JP2015095346A - Led lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device which can be mounted with simple work without adding construction such as drilling and the like to a mounted part such as a ceiling surface and the like, which can radiate heat of heat generation of the LED and the like efficiently, and also in which an LED element and electronic components can be arranged separately on one substrate, in which the number of components is reduced, whose configuration is simple and which can be manufactured at low cost.SOLUTION: An LED lighting device includes: an LED lamp body 1 in which an LED unit substrate is accommodated; and a mounting plate 2 having an insertion hole for an external power source cable and mounting the LED lamp body to a mounted part. The LED unit substrate 30 has a mounting surface for an LED element and a mounting surface for electronic components configuring a lightning circuit for lighting the LED element on one substrate, and the electric component mounting surface is formed by protruding to the outside part of the LED element mounting surface. The LED unit substrate 30 has a substantially disc shape in which a notch part is formed at one part of a peripheral edge part.

Description

  The present invention relates to an LED lighting device using an LED element as a light source, and relates to a ceiling-mounted LED lighting device that is directly attached to a mounted portion such as a ceiling or a wall surface.

  2. Description of the Related Art In recent years, due to an increase in environmental awareness, a self-powered light bulb type LED lamp using an LED element excellent in power saving as a light source has been widespread. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.

  For example, Patent Literature 1 discloses an LED lighting device in which a storage case for an LED module is directly attached to a ceiling with screws. Patent Document 2 discloses a lighting fixture in which the base of the LED unit is attached to the fixture main body embedded in the ceiling material with a screw, and a form in which the lighting fixture is hung by attaching a hanging tool to the ceiling material.

JP 2011-119206 A JP 2012-182191 A

  However, in patent document 1, since the upper surface portion of the storage case of the LED module is in contact with the ceiling surface, there is a problem in that the heat generated by the LED module cannot be efficiently radiated. Since the boards are arranged independently, there are problems such as an increase in the number of parts and a complicated assembly operation. Further, Patent Document 2 has a configuration in which an LED chip is arranged at the center of a rectangular substrate serving as a light emitting device and a power supply line is joined to the end of the substrate. In such a configuration, the LED chip is turned on. The electronic components constituting the lighting circuit of the LED are cluttered around the LED chip, and it is necessary to widen the board in the length direction or the width direction in order to secure the placement space, and the whole board There is a problem that size increases. Moreover, in Patent Document 2, the number of parts such as a base, a holder, and an inner cover is increased, so that the assembly work is troublesome and expensive, and a large hole has to be opened in order to embed the instrument body on the ceiling surface. The construction work and the mounting work of the lighting fixture on the fixture body, and the type of hanging the lighting fixture on the ceiling material with the hanging tool, the lighting fixture is not only unstable, There are problems such as troublesome connection work between the external power supply wires drawn from the ceiling material and the lighting fixtures.

  The present invention has been proposed in order to solve the above-described problems, and the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. Further, the present invention provides an LED lighting device that can efficiently dissipate heat generated by an LED or the like. In addition, the present invention provides an LED lighting device that enables LED elements and electronic components to be separately arranged on a single substrate, reduces the number of components, is simple in structure, and can be manufactured at low cost. is there.

In order to solve the above-mentioned problem, in the invention of claim 1, there is provided an LED lamp main body in which the LED unit substrate is accommodated and an insertion hole for an external power source electric wire for attaching the LED lamp main body to the attached portion. A mounting plate,
The LED unit substrate has a mounting surface for LED elements on one substrate and a mounting surface for electronic components constituting a lighting circuit for lighting the LED elements,
The electronic component mounting surface is formed to protrude from the outer side of the LED element mounting surface.

  According to a second aspect of the present invention, the electronic component mounting surface is formed to protrude outward from the LED element mounting surface.

  Further, in the invention of claim 3, the LED unit substrate has a substantially disc shape in which a notch is formed at a position opposite to the peripheral portion, and a pair of arc surface portions are formed outside the center surface portion. The arcuate surface portion is the electronic component mounting surface, and the central surface portion is the LED element mounting surface.

  The invention according to claim 4 is characterized in that the notch portion of the LED unit substrate is a mounting relief portion when the LED lamp main body is mounted on the mounting plate.

  The invention of claim 5 is characterized in that the LED unit substrate is fixed to a substrate support member having heat dissipation properties through an insulating cover.

  The invention according to claim 6 is characterized in that a concave portion serving as a space portion is formed at a position corresponding to the protruding portion of the LED unit substrate in the substrate support member and the insulating cover.

  The invention according to claim 7 is characterized in that a power source shielding member for shielding the electronic component mounting surface of the LED unit board is disposed on the light emitting side of the LED unit board.

  In the invention of claim 8, the power source light shielding member includes a mortar-shaped central disk portion having an opening through which the LED element of the LED unit substrate is exposed in the central portion, and the central disk The portion is a light reflecting surface.

  The invention according to claim 9 is characterized in that a translucent cover that covers the light emission side of the central disk part is attached to the central disk part of the power source light shielding member.

  The invention according to claim 10 is characterized in that a housing covering the LED lamp body is detachably provided on the power source light shielding member.

  In the invention of claim 11, a locking claw portion is provided on the inner surface portion of the casing, and a hooking portion for locking the casing locking claw portion is provided on a side surface portion of the power source light shielding member. Thus, the power supply light shielding member and the casing can be engaged and disengaged.

  In the invention of claim 12, the hooking portion has a substantially concave shape, and a sliding portion of the housing locking claw portion formed on a side surface portion of the power supply light shielding member, and the housing engaging member. It has the claw part which a pawl part latches, It is characterized by the above-mentioned.

  The invention according to claim 13 is characterized in that the housing has an opening through which the translucent cover mounted on the power source light shielding member is exposed.

  According to the first to thirteenth inventions described above, the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. An LED lighting device that can efficiently dissipate heat can be provided. In addition, it is possible to provide an LED lighting device that enables the LED element and the electronic component to be separately arranged on one substrate, reduces the number of components, and has a simple configuration and can be manufactured at low cost.

The disassembled perspective view of the LED lighting apparatus concerning 1st this embodiment. The perspective view of the housing | casing of the LED lamp main body concerning 1st this embodiment. The perspective view of the translucent cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the LED unit board | substrate of the LED lamp main body concerning 1st this embodiment. The perspective view of the insulation cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the board | substrate support member of the LED lamp main body concerning 1st this embodiment. The perspective view of the mounting plate of the LED lighting apparatus concerning 1st this embodiment. The perspective view of the state which removed the housing | casing and translucent cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 1st this embodiment. The schematic side view which shows the attachment state of the LED lamp main body concerning 1st this embodiment, and an attachment board. The schematic side view of the housing | casing of the LED lamp main body concerning 1st this embodiment. The whole perspective view of the state which removed the housing | casing of the LED lamp apparatus concerning 1st this embodiment. The disassembled perspective view of the LED lighting apparatus concerning 2nd Embodiment. (A) is a perspective view of the surface side of the housing | casing (LED lamp main body) concerning 2nd this embodiment, (b) is a perspective view of the back surface side of a housing | casing. The perspective view of the surface side of the power-source-part light shielding member concerning 2nd Embodiment. The perspective view of the back surface side of the power supply part light shielding member concerning 2nd Embodiment. The perspective view seen from the lower side of the translucent cover concerning 2nd Embodiment. The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the translucent cover of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the power-source-part light-shielding member of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment. The perspective view of the terminal block of the LED lamp main body concerning 2nd Embodiment. The perspective view seen from the bottom face direction of the LED lighting apparatus of the state which removed the housing | casing concerning 2nd Embodiment. The side view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment.

  Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.

(First embodiment)
As shown in FIG. 1, the LED lighting device of the present invention includes an LED lamp body 1 and a mounting plate 2. The LED lamp body 1 includes a housing 10, a translucent cover 20 accommodated in the housing 10, an LED unit substrate 30, an insulating cover 40, a substrate support member 50, and a terminal block as viewed from the LED irradiation direction. (Power supply terminal block) 60 and a schematic configuration.

  As shown in FIG. 2, the casing 10 has a flat and substantially cylindrical shape with an open bottom surface and an exposed hole 10a of the translucent cover 20 on the top surface (irradiation direction). Made of resin. The upper surface peripheral surface portion 10b of the housing 10 has an inclined surface that inclines toward the exposure hole 10a, so that the irradiation light is expanded. The upper edge 10c is an inclined surface that is inclined outward (FIG. 11), and the reflected light is also emitted from the upper edge 10c. The cylindrical body 10 is a cylindrical body here, but the shape thereof is arbitrary, such as an elliptical cylindrical body or a rectangular cylindrical body.

  As shown in FIG. 3, the translucent cover 20 is a generally bottomed cylindrical body having a generally butterfly shape, and includes a central disk portion 20 a and arc frame portions (projecting portions) 20 b projecting on both sides thereof. 20c is integrally formed, and mounting relief portions 20d and 20e are formed in portions where the arc frame portions 20b and 20c are not formed. The central disk portion 20a and the arc frame portions 20b and 20c are concentric curved bodies. Here, one arc frame portion 20c has a longer arc length than the other arc frame portion 20b. The translucent cover 20 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin.

  A locking tongue piece 20g for locking the power supply electric wire is provided on the outer side near the end face of the arc frame portion 20b on the mounting escape portion 20d side of the central disk portion 20a. A locking hole 20f is opened in the locking tongue piece 20g, and a notch 20h is formed in a part thereof. An insertion hole 20j for a power supply electric wire is opened in the end surface portion of the arcuate frame portion 20b near where the locking tongue piece 20g is provided. Further, screw fastening portions 20i into which set screws 50g (FIG. 8) provided on a substrate support member 50 described later are screwed are formed at the circumferential ends of the arc frame portions 20b and 20c. Although not shown, a screw hole is formed on the back surface side of the screw fixing portion 20i. Here, the screw fixing portions 20i are provided at four locations, but the present invention is not limited to this.

  As shown in FIG. 4, the LED unit substrate 30 is a substantially butterfly-shaped substrate, and a central disk portion 30a and arc surface portions (projecting surface portions) 30b and 30c projecting on both sides thereof are integrally formed. . The central disk portion 30a and the arcuate surface portions 30b and 30c are concentric curved bodies. Here, one arcuate surface portion 30c has a longer arc length than the other arcuate surface portion 30b. Further, notch portions between the central disc portion 30a and the arc surface portions 30b and 30c where the arc surface portions 30b and 30c are not formed are provided with mounting escape portions 30d and 30e. As shown in FIG. 8, a plurality of LED elements 30f are mounted in a circle on the lower surface (irradiation surface side) of the central disk portion 30a of the LED unit substrate 30, and the LED elements 30f are mounted on the arcuate surfaces 30b and 30c. An electronic component (not shown) of a lighting circuit for driving and lighting is mounted. This electronic surface component may be disposed on the same plane portion as the LED element 30f in the circular arc surface portions 30b and 30c, or may be disposed on the back surface portion thereof.

  Here, the LED element 30f is disposed on the central disk portion 30a of the LED unit substrate 30 and the electronic components are disposed on the arcuate surface portions 30b and 30c. However, if necessary, the electronic component is disposed on the central disk portion 30a. The LED elements may be arranged on the arcuate surface portions 30b and 30c. In this case, the shapes of the housing 10, the translucent cover 20, the LED unit substrate 30, the insulating cover 40, and the substrate support member 50 are changed correspondingly.

  The electronic components are known electronic components such as various diodes, capacitors, ICs, resistors, and the like for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.

  As described above, the LED unit substrate 30 has the number of components reduced by mounting the LED elements 30f and the electronic components of the lighting circuit that drives the LED elements 30f on the single substrate. In addition, the LED element 30f and the electronic component are arranged in an orderly manner on a single substrate, so that the LED lamp body 1 can be reduced in size.

  As shown in FIG. 5, the insulating cover 40 is formed in a substantially butterfly shape corresponding to the shape of the LED unit substrate 30, and is made of an insulating resin. The insulating cover 40 is formed by integrally forming a central disc portion 40a and concave arcuate frame portions (projecting portions) 40b and 40c projecting on both sides thereof, and portions where these arc frame portions 40b and 40c are not formed are mounted. The escape portions 40d and 40e are formed. The central disc portion 40a and the arc frame portions 40b and 40c are concentric curved bodies. Here, one arc frame portion 40c has a longer arc length than the other arc frame portion 40d.

  As shown in FIG. 6, the substrate support member 50 that supports the LED unit substrate 30 has a substantially disk shape and is formed by a metal plate. The substrate support member 50 is formed with arc frame portions 50b and 50c that are recessed in the lower surface direction (direction opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 50a. The convex portions where 50c is not formed are mounting surface portions 50d, 50e with the mounting plate 2. Dharma-shaped screw holes 50f are respectively opened in the mounting surface portions 50d and 50e. Here, one arc frame portion 50c has a longer arc length than the other arc frame portion 50b.

  On the support surface side of the LED unit substrate 30 of the substrate support member 50 (the back surface side in FIG. 6), as shown in FIG. A screw 50g is provided. Further, a notch hole 50h (not shown in FIG. 6) through which the power supply wire is inserted is formed in the mounting surface portion 50e.

  The terminal block 60 is attached to the lower surface portion of the substrate support member 50 with screws or the like, and a connection port of an external power supply wire (F cable) drawn out from a mounted portion such as a ceiling is a mounting plate 2 described later. The external power supply electric wire insertion hole 2c is provided. FIGS. 10 and 12 show the terminal block 60, but the connection port with the external power supply wire is not shown here because it is provided on the back side. On the surface side of the terminal block 60, a connection port 60a for a power supply wire that conducts the external power supply wire and the power supply unit of the LED unit substrate 30 is provided.

  The power supply wire connected to the connection port 60a passes through the notch hole 50h of the substrate support member 50, and passes through the insertion hole 20j through the locking hole 20f of the locking tongue piece 20g of the translucent cover 20, as shown in FIG. By being inserted into the interior of the translucent cover 20, the power unit of the LED unit substrate 30 is connected. Since the notch 20h is formed in the locking hole 20f, the power supply wire can be passed through the locking hole 20f regardless of the assembly order. These connection operations are performed in the assembly process of the LED lamp main body 1. A known terminal block 60 can be used.

  As shown in FIG. 7, the mounting plate 2 is a horizontally long metal plate, and both end edges in the length direction are formed in an arc shape matching the outer diameter surface of the housing 10. A pair of mounting surface portions 2b of the LED lamp body 1 erected in an L-shape is formed at both ends on the long side of the main body surface portion 2a of the mounting plate 2, and screw holes 2f are opened in the mounting surface portion 2b. Has been. An insertion hole 2c for an external power source electric wire is opened at the center of the main body surface portion 2a, and a plurality of screw holes 2d for mounting the mounting plate 2 on a mounted portion such as a ceiling are mutually connected near the mounting portion 2b. It is formed in a different direction. A plurality of beads 2e are formed on the main body surface portion 2a. It should be noted that an elastic member such as a sponge is interposed between the mounting plate 2 and the mounted portion and sealed to prevent dust, insects, etc. from entering the LED lamp main body 1 and the vibration of the mounted portion is reduced to the LED. Propagation to the lamp body 1 can be prevented.

  As shown in FIG. 8, the LED lamp main body 1 is integrated by attaching the LED unit substrate 30 to the upper surface portion of the substrate support member 50 via an insulating cover 40 by screws or the like. In this state, the concave arc frame portions 40b and 40c of the insulating cover 40 are fitted into the concave arc frame portions 50b and 50c of the substrate support member 50, and the central disk portion 30a of the LED unit substrate 30 is located at the center of the insulating cover 40. The central disc surface portion 50a of the substrate support member 50 is in contact with the disc portion 40a. Further, the arc surface portions 30 b and 30 c of the LED unit substrate 30 are separated from the concave arc frame portions 50 b and 50 c of the substrate support member 50 and the concave arc frame portions 40 b and 40 c of the insulating cover 40.

  And when the said electronic component is mounted in the back surface part (opposite surface of an irradiation surface) of the LED unit board | substrate 30, the electronic component will be accommodated in this spaced apart space part, The surface of the LED lamp unit board | substrate 30 When the electronic component is arranged on the portion (irradiation surface side), the space portion becomes the heat radiating portion of the electronic component.

  As shown in FIGS. 9 and 12, the translucent cover 20 is put on the LED unit substrate 30 (on the irradiation slope side), and the set screw 50 g of the substrate support member 50 is attached to the translucent cover 20. The board support member 50 and the translucent cover 20 are fixed by screwing into the screw fastening part 20i. The translucent cover 20 is covered with a casing 10 (not shown in FIGS. 9 and 12). In this state, the arc frame portions 20b and 20c of the translucent cover 20 cover the arc surface portions 30d and 30e of the corresponding LED unit substrate 30, and the central disk portion 20a of the translucent cover 20 as shown in FIG. Swells from the exposure hole 10 a of the housing 10. Further, the electronic components and the like mounted on the arc surface portions 30 d and 30 e of the LED unit substrate 30 are the edge surface portions (upper surface peripheral surface portion 10 b and upper end edge portion 10 c) of the housing 10 and the arc frame portion of the translucent cover 20. It will be hidden by 20b, 20c. In addition, the fixing method of the board | substrate support member 50 and the translucent cover 20 is not limited to the structure mentioned above.

  The shape of the LED unit substrate 30 described above can change the size and shape of the arcuate surface portions 30b, 30c depending on the arrangement position of the electronic components. Correspondingly, the arc frame portion 20c of the translucent cover 20 is insulated. The size and shape of the arc frame portions 40b and 40c of the cover 40 and the arc frame portions 50b and 50c of the substrate support member 50 can be changed.

  When attaching the LED lamp main body 1 to a mounted portion such as a ceiling, first, an external power supply wire (F-cable) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is opened in the ceiling). Pull out from the through-hole), match the through-hole of the external power supply wire opened in the ceiling and the external power line insertion hole 2c of the mounting plate 2 so that the mounting portion 2b of the mounting plate 2 faces downward (irradiation direction) The mounting plate 2 is screwed to the mounted portion through the screw hole 2d.

  Next, after connecting the external power supply wire to the terminal block 60, the mounting surface portions 50d, 50e of the substrate support member 50 of the LED lamp body 1 and the mounting surface portion 2b of the mounting plate are aligned, and the screw 3 (FIG. 8 and Fig. 9). At this time, if the housing 10 is removed, the mounting escape portions 20d and 20e of the translucent cover 20, the mounting escape portions 30d and 30e of the LED unit substrate 30, and the mounting escape portions 40d and 40e of the insulating cover 40 correspond. Therefore, the screwing operation can be easily performed.

  By mounting the LED lamp body 1 on the mounting plate 2 in this manner, a space portion 70 is generated between the LED board support member 50 and the mounting plate 2 as schematically shown in FIG. The terminal block 60 is disposed on the portion 70. Further, the heat generated in the LED unit substrate 30 is transmitted to the LED substrate support member 50 and radiated to the space portion 70.

(Second Embodiment)
13 to 24 show a second embodiment of the present invention. As shown in FIG. 13, the LED lighting device of the second embodiment includes an LED lamp body 200 and a mounting plate 2. Since the configuration of the mounting plate 2 is the same as that of the first embodiment, the description thereof is omitted here. The LED lamp body 200 includes a housing 100, a translucent cover 110 housed therein, a power source shielding member 120, an LED unit substrate 130, an insulating cover 140, a substrate, as viewed from the LED irradiation direction. The support member 150 and a terminal block (power supply terminal block) 160 mounted on the substrate support member 150 are schematically configured.

  14 (a) and 14 (b) show the housing 100, and FIG. 14 (a) also shows the overall shape after the assembly of the LED lamp main body 200 of the present embodiment. Since the configuration of the housing 100 is substantially the same as that of the first embodiment, a detailed description thereof will be omitted here, but as shown in FIG. As described above, the locking claw portions 100a that engage with the hooking portions 120i of the power supply portion shielding member 120 are provided to protrude in a plurality of locations (here, three locations) in the circumferential direction.

  The power source shielding member 120 is made of polycarbonate resin or the like that does not transmit light, and covers the electronic components of the lighting circuit mounted on the LED unit substrate 130.

  As shown in FIGS. 15 and 16, the power source shielding member 120 is generally a butterfly cylindrical body, and includes a central disk portion 120a and arc frame portions (protruding portions) 120b and 120c projecting on both sides thereof. The portions that are integrally formed and where the arc frame portions 120b and 120c are not formed are mounting escape portions 120d and 120e.

  An opening 120f is formed at the center of the central disk portion 120a, and an LED element 130f of the LED unit substrate 130 described later is exposed from the opening 120f. Moreover, the center disk part 120a becomes mortar shape, and the inclined surface is formed toward the opening part 120f. The inclined surface is a light reflecting surface by a method such as application of a highly reflecting sheet or application of a highly reflecting resin. Further, a plurality of elongated engagement holes 120p (three in this embodiment) are formed at equal intervals on the upper peripheral edge of the central disk portion 120a. The central disk portion 120a and the arc frame portions 120b and 120c are concentric curved bodies. Here, one arc frame portion 120c has a longer arc length than the other arc frame portion 120b.

  Stepped side band portions 120h are formed on the outer peripheral portions of the arc frame portions 120b and 120c of the power source shielding member 120, and hooking portions 120i are formed at a plurality of locations in the circumferential direction of the side band portions 120h. (Three locations in this example). The hook portion 120i has a substantially concave shape, and is formed with a slide portion 120q and a claw portion 120k that are cut obliquely downward from the upper edge of the side band portion 120h, and the locking claw portion 100a of the cylinder 100 described above. Is guided by the slide part 120a, engages with the hook part 120i, and is locked by the claw part 120k.

  Further, an opening 120g is formed in a part of the mounting escape portion 120d, and a terminal block storage portion having a substantially trapezoidal frame shape as shown in FIG. 16 is formed on the back surface portion of the central disk portion 120a communicating with the opening 120g. 120m is formed. Further, an insertion hole 120j for a power supply electric wire is formed in an end surface near the opening 120g of the mounting escape portion 120b. Furthermore, a screw hole 120n is formed in the back surface portion of the screw mounting portion formed to face the one end surface side of each of the arc frame portions 120b and 120c.

  The translucent cover 110 has a disk shape having an outer diameter corresponding to the outer peripheral edge portion of the central disk portion 120a of the power supply unit shielding member 12 as shown in FIG. 17, and a position corresponding to the engagement hole 120p. A plurality of engaging claws 110a are formed. The translucent cover 110 is mounted so as to cover the central disk part 120a of the power supply part light shielding member 120 by engaging the engaging claw 110a into the central disk part engagement hole 120p of the power supply part light shielding member 120. . The translucent cover 110 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin or the like.

  The LED unit substrate 130 is substantially the same shape as the LED unit substrate 30 of the first embodiment, and as shown in FIG. 20, a central disc portion 130a and arcuate surface portions (projecting surface portions) 130b, 130c projecting on both sides thereof. Is integrally molded. The central disk portion 130a and the arcuate surface portions 130b and 130c are concentric curved bodies. Here, one arcuate surface part 130c has a longer arc length than the other arcuate surface part 130b in order to correspond to the arrangement form of electronic components described later. Further, portions between the central disc portion 130a and the arc surface portions 130b and 130c where the arc surface portions 130b and 130c are not formed are notched mounting escape portions 130d and 130e.

  In the second embodiment, the mounting escape portion 130e side is cut in the direction of the central portion of the central disc portion 130a, and a space for arranging the terminal block 160 described later is secured. A plurality of LED elements 130f are mounted in a circle on the lower surface portion (irradiation surface side) of the central disk portion 130a of the LED unit substrate 130. The central disk portion 130a is the central disk of the first embodiment. Since the mounting area is smaller than that of the portion 30a, the mounting density of the LED elements 130f is increased accordingly. Further, an electronic component (not shown) of a lighting circuit that drives the LED element 130f to be lit is mounted on the circular arc surface portions 130b and 130c.

  The insulating cover 140 is provided with a mounting relief portion 140d (see FIG. 13) in order to secure an arrangement space for a terminal block 160 described later. Since other configurations are the same as those of the first embodiment, description thereof is omitted here.

  The substrate support member 150 is formed by a metal plate, and as shown in FIGS. 21 and 24, is recessed in the lower surface direction (opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 150a. Arc frame portions 150b and 150c are formed. The convex portions where the arc frame portions 150b and 150c are not formed are mounting surface portions 150d and 150e with the mounting plate 2. Dharma-shaped screw holes 150f are respectively opened in the mounting surface portions 150d and 150e. Here, one arc frame portion 150c has a longer arc length than the other arc frame portion 150b.

  At the end of the substrate support member 150, here, the end of the mounting surface 150e, a notch 150g having an opening area in which a terminal block 160 described later is accommodated is formed. The notch 150g is formed by cutting out a section having a predetermined width in the direction of the center of the central disk surface 150a, and an upright piece 150h that is bent substantially in a letter shape is formed. An engaging hole (not shown) for fixing the terminal block 160 is formed in the standing piece 150h.

  As shown in FIG. 22, the terminal block 160 has a plurality of locking projections 160a on the upper surface. The locking protrusion 160a is not particularly limited, but if it is configured to be able to be engaged with the engaging hole of the upright piece 150h with one touch, it is possible to save time and labor such as screwing. The terminal block 160 is inserted into the notch 150g of the substrate support member 150, and is attached to the substrate support member 150 by engaging the locking projection 160a of the terminal block 150g into the engagement hole of the upright piece 150h. An external power supply wire is connected to the terminal block 160, a connection port with the external power supply wire is directed to the external power supply wire insertion hole 2c of the mounting plate 2, and the power supply section of the terminal block 160 and the LED unit board 130 It is the same as that of the first embodiment that the connection port of the power supply wire that conducts is provided.

  Next, an example of a procedure for attaching the LED lighting device described above to an attached part such as a ceiling will be described. First, as in the first embodiment, the external power supply wire (F-cable) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is pulled out from the through hole opened in the ceiling), The through-hole of the external power source wire opened in the ceiling and the external power line insertion hole 2c of the mounting plate 2 are aligned, and the mounting portion 2b of the mounting plate 2 is attached through the screw hole 2d so that the mounting portion 2b faces downward (irradiation direction). The mounting plate 2 is screwed to the part.

  On the other hand, the substrate support member 150, the insulating cover 140, and the LED substrate 130 of the LED lamp main body 200 are fastened and integrated in advance by a plurality of screws 170 (FIGS. 13 and 20). After connecting the terminal block 160, the terminal block 160 is attached to the standing piece 150h of the substrate support member 150 as described above (the state shown in FIG. 20). Since the connection procedure of the terminal block 160 and the external power supply wire is the same as in the first embodiment, the description thereof is omitted here.

  Thereafter, the power source light shielding member 120 is attached to the substrate support member 150 by screws (state of FIG. 19). That is, as shown in FIG. 13, the screw 180 inserted through the through hole 150k of the substrate support member 150 is screwed into the screw hole 120n (FIG. 16) of the power supply light shielding member 120, thereby supporting the power supply light shielding member 120. Fastened to the member 150. At this time, the terminal block 16 attached to the substrate support member 150 is in a state of being stored in the terminal block storage portion 120m of the power source light shielding member 120. Note that the power source light shielding member 120 and the substrate support member 150 may be configured to be detachable by a locking unit. In this way, the power source light shielding member 120 can be attached to the substrate support member 150 after the unit that integrates the substrate support member 150, the insulating cover 140, and the LED substrate 130 is attached to the attachment plate 2, and the terminal block 16 or the like can be easily examined by removing the power source light shielding member 120.

  Next, a unit in which the substrate support member 150, the insulating cover 140, the LED substrate 130, and the power source light shielding member 120 are integrated is attached to the attachment plate 2. That is, the board support member 150 is fixed to the mounting plate 2 by screwing screws 190 (FIGS. 13, 20, and 21) into the screw holes 2f of the mounting plate 2 through the screw holes 150f of the board supporting member 150. Thereafter, the translucent cover 110 is attached to the central disk portion 120a of the power source light shielding member 120 by the above-described method, and finally the engaging claw portion 110a of the housing 100 is engaged with the hooking portion 120i of the power source light shielding member 120. The housing 100 is detachably attached to the power source light shielding member 120.

  According to the second embodiment, since the terminal block 160 is attached to the notch 150g of the substrate support member 150, the terminal block 160 is located above the substrate support member 150 (see FIG. 18 to FIG. 21). In this state, the distance between the LED unit substrate 130 and the translucent cover 120 attached to the power supply shielding member 120 is increased. For this reason, it is possible to prevent or reduce the state in which the LED elements 130f mounted on the LED unit substrate 130 are projected in a granular shape on the translucent cover 120, and a beautiful light emitting surface can be obtained. Moreover, the attachment to a to-be-attached part can also be performed easily.

  Further, by making the power source shielding member 120 made of polycarbonate resin, the insulation can be improved and the material cost can be reduced. Moreover, by forming the mortar-shaped light reflecting surface on the power supply unit shielding member 120, the LED irradiation light can be uniformly reflected over a wide range. Further, since the terminal block 160 is disposed in the cut-out opening portion 150g of the board support member 150, the mounting area of the LED elements 130f of the LED unit board 130 is reduced and the LED elements 130f are densely mounted. The LED irradiation efficiency can be increased in combination with the mortar-shaped light reflecting surface of the part shielding member 120.

  In the present embodiment, the shape of the LED lamp main body 2 is a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.

  As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be made by those skilled in the art are also included in the present invention.

DESCRIPTION OF SYMBOLS 1 LED lamp main body 2 Mounting plate 2b Mounting surface part 10 Case 20 Translucent cover 30 LED unit board 40 Insulating cover 50 Substrate support member 50a Mounting surface part 60 Terminal block 100 LED lamp main body 110 Translucent cover 120 Power supply part light shielding member 130 LED unit substrate 140 Insulation cover 150 Substrate support member 150g Cut opening 150h Standing piece 160 Terminal block

  The present invention relates to an LED lighting device using an LED element as a light source, and relates to a ceiling-mounted LED lighting device that is directly attached to a mounted portion such as a ceiling or a wall surface.

  2. Description of the Related Art In recent years, due to an increase in environmental awareness, a self-powered light bulb type LED lamp using an LED element excellent in power saving as a light source has been widespread. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.

  For example, Patent Literature 1 discloses an LED lighting device in which a storage case for an LED module is directly attached to a ceiling with screws. Patent Document 2 discloses a lighting fixture in which the base of the LED unit is attached to the fixture main body embedded in the ceiling material with a screw, and a form in which the lighting fixture is hung by attaching a hanging tool to the ceiling material.

JP 2011-119206 A JP 2012-182191 A

  However, in patent document 1, since the upper surface portion of the storage case of the LED module is in contact with the ceiling surface, there is a problem in that the heat generated by the LED module cannot be efficiently radiated. Since the boards are arranged independently, there are problems such as an increase in the number of parts and a complicated assembly operation. Further, Patent Document 2 has a configuration in which an LED chip is arranged at the center of a rectangular substrate serving as a light emitting device and a power supply line is joined to the end of the substrate. In such a configuration, the LED chip is turned on. The electronic components constituting the lighting circuit of the LED are cluttered around the LED chip, and it is necessary to widen the board in the length direction or the width direction in order to secure the placement space, and the whole board There is a problem that size increases. Moreover, in Patent Document 2, the number of parts such as a base, a holder, and an inner cover is increased, so that the assembly work is troublesome and expensive, and a large hole has to be opened in order to embed the instrument body on the ceiling surface. The construction work and the mounting work of the lighting fixture on the fixture body, and the type of hanging the lighting fixture on the ceiling material with the hanging tool, the lighting fixture is not only unstable, There are problems such as troublesome connection work between the external power supply wires drawn from the ceiling material and the lighting fixtures.

  The present invention has been proposed in order to solve the above-described problems, and the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. Further, the present invention provides an LED lighting device that can efficiently dissipate heat generated by an LED or the like. In addition, the present invention provides an LED lighting device that enables LED elements and electronic components to be separately arranged on a single substrate, reduces the number of components, is simple in structure, and can be manufactured at low cost. is there.

In order to solve the above-mentioned problem, in the invention of claim 1, there is provided an LED lamp main body in which the LED unit substrate is accommodated and an insertion hole for an external power source electric wire for attaching the LED lamp main body to the attached portion. A mounting plate,
The LED unit substrate has a substantially disk shape in which a notch portion is formed at a position opposed to the peripheral edge portion, a pair of arc surface portions are formed outside the center surface portion, and the arc surface portions serve as mounting surfaces for electronic components, The central surface portion is an LED element mounting surface .

  The invention according to claim 2 is characterized in that the notch portion of the LED unit substrate is a mounting relief portion when the LED lamp main body is mounted on the mounting plate.

  The invention of claim 3 is characterized in that the LED unit substrate is fixed to a substrate support member having heat dissipation properties through an insulating cover.

According to a fourth aspect of the present invention, a concave portion serving as a space portion is formed through the insulating cover at a position corresponding to the circular arc surface portion of the substrate support member and the LED unit substrate .

The invention of claim 5 is characterized in that a power source shielding member for shielding the mounting surface of the electronic component of the LED unit board is disposed on the light emitting side of the LED unit board.

In the invention of claim 6, the power source shielding member includes a mortar-shaped central disk portion having an opening through which the LED element of the LED unit substrate is exposed at the central portion, and the central disk The portion is a light reflecting surface.

The invention according to claim 7 is characterized in that a translucent cover that covers the light emission side of the central disk part is attached to the central disk part of the power supply unit shielding member.

The invention according to claim 8 is characterized in that a housing covering the LED lamp body is detachably provided on the power source shielding member.

Also In the invention of claim 9, wherein the housing is characterized in that the translucent cover that is attached to the power supply unit shielding member has an opening that exposes.

According to the inventions of claims 1 to 9 described above, the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. An LED lighting device that can efficiently dissipate heat can be provided. In addition, it is possible to provide an LED lighting device that enables the LED element and the electronic component to be separately arranged on one substrate, reduces the number of components, and has a simple configuration and can be manufactured at low cost.

The disassembled perspective view of the LED lighting apparatus concerning 1st this embodiment. The perspective view of the housing | casing of the LED lamp main body concerning 1st this embodiment. The perspective view of the translucent cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the LED unit board | substrate of the LED lamp main body concerning 1st this embodiment. The perspective view of the insulation cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the board | substrate support member of the LED lamp main body concerning 1st this embodiment. The perspective view of the mounting plate of the LED lighting apparatus concerning 1st this embodiment. The perspective view of the state which removed the housing | casing and translucent cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 1st this embodiment. The schematic side view which shows the attachment state of the LED lamp main body concerning 1st this embodiment, and an attachment board. The schematic side view of the housing | casing of the LED lamp main body concerning 1st this embodiment. The whole perspective view of the state which removed the housing | casing of the LED lamp apparatus concerning 1st this embodiment. The disassembled perspective view of the LED lighting apparatus concerning 2nd Embodiment. (A) is a perspective view of the surface side of the housing | casing (LED lamp main body) concerning 2nd this embodiment, (b) is a perspective view of the back surface side of a housing | casing. The perspective view of the surface side of the power-source-part shielding member concerning 2nd Embodiment. The perspective view of the back surface side of the power-source-part shielding member concerning 2nd Embodiment. The perspective view seen from the lower side of the translucent cover concerning 2nd Embodiment. The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the translucent cover of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the power-source-part shielding member of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment. The perspective view of the terminal block of the LED lamp main body concerning 2nd Embodiment. The perspective view seen from the bottom face direction of the LED lighting apparatus of the state which removed the housing | casing concerning 2nd Embodiment. The side view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment.

  Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.

(First embodiment)
As shown in FIG. 1, the LED lighting device of the present invention includes an LED lamp body 1 and a mounting plate 2. The LED lamp body 1 includes a housing 10, a translucent cover 20 accommodated in the housing 10, an LED unit substrate 30, an insulating cover 40, a substrate support member 50, and a terminal block as viewed from the LED irradiation direction. (Power supply terminal block) 60 and a schematic configuration.

  As shown in FIG. 2, the casing 10 has a flat and substantially cylindrical shape with an open bottom surface and an exposed hole 10a of the translucent cover 20 on the top surface (irradiation direction). Made of resin. The upper surface peripheral surface portion 10b of the housing 10 has an inclined surface that inclines toward the exposure hole 10a, so that the irradiation light is expanded. The upper edge 10c is an inclined surface that is inclined outward (FIG. 11), and the reflected light is also emitted from the upper edge 10c. The cylindrical body 10 is a cylindrical body here, but the shape thereof is arbitrary, such as an elliptical cylindrical body or a rectangular cylindrical body.

  As shown in FIG. 3, the translucent cover 20 is a generally bottomed cylindrical body having a generally butterfly shape, and includes a central disk portion 20 a and arc frame portions (projecting portions) 20 b projecting on both sides thereof. 20c is integrally formed, and mounting relief portions 20d and 20e are formed in portions where the arc frame portions 20b and 20c are not formed. The central disk portion 20a and the arc frame portions 20b and 20c are concentric curved bodies. Here, one arc frame portion 20c has a longer arc length than the other arc frame portion 20b. The translucent cover 20 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin.

  A locking tongue piece 20g for locking the power supply electric wire is provided on the outer side near the end face of the arc frame portion 20b on the mounting escape portion 20d side of the central disk portion 20a. A locking hole 20f is opened in the locking tongue piece 20g, and a notch 20h is formed in a part thereof. An insertion hole 20j for a power supply electric wire is opened in the end surface portion of the arcuate frame portion 20b near where the locking tongue piece 20g is provided. Further, screw fastening portions 20i into which set screws 50g (FIG. 8) provided on a substrate support member 50 described later are screwed are formed at the circumferential ends of the arc frame portions 20b and 20c. Although not shown, a screw hole is formed on the back surface side of the screw fixing portion 20i. Here, the screw fixing portions 20i are provided at four locations, but the present invention is not limited to this.

  As shown in FIG. 4, the LED unit substrate 30 is a substantially butterfly-shaped substrate, and a central disk portion 30a and arc surface portions (projecting surface portions) 30b and 30c projecting on both sides thereof are integrally formed. . The central disk portion 30a and the arcuate surface portions 30b and 30c are concentric curved bodies. Here, one arcuate surface portion 30c has a longer arc length than the other arcuate surface portion 30b. Further, notch portions between the central disc portion 30a and the arc surface portions 30b and 30c where the arc surface portions 30b and 30c are not formed are provided with mounting escape portions 30d and 30e. As shown in FIG. 8, a plurality of LED elements 30f are mounted in a circle on the lower surface (irradiation surface side) of the central disk portion 30a of the LED unit substrate 30, and the LED elements 30f are mounted on the arcuate surfaces 30b and 30c. An electronic component (not shown) of a lighting circuit for driving and lighting is mounted. This electronic surface component may be disposed on the same plane portion as the LED element 30f in the circular arc surface portions 30b and 30c, or may be disposed on the back surface portion thereof.

  Here, the LED element 30f is disposed on the central disk portion 30a of the LED unit substrate 30 and the electronic components are disposed on the arcuate surface portions 30b and 30c. However, if necessary, the electronic component is disposed on the central disk portion 30a. The LED elements may be arranged on the arcuate surface portions 30b and 30c. In this case, the shapes of the housing 10, the translucent cover 20, the LED unit substrate 30, the insulating cover 40, and the substrate support member 50 are changed correspondingly.

  The electronic components are known electronic components such as various diodes, capacitors, ICs, resistors, and the like for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.

  As described above, the LED unit substrate 30 has the number of components reduced by mounting the LED elements 30f and the electronic components of the lighting circuit that drives the LED elements 30f on the single substrate. In addition, the LED element 30f and the electronic component are arranged in an orderly manner on a single substrate, so that the LED lamp body 1 can be reduced in size.

  As shown in FIG. 5, the insulating cover 40 is formed in a substantially butterfly shape corresponding to the shape of the LED unit substrate 30, and is made of an insulating resin. The insulating cover 40 is formed by integrally forming a central disc portion 40a and concave arcuate frame portions (projecting portions) 40b and 40c projecting on both sides thereof, and portions where these arc frame portions 40b and 40c are not formed are mounted. The escape portions 40d and 40e are formed. The central disc portion 40a and the arc frame portions 40b and 40c are concentric curved bodies. Here, one arc frame portion 40c has a longer arc length than the other arc frame portion 40d.

  As shown in FIG. 6, the substrate support member 50 that supports the LED unit substrate 30 has a substantially disk shape and is formed by a metal plate. The substrate support member 50 is formed with arc frame portions 50b and 50c that are recessed in the lower surface direction (direction opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 50a. The convex portions where 50c is not formed are mounting surface portions 50d, 50e with the mounting plate 2. Dharma-shaped screw holes 50f are respectively opened in the mounting surface portions 50d and 50e. Here, one arc frame portion 50c has a longer arc length than the other arc frame portion 50b.

  On the support surface side of the LED unit substrate 30 of the substrate support member 50 (the back surface side in FIG. 6), as shown in FIG. A screw 50g is provided. Further, a notch hole 50h (not shown in FIG. 6) through which the power supply wire is inserted is formed in the mounting surface portion 50e.

  The terminal block 60 is attached to the lower surface portion of the substrate support member 50 with screws or the like, and a connection port of an external power supply wire (F cable) drawn out from a mounted portion such as a ceiling is a mounting plate 2 described later. The external power supply electric wire insertion hole 2c is provided. FIGS. 10 and 12 show the terminal block 60, but the connection port with the external power supply wire is not shown here because it is provided on the back side. On the surface side of the terminal block 60, a connection port 60a for a power supply wire that conducts the external power supply wire and the power supply unit of the LED unit substrate 30 is provided.

  The power supply wire connected to the connection port 60a passes through the notch hole 50h of the substrate support member 50, and passes through the insertion hole 20j through the locking hole 20f of the locking tongue piece 20g of the translucent cover 20, as shown in FIG. By being inserted into the interior of the translucent cover 20, the power unit of the LED unit substrate 30 is connected. Since the notch 20h is formed in the locking hole 20f, the power supply wire can be passed through the locking hole 20f regardless of the assembly order. These connection operations are performed in the assembly process of the LED lamp main body 1. A known terminal block 60 can be used.

  As shown in FIG. 7, the mounting plate 2 is a horizontally long metal plate, and both end edges in the length direction are formed in an arc shape matching the outer diameter surface of the housing 10. A pair of mounting surface portions 2b of the LED lamp body 1 erected in an L-shape is formed at both ends on the long side of the main body surface portion 2a of the mounting plate 2, and screw holes 2f are opened in the mounting surface portion 2b. Has been. An insertion hole 2c for an external power source electric wire is opened at the center of the main body surface portion 2a, and a plurality of screw holes 2d for mounting the mounting plate 2 on a mounted portion such as a ceiling are mutually connected near the mounting portion 2b. It is formed in a different direction. A plurality of beads 2e are formed on the main body surface portion 2a. It should be noted that an elastic member such as a sponge is interposed between the mounting plate 2 and the mounted portion and sealed to prevent dust, insects, etc. from entering the LED lamp main body 1 and the vibration of the mounted portion is reduced to the LED. Propagation to the lamp body 1 can be prevented.

  As shown in FIG. 8, the LED lamp main body 1 is integrated by attaching the LED unit substrate 30 to the upper surface portion of the substrate support member 50 via an insulating cover 40 by screws or the like. In this state, the concave arc frame portions 40b and 40c of the insulating cover 40 are fitted into the concave arc frame portions 50b and 50c of the substrate support member 50, and the central disk portion 30a of the LED unit substrate 30 is located at the center of the insulating cover 40. The central disc surface portion 50a of the substrate support member 50 is in contact with the disc portion 40a. Further, the arc surface portions 30 b and 30 c of the LED unit substrate 30 are separated from the concave arc frame portions 50 b and 50 c of the substrate support member 50 and the concave arc frame portions 40 b and 40 c of the insulating cover 40.

  And when the said electronic component is mounted in the back surface part (opposite surface of an irradiation surface) of the LED unit board | substrate 30, the electronic component will be accommodated in this spaced apart space part, The surface of the LED lamp unit board | substrate 30 When the electronic component is arranged on the portion (irradiation surface side), the space portion becomes the heat radiating portion of the electronic component.

  As shown in FIGS. 9 and 12, the translucent cover 20 is put on the LED unit substrate 30 (on the irradiation slope side), and the set screw 50 g of the substrate support member 50 is attached to the translucent cover 20. The board support member 50 and the translucent cover 20 are fixed by screwing into the screw fastening part 20i. The translucent cover 20 is covered with a casing 10 (not shown in FIGS. 9 and 12). In this state, the arc frame portions 20b and 20c of the translucent cover 20 cover the arc surface portions 30d and 30e of the corresponding LED unit substrate 30, and the central disk portion 20a of the translucent cover 20 as shown in FIG. Swells from the exposure hole 10 a of the housing 10. Further, the electronic components and the like mounted on the arc surface portions 30 d and 30 e of the LED unit substrate 30 are the edge surface portions (upper surface peripheral surface portion 10 b and upper end edge portion 10 c) of the housing 10 and the arc frame portion of the translucent cover 20. It will be hidden by 20b, 20c. In addition, the fixing method of the board | substrate support member 50 and the translucent cover 20 is not limited to the structure mentioned above.

  The shape of the LED unit substrate 30 described above can change the size and shape of the arcuate surface portions 30b, 30c depending on the arrangement position of the electronic components. Correspondingly, the arc frame portion 20c of the translucent cover 20 is insulated. The size and shape of the arc frame portions 40b and 40c of the cover 40 and the arc frame portions 50b and 50c of the substrate support member 50 can be changed.

When attaching the LED lamp main body 1 to a mounted portion such as a ceiling, first, an external power supply wire ( F cable ) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is opened through the ceiling). Pull out from the hole), align the through hole of the external power supply wire opened in the ceiling with the external power line insertion hole 2c of the mounting plate 2, and screw the mounting part 2b of the mounting plate 2 downward (irradiation direction) The mounting plate 2 is screwed to the mounted portion through the hole 2d.

  Next, after connecting the external power supply wire to the terminal block 60, the mounting surface portions 50d, 50e of the substrate support member 50 of the LED lamp body 1 and the mounting surface portion 2b of the mounting plate are aligned, and the screw 3 (FIG. 8 and Fig. 9). At this time, if the housing 10 is removed, the mounting escape portions 20d and 20e of the translucent cover 20, the mounting escape portions 30d and 30e of the LED unit substrate 30, and the mounting escape portions 40d and 40e of the insulating cover 40 correspond. Therefore, the screwing operation can be easily performed.

  By mounting the LED lamp body 1 on the mounting plate 2 in this manner, a space portion 70 is generated between the LED board support member 50 and the mounting plate 2 as schematically shown in FIG. The terminal block 60 is disposed on the portion 70. Further, the heat generated in the LED unit substrate 30 is transmitted to the LED substrate support member 50 and radiated to the space portion 70.

(Second Embodiment)
13 to 24 show a second embodiment of the present invention. As shown in FIG. 13, the LED lighting device of the second embodiment includes an LED lamp body 200 and a mounting plate 2. Since the configuration of the mounting plate 2 is the same as that of the first embodiment, the description thereof is omitted here. The LED lamp body 200 includes a housing 100, a translucent cover 110 housed therein, a power source shielding member 120, an LED unit substrate 130, an insulating cover 140, a substrate, as viewed from the LED irradiation direction. The support member 150 and a terminal block (power supply terminal block) 160 mounted on the substrate support member 150 are schematically configured.

  14 (a) and 14 (b) show the housing 100, and FIG. 14 (a) also shows the overall shape after the assembly of the LED lamp main body 200 of the present embodiment. Since the configuration of the housing 100 is substantially the same as that of the first embodiment, a detailed description thereof will be omitted here, but as shown in FIG. As described above, the locking claw portions 100a that engage with the hooking portions 120i of the power supply portion shielding member 120 are provided to protrude in a plurality of locations (here, three locations) in the circumferential direction.

  The power source shielding member 120 is made of polycarbonate resin or the like that does not transmit light, and covers the electronic components of the lighting circuit mounted on the LED unit substrate 130.

  As shown in FIGS. 15 and 16, the power source shielding member 120 is generally a butterfly cylindrical body, and includes a central disk portion 120a and arc frame portions (protruding portions) 120b and 120c projecting on both sides thereof. The portions that are integrally formed and where the arc frame portions 120b and 120c are not formed are mounting escape portions 120d and 120e.

  An opening 120f is formed at the center of the central disk portion 120a, and an LED element 130f of the LED unit substrate 130 described later is exposed from the opening 120f. Moreover, the center disk part 120a becomes mortar shape, and the inclined surface is formed toward the opening part 120f. The inclined surface is a light reflecting surface by a method such as application of a highly reflecting sheet or application of a highly reflecting resin. Further, a plurality of elongated engagement holes 120p (three in this embodiment) are formed at equal intervals on the upper peripheral edge of the central disk portion 120a. The central disk portion 120a and the arc frame portions 120b and 120c are concentric curved bodies. Here, one arc frame portion 120c has a longer arc length than the other arc frame portion 120b.

  Stepped side band portions 120h are formed on the outer peripheral portions of the arc frame portions 120b and 120c of the power source shielding member 120, and hooking portions 120i are formed at a plurality of locations in the circumferential direction of the side band portions 120h. (Three locations in this example). The hook portion 120i has a substantially concave shape, and is formed with a slide portion 120q and a claw portion 120k that are cut obliquely downward from the upper edge of the side band portion 120h, and the locking claw portion 100a of the cylinder 100 described above. Is guided by the slide part 120a, engages with the hook part 120i, and is locked by the claw part 120k.

  Further, an opening 120g is formed in a part of the mounting escape portion 120d, and a terminal block storage portion having a substantially trapezoidal frame shape as shown in FIG. 16 is formed on the back surface portion of the central disk portion 120a communicating with the opening 120g. 120m is formed. Further, an insertion hole 120j for a power supply electric wire is formed in an end surface near the opening 120g of the mounting escape portion 120b. Furthermore, a screw hole 120n is formed in the back surface portion of the screw mounting portion formed to face the one end surface side of each of the arc frame portions 120b and 120c.

As shown in FIG. 17, the translucent cover 110 has a disk shape having an outer diameter corresponding to the outer peripheral edge of the central disk portion 120a of the power source shielding member 120 , and a position corresponding to the engagement hole 120p. A plurality of engaging claws 110a are formed. The light-transmitting cover 110, by engaged with the engaging claw 110a in the central disc portion engaging hole 120p power shielding element 120, and are mounted so as to cover the central disc portion 120a of the power supply shielding element 120 . The translucent cover 110 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin or the like.

  The LED unit substrate 130 is substantially the same shape as the LED unit substrate 30 of the first embodiment, and as shown in FIG. 20, a central disc portion 130a and arcuate surface portions (projecting surface portions) 130b, 130c projecting on both sides thereof. Is integrally molded. The central disk portion 130a and the arcuate surface portions 130b and 130c are concentric curved bodies. Here, one arcuate surface part 130c has a longer arc length than the other arcuate surface part 130b in order to correspond to the arrangement form of electronic components described later. Further, portions between the central disc portion 130a and the arc surface portions 130b and 130c where the arc surface portions 130b and 130c are not formed are notched mounting escape portions 130d and 130e.

  In the second embodiment, the mounting escape portion 130e side is cut in the direction of the central portion of the central disc portion 130a, and a space for arranging the terminal block 160 described later is secured. A plurality of LED elements 130f are mounted in a circle on the lower surface portion (irradiation surface side) of the central disk portion 130a of the LED unit substrate 130. The central disk portion 130a is the central disk of the first embodiment. Since the mounting area is smaller than that of the portion 30a, the mounting density of the LED elements 130f is increased accordingly. Further, an electronic component (not shown) of a lighting circuit that drives the LED element 130f to be lit is mounted on the circular arc surface portions 130b and 130c.

  The insulating cover 140 is provided with a mounting relief portion 140d (see FIG. 13) in order to secure an arrangement space for a terminal block 160 described later. Since other configurations are the same as those of the first embodiment, description thereof is omitted here.

  The substrate support member 150 is formed by a metal plate, and as shown in FIGS. 21 and 24, is recessed in the lower surface direction (opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 150a. Arc frame portions 150b and 150c are formed. The convex portions where the arc frame portions 150b and 150c are not formed are mounting surface portions 150d and 150e with the mounting plate 2. Dharma-shaped screw holes 150f are respectively opened in the mounting surface portions 150d and 150e. Here, one arc frame portion 150c has a longer arc length than the other arc frame portion 150b.

  At the end of the substrate support member 150, here, the end of the mounting surface 150e, a notch 150g having an opening area in which a terminal block 160 described later is accommodated is formed. The notch 150g is formed by cutting out a section having a predetermined width in the direction of the center of the central disk surface 150a, and an upright piece 150h that is bent substantially in a letter shape is formed. An engaging hole (not shown) for fixing the terminal block 160 is formed in the standing piece 150h.

  As shown in FIG. 22, the terminal block 160 has a plurality of locking projections 160a on the upper surface. The locking protrusion 160a is not particularly limited, but if it is configured to be able to be engaged with the engaging hole of the upright piece 150h with one touch, it is possible to save time and labor such as screwing. The terminal block 160 is inserted into the notch 150g of the substrate support member 150, and is attached to the substrate support member 150 by engaging the locking projection 160a of the terminal block 150g into the engagement hole of the upright piece 150h. An external power supply wire is connected to the terminal block 160, a connection port with the external power supply wire is directed to the external power supply wire insertion hole 2c of the mounting plate 2, and the power supply section of the terminal block 160 and the LED unit board 130 It is the same as that of the first embodiment that the connection port of the power supply wire that conducts is provided.

Next, an example of a procedure for attaching the LED lighting device described above to an attached part such as a ceiling will be described. First, as in the first embodiment, the external power supply wire ( F cable ) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is pulled out from the through hole opened in the ceiling), the ceiling The through-hole of the external power supply wire opened in the hole and the external power line insertion hole 2c of the mounting plate 2 are matched, and the mounted portion is passed through the screw hole 2d so that the mounting portion 2b of the mounting plate 2 faces downward (irradiation direction). The mounting plate 2 is screwed to.

  On the other hand, the substrate support member 150, the insulating cover 140, and the LED substrate 130 of the LED lamp main body 200 are fastened and integrated in advance by a plurality of screws 170 (FIGS. 13 and 20). After connecting the terminal block 160, the terminal block 160 is attached to the standing piece 150h of the substrate support member 150 as described above (the state shown in FIG. 20). Since the connection procedure of the terminal block 160 and the external power supply wire is the same as in the first embodiment, the description thereof is omitted here.

Thereafter, the power source shielding member 120 is attached to the substrate support member 150 by screws (state of FIG. 19). That is, as shown in FIG. 13, by screwing the screw hole 120n of the power supply shielding element 120 screws 180 inserted through the through hole 150k of the substrate support member 150 (FIG. 16), the power shielding element 120 substrate supporting Fastened to the member 150. In this case, the terminal block 16 attached to the substrate support member 150 is in a state of being housed in the terminal block housing unit 120m of the power unit shielding 蔽部 member 120. Note that the power supply shielding member 120 and the substrate support member 150 may be configured to be detachable by a locking unit. In this way, the power supply shielding member 120 can be attached to the substrate support member 150 after the unit that integrates the substrate support member 150, the insulating cover 140, and the LED substrate 130 is attached to the attachment plate 2, and the terminal block 16 or the like can be easily checked by removing the power supply shielding member 120.

Next, a unit in which the substrate support member 150, the insulating cover 140, the LED substrate 130, and the power source shielding member 120 are integrated is attached to the attachment plate 2. That is, the board support member 150 is fixed to the mounting plate 2 by screwing screws 190 (FIGS. 13, 20, and 21) into the screw holes 2f of the mounting plate 2 through the screw holes 150f of the board supporting member 150. Thereafter, the translucent cover 110 is attached to the central disk portion 120a of the power supply unit shielding member 120 by the above-described method, and finally the engaging claw portion 110a of the housing 100 is engaged with the hooking portion 120i of the power supply unit shielding member 120. The housing 100 is removably attached to the power source shielding member 120.

According to the second embodiment, since the terminal block 160 is attached to the notch 150g of the substrate support member 150, the terminal block 160 is located above the substrate support member 150 (see FIG. 18 to FIG. 21). In this state, the distance between the LED unit substrate 130 and the translucent cover 110 attached to the power supply shielding member 120 is increased. For this reason, it is possible to prevent or reduce the state in which the LED elements 130f mounted on the LED unit substrate 130 are projected in a granular shape on the translucent cover 110 , and a beautiful light emitting surface can be obtained. Moreover, the attachment to a to-be-attached part can also be performed easily.

  Further, by making the power source shielding member 120 made of polycarbonate resin, the insulation can be improved and the material cost can be reduced. Moreover, by forming the mortar-shaped light reflecting surface on the power supply unit shielding member 120, the LED irradiation light can be uniformly reflected over a wide range. Further, since the terminal block 160 is disposed in the cut-out opening portion 150g of the board support member 150, the mounting area of the LED elements 130f of the LED unit board 130 is reduced and the LED elements 130f are densely mounted. The LED irradiation efficiency can be increased in combination with the mortar-shaped light reflecting surface of the part shielding member 120.

  In the present embodiment, the shape of the LED lamp main body 2 is a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.

  As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be made by those skilled in the art are also included in the present invention.

DESCRIPTION OF SYMBOLS 1 LED lamp main body 2 Mounting plate 2b Mounting surface part 10 Case 20 Translucent cover 30 LED unit board 40 Insulating cover 50 Substrate support member 50a Mounting surface part 60 Terminal block 100 LED lamp main body 110 Translucent cover 120 Power supply part shielding member 130 LED unit substrate 140 Insulation cover 150 Substrate support member 150g Cut opening 150h Standing piece 160 Terminal block

  The present invention relates to an LED lighting device using an LED element as a light source, and relates to a ceiling-mounted LED lighting device that is directly attached to a mounted portion such as a ceiling or a wall surface.

  2. Description of the Related Art In recent years, due to an increase in environmental awareness, a self-powered light bulb type LED lamp using an LED element excellent in power saving as a light source has been widespread. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.

  For example, Patent Literature 1 discloses an LED lighting device in which a storage case for an LED module is directly attached to a ceiling with screws. Patent Document 2 discloses a lighting fixture in which the base of the LED unit is attached to the fixture main body embedded in the ceiling material with a screw, and a form in which the lighting fixture is hung by attaching a hanging tool to the ceiling material.

JP 2011-119206 A JP 2012-182191 A

  However, in patent document 1, since the upper surface portion of the storage case of the LED module is in contact with the ceiling surface, there is a problem in that the heat generated by the LED module cannot be efficiently radiated. Since the boards are arranged independently, there are problems such as an increase in the number of parts and a complicated assembly operation. Further, Patent Document 2 has a configuration in which an LED chip is arranged at the center of a rectangular substrate serving as a light emitting device and a power supply line is joined to the end of the substrate. In such a configuration, the LED chip is turned on. The electronic components constituting the lighting circuit of the LED are cluttered around the LED chip, and it is necessary to widen the board in the length direction or the width direction in order to secure the placement space, and the whole board There is a problem that size increases. Moreover, in Patent Document 2, the number of parts such as a base, a holder, and an inner cover is increased, so that the assembly work is troublesome and expensive, and a large hole has to be opened in order to embed the instrument body on the ceiling surface. The construction work and the mounting work of the lighting fixture on the fixture body, and the type of hanging the lighting fixture on the ceiling material with the hanging tool, the lighting fixture is not only unstable, There are problems such as troublesome connection work between the external power supply wires drawn from the ceiling material and the lighting fixtures.

  The present invention has been proposed in order to solve the above-described problems, and the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. Further, the present invention provides an LED lighting device that can efficiently dissipate heat generated by an LED or the like. In addition, the present invention provides an LED lighting device that enables LED elements and electronic components to be separately arranged on a single substrate, reduces the number of components, is simple in structure, and can be manufactured at low cost. is there.

In order to solve the above-mentioned problem, in the invention of claim 1, there is provided an LED lamp main body in which the LED unit substrate is accommodated and an insertion hole for an external power source electric wire for attaching the LED lamp main body to the attached portion. A mounting plate,
The LED unit substrate has a substantially disk shape in which a notch portion is formed at a position opposed to the peripheral edge portion, a pair of arc surface portions are formed outside the center surface portion, and the arc surface portions serve as mounting surfaces for electronic components, The central surface portion is an LED element mounting surface.

  The invention according to claim 2 is characterized in that the notch portion of the LED unit substrate is a mounting relief portion when the LED lamp main body is mounted on the mounting plate.

  The invention of claim 3 is characterized in that the LED unit substrate is fixed to a substrate support member having heat dissipation properties through an insulating cover.

According to a fourth aspect of the present invention, a concave portion serving as a space portion is formed through the insulating cover at a position corresponding to the arc surface portion of the LED unit substrate in the substrate support member.

  The invention of claim 5 is characterized in that a power source shielding member for shielding the mounting surface of the electronic component of the LED unit board is disposed on the light emitting side of the LED unit board.

  In the invention of claim 6, the power source shielding member includes a mortar-shaped central disk portion having an opening through which the LED element of the LED unit substrate is exposed at the central portion, and the central disk The portion is a light reflecting surface.

  The invention according to claim 7 is characterized in that a translucent cover that covers the light emission side of the central disk part is attached to the central disk part of the power supply unit shielding member.

  The invention according to claim 8 is characterized in that a housing covering the LED lamp body is detachably provided on the power source shielding member.

  The invention according to claim 9 is characterized in that the casing has an opening through which the translucent cover attached to the power source shielding member is exposed.

  According to the inventions of claims 1 to 9 described above, the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. An LED lighting device that can efficiently dissipate heat can be provided. In addition, it is possible to provide an LED lighting device that enables the LED element and the electronic component to be separately arranged on one substrate, reduces the number of components, and has a simple configuration and can be manufactured at low cost.

The disassembled perspective view of the LED lighting apparatus concerning 1st this embodiment. The perspective view of the housing | casing of the LED lamp main body concerning 1st this embodiment. The perspective view of the translucent cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the LED unit board | substrate of the LED lamp main body concerning 1st this embodiment. The perspective view of the insulation cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the board | substrate support member of the LED lamp main body concerning 1st this embodiment. The perspective view of the mounting plate of the LED lighting apparatus concerning 1st this embodiment. The perspective view of the state which removed the housing | casing and translucent cover of the LED lamp main body concerning 1st this embodiment. The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 1st this embodiment. The schematic side view which shows the attachment state of the LED lamp main body concerning 1st this embodiment, and an attachment board. The schematic side view of the housing | casing of the LED lamp main body concerning 1st this embodiment. The whole perspective view of the state which removed the housing | casing of the LED lamp apparatus concerning 1st this embodiment. The disassembled perspective view of the LED lighting apparatus concerning 2nd Embodiment. (A) is a perspective view of the surface side of the housing | casing (LED lamp main body) concerning 2nd this embodiment, (b) is a perspective view of the back surface side of a housing | casing. The perspective view of the surface side of the power-source-part shielding member concerning 2nd Embodiment. The perspective view of the back surface side of the power-source-part shielding member concerning 2nd Embodiment. The perspective view seen from the lower side of the translucent cover concerning 2nd Embodiment. The perspective view of the state which removed the housing | casing of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the translucent cover of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the power-source-part shielding member of the LED lamp main body concerning 2nd Embodiment. The perspective view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment. The perspective view of the terminal block of the LED lamp main body concerning 2nd Embodiment. The perspective view seen from the bottom face direction of the LED lighting apparatus of the state which removed the housing | casing concerning 2nd Embodiment. The side view of the state which removed the LED unit board | substrate of the LED lamp main body concerning 2nd Embodiment.

  Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.

(First embodiment)
As shown in FIG. 1, the LED lighting device of the present invention includes an LED lamp body 1 and a mounting plate 2. The LED lamp body 1 includes a housing 10, a translucent cover 20 accommodated in the housing 10, an LED unit substrate 30, an insulating cover 40, a substrate support member 50, and a terminal block as viewed from the LED irradiation direction. (Power supply terminal block) 60 and a schematic configuration.

  As shown in FIG. 2, the casing 10 has a flat and substantially cylindrical shape with an open bottom surface and an exposed hole 10a of the translucent cover 20 on the top surface (irradiation direction). Made of resin. The upper surface peripheral surface portion 10b of the housing 10 has an inclined surface that inclines toward the exposure hole 10a, so that the irradiation light is expanded. The upper edge 10c is an inclined surface that is inclined outward (FIG. 11), and the reflected light is also emitted from the upper edge 10c. The cylindrical body 10 is a cylindrical body here, but the shape thereof is arbitrary, such as an elliptical cylindrical body or a rectangular cylindrical body.

  As shown in FIG. 3, the translucent cover 20 is a generally bottomed cylindrical body having a generally butterfly shape, and includes a central disk portion 20 a and arc frame portions (projecting portions) 20 b projecting on both sides thereof. 20c is integrally formed, and mounting relief portions 20d and 20e are formed in portions where the arc frame portions 20b and 20c are not formed. The central disk portion 20a and the arc frame portions 20b and 20c are concentric curved bodies. Here, one arc frame portion 20c has a longer arc length than the other arc frame portion 20b. The translucent cover 20 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin.

  A locking tongue piece 20g for locking the power supply electric wire is provided on the outer side near the end face of the arc frame portion 20b on the mounting escape portion 20d side of the central disk portion 20a. A locking hole 20f is opened in the locking tongue piece 20g, and a notch 20h is formed in a part thereof. An insertion hole 20j for a power supply electric wire is opened in the end surface portion of the arcuate frame portion 20b near where the locking tongue piece 20g is provided. Further, screw fastening portions 20i into which set screws 50g (FIG. 8) provided on a substrate support member 50 described later are screwed are formed at the circumferential ends of the arc frame portions 20b and 20c. Although not shown, a screw hole is formed on the back surface side of the screw fixing portion 20i. Here, the screw fixing portions 20i are provided at four locations, but the present invention is not limited to this.

  As shown in FIG. 4, the LED unit substrate 30 is a substantially butterfly-shaped substrate, and a central disk portion 30a and arc surface portions (projecting surface portions) 30b and 30c projecting on both sides thereof are integrally formed. . The central disk portion 30a and the arcuate surface portions 30b and 30c are concentric curved bodies. Here, one arcuate surface portion 30c has a longer arc length than the other arcuate surface portion 30b. Further, notch portions between the central disc portion 30a and the arc surface portions 30b and 30c where the arc surface portions 30b and 30c are not formed are provided with mounting escape portions 30d and 30e. As shown in FIG. 8, a plurality of LED elements 30f are mounted in a circle on the lower surface (irradiation surface side) of the central disk portion 30a of the LED unit substrate 30, and the LED elements 30f are mounted on the arcuate surfaces 30b and 30c. An electronic component (not shown) of a lighting circuit for driving and lighting is mounted. This electronic surface component may be disposed on the same plane portion as the LED element 30f in the circular arc surface portions 30b and 30c, or may be disposed on the back surface portion thereof.

  Here, the LED element 30f is disposed on the central disk portion 30a of the LED unit substrate 30 and the electronic components are disposed on the arcuate surface portions 30b and 30c. However, if necessary, the electronic component is disposed on the central disk portion 30a. The LED elements may be arranged on the arcuate surface portions 30b and 30c. In this case, the shapes of the housing 10, the translucent cover 20, the LED unit substrate 30, the insulating cover 40, and the substrate support member 50 are changed correspondingly.

  The electronic components are known electronic components such as various diodes, capacitors, ICs, resistors, and the like for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.

  As described above, the LED unit substrate 30 has the number of components reduced by mounting the LED elements 30f and the electronic components of the lighting circuit that drives the LED elements 30f on the single substrate. In addition, the LED element 30f and the electronic component are arranged in an orderly manner on a single substrate, so that the LED lamp body 1 can be reduced in size.

  As shown in FIG. 5, the insulating cover 40 is formed in a substantially butterfly shape corresponding to the shape of the LED unit substrate 30, and is made of an insulating resin. The insulating cover 40 is formed by integrally forming a central disc portion 40a and concave arcuate frame portions (projecting portions) 40b and 40c projecting on both sides thereof, and portions where these arc frame portions 40b and 40c are not formed are mounted. The escape portions 40d and 40e are formed. The central disc portion 40a and the arc frame portions 40b and 40c are concentric curved bodies. Here, one arc frame portion 40c has a longer arc length than the other arc frame portion 40d.

  As shown in FIG. 6, the substrate support member 50 that supports the LED unit substrate 30 has a substantially disk shape and is formed by a metal plate. The substrate support member 50 is formed with arc frame portions 50b and 50c that are recessed in the lower surface direction (direction opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 50a. The convex portions where 50c is not formed are mounting surface portions 50d, 50e with the mounting plate 2. Dharma-shaped screw holes 50f are respectively opened in the mounting surface portions 50d and 50e. Here, one arc frame portion 50c has a longer arc length than the other arc frame portion 50b.

  On the support surface side of the LED unit substrate 30 of the substrate support member 50 (the back surface side in FIG. 6), as shown in FIG. A screw 50g is provided. Further, a notch hole 50h (not shown in FIG. 6) through which the power supply wire is inserted is formed in the mounting surface portion 50e.

  The terminal block 60 is attached to the lower surface portion of the substrate support member 50 with screws or the like, and a connection port of an external power supply wire (F cable) drawn out from a mounted portion such as a ceiling is a mounting plate 2 described later. The external power supply electric wire insertion hole 2c is provided. FIGS. 10 and 12 show the terminal block 60, but the connection port with the external power supply wire is not shown here because it is provided on the back side. On the surface side of the terminal block 60, a connection port 60a for a power supply wire that conducts the external power supply wire and the power supply unit of the LED unit substrate 30 is provided.

  The power supply wire connected to the connection port 60a passes through the notch hole 50h of the substrate support member 50, and passes through the insertion hole 20j through the locking hole 20f of the locking tongue piece 20g of the translucent cover 20, as shown in FIG. By being inserted into the interior of the translucent cover 20, the power unit of the LED unit substrate 30 is connected. Since the notch 20h is formed in the locking hole 20f, the power supply wire can be passed through the locking hole 20f regardless of the assembly order. These connection operations are performed in the assembly process of the LED lamp main body 1. A known terminal block 60 can be used.

  As shown in FIG. 7, the mounting plate 2 is a horizontally long metal plate, and both end edges in the length direction are formed in an arc shape matching the outer diameter surface of the housing 10. A pair of mounting surface portions 2b of the LED lamp body 1 erected in an L-shape is formed at both ends on the long side of the main body surface portion 2a of the mounting plate 2, and screw holes 2f are opened in the mounting surface portion 2b. Has been. An insertion hole 2c for an external power source electric wire is opened at the center of the main body surface portion 2a, and a plurality of screw holes 2d for mounting the mounting plate 2 on a mounted portion such as a ceiling are mutually connected near the mounting portion 2b. It is formed in a different direction. A plurality of beads 2e are formed on the main body surface portion 2a. It should be noted that an elastic member such as a sponge is interposed between the mounting plate 2 and the mounted portion and sealed to prevent dust, insects, etc. from entering the LED lamp main body 1 and the vibration of the mounted portion is reduced to the LED. Propagation to the lamp body 1 can be prevented.

  As shown in FIG. 8, the LED lamp main body 1 is integrated by attaching the LED unit substrate 30 to the upper surface portion of the substrate support member 50 via an insulating cover 40 by screws or the like. In this state, the concave arc frame portions 40b and 40c of the insulating cover 40 are fitted into the concave arc frame portions 50b and 50c of the substrate support member 50, and the central disk portion 30a of the LED unit substrate 30 is located at the center of the insulating cover 40. The central disc surface portion 50a of the substrate support member 50 is in contact with the disc portion 40a. Further, the arc surface portions 30 b and 30 c of the LED unit substrate 30 are separated from the concave arc frame portions 50 b and 50 c of the substrate support member 50 and the concave arc frame portions 40 b and 40 c of the insulating cover 40.

  And when the said electronic component is mounted in the back surface part (opposite surface of an irradiation surface) of the LED unit board | substrate 30, the electronic component will be accommodated in this spaced apart space part, The surface of the LED lamp unit board | substrate 30 When the electronic component is arranged on the portion (irradiation surface side), the space portion becomes the heat radiating portion of the electronic component.

  As shown in FIGS. 9 and 12, the translucent cover 20 is put on the LED unit substrate 30 (on the irradiation slope side), and the set screw 50 g of the substrate support member 50 is attached to the translucent cover 20. The board support member 50 and the translucent cover 20 are fixed by screwing into the screw fastening part 20i. The translucent cover 20 is covered with a casing 10 (not shown in FIGS. 9 and 12). In this state, the arc frame portions 20b and 20c of the translucent cover 20 cover the arc surface portions 30d and 30e of the corresponding LED unit substrate 30, and the central disk portion 20a of the translucent cover 20 as shown in FIG. Swells from the exposure hole 10 a of the housing 10. Further, the electronic components and the like mounted on the arc surface portions 30 d and 30 e of the LED unit substrate 30 are the edge surface portions (upper surface peripheral surface portion 10 b and upper end edge portion 10 c) of the housing 10 and the arc frame portion of the translucent cover 20. It will be hidden by 20b, 20c. In addition, the fixing method of the board | substrate support member 50 and the translucent cover 20 is not limited to the structure mentioned above.

  The shape of the LED unit substrate 30 described above can change the size and shape of the arcuate surface portions 30b, 30c depending on the arrangement position of the electronic components. Correspondingly, the arc frame portion 20c of the translucent cover 20 is insulated. The size and shape of the arc frame portions 40b and 40c of the cover 40 and the arc frame portions 50b and 50c of the substrate support member 50 can be changed.

  When the LED lamp body 1 is attached to a mounted portion such as a ceiling, first, an external power supply wire (F cable) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is opened through the ceiling). Pull out from the hole), align the through hole of the external power supply wire opened in the ceiling with the external power line insertion hole 2c of the mounting plate 2, and screw the mounting part 2b of the mounting plate 2 downward (irradiation direction) The mounting plate 2 is screwed to the mounted portion through the hole 2d.

  Next, after connecting the external power supply wire to the terminal block 60, the mounting surface portions 50d, 50e of the substrate support member 50 of the LED lamp body 1 and the mounting surface portion 2b of the mounting plate are aligned, and the screw 3 (FIG. 8 and Fig. 9). At this time, if the housing 10 is removed, the mounting escape portions 20d and 20e of the translucent cover 20, the mounting escape portions 30d and 30e of the LED unit substrate 30, and the mounting escape portions 40d and 40e of the insulating cover 40 correspond. Therefore, the screwing operation can be easily performed.

  By mounting the LED lamp body 1 on the mounting plate 2 in this manner, a space portion 70 is generated between the LED board support member 50 and the mounting plate 2 as schematically shown in FIG. The terminal block 60 is disposed on the portion 70. Further, the heat generated in the LED unit substrate 30 is transmitted to the LED substrate support member 50 and radiated to the space portion 70.

(Second Embodiment)
13 to 24 show a second embodiment of the present invention. As shown in FIG. 13, the LED lighting device of the second embodiment includes an LED lamp body 200 and a mounting plate 2. Since the configuration of the mounting plate 2 is the same as that of the first embodiment, the description thereof is omitted here. The LED lamp body 200 includes a housing 100, a translucent cover 110 housed therein, a power source shielding member 120, an LED unit substrate 130, an insulating cover 140, a substrate, as viewed from the LED irradiation direction. The support member 150 and a terminal block (power supply terminal block) 160 mounted on the substrate support member 150 are schematically configured.

  14 (a) and 14 (b) show the housing 100, and FIG. 14 (a) also shows the overall shape after the assembly of the LED lamp main body 200 of the present embodiment. Since the configuration of the housing 100 is substantially the same as that of the first embodiment, a detailed description thereof will be omitted here, but as shown in FIG. As described above, the locking claw portions 100a that engage with the hooking portions 120i of the power supply portion shielding member 120 are provided to protrude in a plurality of locations (here, three locations) in the circumferential direction.

  The power source shielding member 120 is made of polycarbonate resin or the like that does not transmit light, and covers the electronic components of the lighting circuit mounted on the LED unit substrate 130.

  As shown in FIGS. 15 and 16, the power source shielding member 120 is generally a butterfly cylindrical body, and includes a central disk portion 120a and arc frame portions (protruding portions) 120b and 120c projecting on both sides thereof. The portions that are integrally formed and where the arc frame portions 120b and 120c are not formed are mounting escape portions 120d and 120e.

  An opening 120f is formed at the center of the central disk portion 120a, and an LED element 130f of the LED unit substrate 130 described later is exposed from the opening 120f. Moreover, the center disk part 120a becomes mortar shape, and the inclined surface is formed toward the opening part 120f. The inclined surface is a light reflecting surface by a method such as application of a highly reflecting sheet or application of a highly reflecting resin. Further, a plurality of elongated engagement holes 120p (three in this embodiment) are formed at equal intervals on the upper peripheral edge of the central disk portion 120a. The central disk portion 120a and the arc frame portions 120b and 120c are concentric curved bodies. Here, one arc frame portion 120c has a longer arc length than the other arc frame portion 120b.

  Stepped side band portions 120h are formed on the outer peripheral portions of the arc frame portions 120b and 120c of the power source shielding member 120, and hooking portions 120i are formed at a plurality of locations in the circumferential direction of the side band portions 120h. (Three locations in this example). The hook portion 120i has a substantially concave shape, and is formed with a slide portion 120q and a claw portion 120k that are cut obliquely downward from the upper edge of the side band portion 120h, and the locking claw portion 100a of the cylinder 100 described above. Is guided by the slide part 120a, engages with the hook part 120i, and is locked by the claw part 120k.

  Further, an opening 120g is formed in a part of the mounting escape portion 120d, and a terminal block storage portion having a substantially trapezoidal frame shape as shown in FIG. 16 is formed on the back surface portion of the central disk portion 120a communicating with the opening 120g. 120m is formed. Further, an insertion hole 120j for a power supply electric wire is formed in an end surface near the opening 120g of the mounting escape portion 120b. Furthermore, a screw hole 120n is formed in the back surface portion of the screw mounting portion formed to face the one end surface side of each of the arc frame portions 120b and 120c.

  As shown in FIG. 17, the translucent cover 110 has a disk shape having an outer diameter corresponding to the outer peripheral edge of the central disk portion 120a of the power source shielding member 120, and a position corresponding to the engagement hole 120p. A plurality of engaging claws 110a are formed. The translucent cover 110 is mounted so as to cover the central disk part 120a of the power supply unit shielding member 120 by engaging the engaging claws 110a into the central disk part engagement hole 120p of the power supply unit shielding member 120. . The translucent cover 110 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin or the like.

  The LED unit substrate 130 is substantially the same shape as the LED unit substrate 30 of the first embodiment, and as shown in FIG. 20, a central disc portion 130a and arcuate surface portions (projecting surface portions) 130b, 130c projecting on both sides thereof. Is integrally molded. The central disk portion 130a and the arcuate surface portions 130b and 130c are concentric curved bodies. Here, one arcuate surface part 130c has a longer arc length than the other arcuate surface part 130b in order to correspond to the arrangement form of electronic components described later. Further, portions between the central disc portion 130a and the arc surface portions 130b and 130c where the arc surface portions 130b and 130c are not formed are notched mounting escape portions 130d and 130e.

  In the second embodiment, the mounting escape portion 130e side is cut in the direction of the central portion of the central disc portion 130a, and a space for arranging the terminal block 160 described later is secured. A plurality of LED elements 130f are mounted in a circle on the lower surface portion (irradiation surface side) of the central disk portion 130a of the LED unit substrate 130. The central disk portion 130a is the central disk of the first embodiment. Since the mounting area is smaller than that of the portion 30a, the mounting density of the LED elements 130f is increased accordingly. Further, an electronic component (not shown) of a lighting circuit that drives the LED element 130f to be lit is mounted on the circular arc surface portions 130b and 130c.

  The insulating cover 140 is provided with a mounting relief portion 140d (see FIG. 13) in order to secure an arrangement space for a terminal block 160 described later. Since other configurations are the same as those of the first embodiment, description thereof is omitted here.

  The substrate support member 150 is formed by a metal plate, and as shown in FIGS. 21 and 24, is recessed in the lower surface direction (opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 150a. Arc frame portions 150b and 150c are formed. The convex portions where the arc frame portions 150b and 150c are not formed are mounting surface portions 150d and 150e with the mounting plate 2. Dharma-shaped screw holes 150f are respectively opened in the mounting surface portions 150d and 150e. Here, one arc frame portion 150c has a longer arc length than the other arc frame portion 150b.

  At the end of the substrate support member 150, here, the end of the mounting surface 150e, a notch 150g having an opening area in which a terminal block 160 described later is accommodated is formed. The notch 150g is formed by cutting out a section having a predetermined width in the direction of the center of the central disk surface 150a, and an upright piece 150h that is bent substantially in a letter shape is formed. An engaging hole (not shown) for fixing the terminal block 160 is formed in the standing piece 150h.

  As shown in FIG. 22, the terminal block 160 has a plurality of locking projections 160a on the upper surface. The locking protrusion 160a is not particularly limited, but if it is configured to be able to be engaged with the engaging hole of the upright piece 150h with one touch, it is possible to save time and labor such as screwing. The terminal block 160 is inserted into the notch 150g of the substrate support member 150, and is attached to the substrate support member 150 by engaging the locking projection 160a of the terminal block 150g into the engagement hole of the upright piece 150h. An external power supply wire is connected to the terminal block 160, a connection port with the external power supply wire is directed to the external power supply wire insertion hole 2c of the mounting plate 2, and the power supply section of the terminal block 160 and the LED unit board 130 It is the same as that of the first embodiment that the connection port of the power supply wire that conducts is provided.

  Next, an example of a procedure for attaching the LED lighting device described above to an attached part such as a ceiling will be described. First, as in the first embodiment, the external power supply wire (F cable) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is pulled out from the through hole opened in the ceiling), the ceiling The through-hole of the external power supply wire opened in the hole and the external power line insertion hole 2c of the mounting plate 2 are matched, and the mounted portion is passed through the screw hole 2d so that the mounting portion 2b of the mounting plate 2 faces downward (irradiation direction). The mounting plate 2 is screwed to.

  On the other hand, the substrate support member 150, the insulating cover 140, and the LED substrate 130 of the LED lamp main body 200 are fastened and integrated in advance by a plurality of screws 170 (FIGS. 13 and 20). After connecting the terminal block 160, the terminal block 160 is attached to the standing piece 150h of the substrate support member 150 as described above (the state shown in FIG. 20). Since the connection procedure of the terminal block 160 and the external power supply wire is the same as in the first embodiment, the description thereof is omitted here.

  Thereafter, the power source shielding member 120 is attached to the substrate support member 150 by screws (state of FIG. 19). That is, as shown in FIG. 13, the screw 180 inserted through the through hole 150 k of the substrate support member 150 is screwed into the screw hole 120 n (FIG. 16) of the power supply shield member 120, thereby supporting the power supply shield member 120. Fastened to the member 150. At this time, the terminal block 16 attached to the board support member 150 is stored in the terminal block storage section 120m of the power supply section shielding member 120. Note that the power supply shielding member 120 and the substrate support member 150 may be configured to be detachable by a locking unit. In this way, the power supply shielding member 120 can be attached to the substrate support member 150 after the unit that integrates the substrate support member 150, the insulating cover 140, and the LED substrate 130 is attached to the attachment plate 2, and the terminal block 16 or the like can be easily checked by removing the power supply shielding member 120.

  Next, a unit in which the substrate support member 150, the insulating cover 140, the LED substrate 130, and the power source shielding member 120 are integrated is attached to the attachment plate 2. That is, the board support member 150 is fixed to the mounting plate 2 by screwing screws 190 (FIGS. 13, 20, and 21) into the screw holes 2f of the mounting plate 2 through the screw holes 150f of the board supporting member 150. Thereafter, the translucent cover 110 is attached to the central disk portion 120a of the power supply unit shielding member 120 by the above-described method, and finally the engaging claw portion 110a of the housing 100 is engaged with the hooking portion 120i of the power supply unit shielding member 120. The housing 100 is removably attached to the power source shielding member 120.

  According to the second embodiment, since the terminal block 160 is attached to the notch 150g of the substrate support member 150, the terminal block 160 is located above the substrate support member 150 (see FIG. 18 to FIG. 21). In this state, the distance between the LED unit substrate 130 and the translucent cover 110 attached to the power supply shielding member 120 is increased. For this reason, it is possible to prevent or reduce the state in which the LED elements 130f mounted on the LED unit substrate 130 are projected in a granular shape on the translucent cover 110, and a beautiful light emitting surface can be obtained. Moreover, the attachment to a to-be-attached part can also be performed easily.

  Further, by making the power source shielding member 120 made of polycarbonate resin, the insulation can be improved and the material cost can be reduced. Moreover, by forming the mortar-shaped light reflecting surface on the power supply unit shielding member 120, the LED irradiation light can be uniformly reflected over a wide range. Further, since the terminal block 160 is disposed in the cut-out opening portion 150g of the board support member 150, the mounting area of the LED elements 130f of the LED unit board 130 is reduced and the LED elements 130f are densely mounted. The LED irradiation efficiency can be increased in combination with the mortar-shaped light reflecting surface of the part shielding member 120.

  In the present embodiment, the shape of the LED lamp main body 2 is a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.

  As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be made by those skilled in the art are also included in the present invention.

DESCRIPTION OF SYMBOLS 1 LED lamp main body 2 Mounting plate 2b Mounting surface part 10 Case 20 Translucent cover 30 LED unit board 40 Insulation cover 50 Substrate support member 50a Mounting surface part 60 Terminal block 100 Housing 110 Translucent cover 120 Power supply part shielding member 130 LED Unit substrate 140 Insulation cover 150 Substrate support member 150g Cut opening 150h Standing piece 160 Terminal block

Claims (13)

An LED lamp main body in which the LED unit substrate is housed, and an attachment plate for attaching the LED lamp main body to the attached portion, having an insertion hole for an external power supply wire,
The LED unit substrate has a mounting surface for LED elements on one substrate and a mounting surface for electronic components constituting a lighting circuit for lighting the LED elements,
The LED lighting device, wherein the electronic component mounting surface is formed so as to protrude from an outer side of the LED element mounting surface.   The LED lighting device according to claim 1, wherein the electronic component mounting surface is formed to protrude outward from the LED element mounting surface.   The LED unit substrate has a substantially disk shape in which a notch portion is formed at a position opposed to the peripheral edge portion, and a pair of arc surface portions are formed outside the center surface portion, and the arc surface portions serve as the electronic component mounting surface, The LED lighting device according to claim 1, wherein the central surface portion is the LED element mounting surface.   The LED lighting device according to claim 3, wherein the cutout portion of the LED unit substrate is a mounting escape portion when the LED lamp main body is mounted on the mounting plate.   5. The LED lighting device according to claim 1, wherein the LED unit substrate is fixed to a substrate support member having heat dissipation properties through an insulating cover.   The LED lighting device according to claim 4, wherein a concave portion serving as a space portion is formed at a position corresponding to a protruding portion of the LED unit substrate on the substrate support member and the insulating cover.   The LED illumination device according to any one of claims 1 to 6, wherein a power source shielding member that shields the electronic component mounting surface of the LED unit substrate is disposed on the light emission side of the LED unit substrate. .   The power source light-shielding member includes a mortar-shaped central disc portion having an opening through which the LED element of the LED unit substrate is exposed at the central portion, and the central disc portion is a light reflecting surface. The LED lighting device according to claim 7, wherein   The LED lighting device according to claim 8, wherein a translucent cover that covers a light emission side of the central disk portion is attached to the central disk portion of the power source light shielding member.   The LED lighting device according to claim 1, wherein a casing that covers the LED lamp main body is detachably provided on the power source light shielding member.   The power supply light shielding member and the housing are provided by providing a locking claw portion on the inner surface portion of the housing and providing a hook portion for locking the housing locking claw portion on a side surface portion of the power supply portion light shielding member. The LED illumination device according to claim 10, wherein the LED illumination device is detachable.   The hook portion has a substantially concave shape, and has a slide portion of the housing locking claw portion formed on a side surface portion of the power light shielding member, and a claw portion that is locked by the housing locking claw portion. The LED lighting device according to claim 11, wherein   The LED casing according to any one of claims 10 to 12, wherein the casing has an opening through which a translucent cover attached to the power source light shielding member is exposed.