JP2015188036A - substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for efficiently attaching/removing a wire to/from a stage on which a substrate is thermally processed.SOLUTION: A wire 3 is disposed on a surface of a stage 2 on which heating treatment is performed to a substrate 90. The wire 3 is folded at the lateral side of the stage 2 to continuously traverse the surface of the stage 2 several times. Multiple hooks 41, on which the wire 3 hooks, are provided at a long member 40 disposed at a side part of the stage 2. The long member 40 is connected with a fixed part 23 fixed to the stage 2 through multiple elastic members 54. The long member 40 is biased to the lower side by the multiple elastic members 54 thereby causing the wire 3 hooking on the hooks 41 to be pulled.

Description

  The present invention relates to a technique for thermally processing a substrate.

  For example, as one of the manufacturing processes of a liquid crystal display device (LCD), there is photolithography that forms a predetermined pattern on a glass substrate for LCD. In this photophysography, in general, thermal processing such as dehydration processing for drying a cleaned glass substrate, pre-baking processing for solidifying a resist applied to the glass substrate, and post-baking processing after development is performed. .

  As a processing unit for performing such thermal processing, a glass substrate is placed on a stage constituted by a hot plate or a cold plate, and the substrate is thermally processed by heating or cooling the stage. Things are known. In general, a plurality of proximity pins are distributed on the surface of the stage so that the glass substrate does not directly contact the stage.

  Moreover, it is also proposed to place a plurality of wire rods on the surface of the stage and place a substrate on the plurality of wire rods instead of providing stage proximate pins (for example, Patent Document 1).

JP 2004-179384 A

  However, in the substrate processing apparatus described in Patent Document 1, a plurality of wire rods are arranged at predetermined intervals in the longitudinal direction of the hot plate. Each wire is fixed one by one using a plurality of wire fixing jigs provided on the side of the hot plate. For this reason, when attaching each wire to a hot plate, it was necessary to attach one wire at a time to a wire fixing jig, and the work was complicated. Also, when removing the wire from the stage, it is necessary to remove the wire from the wire fixing jig one by one, which is complicated. For this reason, maintenance of the stage surface could not be performed easily.

  Therefore, an object of the present invention is to provide a technique for efficiently attaching and detaching a wire to a stage that thermally processes a substrate.

  In order to solve the above-described problem, a first aspect is a substrate processing apparatus for processing a substrate, the stage for thermally processing the substrate, and the surface of the stage disposed on the surface of the stage and folded back. One or more wire rods that continuously traverse a plurality of times, and a positioning portion that contacts a folded portion of the wire rod and defines a transverse position of the wire rod on the surface of the stage.

  Moreover, a 2nd aspect is the substrate processing apparatus which concerns on a 1st aspect, Comprising: The said positioning part is attached to the elongate part arrange | positioned at the side part of the said stage, and the said elongate part. In addition, a plurality of hooks for hooking the wire rod are provided.

  Moreover, a 3rd aspect is a substrate processing apparatus which concerns on a 2nd aspect, Comprising: The biasing mechanism which pulls the said wire material hooked on the said latching part by biasing the said elongate part is further provided. Prepare.

  Moreover, a 4th aspect is a substrate processing apparatus which concerns on a 3rd aspect, Comprising: The said urging | biasing mechanism has connected between the fixed part in the said elongate part and the said stage, The said elongate part is And an elastic member that urges toward the fixed portion.

  Further, the fifth aspect is a substrate processing apparatus according to the third or fourth aspect, further comprising a detector that detects the movement of the long portion in the direction biased by the biasing mechanism. I have.

  A sixth aspect is a substrate processing apparatus according to any one of the second to fifth aspects, wherein the long portion is a structure for attaching the latching portion, and It has an attachment structure in which the attachment position of the hooking portion in the scale portion is variable.

  Moreover, a 7th aspect is a substrate processing apparatus which concerns on a 6th aspect, Comprising: The said attachment structure is a structure which attaches | detaches the said latching part with respect to a elongate part so that attachment or detachment is possible.

  Further, an eighth aspect is the substrate processing apparatus according to any one of the second to seventh aspects, wherein the long portions are arranged in a row along the stage. It has a long member.

  Further, a ninth aspect is the substrate processing apparatus according to any one of the second to eighth aspects, wherein the long portion winds and holds the end of the wire, Have

  A tenth aspect is a substrate processing apparatus according to any one of the first to ninth aspects, wherein the one or more wires cross the surface of the stage along a first direction. A first linear portion and a plurality of second linear portions that cross the surface of the stage along a direction intersecting the first direction, and the first linear portion includes the plurality of second linear portions. When intersecting the two linear parts, the upper and lower positions of each second linear part pass alternately.

  According to the substrate processing apparatus according to the first aspect, since the surface of the stage is crossed by folding the wire, it is easier to attach the wire than when fixing one wire at each position where the stage is crossed. Can be In addition, the work can be easily performed at the time of removal as compared with the case where the pieces are fixed one by one. Therefore, there is an effect that the wire can be efficiently attached and detached.

  Moreover, according to the substrate processing apparatus which concerns on a 2nd aspect, it can be return | folded to a wire by hooking a wire to a latching | locking part.

  Moreover, according to the substrate processing apparatus which concerns on a 3rd aspect, since a wire can be pulled by an urging | biasing mechanism, a wire can be arrange | positioned favorably on a stage surface.

  Moreover, according to the substrate processing apparatus which concerns on a 4th aspect, since a wire can be pulled with an elastic member, a wire can be arrange | positioned favorably on a stage surface.

  Moreover, according to the substrate processing apparatus which concerns on a 5th aspect, since the movement of the elongate member which generate | occur | produces by extension or a cutting | disconnection of a wire can be detected, the maintenance time of a wire can be grasped | ascertained and the effect that process failure can be suppressed beforehand. Play.

  Moreover, according to the substrate processing apparatus which concerns on a 6th aspect, since the attachment position of a latching part is variable, the attachment position of a latching part can be changed freely. Therefore, there is an effect that the crossing position of the wire in the stage 2 can be changed.

  Moreover, according to the substrate processing apparatus which concerns on a 7th aspect, since a latching part is detachable, a latching part can be attached or removed as needed. Therefore, since the number of the latching portions can be suppressed to a necessary number, there is an effect that the component cost can be suppressed.

  Moreover, according to the substrate processing apparatus which concerns on an 8th aspect, it can replace | exchange for every elongate member which is a part of elongate part. For this reason, the maintenance of a long part becomes easy compared with the case where a long part is comprised with a single member. Further, since only partial replacement is required, the cost of parts related to replacement can be suppressed.

  Moreover, according to the substrate processing apparatus which concerns on a 9th aspect, there exists an effect that the part of the excess wire can be wound up and hold | maintained by the winding-up part.

  Moreover, according to the substrate processing apparatus which concerns on a 10th aspect, a board | substrate can be supported in the shape of a dot in the part which a 1st linear part and a 2nd linear part cross | intersect. Thereby, the contact area between the substrate and the wire can be reduced. Therefore, there is an effect that the substrate can be thermally processed satisfactorily.

1 is a schematic plan view showing a substrate processing system including a substrate processing apparatus according to a first embodiment. 1 is a schematic plan view showing a substrate processing apparatus according to a first embodiment. It is a schematic side view which shows the substrate processing apparatus which concerns on 1st Embodiment seen from the + X side. It is a schematic sectional drawing which shows the substrate processing apparatus seen from the IV-IV position shown by FIG. It is a schematic sectional drawing of the substrate processing apparatus with which a pair of plate-shaped member was removed from the stage. It is a schematic side view which shows the substrate processing apparatus which concerns on the modification of 1st Embodiment. It is a schematic plan view which shows the substrate processing apparatus which concerns on 2nd Embodiment. It is a schematic front view which shows the substrate processing apparatus seen from the VIII-VIII position shown by FIG. It is a schematic perspective view which shows the elongate member which concerns on 2nd Embodiment. It is the partial schematic which shows the elongate member which concerns on the modification of 2nd Embodiment. It is a schematic sectional drawing which shows the elongate member seen from the XI-XI position shown by FIG. It is a figure which shows the example 1 of arrangement | positioning 1 of a wire. It is a partial schematic sectional drawing which shows the example of arrangement | positioning arrange | positioned so that a wire may cross | intersect.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the component described in this embodiment is an illustration to the last, and is not a thing of the meaning which limits the scope of the present invention only to them. In the drawings, the size and number of each part may be exaggerated or simplified as necessary for easy understanding.

{1. First Embodiment}
<Substrate processing system 100>
FIG. 1 is a schematic plan view showing a substrate processing system 100 including a substrate processing apparatus 1 according to the first embodiment. The substrate processing system 100 processes a rectangular glass substrate 90 (hereinafter simply referred to as a substrate 90) for manufacturing a liquid crystal display (LCD) screen panel.

  The substrate processing system 100 includes a substrate processing apparatus 1 as a carry-in unit 10, a cleaning unit 11, a dehydrated bake unit 12, a coating unit 13, a vacuum drying unit 14, and a prebake unit. As shown in FIG. 1, the carry-in unit 10, the cleaning unit 11, the dehydrated bake unit 12, the coating unit 13, the vacuum drying unit 14, and the substrate processing apparatus 1 (prebake unit) are arranged in one direction (direction D <b> 1) in this order. Are arranged so as to be linearly adjacent to each other.

  The carry-in unit 10 is a part that receives a substrate 90 to be processed in the substrate processing system 100. The cleaning unit 11 cleans and cleans the substrate 90 carried into the carry-in unit 10. The dehydrated bake unit 12 dries the substrate 90 to which the cleaning liquid is adhered in the cleaning unit 11.

  The application unit 13 applies a treatment solution (here, a resist solution) to the surface of the substrate 90 dried by the dehydration bake unit 12. The vacuum drying unit 14 vacuum-drys the treatment liquid applied by the coating unit 13. The substrate processing apparatus 1 as the pre-baking unit heats the substrate 90 to solidify the processing liquid, and forms a thin film of the processing liquid on the substrate 90.

  The substrate processing system 100 also includes an exposure unit 15 that exposes the surface of the substrate 90 on which a thin film of processing solution is formed in a required circuit pattern. The exposure unit 15 extends in a direction D2 orthogonal to the direction D1. A part on one side of the exposure unit 15 is adjacent to the substrate processing apparatus 1 as a pre-baking unit, and a part on the other side of the exposure unit 15 is adjacent to the developing unit 16.

  The substrate processing system 100 further includes a developing unit 16, a rinse unit 17, a post-bake unit 18, and a carry-out unit 19. The developing unit 16 performs a development process by immersing the substrate 90 exposed in the exposing unit 15 in a developer. The rinsing unit 17 stops the development process by rinsing the substrate 90 developed by the developing unit 16 with a rinsing solution.

  The post-bake unit 18 removes the rinse liquid adhering to the substrate 90 by heating the substrate 90. The carry-out unit 19 is a part that carries out the substrate 90 that has been processed in the substrate processing system 100 to the outside. The developing unit 16, the rinsing unit 17, the post-bake unit 18, and the carry-out unit 19 are arranged so as to be linearly adjacent along the direction D3 opposite to the direction D1. In the substrate processing system 100, the direction of progress of processing is changed from the direction D1 to the direction D3 so that the substrate 90 makes a U-turn in the exposure unit 15.

<Substrate processing apparatus 1>
FIG. 2 is a schematic plan view showing the substrate processing apparatus 1 according to the first embodiment. FIG. 3 is a schematic side view showing the substrate processing apparatus 1 according to the first embodiment viewed from the + X side. FIG. 4 is a schematic cross-sectional view showing the substrate processing apparatus 1 as seen from the IV-IV position shown in FIG. 2 and the subsequent drawings show an X direction and a Y direction orthogonal to each other on the horizontal plane, and a Z direction along the vertical direction. These directions are defined for the convenience of explanation of the positional relationship of each element, and are not intended to limit the positional relationship of each element.

  The substrate processing apparatus 1 includes a stage 2, a wire 3, and a positioning unit 4. The stage 2 is a substantially rectangular parallelepiped member. The surface (upper surface) of the stage 2 is a smooth surface parallel to the horizontal plane. One wire 3 is disposed on the surface of the stage 2.

  The substrate processing apparatus 1 includes a plurality of lifting pins 21 that penetrate the stage 2. As shown in FIG. 4, the substrate processing apparatus 1 includes a pin driving device 22 that lifts and lowers a plurality of lifting pins 21 simultaneously. The pin driving device 22 includes a plate-like member to which the lower ends of the plurality of elevating pins 21 are attached, and a piston part that moves the plate-like member up and down.

  By the pin driving device 22, the plurality of lift pins 21 are raised to a position higher than the surface of the stage 2 and lowered to a position lower than the surface of the stage 2. The plurality of elevating pins 21 receives and supports the substrate 90 conveyed from the outside by the conveyance robot at the upper end. Then, when the plurality of lifting pins 21 are lowered, the substrate 90 is placed on the wire 3 arranged on the surface of the stage 2.

  As shown in FIG. 4, the stage 2 includes a heater 23. When the surface of the stage 2 is heated by the heater 23, the substrate 90 supported by the wire 3 is heated by the radiant heat from the surface of the stage 2.

  As shown in FIG. 2, the single wire 3 crosses the surface of the stage 2 a plurality of times continuously by turning back. In the example shown in FIG. 2, the single wire 3 crosses the stage 2 seven times along the X direction.

  As the wire 3, a glass wire such as a metal wire or glass fiber, a heat-resistant resin wire, or a wire made of two or more composite materials selected from these can be used. Moreover, as the wire 3, the thing with small heat conductivity is desirable. This is because heat conduction from the stage 2 to the substrate 90 through the wire 3 can be suppressed by reducing the thermal conductivity. Although the thickness of the wire 3 is not specifically limited, For example, it is set as the thickness of the range of about 0.1 mm-about 1 mm so that the thermal radiation of the stage 2 may occur uniformly. In addition, the wire 3 may be comprised as one wire by twisting together several strands.

  The wire 3 is folded back by a pair of positioning portions 4, 4 provided on both sides in the X direction of the stage 2. The positioning portion 4 is attached to a long member 40 and a long member 40 (long portion) disposed on the side of the stage 2, and a plurality of hooks 41 (holding portions) for hooking the wire 3. It has.

  As shown in FIG. 2, the wire 3 is folded by being hooked on the two hooks 41 and 41. For example, when paying attention to two adjacent hooks 41 and 41 provided on the −X side of the stage 2, the wire 3 extending from the + X side to the −X side is out of the two hooks 41 and 41 arranged in the Y direction. By being hooked on the hook 41 arranged on the −Y side, the X direction is bent in the Y direction and the Y direction extends to the hook 41 arranged on the + Y side. Further, the wire rod 3 is hooked on the hook 41 arranged on the + Y side, so that it bends again from the Y direction to the X direction and extends to the hook 41 arranged on the + X side. In the following description, a portion that is bent in contact with the two hooks 41, 41 and a portion sandwiched between these bent portions are referred to as a folded portion 30 of the wire 3.

  The long member 40 extends in the Y direction along the side of the stage 2. Each hook 41 is detachably attached to an attachment hole 42 formed on the upper surface (the surface on the + Z side) of the long member 40 at a predetermined interval along the Y direction. Various manners of attaching the hook 41 are conceivable. For example, a female screw may be provided in the mounting hole 42 and a male screw may be provided at the rear end portion of the hook 41 so that they are screwed together. Further, when the hook 41 is inserted into the mounting hole 42, a part of the hook 41 may be hooked at a predetermined position so that the hook 41 is difficult to be removed from the mounting hole 42. Further, a magnet may be attached to the inside of the attachment hole 42 or the hook 41 so that the hook 41 is coupled to the long member 40 by a magnetic force. The plurality of attachment holes 42 are an example of an attachment structure for attaching the hook 41 that is a latching portion to the long member 40.

  As shown in FIG. 2, the long member 40 is provided with a large number of mounting holes 42. For this reason, the crossing position of the wire 3 in the stage 2 can be moved in the Y direction by changing the attachment positions of the plurality of hooks 41. That is, the pitch of the wire 3 in the Y direction can be changed by changing the mounting pitch of the plurality of hooks 41.

  Moreover, the hook 41 can be attached or detached as necessary. For this reason, the number of hooks 41 can be suppressed to the number necessary for positioning the wire 3. Therefore, component costs can be reduced.

  One end portion of the wire 3 is held by an end holding jig 43. The end holding jig 43 is provided near the −Y side end of the long member 40 arranged on the −X side. As a method of fixing the wire 3, for example, the wire 3 may be wound around the end holding jig 43 and the end thereof may be fixed. Alternatively, the end of the wire 3 may be fixed by providing a hole in the end holding jig 43, inserting the end of the wire 3 into the hole, and covering the hole. Note that the end holding jig 43 may be attached to the stage 2 or the like.

  The other end portion of the wire 3 is held by a winding jig 44 (winding portion). The winding jig 44 is provided in the vicinity of the + Y side end of the long member 40 arranged at + X. The winding jig 44 is composed of two plate members arranged to face each other with a gap and a connecting member that connects the central portions of these plate members. The wire 3 is passed through the gap between the two plate members in the winding jig 44, and is fixed to the winding jig 44 by being wound around the connecting member several times.

  According to the winding jig 44, the remaining end of the wire 3 can be wound and held. In addition, you may make it hold | maintain only a part among the excess edge parts of the wire 3, and hang down the part at the front end side rather than it. However, the use of the winding jig 44 can eliminate such drooping of the wire 3, so that the stage 2 can be arranged.

  Plate-like members 51 and 51 are respectively attached to both side surfaces of the stage 2 on the + X side and the −X side. The plate-like member 51 is a member interposed between the side surface of the stage 2 and the long member 40. The length of the plate member 51 in the Y direction is longer than the length of the long member 40 in the Y direction (see FIG. 3). The plate-like member 51 is fixed to the side surface of the stage 2 with, for example, bolts.

  The plate-like member 51 is provided with a pair of rails 52 and 52 extending in the Z direction and a fixing portion 53 extending in the Y direction.

  The pair of rails 52, 52 are provided in the vicinity of the −Y side and + Y side ends of the plate-like member 51. The pair of rails 52, 52 are connected to a part of the long member 40 to restrict movement in the left-right direction (Y direction). The long member 40 is configured to be linearly movable only in the vertical direction (Z direction) by the pair of rails 52 and 52. Note that the pair of rails 52, 52 may be omitted.

  The fixing part 53 is a part fixed to the stage 2 via the plate-like member 51. The fixing portion 53 is a portion protruding from the stage 2 to the side (+ X direction or −X direction). One end of a plurality of elastic members 54 (string winding springs) is attached to the upper surface (the surface on the + Z side) of the fixed portion 53. The other ends of the plurality of elastic members 54 are attached to the lower surface (the surface on the −Z side) of the long member 40 disposed above the fixing portion 53. The plurality of elastic members 54 urge the long member 40 toward the fixed portion 53. Accordingly, the plurality of hooks 41 attached to the long member 40 pull the wire 3 downward. Here, the long members 40 on the + X side and the −X side of the stage 2 are urged downward by the plurality of elastic members 54. For this reason, the wire 3 traversing the surface of the stage 2 is pulled from both sides and is arranged without slack. Therefore, in this embodiment, the urging mechanism is configured by the plurality of elastic members 54 connected to the fixed portion 53.

  Note that the plate-like member 51 may be omitted, and the rail 52 and the fixing portion 53 may be provided on the stage 2 itself. However, in this case, processing of the stage 2 is necessary, and the cost may increase. On the other hand, in this embodiment, by providing these structures on the plate-like member 51, the processing of the stage 2 can be omitted, so that the processing cost can be suppressed.

  FIG. 5 is a schematic cross-sectional view of the substrate processing apparatus 1 with the pair of plate-like members 51, 51 removed from the stage 2. In the present embodiment, the wire rod 3 and the pair of positioning portions 4, 4 can be removed from the stage 2 by removing the pair of plate-like members 51, 51 from the stage 2. For example, the surface of the stage 2 and its peripheral part can be easily maintained by lifting and supporting the pair of plate-like members 51, 51 upward.

  A plurality of detectors 55 for detecting the vertical movement of the long member 40 are provided on the upper surface of the fixed portion 53 (see FIG. 3). The detector 55 is composed of, for example, a limit switch sensor. The limit switch sensor has a configuration for opening and closing an electric circuit by transmitting a force received from the outside to the microswitch. By detecting the lowering of the long member 40 by this limit switch sensor, the extension or disconnection of the wire 3 can be detected.

  In the substrate processing apparatus according to the present embodiment, the substrate 90 is supported by the wire 3. For this reason, in order to support the substrate with a large number of proximity pins as in the prior art, it is not necessary to form a large number of proximity pin fixing holes on the stage 2 or to provide the proximity pins. Thereby, the processing cost of the stage 2 can be significantly reduced. Moreover, since the surface of the stage 2 can be kept flat by not providing the proximity pin, the surface of the stage 2 can be efficiently cleaned and highly purified. That is, by using the wire 3, maintenance work of the substrate processing apparatus 1 can be facilitated.

  In the present embodiment, the surface of the stage 2 is traversed a plurality of times by folding the single wire 3. For this reason, the attachment work of the wire 3 is simplified compared to the case where a plurality of wires are fixed one by one at each crossing position on the stage (hot plate) as in the substrate processing apparatus described in Patent Document 1. Can be Therefore, the wire 3 can be efficiently attached to the stage 2. Moreover, also in the case of removal, it can remove efficiently compared with the case where a several wire is fixed one by one.

  In the present embodiment, the wire 3 is pulled by biasing the long member 40 downward by the elastic member 54. For this reason, even if the stage 2 is thermally expanded by the heater 23 and deformed, the wire 3 can be disposed at a predetermined position on the stage 2 without loosening. Note that the long member 40 may be biased downward by attaching a weight to the long member 40 instead of the elastic member 54. Alternatively, the wire 3 may be pulled by attaching a weight to the folded portion 30 of the wire 3.

  FIG. 6 is a schematic side view showing the substrate processing apparatus 1 according to a modification of the first embodiment. In the substrate processing apparatus 1 shown in FIGS. 2 to 4, one long member 40 is arranged on the side of the stage 2. In contrast, in the substrate processing apparatus 1 shown in FIG. 6, the long member 40 is replaced with two long members 401 and 401.

  The two long members 401 and 401 are arranged in a row along the Y-axis direction. Each long member 401 is provided with a plurality of attachment holes 42 for attaching the hooks 41. Each elongate member 401 is limited in the moving direction only in the vertical direction by the pair of rails 52.

  In this case, each long member 401 can be replaced. For this reason, maintenance is easier than in the case of a single long member 40. Further, since only partial replacement is required, the cost of parts related to replacement can be suppressed. The long member 40 may be divided into three or more long members. Further, the plate-like member 51 and the fixing portion 53 provided on the plate-like member 51 may be divided in the same manner as the long member 401.

{2. Second Embodiment}
Next, a second embodiment will be described. In the following description, elements having the same functions as those already described may be denoted by the same reference numerals or reference numerals added with alphabets, and detailed description may be omitted.

  FIG. 7 is a schematic plan view showing a substrate processing apparatus 1A according to the second embodiment. FIG. 8 is a schematic front view showing the substrate processing apparatus 1A viewed from the position VIII-VIII shown in FIG. In the substrate processing apparatus 1A, each of the two wire rods 3 and 3 is disposed so as to cross the stage 2 a plurality of times in the X direction by folding back. The two wires 3 and 3 are positioned by positioning portions 4A arranged on the + X side and the −X side of the stage 2A.

  The positioning portion 4A includes a long member 40A and a plurality of pulleys 41A. The long member 40 </ b> A is a member extending in the Y direction, similarly to the long member 40 according to the first embodiment, and the moving direction of the long member 40 </ b> A is up and down by a pair of rails 52 and 52 provided on the plate-like member 51. Limited to only. The long member 40 </ b> A is connected to a fixing portion 53 provided on the plate-like member 51 by a plurality of elastic members 54. Thereby, the long member 40A is urged downward.

  The pulley 41A is detachably attached to the long member 40A. The pulley 41A includes a disk portion that is rotatable around an axis extending in the X direction. The disc portion is arranged so as to be parallel to the YZ plane, and the wire 3 is hooked in a circumferential groove formed in the central portion of the disc. As shown in FIG. 7, the wire 3 is turned back by being hooked on the two pulleys 41A and 41A.

  For example, attention is paid to two adjacent pulleys 41A and 41A provided on the −X side of the stage 2A. Then, the wire 3 extending from the + X side toward the −X side is hooked on the −Y side pulley 41 </ b> A, thereby bending from the X direction to the Y direction and extending to the + Y side pulley 41 </ b> A. Then, the wire 3 is hooked on the pulley 41A arranged on the + Y side, so that it bends again from the Y direction to the X direction and extends to the pulley 41A arranged on the + X side. Thus, in the present embodiment, the wire rod 3 is folded by the two pulleys 41A and 41A.

  As shown in FIG. 8, a portion of the wire 3 that protrudes from the surface of the stage 2 </ b> A (hereinafter referred to as “protruding portion”) extends obliquely downward with respect to the horizontal plane. Further, since the disk portion of the pulley 41A is arranged in parallel to the YZ plane, the wire 3 is bent in the Z direction by the pulley 41A. If this turn is abrupt, there is a risk of detachment from the pulley 41A. In order to avoid this, the disc portion of the pulley 41A may be arranged obliquely with respect to the YZ plane so as to match the direction in which the protruding portion of the wire 3 extends.

  FIG. 9 is a schematic perspective view showing a long member 40A according to the second embodiment. A mounting hole 42A for attaching the pulley 41A to the long member 40A by inserting a rod-like connecting portion 411 extending from the disk portion of the pulley 41A is provided on the side surface of the long member 40A. The manner of attaching the connecting portion 411 of the pulley 41A may be the same as the manner of attaching the hook 41.

  The long member 40A is also provided with a large number of mounting holes 42A. For this reason, pulley 41A can be attached to arbitrary attachment holes 42A. For this reason, the crossing position in the stage 2A of the wire 3 can be changed by changing the installation position of the pulley 41A.

  At both ends on the surface side of the stage 2A, a corner R portion 2R is formed by rounding a rectangular corner. By forming the corner R portion 2R, the wire 3 can be prevented from being broken.

  In this embodiment, for example, the pulley 41A disposed on the + X side of the stage 2 protrudes to the + X side from the side surface of the stage 2A, and the pulley 21A disposed on the −X side 2 of the stage 2 is the side surface of the stage 2A. Protruding to the -X side. Therefore, the protruding portion of the wire 3 extends in the + X direction and −Z direction at the + X side portion of the stage 2A, and extends in the −X direction and −Z direction at the −X side portion of the stage 2A. It is also conceivable that the protruding portion of the wire 3 is, for example, only in the −Z direction. Specifically, the plate-like member 51 is moved to the inside of the stage 2A by denting the side surfaces of the stage 2A on the + X side and the −X side. Thereby, the pulley 41A arranged on the + X side and the −X side of the stage 2A can be moved to the inside (−X side and + X side) of the stage 2A. Therefore, the protruding portion of the wire 3 can be configured to extend only downward (−Z direction).

  FIG. 10 is a partial schematic view showing a long member 40B according to a modification of the second embodiment. FIG. 11 is a schematic cross-sectional view showing the long member 40B viewed from the XI-XI position shown in FIG. The long member 40B has a shape in which a central portion of each side surface of the hollow quadrangular prism is recessed so as to form a prismatic groove 402 along the longitudinal direction (Y direction). As the long member 40B, for example, an aluminum drawing material or the like is employed.

  For example, when the pulley 41A is attached to the long member 40B, an attachment jig 45 is used. The mounting jig 45 includes a moving jig 46 that is inserted into the groove 402 and is movable in the Y direction along the groove 402, and a pair of fixing jigs 47 and 47 for fixing the moving jig 46. .

  An attachment hole 42A for attaching the pulley 41A is provided at the center of the moving jig 46. The fixing jig 47 fixes itself to the long member 40B by sandwiching the upper end and the lower end of the long member 40B. The position of the moving jig 46 is fixed by attaching each of the two fixing jigs 47, 47 to the long member 40B so as to overlap the −Y side end and the + Y side end of the moving jig 46. be able to. The fixing jig 47 is preferably formed of a material such as rubber from the viewpoint of easy removal.

  When such a long member 40 </ b> B and the attachment jig 45 are used, the attachment position of the moving jig 46 can be freely set in the groove 402. For this reason, since the position of the pulley 41A can be set arbitrarily, the crossing position of the wire 3 can be set freely.

  FIG. 12 is a diagram illustrating an arrangement example 1 to an arrangement example 4 of the wire 3. Arrangement Example 1 to Arrangement Example 4 shown in FIG. 12 are all plan views of the stage 2 viewed from the + Z side. Arrangement example 1 crosses the wire 3 along the X direction. This is an arrangement similar to the embodiment shown in FIGS.

  Arrangement Example 2 crosses the wire 3 along the Y direction. In this case, a positioning unit 4 (or positioning unit 4A) for folding the wire 3 may be disposed on each of the + Y side and the -Y side of the stage 2.

  In the arrangement example 3, the wire 3 is crossed not only in the X direction but also in the Y direction. In this case, the positioning part 4 (or positioning part 4A) may be arranged at + X and -X, and + Y and -Y of the stage 2, and the wire rod may be folded back. One wire 3 may be folded and arranged, or a plurality of wires 3 may be combined and arranged. As shown in the drawing, if one wire 3 is folded and arranged so as to draw a single stroke, the wire 3 can be attached to and removed from the stage 2 more efficiently.

  Arrangement Example 4 is an example in which the wire 3 is crossed obliquely with respect to the X direction and the Y direction, and the wire 3 is crossed. Also in this case, if the single wire 3 is folded and arranged so as to draw a single stroke, the wire 3 can be efficiently attached to and detached from the stage 2.

  FIG. 13 is a partial schematic cross-sectional view showing an arrangement example in which the wires 3 are arranged so as to intersect each other. The first linear portion 31 and the second linear portion 32 shown in FIG. 13 are part of the same wire 3 or different wires 3. The first linear portion 31 crosses the surface of the stage 2 along the Y direction. In addition, the second linear portion 32 extends in the X direction that intersects (here, is orthogonal) to the Y direction.

  As illustrated, when the first linear portion 31 intersects with the plurality of second linear portions 32, the first linear portion 31 alternately passes through the upper position and the lower position of each second linear portion 32. Thus, by making the wire 3 cross so as to be knitted, the substrate 90 can be supported in a dot shape at each crossing portion (intersections P1, P2, P3). Thereby, the contact area between the substrate 90 and the wire 3 can be reduced. Therefore, the substrate 90 can be uniformly heat-treated.

{3. Modification}
Although the embodiment has been described above, the present invention is not limited to the above, and various modifications are possible.

  For example, in the first embodiment, the hook 41 that is a latching portion pulls the wire 3 downward at a height lower than the surface of the stage 2. For this reason, the protruding part from the stage 2 in the wire 3 is pulled down. For example, if the hook 41 pulls the wire 3 at the height of the surface of the stage 2 and toward the outside (side) of the stage 2, the wire 3 can be suppressed from being pulled downward. Thereby, it is possible to prevent the wire 3 from being broken at the corners of the stage 2.

  In the first embodiment, the positioning portions 4 arranged on both side surfaces of the stage 2 are all hooked by the elastic members 54. However, one may be hooked by the elastic member 54 and the other may be hooked by a structure different from the mode using the elastic member 54. As a configuration example of such a structure, for example, a configuration in which the long member 40 is directly fixed to the plate-like member 51 is conceivable.

  In the above embodiment, the case where the substrate processing apparatus 1 is configured as a pre-bake unit in the substrate processing system 100 has been described. However, the present invention is also effective in the substrate processing apparatus configured as the dehydrated bake unit 12 or the post bake unit 18 in the substrate processing system 100.

  In the above-described embodiment, the substrate processing apparatus that heats the substrate has been described. However, the present invention is also effective in a substrate processing apparatus that cools a substrate. By cooling the stage, the substrate placed on the wire on the stage surface can be cooled. As the configuration for cooling the stage, various configurations such as a configuration using a Peltier element and a configuration in which a flow path for flowing cooling water is provided in the stage are conceivable. The present invention is also effective when the substrate is left to cool naturally.

  In the above embodiment, the case where the processing target of the substrate processing apparatus is a glass substrate for a liquid crystal display device has been described. However, substrates to be processed include semiconductor wafers, glass substrates for plasma displays, glass or ceramic substrates for magnetic / optical disks, glass substrates for organic EL, glass substrates or silicon substrates for solar cells, other flexible substrates, printed boards, etc. Various substrates to be processed for electronic devices may be used.

  Although the present invention has been described in detail, the above description is illustrative in all aspects, and the present invention is not limited thereto. It is understood that countless variations that are not illustrated can be envisaged without departing from the scope of the present invention. In addition, the configurations described in the above embodiments and modifications can be appropriately combined or omitted as long as they do not contradict each other.

DESCRIPTION OF SYMBOLS 100 Substrate processing system 1, 1A Substrate processing apparatus 2, 2A Stage 23 Heater 3 Wire material 30 Folding part 31 First linear part 32 Second linear part 4, 4A Positioning part 40, 40A, 40B, 401 Long member (long Scale)
402 Groove 41 Hook (Hook)
41A pulley (hanging part)
411 Connection part 42, 42A Mounting hole (mounting structure)
43 End holding jig 44 Winding jig 45 Mounting jig 46 Moving jig 47 Fixing jig 51 Plate-like member 52 Rail 53 Fixing part 54 Elastic member (biasing mechanism)
55 Detector 90 Substrate P1, P2, P3 Intersection

Claims (10)

A substrate processing apparatus for processing a substrate,
A stage for thermally treating the substrate;
One or more wire rods arranged on the surface of the stage and crossing the surface of the stage a plurality of times by turning back; and
A positioning portion that contacts a folded portion of the wire, and defines a transverse position of the wire on the surface of the stage;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The positioning part is
A long portion disposed on a side of the stage;
A plurality of hooks that are attached to the long part and hook the wire.
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 2,
A biasing mechanism that pulls the wire hooked on the hooking portion by biasing the long portion;
A substrate processing apparatus further comprising: The substrate processing apparatus according to claim 3, wherein
The biasing mechanism is
An elastic member that connects between the long portion and the fixed portion of the stage, and biases the long portion toward the fixed portion;
A substrate processing apparatus. The substrate processing apparatus according to claim 3 or 4, wherein
A detector for detecting movement of the elongated portion in a direction biased by the biasing mechanism;
A substrate processing apparatus further comprising: A substrate processing apparatus according to any one of claims 2 to 5,
The long part is
A substrate processing apparatus for attaching the latching portion, wherein the substrate processing apparatus has an attachment structure in which an attachment position of the latching portion in the long portion is variable. The substrate processing apparatus according to claim 6,
The said mounting structure is a substrate processing apparatus which is the structure which attaches | detaches the said latching | locking part with respect to a elongate part so that attachment or detachment is possible. The substrate processing apparatus according to any one of claims 2 to 7,
The long part is
A substrate processing apparatus having a plurality of long members arranged in a row along the stage. The substrate processing apparatus according to any one of claims 2 to 8,
The long part is
A winding unit that winds and holds an end of the wire,
A substrate processing apparatus. The substrate processing apparatus according to any one of claims 1 to 9,
The one or more wires are
A first linear portion that traverses the surface of the stage along a first direction;
A plurality of second linear portions that cross the surface of the stage along a direction intersecting the first direction,
The substrate processing apparatus, wherein the first linear portion alternately passes through an upper position and a lower position of each second linear portion when intersecting the plurality of second linear portions.

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