JP2015175028A - Production method of vapor deposition mask device with substrate, and vapor deposition mask with substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a production method of a vapor deposition mask device with a substrate capable of imparting tension having a proper value to a vapor deposition mask, and executing plating treatment efficiently, highly accurately, stably and productively.SOLUTION: A production method of a vapor deposition mask device with a substrate includes steps for: forming a multi-surfaced resist pattern 3 for plating treatment corresponding to a plurality of vapor deposition masks; cutting a glass substrate 1 slenderly; and forming a vapor deposition mask 2 by plating treatment by using the resist pattern 3 as a mask.

Description

  The present invention relates to a method of manufacturing a deposition mask device with a substrate that can apply an appropriate value of tension to the deposition mask, and a deposition mask with a substrate.

  Conventionally, a method of forming a thin film with a desired pattern by using a vapor deposition mask including through holes arranged in a desired pattern is known. In recent years, vapor deposition is sometimes used when a very expensive material is deposited, for example, when an organic material is vapor deposited on a product at the time of manufacturing an organic EL display device. In general, the vapor deposition mask can be manufactured by forming a through hole in a metal plate by etching using a photolithography technique (for example, Patent Document 1). In such a case, it is considered that a deposition mask with a substrate is formed by forming a plating mask on the substrate, and tension is applied to the deposition mask with a substrate. Furthermore, there is a need for a deposition mask with a substrate that is suitable for ultra-high definition displays.

JP 2004-39319 A

  The vapor deposition mask having such a configuration is bonded to a frame made of a metal material or the like, and thus a vapor deposition mask device including the vapor deposition mask and the frame is obtained. By the way, when adhering the vapor deposition mask to the frame, the vapor deposition mask is positioned on the frame and bonded after physically applying tension to the vapor deposition mask.

  On the other hand, it is also considered that the vapor deposition mask is produced by plating, but in this case as well, the work of uniformly applying tension to the vapor deposition mask when bonding the vapor deposition mask to the frame is not easy.

  When the plating mask is made of a single foil, the total pitch varies greatly due to variations in plating internal stress, and cannot be used for a large display or a small high-definition display. For this reason, plating masks have existed from the past, but there are very few practical examples.

  The present invention has been made in consideration of such points, and can form a vapor deposition mask by plating, and can easily and surely apply an appropriate value of tension to the vapor deposition mask. Further, it is an object of the present invention to provide a method for manufacturing a deposition mask device with a substrate and a deposition mask with a substrate that can efficiently carry out a plating process and are suitable for an ultra-high-definition display.

  The present invention provides a resist pattern for plating treatment on a glass substrate, the step of forming a multi-layered, multi-rowed resist pattern corresponding to a plurality of vapor deposition masks, and an elongated glass substrate. A vapor deposition mask having a perforated region and a non-perforated region surrounding the perforated region on a substrate on which a resist pattern is formed by being cut into a strip shape, and a plating process using the resist pattern as a mask And a step of forming a deposition mask with a substrate.

  The present invention is a method of manufacturing a deposition mask device with a substrate, wherein resist patterns adjacent to each other in the elongated direction on a glass substrate cut into an elongated shape are continuous with each other without any interval.

  The present invention is a method of manufacturing a deposition mask device with a substrate, characterized in that resist patterns adjacent in the elongated direction on a glass substrate cut in the elongated direction are arranged at intervals.

  This invention is a manufacturing method of the vapor deposition mask apparatus with a board | substrate characterized by cut | disconnecting a glass-made board | substrate in the shape of a long thin strip.

  The present invention includes a glass substrate, a plurality of vapor deposition masks formed by being plated on the substrate, and having a perforated region and a non-perforated region surrounding the perforated region. The vapor deposition mask is a vapor deposition mask with a substrate, which is arranged in an elongated shape.

  According to the present invention, the vapor deposition mask can be formed by plating treatment, and an appropriate value of tension can be reliably applied to the vapor deposition mask, and the plating treatment can be performed efficiently and with high definition. The production can be carried out stably, and a deposition mask with a substrate suitable for an ultra-high-definition display can be manufactured.

1A, 1B, and 1C are diagrams for explaining an embodiment of the present invention, and are schematic perspective views showing a method of manufacturing a vapor deposition mask apparatus including a vapor deposition mask. FIG. 2 is a diagram for explaining a method of vapor deposition using a vapor deposition mask device. 3A to 3D are diagrams showing a method for manufacturing a substrate-attached vapor deposition mask. 4A to 4D are diagrams showing a method for manufacturing a deposition mask with a substrate. FIGS. 5A to 5E are cross-sectional views illustrating a method for manufacturing a substrate-attached vapor deposition mask. 6A to 6C are cross-sectional views illustrating a method for manufacturing a substrate-attached vapor deposition mask. FIG. 7 is a cross-sectional view showing a resist pattern formed on the substrate. 8A, 8B, 8C, and 8D are cross-sectional views showing a resist pattern as a comparative example formed on a substrate. FIGS. 9A and 9B are views showing the cross-sectional shape of a resist pattern based on the characteristics of the substrate. FIGS. 10A and 10B are operation diagrams showing proximity exposure. FIG. 11 is a plan view showing a substrate-attached vapor deposition mask. FIG. 12 is a plan view of a substrate with a resist pattern showing a modification of the present invention. FIG. 13 is a plan view of a deposition mask with a substrate showing a modification of the present invention. FIG. 14 is a plan view showing a deposition mask with a substrate including a fixing portion according to a modification of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  FIGS. 1-14 is a figure for demonstrating embodiment and its modification by this invention. In the following embodiments and modifications thereof, a method for manufacturing an evaporation mask device used for patterning an organic light emitting material on a glass substrate in a desired pattern when manufacturing an organic EL display device will be described as an example. To do. However, the present invention is not limited to such an application, and the present invention can be applied to a vapor deposition mask device and a method for manufacturing the vapor deposition mask device used for various purposes.

  In the present specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other only based on the difference in names. For example, “plate” is a concept that includes members that can be called sheets and films. Therefore, “metal plate” is distinguished from members called “metal sheet” and “metal film” only by the difference in name. I don't get it.

  In addition, “plate surface (sheet surface, film surface)” means a target plate-like member (sheet-like) when the target plate-like (sheet-like, film-like) member is viewed as a whole and globally. It refers to the surface that coincides with the plane direction of the member or film-like member. Moreover, the normal direction used with respect to a plate-like (sheet-like, film-like) member refers to the normal direction with respect to the plate | board surface (sheet surface, film surface) of the said member.

  Furthermore, as used in this specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, length and angle values, etc. Without being bound by meaning, it should be interpreted including the extent to which similar functions can be expected.

  First, an example of a vapor deposition mask apparatus including a vapor deposition mask that can be manufactured by the vapor deposition mask manufacturing method according to the present embodiment will be described mainly with reference to FIGS. 1 (a), (b), (c) and FIG. Here, FIG. 1 (a) (b) (c) is a perspective view which shows the vapor deposition mask apparatus containing a vapor deposition mask, and its manufacturing method.

  The vapor deposition mask apparatus 10 shown in FIGS. 1A, 1B and 1C has a plurality of vapor deposition masks 20 made of a rectangular metal plate and each vapor deposition mask 20 bonded thereto, and this vapor deposition mask 20 is held. And a frame 15 (see FIG. 1C). Each vapor deposition mask 20 includes a metal plate 21 having a first surface 21a and a second surface 21b opposite to the first surface 21a. The metal plate 21 includes a first surface 21a and a second surface 21b. A plurality of through holes 25 extending therebetween are formed. As shown in FIG. 2, the vapor deposition mask device 10 is supported in the vapor deposition device 90 so that the vapor deposition mask 20 faces the glass product 92. And the vapor deposition mask 20 and the glass product 92 are urged | biased by the magnet not shown in figure.

In the vapor deposition apparatus 90, a crucible 94 for accommodating a vapor deposition material (for example, an organic light emitting material) 98 and a heater 96 for heating the crucible 94 are disposed below the glass substrate 92 sandwiching the vapor deposition mask apparatus 10. Has been. The vapor deposition material 98 in the crucible 94 is vaporized or sublimated by heating from the heater 96 and adheres to the surface of the glass product 92. As described above, a large number of through holes 25 are formed in the vapor deposition mask 20, and the vapor deposition material 98 adheres to the glass product 92 through the through holes 25. As a result, the vapor deposition material 98 is formed on the surface of the glass product 92 in a desired pattern corresponding to the position of the through hole 25 of the vapor deposition mask 20.

  As shown in FIG.1 (c), in this Embodiment, the vapor deposition mask 20 consists of the metal film (metal plate) 21 formed by the plating process, and is substantially square shape in planar view, and more precisely planar view. Has a substantially rectangular outline. The metal plate 21 of the vapor deposition mask 20 includes a perforated region 22 in which the through hole 25 is formed and a non-perforated region 23 in which the through hole 25 is not formed and occupies a region surrounding the perforated region 22. Have. As shown in FIG. 1, each of the perforated regions 22 has a substantially rectangular shape in a plan view, more precisely, a substantially rectangular shape in a plan view. The perforated region may have a stripe shape (strip shape), a pentagonal shape, or a hexagonal shape in plan view.

  In the illustrated example, the plurality of perforated regions 22 are arranged at predetermined intervals along one direction parallel to one side of the vapor deposition mask 20. In the illustrated example, one perforated region 22 corresponds to one organic EL display device. That is, according to the vapor deposition mask device 10 (vapor deposition mask 20) shown in FIGS. 1A, 1B, and 1C, vapor deposition with multiple surfaces is possible.

  Further, as shown in FIGS. 1A, 1B, and 1C, the plurality of through holes 25 formed in each perforated region 22 are arranged side by side at equal intervals in the perforated region 22. Yes.

  As described above, the vapor deposition mask device 10 includes a plurality of vapor deposition masks 20 and a frame 15 to which the vapor deposition masks 20 are bonded to hold the vapor deposition mask 20. An opening 16 corresponding to the hole region 22 is formed.

  A plurality of warpage prevention plates may be attached to the back surface of the frame 15. Each vapor deposition mask 20 held on the surface of the frame 15 has a belt-like shape having a plurality of perforated regions 22 arranged in succession, and the warpage preventing plate has a belt-like shape like the vapor deposition mask 20. 20 are arranged in the same direction as the longitudinal direction.

  As will be described later, the vapor deposition mask 20 is formed by performing a plating process on the substrate 1 having the glass substrate body 1a and the ITO film 1b formed on the substrate body 1a (FIG. 3A). ) (B) (c) to FIG. 7 (a) (b) (c)).

  In this case, the evaporation mask 20 </ b> A with the substrate is formed by the evaporation mask 20 and the glass substrate 1. Then, by removing the substrate 1 from the evaporation mask with substrate 20A, the evaporation mask 20 according to the present embodiment is obtained.

  The number of vapor deposition masks 20 arranged on the surface of the frame 15 is not particularly limited.

  A single vapor deposition mask 20 may be disposed on the surface of the frame 15, and two, three, or four or more vapor deposition masks 20 may be disposed on the frame 15.

  The vapor deposition mask 20 and the warp prevention plate are fixed to the frame 15 by welding or an adhesive.

  Further, the number of warpage preventing plates attached to the back surface of the frame 15 is not particularly limited. The warpage preventing plate is made of a material having the same thermal expansion coefficient as that of the vapor deposition mask 20, preferably the same material. When tension is applied to the vapor deposition mask 20 disposed on the surface of the frame 15 using thermal expansion as will be described later, the thermal expansion is also used for the warp prevention plate disposed on the back surface of the frame. Apply tension. This prevents warping of the vapor deposition mask device 10 as a whole.

  When the frame 15 has sufficient rigidity, it is not necessary to provide a warp preventing plate on the back surface of the frame 15.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, a method of manufacturing the evaporation mask with substrate 20A will be described mainly with reference to FIGS. 3 (a), (b), (c), and (d) to FIGS.

  First, as shown in FIGS. 3A and 5A, a glass substrate body 1a is prepared. In this case, as the substrate main body 1a, non-alkali glass or soda glass having a thickness of 0.7 mm can be used, and its thermal expansion coefficient is 3 to 9 ppm / ° C.

  Next, as shown in FIGS. 3B and 5B, an ITO film 1b is formed on the substrate body 1a by sputtering. In this case, the film thickness of the ITO film 1b is, for example, 1500 mm. By increasing the thickness of the ITO film 1b, the resistance value of the ITO film 1b can be lowered and the plating process can be easily performed.

  Thus, the glass substrate 1 is obtained from the substrate body 1a and the ITO film 1b.

  Next, as shown in FIGS. 3C and 5C, a negative resist film 3A is formed on the ITO film 1b of the substrate 1 made of glass. In this case, the negative resist solution 3A can be formed on the substrate 1 by applying a negative resist solution on the substrate 1 and then baking the negative resist solution. The film thickness of the negative resist film 3A is preferably determined from the hole pitch, opening diameter, vapor deposition angle, and the like, and is, for example, about 7 to 18 μm.

  Next, as shown in FIGS. 3D and 5D and 5E, an exposure mask (having a quartz glass substrate 5a and a light-shielding pattern 5b on the quartz glass substrate 5a with respect to the negative resist film 3A). Using a photomask 5, proximity exposure with UV light is performed and baking is performed. Thereafter, the exposure mask 5 is removed from the substrate 1, and the negative resist film 3A is developed with a developer, whereby the resist pattern 3 can be formed on the substrate 1 (FIGS. 4A and 6A). reference).

  The resist pattern 3 formed on the substrate 1 has a tapered cross section that tapers toward the substrate 1. Therefore, as described later, when the plating layer 2 is formed in the space between the resist patterns 3 by plating, the plating layer 2 has a cross-sectional shape extending toward the substrate 1.

  Next, the process of forming the resist pattern 3 on the substrate 1 will be further described with reference to FIGS.

  As shown in FIG. 10A, proximity exposure is performed on the negative resist film 3A using an exposure mask (photomask) 5 having a quartz glass substrate 5a and a light shielding pattern 5b on the quartz glass substrate 5a. In this case, the gap g between the negative resist film 3A and the exposure mask 5 can be widened. In this case, since the UV light L passing through the exposure mask 5 reaches the negative resist film 3A while expanding, the light intensity distribution on the surface of the negative resist film 3A has a gentle mountain shape. For this reason, an exposed portion 3a having a cross section with a large taper angle is formed in the negative resist film 3A. A portion of the resist film 3A other than the exposed portion 3a becomes an unexposed portion 3b.

  Therefore, by developing and baking the negative resist film 3A after exposure, the resist pattern 3 having a taper-shaped cross section tapering toward the substrate 1 can be reliably formed (FIG. 10A). .

  On the other hand, as shown in FIG. 10B, when the gap g between the negative resist film 3A and the exposure mask 5 is reduced, the light intensity distribution on the surface of the negative resist film 3A has a steep mountain shape. Make. For this reason, an exposed portion 3a having a cross section with a large taper angle is formed in the negative resist film 3A. A portion of the resist film 3A other than the exposed portion 3a becomes an unexposed portion 3b.

  In this case, when the negative resist film 3A is developed and baked after exposure, the cross section of the resist pattern 3 has a rectangular shape or a tapered shape with a tapered angle. For this reason, it is difficult to ensure that the cross section of the resist pattern 3 is tapered.

  Through the above-described steps, a resist pattern 3 having a tapered shape that tapers toward the substrate 1 can be formed on the substrate 1 (see FIGS. 4A and 6A).

  In this case, the substrate 1 and the resist pattern 3 constitute a resist pattern-attached substrate 1A.

  Thus obtained substrate 1A with a resist pattern has a resist pattern 3 for a multi-stage multi-row evaporation mask 2.

  In FIG. 4A, the resist pattern 3 of the substrate 1A with a resist pattern is a resist pattern for the vapor deposition mask 2 that is multi-layered in 3 steps × 3 rows, but the shape of the resist pattern 3 is 3 steps. The resist pattern 3 may be formed in a larger number of multi-stage multi-rows without being limited to × 3 rows.

  When plating processing is performed on such a large-sized substrate 1A with a resist pattern, it is necessary to increase the size of the plating processing apparatus, which increases the manufacturing cost. In addition, when the plating process is performed on the large substrate 1A with a resist pattern, the film thickness of the plating layer 2 formed by the plating process varies greatly, resulting in wrinkles during stretching. Problems such as variations occur.

  Therefore, in the present embodiment, a resist pattern having a resist pattern 3 of 3 steps × 1 row is obtained by cutting the glass substrate 1 of the substrate 1A with a resist pattern having the resist pattern 3 of 3 steps × 3 rows into an elongated shape. Attached substrate 1A (see FIG. 4B).

  Next, the plating layer 2 can be formed between the resist patterns 3 by plating the resist pattern-coated substrate 1A (see FIGS. 4C and 6B). In this case, the thickness (height) of the plating layer 2 is lower than the height of the resist pattern 3.

  Next, as shown in FIGS. 4D and 6C, the resist pattern 3 is removed from the substrate 1 to leave the plating layer 2 on the substrate 1. As a result, the vapor deposition mask 20 made of the plating layer 2 can be formed on the substrate 1. In this case, the vapor deposition mask 20 made of the plating layer 2 has a perforated region 22 having a through hole 25 corresponding to the resist pattern 3 and a non-porous region 23 surrounding the perforated region 22.

  In this way, the substrate-equipped vapor deposition mask 20A is obtained from the substrate 1 and the vapor deposition mask 20 formed of the plating layer 2 formed on the substrate 1 by plating.

  In this case, the vapor deposition mask 20 includes a Ni plating layer or a Ni alloy plating layer 2 having a thickness smaller than that of the resist film 3A.

  As described above, the plating layer 2 constituting the vapor deposition mask 20 of the vapor deposition mask with substrate 20 </ b> A has a cross section with a tapered shape that expands toward the substrate 1.

  Next, the action of cutting the glass substrate 1 of the resist-pattern-equipped substrate 1A into an elongated shape will be further described with reference to FIGS.

  As described above, the shape of the resist pattern 3 of the resist pattern-attached substrate 1A is not limited to 3 stages × 3 rows, and the resist patterns 3 may be formed in many more stages and multiple rows.

  By cutting the glass substrate 1 of the resist pattern-attached substrate 1A on which the resist patterns 3 are formed in multiple stages and multiple rows in this manner, the resist pattern-attached substrate 1A having, for example, 6 stages × 1 rows of resist patterns 3 is cut. Can be produced. Then, the plating layer 2 is formed between the resist patterns 3 by plating the resist-patterned substrate 1A having the resist pattern 3 of 6 steps × 1 row to have the evaporation mask 20 of 6 steps × 1 row. A substrate-attached vapor deposition mask 20A is obtained (see FIG. 11).

  A deposition mask 20A with a substrate shown in FIG. 11 has a deposition mask 20 of 6 stages × 1 row. Further, as shown in FIG. 11, the vapor deposition mask 20 of the vapor deposition mask with substrate 20A adjacent in the elongated direction and the resist pattern 3 of the substrate with resist pattern 1A corresponding to the vapor deposition mask with substrate 20A are spaced apart from each other. Are continuous with each other.

  Thus, the glass substrate 1 can be used effectively by arranging the vapor deposition masks 20 of the vapor deposition masks with substrates 20A adjacent to each other in the elongated direction.

  Further, by cutting the glass substrate 1 of the resist pattern-attached substrate 1A on which the multi-stage multi-row resist patterns 3 are formed into an elongated shape, for example, a resist pattern-provided substrate 1A having 6-stage x 1-row resist patterns 3 Since it can be produced, the plating apparatus can be miniaturized and the plating process can be carried out efficiently. Further, the size of the resist pattern-attached substrate 1A can be reduced, and variations in the thickness of the plating layer 2 formed by plating can be suppressed.

  As shown in FIG. 12, the substrate 1A with a resist pattern includes a glass substrate 1 and a multi-stage multi-row resist pattern 3 provided on the glass substrate 1, but the substrate 1A with a resist pattern is provided. When the glass substrate 1 is cut into an elongated shape, the resist patterns 3 adjacent in the elongated direction may be arranged with a gap G.

  As shown in FIG. 13, when the elongated substrate-attached evaporation mask 20 </ b> A is manufactured using the elongated resist-patterned substrate 1 </ b> A, the evaporation mask 20 adjacent in the elongated direction is the resist adjacent in the elongated direction. Similar to the pattern 3, they are arranged with a gap G.

  As described above, in the elongated substrate-attached deposition mask 20A, when the deposition masks 20 adjacent to each other in the elongated direction are arranged with a gap G, the film thickness variation of the plating layer 2 can be more reliably performed during the plating process. Can be suppressed. Moreover, the pitch fluctuation of the vapor deposition mask 20 at the time of peeling the board | substrate 1 from 20A of vapor deposition masks with a board | substrate can be suppressed.

  Furthermore, when the vapor deposition masks 20 adjacent to each other in the elongate direction of the vapor deposition mask with substrate 20A are arranged at intervals G, the vapor deposition mask when the vapor deposition mask with substrate 20A is secured to the frame 15 via the adhering portion 65. Twenty pitch variations can be accommodated in each deposition mask 20 (see FIG. 14).

  Next, the characteristics of the plating layer 2 having a tapered cross section extending toward the substrate 1 will be described with reference to FIGS.

  As shown in FIG. 7, the cross section of the plating layer 2 constituting the evaporation mask with substrate 20 </ b> A has a tapered shape that expands toward the substrate 1. In this case, it is preferable that the taper shape of the plating layer 2 has a taper angle β that substantially matches the vapor deposition angle α of the vapor deposition material 98 in the vapor deposition apparatus 90 shown in FIG.

  Here, the vapor deposition angle α of the vapor deposition material 98 refers to an angle range when the vapor deposition material 98 approaches the vapor deposition mask 20 in the vapor deposition apparatus 90.

  Thus, the shadow of the vapor deposition mask 2 can be made substantially zero by making the taper-shaped taper angle β (eg, 45 °) of the plating layer 2 substantially coincide with the vapor deposition angle α (eg, 45 °).

  Here, FIGS. 8A, 8B, and 8C show a deposition mask with substrate 20A as a comparative example.

  As shown in FIG. 8A, the arrangement pitch of the resist pattern 3 and the plating layer 2 of the evaporation mask with substrate 20A is large, and the cross section of the plating layer 2 is substantially rectangular. In this case, even if the cross section of the plating layer 2 is substantially rectangular, the influence of the shadow is small because the arrangement pitch is large.

  On the other hand, as shown in FIGS. 8B and 8C, when a high-definition display is manufactured, the arrangement pitch of the resist pattern 3 and the plating layer 2 of the evaporation mask with substrate 20A is reduced. In this case, if the plating layer 2 has a rectangular cross section, the shadow of the vapor deposition mask 20 becomes large when the vapor deposition angle α is 45 °.

  In FIGS. 8B and 8C, it is conceivable to further reduce the thickness of the plating layer 2 in consideration of the influence of shadows, but in this case, the strength of the vapor deposition mask 20 is reduced.

  In contrast, according to the present embodiment, the cross section of the plating layer 2 is tapered so as to expand toward the substrate 1, and the taper angle β of the taper shape is substantially matched with the vapor deposition angle α. The shadow of the vapor deposition mask 20 can be made substantially zero without reducing the film thickness.

  The substrate 1 is composed of the glass substrate body 1a and the ITO film 1b as described above, so that the UV light is not reflected on the substrate 1 when the negative resist film 3A is exposed. 1 is transmitted. Therefore, the resist pattern 3 can be accurately manufactured by accurately forming the exposed portion 3a by UV light on the negative resist film 3A (see FIG. 9A).

  On the other hand, when the substrate 1 made of a reflective material is used, it is considered that the UV light is partially reflected from the substrate 1 when the negative resist film 3A is exposed. The protrusion 8 of the exposed portion 3a is formed on the pattern 3 (see FIG. 9B).

  Thus, according to the present embodiment, by using the glass substrate 1, the exposed portion 3a and the resist pattern 3 by UV light can be formed with high accuracy.

  Next, the vapor deposition mask device 10 is manufactured using the vapor deposition mask with substrate 20A thus obtained.

  First, as shown in FIG. 1A, a plurality of the above-described deposition masks 20 with a substrate are prepared. In this case, the deposition mask 20 of each substrate deposition mask 20A has a perforated region 22 and a non-perforated region 23 surrounding the perforated region 22, and a plurality of perforated regions 22 of the deposition mask 20 are continuously arranged. Each vapor deposition mask 20 has a strip shape. The vapor deposition mask 20 is made of a Ni plating layer or a Ni alloy plating layer, and its thermal expansion coefficient is 12.8 ppm / ° C., for example, when the vapor deposition mask 20 is made of a Ni plating layer. The substrate 1 of the evaporation mask with substrate 20A is made of glass having a thermal expansion coefficient of 3 to 9 ppm / ° C.

  Similarly, a frame 15 having an opening 16 and a thickness of 3 to several tens of mm is prepared, and this frame 15 is placed on the thermal control panel 70. In this case, the frame 15 is made of 36Ni invar material having a thermal expansion coefficient of around 1 ppm / ° C. For this reason, the frame 15 has a thermal expansion coefficient smaller than the thermal expansion coefficient of both the substrate 1 and the vapor deposition mask 20 of the vapor deposition mask with substrate 20A.

  Next, as shown in FIG. 1A, each deposition mask with substrate 20 </ b> A is placed on a frame 15 having an opening 16. In this case, a positioning mark is provided on the surface of the frame 15, and a positioning mark corresponding to the positioning mark of the frame 15 is also provided on each substrate-deposited mask 20 </ b> A. The mask 20A can be accurately positioned.

  In this manner, the substrate-attached vapor deposition mask 20A and the frame 15 are laminated on the heat control panel 70 in order from the top, and the laminate 10A including the substrate-equipped vapor deposition mask 20A and the frame 15 is manufactured.

  The thermal control panel 70 functions as a hot plate that heats the stacked body 10A or a cold plate that cools the stacked body 10A.

  Next, in FIG.1 (b), 10 A of laminated bodies are heated on the heat control board 70 from room temperature of 20 degreeC to 50 degreeC, for example.

  At this time, the laminated body 20A is heated to 50 ° C. as a whole on the thermal control panel 70, and the frame 15 made of 36Ni invar material in the laminated body 20A does not thermally expand greatly, but each substrate deposition mask 20A. Each expands based on its own coefficient of thermal expansion. In this state, laser light is irradiated from the glass substrate 1 side to the non-porous region 23 of the substrate-attached vapor deposition mask 20A on the frame 15, and the non-porous region 23 of the substrate-equipped vapor deposition mask 20A is welded to the frame 15. Let In this way, the evaporation mask with substrate 20A is fixed to the frame 15 via the fixing portion 65 (see FIG. 1B).

  Thereafter, the laminated body 10A is lowered from the thermal control panel 70, and cooled back to room temperature. In this case, the shape of the frame 15 made of 36Ni invar material hardly changes, but the evaporation mask with substrate 20A is cooled to room temperature and thermally contracted. Since the evaporation mask with substrate 20A is fixed to the frame 15, an appropriate tension can be applied to the evaporation mask with substrate 20A along with the thermal contraction action.

  Then, about each vapor deposition mask 20A with a board | substrate on the flame | frame 15, the board | substrate 1 is peeled from the laminated body 10A (refer FIG.1 (c)).

  In this way, the substrate 1 of the evaporation mask with substrate 20A is peeled from the laminated body 10A, and the evaporation mask 20 fixed on the frame 15 is obtained.

  As described above, according to the present embodiment, the laminated body 10A including the substrate-attached vapor deposition mask 20A and the frame 15 is heated on the thermal control panel 70, and in this state, the substrate-equipped vapor deposition mask 20A and the warpage prevention plate 60 are provided. Is fixed and adhered to the frame 15, and then the laminate 10A is cooled to room temperature.

Thereby, an appropriate tension can be applied to the evaporation mask with substrate 20A and the evaporation mask 20. Further, the deposition mask with substrate 20A is physically pulled and the heating temperature by the thermal control panel 70 is set to a desired value as compared with the case where the deposition mask 20A with substrate is fixed to the frame 15. An appropriate value of tension can be applied uniformly to the frame 15 with respect to 20A and the vapor deposition mask 20.

  Further, the non-hole region 23 of the evaporation mask with substrate 20A is bonded onto the frame 15 through the fixing portion 65, and the fixing portion 65 is formed on the left and right of each of the perforated regions 22 along the width direction of the evaporation mask with substrate 20A. By providing continuously (refer FIG.1 (c)), tension | tensile_strength can be provided with respect to both the longitudinal direction and the width direction of the vapor deposition mask 20 in each perforated area | region 22 of 20A of vapor deposition masks with a board | substrate. it can.

  Furthermore, the cross section of the plating layer 2 of the vapor deposition mask 20 can be tapered, and the taper angle β of the taper can be made substantially coincident with the vapor deposition angle α. For this reason, the shadow of the vapor deposition mask 20 can be made substantially zero without reducing the film thickness of the plating layer 2. As a result, it is possible to obtain a vapor deposition mask 20 having a shadow of approximately 0 and having an appropriate strength.

  In addition, since the resist pattern-attached substrate 1A having the resist patterns 3 arranged in multiple stages and multiple rows can be cut into an elongated shape, for example, the resist pattern-attached substrate 1A having the resist patterns 3 of 6 steps × 1 row can be produced. The plating apparatus can be downsized and the plating process can be carried out efficiently. Further, the size of the substrate 1A with a resist pattern can be reduced, and the film thickness variation of the plating layer 2 formed by the plating process can be suppressed.

  Moreover, the dispersion | distribution of the film thickness distribution / internal stress of the plating layer 2 can be reduced. For this reason, the total pitch fluctuation is reduced, and this makes it possible to provide an ultra-high-definition display and improve the yield rate of products.

  Further, since the size of the resist pattern-provided substrate 1A can be reduced, even if a defect occurs in the one resist pattern-provided substrate 1A by plating, only the defective resist pattern-provided substrate 1A needs to be discarded. The other resist-patterned substrate 1A is not affected.

DESCRIPTION OF SYMBOLS 1 Substrate 1a Substrate body 1b ITO film 2 Plating layer 3 Resist pattern 3A Negative resist film 5 Exposure mask 10 Deposition mask apparatus 10A Laminate 15 Frame 16 Opening 20 Deposition mask 20A Substrate deposition mask 21 Metal plate 21a First surface 21b First Two surfaces 22 Perforated region 23 Non-perforated region 25 Through-hole 65 Adhering location 70 Thermal control panel

Claims (5)

A resist pattern for plating treatment on a glass substrate, the step of forming a multi-layered resist pattern corresponding to a plurality of vapor deposition masks, arranged in multiple rows, and multiple faces;
A step of cutting a glass substrate into an elongated shape;
Forming a vapor deposition mask having a perforated region and a non-perforated region surrounding the perforated region by plating using the resist pattern as a mask on a substrate that is cut into an elongated shape and formed with a resist pattern. The manufacturing method of the vapor deposition mask with a board | substrate characterized by the above-mentioned.   2. The method of manufacturing a vapor deposition mask device with a substrate according to claim 1, wherein the resist patterns adjacent to each other in the elongated direction on the glass substrate cut into an elongated shape are continuous with each other without any interval.   2. The method of manufacturing a deposition mask device with a substrate according to claim 1, wherein the resist patterns adjacent to each other in the elongated direction on the glass substrate cut in the elongated direction are arranged at intervals.   4. The method of manufacturing a vapor deposition mask device with a substrate according to claim 1, wherein the glass substrate is cut into an elongated shape in a line. A glass substrate;
A plurality of vapor deposition masks formed of a plating layer having a perforated region and a non-perforated region surrounding the perforated region;
The vapor deposition mask with a substrate, wherein the plurality of vapor deposition masks are arranged in an elongated shape.

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