JP2015102442A - 検査装置、及び検査方法 - Google Patents
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- G01N21/88—Investigating the presence of flaws or contamination
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- G01N21/88—Investigating the presence of flaws or contamination
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- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
【解決手段】本発明の一態様にかかる検査装置は、パターンが設けられた試料を照明する光源10と、光源によって照明された試料30からの光を検出する検出器11と、検出器11によって取得された試料画像の輝度値と、試料30の表面形状又は高さ方向における寸法との相関に基づいて、検査を行う処理装置50とを備えている。処理装置50は、複数の撮像条件で取得した試料画像の輝度値を重み付け加算した加算値に基づいて、検査を行う。
【選択図】図1
Description
CD値=Image1×a1+Image2×a2+b・・・(1)
11 検出器
20 試料
30 ステージ
50 処理装置
51 第1の記憶部
52 第2の記憶部
53 パラメータ算出部
54 パラメータ記憶部
55 判定部
Claims (12)
- パターンが設けられた試料を照明する光源と、
前記光源によって照明された試料からの光を検出する検出器と、
前記検出器によって取得された試料画像の輝度値と、前記試料のパターンの表面形状又は高さ方向における寸法との相関に基づいて、検査を行う処理装置とを備え、
前記処理装置は、複数の撮像条件で取得した前記試料画像の輝度値を重み付け加算した加算値に基づいて、検査を行う検査装置。 - 参照試料において測定した前記寸法の測定値と、前記参照試料の試料画像の輝度値とを基に、統計的手法を用いて、重み付け加算のパラメータが算出されている請求項1に記載の検査装置。
- 前記統計的手法として、重回帰分析が用いられている請求項2に記載の検査装置。
- 照明光の波長、照明光の偏光、照明光の照明角度、照明光の形状、検出器の検出角度、及び試料の角度の少なくとも一つを変えることで、前記撮像条件を変えている請求項1〜3のいずれか1項に記載の検査装置。
- 前記パターンの前記表面形状における寸法と前記高さ方向における寸法とのいずれか一項目を検査対象とした場合に、検査対象項目以外の項目に対する感度が同等の撮像条件が設定されている請求項1〜4のいずれか1項に記載の検査装置。
- 前記試料が、半導体ウェハ、TFT基板、フォトマスクであり、
前記試料のCD、膜厚、テーパ角度、又は表面プロファイルを検査する請求項1〜5のいずれか1項に記載の検査装置。 - パターンが設けられた試料を照明するステップと、
照明された試料からの光を検出するステップと、
前記検出器によって取得された試料画像の輝度値と、前記試料のパターンの表面形状又は高さ方向における寸法との相関に基づいて、検査を行うステップとを備え、
複数の撮像条件で取得した前記試料画像の輝度値を重み付け加算した加算値に基づいて、検査を行う検査方法。 - 参照試料において測定した前記寸法の測定値と、前記参照試料の試料画像の輝度値とを基に、統計的手法を用いて、重み付け加算のパラメータが算出されている請求項7に記載の検査方法。
- 前記統計的手法として、重回帰分析が用いられている請求項8に記載の検査方法。
- 照明光の波長、照明光の偏光、照明光の照明角度、照明光の形状、検出器の検出角度、及び試料の角度の少なくとも一つを変えることで、前記撮像条件を変えている請求項7〜9のいずれか1項に記載の検査方法。
- 前記パターンの表面形状における寸法と前記高さ方向における寸法とのいずれか1項目を検査対象とした場合に、検査対象項目以外の項目に対する感度が同等の撮像条件が設定されている請求項7〜10のいずれか1項に記載の検査方法。
- 前記試料が、半導体ウェハ、TFT基板、又はフォトマスクであり、
前記試料のCD、膜厚、テーパ角度、又は表面プロファイルを検査する請求項7〜11のいずれか1項に記載の検査方法。
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017167297A (ja) * | 2016-03-15 | 2017-09-21 | 東芝メモリ株式会社 | リソグラフィマスクの生産方法およびその生産システム |
JP2018534758A (ja) * | 2015-08-31 | 2018-11-22 | ケーエルエー−テンカー コーポレイション | 画像を用いたモデル依拠計量 |
WO2020075213A1 (ja) * | 2018-10-09 | 2020-04-16 | オリンパス株式会社 | 計測装置、計測方法および顕微鏡システム |
KR20210071899A (ko) * | 2018-10-15 | 2021-06-16 | 주식회사 고영테크놀러지 | 검사를 위한 장치, 방법 및 명령을 기록한 기록 매체 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001041720A (ja) * | 1999-07-29 | 2001-02-16 | Nikon Corp | 欠陥検出方法および装置 |
JP2004093338A (ja) * | 2002-08-30 | 2004-03-25 | Nec Corp | 外観検査装置および外観検査方法 |
JP2007327796A (ja) * | 2006-06-06 | 2007-12-20 | Nikon Corp | 表面検査装置 |
JP2008058239A (ja) * | 2006-09-01 | 2008-03-13 | Hitachi High-Technologies Corp | 表面検査方法、及び表面検査装置 |
JP2011163766A (ja) * | 2010-02-04 | 2011-08-25 | Omron Corp | 画像処理方法および画像処理システム |
JP2012013614A (ja) * | 2010-07-02 | 2012-01-19 | Hitachi Ltd | 鏡面検査方法及びその装置 |
JP2012103052A (ja) * | 2010-11-08 | 2012-05-31 | Nikon Corp | 検査装置、検査方法、検査装置用プログラムおよび露光システム |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5640237A (en) | 1995-08-29 | 1997-06-17 | Kla Instruments Corporation | Method and apparatus for detecting non-uniformities in reflective surafaces |
US6646735B2 (en) | 2000-09-13 | 2003-11-11 | Nikon Corporation | Surface inspection apparatus and surface inspection method |
JP4666244B2 (ja) | 2000-09-13 | 2011-04-06 | 株式会社ニコン | 表面検査装置および方法 |
JP4591802B2 (ja) | 2000-09-13 | 2010-12-01 | 株式会社ニコン | 表面検査装置および方法 |
WO2008027362A1 (en) * | 2006-08-28 | 2008-03-06 | Advanced Metrology Systems Llc | Measuring diffractive structures by parameterizing spectral features |
JP2009031212A (ja) | 2007-07-30 | 2009-02-12 | Nikon Corp | 表面検査装置および表面検査方法 |
DE102010029091B4 (de) * | 2009-05-21 | 2015-08-20 | Koh Young Technology Inc. | Formmessgerät und -verfahren |
JP2013108779A (ja) | 2011-11-18 | 2013-06-06 | Nikon Corp | 表面検査装置、表面検査方法、および露光システム |
JP2013174575A (ja) | 2012-01-24 | 2013-09-05 | Hitachi High-Technologies Corp | パターン検査装置、及びこれを使用した露光装置の制御方法 |
CN109387494B (zh) * | 2012-07-06 | 2023-01-24 | Bt成像股份有限公司 | 检查半导体材料的方法与分析半导体材料的方法和系统 |
-
2013
- 2013-11-26 JP JP2013243704A patent/JP5843241B2/ja active Active
-
2014
- 2014-11-21 US US14/549,625 patent/US9970885B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001041720A (ja) * | 1999-07-29 | 2001-02-16 | Nikon Corp | 欠陥検出方法および装置 |
JP2004093338A (ja) * | 2002-08-30 | 2004-03-25 | Nec Corp | 外観検査装置および外観検査方法 |
JP2007327796A (ja) * | 2006-06-06 | 2007-12-20 | Nikon Corp | 表面検査装置 |
JP2008058239A (ja) * | 2006-09-01 | 2008-03-13 | Hitachi High-Technologies Corp | 表面検査方法、及び表面検査装置 |
JP2011163766A (ja) * | 2010-02-04 | 2011-08-25 | Omron Corp | 画像処理方法および画像処理システム |
JP2012013614A (ja) * | 2010-07-02 | 2012-01-19 | Hitachi Ltd | 鏡面検査方法及びその装置 |
JP2012103052A (ja) * | 2010-11-08 | 2012-05-31 | Nikon Corp | 検査装置、検査方法、検査装置用プログラムおよび露光システム |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018534758A (ja) * | 2015-08-31 | 2018-11-22 | ケーエルエー−テンカー コーポレイション | 画像を用いたモデル依拠計量 |
JP2021090064A (ja) * | 2015-08-31 | 2021-06-10 | ケーエルエー コーポレイション | 画像を用いたモデル依拠計量システム及び方法 |
US11200658B2 (en) | 2015-08-31 | 2021-12-14 | Kla-Tencor Corporation | Model-based metrology using images |
JP7071562B2 (ja) | 2015-08-31 | 2022-05-19 | ケーエルエー コーポレイション | 画像を用いたモデル依拠計量システム及び方法 |
JP2017167297A (ja) * | 2016-03-15 | 2017-09-21 | 東芝メモリ株式会社 | リソグラフィマスクの生産方法およびその生産システム |
WO2020075213A1 (ja) * | 2018-10-09 | 2020-04-16 | オリンパス株式会社 | 計測装置、計測方法および顕微鏡システム |
JPWO2020075213A1 (ja) * | 2018-10-09 | 2021-09-02 | オリンパス株式会社 | 計測装置、計測方法および顕微鏡システム |
KR20210071899A (ko) * | 2018-10-15 | 2021-06-16 | 주식회사 고영테크놀러지 | 검사를 위한 장치, 방법 및 명령을 기록한 기록 매체 |
KR102382769B1 (ko) | 2018-10-15 | 2022-04-08 | 주식회사 고영테크놀러지 | 검사를 위한 장치, 방법 및 명령을 기록한 기록 매체 |
US11694916B2 (en) | 2018-10-15 | 2023-07-04 | Koh Young Technology Inc. | Apparatus, method and recording medium storing command for inspection |
JP2021135181A (ja) * | 2020-02-27 | 2021-09-13 | キオクシア株式会社 | 計測装置及び方法 |
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