JP2015133476A - 相変化メモリセル - Google Patents
相変化メモリセル Download PDFInfo
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- JP2015133476A JP2015133476A JP2014216106A JP2014216106A JP2015133476A JP 2015133476 A JP2015133476 A JP 2015133476A JP 2014216106 A JP2014216106 A JP 2014216106A JP 2014216106 A JP2014216106 A JP 2014216106A JP 2015133476 A JP2015133476 A JP 2015133476A
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- 230000015654 memory Effects 0.000 title claims abstract description 70
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 254
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 252
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 252
- 239000000758 substrate Substances 0.000 description 55
- 238000005452 bending Methods 0.000 description 39
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 29
- 238000004519 manufacturing process Methods 0.000 description 17
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- 238000010438 heat treatment Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910000618 GeSbTe Inorganic materials 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 238000005566 electron beam evaporation Methods 0.000 description 2
- 238000001017 electron-beam sputter deposition Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
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- 238000001878 scanning electron micrograph Methods 0.000 description 2
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 229910005900 GeTe Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- -1 chalcogenide compounds Chemical class 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- GPMBECJIPQBCKI-UHFFFAOYSA-N germanium telluride Chemical compound [Te]=[Ge]=[Te] GPMBECJIPQBCKI-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/861—Thermal details
- H10N70/8613—Heating or cooling means other than resistive heating electrodes, e.g. heater in parallel
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
- G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/253—Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/823—Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0069—Writing or programming circuits or methods
- G11C2013/008—Write by generating heat in the surroundings of the memory material, e.g. thermowrite
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- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Semiconductor Memories (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
図1及び図2を参照すると、本発明の実施例1は、相変化メモリセル10を提供する。相変化メモリセル10は、基板110と、複数のカーボンナノチューブワイヤ120と、相変化層130と、第一電極122と、第二電極124と、第三電極126と、を含む。複数のカーボンナノチューブワイヤ120は相互に間隔をあけて設置される。
図5及び図6を参照すると、本発明の実施例2は相変化メモリセル20を提供する。相変化メモリセル20は、基板110と、複数のカーボンナノチューブワイヤ120と、相変化層130と、第一電極122と、第二電極124と、第三電極126と、を含む。複数のカーボンナノチューブワイヤ120は相互に間隔をあけて設置される。
図7を参照すると、本発明の実施例3は相変化メモリセル10の製造方法を提供する。相変化メモリセル10の製造方法は、基板110を提供するステップS11と、基板110の一つの表面に少なくとも一本のカーボンナノチューブワイヤ120を設置し、この際、該少なくとも一本のカーボンナノチューブワイヤ120の軸方向は基板110の表面に平行であるステップS12と、該少なくとも一本のカーボンナノチューブワイヤ120を湾曲させるステップS13であって、各カーボンナノチューブワイヤ120が一つの湾曲部121を形成し、各カーボンナノチューブワイヤ120は第一部123、湾曲部121及び第二部125を有し、第一部123、湾曲部121及び第二部125が順番に接続され、湾曲したカーボンナノチューブワイヤ120の第一部123及び第二部125は互いに接触されず、間隔をあけて設置されるステップS13と、基板110の表面に、第一電極122、第二電極124及び第三電極126を設置するステップであって、第一電極122を各カーボンナノチューブワイヤ120の第一部123と電気的に接続させ、第二電極124を各カーボンナノチューブワイヤ120の第二部125と電気的に接続させ、第三電極126を各カーボンナノチューブワイヤ120の湾曲部121と間隔をあけて設置するステップS14と、基板110の表面に相変化層130を堆積させて、少なくとも湾曲部121の一部を被覆し、且つ第三電極126と電気的に接続させるステップS15と、を含む。
図9を参照すると、本発明の実施例4は相変化メモリセル10の製造方法を提供する。相変化メモリセル10の製造方法は、基板110を提供するステップS21と、基板110の表面に間隔をあけて複数の柱112を設置するステップS22と、カーボンナノチューブライン1201を提供し、カーボンナノチューブライン1201の一端を基板110の表面に固定させるステップS23と、一つの柱112に巻いてカーボンナノチューブライン1201を湾曲させて湾曲部121を形成した後、カーボンナノチューブライン1201を切断し、一本のカーボンナノチューブワイヤ120を形成するステップS24であって、カーボンナノチューブワイヤ120は第一部123、湾曲部121及び第二部125を有し、第一部123、湾曲部121及び第二部125が順番に接続され、湾曲したカーボンナノチューブワイヤ120の第一部123及び第二部125は互いに接触されず、間隔をあけて設置されるステップS24と、ステップS23及びステップS24を繰り返して、複数のカーボンナノチューブワイヤ120を形成した後、複数の柱112を除去するステップS25と、基板110の表面に、第一電極122、第二電極124及び第三電極126を設置させるステップであって、第一電極122をカーボンナノチューブワイヤ120の第一部123と電気的に接続させ、第二電極124をカーボンナノチューブワイヤ120の第二部125と電気的に接続させ、第三電極126をカーボンナノチューブワイヤ120の湾曲部121と間隔をあけて設置させるステップS26と、複数の湾曲部121に相変化層130を堆積させて、且つ第三電極126と電気的に接続させるステップS27と、を含む。
図11を参照すると、本発明の実施例5は相変化メモリデバイス100を提供する。相変化メモリデバイス100は、基板110及び該基板110の表面に設置されている複数の相変化メモリ構造体104を含む。
100 相変化メモデバイス
104 相変化メモリ構造体
110 基板
112 柱
120 カーボンナノチューブワイヤ
121 湾曲部
122 第一電極
123 第一部
124 第二電極
125 第二部
126 第三電極
130 相変化層
142 第一列電極リード線
144 第一行電極リード線
146 第二行電極リード線
147 絶縁層
1110 マスク
1112 通孔
1201 カーボンナノチューブライン
1202 カーボンナノチューブライン提供装置
1204 針管
1206 針頭
Claims (2)
- 少なくとも一本のカーボンナノチューブワイヤと、少なくとも一つの相変化層と、第一電極と、第二電極と、第三電極と、を含む相変化メモリセルであって、
前記第一電極と、少なくとも一本の前記カーボンナノチューブワイヤと、前記第二電極とは、書き込み回路を形成し、
前記第一電極、少なくとも一本の前記カーボンナノチューブワイヤ及び前記第二電極は、相互に直列接続され、
前記書き込み回路は、前記相変化メモリセルにデータを書き込み、
前記第三電極と、少なくとも一つの前記相変化層と、少なくとも一本の前記カーボンナノチューブワイヤと、前記第一電極或いは前記第二電極とは、読み出し回路を形成し、
前記第三電極と、少なくとも一つの前記相変化層と、少なくとも一本の前記カーボンナノチューブワイヤと、前記第一電極或いは前記第二電極とは、相互に直列接続され、
前記読み出し回路は、前記相変化メモリセルからデータを読み出し、
少なくとも一本の前記カーボンナノチューブワイヤは湾曲部を有し、
前記第三電極は、少なくとも一本の前記カーボンナノチューブワイヤの前記湾曲部と間隔をあけて設置され、
少なくとも一部の前記相変化層及び少なくとも一部の前記カーボンナノチューブワイヤの前記湾曲部は、相互に接触していることを特徴とする相変化メモリセル。 - 前記カーボンナノチューブワイヤは、順に接続された第一部、前記湾曲部及び第二部から形成され、
前記第一部は、前記第二部と間隔をあけて平行に設置されることを特徴とする請求項1に記載の相変化メモリセル。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410016719.4A CN104779344B (zh) | 2014-01-15 | 2014-01-15 | 相变存储单元 |
CN201410016719.4 | 2014-01-15 |
Publications (2)
Publication Number | Publication Date |
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JP2015133476A true JP2015133476A (ja) | 2015-07-23 |
JP6332691B2 JP6332691B2 (ja) | 2018-05-30 |
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JP2014216106A Active JP6332691B2 (ja) | 2014-01-15 | 2014-10-23 | 相変化メモリセル |
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US (1) | US9349951B2 (ja) |
JP (1) | JP6332691B2 (ja) |
CN (1) | CN104779344B (ja) |
TW (1) | TWI539556B (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN104779346B (zh) * | 2014-01-15 | 2017-04-12 | 清华大学 | 相变存储单元的制备方法 |
CN108922878B (zh) * | 2018-07-05 | 2020-03-31 | 西安众力为半导体科技有限公司 | 一种采用热相变材料进行均流的半导体功率器件 |
Citations (8)
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US9349951B2 (en) | 2016-05-24 |
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