JP2015140205A - Transportation carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize stability in electric parts and electrical examination of the electric parts.SOLUTION: A transportation carrier 1 comprises: a flat upper plate 10 on which a plurality of first openings 11 penetrating in a thickness direction are formed, and on which a plurality of electric parts XA1 comprising a pair of electrodes YA1 are fitted on the plurality of first openings 11 one by one in a manner where the pair of electrodes YA1 are arranged below; and a lower plate 40 which is a flat metal plate directly or indirectly jointed onto a lower side of the upper plate 10, on which a support surface 41a supporting the electric parts XA1 fitted on the first openings from a lower side are formed at respective positions extending from the plurality of first openings 11, and on which holes 42 which penetrates the lower plate 40 in the thickness direction and through which the pair of electrodes are exposed are formed at respective positions constructing the support surface 41a. In the support surface 41a, a region contacting with at least a pair of electrodes YA1 is made of an insulator 3.

Description

  The present invention relates to a transport carrier that houses and transports electronic components.

  In recent years, electronic components such as piezoelectric vibrators have been miniaturized, and the number of chip-shaped electronic components that can be surface-mounted has increased. Since such an electronic component is very small, generally in the manufacturing process, an electronic component is accommodated in a receiving portion of a metal conveyance carrier, and a plurality of electronic components are manufactured in each manufacturing process by conveying the conveyance carrier. They are transported in bulk. Further, depending on the manufacturing process, various processes such as seam welding and electrical inspection are performed while the electronic component is housed in the carrier (see, for example, Patent Document 1).

  As shown in FIG. 10A, the accommodation portion 101 of the transport carrier 100 has four holes 102 at the four corners. These four holes 102 expose the four electrodes YA1 provided at the four corners of the electronic component XA1. Thereby, a probe can be made to contact each electrode YA1 at the time of a test | inspection.

  By the way, depending on the type of electronic component, there is an electronic component having a pair of electrodes on both sides. When transporting such an electronic component, it is assumed that a transport carrier 200 shown in FIG. 10B is used. Two holes 202 a are formed on both sides of the accommodating portion 201 of the transport carrier 200. These two holes 202a expose a pair of electrodes YA1 provided on both sides of the electronic component XA1. Thereby, a probe can be made to contact each electrode YA1 at the time of a test | inspection.

Japanese Patent No. 4895061

  As shown in FIG. 10 (B), when the holes 202a on both sides formed in the accommodating portion 201 of the transport carrier 200 are large, the electronic component XA1 accommodated in the accommodating portion 201 is used when performing seam welding. It is not stable. On the other hand, as shown in FIG. 10C, when the holes 202b on both sides formed in the accommodating portion 201 of the transport carrier 200 are small, the electrode YA1 of the electronic component XA1 comes into contact with the transport carrier 200 and is inspected. Can not do it.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a transport carrier that stabilizes an electronic component and enables electrical inspection of the electronic component.

  The above-mentioned object is achieved by the following means based on the earnest research of the present inventors.

  (1) In the present invention, a plurality of first openings penetrating in the thickness direction are formed, and a plurality of electronic components having a pair of electrodes are placed one by one in the plurality of first openings. A flat plate-like upper plate to be fitted, and a flat plate-like metal plate joined directly or indirectly under the upper plate, each at a position continuing to the plurality of first openings, A support surface for supporting the electronic component fitted in the first opening from below is configured, and a hole that penetrates in the thickness direction and exposes each of the pair of electrodes is formed at each position of the support surface. A carrier plate, wherein the support surface has at least a region in contact with the pair of electrodes or a region around the pair of electrodes made of an insulator.

  According to the present invention, the hole exposing the electrode can be made small. Thereby, it can prevent that an electronic component rattles. That is, the electronic component can be stabilized. And since the area | region which contacts an electrode consists of insulators, an electrode does not contact the metal part of a conveyance carrier. Thereby, electrical inspection is possible.

  (2) In the present invention, it is also preferable that the insulator has a recess formed in the upper surface of the lower plate so that the surface of the insulator is lower than the upper surface of the lower plate, or The carrier according to (1) above, wherein the body surface is disposed so as to be substantially flush with the upper surface of the lower plate.

  According to the above invention, since the surface of the insulator does not protrude from the upper surface of the lower plate, it is possible to prevent the bonding state between the lower plate and the upper plate on the lower plate from becoming unstable. As a result, the electronic component can be further stabilized.

  (3) The present invention is also a flat plate joined directly or indirectly between the upper plate and the lower plate, and the first plate is disposed at each position continuous to the plurality of first openings. An intermediate plate is provided in which each of the second openings into which the electronic component is continuously inserted is formed in one opening, and the intermediate plate is fitted into the second opening inside each of the plurality of second openings. The carrier according to (1) or (2) above, further comprising an elastic member that biases and holds the electronic component.

  According to the above invention, since the elastic member sandwiches the electronic component, the electronic component can be further stabilized.

  According to the carrier according to any one of (1) to (3) of the present invention, the electronic component can be stabilized and an excellent effect of enabling an electrical inspection of the electronic component can be achieved.

(A) is a top view of the conveyance carrier which concerns on embodiment of this invention, (B) is a front view of a conveyance carrier, (C) is the elements on larger scale of a conveyance carrier. It is a partial expanded sectional view of a conveyance carrier. (A) is a plan view of the upper plate, and (B) is a partially enlarged plan view of the upper plate. (A) is a plan view of the middle plate, (B) is a partially enlarged plan view of the middle plate. (A) is a plan view of the spacer, and (B) is a partially enlarged plan view of the spacer. (A) is a top view of a lower board, (B) is the elements on larger scale of a lower board. (A) is a top view of a 1st reinforcement board, (B) is the elements on larger scale of a 1st reinforcement board. (A) is a top view of a 2nd reinforcement board, (B) is the elements on larger scale of a 2nd reinforcement board. (A)-(C) are the partial expanded plan views of the conveyance carrier of another form. (A) is a partially enlarged plan view and a partially enlarged cross-sectional view of a conventional carrier, and (B) and (C) are a partially enlarged plan view and a partially enlarged sectional view of a carrier carrier modified from the conventional carrier.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings.

  First, the configuration of the transport carrier 1 will be described with reference to FIGS. 1 and 2. FIG. 1A is a plan view of the transport carrier 1. FIG. 1B is a front view of the transport carrier 1. FIG. 1C is a partially enlarged plan view of the transport carrier 1. FIG. 2 is a partially enlarged sectional view of the transport carrier 1. In each drawing, illustration of some components is omitted as appropriate, and the drawings are simplified.

  The transport carrier 1 shown in FIGS. 1 and 2 is a flat plate having a substantially rectangular shape and a thickness of 1.5 mm having a plurality of housing portions 2 that are depressions, and each of the electronic components XA1 is housed in the plurality of housing portions 2 one by one. And transport it. Specifically, the transport carrier 1 includes an upper plate 10, an intermediate plate 20, a spacer 30, a lower plate 40, a first reinforcing plate 50, and two second reinforcing plates 60 in order from the top. It has a laminated structure. The plates 10, 20, 30, 40 and 50 are joined by laser spot welding. Each plate 40, 50, 60 is welded by thermocompression bonding.

  In the present embodiment, assuming that the rectangular electronic component XA1 is transported, each housing portion 2 is configured in a rectangular shape. The accommodating portions 2 are arranged in a 10 × 16 matrix. Thereby, the conveyance carrier 1 can convey a maximum of 160 electronic components XA1 at a time.

  A part of the elastic member 22 that biases and holds the stored electronic component XA1 protrudes inside each storage portion 2. An operation hole 12 is provided in the vicinity of each accommodating portion 2. A jig or the like is inserted into the operation hole 12. The elastic member 22 is operated by moving the jig inserted into the operation hole 12.

  The bottom surface of the housing portion 2 is composed of an insulator 3 (illustrated by hatching in FIG. 1C). A pair of inspection holes 4 are provided on both sides of the bottom surface of the housing portion 2. That is, the spread of the insulator 3 is larger than the spread of the inspection hole 4 when viewed from the center of the inspection hole 4. As a result, the insulator 3 prevents the electrode YA1 of the electronic component XA1 from coming into direct contact with the metal portion of the carrier 1. The inspection hole 4 exposes the electrode YA1 of the electronic component XA1 accommodated in the accommodating portion 2. A probe (not shown) is inserted into the inspection hole 4 when performing an electrical inspection.

  Positioning holes 5 are provided at both ends in the longitudinal direction of the transport carrier 1. The positioning hole 5 is used when determining the position of the transport carrier 1. The position of the transport carrier 1 is determined when the electronic component XA1 is accommodated in the accommodating portion 2, or when processing such as processing is performed on the electronic component XA1 accommodated in the accommodating portion 2. A rectangular notch 6 is provided at one end of the transport carrier 1 in the longitudinal direction. Further, assembly holes 7 are provided at the four corners of the carrier 1. The assembly hole 7 is used for positioning the plates 10, 20, 30, 40, 50, 60 when the transport carrier 1 is manufactured.

  Next, the individual configuration of each plate 10, 20, 30, 40, 50, 60 will be described. FIG. 3A is a plan view of the upper plate 10. FIG. 3B is a partially enlarged plan view of the upper plate 10. FIG. 4A is a plan view of the intermediate plate 20. FIG. 4B is a partially enlarged plan view of the intermediate plate 20. FIG. 5A is a plan view of the spacer 30. FIG. 5B is a partially enlarged plan view of the spacer 30. FIG. 6A is a plan view of the lower plate 40. FIG. 6B is a partially enlarged plan view of the lower plate 40. FIG. 7A is a plan view of the first reinforcing plate 50. FIG. 7B is a partially enlarged plan view of the first reinforcing plate 50. FIG. 8A is a plan view of the second reinforcing plate 60. FIG. 8B is a partially enlarged plan view of the second reinforcing plate 60.

  The upper plate 10 shown in FIGS. 3A and 3B is a flat plate having a thickness of 0.1 mm made of metal (for example, stainless steel). The upper plate 10 includes a plurality of first openings 11, a plurality of operation holes 12 formed one by one on the sides of the plurality of first openings 11, and a positioning hole 5 (see FIG. 1A). A plurality of holes 13, a notch 14 forming a notch 6 (see FIG. 1A), and a plurality of holes 15 forming an assembly hole 7 (see FIG. 1A). Yes. The plurality of first openings 11, the plurality of operation holes 12, the plurality of holes 13, and the plurality of holes 15 are each formed so as to penetrate in the thickness direction by etching. The plurality of first openings 11 include a second opening 21 (see FIG. 4B) of the intermediate plate 20, a third opening 31 (see FIG. 5B) of the spacer 30, and a support surface 41a of the lower plate 40, respectively. (Refer FIG. 2) and the accommodating part 2 (refer FIG. 1 (A), FIG. 1 (C), and FIG. 2) are comprised. Each of the plurality of first openings 11 is fitted with the electronic component XA1 with the pair of electrodes YA1 facing downward.

  The middle plate 20 shown in FIGS. 4A and 4B is a flat plate having a thickness of 0.15 mm made of metal (for example, stainless steel) and is directly or indirectly between the upper plate 10 and the lower plate 40. Are joined together. In the present embodiment, the middle plate 20 is joined between the upper plate 10 and the spacer 30. The middle plate 20 includes a plurality of second openings 21 formed one by one at each position continuous to the plurality of first openings 11 of the upper plate 10, and one inside each of the plurality of second openings 21. A plurality of elastic members 22 formed and biased to hold the electronic component XA1 fitted in the second opening; a plurality of holes 23 constituting the positioning holes 5 (see FIG. 1A); A notch 24 constituting the notch 6 (see FIG. 1A) and a plurality of holes 25 constituting the assembly hole 7 (see FIG. 1A) are provided. The plurality of second openings 21, the plurality of holes 23, and the plurality of holes 25 are each formed so as to penetrate in the thickness direction by etching. The plurality of second openings 21 are respectively the first opening 11 (see FIG. 3B) of the upper plate 10, the third opening 31 of the spacer 30 (see FIG. 5B), and the support surface 41a of the lower plate 40. (Refer FIG. 2) and the accommodating part 2 (refer FIG. 1 (A), FIG. 1 (C), and FIG. 2) are comprised. The electronic parts XA1 are fitted into the plurality of second openings 21 in succession to the first openings 11 (see FIGS. 3A and 3B) of the upper plate 10, respectively.

  The spacer 30 shown in FIGS. 5A and 5B is a flat plate having a thickness of 0.05 mm made of metal (for example, stainless steel), and is joined between the middle plate 20 and the lower plate 40. The spacer 30 constitutes a plurality of third openings 31 formed one at each position continuous with the plurality of second openings 21 of the intermediate plate 20 and positioning holes 5 (see FIG. 1A). A plurality of holes 33, a notch 34 constituting the notch 6 (see FIG. 1A), and a plurality of holes 35 constituting the assembly hole 7 (see FIG. 1A) are provided. . The plurality of third openings 31, the plurality of holes 33, and the plurality of holes 35 are formed so as to penetrate in the thickness direction by etching. The plurality of third openings 31 are accommodated together with the first opening 11 of the upper plate 10 (see FIG. 3B), the second opening 21 of the middle plate 20, and the support surface 41a of the lower plate 40 (see FIG. 2). Part 2 (see FIGS. 1A, 1C, and 2) is configured. The plurality of third openings 31 are respectively fitted with the electronic components XA1 in succession to the second openings 21 (see FIGS. 4A and 4B) of the intermediate plate 20.

  The lower plate 40 shown in FIGS. 6A and 6B is a 0.3 mm-thick flat plate made of metal (for example, stainless steel) and is directly or indirectly joined to the lower plate 10. The In the present embodiment, the lower plate 40 is joined between the spacer 30 and the first reinforcing plate 50. The lower plate 40 includes a plurality of depressions 41 formed one by one at each position continuous to the plurality of third openings 31 of the spacer 30 and a plurality of pairs of holes formed one by one in the plurality of depressions 41. 42, a plurality of holes 46 formed one by one on the sides of the plurality of depressions 41, a plurality of holes 43 constituting the positioning holes 5 (see FIG. 1A), and a notch 6 (FIG. 1A). )) And a plurality of holes 45 constituting the assembly hole 7 (see FIG. 1A). Each of the plurality of depressions 41 is formed so as to dent the upper surface of the lower plate 40 by etching.

In each depression 41, an insulator 3 (for example, polyimide, Teflon (registered trademark), ceramic coating, ceramic material, etc.) is disposed so as not to jump out from the upper surface of the lower plate 40. Specifically, the insulator 3 is such that the surface of the insulator 3 is lower than the upper surface of the lower plate 40, or the surface of the insulator 3 is substantially flush with the upper surface of the lower plate 40. Be placed. That is, the insulator 3 is arranged so that the relationship of the depth t ₄₁ of the recess 41 ≧ the thickness t ₄₂ of the insulator 3 is maintained. Such an insulator 3 constitutes a support surface 41a that supports the electronic component XA1 fitted in the first opening 11 of the upper plate 10 from below. That is, the support surface 41a is made of the insulator 3 at least in a region in contact with the pair of electrodes YA1. The plurality of pairs of holes 42, the plurality of holes 46, the plurality of holes 43, and the plurality of holes 45 are each formed so as to penetrate in the thickness direction by etching. The plurality of pairs of holes 42 penetrate each of the positions constituting the support surface 41a in the thickness direction and partially expose each of the pair of electrodes YA1. That is, the plurality of pairs of holes 42 are formed in the holes 51 of the first reinforcing plate 50 (see FIGS. 7A and 7B) and the holes 61 of the second reinforcing plate 60 (FIG. 8A), respectively. And the inspection hole 4 (see FIG. 1C and FIG. 2). Probes (not shown) are inserted into the plurality of pairs of holes 42 in succession to the holes 51 (see FIGS. 7A and 7B) of the first reinforcing plate 50, respectively.

  The first reinforcing plate 50 shown in FIGS. 7A and 7B is a 0.3 mm-thick flat plate made of metal (for example, stainless steel) and directly or indirectly under the lower plate 40. To be joined. In the present embodiment, the first reinforcing plate 50 is joined between the lower plate 40 and the second reinforcing plate 60. The first reinforcing plate 50 is formed by a plurality of pairs of holes 51 formed at respective positions continuous to the plurality of pairs of holes 42 of the lower plate 40, and one by the side of the plurality of pairs of holes 51. A plurality of holes 52, a plurality of holes 53 constituting the positioning holes 5 (see FIG. 1A), a notch 54 constituting the notch 6 (see FIG. 1A), and an assembly hole 7 ( And a plurality of holes 55 that constitute (see FIG. 1A). The plurality of pairs of holes 51 are inspected holes together with the holes 42 of the lower plate 40 (see FIG. 6B) and the holes 61 of the second reinforcing plate 60 (see FIGS. 8A and 8B), respectively. 4 (see FIG. 1C and FIG. 2). Probes (not shown) are inserted into the plurality of pairs of holes 51 in succession to the holes 61 (see FIGS. 8A and 8B) of the second reinforcing plate 60, respectively.

  The second reinforcing plate 60 shown in FIGS. 8A and 8B is a 0.3 mm-thick flat plate made of metal (for example, stainless steel) and directly or indirectly under the lower plate 40. To be joined. In the present embodiment, the first second reinforcing plate 60 is joined between the first reinforcing plate 50 and the second second reinforcing plate 60. The second second reinforcing plate 60 is joined under the first second reinforcing plate 60. The second reinforcing plate 60 includes a plurality of holes 61 formed at positions corresponding to the plurality of pairs of holes 51 and the plurality of holes 52 in the first reinforcing plate 50, and the positioning holes 5 (FIG. 1A )), A notch 64 forming the notch 6 (see FIG. 1A), and a plurality of holes 65 forming the assembly hole 7 (see FIG. 1A). And. The plurality of holes 61 are inspected holes 4 together with the holes 42 of the lower plate 40 (see FIG. 6B) and the holes 51 of the first reinforcing plate 50 (see FIGS. 7A and 7B), respectively. (See FIG. 1C and FIG. 2). Probes (not shown) are inserted into the plurality of holes 61, respectively.

  As described above, according to the transport carrier 1, the inspection hole 4 that exposes the electrode YA1 can be made small. This can prevent the electronic component XA1 from rattling. That is, the electronic component XA1 can be stabilized. And since the area | region which contacts electrode YA1 consists of the insulator 3, electrode YA1 does not contact the metal part of the conveyance carrier 1. FIG. Thereby, electrical inspection is possible.

  And since the surface of the insulator 3 does not jump out from the upper surface of the lower plate 40, it is prevented that the joining state of the lower plate 40 and the spacer 30 on it becomes unstable. As a result, the electronic component XA1 can be further stabilized.

  Further, since the elastic member 22 holds the electronic component XA1, the electronic component XA1 can be further stabilized.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and technical idea thereof. That is, in the above embodiment, the position, size, length, shape, material, orientation, quantity, temperature, and the like of each component can be changed as appropriate.

  Or in the said embodiment, although the area | region which contacts at least a pair of electrode YA1 in the support surface 41a consists of the insulator 3, this is because the electrode YA1 is always larger than the inspection hole 4 and contacts the support surface 41a. . That is, in the present invention, when the electrode YA1 is smaller than the inspection hole 4, the region around the pair of electrodes YA1 on the support surface 41a is made of the insulator 3.

  Or in the said embodiment, in addition to arrange | positioning so that the support surface 41a may be comprised, the insulator 3 may be arrange | positioned on the internal peripheral surface of the test | inspection hole 4. FIG.

  Alternatively, in the above embodiment, a pair of circular inspection holes 4 are provided on both sides on the bottom surface of each accommodating portion 2 of the transport carrier 1, but the position, size, and shape of the inspection holes in the present invention are as follows. It is not limited to this.

  Next, the configuration of another form of carrier 70, 80, 90 will be described with reference to FIG. FIGS. 9A, 9B, and 9C are partially enlarged plan views of transport carriers 70, 80, and 90 in another form.

  A pair of square inspection holes 72 are provided on both sides so as to contact the outer peripheral edge on the bottom surface of the accommodating portion 71 of the transport carrier 70 shown in FIG.

  A pair of square inspection holes 82 do not come into contact with the left and right in the drawing of the outer peripheral edge and contact the upper and lower sides in the drawing of the outer peripheral edge on the bottom surface of the accommodating portion 81 of the transport carrier 80 shown in FIG. It is provided on both sides.

  A pair of square inspection holes 92 are in contact with the left and right and lower sides in the drawing of the outer peripheral edge on the bottom surface of the accommodating portion 91 of the transport carrier 90 shown in FIG. It is provided on both sides so as not to contact the upper side.

  The transport carrier of the present invention can be used in the field of manufacturing electronic components (including electronic devices) or physical distribution.

1,70,80,90 Transport carrier 3 Insulator 4,72,82,92 Inspection hole (hole)
10 upper plate 11 first opening 20 middle plate 22 elastic member 40 lower plate 41 recess 41a support surface

Claims (3)

A plurality of first openings penetrating in the thickness direction are formed, and a plurality of electronic components having a pair of electrodes are fitted into the plurality of first openings one by one with the pair of electrodes facing downward, respectively. When,
A flat plate-like metal plate joined directly or indirectly under the upper plate, and fitted in the first opening at each position continuous to the plurality of first openings. Comprising a support surface for supporting the electronic component from below, and a lower plate in which holes are formed in each of the positions constituting the support surface to expose each of the pair of electrodes in the thickness direction. ,
The support surface is characterized in that at least a region in contact with the pair of electrodes or a region around the pair of electrodes is made of an insulator.
Transport carrier. The insulator is placed in a recess formed on the upper surface of the lower plate so that the surface of the insulator is lower than the upper surface of the lower plate, or the surface of the insulator is on the lower plate. It is arranged to be substantially flush with the upper surface,
The carrier according to claim 1. A plate-like plate joined directly or indirectly between the upper plate and the lower plate, wherein the electrons are continuously connected to the first openings at the positions continuous to the first openings; Comprising an intermediate plate in which second openings into which components are fitted are formed one by one;
The intermediate plate includes an elastic member that urges and holds the electronic component fitted in the second opening inside each of the plurality of second openings.
The carrier according to claim 1 or 2.

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