology
Entering into the deep-submicron stage along with integrated circuit feature size, IC wafer manufactures work
The cleanliness factor of wafer surface required in skill is more and more harsher, in order to ensure the clean of wafer material surface
, there is hundreds of roads matting in cleanliness, matting account for whole system in the manufacturing process of integrated circuit
Make the 30% of process.
But during cleaning, occur in that some problems, such as: wafer cleaning device is in operation
Time sprayed medicinal liquid or cleanout fluid to crystal column surface by the shower above chuck, as it is shown in figure 1, clearly
Washing in operation process, the acid gas produced in chuck 100 can be overflowed by chuck lockhole 300 and be deposited
In cavity 200, owing to not getting rid of the pipeline of these acid gas in cleaning device, and the process operation time
The longest, cause acid gas cannot discharge in being trapped in cavity 200 for a long time, substantial amounts of acid gas is detained
It is easily caused chuck 100 or/and the metal parts in cavity 200 is damaged by acid gas corrosion, especially
Metal parts on the spring part clamping wafer and bearing in chuck.Dress is cleaned due to existing
Put that cause cleaning the metal parts in device because acid gas is detained impaired, and then cause wafer cleaning device
Operation irregularity, serious meeting causes product rejection and then needs often to change implement, adding enterprise
The cost that industry produces.
Therefore, existing wafer cleaning device is improved, prevent acid gas to be trapped in cleaning device
Become those skilled in the art's problem demanding prompt solution.
Summary of the invention
It is an object of the invention to provide a kind of etch-proof wafer cleaning device, prevent acid gas the most stagnant
Stay in wafer cleaning device, cause the metal parts in device to damage because of acid gas corrosion.
The present invention solves that above-mentioned technical problem employed technical scheme comprise that a kind of erosion-resisting crystalline substance of offer
Circle cleans device, including the chuck for carrying wafer and the cavity that removably connects with chuck, described
Chuck is provided with the chuck lockhole through with described cavity, is provided with one or more in described cavity vertically
The gas passage communicated with chuck lockhole, described gas passage is sequentially connected with exhaust pipe and air extractor,
Described exhaust pipe is provided with the valve controlling described air extractor switch, opens air extractor, in described chuck
Gas enter gas passage and exhaust pipe by chuck lockhole and be pulled out out described chuck.
Preferably, described exhaust pipe includes main line and some bye-passes, and one end of each bye-pass connects
Gas passage, the other end of each bye-pass connects with main line.
Preferably, each bye-pass is uniformly distributed along the circumference of described cavity.
Preferably, described main line includes a ring-type pipeline and pipeline always, and described ring-type pipeline is simultaneously
With each bye-pass and straight pipeline connection, described straight tube road is connected with described air extractor.
Preferably, each bye-pass is connected by multiple-pass joint with described ring-type pipeline.
Preferably, described multiple-pass joint is three way cock.
Preferably, described ring-type pipeline is connected by snap joint with described straight tube road.
Preferably, described ring-type pipeline is at right angles connected with described straight tube road.
Preferably, described cavity is connected with described chuck by bearing, and described chuck is relative to described cavity
Can horizontal rotation.
Preferably, the lower section of described cavity is provided with the pedestal for carrying described cavity.
The etch-proof wafer cleaning device of one that the present invention provides, by setting up exhaust pipe and dress of bleeding
Putting thus discharged by the acid gas being detained in wafer cleaning equipment in time, the metal parts in anti-locking apparatus is because of acid
Gas corrosion and damage, it is to avoid wafer produces fragmentation or device fails, reduces entreprise cost simultaneously
Improve product quality.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below will be to institute in embodiment
The accompanying drawing used is needed to be briefly described, it should be apparent that, the accompanying drawing in describing below is only this
Some embodiments of invention, for those of ordinary skill in the art, are not paying creative work
On the premise of, it is also possible to other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the structural representation of erosion-resisting wafer cleaning device in the embodiment of the present invention.
In figure, label is described as follows:
100, chuck, 101, bearing, 200, cavity, 300, chuck lockhole, 400, gas passage,
500, exhaust pipe, 501, bye-pass, 502, main line, 5021, ring-type pipeline, 5022, straight tube
Road, 600, air extractor, 700, valve, 800, multiple-pass joint, 900, pedestal.
Detailed description of the invention
The present invention is further described as follows below in conjunction with the accompanying drawings, and appended accompanying drawing is used for explaining that the present invention's is concrete
Embodiment, is not used for limiting to the present invention.
As it is shown in figure 1, the structural representation that Fig. 1 is the erosion-resisting wafer cleaning device of the present invention, this
Bright employed technical scheme comprise that provides a kind of erosion-resisting wafer cleaning device, including for carrying wafer
Chuck 100 and the cavity 200 removably connected with chuck 100, chuck 100 is provided with and cavity 200
Through chuck lockhole 300, be provided with vertically in cavity 200 one or more with chuck lockhole 300 phase
Logical gas passage 400, gas passage 400 is sequentially connected with exhaust pipe 500 and air extractor 600, takes out
Air pipe 500 is provided with the valve controlling air extractor 600 switch, opens air extractor 600, chuck 100
Interior gas enters gas passage 400 by chuck lockhole 300 and exhaust pipe 500 is pulled out card release
Dish 100.
The present invention is by setting up exhaust pipe 500 and air extractor 600 thus in time by wafer cleaning equipment
The acid gas of interior delay is discharged, and prevents the metal parts cleaned in device from damaging because of acid gas corrosion, it is to avoid
Wafer produces the consequence such as fragmentation or device fails, reduces entreprise cost and improves product quality simultaneously.
In the present embodiment, described exhaust pipe 500 includes some bye-passes 501 and main line 502, respectively
One end of bye-pass 501 connects gas passage 400, the other end of each bye-pass 501 and main line 502
Connection；Described each bye-pass 501 can be uniformly distributed or uneven distribution along the circumference of cavity, is preferably
It is uniformly distributed along cavity.Main line 502 can include a ring-type pipeline 5021 and pipeline 5022 always,
Ring-type pipeline 5021 connects with each bye-pass 501 and straight tube road 5022 simultaneously, and ring-type pipeline 5021
Being preferably right angle with each bye-pass 501 to be connected, ring-type pipeline 5021 is preferably right angle with straight tube road 5022
Connecting, straight tube road 5022 is connected with air extractor 600.Wherein, the connection between the most each pipeline,
Each bye-pass 501 is connected by multiple-pass joint 800 with ring-type pipeline 5021, and multiple-pass joint 800 is preferably
Three way cock, ring-type pipeline 5021 is connected preferably by snap joint with straight tube road 5022.
What deserves to be explained is, in the present embodiment, described gas passage 400 is located in cavity 200, gas
Passage 400 connects with chuck lockhole 300 and exhaust pipe 500, and described gas passage 400 can be
In cavity 200, itself is from the passage that sets, it is possible to set up in cavity 200 and chuck lockhole 300 and taking out
The gas passage 400 of air pipe 500 connection.Additionally, described gas passage 400 and exhaust pipe 500
Junction can be provided with sealing ring.
In the present embodiment, described cavity 200 is connected with chuck 100 by bearing 101, chuck 100 phase
For cavity 200 can horizontal rotation, the lower section of cavity 200 is provided with the pedestal 900 for carrying cavity 200.
The above-described the preferred embodiments of the present invention that are only, described embodiment also is not used to limit the present invention
Scope of patent protection, the equivalent structure that the description of the most every utilization present invention and accompanying drawing content are made
Change, in like manner should be included in protection scope of the present invention.
Claims (10)
1. an erosion-resisting wafer cleaning device, including chuck and and chuck for carrying wafer
The cavity removably connected, described chuck is provided with the chuck lockhole through with described cavity, and its feature exists
In, it is provided with one or more gas passage communicated with chuck lockhole, described gas in described cavity vertically
Body passage is sequentially connected with exhaust pipe and air extractor, and described exhaust pipe is provided with described in control dress of bleeding
Put the valve of switch, open air extractor, the gas in described chuck by chuck lockhole enter gas passage with
And exhaust pipe is pulled out out described chuck.
Erosion-resisting wafer cleaning device the most according to claim 1, it is characterised in that described in take out
Air pipe includes main line and some bye-passes, and one end of each bye-pass connects gas passage, each bye-pass
The other end connect with main line.
Erosion-resisting wafer cleaning device the most according to claim 2, it is characterised in that each arm
The circumference of cavity described in curb is uniformly distributed.
Erosion-resisting wafer cleaning device the most according to claim 2, it is characterised in that described master
Pipeline includes a ring-type pipeline and pipeline always, described ring-type pipeline simultaneously with each bye-pass and straight tube road
Connection, described straight tube road is connected with described air extractor.
Erosion-resisting wafer cleaning device the most according to claim 4, it is characterised in that each arm
Road is connected by multiple-pass joint with described ring-type pipeline.
Erosion-resisting wafer cleaning device the most according to claim 5, it is characterised in that described many
Pass joint is three way cock.
Erosion-resisting wafer cleaning device the most according to claim 4, it is characterised in that described ring
Shape pipeline is connected by snap joint with described straight tube road.
Erosion-resisting wafer cleaning device the most according to claim 4, it is characterised in that described ring
Shape pipeline is at right angles connected with described straight tube road.
9. according to the arbitrary described erosion-resisting wafer cleaning device of claim 1～8, it is characterised in that
Described cavity is connected with described chuck by bearing, and described chuck can horizontal rotation relative to described cavity.
10. according to the arbitrary described erosion-resisting wafer cleaning device of claim 1～8, it is characterised in that
The lower section of described cavity is provided with the pedestal for carrying described cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410161343.6A CN103928372B (en) | 2014-04-22 | 2014-04-22 | Corrosion-resistant wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410161343.6A CN103928372B (en) | 2014-04-22 | 2014-04-22 | Corrosion-resistant wafer cleaning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103928372A CN103928372A (en) | 2014-07-16 |
| CN103928372B true CN103928372B (en) | 2017-01-11 |
Family
ID=51146551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410161343.6A Active CN103928372B (en) | 2014-04-22 | 2014-04-22 | Corrosion-resistant wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103928372B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114618819B (en) * | 2022-03-22 | 2023-04-07 | 上海华力微电子有限公司 | Flushing device and semiconductor manufacturing equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1450618A (en) * | 2002-04-08 | 2003-10-22 | 中芯国际集成电路制造(上海)有限公司 | Vacuum suction device capable of reducing particle pollution |
| US6676804B1 (en) * | 1998-07-16 | 2004-01-13 | Tokyo Electron At Limited | Method and apparatus for plasma processing |
| CN101145522A (en) * | 2006-09-15 | 2008-03-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas injection device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05234944A (en) * | 1992-02-19 | 1993-09-10 | Hitachi Ltd | Wafer temperature control method and equipment |
-
2014
- 2014-04-22 CN CN201410161343.6A patent/CN103928372B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6676804B1 (en) * | 1998-07-16 | 2004-01-13 | Tokyo Electron At Limited | Method and apparatus for plasma processing |
| CN1450618A (en) * | 2002-04-08 | 2003-10-22 | 中芯国际集成电路制造(上海)有限公司 | Vacuum suction device capable of reducing particle pollution |
| CN101145522A (en) * | 2006-09-15 | 2008-03-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Gas injection device |
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| Publication number | Publication date |
|---|---|
| CN103928372A (en) | 2014-07-16 |
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