JP2015171898A - Electronic component series and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress jumping out and dislocation of electronic components accommodated in a carrier tape.SOLUTION: An electronic component series 10 is configured by: a carrier tape 12 in which a number of accommodation parts 14 for accommodating electronic components 16 are formed in the longitudinal direction at predetermined intervals; the electronic components 16 accommodated in the accommodation parts 14; and a top tape 20 for covering an opening of the accommodation part 14. The carrier tape 12 and the top tape 20 are sealed by thermocompression-bonding so as to sandwich the accommodation parts 14 along the longitudinal direction. Out of a seal part 22 of the carrier tape 12 and the top tape 20, in a region where the accommodation part 14 is not formed, a bite part 24 in which biting with respect to the carrier tape 12 is large is formed. When the electronic component series 10 is folded to the top tape 20 side, a gap 28 between the top tape 20 and the carrier tape 12 is dislocated from above the accommodation part 14, so that jumping out of the electronic component 16 is suppressed.

Description

  The present invention relates to a series of electronic components containing electronic components and a method of manufacturing the same, and more specifically to prevention of jumping out of electronic components.

  The electronic component series in which the electronic components are packaged has a structure in which, for example, the electronic component is put into a component storage portion formed on a carrier tape and a top tape is attached. Specifically, as shown in FIG. 4A, the electronic component series 100 includes a carrier tape 12 in which a large number of storage portions 14 for storing the electronic components 16 are formed at predetermined intervals in the longitudinal direction, and the storage. The top tape 20 is bonded to the upper surface of the carrier tape 12 so as to cover the opening of the portion 14. On one side end side of the carrier tape 12, feed holes 18 that engage with automatic feed pins of the mounting apparatus are formed at appropriate intervals along the longitudinal direction of the carrier tape 12. The top tape 20 is formed with a layer (not shown) that is fused by heating and pressing. Then, as shown in FIG. 4 (B), the carrier tape 12 and the top tape 20 are heated and pressurized by a pair of crimping portions 34 protruding from the main body 32 so that the storage portion 14 is sandwiched therebetween. A seal portion 22 is formed and pasted. The electronic component series 100 is installed in an automatic surface mounting apparatus in such a taped state, and the electronic component 16 stored in the storage unit 14 is taken out while the top tape 20 is peeled off, and surface mounted on a substrate or the like. I will do it.

  In the electronic component series 100 having such a seal structure, when the carrier tape 12 is folded back in a state where a thin chip component called a low profile product is housed, a phenomenon that the electronic component 16 pops out may occur. That is, as shown in FIG. 4C, when the carrier tape 12 is reversely folded, that is, bent toward the top tape 20, a gap 102 is randomly generated between the carrier tape 12 and the top tape 20. Since the electronic component 16 jumps out of the storage unit 14 and is disposed obliquely or stands up (90 ° rotation) as indicated by an arrow in FIG. In some cases, it may enter a place other than 14 or the adjacent storage section 14. This is because the bending of the top tape 20 is larger than the bending of the carrier tape 12 when reversely folded (bending toward the top tape 20), and the relative position of the carrier tape 12 is shifted with respect to the top tape 20. by.

  When it is sandwiched between places other than the storage part 14, for example, a gap between the carrier tape 12 and the top tape 20, the electronic component 16 is damaged and not in a predetermined place, so that the mounting suction head does not operate, There is a disadvantage that the mounting efficiency is lowered. On the other hand, if the entire surface of the top tape 20 in contact with the carrier tape 12 is sealed or the space between the adjacent storage portions 14 is sealed, it is possible to suppress the movement of such low-profile electronic components. On the other hand, it is difficult to peel off the top tape 20, and the mountability may be significantly reduced.

  As a technique for reducing the mounting efficiency of electronic components, for example, there is a technique shown in Patent Document 1 below. According to the technology, a carrier tape having a plurality of storage recesses periodically along the longitudinal direction, an electronic component stored in each of the plurality of storage recesses, and a plurality of storage recesses of the carrier tape are provided so as to cover And a pair of adhesive portions that extend along the longitudinal direction of the carrier tape so as to sandwich the plurality of storage recesses and adhere the carrier tape and the cover tape, and at least one of the pair of adhesive portions is bonded. The bonding width of the portion is periodically increased corresponding to each of the plurality of storage recesses. By adopting such a structure, when peeling the cover tape from the carrier tape, the occurrence of vibration in the concave portion of the carrier tape is suppressed, the electronic components are prevented from tilting and scattering, and the mounting efficiency is prevented from being lowered. ing.

JP 2006-182399 A

  However, in the technique described in Patent Document 1, the relative position of the top tape 20 and the carrier tape 12 due to the bending of the top tape 20 when reversely folded becomes larger than the bending of the carrier tape 12. A solution to the deviation is not shown. That is, since prevention of positional deviation of low-profile electronic components is not taken into consideration, the above-described problem cannot be solved sufficiently.

  The present invention focuses on the above points, and an object of the present invention is to provide an electronic component series and a manufacturing method thereof that can prevent the electronic component from jumping out and being displaced.

  The electronic component series of the present invention includes a carrier tape in which a plurality of component storage portions for storing electronic components are formed at intervals along the longitudinal direction, an electronic component stored in the component storage portion, and the component storage A top tape that is sealed to the carrier tape so as to sandwich the component storage portion along the longitudinal direction. In the longitudinal direction of the carrier tape, the region where the component storage portion is not formed in the seal portion of the carrier tape and the top tape is more than the region where the component storage portion is formed. The carrier tape has a portion in which the top tape bites into the carrier tape.

  One of the main forms is characterized in that seal portions of the carrier tape and the top tape are separated from the component storage portion. Another aspect is characterized in that a thickness in the height direction when the electronic component is housed in the component housing portion is smaller than a thickness in the width direction.

  The method for manufacturing an electronic component series according to the present invention includes a step of storing the electronic component in a carrier tape in which a plurality of component storage portions for storing the electronic component are formed at intervals in the longitudinal direction, and the longitudinal direction of the carrier tape. Sealing a top tape covering the opening of the component storage portion along the longitudinal direction with the carrier tape so as to sandwich the component storage portion along the longitudinal direction, the carrier tape and the top In the step of sealing the tape, in the longitudinal direction of the carrier tape, the top tape bites into the carrier tape in a region where the component storage portion is not formed in a region where the component storage portion is formed. It is characterized by forming a large part.

  One of the main forms is that the step of sealing the carrier tape and the top tape is performed by thermocompression bonding the carrier tape and the top tape uniformly along the longitudinal direction of the carrier tape so as to sandwich the component storage portion. And a step of further pressurizing a portion where the component storage portion is not formed among the portions heat-pressed by the step.

  Another electronic component series of the present invention is manufactured by any one of the manufacturing methods described above. The above and other objects, features and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings.

  According to the present invention, an electronic component is stored in a plurality of storage portions formed at intervals in the longitudinal direction of the carrier tape, the opening of the storage portion is covered with a top tape, and the carrier tape is sandwiched between the storage portions. A seal portion is formed along the longitudinal direction of the. At that time, a portion of the seal portion where the top tape bites into the carrier tape is formed in a region where the storage portion is not formed, compared to a region where the storage portion is formed. For this reason, when the sealed carrier tape is bent in the direction of the opening of the storage unit, that is, when the electronic component series is reversely folded, the gap between the carrier tape and the top tape is not located on the storage unit. It is possible to suppress displacement and jumping out of the electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the electronic component series of Example 1 of this invention, (A) is an external appearance perspective view which shows the state which removed a part of top tape, (B) is the said (A) # A- # A line | wire It is sectional drawing which cut | disconnected along and was seen in the arrow direction. It is a figure which shows the state which reversely folded the electronic component series of the said Example 1 to the top tape side, (A) is a perspective view showing the cross section which cut | disconnected the electronic component series along the longitudinal direction, (B) It is sectional drawing which looked at (A) from the arrow F2 direction. It is sectional drawing which shows the manufacturing process of the electronic component series of the said Example 1. FIG. It is a figure which shows the electronic component series of background art, (A) is an external appearance perspective view which shows the state which removed a part of top tape, (B) is said (A) along a # B- # B line | wire. Sectional view cut and viewed in the direction of the arrow, (C) is a sectional view of section (A) cut along the line # C- # C and viewed in the direction of the arrow.

  Hereinafter, the best mode for carrying out the present invention will be described in detail based on examples.

  First, Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a series of electronic components according to the first embodiment. (A) is an external perspective view showing a state in which a part of a top tape is removed, and (B) is the above-described (A) # A- # A. It is sectional drawing cut | disconnected along the line and seeing in the arrow direction. FIG. 2 is a diagram showing a state in which the electronic component series is folded back to the top tape side, (A) is a perspective view showing a cross section of the electronic component series cut along the longitudinal direction, and (B) It is sectional drawing which looked at (A) from the arrow F2 direction. FIG. 3 is a cross-sectional view showing an example of the manufacturing process of the electronic component series according to the present embodiment. In this embodiment, as an electronic component stored in the carrier tape, a low-profile chip component in which the thickness in the height direction during storage is smaller than the thickness in the width direction is taken as an example. For example, the dimension in the height direction is 0.1 mm, and the thickness in the width direction is 0.5 mm. Resin or paper can be applied as the material of the carrier tape, and resin can be applied as the material of the top tape.

  As shown in FIG. 1A, the electronic component series 10 of this embodiment includes a carrier tape 12 in which a large number of storage portions 14 for storing electronic components 16 are formed at predetermined intervals in the longitudinal direction, and the storage portion. 14 and the top tape 20 bonded to the upper surface of the carrier tape 12 so as to cover the opening of the storage portion 14. On one side end side of the carrier tape 12, feed holes 18 that engage with automatic feed pins of the mounting apparatus are formed at appropriate intervals along the longitudinal direction of the carrier tape 12. The top tape 20 is formed with a heat-sealing layer 40 (not shown in FIG. 2) that is fused by heating. Then, the top tape 20 is heat-pressed against the carrier tape 12 to form the seal portion 22, whereby the opening portion of the storage portion 14 can be covered with the top tape 20.

  A pair of the seal portions 22 is formed along the longitudinal direction of the carrier tape 12 so as to sandwich the storage portion 14. The seal portion 22 is formed at a predetermined interval from the storage portion 14. In addition, the seal portion 22 has bite of the top tape 20 into the carrier tape 12 at a position corresponding to the space between the storage portion 14 and the storage portion 14 as shown in FIG. A larger biting portion 24 is formed. The depth of the biting portion 24 is, for example, about 0.13 to 0.15 mm.

  In the electronic component series 10 of the present embodiment, the top tape 20 is deformed as follows when reverse folding is performed, that is, when it is folded toward the top tape 20 side. As shown in FIGS. 2 (A) and 2 (B), in the region where the electronic component 16 is not stored (the region where the storage portion 14 is not formed), the top tape 20 is separated from the upper surface of the carrier tape 12 and the gap 28 is formed. Form. On the other hand, the top tape 20 is in close contact with the carrier tape 12 in a region where the electronic component 16 is stored (region where the storage portion 14 is formed). When this state is viewed in a cross section, the top tape 20 is deformed so that the storage portion 14 and the gap 28 are displaced as shown in FIG. That is, the top tape 20 is close to the storage portion 14, and the top tape 20 is deformed in a wave shape so that the top tape 20 is separated between the storage portions 14.

  For this reason, even if the carrier tape 12 is bent toward the top tape 20, the electronic component 16 does not jump out of the storage portion 14 or is not displaced, and the mounting efficiency can be improved. Further, in this embodiment, since the storage portion 14 and the seal portion 22 are separated from each other, even if the carrier tape 12 of the seal portion 22 is recessed, the storage portion 14 is not deformed and the low-profile electronic component 16 is formed. Can be stored without stress. For this reason, the crack of the low-profile electronic component 16 having a low strength can be prevented.

  Next, with reference to FIG. 3, an example of the manufacturing method of the electronic component series 10 of the present embodiment will be described. In the steps shown in FIGS. 3A to 3E below, the carrier tape 12 is intermittently fed in a direction indicated by an arrow in the figure by a predetermined length by a feeding device (not shown). And First, as shown in FIG. 3 (A), the carrier tape 12 and the top tape 20 are heated by a trowel 30 in which a pair of crimping portions 34 having a predetermined length in the longitudinal direction of the carrier tape 12 protrude from the main body 32. Pressurize. Then, the heat sealing layer 40 of the top tape 20 is melted, a pair of seal portions 22 are formed so as to sandwich the storage portion 14, and the top tape 20 is attached to the carrier tape 12. When a certain time has elapsed, the carrier tape 12 is fed as shown in FIG. At this time, the seal portion 22 is formed with a uniform pressure.

  Next, as shown in FIG. 3 (C), a plurality of crimping portions 54 are further partially heat-bonded by another iron 50 protruding from the main body 52 at appropriate intervals along the longitudinal direction of the carrier tape 12. Thus, the top tape 20 is partially deformed to form the recess 26. The intervals between the plurality of crimping portions 54 are substantially the same as the intervals between the storage portions 14 of the carrier tape 12, and the pressure bonding portions 54 are intermediate between the storage portions 14 and 14 when pressed. To be located. As a result, the intermediate portion between the storage portion 14 and the storage portion 14 of the seal portion 22 is most deformed, and the biting portion 24 in which the top tape 20 bites into the carrier tape 12 is large. When the bite portion 24 is formed by the iron 50, the iron 50 is raised as shown in FIG. 3 (D), the carrier tape 12 is fed, and the bite portion 24 by the iron 50 is again shown in FIG. 3 (E). Is formed.

  The electronic component series 10 is installed in an automatic surface mounting apparatus in such a sealed state, and the electronic component 16 stored in the storage unit 14 is taken out while the top tape 20 is peeled off, and surface mounted on a substrate or the like. I will do it. In the present embodiment, an existing apparatus can be used until the top tape 20 is thermocompression bonded with the iron 30 at a uniform pressure along the longitudinal direction of the carrier tape 12. For this reason, it is only necessary to add the iron 50 for partial crimping shown in FIGS. 3 (C) to 3 (E), and the protruding and position of the low-profile electronic component 16 can be obtained without major changes to the existing equipment. The shift can be suppressed satisfactorily.

In addition, this invention is not limited to the Example mentioned above, A various change can be added in the range which does not deviate from the summary of this invention. For example, the following are also included.
(1) The shapes and dimensions shown in the above-described embodiments are merely examples, and can be appropriately changed within a range where similar effects can be obtained.
(2) In the above embodiment, after forming the seal portion 22 along the longitudinal direction of the carrier tape 12, the region other than the storage portion 14 in the seal portion 22 is partially further thermocompression bonded to the carrier tape. Although the bite of the top tape 20 with respect to 12 is increased, this is also an example, and may be appropriately changed within the range where the same effect can be obtained.
(3) In the above-described embodiment, the low-profile electronic component 16 is stored in the storage unit 14, but the present invention can also be applied to packaging of electronic components other than the low-profile type. Moreover, it does not prevent application of the present invention for packaging a packaged body other than electronic components.

  According to the present invention, an electronic component is stored in a plurality of storage portions formed at intervals in the longitudinal direction of the carrier tape, the opening of the storage portion is covered with a top tape, and the carrier tape is sandwiched between the storage portions. A seal portion is formed along the longitudinal direction of the. At this time, a portion of the seal portion where the top tape bites into the carrier tape is provided in a region where the storage portion is not formed, compared to a region where the storage portion is formed. For this reason, when the sealed carrier tape is bent in the direction of the opening of the storage unit, that is, when the electronic component series is reversely folded, the gap between the carrier tape and the top tape is not located on the storage unit. Since it is possible to suppress the displacement and pop-out of the electronic component, it can be applied to a series of electronic component applications. Particularly, it is suitable as a low-profile electronic component series in which the thickness in the height direction during storage is smaller than the thickness in the width direction.

10: electronic component series 12: carrier tape 14: storage part 16: electronic part 18: feed hole 20: top tape 22: seal part 24: biting part 26: recess 28: gap 30: iron 32: main body 34: crimping part 40 : Thermal fusion layer 50: Iron 52: Main body 54: Crimp part 100: Electronic component series 102: Crevice

Claims (6)

A carrier tape in which a plurality of component storage parts for storing electronic components are formed at intervals along the longitudinal direction;
An electronic component stored in the component storage unit;
A top tape that is provided along the longitudinal direction of the carrier tape so as to cover the opening of the component storage portion, and is sealed with the carrier tape so as to sandwich the component storage portion along the longitudinal direction; ,
Have
In the longitudinal direction of the carrier tape,
Of the seal portion of the carrier tape and the top tape, a portion where the component storage portion is not formed is a portion where the top tape bites into the carrier tape is larger than a region where the component storage portion is formed. An electronic component series comprising:   2. The electronic component series according to claim 1, wherein a seal portion of the carrier tape and the top tape is separated from the component storage portion. The electronic component is
3. The electronic component series according to claim 1, wherein a thickness in a height direction when stored in the component storage unit is smaller than a thickness in a width direction. Storing the electronic component in a carrier tape in which a plurality of component storage portions for storing the electronic component are formed at intervals in the longitudinal direction; and
Sealing the top tape covering the opening of the component storage portion along the longitudinal direction of the carrier tape with the carrier tape so as to sandwich the component storage portion along the longitudinal direction;
Contains
In the step of sealing the carrier tape and the top tape,
In the longitudinal direction of the carrier tape, a portion where the top tape bites into the carrier tape is formed in a region where the component storage portion is not formed in a region where the component storage portion is formed. A method for producing a series of electronic components. Sealing the carrier tape and the top tape,
The step of heat-pressing the carrier tape and the top tape uniformly along the longitudinal direction of the carrier tape so as to sandwich the component storage portion;
Of the parts thermocompression-bonded by the step, the step of further pressurizing the part where the component storage part is not formed;
The manufacturing method of the electronic component series of Claim 4 characterized by the above-mentioned.   An electronic component series manufactured by the manufacturing method according to claim 4 or 5.

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