JP2015156471A5 - - Google Patents

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Publication number
JP2015156471A5
JP2015156471A5 JP2014228199A JP2014228199A JP2015156471A5 JP 2015156471 A5 JP2015156471 A5 JP 2015156471A5 JP 2014228199 A JP2014228199 A JP 2014228199A JP 2014228199 A JP2014228199 A JP 2014228199A JP 2015156471 A5 JP2015156471 A5 JP 2015156471A5
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JP
Japan
Prior art keywords
wiring
substrate
cut portion
adhesive layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014228199A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015156471A (ja
JP6316731B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014228199A priority Critical patent/JP6316731B2/ja
Priority claimed from JP2014228199A external-priority patent/JP6316731B2/ja
Priority to US14/591,239 priority patent/US9603253B2/en
Priority to CN201510013051.2A priority patent/CN104779225B/zh
Publication of JP2015156471A publication Critical patent/JP2015156471A/ja
Publication of JP2015156471A5 publication Critical patent/JP2015156471A5/ja
Application granted granted Critical
Publication of JP6316731B2 publication Critical patent/JP6316731B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014228199A 2014-01-14 2014-11-10 配線基板及びその製造方法、並びに半導体パッケージ Active JP6316731B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014228199A JP6316731B2 (ja) 2014-01-14 2014-11-10 配線基板及びその製造方法、並びに半導体パッケージ
US14/591,239 US9603253B2 (en) 2014-01-14 2015-01-07 Wiring substrate, manufacturing method therefor, and semiconductor package
CN201510013051.2A CN104779225B (zh) 2014-01-14 2015-01-09 配线基板及其制造方法、以及半导体封装

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014004629 2014-01-14
JP2014004629 2014-01-14
JP2014228199A JP6316731B2 (ja) 2014-01-14 2014-11-10 配線基板及びその製造方法、並びに半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2015156471A JP2015156471A (ja) 2015-08-27
JP2015156471A5 true JP2015156471A5 (de) 2017-07-20
JP6316731B2 JP6316731B2 (ja) 2018-04-25

Family

ID=53522581

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014228199A Active JP6316731B2 (ja) 2014-01-14 2014-11-10 配線基板及びその製造方法、並びに半導体パッケージ

Country Status (3)

Country Link
US (1) US9603253B2 (de)
JP (1) JP6316731B2 (de)
CN (1) CN104779225B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10283688B2 (en) * 2016-08-22 2019-05-07 Nichia Corporation Light emitting device
JP6699535B2 (ja) * 2016-12-14 2020-05-27 株式会社デンソー 回路基板
JP6881409B2 (ja) * 2018-09-27 2021-06-02 日亜化学工業株式会社 照明装置およびその製造方法
TWI672711B (zh) * 2019-01-10 2019-09-21 健策精密工業股份有限公司 絕緣金屬基板及其製造方法
CN117730629A (zh) * 2021-09-30 2024-03-19 日亚化学工业株式会社 布线基板及其制造方法、面状发光装置及其制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
JP2789563B2 (ja) * 1993-05-28 1998-08-20 いわき電子株式会社 集積回路装置
US5808872A (en) * 1994-11-15 1998-09-15 Nippon Steel Corporation Semiconductor package and method of mounting the same on circuit board
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
US6064114A (en) * 1997-12-01 2000-05-16 Motorola, Inc. Semiconductor device having a sub-chip-scale package structure and method for forming same
US6920046B2 (en) * 2003-06-25 2005-07-19 Eaton Corporation Dissipating heat in an array of circuit components
US7148554B2 (en) * 2004-12-16 2006-12-12 Delphi Technologies, Inc. Discrete electronic component arrangement including anchoring, thermally conductive pad
US7550319B2 (en) * 2005-09-01 2009-06-23 E. I. Du Pont De Nemours And Company Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
JP2008205308A (ja) * 2007-02-21 2008-09-04 Sanyo Electric Co Ltd 半導体装置
CN101645478A (zh) * 2008-08-08 2010-02-10 鸿富锦精密工业（深圳）有限公司 发光二极管散热结构
JP2011103353A (ja) * 2009-11-10 2011-05-26 Koito Mfg Co Ltd 発光モジュール
JP2012033855A (ja) * 2010-07-01 2012-02-16 Hitachi Cable Ltd Ｌｅｄモジュール、ｌｅｄパッケージ、並びに配線基板およびその製造方法
US9084373B2 (en) * 2011-02-24 2015-07-14 Dexerials Corporation Thermally conductive adhesive
JP5844101B2 (ja) 2011-09-15 2016-01-13 新光電気工業株式会社 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法
JP5848976B2 (ja) * 2012-01-25 2016-01-27 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP6230777B2 (ja) * 2012-01-30 2017-11-15 新光電気工業株式会社 配線基板、配線基板の製造方法、及び発光装置

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