JP6043676B2 - LED lighting device - Google Patents
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- JP6043676B2 JP6043676B2 JP2013093185A JP2013093185A JP6043676B2 JP 6043676 B2 JP6043676 B2 JP 6043676B2 JP 2013093185 A JP2013093185 A JP 2013093185A JP 2013093185 A JP2013093185 A JP 2013093185A JP 6043676 B2 JP6043676 B2 JP 6043676B2
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Description
本発明は、LED照明装置に関する。 The present invention relates to an LED lighting device.
近年、従来の蛍光ランプに替えて、光源としてLEDを用いた照明装置が種々開発され、例えば、家庭で用いられる吊り下げ形照明器具(ペンダントライト形照明器具)にまで拡大してきている。 In recent years, various lighting devices using LEDs as light sources have been developed in place of conventional fluorescent lamps, and have been expanded to, for example, hanging type lighting fixtures (pendant light type lighting fixtures) used at home.
特許文献1には、ねじ等の固定部品によりLEDを載置した基板を灯具本体に固定したLED照明装置が記載されている。 Patent Document 1 describes an LED lighting device in which a substrate on which an LED is mounted is fixed to a lamp body by a fixing component such as a screw.
特許文献1に記載のLED照明装置では、ねじ等の固定部品によりLEDを載置した基板を灯具本体に固定しているため、製造に要する工数が増す懸念がある。 In the LED illumination device described in Patent Document 1, since the substrate on which the LED is mounted is fixed to the lamp body by a fixing component such as a screw, there is a concern that the number of man-hours required for manufacturing increases.
本発明は、LEDを載置した基板を固定する際の製造工数を低減して、より安価にLED照明装置を提供することを目的とするものである。 An object of the present invention is to provide an LED lighting device at a lower cost by reducing the number of manufacturing steps when fixing a substrate on which an LED is mounted.
LEDと、該LEDを載置する配線基板と、該配線基板を載置する配線基板載置部を備えた放熱板と、前記放熱板を固定するバックボーンと、前記バックボーンに絶縁板を介して取り付けられ前記LEDを制御する電源基板と、前記バックボーンの背面から側面を覆うように前記バックボーンに取り付けられるカバーセード上と、前記カバーセード上に取り付けられ前記LEDの前面を覆うカバーセード下と、を有するLED照明装置において、前記配線基板は、略ドーナツ形状の平板の部品であり、前記LEDを外周縁部まで載置する円形部と、該円形部の外周に設けられた配線基板凸部と、からなり、前記配線基板の周方向の回転により前記配線基板凸部を係止する基板押さえを前記配線基板載置部の外周側に設けた。
An LED, a wiring board on which the LED is mounted, a heat sink having a wiring board mounting portion on which the wiring board is mounted, a backbone for fixing the heat sink, and an insulating plate attached to the backbone A power supply board that controls the LED, a cover shade that is attached to the backbone so as to cover a side surface from the back of the backbone, and a cover shade that is attached on the cover shade and covers the front of the LED. In the LED lighting device, the wiring board is a substantially donut-shaped flat plate component, and includes a circular part on which the LED is mounted to the outer peripheral edge, and a wiring board convex part provided on the outer periphery of the circular part. Thus, a substrate pressing member for locking the wiring substrate convex portion by rotation in the circumferential direction of the wiring substrate is provided on the outer peripheral side of the wiring substrate mounting portion.
LEDを載置した基板を固定する際の製造工数を低減し、より安価にLED照明装置を提供することができる。 The number of manufacturing steps for fixing the substrate on which the LED is mounted can be reduced, and the LED lighting device can be provided at a lower cost.
以下、本発明の実施形態に係るLED照明装置1(LEDペンダントライト)について、図面を参照して詳細に説明する。なお、以下では、LED照明装置1を天井に取り付けたときのようにした状態、すなわち紙面上側が家屋の天井側であり、紙面下側が家屋の床側と下状態を図示しながら説明する。 Hereinafter, an LED lighting device 1 (LED pendant light) according to an embodiment of the present invention will be described in detail with reference to the drawings. In the following, the state when the LED lighting device 1 is attached to the ceiling, that is, the upper side of the paper is the ceiling side of the house, and the lower side of the paper is described with reference to the floor side and the lower state of the house.
図1は、本実施形態に係るLED照明装置1の全体斜視図、図2は図1からセード26を外した器具本体28の全体斜視図、図3は図2の分解斜視図、図4(a)〜(e)はLED基板30の取り付け工程図、図5は図4(e)の基板押さえ15近傍拡大図である。 1 is an overall perspective view of the LED lighting device 1 according to the present embodiment, FIG. 2 is an overall perspective view of an instrument body 28 with the shade 26 removed from FIG. 1, FIG. 3 is an exploded perspective view of FIG. FIGS. 5A to 5E are attachment process diagrams of the LED substrate 30, and FIG. 5 is an enlarged view of the vicinity of the substrate holder 15 in FIG.
以下の説明において、特に断らない限り、LED照明装置1が天井面に取り付けられた状態を基準として、床側(LED13の光放射方向)を“表面側”、天井側を“背面側”と呼ぶ。 In the following description, unless otherwise specified, the floor side (light emission direction of the LED 13) is referred to as the “front side” and the ceiling side is referred to as the “rear side” based on the state where the LED lighting device 1 is attached to the ceiling surface. .
図1に示すように、LED照明装置1は、ペンダントライト形のものであり、吊り具29とセード26とカバーセード上20とカバーセード下10とペンダント紐23などを備えている。吊り具29は器具本体28に接続されている。セード26は器具本体28に固定してもよいし、固定せずにかぶせて係止するのみでもよい。吊り具29を天井に取り付けることで、LED照明装置1を固定することが可能となる。 As shown in FIG. 1, the LED lighting device 1 is of a pendant light type, and includes a hanging tool 29, a shade 26, a cover shade upper 20, a cover shade lower 10, a pendant string 23, and the like. The hanger 29 is connected to the instrument body 28. The shade 26 may be fixed to the instrument main body 28, or may only be covered and locked without being fixed. The LED lighting device 1 can be fixed by attaching the hanging tool 29 to the ceiling.
また、図2に示すように、LED照明装置1からセード26を外した器具本体28は、吊り具29、バックボーン19、カバーセード上20、カバーセード下10、ペンダント紐23などからなる。器具本体28は下から見て丸形となっている。 As shown in FIG. 2, the instrument main body 28 from which the shade 26 is removed from the LED lighting device 1 includes a hanging tool 29, a backbone 19, an upper cover shade 20, a lower cover shade 10, a pendant string 23, and the like. The instrument body 28 has a round shape when viewed from below.
図3に示すように、器具本体28は、吊り具29、バックボーン19、カバーセード上20、絶縁板18、電源基板17、放熱板16、基板押さえ15、LED基板30、遮光カバー12、パッキン11、カバーセード下10、ペンダント紐23などを備えている。なお、本実施形態では、器具本体28が下から見て丸形のものを例に挙げて説明するが、角形のものにも同様に適用することができる。 As shown in FIG. 3, the instrument main body 28 includes a hanging tool 29, a backbone 19, a cover top 20, an insulating plate 18, a power supply board 17, a heat radiating plate 16, a board presser 15, an LED board 30, a light shielding cover 12, and a packing 11. The lower cover cover 10 and the pendant string 23 are provided. In the present embodiment, the instrument body 28 will be described by taking a round shape as viewed from below, but the present invention can be similarly applied to a square shape.
カバーセード上20とカバーセード下10は、透光性(透明、半透明、または、乳白色を含む)を有する樹脂製(例えばポリプロピレンやアクリルやポリスチレンなど)の略円形かつ傘形状の部品である。 The cover shade upper 20 and the cover shade lower 10 are substantially circular and umbrella-shaped parts made of a resin (for example, polypropylene, acrylic, polystyrene, etc.) having translucency (including transparent, translucent, or milky white).
カバーセード上20の背面側には、バックボーン19の背面部が露出するための開口部10aが設けられており、カバーセード上20の表面側の端部には、カバーセード下10の背面側の端部に設けられた環状のカバーセード下凸部10cと嵌合するための環状のカバーセード上凹部20aが設けられている。 An opening 10a for exposing the back surface of the backbone 19 is provided on the back side of the cover shade upper 20, and an end portion on the front side of the cover save top 20 is provided on the back side of the cover shade lower 10 side. An annular cover shade upper concave portion 20a for fitting with an annular cover shade lower convex portion 10c provided at the end is provided.
カバーセード下10の表面側には、カバーセード下10の中央にペンダント紐23が通るための開口部10aが設けられているとともに、開口部10aからLED照明装置1の内部方向(光源基板方向、背面側方向)に突出する円筒部10bと、を備えている。円筒部10bにおける開口部10aとは反対側の端部には、平坦部(図示なし)が設けられている。カバーセード上20と、カバーセード下10は、LED13から放射された光束を拡散させて、使用者がLED照明装置1を直視した際のまぶしさを軽減したり、LED照明装置1が設置された空間の明るさを均一化する役割を果たす。 An opening 10a for pendant string 23 to pass through the center of the cover shade 10 is provided on the surface side of the cover shade 10 and the interior direction of the LED lighting device 1 (light source substrate direction, And a cylindrical portion 10b protruding in the rear side direction). A flat portion (not shown) is provided at the end of the cylindrical portion 10b opposite to the opening 10a. The upper cover shade 20 and the lower cover shade 10 diffuse the luminous flux emitted from the LED 13 to reduce glare when the user looks directly at the LED lighting device 1 or the LED lighting device 1 is installed. It plays a role in making the brightness of the space uniform.
カバーセード下10の端部には環状のカバーセード下凸部10cが設けられている。また、前述の通り、カバーセード上20の端部には環状のカバーセード上凹部20aが設けられている。カバーセード下凸部10cとカバーセード上凹部20aとが嵌合することによりカバーセード下10はカバーセード上20に係止される。カバーセード下凸部10cとカバーセード上凹部20aとが嵌合することによりカバーセード下10が落下する恐れは抑制される。更に、前述の円筒部10bの平坦部とLED基板30及び放熱板16とをねじ止めすることでカバーセード下10を固定することで、カバーセード下10が落下する恐れが抑制される。さらに、平坦部16bと電源基板17とはパッキン11を介してねじ止めしており、カバーセード下10内部への虫などの侵入を抑制している。パッキン11は、パッキン11と円筒部10bの平坦部、パッキン11と電源基板17、との間に隙間が生じにくいように、例えばEPDMのように弾性を有する材料であることが望ましい。 An annular cover shade lower convex portion 10 c is provided at an end portion of the lower cover shade 10. Further, as described above, an annular cover-sade upper recess 20a is provided at the end of the cover-sade upper 20. When the cover shade lower convex portion 10c and the cover shade upper concave portion 20a are fitted, the cover shade lower portion 10 is locked to the cover shade upper portion 20. The possibility that the lower cover shade 10 will fall due to the fitting of the cover shade lower convex portion 10c and the cover shade upper concave portion 20a is suppressed. Furthermore, by fixing the flat part of the above-mentioned cylindrical part 10b, the LED substrate 30, and the heat radiating plate 16 with screws, the possibility that the cover cover lower part 10 will drop is suppressed. Further, the flat portion 16b and the power supply substrate 17 are screwed through the packing 11 to suppress the entry of insects or the like into the inside of the cover shade 10. The packing 11 is preferably made of an elastic material such as EPDM so that a gap is not easily formed between the packing 11 and the flat portion of the cylindrical portion 10 b and between the packing 11 and the power supply substrate 17.
カバーセード下10は、端部から中央部にかけて膨らんだ形状を有する樹脂製の部品である。そのため、カバーセード下10の中央部に外側から力が加わるとカバーセード下10が撓んで凹む恐れがある。本実施形態のように、カバーセード下10と電源基板17との間で中央に円筒部10bを設けることで、カバーセード下10の中央部近傍に外側から力が加わった場合に、カバーセード下10の変形を抑制することができる。 The lower cover shade 10 is a resin part having a shape that swells from the end to the center. Therefore, when a force is applied from the outside to the center portion of the cover shade lower 10, the cover shade lower 10 may be bent and recessed. As in the present embodiment, the cylindrical portion 10b is provided in the center between the cover shade lower 10 and the power supply board 17, so that when a force is applied from the outside in the vicinity of the center portion of the cover shade lower 10 under the cover shade. Ten deformations can be suppressed.
カバーセード上20とバックボーン19とは、カバーセード上20とバックボーン19とを接続した状態で、カバーセード上20の背面方向から器具本体28をみた際に隙間が生じないように接続される。これは、器具本体28内への虫などの侵入を防ぐためである。そのために、カバーセード上20およびバックボーン19の背面側には必要以上に穴を設けない構造とすることが望ましい。 The cover top 20 and the backbone 19 are connected so that there is no gap when the instrument main body 28 is viewed from the back side of the cover top 20 with the cover top 20 and the backbone 19 connected. This is for preventing insects and the like from entering the instrument main body 28. Therefore, it is desirable to have a structure that does not provide more holes than necessary on the coverside 20 and the back side of the backbone 19.
本実施形態では、後述する放熱板16を備えることによって、放熱空間の容積を大きくするとともに(放熱空間の空気の量を多くし)、放熱板16と空気との接触面積を広くとることで、電源基板17およびLED基板30の放熱効率の向上を図っている。その結果、LED13の発光効率が高く、かつ、放熱板16の絞り成形性が良好で生産性の優れたLED照明装置1を実現することができる。 In the present embodiment, by providing the heat radiating plate 16 described later, the volume of the heat radiating space is increased (the amount of air in the heat radiating space is increased), and the contact area between the heat radiating plate 16 and the air is increased, The heat dissipation efficiency of the power supply board 17 and the LED board 30 is improved. As a result, it is possible to realize the LED lighting device 1 with high luminous efficiency of the LED 13 and excellent drawability of the heat sink 16 and excellent productivity.
LED基板30は、ドーナツ形状の配線基板14と、この配線基板14の一面側(LED13の実装面側)に同心円状に複数列(本実施形態では7列)配置された複数のLED13と、を含んで構成されている。なお、LED13は、いずれも白色系の光束を放射する同一種類の素子で構成されている。 The LED board 30 includes a donut-shaped wiring board 14 and a plurality of LEDs 13 arranged in a plurality of rows (in this embodiment, seven rows) concentrically on one side of the wiring board 14 (the mounting surface side of the LEDs 13). It is configured to include. The LEDs 13 are all composed of the same type of element that emits a white light beam.
配線基板14は、アルミニウムまたはアルミニウム合金製の平板に絶縁層および銅箔パターンなどを形成したものや、熱伝導性の良好な樹脂(例えばポリイミド樹脂など)製の平板上に銅箔パターンおよびソルダーレジストなどを形成したものなどで構成されている。つまり、配線基板14は、LED13の端子(不図示)や、LED13を配線基板14に対して密着させる目的でLED13の背面側に設けられる放熱パッド(不図示)などを介した熱伝導を受けて、複数のLED13の発光により生じた熱を、速やかに伝熱および放熱するようになっている。 The wiring board 14 is formed by forming an insulating layer and a copper foil pattern on a flat plate made of aluminum or an aluminum alloy, or a copper foil pattern and a solder resist on a flat plate made of a resin having good thermal conductivity (such as polyimide resin). Etc. are formed. That is, the wiring board 14 receives heat conduction through the terminal (not shown) of the LED 13 or the heat dissipation pad (not shown) provided on the back side of the LED 13 for the purpose of bringing the LED 13 into close contact with the wiring board 14. The heat generated by the light emission of the plurality of LEDs 13 is quickly transferred and radiated.
また、配線基板14は、1枚で略ドーナツ形状となるように構成したものであるが、この限りでない。略半ドーナツ形状の2枚の基板を組み合わせて略ドーナツ形状となるように構成したものでも、3枚以上を組み合わせたものでも良い。ただし、分割する枚数を少なくすることにより、LED基板30の組みつけが容易となるという効果を奏する。 Moreover, although the wiring board 14 is comprised so that it may become a substantially donut shape by one sheet, it is not this limitation. Two substrates having a substantially semi-doughnut shape may be combined to form a substantially donut shape, or a combination of three or more substrates may be used. However, the effect of facilitating the assembly of the LED substrate 30 is achieved by reducing the number of divisions.
また、配線基板14は、円形部14aと、円形部14aの外周の4つの配線基板凸部14bとからなる。該配線基板凸部14bが後述する基板押さえ15の係止部15bに入ることで、配線基板14は基板押さえ15に係止される。さらに、配線基板14の中央部にはLED基板30を放熱板16にねじ固定する配線基板ねじ挿通孔14cが複数個所に形成されている。本実施形態では4つの配線基板凸部14bを設けているが、これは、一枚の板から配線基板14をとる際に、凸部を3つにするよりも4つにする方が多くの配線基板14をとることができるためである。 The wiring board 14 includes a circular portion 14a and four wiring board convex portions 14b on the outer periphery of the circular portion 14a. The wiring board 14 is locked to the board holder 15 by the wiring board protrusion 14 b entering a locking part 15 b of the board holder 15 described later. Furthermore, wiring board screw insertion holes 14c for screw-fixing the LED board 30 to the heat sink 16 are formed in a central portion of the wiring board 14 at a plurality of locations. In this embodiment, four wiring board convex portions 14b are provided. However, when the wiring board 14 is taken from one plate, it is more preferable to use four convex portions than three convex portions. This is because the wiring board 14 can be taken.
なお、配線基板14には、その表面に、図示しない白色の反射シートを設けることもできる。この反射シートは、LED13から放射された後、カバーセード下10などの内面で反射して戻ってきた光を、表面側に向かって再反射させる機能を有し、各LED13に対応する位置には小孔が形成されている。 The wiring board 14 may be provided with a white reflection sheet (not shown) on the surface thereof. This reflection sheet has a function of re-reflecting light that has been radiated from the LED 13 and then reflected and returned from the inner surface such as under the cover shade 10 toward the surface side, and is located at a position corresponding to each LED 13. Small holes are formed.
また、配線基板14は、放熱板16の平坦部(載置面)16bの直径寸法D2よりも長い直径寸法D1を有している。つまり、本実施形態におけるLED基板30は、放熱板16の平坦部(載置面)16bに載置されたときに、LED基板30の外周縁部(最外周とその内周の2列分のLED13が配置されている基板領域)が、放熱板16の平坦部16bとは接しない構造となっている。 Further, the wiring board 14 has a diameter dimension D1 longer than the diameter dimension D2 of the flat portion (mounting surface) 16b of the heat sink 16. That is, when the LED substrate 30 in the present embodiment is placed on the flat portion (mounting surface) 16b of the heat radiating plate 16, the outer peripheral edge portion of the LED substrate 30 (the outermost circumference and the inner circumference of two rows). The substrate region in which the LEDs 13 are disposed has a structure that does not contact the flat portion 16 b of the heat sink 16.
このように構成されたLED基板30は、LED13の発光面(実装面)とは反対側の面が、縦断面がハット形状である放熱板16の錐台部16aの平坦部16bに密着状態を維持して取り付けられる。したがって、本実施形態によれば、LED基板30および放熱板16に関する伝熱および放熱に係る作用効果が相乗的に機能することによって、複数のLED13の発光により生じた熱を速やかに冷却することが可能になる。 In the LED substrate 30 configured in this way, the surface opposite to the light emitting surface (mounting surface) of the LED 13 is in close contact with the flat portion 16b of the frustum portion 16a of the heat radiating plate 16 whose longitudinal section is a hat shape. Maintained and attached. Therefore, according to the present embodiment, the heat and heat dissipation related to the LED substrate 30 and the heat radiating plate 16 function synergistically to quickly cool the heat generated by the light emission of the plurality of LEDs 13. It becomes possible.
また、本実施形態に係るLED基板30では、LED照明装置1の中央部付近まで面積を広げてLED13を配置する構成を採用している。このように構成すれば、LED照明装置1の中央部から周縁部に至るまで、その明るさをほぼ均一にすることができる。 Moreover, in the LED board 30 which concerns on this embodiment, the structure which expands an area to center part vicinity of the LED lighting apparatus 1 and arrange | positions LED13 is employ | adopted. If comprised in this way, the brightness can be made substantially uniform from the center part of LED lighting apparatus 1 to a peripheral part.
LED基板30の中央には、保安灯用LED25が2つ設けられている。本実施形態では、保安灯用LED25と円筒部10bとの間を遮るように遮光カバー壁部12aを有する、ポリプロピレンなどの樹脂製の環状部品である遮光カバー12を配設している。遮光カバー12が有する遮光カバー壁部12aにより、保安灯用LED25から出射された光を遮り、カバーセード下10中央の円筒部10bを通過する光をなくすことで、カバーセード下10の表面に円筒部10bの影が映りこまないようにしている。 In the center of the LED substrate 30, two safety light LEDs 25 are provided. In the present embodiment, the light shielding cover 12 that is an annular part made of resin such as polypropylene and having a light shielding cover wall portion 12a is provided so as to shield between the safety light LED 25 and the cylindrical portion 10b. The light shielding cover wall portion 12a of the light shielding cover 12 blocks the light emitted from the safety light LED 25 and eliminates the light passing through the cylindrical portion 10b in the center of the cover shade 10 so that a cylinder is formed on the surface of the cover shade 10 below. The shadow of the part 10b is not reflected.
基板押さえ15は、樹脂製(例えばポリプロピレンやアクリルやポリスチレンなど)の略環形状の部品である。基板押さえ15は、環状部15aと、係止部15bと、からなる。基板押さえ15の環状部15aの内径は、配線基板14の円形部14aの外径よりも大きい。係止部15bは、環状部15aからカバーセード下10側(表面側)に突出した部分である。係止部15bは、周方向に係止部開口15b1を有している。係止部開口15b1から配線基板凸部14bが入り、係止部15bに配線基板凸部14bが係止されることで、配線基板14が基板押さえ15に係止される。本実施形態において、基板押さえ15に係止部15bは4箇所ある。これは、係止される配線基板凸部14bが4箇所であるためである。 The substrate holder 15 is a substantially ring-shaped component made of resin (for example, polypropylene, acrylic, polystyrene, etc.). The substrate holder 15 includes an annular portion 15a and a locking portion 15b. The inner diameter of the annular portion 15 a of the substrate holder 15 is larger than the outer diameter of the circular portion 14 a of the wiring substrate 14. The latching | locking part 15b is a part protruded from the cyclic | annular part 15a to the cover shade lower 10 side (surface side). The locking part 15b has a locking part opening 15b1 in the circumferential direction. The wiring board convex part 14b enters from the latching part opening 15b1, and the wiring board convex part 14b is latched by the latching part 15b, whereby the wiring board 14 is latched by the board presser 15. In the present embodiment, the board pressing member 15 has four locking portions 15b. This is because there are four wiring board convex portions 14b to be locked.
なお、本実施形態では、基板押さえ15と放熱板16とを別体としたが、この限りでない。配線基板凸部14bが係止部15bに係止される機能を有していればよく、一部品で成形しても構わない。本実施形態のように基板押さえ15と放熱板16とを別部品で成形した場合は、別材料で成形することができる。別材料で成形することができるため、LED基板30と接触する面積が大きい放熱板16には効果の高い材料(アルミなど)を選び、LED基板30をきちんと係止する必要の有る基板押さえ15には作り易い材料(ポリプロピレンなど)や剛性の高い材料(セラミックスなど)など、適切な材料を選ぶことができる。対して、一部品で成型した場合には、部品点数の低減効果や、基板押さえ15を固定するための製造工数の低減という効果を奏する。 In addition, in this embodiment, although the board | substrate holding | suppressing 15 and the heat sink 16 were made into the different body, it is not this limitation. The wiring board convex part 14b should just have the function latched by the latching | locking part 15b, and you may shape | mold by one component. When the substrate holder 15 and the heat sink 16 are formed as separate parts as in this embodiment, they can be formed from different materials. Since it can be formed of another material, a highly effective material (such as aluminum) is selected for the heat sink 16 having a large area in contact with the LED substrate 30, and the substrate holder 15 that needs to properly lock the LED substrate 30 is used. You can choose an appropriate material, such as a material that is easy to make (such as polypropylene) or a material with high rigidity (such as ceramics). On the other hand, when molding with one component, there is an effect of reducing the number of components and an effect of reducing the number of manufacturing steps for fixing the substrate presser 15.
係止部開口15b1は、基板押さえ15を放熱板16に取り付けた際に、放熱板16の平坦部16bと同じ高さの位置から、配線基板14の厚さ分と同程度の大きさの開口であることが望ましい。上記の大きさの開口部10aとすることで、LED基板30を係止部15bに取り付けた後のLED基板30が上下方向へ動く余地を少なくし、よりよく係止することができるという効果を奏する。加えて、LED基板30の背面側と放熱板16の表面側とが接触し放熱効果を高めるという効果を奏する。 The locking portion opening 15b1 is an opening having the same size as the thickness of the wiring board 14 from a position at the same height as the flat portion 16b of the heat radiating plate 16 when the substrate retainer 15 is attached to the heat radiating plate 16. It is desirable that By making the opening 10a of the above-mentioned size, there is an effect that the LED board 30 after the LED board 30 is attached to the locking part 15b has less room to move in the vertical direction and can be locked better. Play. In addition, there is an effect that the back side of the LED substrate 30 and the surface side of the heat radiating plate 16 are in contact with each other to enhance the heat radiation effect.
なお、本実施形態では、基板押さえ15は、環状部15aと係止部15bとからなる部品としたが、この限りでない。配線基板凸部14bが係止部15bに係止される機能を有していれば良く、例えば係止部15bのみからなる部品でもよい。 In the present embodiment, the substrate pressing member 15 is a component composed of the annular portion 15a and the locking portion 15b, but this is not restrictive. The wiring board convex part 14b should just have the function latched by the latching | locking part 15b, for example, the component which consists only of the latching | locking part 15b may be sufficient.
放熱板16の背面側には、天井側に近い部品から、バックボーン19、絶縁板18、電源基板17が設けられている。 On the back side of the heat radiating plate 16, a backbone 19, an insulating plate 18, and a power supply substrate 17 are provided from components close to the ceiling side.
バックボーン19は、例えば金属板などを略円形状に加工成形した部品である。バックボーン19の中央には、略円形状の孔である器具取付部19aが設けられている。器具取付部19aには、前記した取付アダプタが引掛け部(不図示)を介して係合固定される。取付アダプタは、天井側の屋内配線器具に係合固定される。これにより、バックボーン19を含むLED照明装置1は、取付アダプタ、器具取付部19aおよび屋内配線器具をそれぞれ介して、天井面の所定位置に固定されるようになっている。 The backbone 19 is a part formed by processing a metal plate or the like into a substantially circular shape, for example. In the center of the backbone 19, an instrument mounting portion 19a, which is a substantially circular hole, is provided. The above-described mounting adapter is engaged and fixed to the instrument mounting portion 19a via a hooking portion (not shown). The mounting adapter is engaged and fixed to the indoor wiring device on the ceiling side. Thereby, the LED lighting device 1 including the backbone 19 is fixed to a predetermined position on the ceiling surface via the mounting adapter, the fixture mounting portion 19a, and the indoor wiring fixture.
器具取付部19aの近傍には、不図示の給電接続部が設けられている。給電接続部は、不図示の電線を介して、取付アダプタと電源基板17との間を電気的に接続している。これにより、LED照明装置1は、屋内配線器具、取付アダプタ、給電接続部および電源基板17をそれぞれ介して、給電を受けるようになっている。 A power supply connection portion (not shown) is provided in the vicinity of the instrument mounting portion 19a. The power supply connecting portion electrically connects the mounting adapter and the power supply board 17 via an electric wire (not shown). Thereby, the LED lighting device 1 receives power supply through the indoor wiring device, the mounting adapter, the power supply connection portion, and the power supply board 17.
絶縁板18は、バックボーン19と、放熱板16との間に介在させて設けられている。バックボーン19および放熱板16は、いずれも金属製である。これに対し、絶縁板18は、電気絶縁性および難燃性を有する例えばポリプロピレンなどの樹脂材料を用いて成形されている。 The insulating plate 18 is provided between the backbone 19 and the heat radiating plate 16. Both the backbone 19 and the heat sink 16 are made of metal. On the other hand, the insulating plate 18 is molded using a resin material such as polypropylene having electrical insulation and flame retardancy.
電源基板17は、絶縁板18の外縁に突設された基板係止部18aなどを介して保持されている。 The power supply substrate 17 is held via a substrate locking portion 18 a that protrudes from the outer edge of the insulating plate 18.
ところで、放熱板16はLED基板30を主に熱伝導によって冷却する機能を有している。 By the way, the heat sink 16 has a function of cooling the LED substrate 30 mainly by heat conduction.
LED13は発光に伴う発熱によってLED13それ自体や周囲の部品が劣化する。かかる劣化を抑制して長寿命・高信頼性を実現するには、適切な放熱を行うことが求められる。 The LED 13 itself and surrounding components deteriorate due to heat generated by light emission. In order to suppress such deterioration and realize a long life and high reliability, it is required to perform appropriate heat dissipation.
また、電源基板17およびLED基板30が発熱すると、放熱板16によって囲まれた放熱空間の雰囲気温度は上昇する。このとき、放熱空間の容積が小さいと、本体内部に熱がこもりやすくなり、電子部品の劣化を早めたり、LED13の発光効率が下がる要因となる。そこで、本実施例では、放熱板16は、例えば亜鉛メッキ鋼板やアルミニウムなどの熱伝導性の良好な金属を素材として用いて、その縦断面がハット形状として内容積をできるだけ大きくするようにし、かつ、熱伝導性を良好に維持する観点から、絞り加工により、継ぎ目なく一体に成形している。 Further, when the power supply substrate 17 and the LED substrate 30 generate heat, the ambient temperature of the heat dissipation space surrounded by the heat dissipation plate 16 increases. At this time, if the volume of the heat radiating space is small, heat is likely to be trapped inside the main body, which causes deterioration of the electronic components and causes the luminous efficiency of the LED 13 to decrease. Therefore, in this embodiment, the heat radiating plate 16 is made of, for example, a metal having a good thermal conductivity such as a galvanized steel plate or aluminum so that its longitudinal section has a hat shape and the internal volume is increased as much as possible. From the standpoint of maintaining good thermal conductivity, it is formed integrally with the joint by drawing.
放熱板16は、略円形状の錐台部16aと、この錐台部16aの外周側(径方向外側)に略ドーナツ形状(略環状)の外周固定部16cと、を有する構造を採用している。 The heat sink 16 employs a structure having a substantially circular frustum portion 16a and a substantially donut-shaped (substantially annular) outer peripheral fixing portion 16c on the outer peripheral side (radially outer side) of the frustum portion 16a. Yes.
詳述すると、放熱板16の錐台部16aは、1枚ものの円形の薄い金属板を絞り加工することによって製造される。この錐台部16aは、LED基板30の裏面が面で接触して載置される円形状の平坦部16b(載置面)と、平坦部16bの外周縁部から背面側に向けて拡径しながら延びる筒形状の傾斜部と、を有している。 More specifically, the frustum portion 16a of the heat radiating plate 16 is manufactured by drawing a single thin circular metal plate. The frustum portion 16a has a circular flat portion 16b (mounting surface) on which the back surface of the LED substrate 30 is placed in contact with the surface, and the diameter increases from the outer peripheral edge of the flat portion 16b toward the back surface side. And a cylindrical inclined portion that extends while extending.
平坦部16bには、LED基板30を放熱板16にねじ固定するねじ固定孔が複数個所に形成される。 The flat portion 16b is formed with a plurality of screw fixing holes for fixing the LED substrate 30 to the heat radiating plate 16 with screws.
基板押さえ15と、放熱板16と、絶縁板18と、は、バックボーン19にねじ止め固定されている。本実施形態では、基板押さえ15に設けられたねじ止め用の孔である基板押さえねじ挿通孔15cと放熱板16に設けられたねじ止め用の孔である放熱板ねじ挿通孔16dとバックボーン19のねじ止め孔(図示なし)との位置が合うようにし、ねじ止めすることで部品点数の低減と、LED照明装置1の製造工数の低減を図っている。 The substrate holder 15, the heat radiating plate 16, and the insulating plate 18 are fixed to the backbone 19 with screws. In the present embodiment, a board holding screw insertion hole 15 c that is a screwing hole provided in the board holding member 15, a heat radiation plate screw insertion hole 16 d that is a screwing hole provided in the heat dissipation plate 16, and the backbone 19. The positions of the screw holes (not shown) are matched and screwed to reduce the number of parts and the number of manufacturing steps of the LED lighting device 1.
LED照明装置1を組み立てる場合には、まず、バックボーン19の前面側に絶縁板18を取り付ける。続いて、絶縁板18の前面側に電源基板17を取り付ける。続いて、電源基板17を覆うように放熱板16、基板押さえ15をバックボーン19に取り付ける。ここで、放熱板16と基板押さえ15のバックボーン19への取り付けは、基板押さえ15の基板押さえねじ挿通孔15cと放熱板16の放熱板ねじ挿通孔16dとバックボーン19のねじ止め孔の位置を合わせた状態とし(図4(a)(b)参照)、一度のねじ止めで行う。これにより、製造工数の低減を図ることができる。続いて、基板押さえ15によりLED基板30を係止する。続いて、遮光カバー12によりLED基板30を挟むように放熱板16に取り付ける。続いて、バックボーン19の背面から側面を覆うようにカバーセード上20をバックボーン19に取り付ける。続いて、LED基板30の前面から側面を覆うようにカバーセード下10をカバーセード上20に取り付ける。カバーセード上20とカバーセード下10との接続は、カバーセード上凹部20aとカバーセード下凸部10cとの嵌合により行う。この際、カバーセード下10における円筒部10bの平坦部がパッキン11を介してLED基板30と当接するようにしてカバーセード上20とカバーセード下10とを嵌合させる。これにより、カバーセード下10の開口部10aからLED照明装置1内に虫などが入り込む恐れを減らすことができる。工程の最後に、バックボーン19の背面側に吊り具29をとりつけ、この際、天井などから引っ張ってきて吊り具29内を通るリード線(図示なし)を、バックボーン19の背面側に位置する電源基板17のコネクタに取り付ける。 When assembling the LED lighting device 1, first, the insulating plate 18 is attached to the front side of the backbone 19. Subsequently, the power supply substrate 17 is attached to the front side of the insulating plate 18. Subsequently, the heat sink 16 and the substrate holder 15 are attached to the backbone 19 so as to cover the power supply substrate 17. Here, the heat sink 16 and the substrate retainer 15 are attached to the backbone 19 by aligning the positions of the substrate retainer screw insertion hole 15c of the substrate retainer 15, the heat dissipation plate screw insertion hole 16d of the heat sink 16, and the screw fixing hole of the backbone 19. (See FIGS. 4 (a) and 4 (b)). Thereby, reduction of a manufacturing man-hour can be aimed at. Subsequently, the LED board 30 is locked by the board presser 15. Then, it attaches to the heat sink 16 so that the LED board 30 may be pinched | interposed by the light shielding cover 12. FIG. Subsequently, the cover shade upper 20 is attached to the backbone 19 so as to cover the side surface from the back surface of the backbone 19. Subsequently, the lower cover cover 10 is attached to the upper cover cover 20 so as to cover the side surface from the front surface of the LED substrate 30. The connection between the cover shade upper 20 and the cover shade lower 10 is performed by fitting the cover shade upper concave portion 20a and the cover shade lower convex portion 10c. At this time, the upper portion of the cover shade 20 and the lower portion of the cover shade 10 are fitted so that the flat portion of the cylindrical portion 10 b in the lower portion 10 of the cover shade comes into contact with the LED substrate 30 via the packing 11. Thereby, a possibility that an insect etc. may enter into LED lighting device 1 from opening 10a under cover shade 10 can be reduced. At the end of the process, a hanging tool 29 is attached to the back side of the backbone 19, and at this time, a lead wire (not shown) that is pulled from the ceiling or the like and passes through the inside of the hanging tool 29 is located on the back side of the backbone 19. Attach to 17 connectors.
基板押さえ15によるLED基板30の係止について説明する。図4(a)のような状態となった後、LED基板30を放熱板16側(背面側)に移動させる(図4(b)参照)。続いて、LED基板30を周方向に回転させる(図4(c)参照)。LED基板30を周方向に回転していくと、配線基板凸部14bが係止部開口15b1から係止部15に入っていく(図4(d)参照)。配線基板凸部14bが係止部15に入ったときに、LED基板30は基板押さえ15に係止され、落下の恐れが抑制される(図4(e)、図5参照)。これにより、LED基板30を放熱板16に取り付ける工数が低減される。本実施形態では、保安灯用LED25から出射した光が円筒部10bを通過しカバーセード下10に到る際に影となる恐れを抑制するために、遮光カバー12を備えている。本実施形態では、LED基板30を挟むように遮光カバー12と放熱板16とを配線基板ねじ挿通孔14cを通るようにねじ止めなどにより固定している(図4(e)参照)。これにより、LED基板30の背面側と放熱板16の表面側が押し付けられることになり、固定しない場合よりも接触し、放熱効果を高めることが可能となる。 The locking of the LED board 30 by the board presser 15 will be described. After the state as shown in FIG. 4A, the LED substrate 30 is moved to the heat radiating plate 16 side (back side) (see FIG. 4B). Subsequently, the LED substrate 30 is rotated in the circumferential direction (see FIG. 4C). When the LED substrate 30 is rotated in the circumferential direction, the wiring board convex portion 14b enters the locking portion 15 from the locking portion opening 15b1 (see FIG. 4D). When the wiring board convex part 14b enters the locking part 15, the LED board 30 is locked by the board presser 15, and the possibility of dropping is suppressed (see FIGS. 4E and 5). Thereby, the man-hour which attaches LED board 30 to the heat sink 16 is reduced. In the present embodiment, the light shielding cover 12 is provided in order to prevent the light emitted from the safety light LED 25 from being shaded when it passes through the cylindrical portion 10b and reaches the bottom 10 of the cover shade. In the present embodiment, the light shielding cover 12 and the heat sink 16 are fixed by screwing so as to pass through the wiring board screw insertion holes 14c so as to sandwich the LED board 30 (see FIG. 4E). Thereby, the back side of LED board 30 and the surface side of heat sink 16 will be pressed, and it will contact rather than the case where it does not fix, and it becomes possible to raise a heat dissipation effect.
以上のように、LED13を載置する平板の部品である配線基板14を、LED13を載置する円形部14aと、円形部14aの外周に設けられた配線基板凸部14bと、からなる形状とし、配線基板14の周方向の回転により配線基板凸部14bを係止する基板押さえ15を放熱板16における平坦部16b(配線基板14を載置する部分)の外周側に設けたことにより、LED13を載置した配線基板14を固定する際の製造工数を低減し、より安価にLED照明装置1を提供することができるという効果を奏する。 As described above, the wiring board 14, which is a flat plate component on which the LED 13 is placed, has a shape including the circular portion 14 a on which the LED 13 is placed and the wiring substrate convex portion 14 b provided on the outer periphery of the circular portion 14 a. By providing the board pressing member 15 for locking the wiring board convex part 14b by the rotation of the wiring board 14 in the circumferential direction on the outer peripheral side of the flat part 16b (the part on which the wiring board 14 is placed) in the heat radiating plate 16, As a result, it is possible to reduce the number of manufacturing steps for fixing the wiring board 14 on which the LED lighting device 1 is mounted, and to provide the LED lighting device 1 at a lower cost.
1 LED照明装置
10 カバーセード下
10a 開口部
10b 円筒部
10c カバーセード下凸部
11 パッキン
12 遮光カバー
12a 遮光カバー壁部
13 LED
14 配線基板
14a 円形部
14b 配線基板凸部
14c 配線基板ねじ挿通孔
15 基板押さえ
15a 環状部
15b 係止部
15b1係止部開口
15c 基板押さえねじ挿通孔
16 放熱板
16a 錐台部
16b 平坦部
16c 外周固定部
16d 放熱板ねじ挿通孔
17 電源基板
18 絶縁板
18a 基板係止部
19 バックボーン
19a 器具取付部
20 カバーセード上
20a カバーセード上凹部
23 ペンダント紐
25 保安灯用LED
26 セード
28 器具本体
29 吊り具
30 LED基板
DESCRIPTION OF SYMBOLS 1 LED illuminating device 10 Cover cover lower part 10a Opening part 10b Cylindrical part 10c Cover shade lower convex part 11 Packing 12 Light shielding cover 12a Light shielding cover wall part 13 LED
14 Wiring board 14a Circular part 14b Wiring board convex part 14c Wiring board screw insertion hole 15 Substrate presser 15a Annular part 15b Locking part 15b1 Locking part opening 15c Substrate pressing screw insertion hole 16 Heat sink 16a Frustum part 16b Flat part 16c Outer periphery Fixing part 16d Heat sink screw insertion hole 17 Power supply board 18 Insulating board 18a Board locking part 19 Backbone 19a Instrument mounting part 20 Coversade upper part 20a Coversade upper concave part 23 Pendant string 25 Security light LED
26 SEED 28 Instrument body 29 Suspension tool 30 LED board
Claims (3)
前記配線基板は、略ドーナツ形状の平板の部品であり、前記LEDを外周縁部まで載置する円形部と、該円形部の外周に設けられた配線基板凸部と、からなり、
前記配線基板の周方向の回転により前記配線基板凸部を係止する基板押さえを前記配線基板載置部の外周側に設けたことを特徴とするLED照明装置。 An LED, a wiring board on which the LED is mounted, a heat sink having a wiring board mounting portion on which the wiring board is mounted, a backbone for fixing the heat sink, and an insulating plate attached to the backbone A power supply board that controls the LED, a cover shade that is attached to the backbone so as to cover a side surface from the back of the backbone, and a cover shade that is attached on the cover shade and covers the front of the LED. In LED lighting device,
The wiring board is a substantially donut-shaped flat plate component, and includes a circular part on which the LED is mounted to the outer peripheral edge part, and a wiring board convex part provided on the outer periphery of the circular part,
An LED lighting device, wherein a substrate pressing member that locks the wiring substrate convex portion by rotation in the circumferential direction of the wiring substrate is provided on the outer peripheral side of the wiring substrate mounting portion.
前記基板押さえは、前記放熱板および前記バックボーンとは別体であることを特徴とするLED照明装置。 The LED lighting device according to claim 1,
The LED lighting device according to claim 1, wherein the substrate holder is separate from the heat sink and the backbone.
前記配線基板は、前記配線基板載置部の直径寸法よりも長い直径寸法を有し、
前記基板押さえは、環状部と該環状部から突出する係止部とを有し、前記係止部で前記配線基板凸部を係止することを特徴とするLED照明装置。 The LED lighting device according to claim 1 or 2,
The wiring board has a diameter dimension longer than the diameter dimension of the wiring board mounting portion,
The said board | substrate holding | suppressing has an annular part and the latching | locking part which protrudes from this annular part, and latches the said wiring board convex part by the said latching | locking part, The LED lighting apparatus characterized by the above-mentioned.
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