JP2015096836A5 - - Google Patents

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Publication number
JP2015096836A5
JP2015096836A5 JP2013237024A JP2013237024A JP2015096836A5 JP 2015096836 A5 JP2015096836 A5 JP 2015096836A5 JP 2013237024 A JP2013237024 A JP 2013237024A JP 2013237024 A JP2013237024 A JP 2013237024A JP 2015096836 A5 JP2015096836 A5 JP 2015096836A5
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JP
Japan
Prior art keywords
solder
void
pixel
evaluation method
function
Prior art date
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Application number
JP2013237024A
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English (en)
Japanese (ja)
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JP6360674B2 (ja
JP2015096836A (ja
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Application filed filed Critical
Priority to JP2013237024A priority Critical patent/JP6360674B2/ja
Priority claimed from JP2013237024A external-priority patent/JP6360674B2/ja
Priority to PCT/JP2014/079717 priority patent/WO2015072424A1/ja
Priority to US15/034,302 priority patent/US9965849B2/en
Publication of JP2015096836A publication Critical patent/JP2015096836A/ja
Publication of JP2015096836A5 publication Critical patent/JP2015096836A5/ja
Application granted granted Critical
Publication of JP6360674B2 publication Critical patent/JP6360674B2/ja
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JP2013237024A 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法 Active JP6360674B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013237024A JP6360674B2 (ja) 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法
PCT/JP2014/079717 WO2015072424A1 (ja) 2013-11-15 2014-11-10 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法
US15/034,302 US9965849B2 (en) 2013-11-15 2014-11-10 Void evaluation apparatus and void evaluation method in the solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013237024A JP6360674B2 (ja) 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法

Publications (3)

Publication Number Publication Date
JP2015096836A JP2015096836A (ja) 2015-05-21
JP2015096836A5 true JP2015096836A5 (https=) 2017-02-16
JP6360674B2 JP6360674B2 (ja) 2018-07-18

Family

ID=53057358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013237024A Active JP6360674B2 (ja) 2013-11-15 2013-11-15 ハンダ内のボイドの評価装置及びハンダ内のボイドの評価方法

Country Status (3)

Country Link
US (1) US9965849B2 (https=)
JP (1) JP6360674B2 (https=)
WO (1) WO2015072424A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020159758A (ja) * 2019-03-25 2020-10-01 豊田合成株式会社 発光装置の製造方法および半田接合部検査装置
JP7728536B2 (ja) * 2020-01-15 2025-08-25 株式会社クオルテック 電子部品を接続する接合部のボイド・クラックの検出方法
JP7708639B2 (ja) * 2021-10-11 2025-07-15 Ｊｆｅスチール株式会社 耐火物の欠陥評価方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1409816A (zh) * 1999-11-08 2003-04-09 泰瑞达因公司 利用垂直断层成像的检查方法
JP3922172B2 (ja) * 2002-12-17 2007-05-30 トヨタ自動車株式会社 電子部品の放熱性検査方法及びその装置
JP4631460B2 (ja) 2005-02-18 2011-02-16 パナソニック株式会社 Ｘ線検査方法
JP4728092B2 (ja) * 2005-10-27 2011-07-20 名古屋電機工業株式会社 Ｘ線画像出力装置、ｘ線画像出力方法およびｘ線画像出力プログラム
JP2011075470A (ja) * 2009-10-01 2011-04-14 Fujitsu Ltd 画像処理プログラム、画像処理方法および画像処理装置
US8306311B2 (en) * 2010-04-14 2012-11-06 Oracle International Corporation Method and system for automated ball-grid array void quantification
CN104428881B (zh) * 2013-07-08 2017-06-09 索尼公司 固化条件的确定方法、电路器件的生产方法和电路器件

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