WO2012160688A1 - Illuminating apparatus - Google Patents

Illuminating apparatus Download PDF

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Publication number
WO2012160688A1
WO2012160688A1 PCT/JP2011/062060 JP2011062060W WO2012160688A1 WO 2012160688 A1 WO2012160688 A1 WO 2012160688A1 JP 2011062060 W JP2011062060 W JP 2011062060W WO 2012160688 A1 WO2012160688 A1 WO 2012160688A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
socket
protrusion
lamp device
contact surface
Prior art date
Application number
PCT/JP2011/062060
Other languages
French (fr)
Japanese (ja)
Inventor
長田 武
大澤 滋
高原 雄一郎
啓道 中島
佐々木 淳
松田 良太郎
戸田 雅宏
博史 松下
Original Assignee
東芝ライテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東芝ライテック株式会社 filed Critical 東芝ライテック株式会社
Priority to PCT/JP2011/062060 priority Critical patent/WO2012160688A1/en
Publication of WO2012160688A1 publication Critical patent/WO2012160688A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • Embodiment of this invention is related with the illuminating device which can be used combining the suitable lamp apparatus and fixture apparatus.
  • a lighting device that uses a combination of a lamp device using a flat base such as a GX53 type and an appliance device having a socket on which the base of the lamp device is detachably attached.
  • the lamp device includes a light source and a lighting circuit that turns on the light source. With the base of the lamp device mounted on the socket device, power is supplied from the socket to the lamp device, and the light source is turned on by the lighting circuit of the lamp device.
  • the problem to be solved by the present invention is to provide a lighting device that can be used in combination with a suitable lamp device and fixture device.
  • the lighting device of the embodiment includes a lamp device and a fixture device.
  • the lamp device includes a housing having a base, a light source housed in the housing, and a lighting circuit.
  • the contact surface is provided on the base and a concave portion is provided on the contact surface.
  • the instrument device includes a socket to which the base is detachably attached, a heat conduction surface that comes into contact with the socket when the base is attached, and a protrusion that protrudes from the heat conduction surface toward the side to which the base is attached. The protrusion enters the recess and the base is attached to the socket.
  • the lighting device 11 is an embedded lighting fixture such as a downlight, and is installed by being embedded in a circular embedded hole 13 provided in the ceiling plate 12.
  • the illuminating device 11 includes a flat lamp device 14 and an appliance device 15 on which the lamp device 14 is detachably mounted.
  • the lamp device 14 is accommodated in a flat and cylindrical casing 21, a heat conductive sheet 22 attached to the upper surface of the casing 21, and the casing 21.
  • a light source 23, an optical component 24, a lighting circuit 25, and a translucent cover 26 attached to the lower surface of the housing 21 are provided.
  • a light emitting module 27 having a semiconductor light emitting element is used as the light source 23 .
  • the housing 21 has a cylindrical case 28 and a disc-shaped base member 29 attached to the upper surface of the case 28.
  • the upper part of the case 28 and the base member 29 constitute a base 30 having a predetermined standard size.
  • the case 28 is made of, for example, an insulating synthetic resin, and protrudes upward from the flat plate portion 31 on the upper surface, the cylindrical peripheral surface portion 32 protruding downward from the peripheral portion of the flat plate portion 31, and the upper surface of the flat plate portion 31.
  • a cylindrical tube portion 33 is provided.
  • An opening 28 a is formed on the lower surface of the case 28.
  • a circular optical component insertion hole 34 is formed in the center of the flat plate portion 31, and a plurality of bosses 35 having screw insertion holes and a pair of lamp pin insertion holes 36 are formed in the peripheral portion of the flat plate portion 31.
  • the plurality of bosses 35 protrude from the upper surface of the flat plate portion 31 to the inside of the tube portion 33.
  • An annular outer periphery side substrate support portion 37 and an annular inner periphery side substrate support portion 38 that support the lighting circuit 25 (circuit board) are formed at the periphery of the flat plate portion 31 and the edge of the optical component insertion hole 34, respectively.
  • a wiring passage 39 is formed at one location of the substrate support portion 38 on the inner peripheral side.
  • a plurality of optical component support portions 40 that support the optical component 24 are formed on the inner peripheral surface of the peripheral surface portion 32 of the case 28, and a plurality of protrusions 41 are formed in the vicinity of the opening 28a.
  • an uneven portion 32a for increasing the surface area is formed on the upper side of the outer peripheral surface of the peripheral surface portion 32.
  • a frame-shaped holder 42 that holds the light emitting module 27 is attached to the inside of the cylindrical portion 33 on the upper surface of the flat plate portion 31 of the case 28.
  • the base member 29 is formed in a disk shape with a material such as a metal such as aluminum die casting, ceramics, or a resin having excellent thermal conductivity.
  • the diameter of the base member 29 is larger than the diameter of the cylindrical portion 33 of the case 28, and the peripheral portion of the base member 29 protrudes from the outer peripheral surface of the cylindrical portion 33 of the case 28.
  • a plurality of mounting holes 44 into which a plurality of screws 43 are screwed through a plurality of bosses 35 of the case 28 are formed in the periphery of the lower surface of the base member 29.
  • the case 28 and the base member 29 are fastened and fixed by the plurality of screws 43 in a state where the light emitting module 27 is sandwiched between the holder 42 of the case 28 and the base member 29.
  • a light emitting module mounting portion 45 protruding from the lower surface of the base member 29 is integrally formed.
  • a flat mounting surface 45a with which the light emitting module 27 comes into contact is formed.
  • a plurality of groove portions 46 and a plurality of keys 47 are alternately formed at equal intervals in the circumferential direction on the periphery of the base member 29. In a state where the base member 29 is combined with the case 28, each key 47 protrudes from the outer peripheral surface of the cylindrical portion 33.
  • three grooves 46 and three keys 47 are provided. However, at least two grooves may be provided, and four or more grooves may be provided.
  • the base 30 has an annular base surface 48 formed by the upper surface of the case 28, and a cylindrical protrusion 49 that protrudes from the inside of the base surface 48.
  • a flat or planar contact surface 50 is formed on the upper surface of the base member 29 that is the tip of the protruding portion 49.
  • a cylindrical recess 51 is formed at the center of the contact surface 50 corresponding to the central axis of the lamp device 14. Between the peripheral edge of the contact surface 50 and the recess 51, a hexagonal recess 52 (which may be a polygon other than a hexagon or a circle) in which the heat conductive sheet 22 is disposed is formed.
  • the heat conductive sheet 22 is attached to the recess 52 so as to protrude from the contact surface 50.
  • the heat conductive sheet 22 is made of, for example, an elastic silicone sheet attached to the recess 52 of the contact surface 50, and a hexagonal (hexagonal) metal foil made of aluminum, tin, zinc or the like attached to the upper surface of the silicone sheet. Other than polygonal shape or circular shape).
  • the metal foil has a lower surface frictional resistance than the silicone sheet.
  • the light emitting module 27 includes a substrate 55, a light emitting portion 56 formed on the lower surface of the substrate 55, and a connector 57 mounted on the lower surface of the substrate 55.
  • the substrate 55 is formed in a flat plate shape with a material such as metal or ceramics having excellent thermal conductivity, for example.
  • a semiconductor light emitting element such as an LED element or an EL element is used.
  • an LED element is used as the semiconductor light emitting element
  • a COB (Chip On Board) system in which a plurality of LED elements are mounted on the substrate 55 is employed. That is, a plurality of LED elements are mounted on the substrate 55, the plurality of LED elements are electrically connected in series by wire bonding, and a plurality of phosphor layers, for example, a transparent resin such as silicone resin mixed with a phosphor, are used.
  • the LED elements are integrally covered and sealed.
  • the light emitting unit 56 is configured by the LED element and the phosphor layer, and the surface of the phosphor layer which is the surface of the light emitting unit 56 becomes a square or circular light emitting surface, and white illumination light is emitted from this light emitting surface. Is done.
  • a method of mounting a plurality of SMD (SurfaceSMount Device) packages with connecting terminals on which LED elements are mounted on the substrate 55 may be used.
  • the connector 57 is electrically connected to a plurality of semiconductor light emitting elements, and an electric wire 58 with a connector for connecting to the lighting circuit 25 is connected.
  • the optical component 24 is constituted by a cylindrical reflector 61.
  • the reflector 61 is made of, for example, an insulating synthetic resin, and is formed with a cylindrical light guide portion 62 whose upper and lower surfaces are opened and whose diameter is increased stepwise or continuously from the upper end side toward the lower end side.
  • An annular cover portion 63 that covers the periphery of the lower surface of the case 28 is formed at the lower end of the light guide portion 62.
  • a reflective surface having a high light reflectance such as white or a mirror surface is formed.
  • vapor deposition means such as aluminum can be used. In this case, the electrical insulation can be improved by masking the outer peripheral portion of the cover portion 63 to form a non-deposition surface.
  • the upper side of the light guide portion 62 passes through the lighting circuit 25 (circuit board) and the optical component insertion hole 34 of the case 28.
  • a substrate pressing portion 64 that holds the lighting circuit 25 (circuit substrate) between the outer peripheral surface of the light guide portion 62 and the substrate support portions 37 and 38 of the case 28 is formed at the intermediate portion in the vertical direction.
  • the cover portion 63 is formed with a plurality of holding claws 65 that are supported by the optical component support portions 40 of the case 28.
  • the lighting circuit 25 includes, for example, a circuit for rectifying and smoothing a commercial power supply voltage, a DC / DC converter having a switching element that switches at a high frequency of several kHz to several hundred kHz, and the like, and a power supply that outputs DC power of constant current Configure the circuit.
  • the lighting circuit 25 includes a circuit board 67 and a circuit component 68 that is a plurality of electronic components mounted on the circuit board 67.
  • the circuit board 67 is formed in an annular shape, and a circular fitting hole 69 into which the upper side of the light guide portion 62 of the reflector 61 is fitted is formed at the center of the circuit board 67.
  • a notch 70 is formed at the edge of the fitting hole 69 corresponding to the wiring passage 39 of the case 28.
  • the lower surface of the circuit board 67 is a mounting surface 67a for mounting the lead component having the lead wire of the circuit component 68, and the upper surface is for connecting the lead wire of the discrete component and mounting the surface mount component of the circuit component 68.
  • This is a wiring pattern surface 67b on which a wiring pattern is formed.
  • a connector (not shown) for connecting to the light emitting module 27 by the connector-attached electric wire 58 is mounted in the vicinity of the notch 70.
  • the circuit board 67 is arranged on the upper side in the case 28 with the wiring pattern surface 67b facing the flat plate portion 31 of the case 28 in parallel.
  • the circuit component 68 mounted on the mounting surface 67a of the circuit board 67 is disposed between the peripheral surface portion 32 of the case 28 and the light guide portion 62 and the cover portion 63 of the reflector 61.
  • a pair of lamp pins 71 electrically connected to the circuit board 67 is press-fitted into the lamp pin insertion holes 36 of the case 28 and vertically protrudes above the case 28. That is, the pair of lamp pins 71 protrudes vertically from the base surface 48 of the base 30. Further, the pair of lamp pins 71 may be electrically connected to the circuit board 67 with lead wires, or the lamp pins 71 may be erected on the circuit board 67 and directly connected to the circuit board 67.
  • the translucent cover 26 has translucency and diffusibility, is formed in a disc shape by, for example, synthetic resin or glass, and is attached to the case 28 so as to cover the opening 28a.
  • a fitting portion 74 is formed around the upper surface of the translucent cover 26 so as to be fitted to the inner periphery of the peripheral surface portion 32 of the case 28.
  • the fitting portion 74 is engaged with each protrusion 41 of the peripheral surface portion 32 of the case 28.
  • a plurality of locking claws 75 are formed. In a state where each locking claw 75 is locked to each projection 41, each holding claw 65 of the reflector 61 is sandwiched and held between the fitting portion 74 and each optical component support portion 40.
  • a pair of finger hooks 76 are provided to facilitate the attachment / detachment operation of the lamp device 14 with respect to the fixture device 15, and the mounting position on the fixture device 15 is displayed.
  • a triangular mark 77 is formed.
  • the shape of the finger-hanging portion 76 is arbitrary, and it is preferable that it does not impair the appearance (does not stand out), does not hinder the light distribution, and is easy to operate when the lamp device 14 is attached or detached.
  • the input power (power consumption) of the light emitting module 27 is 20 to 25 W, and the total luminous flux is 1100 to 1650 lm.
  • the instrument device 15 includes a reflector 81 that is widened and opened downward, a radiator 82 that is an instrument body attached to the upper part of the reflector 81, A socket 83 attached to the lower part of the radiator 82, a terminal block 85 attached to the upper part of the radiator 82 by a mounting plate 84, and a plurality of mounting springs 86 for attaching to the ceiling around the radiator 82, etc. I have.
  • a circular opening 87 is formed at the top of the reflector 81, and a triangular mark 88 indicating the mounting position of the lamp device 14 is provided at one place on the inner peripheral surface of the reflector 81.
  • the heat radiating body 82 is made of a material such as a metal such as aluminum die casting, ceramics, or a resin excellent in heat dissipation.
  • the heat dissipating body 82 has a columnar base 89 and a plurality of heat dissipating fins 90 projecting radially from the periphery of the base 89.
  • a circular protrusion 91 that fits into the opening 87 of the reflector 81 is formed on the lower surface of the base 89, and a flat or planar heat conduction surface 92 is formed on the lower surface of the protrusion 91.
  • a cylindrical projection 93 is formed protruding.
  • a plurality of attachment portions 94 to which attachment springs 86 are attached are formed around the base portion 89.
  • the socket 83 includes a socket main body 95 made of an insulating synthetic resin and formed in an annular shape, and a pair of terminals (not shown) arranged on the socket main body 95.
  • a circular opening 96 through which the protrusion 49 of the base 30 of the lamp device 14 is inserted is formed in the center of the socket body 95.
  • An annular socket surface 97 is formed on the lower surface of the socket body 95 so as to face the base surface 48 of the lamp device 14.
  • a pair of connection holes 98 into which the pair of lamp pins 71 of the lamp device 14 are inserted are formed in a long hole shape along the circumferential direction.
  • a pair of terminals are disposed above the pair of connection holes 98, and a pair of lamp pins 71 of the lamp device 14 inserted into the pair of connection holes 98 are electrically connected to the pair of terminals.
  • a plurality of restricting protrusions 99 are formed on the inner peripheral surface of the socket body 95, and a plurality of substantially L-shaped key grooves 100 are formed.
  • Each key groove 100 is formed in a substantially L shape having a vertical groove 100a formed along the vertical direction and a horizontal groove 100b formed along the circumferential direction on the upper side of the socket body 95.
  • the restriction projection 99 and the key groove 100 of the socket 83 and the groove 46 and the key 47 of the lamp device 14 are provided at corresponding positions.
  • the key groove 100 of the socket 83 and the key 47 of the lamp device 14 constitute an attachment / detachment structure 101 that rotates the base 30 with respect to the socket 83 to attach / detach.
  • the socket body 95 is formed with a plurality of bosses 102 that open to the socket surface 97. Inside the boss 102, a sleeve 103 that penetrates the boss 102 and contacts the reflector 81, a coil spring 104 as an elastic body disposed on the outer periphery of the sleeve 103, the sleeve 103, and the reflector 81 penetrates the heat sink. A screw 105 to be screwed to 82 is arranged. By tightening the screw 105, the sleeve 103 and the reflector 81 are sandwiched and fixed between the heat sink 82 and the heat sink 82.
  • the coil spring 104 is disposed in a compressed state between the inner surface of the boss 102 and the head of the screw 105, and has a repulsive force in the direction in which the socket body 95 is pressed against the heat radiating body 82.
  • the socket main body 95 is supported by the sleeve 103 so as to be movable in the vertical direction perpendicular to the heat conducting surface 92 of the heat radiating body 82, and is pressed upward toward the heat radiating body 82 by the repulsive force of the coil spring 104.
  • the socket body 95, the sleeve 103, the coil spring 104, the screw 105, and the like constitute a pressing structure 106 that presses the contact surface 50 of the base 30 against the heat conducting surface 92 by mounting the base 30 to the socket 83. .
  • the terminal block 85 is electrically connected to the terminal of the socket 83.
  • the lighting device 11 composed of the lamp device 14 and the fixture device 15 in this way, for example, a plurality of types of lamp devices 14 are provided according to the difference in the output of the light emitting module 27, etc. Accordingly, when a plurality of types of fixture devices 15 are provided for each type of the lamp device 14, the compatible types of lamp devices 14 and the fixture device 15 are combined.
  • the lamp device 14 having a high output is mounted on the fixture device 15 that is compatible with the lamp device 14 having a low output. That is, when the fixture device 15 is optimized for heat dissipation performance in accordance with the output of the lamp device 14, if the lamp device 14 with a large output is mounted on the fixture device 15 suitable for the lamp device 14 with a small output, the lamp device 14 The desired performance may not be achieved. On the other hand, even if the lamp device 14 with a small output is mounted on the fixture device 15 to which the lamp device 14 with a large output is fitted, the heat dissipation performance is only excessive and the desired performance can be achieved. In other words, the lamp device 14 can be mounted on the fixture device 15 that fits the lamp device 14 that is larger than its own output, and cannot be mounted on the fixture device 15 that fits the lamp device 14 smaller than its own output. It is desirable to do.
  • the fixture device 15 for the lamp device 14 it is desirable to set the suitability of the fixture device 15 for the lamp device 14 depending on the difference in power supply voltage input to the lamp device 14. For example, when there is a lamp device 14 that operates at 100V and a lamp device 14 that operates at 200V, it is necessary to set a device device 15 dedicated to 100V and a device device 15 dedicated to 200V.
  • the adaptation between the lamp device 14 and the fixture device 15 according to the difference between the output of the lamp device 14 and the input voltage.
  • the suitability between the lamp device 14 and the appliance device 15 can be set, for example, by changing the position and size of the groove portion 46 of the base 30 and the restriction projection 99 of the socket 83 for each type.
  • FIG. 5 shows a plan view of the base 30.
  • a key 47 protrudes from the periphery of the base member 29 at three equally spaced intervals in the circumferential direction, and one of the three keys 47 serves as a reference key 47s.
  • groove portions 46 are formed at three locations separated from the straight line L1 connecting the center of the base member 29 and the reference key 47s by predetermined angles ⁇ , ⁇ , ⁇ in the circumferential direction. ing.
  • the grooves 46 formed in the 100V base 30 and the grooves 46 formed in the 200V base 30 are relatively shifted in the positions of the angles ⁇ , ⁇ , and ⁇ from the reference key 47s.
  • the circumferential length X of the groove 46 is set to be shorter in the lamp device 14 having a larger output than in the lamp device 14 having a smaller output.
  • FIG. 6 shows a bottom view of the socket 83.
  • key grooves 100 are provided at three positions that are equally spaced in the circumferential direction, and one of these three key grooves 100 is used as a reference key groove 100s.
  • the socket body 95 has a restriction protrusion 99 that protrudes at a position and size that allows insertion of the groove 46 formed in the base 30 of the lamp device 14 that matches the key groove 100s as a reference. Yes.
  • the dimension X in the circumferential direction of the groove 46 of the lamp device 14 with a small output is larger than the dimension Y of the restricting projection 99 of the socket 83 corresponding to the lamp device 14 with a large output.
  • the lamp device 14 having a small output can be mounted on the base 30 that is suitable for the lamp device 14 having a large output.
  • the heat radiation performance is ensured even if it is mounted on the fixture device 15 that is suitable for the lamp device 14 having a large output.
  • the circumferential dimension X of the groove 46 of the lamp device 14 having a high output is smaller than the dimension Y of the restricting projection 99 of the socket 83 corresponding to the lamp device 14 having a low output.
  • the lamp device 14 having a large output cannot be attached to the socket 83 suitable for the lamp device 14 having a small output due to interference with the restricting protrusion 99. That is, the lamp device 14 having a high output cannot be attached to the fixture device 15 to which the lamp device 14 having a low output is suitable, and safety is ensured.
  • the positions of the groove 46 and the regulation protrusion 99 are different between the lamp device 14 for 100 V and the device device 15 for 200 V, and the lamp device 14 for 100 V and the device device 15 for 100 V, and the output is small. Moreover, since both of the large outputs are not compatible, it is possible to prevent erroneous mounting.
  • lamp devices 14 are set depending on whether or not the cap 30 has the recess 51, and only the lamp device 14 having the recess 51 in the cap 30 can be attached to the fixture device 15 having the protrusion 93.
  • a suitable type of lamp device 14 and fixture device 15 are combined.
  • the inner diameter and depth of the recess 51 of the base 30 and the diameter and protrusion amount of the projection 93 of the instrument device 15 are changed depending on the type. You can set the type.
  • the lamp device 14 is inserted from the lower surface opening of the fixture device 15, and each groove portion 46 of the base 30 is passed upward in accordance with each regulation protrusion 99 of the socket 83, and each key 47 of the base 30 is set to each of the socket 83.
  • the projection 49 of the base 30 is inserted into the opening 96 of the socket 83 and inserted along the vertical groove 100 a of the keyway 100.
  • the recess of the base 30 51 fits into the protrusion 93 of the radiator 82, in other words, the protrusion 93 of the radiator 82 is inserted into the recess 51 of the base 30. Therefore, the protruding portion 49 of the base 30 can be inserted to a predetermined insertion position in the opening 96 of the socket 83, and the contact surface 50 of the base 30 is connected to the heat conducting surface 92 of the radiator 82 via the heat conducting sheet 22. It can be made to contact. At this time, each lamp pin 71 protruding from the base 30 is inserted into each connection hole 98 of the socket 83.
  • each key 47 of the base 30 enters into the lateral groove 100b of each key groove 100 of the socket 83 and gets caught, The lamp device 14 is attached to the socket 83.
  • each lamp pin 71 of the base 30 moves in each connection hole 98 of the socket 83 and contacts each terminal disposed in each connection hole 98 to be electrically connected.
  • the socket body 95 is pushed down against the coil spring 104 by the key 47 of the base 30.
  • the repulsive force of the coil spring 104 acts in a direction to press the base 30 against the heat conducting surface 92 of the radiator 82 via the socket body 95, and the contact surface 50 of the base 30 passes through the heat conducting sheet 22 to the radiator 82.
  • the heat conduction surface 92 is pressed against.
  • the contact surface 50 of the base 30 is in close contact with the heat conductive surface 92 of the radiator 82 via the heat conductive sheet 22, and from the base 30 of the lamp device 14 It is possible to conduct heat efficiently to the radiator 82.
  • the cap 30 When the protrusion 49 is to be inserted into the opening 96 of the socket 83, the contact surface 50 of the base 30 abuts on the protrusion 93 of the radiator 82, and the protrusion 49 of the base 30 is inserted into the opening 96 of the socket 83. Cannot be inserted up to a predetermined device position.
  • each key 47 of the base 30 will not enter the lateral groove 100b of each key groove 100 of the socket 83.
  • the lamp device 14 cannot be mounted in the socket 83. Therefore, it is possible to prevent the lamp device 14 and the appliance device 15 of an incompatible type from being combined.
  • the key 47 of the base 30 is moved to the respective direction of the socket 83 by rotating the lamp device 14 in the removal direction opposite to that at the time of attachment.
  • the key groove 100 moves from the horizontal groove 100b to the vertical groove 100a.
  • each lamp pin 71 is removed from each connection hole 98 of each socket 83, each groove portion 46 of the base 30 is released from each regulation protrusion 99 of the socket 83, and the base 30
  • the keys 47 are removed from the key grooves 100 of the socket 83, and the base 30 is detached from the opening 96 of the socket 83, so that the lamp device 14 can be removed from the socket 83.
  • the lighting circuit 25 When power is supplied to the lighting circuit 25 from the power line through the terminal block 85, the terminal of the socket 83 and the lamp pin 71 of the lamp device 14, the lighting power is supplied from the lighting circuit 25 to the semiconductor light emitting element of the light emitting module 27.
  • the light emitted from the light emitting unit 56 by turning on the semiconductor light emitting element travels in the light guide unit 62 of the reflector 61, passes through the light transmitting cover 26, and is emitted from the lower surface opening of the instrument device 15.
  • the heat generated by the semiconductor light emitting element of the light emitting module 27 at the time of lighting is mainly efficiently conducted to the light emitting module mounting portion 45 of the base member 29 that is thermally bonded from the substrate 55 of the light emitting module 27. Then, heat is efficiently conducted from the light emitting module mounting portion 45 of the base member 29 to the heat dissipating member 82 that is in close contact with the heat conducting sheet 22, and the heat dissipating from the surface of the heat dissipating member 82 including the plurality of heat dissipating fins 90 to the air.
  • part of the heat conducted from the lamp device 14 to the radiator 82 is also conducted to the reflector 81, the plurality of attachment springs 86, and the attachment plate 84, respectively, and is also radiated into the air from these.
  • the heat generated by the lighting circuit 25 is transmitted to the case 28 and the translucent cover 26, and is radiated from the surface of the case 28 and the translucent cover 26 to the air.
  • the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is equal to the depth dimension h2 of the recess 51 from the contact surface 50 and the protrusion dimension h3 of the heat conduction sheet 22 from the contact surface 50. It is smaller than the above dimension and has a relationship of h1 ⁇ h2 + h3.
  • the contact surface 50 of the base 30 is connected to the heat conductive surface 92 of the heat sink 82 via the heat conductive sheet 22 even when the protrusion 93 of the heat sink 82 is inserted into the recess 51 of the base 30. It can be reliably contacted.
  • the protrusion 93 of the radiator 82 is inserted into the recess 51 of the base 30, and the tip surface of the protrusion 93 comes into contact with the bottom surface of the recess 51. Cannot be brought into contact with the heat conducting surface 92 of the radiator 82 via the heat conducting sheet 22.
  • the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is larger than the dimension obtained by combining the movement dimension h4 of the socket 83 and the protrusion dimension h3 of the heat conduction sheet 22 from the contact surface 50. , H1> h4 + h3.
  • the lamp device 14 having the recess 51 can be attached to the fixture device 15 having the protrusion 93, but the lamp device 14 not having the recess 51 cannot be attached in any way. it can.
  • the socket body 95 is forcibly pushed down by placing a finger on the socket body 95, the protrusion 49 of the base 30 is inserted to a predetermined device position in the opening 96 of the socket 83, and in this state There is a possibility that the lamp device 14 can be rotated and attached to the socket 83.
  • the lamp device 14 having no recess 51 can be prevented from being mounted in any way.
  • the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is smaller than the dimension h5 from the heat conduction surface 92 to the socket surface 97, and h1 ⁇ h5.
  • the lamp device 14 having the recess 51 can be mounted on the fixture device 15 having the protrusion 93, and the lamp device 14 not having the recess 51 cannot be mounted. Therefore, a suitable type of lamp device 14 and fixture device 15 can be used in combination.
  • the concave portion 51 is provided in the contact surface 50 of the base 30 instead of the projection 93, the work of attaching the heat conductive sheet 22 to the contact surface 50 can be facilitated.
  • the recess 51 is provided in the center of the contact surface 50 and the protrusion 93 is provided in the center of the heat conduction surface 92. Therefore, the area of the recess 51 opening in the contact surface 50 can be minimized, the area of the contact surface 50 can be ensured, and sufficient heat conduction performance from the contact surface 50 to the heat conduction surface 92 can be ensured.
  • the recess 51 is provided in the center of the contact surface 50 and the protrusion 93 is provided in the center of the heat conducting surface 92, so that when the base 30 is rotated with respect to the socket 83 and attached / detached.
  • the protrusions 93 it is possible to prevent the protrusions 93 from coming into contact with the heat conductive sheet 22 on the contact surface 50 and causing damage.
  • the protrusion dimension of the protrusion 93 from the heat conduction surface 92 is smaller than the total dimension of the depth dimension of the recess 51 from the contact surface 50 and the protrusion dimension of the heat conduction sheet 22 from the contact surface 50, the base 30 Even when the protrusion 93 of the radiator 82 is inserted into the recess 51, the contact surface 50 of the base 30 can be reliably brought into contact with the heat conducting surface 92 of the radiator 82 via the heat conducting sheet 22.
  • the protrusion dimension of the protrusion 93 from the heat conduction surface 92 is larger than the total dimension of the movement dimension of the socket 83 and the protrusion dimension of the heat conduction sheet 22 from the contact surface 50.
  • the lamp device 14 having the recess 51 can be mounted, but the lamp device 14 not having the recess 51 cannot be mounted in any way.
  • the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is smaller than the dimension h5 from the heat conduction surface 92 to the socket surface 97, when the base 30 is attached to the socket 83, the base 30 is in relation to the socket 83. Even if the heat conductive sheet 22 is inserted obliquely, the heat conductive sheet 22 of the base 30 does not come into contact with the protrusions 93, and the heat conductive sheet 22 can be prevented from being peeled off or torn.
  • the heat conducting surface 92 is not limited to being provided on the radiator 82 but may be provided on the socket 83.
  • the socket 83 and the radiator 82 may be provided integrally.
  • the protrusion 93 may also be provided on the socket 83 as long as it is provided on the heat conduction surface 92 with which the contact surface 50 of the base 30 contacts.
  • a combination of a plurality of types is possible by changing the inner diameter and depth of the recess 51 of the base 30 and the diameter and protrusion amount of the projection 93 of the instrument device 15 for each type. Can be set.
  • the adaptation of the fixture device 15 and the lamp device 14 in which the input voltage is set in advance has been described, but the lamp device 14 that can be used at both 100 V and 200 V is assumed as the type of the lamp device 14. Even in this case, it is possible to prevent erroneous mounting.
  • the recess 51 is provided in the lamp device 14 corresponding to 100V and 200V
  • the protrusion 93 is provided in the instrument device 15 corresponding to 100V and 200V.
  • the instrument device 15 corresponding to 100V and 200V means that 100V and 200V are properly used by the user, and the constituent members are common.
  • the socket 83 for 200V is used as the instrument apparatus 15 corresponding to 100V and 200V is demonstrated.
  • the lamp device 14 for 100V and 200V does not have the recess 51, so that the protrusion 93 can be mounted on the instrument device 15 corresponding to 100V and 200V. Can not. Assuming that 100V is connected to the 100V and 200V compatible appliance device 15 without the projection 93, 100V power may be supplied to the 200V lamp device 14, and in this case, the lamp device 14 is turned on. I can't let you.
  • the lamp devices 14 and 100V corresponding to 100V and 200V are used. A method of fitting with the instrument device 15 for 200V will be described.
  • FIG. 11 is a partially enlarged view showing a state in which the socket 83 of the fixture device 15 and the base 30 of the lamp device 14 are aligned.
  • FIG. 11 (a) shows the restricting protrusion 99 of the socket 83 that fits the lamp device 14 with a small output
  • FIG. 11 (b) shows the restricting protrusion 99 of the socket 83 that fits the lamp device 14 with a large output.
  • As the restriction protrusion 99 a restriction protrusion 99 for 100V (for 100V) and a restriction protrusion 99 for 200V (for 200V) are shown in FIG.
  • a straight line L1 indicates a straight line connecting the center of the base 30 and the reference key 47s.
  • the straight line L2 is a straight line connecting the center of the base 30 and the center of the 100V regulating protrusion 99 (for 100V) when the key 47s serving as the reference of the base 30 and the key groove 100 of the socket 83 are aligned. Is shown.
  • a straight line L3 indicates a straight line connecting the center of the base 30 and the center of the regulating protrusion 99 for 200V (for 200V).
  • the angle ⁇ formed by the straight line L2 and the straight line L3 is set to 5 °, for example.
  • the groove 46 of the base 30 of the lamp device 14 corresponding to the input voltages of 100V and 200V is a regulation projection 99 for 100V (for 100V) and a regulation projection 99 for 200V ( (For 200V) and both are formed with dimensions that can pass through.
  • the groove 46S shown in FIG. 11 (a) is set to have a larger dimension in the circumferential direction than the groove 46L shown in FIG. 11 (b).
  • the groove 46S can be inserted with a 100V regulating projection 99 (for 100V) and a 200V regulating projection 99 (for 200V) to which the lamp device 14 having a large output can be fitted, but the groove 46L has a small output.
  • the lamp device 14 cannot be inserted by interfering with both the regulation protrusion 99 for 100V (for 100V) and the regulation protrusion 99 for 200V (for 200V).
  • the lamp device 14 that is compatible with the instrument device 15 for 100V and 200V and that can prevent erroneous mounting on the instrument device 15 having different corresponding outputs.
  • the inner diameter and depth of the recess 51 of the base 30 and the diameter and protrusion amount of the projection 93 of the instrument device 15 are changed depending on the type, thereby supporting 100 V and 200 V.
  • the fixture device 15 and the lamp device 14 to be adapted can be adapted according to the difference in output.
  • the protrusion dimension h1 of the protrusion 93 of the fixture device 15 corresponding to the lamp device 14 having a high output is made smaller than the protrusion dimension h1 of the protrusion 93 of the fixture device 15 corresponding to the lamp device 14 having a low output.
  • the recess 51 of the lamp device 14 is formed in accordance with the dimension of the protrusion 93.
  • the lamp device 14 having a small output can be mounted on the fixture device 15 corresponding to the lamp device 14 having a large output, but has a large output as shown in FIG. 12 (b).
  • the lamp device 14 cannot be mounted on the fixture device 15 corresponding to the lamp device 14 having a small output.

Abstract

An illuminating apparatus (11) of an embodiment is provided with a lamp device (14) and a fixing device (15). In the lamp device (14), a housing (21), which has a ferrule (30), and a light source (23) and a lighting circuit (25), which are housed in the housing (21), are provided, a contact surface (50) is provided on the ferrule (30), and a recessed portion (51) is provided in the contact surface (50). The fixing device (15) has: a socket (83), to which the ferrule (30) is removably attached; a heat transfer surface (92), with which the contact surface (50) is brought into contact when the ferrule (30) is attached to the socket (83); and a protrusion (93), which protrudes further to the side on which the ferrule (30) is to be attached than the heat transfer surface (92). The ferrule (30) is attached to the socket (83) by having the protrusion (93) fitted in the recessed portion (51).

Description

照明装置Lighting equipment
 本発明の実施形態は、適合するランプ装置と器具装置とを組み合わせて使用できる照明装置に関する。 Embodiment of this invention is related with the illuminating device which can be used combining the suitable lamp apparatus and fixture apparatus.
 従来、例えばGX53形などのフラット形の口金を用いたランプ装置と、このランプ装置の口金を着脱可能に装着するソケットを有する器具装置とを組み合わせて使用する照明装置がある。 2. Description of the Related Art Conventionally, there is a lighting device that uses a combination of a lamp device using a flat base such as a GX53 type and an appliance device having a socket on which the base of the lamp device is detachably attached.
 ランプ装置は、光源、およびこの光源を点灯させる点灯回路を備えている。ランプ装置の口金をソケット装置に装着した状態で、ソケットからランプ装置に電力を供給し、ランプ装置の点灯回路により光源が点灯する。 The lamp device includes a light source and a lighting circuit that turns on the light source. With the base of the lamp device mounted on the socket device, power is supplied from the socket to the lamp device, and the light source is turned on by the lighting circuit of the lamp device.
特開2010-262781号公報JP 2010-262781 A
 例えば光源の出力の違いなどに応じて複数種類のランプ装置を設け、このランプ装置の種類毎に適合する器具装置を複数種類設ける場合、適合する種類のランプ装置と器具装置とを組み合わせて使用することになる。 For example, when a plurality of types of lamp devices are provided according to differences in the output of the light source, and a plurality of types of fixture devices are provided for each type of the lamp device, a combination of the appropriate type of lamp device and the fixture device is used. It will be.
 しかしながら、ランプ装置の種類および器具装置の種類に関係なく口金およびソケットが共通であると、不適合な種類の組み合わせでもランプ装置を器具装置に誤装着してしまう問題がある。 However, if the base and the socket are common regardless of the type of the lamp device and the type of the fixture device, there is a problem that the lamp device is erroneously attached to the fixture device even if the combination is incompatible.
 本発明が解決しようとする課題は、適合するランプ装置と器具装置とを組み合わせて使用できる照明装置を提供することである。 The problem to be solved by the present invention is to provide a lighting device that can be used in combination with a suitable lamp device and fixture device.
 実施形態の照明装置は、ランプ装置と器具装置とを具備する。ランプ装置は、口金を有する筐体、この筐体内に収納された光源および点灯回路を備え、口金に接触面が設けられるとともにこの接触面に凹部が設けられている。器具装置は、口金が着脱可能に装着されるソケット、このソケットに口金が装着されることで接触面が接触する熱伝導面、およびこの熱伝導面よりも口金が装着される側に突出する突起を有し、この突起が凹部に入り込んで口金がソケットに装着される。 The lighting device of the embodiment includes a lamp device and a fixture device. The lamp device includes a housing having a base, a light source housed in the housing, and a lighting circuit. The contact surface is provided on the base and a concave portion is provided on the contact surface. The instrument device includes a socket to which the base is detachably attached, a heat conduction surface that comes into contact with the socket when the base is attached, and a protrusion that protrudes from the heat conduction surface toward the side to which the base is attached. The protrusion enters the recess and the base is attached to the socket.
一実施形態の照明装置を示す断面図である。It is sectional drawing which shows the illuminating device of one Embodiment. 同上照明装置のランプ装置と器具装置とを離した状態を示す斜視図である。It is a perspective view which shows the state which isolate | separated the lamp device and fixture apparatus of the illuminating device same as the above. 同上照明装置の分解状態を示す斜視図である。It is a perspective view which shows the decomposition | disassembly state of an illuminating device same as the above. 同上ランプ装置の分解状態を示す斜視図である。It is a perspective view which shows the decomposition | disassembly state of a lamp device same as the above. 同上ランプ装置の口金の平面図である。It is a top view of the nozzle | cap | die of a lamp apparatus same as the above. 同上器具装置のソケットの底面図である。It is a bottom view of the socket of an instrument apparatus same as the above. 同上ランプ装置の突起の突出寸法を説明する説明図である。It is explanatory drawing explaining the protrusion dimension of the protrusion of a lamp apparatus same as the above. 同上ランプ装置の突起の突出寸法を説明する説明図である。It is explanatory drawing explaining the protrusion dimension of the protrusion of a lamp apparatus same as the above. 同上ランプ装置の突起の突出寸法を説明する説明図である。It is explanatory drawing explaining the protrusion dimension of the protrusion of a lamp apparatus same as the above. 同上ランプ装置と器具装置との組み合わせを説明する説明図であり、(a)は装着できない組み合わせを示し、(b)は装着できる組み合わせを示している。It is explanatory drawing explaining the combination of a lamp device and fixture apparatus same as the above, (a) shows the combination which cannot be mounted | worn, (b) has shown the combination which can be mounted | worn. 同上ランプ装置の口金と器具装置のソケットとを位置合わせた状態を示す一部拡大図であり、(a)は小さい出力のランプ装置に適合するソケットの規制突部を示し、(b)は、大きい出力のランプ装置に適合するソケットの規制突部を示している。It is a partially enlarged view showing a state in which the base of the lamp device and the socket of the fixture device are aligned, (a) shows the restriction protrusion of the socket that fits the lamp device of small output, (b), Fig. 4 shows a socket restricting protrusion adapted to a high power lamp device. 同上ランプ装置と器具装置との組み合わせを説明する説明図であり、(a)は出力の小さいランプ装置は出力の大きいランプ装置に対応する器具装置に装着可能であることを示し、(b)は出力の大きいランプ装置は出力の小さいランプ装置に対応する器具装置には装着することができないことを示している。It is explanatory drawing explaining the combination of a lamp device and an appliance device same as the above, (a) shows that a lamp device with a small output can be attached to an appliance device corresponding to a lamp device with a large output, (b) This indicates that a lamp device having a high output cannot be mounted on an appliance corresponding to the lamp device having a low output.
 以下、一実施形態を、図面を参照して説明する。 Hereinafter, an embodiment will be described with reference to the drawings.
 図1に示すように、照明装置11は、ダウンライトなどの埋込形照明器具であり、天井板12に設けられた円形の埋込孔13に埋め込まれて設置される。この照明装置11は、フラット形のランプ装置14、このランプ装置14を着脱可能に装着する器具装置15を備えている。 As shown in FIG. 1, the lighting device 11 is an embedded lighting fixture such as a downlight, and is installed by being embedded in a circular embedded hole 13 provided in the ceiling plate 12. The illuminating device 11 includes a flat lamp device 14 and an appliance device 15 on which the lamp device 14 is detachably mounted.
 図1ないし図4に示すように、ランプ装置14は、フラット形で円筒状の筐体21と、この筐体21の上面に取り付けられた熱伝導シート22と、筐体21内に収容された光源23、光学部品24および点灯回路25と、筐体21の下面に取り付けられた透光カバー26とを備えている。光源23には、半導体発光素子を有する発光モジュール27が用いられている。 As shown in FIGS. 1 to 4, the lamp device 14 is accommodated in a flat and cylindrical casing 21, a heat conductive sheet 22 attached to the upper surface of the casing 21, and the casing 21. A light source 23, an optical component 24, a lighting circuit 25, and a translucent cover 26 attached to the lower surface of the housing 21 are provided. As the light source 23, a light emitting module 27 having a semiconductor light emitting element is used.
 筐体21は、円筒状のケース28、およびこのケース28の上面に取り付けられる円板状の口金部材29を有している。これらケース28の上部側および口金部材29によって、所定の規格寸法の口金30が構成されている。 The housing 21 has a cylindrical case 28 and a disc-shaped base member 29 attached to the upper surface of the case 28. The upper part of the case 28 and the base member 29 constitute a base 30 having a predetermined standard size.
 ケース28は、例えば絶縁性を有する合成樹脂製で、上面の平板部31、この平板部31の周辺部から下方に突出する円筒状の周面部32、および平板部31の上面から上方に突出する円筒状の筒部33を有している。ケース28の下面には、開口部28aが形成されている。 The case 28 is made of, for example, an insulating synthetic resin, and protrudes upward from the flat plate portion 31 on the upper surface, the cylindrical peripheral surface portion 32 protruding downward from the peripheral portion of the flat plate portion 31, and the upper surface of the flat plate portion 31. A cylindrical tube portion 33 is provided. An opening 28 a is formed on the lower surface of the case 28.
 平板部31の中央には円形の光学部品挿通孔34が形成され、平板部31の周辺部にはねじ挿通孔を有する複数のボス35と一対のランプピン挿通孔36とが形成されている。複数のボス35は、平板部31の上面から筒部33の内側に突出されている。平板部31の周辺部および光学部品挿通孔34の縁部には、点灯回路25(回路基板)を支える環状の外周側の基板支え部37および環状の内周側の基板支え部38がそれぞれ形成されている。内周側の基板支え部38の1箇所には配線通路39が形成されている。 A circular optical component insertion hole 34 is formed in the center of the flat plate portion 31, and a plurality of bosses 35 having screw insertion holes and a pair of lamp pin insertion holes 36 are formed in the peripheral portion of the flat plate portion 31. The plurality of bosses 35 protrude from the upper surface of the flat plate portion 31 to the inside of the tube portion 33. An annular outer periphery side substrate support portion 37 and an annular inner periphery side substrate support portion 38 that support the lighting circuit 25 (circuit board) are formed at the periphery of the flat plate portion 31 and the edge of the optical component insertion hole 34, respectively. Has been. A wiring passage 39 is formed at one location of the substrate support portion 38 on the inner peripheral side.
 ケース28の周面部32の内周面には、光学部品24を支える複数の光学部品支え部40が形成されているとともに、開口部28aの近傍に複数の突部41が形成されている。周面部32の外周面で上部側には、表面積を広くするための凹凸部32aが形成されている。 A plurality of optical component support portions 40 that support the optical component 24 are formed on the inner peripheral surface of the peripheral surface portion 32 of the case 28, and a plurality of protrusions 41 are formed in the vicinity of the opening 28a. On the upper side of the outer peripheral surface of the peripheral surface portion 32, an uneven portion 32a for increasing the surface area is formed.
 ケース28の平板部31の上面で筒部33の内側には、発光モジュール27を保持する枠状のホルダ42が取り付けられている。 A frame-shaped holder 42 that holds the light emitting module 27 is attached to the inside of the cylindrical portion 33 on the upper surface of the flat plate portion 31 of the case 28.
 口金部材29は、例えばアルミダイカストなどの金属、セラミックス、あるいは熱伝導性に優れた樹脂などの材料で円板状に形成されている。口金部材29の直径はケース28の筒部33の直径より大きく、口金部材29の周辺部がケース28の筒部33の外周面より突出されている。 The base member 29 is formed in a disk shape with a material such as a metal such as aluminum die casting, ceramics, or a resin having excellent thermal conductivity. The diameter of the base member 29 is larger than the diameter of the cylindrical portion 33 of the case 28, and the peripheral portion of the base member 29 protrudes from the outer peripheral surface of the cylindrical portion 33 of the case 28.
 口金部材29の下面周辺部には、複数のねじ43が、ケース28の複数のボス35を通じて螺着される複数の取付孔44が形成されている。そして、複数のねじ43により、ケース28のホルダ42と口金部材29との間で発光モジュール27を挟み込んだ状態でケース28と口金部材29とが締め付け固定される。 A plurality of mounting holes 44 into which a plurality of screws 43 are screwed through a plurality of bosses 35 of the case 28 are formed in the periphery of the lower surface of the base member 29. The case 28 and the base member 29 are fastened and fixed by the plurality of screws 43 in a state where the light emitting module 27 is sandwiched between the holder 42 of the case 28 and the base member 29.
 口金部材29の下面中央には、口金部材29の下面から突出する発光モジュール取付部45が一体に形成されている。発光モジュール取付部45の下面には発光モジュール27が接触する平面状の取付面45aが形成されている。 In the center of the lower surface of the base member 29, a light emitting module mounting portion 45 protruding from the lower surface of the base member 29 is integrally formed. On the lower surface of the light emitting module mounting portion 45, a flat mounting surface 45a with which the light emitting module 27 comes into contact is formed.
 口金部材29の周辺部には、複数の溝部46と複数のキー47とが周方向に等間隔毎に交互に形成されている。口金部材29をケース28に組み合わせた状態で、各キー47が筒部33の外周面から突出される。なお、本実施形態では、溝部46およびキー47とも3つずつ設けられているが、少なくとも2つずつあればよく、4つずつ以上あってもよい。 A plurality of groove portions 46 and a plurality of keys 47 are alternately formed at equal intervals in the circumferential direction on the periphery of the base member 29. In a state where the base member 29 is combined with the case 28, each key 47 protrudes from the outer peripheral surface of the cylindrical portion 33. In the present embodiment, three grooves 46 and three keys 47 are provided. However, at least two grooves may be provided, and four or more grooves may be provided.
 そして、口金30は、ケース28の上面で構成される円環状の口金面48、この口金面48の内側から突出する円筒状の突出部49を有している。この突出部49の先端である口金部材29の上面に平坦状あるいは平面状の接触面50が形成されている。ランプ装置14の中心軸に対応した接触面50の中央には、円筒状の凹部51が形成されている。接触面50の周縁部と凹部51との間には、熱伝導シート22を配置する六角形(六角形以外の多角形や、円形でもよい)の窪み部52が形成されている。 The base 30 has an annular base surface 48 formed by the upper surface of the case 28, and a cylindrical protrusion 49 that protrudes from the inside of the base surface 48. A flat or planar contact surface 50 is formed on the upper surface of the base member 29 that is the tip of the protruding portion 49. A cylindrical recess 51 is formed at the center of the contact surface 50 corresponding to the central axis of the lamp device 14. Between the peripheral edge of the contact surface 50 and the recess 51, a hexagonal recess 52 (which may be a polygon other than a hexagon or a circle) in which the heat conductive sheet 22 is disposed is formed.
 また、熱伝導シート22は、接触面50から突出する状態に窪み部52に取り付けられており、ランプ装置14を器具装置15に装着した際に、ランプ装置14から器具装置15に効率よく熱伝導させるものである。熱伝導シート22は、例えば、接触面50の窪み部52に貼り付けられる弾性を有するシリコーンシート、およびこのシリコーンシートの上面に貼り付けられるアルミニウム、スズ、亜鉛などの金属箔で六角形(六角形以外の多角形や、円形でもよい)に構成されている。金属箔は、シリコーンシートに比べて、表面の摩擦抵抗が小さい。 Further, the heat conductive sheet 22 is attached to the recess 52 so as to protrude from the contact surface 50. When the lamp device 14 is attached to the fixture device 15, the heat conductive sheet 22 is efficiently transferred from the lamp device 14 to the fixture device 15. It is something to be made. The heat conductive sheet 22 is made of, for example, an elastic silicone sheet attached to the recess 52 of the contact surface 50, and a hexagonal (hexagonal) metal foil made of aluminum, tin, zinc or the like attached to the upper surface of the silicone sheet. Other than polygonal shape or circular shape). The metal foil has a lower surface frictional resistance than the silicone sheet.
 また、発光モジュール27は、基板55、この基板55の下面に形成された発光部56、基板55の下面に実装されたコネクタ57を備えている。 The light emitting module 27 includes a substrate 55, a light emitting portion 56 formed on the lower surface of the substrate 55, and a connector 57 mounted on the lower surface of the substrate 55.
 基板55は、例えば、熱伝導性に優れた金属あるいはセラミックスなどの材料で平板状に形成されている。 The substrate 55 is formed in a flat plate shape with a material such as metal or ceramics having excellent thermal conductivity, for example.
 発光部56は、例えばLED素子やEL素子などの半導体発光素子が用いられている。本実施形態では、半導体発光素子としてLED素子が用いられ、基板55上に複数のLED素子を実装するCOB(Chip On Board)方式が採用されている。すなわち、基板55上に複数のLED素子が実装され、これら複数のLED素子がワイヤボンディングによって直列に電気的に接続され、蛍光体を混入した例えばシリコーン樹脂などの透明樹脂である蛍光体層で複数のLED素子を一体に覆って封止している。LED素子には例えば青色光を発するLED素子が用いられ、蛍光体層にはLED素子からの青色光の一部により励起されて黄色光を放射する蛍光体が混入されている。したがって、LED素子および蛍光体層などによって発光部56が構成され、この発光部56の表面である蛍光体層の表面が四角形または円形の発光面となり、この発光面から白色系の照明光が放射される。なお、発光部56としては、LED素子が搭載された接続端子付きのSMD(Surface Mount Device)パッケージを基板55に複数個実装する方式を用いてもよい。 For the light emitting unit 56, for example, a semiconductor light emitting element such as an LED element or an EL element is used. In the present embodiment, an LED element is used as the semiconductor light emitting element, and a COB (Chip On Board) system in which a plurality of LED elements are mounted on the substrate 55 is employed. That is, a plurality of LED elements are mounted on the substrate 55, the plurality of LED elements are electrically connected in series by wire bonding, and a plurality of phosphor layers, for example, a transparent resin such as silicone resin mixed with a phosphor, are used. The LED elements are integrally covered and sealed. For example, an LED element that emits blue light is used as the LED element, and a phosphor that emits yellow light by being excited by part of the blue light from the LED element is mixed in the phosphor layer. Therefore, the light emitting unit 56 is configured by the LED element and the phosphor layer, and the surface of the phosphor layer which is the surface of the light emitting unit 56 becomes a square or circular light emitting surface, and white illumination light is emitted from this light emitting surface. Is done. As the light emitting unit 56, a method of mounting a plurality of SMD (SurfaceSMount Device) packages with connecting terminals on which LED elements are mounted on the substrate 55 may be used.
 コネクタ57は、複数の半導体発光素子と電気的に接続されているとともに、点灯回路25と接続するためのコネクタ付き電線58が接続される。 The connector 57 is electrically connected to a plurality of semiconductor light emitting elements, and an electric wire 58 with a connector for connecting to the lighting circuit 25 is connected.
 また、光学部品24は、円筒状の反射体61によって構成されている。この反射体61は、例えば絶縁性を有する合成樹脂製で、上下面が開口されるとともに上端側から下端側に向けて段階的または連続的に拡径する円筒状の光ガイド部62が形成され、この光ガイド部62の下端にケース28の下面周辺を覆う環状のカバー部63が形成されている。光ガイド部62の内面およびカバー部63の下面には、例えば白色や鏡面とする光反射率の高い反射面が形成されている。反射面を形成する一手段としてはアルミニウムなどの蒸着手段を用いることができる。この場合、カバー部63の外周部をマスキングして非蒸着面とすることにより電気絶縁性を向上することができる。 Further, the optical component 24 is constituted by a cylindrical reflector 61. The reflector 61 is made of, for example, an insulating synthetic resin, and is formed with a cylindrical light guide portion 62 whose upper and lower surfaces are opened and whose diameter is increased stepwise or continuously from the upper end side toward the lower end side. An annular cover portion 63 that covers the periphery of the lower surface of the case 28 is formed at the lower end of the light guide portion 62. On the inner surface of the light guide portion 62 and the lower surface of the cover portion 63, for example, a reflective surface having a high light reflectance such as white or a mirror surface is formed. As one means for forming the reflecting surface, vapor deposition means such as aluminum can be used. In this case, the electrical insulation can be improved by masking the outer peripheral portion of the cover portion 63 to form a non-deposition surface.
 光ガイド部62の上部側は、点灯回路25(回路基板)およびケース28の光学部品挿通孔34を貫通されている。光ガイド部62の外周面で上下方向の中間部には、ケース28の基板支え部37,38との間で点灯回路25(回路基板)を保持する基板押え部64が形成されている。 The upper side of the light guide portion 62 passes through the lighting circuit 25 (circuit board) and the optical component insertion hole 34 of the case 28. A substrate pressing portion 64 that holds the lighting circuit 25 (circuit substrate) between the outer peripheral surface of the light guide portion 62 and the substrate support portions 37 and 38 of the case 28 is formed at the intermediate portion in the vertical direction.
 カバー部63には、ケース28の各光学部品支え部40に支えられる複数の保持爪65が形成されている。 The cover portion 63 is formed with a plurality of holding claws 65 that are supported by the optical component support portions 40 of the case 28.
 また、点灯回路25は、例えば、商用電源電圧を整流平滑する回路、数kHz~数百kHzの高周波でスイッチングするスイッチング素子を有するDC/DCコンバータなどを備え、定電流の直流電力を出力する電源回路を構成する。点灯回路25は、回路基板67、およびこの回路基板67に実装された複数の電子部品である回路部品68を備えている。 The lighting circuit 25 includes, for example, a circuit for rectifying and smoothing a commercial power supply voltage, a DC / DC converter having a switching element that switches at a high frequency of several kHz to several hundred kHz, and the like, and a power supply that outputs DC power of constant current Configure the circuit. The lighting circuit 25 includes a circuit board 67 and a circuit component 68 that is a plurality of electronic components mounted on the circuit board 67.
 回路基板67は環状に形成され、回路基板67の中央部には反射体61の光ガイド部62の上部側が貫通して嵌め込まれる円形の嵌合孔69が形成されている。嵌合孔69の縁部には、ケース28の配線通路39に対応して切欠部70が形成されている。 The circuit board 67 is formed in an annular shape, and a circular fitting hole 69 into which the upper side of the light guide portion 62 of the reflector 61 is fitted is formed at the center of the circuit board 67. A notch 70 is formed at the edge of the fitting hole 69 corresponding to the wiring passage 39 of the case 28.
 回路基板67の下面が回路部品68のうちのリード線を有するリード部品を実装する実装面67aであり、上面がディスクリート部品のリード線を接続するとともに回路部品68のうちの面実装部品を実装する配線パターンを形成した配線パターン面67bである。回路基板67の実装面67aには、切欠部70の近傍位置に、コネクタ付き電線58によって発光モジュール27と接続するための図示しないコネクタが実装されている。 The lower surface of the circuit board 67 is a mounting surface 67a for mounting the lead component having the lead wire of the circuit component 68, and the upper surface is for connecting the lead wire of the discrete component and mounting the surface mount component of the circuit component 68. This is a wiring pattern surface 67b on which a wiring pattern is formed. On the mounting surface 67 a of the circuit board 67, a connector (not shown) for connecting to the light emitting module 27 by the connector-attached electric wire 58 is mounted in the vicinity of the notch 70.
 そして、回路基板67は、配線パターン面67bがケース28の平板部31に平行に対向する状態で、ケース28内の上側に配置されている。回路基板67の実装面67aに実装された回路部品68はケース28の周面部32と反射体61の光ガイド部62およびカバー部63との間に配置されている。 The circuit board 67 is arranged on the upper side in the case 28 with the wiring pattern surface 67b facing the flat plate portion 31 of the case 28 in parallel. The circuit component 68 mounted on the mounting surface 67a of the circuit board 67 is disposed between the peripheral surface portion 32 of the case 28 and the light guide portion 62 and the cover portion 63 of the reflector 61.
 回路基板67に電気的に接続される一対のランプピン71がケース28の各ランプピン挿通孔36に圧入されてケース28の上方に垂直に突出されている。つまり、一対のランプピン71が口金30の口金面48から垂直に突出されている。また、一対のランプピン71は、リード線で回路基板67と電気的に接続してもよく、ランプピン71を回路基板67に立設して回路基板67に直接接続してもよい。 A pair of lamp pins 71 electrically connected to the circuit board 67 is press-fitted into the lamp pin insertion holes 36 of the case 28 and vertically protrudes above the case 28. That is, the pair of lamp pins 71 protrudes vertically from the base surface 48 of the base 30. Further, the pair of lamp pins 71 may be electrically connected to the circuit board 67 with lead wires, or the lamp pins 71 may be erected on the circuit board 67 and directly connected to the circuit board 67.
 また、透光カバー26は、透光性および拡散性を有し、例えば合成樹脂やガラスによって円板状に形成されており、開口部28aを覆ってケース28に取り付けられている。透光カバー26の上面周辺部にはケース28の周面部32の内周に嵌め込まれる嵌め込み部74が形成され、この嵌め込み部74にケース28の周面部32の各突部41に係止される複数の係止爪75が形成されている。各係止爪75が各突部41に係止された状態で、嵌め込み部74と各光学部品支え部40との間で反射体61の各保持爪65を挟み込んで保持する。 Further, the translucent cover 26 has translucency and diffusibility, is formed in a disc shape by, for example, synthetic resin or glass, and is attached to the case 28 so as to cover the opening 28a. A fitting portion 74 is formed around the upper surface of the translucent cover 26 so as to be fitted to the inner periphery of the peripheral surface portion 32 of the case 28. The fitting portion 74 is engaged with each protrusion 41 of the peripheral surface portion 32 of the case 28. A plurality of locking claws 75 are formed. In a state where each locking claw 75 is locked to each projection 41, each holding claw 65 of the reflector 61 is sandwiched and held between the fitting portion 74 and each optical component support portion 40.
 透光カバー26の下面の周辺部には、器具装置15に対するランプ装置14の着脱操作を容易にするための一対の指掛け部76が突設されているとともに、器具装置15への装着位置を表示する三角形のマーク77が形成されている。指掛け部76の形状は、任意であり、外観を損なわない(目立たない)とともに配光に支障を与えず、かつランプ装置14の着脱の際に操作しやすいものが好ましい。 On the periphery of the lower surface of the translucent cover 26, a pair of finger hooks 76 are provided to facilitate the attachment / detachment operation of the lamp device 14 with respect to the fixture device 15, and the mounting position on the fixture device 15 is displayed. A triangular mark 77 is formed. The shape of the finger-hanging portion 76 is arbitrary, and it is preferable that it does not impair the appearance (does not stand out), does not hinder the light distribution, and is easy to operate when the lamp device 14 is attached or detached.
 なお、本実施形態のランプ装置14は、例えば、発光モジュール27の入力電力(消費電力)が20~25W、全光束が1100~1650lmである。 In the lamp device 14 of the present embodiment, for example, the input power (power consumption) of the light emitting module 27 is 20 to 25 W, and the total luminous flux is 1100 to 1650 lm.
 次に、図1ないし図3に示すように、器具装置15は、下方へ向けて拡開開口された反射体81、この反射体81の上部に取り付けられた器具本体としての放熱体82、この放熱体82の下部に取り付けられたソケット83、放熱体82の上部に取付板84によって取り付けられた端子台85、および放熱体82の周囲に取り付けられた天井取付用の複数の取付ばね86などを備えている。 Next, as shown in FIG. 1 to FIG. 3, the instrument device 15 includes a reflector 81 that is widened and opened downward, a radiator 82 that is an instrument body attached to the upper part of the reflector 81, A socket 83 attached to the lower part of the radiator 82, a terminal block 85 attached to the upper part of the radiator 82 by a mounting plate 84, and a plurality of mounting springs 86 for attaching to the ceiling around the radiator 82, etc. I have.
 反射体81の頂部には円形の開口部87が形成され、反射体81の内周面の1箇所にはランプ装置14の装着位置を示す三角形のマーク88が設けられている。 A circular opening 87 is formed at the top of the reflector 81, and a triangular mark 88 indicating the mounting position of the lamp device 14 is provided at one place on the inner peripheral surface of the reflector 81.
 また、放熱体82は、例えばアルミダイカストなどの金属、セラミックス、放熱性に優れた樹脂などの材料によって形成されている。放熱体82は、円柱状の基部89、およびこの基部89の周囲から放射状に突出する複数の放熱フィン90を有している。 Further, the heat radiating body 82 is made of a material such as a metal such as aluminum die casting, ceramics, or a resin excellent in heat dissipation. The heat dissipating body 82 has a columnar base 89 and a plurality of heat dissipating fins 90 projecting radially from the periphery of the base 89.
 基部89の下面には反射体81の開口部87に嵌合する円形の突出部91が形成され、この突出部91の下面に平坦状または平面状の熱伝導面92が形成されている。器具装置15の中心軸に対応した熱伝導面92の中央には、円柱状の突起93が突出形成されている。基部89の周囲には、取付ばね86が取り付けられた複数の取付部94が形成されている。 A circular protrusion 91 that fits into the opening 87 of the reflector 81 is formed on the lower surface of the base 89, and a flat or planar heat conduction surface 92 is formed on the lower surface of the protrusion 91. At the center of the heat conducting surface 92 corresponding to the central axis of the instrument device 15, a cylindrical projection 93 is formed protruding. A plurality of attachment portions 94 to which attachment springs 86 are attached are formed around the base portion 89.
 また、ソケット83は、絶縁性を有する合成樹脂製で環状に形成されたソケット本体95、およびこのソケット本体95に配置された図示しない一対の端子を備えている。 The socket 83 includes a socket main body 95 made of an insulating synthetic resin and formed in an annular shape, and a pair of terminals (not shown) arranged on the socket main body 95.
 ソケット本体95の中央には、ランプ装置14の口金30の突出部49が挿通する円形の開口部96が形成されている。ソケット本体95の下面には、ランプ装置14の口金面48が対向する環状のソケット面97が形成されている。ソケット面97には、ランプ装置14の一対のランプピン71が挿入される一対の接続孔98が周方向に沿って長孔状に形成されている。一対の接続孔98の上側に一対の端子が配置されており、一対の接続孔98に挿入されたランプ装置14の一対のランプピン71が一対の端子に電気的に接続される。 In the center of the socket body 95, a circular opening 96 through which the protrusion 49 of the base 30 of the lamp device 14 is inserted is formed. An annular socket surface 97 is formed on the lower surface of the socket body 95 so as to face the base surface 48 of the lamp device 14. In the socket surface 97, a pair of connection holes 98 into which the pair of lamp pins 71 of the lamp device 14 are inserted are formed in a long hole shape along the circumferential direction. A pair of terminals are disposed above the pair of connection holes 98, and a pair of lamp pins 71 of the lamp device 14 inserted into the pair of connection holes 98 are electrically connected to the pair of terminals.
 ソケット本体95の内周面には、複数の規制突部99が突出形成されているとともに、複数の略L字形のキー溝100が形成されている。各キー溝100は、上下方向に沿って形成された縦溝100a、およびソケット本体95の上部側で周方向に沿って形成された横溝100bを有する略L字形に形成されている。ソケット83の規制突部99およびキー溝100とランプ装置14の溝部46およびキー47とはそれぞれ対応する位置に設けられている。そして、ソケット83のキー溝100とランプ装置14のキー47とによって、ソケット83に対して口金30を回動させて着脱する着脱構造101が構成されている。 A plurality of restricting protrusions 99 are formed on the inner peripheral surface of the socket body 95, and a plurality of substantially L-shaped key grooves 100 are formed. Each key groove 100 is formed in a substantially L shape having a vertical groove 100a formed along the vertical direction and a horizontal groove 100b formed along the circumferential direction on the upper side of the socket body 95. The restriction projection 99 and the key groove 100 of the socket 83 and the groove 46 and the key 47 of the lamp device 14 are provided at corresponding positions. The key groove 100 of the socket 83 and the key 47 of the lamp device 14 constitute an attachment / detachment structure 101 that rotates the base 30 with respect to the socket 83 to attach / detach.
 ソケット本体95には、ソケット面97に開口する複数のボス102が形成されている。ボス102内には、ボス102を貫通して反射体81に当接するスリーブ103、このスリーブ103の外周に配置される弾性体としてのコイルスプリング104、スリーブ103および反射体81を貫通して放熱体82に螺着されるねじ105が配置されている。ねじ105の締め付けにより、放熱体82との間にスリーブ103および反射体81を一体に挟み込んで固定している。コイルスプリング104は、ボス102の奥側の面とねじ105の頭部との間に圧縮状態に配置され、ソケット本体95を放熱体82に押し付ける方向に反発力を有している。ソケット本体95は、スリーブ103によって放熱体82の熱伝導面92に対して垂直な上下方向に移動可能に支持され、コイルスプリング104の反発力によって放熱体82へ向けて上方に押し付けられている。そして、ソケット本体95、スリーブ103、コイルスプリング104およびねじ105などにより、ソケット83に口金30が装着されることで口金30の接触面50を熱伝導面92に押し付ける押付構造106が構成されている。 The socket body 95 is formed with a plurality of bosses 102 that open to the socket surface 97. Inside the boss 102, a sleeve 103 that penetrates the boss 102 and contacts the reflector 81, a coil spring 104 as an elastic body disposed on the outer periphery of the sleeve 103, the sleeve 103, and the reflector 81 penetrates the heat sink. A screw 105 to be screwed to 82 is arranged. By tightening the screw 105, the sleeve 103 and the reflector 81 are sandwiched and fixed between the heat sink 82 and the heat sink 82. The coil spring 104 is disposed in a compressed state between the inner surface of the boss 102 and the head of the screw 105, and has a repulsive force in the direction in which the socket body 95 is pressed against the heat radiating body 82. The socket main body 95 is supported by the sleeve 103 so as to be movable in the vertical direction perpendicular to the heat conducting surface 92 of the heat radiating body 82, and is pressed upward toward the heat radiating body 82 by the repulsive force of the coil spring 104. Then, the socket body 95, the sleeve 103, the coil spring 104, the screw 105, and the like constitute a pressing structure 106 that presses the contact surface 50 of the base 30 against the heat conducting surface 92 by mounting the base 30 to the socket 83. .
 また、端子台85は、ソケット83の端子と電気的に接続されている。 The terminal block 85 is electrically connected to the terminal of the socket 83.
 そして、このようにランプ装置14と器具装置15とで構成される照明装置11において、例えば、発光モジュール27の出力の違いなどに応じて複数種類のランプ装置14を設け、放熱性能の違いなどに応じてランプ装置14の種類毎に適合する器具装置15を複数種類設ける場合には、適合する種類のランプ装置14と器具装置15とが組み合わされるようにする。 And, in the lighting device 11 composed of the lamp device 14 and the fixture device 15 in this way, for example, a plurality of types of lamp devices 14 are provided according to the difference in the output of the light emitting module 27, etc. Accordingly, when a plurality of types of fixture devices 15 are provided for each type of the lamp device 14, the compatible types of lamp devices 14 and the fixture device 15 are combined.
 これは、大きい出力のランプ装置14が、小さい出力のランプ装置14に適合する器具装置15に装着されることを防止するためである。すなわち、器具装置15をランプ装置14の出力に応じて放熱性能を最適化している場合、大きい出力のランプ装置14を小さい出力のランプ装置14に適合する器具装置15に装着すると、ランプ装置14の所望の性能を達成することができなくなる恐れがある。一方、小さい出力のランプ装置14を大きい出力のランプ装置14が適合する器具装置15に装着しても、放熱性能が過剰となるだけであって、所望の性能は達成することができる。つまり、ランプ装置14は、自己の出力よりも大きいランプ装置14が適合する器具装置15に装着可能であって、自己の出力よりも小さいランプ装置14が適合する器具装置15には装着できない構成とすることが望ましい。 This is to prevent the lamp device 14 having a high output from being mounted on the fixture device 15 that is compatible with the lamp device 14 having a low output. That is, when the fixture device 15 is optimized for heat dissipation performance in accordance with the output of the lamp device 14, if the lamp device 14 with a large output is mounted on the fixture device 15 suitable for the lamp device 14 with a small output, the lamp device 14 The desired performance may not be achieved. On the other hand, even if the lamp device 14 with a small output is mounted on the fixture device 15 to which the lamp device 14 with a large output is fitted, the heat dissipation performance is only excessive and the desired performance can be achieved. In other words, the lamp device 14 can be mounted on the fixture device 15 that fits the lamp device 14 that is larger than its own output, and cannot be mounted on the fixture device 15 that fits the lamp device 14 smaller than its own output. It is desirable to do.
 さらに、ランプ装置14に入力される電源電圧の違いによってもランプ装置14に対する器具装置15の適合を設定しておくことが望ましい。例えば、100Vで動作するランプ装置14と200Vで動作するランプ装置14がある場合、100V専用の器具装置15と200V専用の器具装置15とを設定する必要がある。 Furthermore, it is desirable to set the suitability of the fixture device 15 for the lamp device 14 depending on the difference in power supply voltage input to the lamp device 14. For example, when there is a lamp device 14 that operates at 100V and a lamp device 14 that operates at 200V, it is necessary to set a device device 15 dedicated to 100V and a device device 15 dedicated to 200V.
 このように、ランプ装置14と器具装置15との適合は、ランプ装置14の出力と入力電圧の違いに応じて設定することが好ましい。また、ランプ装置14と器具装置15との適合は、例えば、口金30の溝部46とソケット83の規制突部99との位置や大きさを種類毎に変えることにより設定することができる。 Thus, it is preferable to set the adaptation between the lamp device 14 and the fixture device 15 according to the difference between the output of the lamp device 14 and the input voltage. The suitability between the lamp device 14 and the appliance device 15 can be set, for example, by changing the position and size of the groove portion 46 of the base 30 and the restriction projection 99 of the socket 83 for each type.
 図5は、口金30の平面図を示している。口金部材29の周辺部には周方向に等間隔となる3箇所にキー47が突出して設けられ、これら3つのキー47のうちの1つが基準となるキー47sとされている。さらに、口金部材29の周辺部には、口金部材29の中心と基準となるキー47sとを結ぶ直線L1から周方向に所定の角度α、β、γだけ離間した3箇所に溝部46が形成されている。なお、100V用の口金30に形成された溝部46と200V用の口金30に形成された溝部46とは基準となるキー47sからの角度α、β、γの位置が相対的にずれている。また、溝部46の周方向の長さXは、出力が小さいランプ装置14に比べ、出力が大きいランプ装置14の方が短く設定されている。 FIG. 5 shows a plan view of the base 30. A key 47 protrudes from the periphery of the base member 29 at three equally spaced intervals in the circumferential direction, and one of the three keys 47 serves as a reference key 47s. Further, in the peripheral portion of the base member 29, groove portions 46 are formed at three locations separated from the straight line L1 connecting the center of the base member 29 and the reference key 47s by predetermined angles α, β, γ in the circumferential direction. ing. The grooves 46 formed in the 100V base 30 and the grooves 46 formed in the 200V base 30 are relatively shifted in the positions of the angles α, β, and γ from the reference key 47s. Further, the circumferential length X of the groove 46 is set to be shorter in the lamp device 14 having a larger output than in the lamp device 14 having a smaller output.
 図6は、ソケット83の底面図を示している。ソケット本体95の内周面には周方向に等間隔となる3箇所にキー溝100が設けられ、これら3つのキー溝100のうちの1つが基準となるキー溝100sとされている。さらに、ソケット本体95には、基準となるキー溝100sに対して、適合するランプ装置14の口金30に形成された溝部46が挿通可能な位置かつ大きさで規制突部99が突出形成されている。 FIG. 6 shows a bottom view of the socket 83. On the inner peripheral surface of the socket body 95, key grooves 100 are provided at three positions that are equally spaced in the circumferential direction, and one of these three key grooves 100 is used as a reference key groove 100s. In addition, the socket body 95 has a restriction protrusion 99 that protrudes at a position and size that allows insertion of the groove 46 formed in the base 30 of the lamp device 14 that matches the key groove 100s as a reference. Yes.
 ところで、出力が小さいランプ装置14の溝部46の周方向の寸法Xは、出力が大きいランプ装置14に対応するソケット83の規制突部99の寸法Yよりも大きい。このため、出力が小さいランプ装置14は出力が大きいランプ装置14に適合する口金30に装着可能である。しかしながら、大きい出力のランプ装置14に適合する器具装置15に装着しても放熱性能は確保されている。 Incidentally, the dimension X in the circumferential direction of the groove 46 of the lamp device 14 with a small output is larger than the dimension Y of the restricting projection 99 of the socket 83 corresponding to the lamp device 14 with a large output. For this reason, the lamp device 14 having a small output can be mounted on the base 30 that is suitable for the lamp device 14 having a large output. However, the heat radiation performance is ensured even if it is mounted on the fixture device 15 that is suitable for the lamp device 14 having a large output.
 一方、出力が大きいランプ装置14の溝部46の周方向の寸法Xは、出力が小さいランプ装置14に対応するソケット83の規制突部99の寸法Yよりも小さい。このため、出力が大きいランプ装置14は、規制突部99と干渉して出力が小さいランプ装置14に適合するソケット83に取り付けることができない。すなわち、出力の大きいランプ装置14は、出力の小さいランプ装置14が適合する器具装置15には取り付けることができず、安全性が確保される。 On the other hand, the circumferential dimension X of the groove 46 of the lamp device 14 having a high output is smaller than the dimension Y of the restricting projection 99 of the socket 83 corresponding to the lamp device 14 having a low output. For this reason, the lamp device 14 having a large output cannot be attached to the socket 83 suitable for the lamp device 14 having a small output due to interference with the restricting protrusion 99. That is, the lamp device 14 having a high output cannot be attached to the fixture device 15 to which the lamp device 14 having a low output is suitable, and safety is ensured.
 なお、100V用のランプ装置14と200V用の器具装置15、200V用のランプ装置14と100V用の器具装置15とは、溝部46と規制突部99との位置が相違しており、小さい出力および大きい出力ともに互換性がないため誤装着を防止することができる。 Note that the positions of the groove 46 and the regulation protrusion 99 are different between the lamp device 14 for 100 V and the device device 15 for 200 V, and the lamp device 14 for 100 V and the device device 15 for 100 V, and the output is small. Moreover, since both of the large outputs are not compatible, it is possible to prevent erroneous mounting.
 次に、ランプ装置14と器具装置15との他の適合方法について説明する。例えば、口金30に凹部51を有するか有さないかで種類の異なるランプ装置14を設定し、突起93を有する器具装置15には口金30に凹部51を有するランプ装置14のみが装着できるようにし、適合する種類のランプ装置14と器具装置15とが組み合わされるようにする。なお、口金30に凹部51を有するランプ装置14においても、口金30の凹部51の内径や深さと、器具装置15の突起93の直径や突出量とを種類毎に変えることにより、3種類以上の種類を設定することができる。 Next, another method for adapting the lamp device 14 and the fixture device 15 will be described. For example, different types of lamp devices 14 are set depending on whether or not the cap 30 has the recess 51, and only the lamp device 14 having the recess 51 in the cap 30 can be attached to the fixture device 15 having the protrusion 93. A suitable type of lamp device 14 and fixture device 15 are combined. In the lamp device 14 having the recess 51 in the base 30, the inner diameter and depth of the recess 51 of the base 30 and the diameter and protrusion amount of the projection 93 of the instrument device 15 are changed depending on the type. You can set the type.
 次に、器具装置15へのランプ装置14の装着について説明する。 Next, attachment of the lamp device 14 to the appliance device 15 will be described.
 まず、ランプ装置14を器具装置15の下面開口から挿入し、口金30の各溝部46をソケット83の各規制突部99に合わせて上方へ通すとともに、口金30の各キー47をソケット83の各キー溝100の縦溝100aに合わせて挿入し、口金30の突出部49をソケット83の開口部96に挿入する。 First, the lamp device 14 is inserted from the lower surface opening of the fixture device 15, and each groove portion 46 of the base 30 is passed upward in accordance with each regulation protrusion 99 of the socket 83, and each key 47 of the base 30 is set to each of the socket 83. The projection 49 of the base 30 is inserted into the opening 96 of the socket 83 and inserted along the vertical groove 100 a of the keyway 100.
 ここで、適合する種類のランプ装置14と器具装置15との組み合わせである場合、つまり凹部51を有するランプ装置14を突起93を有する器具装置15に装着しようとしている場合には、口金30の凹部51が放熱体82の突起93に嵌り、言い換えれば口金30の凹部51に放熱体82の突起93が挿入される。そのため、口金30の突出部49をソケット83の開口部96内の所定の挿入位置まで挿入することができ、口金30の接触面50を熱伝導シート22を介して放熱体82の熱伝導面92に当接させることができる。このとき、口金30から突出する各ランプピン71がソケット83の各接続孔98に挿入される。 Here, in the case of a combination of a suitable type of lamp device 14 and the fixture device 15, that is, when the lamp device 14 having the recess 51 is to be attached to the fixture device 15 having the projection 93, the recess of the base 30 51 fits into the protrusion 93 of the radiator 82, in other words, the protrusion 93 of the radiator 82 is inserted into the recess 51 of the base 30. Therefore, the protruding portion 49 of the base 30 can be inserted to a predetermined insertion position in the opening 96 of the socket 83, and the contact surface 50 of the base 30 is connected to the heat conducting surface 92 of the radiator 82 via the heat conducting sheet 22. It can be made to contact. At this time, each lamp pin 71 protruding from the base 30 is inserted into each connection hole 98 of the socket 83.
 ソケット83に対して所定の挿入位置まで挿入したランプ装置14を装着方向に所定角度回動させることにより、口金30の各キー47がソケット83の各キー溝100の横溝100bに侵入して引っ掛かり、ランプ装置14がソケット83に取り付けられる。このとき、口金30の各ランプピン71がソケット83の各接続孔98内を移動して各接続孔98に配置されている各端子に接触して電気的に接続される。 By rotating the lamp device 14 inserted up to a predetermined insertion position with respect to the socket 83 by a predetermined angle in the mounting direction, each key 47 of the base 30 enters into the lateral groove 100b of each key groove 100 of the socket 83 and gets caught, The lamp device 14 is attached to the socket 83. At this time, each lamp pin 71 of the base 30 moves in each connection hole 98 of the socket 83 and contacts each terminal disposed in each connection hole 98 to be electrically connected.
 口金30のキー47がソケット83のキー溝100の横溝100bに侵入する際には、口金30のキー47でソケット本体95をコイルスプリング104に抗して押し下げる。これにより、コイルスプリング104の反発力がソケット本体95を介して口金30を放熱体82の熱伝導面92に押し付ける方向に働き、口金30の接触面50が熱伝導シート22を介して放熱体82の熱伝導面92に押し付けられる。 When the key 47 of the base 30 enters the lateral groove 100b of the key groove 100 of the socket 83, the socket body 95 is pushed down against the coil spring 104 by the key 47 of the base 30. As a result, the repulsive force of the coil spring 104 acts in a direction to press the base 30 against the heat conducting surface 92 of the radiator 82 via the socket body 95, and the contact surface 50 of the base 30 passes through the heat conducting sheet 22 to the radiator 82. The heat conduction surface 92 is pressed against.
 したがって、ランプ装置14の口金30をソケット83に装着した状態では、口金30の接触面50が熱伝導シート22を介して放熱体82の熱伝導面92に密着し、ランプ装置14の口金30から放熱体82に効率よく熱伝導可能となる。 Therefore, in a state where the base 30 of the lamp device 14 is attached to the socket 83, the contact surface 50 of the base 30 is in close contact with the heat conductive surface 92 of the radiator 82 via the heat conductive sheet 22, and from the base 30 of the lamp device 14 It is possible to conduct heat efficiently to the radiator 82.
 一方、不適合な種類のランプ装置14と器具装置15との組み合わせである場合、つまり凹部51を有さないランプ装置14を突起93を有する器具装置15に装着しようとしている場合には、口金30の突出部49をソケット83の開口部96内に挿入しようとするときに、口金30の接触面50が放熱体82の突起93に当接し、口金30の突出部49をソケット83の開口部96内の所定の装置位置まで挿入することができない。そのため、仮に、ソケット83に対して所定の挿入位置まで挿入されていないランプ装置14を回転させようとしても、口金30の各キー47がソケット83の各キー溝100の横溝100bに侵入することはなく、ランプ装置14をソケット83に装着することはできない。したがって、不適合な種類のランプ装置14と器具装置15とが組み合わされるのを防止できる。 On the other hand, in the case of a combination of the incompatible lamp device 14 and the appliance device 15, that is, when the lamp device 14 having no recess 51 is to be attached to the appliance device 15 having the projection 93, the cap 30 When the protrusion 49 is to be inserted into the opening 96 of the socket 83, the contact surface 50 of the base 30 abuts on the protrusion 93 of the radiator 82, and the protrusion 49 of the base 30 is inserted into the opening 96 of the socket 83. Cannot be inserted up to a predetermined device position. Therefore, even if it is attempted to rotate the lamp device 14 that has not been inserted to the predetermined insertion position with respect to the socket 83, each key 47 of the base 30 will not enter the lateral groove 100b of each key groove 100 of the socket 83. The lamp device 14 cannot be mounted in the socket 83. Therefore, it is possible to prevent the lamp device 14 and the appliance device 15 of an incompatible type from being combined.
 また、器具装置15に装着されているランプ装置14を外す場合には、まず、ランプ装置14を装着時とは反対の取外し方向に回転させることにより、口金30の各キー47がソケット83の各キー溝100の横溝100bから縦溝100aに移動する。続いて、ランプ装置14を下方へ移動させることにより、各ランプピン71が各ソケット83の各接続孔98から外れ、口金30の各溝部46がソケット83の各規制突部99から外れるとともに、口金30の各キー47がソケット83の各キー溝100から外れ、さらに、口金30がソケット83の開口部96から外れ、ランプ装置14をソケット83から取り外すことができる。 Further, when removing the lamp device 14 attached to the fixture device 15, first, the key 47 of the base 30 is moved to the respective direction of the socket 83 by rotating the lamp device 14 in the removal direction opposite to that at the time of attachment. The key groove 100 moves from the horizontal groove 100b to the vertical groove 100a. Subsequently, by moving the lamp device 14 downward, each lamp pin 71 is removed from each connection hole 98 of each socket 83, each groove portion 46 of the base 30 is released from each regulation protrusion 99 of the socket 83, and the base 30 The keys 47 are removed from the key grooves 100 of the socket 83, and the base 30 is detached from the opening 96 of the socket 83, so that the lamp device 14 can be removed from the socket 83.
 次に、ランプ装置14の点灯について説明する。 Next, lighting of the lamp device 14 will be described.
 電源線から端子台85、ソケット83の端子およびランプ装置14のランプピン71を通じて点灯回路25に給電されると、点灯回路25から発光モジュール27の半導体発光素子に点灯電力を供給し、半導体発光素子が点灯する。半導体発光素子の点灯によって発光部56から放射される光が、反射体61の光ガイド部62内を進行し、透光カバー26を透過して、器具装置15の下面開口から出射される。 When power is supplied to the lighting circuit 25 from the power line through the terminal block 85, the terminal of the socket 83 and the lamp pin 71 of the lamp device 14, the lighting power is supplied from the lighting circuit 25 to the semiconductor light emitting element of the light emitting module 27. Light. The light emitted from the light emitting unit 56 by turning on the semiconductor light emitting element travels in the light guide unit 62 of the reflector 61, passes through the light transmitting cover 26, and is emitted from the lower surface opening of the instrument device 15.
 また、点灯時に、発光モジュール27の半導体発光素子が発生する熱は、主に、発光モジュール27の基板55から熱的に接合されている口金部材29の発光モジュール取付部45に効率よく熱伝導され、この口金部材29の発光モジュール取付部45から熱伝導シート22を介して密着する放熱体82に効率よく熱伝導され、この放熱体82の複数の放熱フィン90を含む表面から空気中に放熱される。 In addition, the heat generated by the semiconductor light emitting element of the light emitting module 27 at the time of lighting is mainly efficiently conducted to the light emitting module mounting portion 45 of the base member 29 that is thermally bonded from the substrate 55 of the light emitting module 27. Then, heat is efficiently conducted from the light emitting module mounting portion 45 of the base member 29 to the heat dissipating member 82 that is in close contact with the heat conducting sheet 22, and the heat dissipating from the surface of the heat dissipating member 82 including the plurality of heat dissipating fins 90 to the air. The
 また、ランプ装置14から放熱体82に熱伝導された熱の一部は、反射体81、複数の取付ばね86および取付板84にもそれぞれ熱伝導され、これらからも空気中に放熱される。 Further, part of the heat conducted from the lamp device 14 to the radiator 82 is also conducted to the reflector 81, the plurality of attachment springs 86, and the attachment plate 84, respectively, and is also radiated into the air from these.
 また、点灯回路25が発生する熱は、ケース28や透光カバー26に伝わり、これらケース28や透光カバー26の表面から空気中に放熱される。 Further, the heat generated by the lighting circuit 25 is transmitted to the case 28 and the translucent cover 26, and is radiated from the surface of the case 28 and the translucent cover 26 to the air.
 次に、器具装置15の熱伝導面92からの突起93の突出寸法について説明する。 Next, the protrusion dimension of the protrusion 93 from the heat conduction surface 92 of the instrument device 15 will be described.
 図7に示すように、熱伝導面92からの突起93の突出寸法h1は、接触面50からの凹部51の深さ寸法h2と接触面50からの熱伝導シート22の突出寸法h3とを合わせた寸法より小さく、h1<h2+h3の関係にある。 As shown in FIG. 7, the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is equal to the depth dimension h2 of the recess 51 from the contact surface 50 and the protrusion dimension h3 of the heat conduction sheet 22 from the contact surface 50. It is smaller than the above dimension and has a relationship of h1 <h2 + h3.
 このh1<h2+h3の関係により、口金30の凹部51に放熱体82の突起93が挿入された状態でも、口金30の接触面50を熱伝導シート22を介して放熱体82の熱伝導面92に確実に接触させることができる。 Due to the relationship of h1 <h2 + h3, the contact surface 50 of the base 30 is connected to the heat conductive surface 92 of the heat sink 82 via the heat conductive sheet 22 even when the protrusion 93 of the heat sink 82 is inserted into the recess 51 of the base 30. It can be reliably contacted.
 仮に、h1>h2+h3の関係にあると、口金30の凹部51に放熱体82の突起93が挿入された状態で、凹部51の底面に突起93の先端面が当接し、口金30の接触面50を熱伝導シート22を介して放熱体82の熱伝導面92に接触させることができない。 If h1> h2 + h3, the protrusion 93 of the radiator 82 is inserted into the recess 51 of the base 30, and the tip surface of the protrusion 93 comes into contact with the bottom surface of the recess 51. Cannot be brought into contact with the heat conducting surface 92 of the radiator 82 via the heat conducting sheet 22.
 また、図8に示すように、熱伝導面92からの突起93の突出寸法h1は、ソケット83の移動寸法h4と接触面50からの熱伝導シート22の突出寸法h3とを合わせた寸法より大きく、h1>h4+h3の関係にある。 Further, as shown in FIG. 8, the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is larger than the dimension obtained by combining the movement dimension h4 of the socket 83 and the protrusion dimension h3 of the heat conduction sheet 22 from the contact surface 50. , H1> h4 + h3.
 このh1>h4+h3の関係により、突起93を有する器具装置15に対して、凹部51を有するランプ装置14は装着できるが、凹部51を有さないランプ装置14はどのようにしても装着できないようにできる。 Due to the relationship of h1> h4 + h3, the lamp device 14 having the recess 51 can be attached to the fixture device 15 having the protrusion 93, but the lamp device 14 not having the recess 51 cannot be attached in any way. it can.
 仮に、h1<h4+h3の関係にある場合でも、凹部51を有さないランプ装置14を突起93を有する器具装置15に装着しようとしても、口金30の接触面50が突起93に当接し、口金30の突出部49をソケット83の開口部96内の所定の装置位置まで挿入できないため、ランプ装置14をソケット83に装着することはできない。しかしながら、ソケット本体95に指を掛けてソケット本体95を強制的に押し下げた場合、口金30の突出部49がソケット83の開口部96内の所定の装置位置まで挿入された状態となり、この状態でランプ装置14を回動させてソケット83に装着できてしまうおそれがある。 Even if h1 <h4 + h3, even if the lamp device 14 that does not have the recess 51 is to be mounted on the fixture device 15 having the protrusion 93, the contact surface 50 of the base 30 comes into contact with the protrusion 93, and the base 30 Therefore, the lamp device 14 cannot be mounted on the socket 83 because the protrusion 49 cannot be inserted to a predetermined device position in the opening 96 of the socket 83. However, when the socket body 95 is forcibly pushed down by placing a finger on the socket body 95, the protrusion 49 of the base 30 is inserted to a predetermined device position in the opening 96 of the socket 83, and in this state There is a possibility that the lamp device 14 can be rotated and attached to the socket 83.
 したがって、h1>h4+h3の関係により、凹部51を有さないランプ装置14はどのようにしても装着できないようにできる。 Therefore, due to the relationship of h1> h4 + h3, the lamp device 14 having no recess 51 can be prevented from being mounted in any way.
 また、図9に示すように、熱伝導面92からの突起93の突出寸法h1は、熱伝導面92からソケット面97までの寸法h5より小さく、h1<h5の関係にある。 Further, as shown in FIG. 9, the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is smaller than the dimension h5 from the heat conduction surface 92 to the socket surface 97, and h1 <h5.
 このh1<h5の関係により、口金30をソケット83に装着する際に、口金30がソケット83に対して斜めに挿入された場合でも、口金30の熱伝導シート22が突起93に接触することがなく、熱伝導シート22が剥がれたり破れるのを防止できる。 Due to the relationship of h1 <h5, when the base 30 is mounted in the socket 83, even if the base 30 is inserted obliquely with respect to the socket 83, the heat conductive sheet 22 of the base 30 may contact the protrusion 93. Therefore, it is possible to prevent the heat conductive sheet 22 from being peeled off or torn.
 仮に、h1>h5の関係にあると、口金30をソケット83に装着する際に、口金30がソケット83に対して斜めに挿入された場合、口金30の熱伝導シート22が突起93に接触しやすく、熱伝導シート22が剥がれたり破れるおそれがある。 If the relationship of h1> h5 is satisfied, when the cap 30 is inserted into the socket 83 when the cap 30 is inserted into the socket 83, the heat conductive sheet 22 of the cap 30 contacts the protrusion 93. It is easy to cause the heat conductive sheet 22 to be peeled off or torn.
 以上のように、本実施形態の照明装置11によれば、突起93を有する器具装置15に対して、凹部51を有するランプ装置14が装着でき、凹部51を有さないランプ装置14は装着できないため、適合する種類のランプ装置14と器具装置15とを組み合わせて使用できる。 As described above, according to the illumination device 11 of the present embodiment, the lamp device 14 having the recess 51 can be mounted on the fixture device 15 having the protrusion 93, and the lamp device 14 not having the recess 51 cannot be mounted. Therefore, a suitable type of lamp device 14 and fixture device 15 can be used in combination.
 また、口金30の接触面50には突起93ではなく凹部51を設けているため、接触面50に熱伝導シート22を取り付ける作業をしやすくできる。 Further, since the concave portion 51 is provided in the contact surface 50 of the base 30 instead of the projection 93, the work of attaching the heat conductive sheet 22 to the contact surface 50 can be facilitated.
 また、口金30をソケット83に対して回動させて着脱する着脱構造101を有する照明装置11において、凹部51が接触面50の中央に設けられるとともに、突起93が熱伝導面92の中央に設けられるため、接触面50に開口する凹部51の面積を最小限にすることができ、接触面50の面積を確保し、接触面50から熱伝導面92への十分な熱伝導性能を確保できる。 Further, in the lighting device 11 having the attachment / detachment structure 101 for rotating the base 30 with respect to the socket 83 to attach / detach, the recess 51 is provided in the center of the contact surface 50 and the protrusion 93 is provided in the center of the heat conduction surface 92. Therefore, the area of the recess 51 opening in the contact surface 50 can be minimized, the area of the contact surface 50 can be ensured, and sufficient heat conduction performance from the contact surface 50 to the heat conduction surface 92 can be ensured.
 また、凹部51が接触面50の中央に設けられているとともに、突起93が熱伝導面92の中央に設けられていることにより、口金30をソケット83に対して回動させて着脱する際に、突起93が接触面50の熱伝導シート22に接触して損傷させるのを防止できる。 In addition, the recess 51 is provided in the center of the contact surface 50 and the protrusion 93 is provided in the center of the heat conducting surface 92, so that when the base 30 is rotated with respect to the socket 83 and attached / detached. Thus, it is possible to prevent the protrusions 93 from coming into contact with the heat conductive sheet 22 on the contact surface 50 and causing damage.
 また、熱伝導面92からの突起93の突出寸法は、接触面50からの凹部51の深さ寸法と接触面50からの熱伝導シート22の突出寸法とを合わせた寸法より小さいため、口金30の凹部51に放熱体82の突起93が挿入された状態でも、口金30の接触面50を熱伝導シート22を介して放熱体82の熱伝導面92に確実に接触させることができる。 Further, since the protrusion dimension of the protrusion 93 from the heat conduction surface 92 is smaller than the total dimension of the depth dimension of the recess 51 from the contact surface 50 and the protrusion dimension of the heat conduction sheet 22 from the contact surface 50, the base 30 Even when the protrusion 93 of the radiator 82 is inserted into the recess 51, the contact surface 50 of the base 30 can be reliably brought into contact with the heat conducting surface 92 of the radiator 82 via the heat conducting sheet 22.
 また、熱伝導面92からの突起93の突出寸法は、ソケット83の移動寸法と接触面50からの熱伝導シート22の突出寸法とを合わせた寸法より大きいため、突起93を有する器具装置15に対して、凹部51を有するランプ装置14は装着できるが、凹部51を有さないランプ装置14はどのようにしても装着できないようにできる。 Further, the protrusion dimension of the protrusion 93 from the heat conduction surface 92 is larger than the total dimension of the movement dimension of the socket 83 and the protrusion dimension of the heat conduction sheet 22 from the contact surface 50. In contrast, the lamp device 14 having the recess 51 can be mounted, but the lamp device 14 not having the recess 51 cannot be mounted in any way.
 また、熱伝導面92からの突起93の突出寸法h1は、熱伝導面92からソケット面97までの寸法h5より小さいため、口金30をソケット83に装着する際に、口金30がソケット83に対して斜めに挿入された場合でも、口金30の熱伝導シート22が突起93に接触することがなく、熱伝導シート22が剥がれたり破れるのを防止できる。 Further, since the protrusion dimension h1 of the protrusion 93 from the heat conduction surface 92 is smaller than the dimension h5 from the heat conduction surface 92 to the socket surface 97, when the base 30 is attached to the socket 83, the base 30 is in relation to the socket 83. Even if the heat conductive sheet 22 is inserted obliquely, the heat conductive sheet 22 of the base 30 does not come into contact with the protrusions 93, and the heat conductive sheet 22 can be prevented from being peeled off or torn.
 なお、熱伝導面92は、放熱体82に設けられている場合に限らず、ソケット83に設けられていてもよい。この場合、ソケット83と放熱体82とは一体に設けられているものであってもよい。また、突起93についても、ソケット83に設けてもよく、口金30の接触面50が接触する熱伝導面92に設けられていればよい。 Note that the heat conducting surface 92 is not limited to being provided on the radiator 82 but may be provided on the socket 83. In this case, the socket 83 and the radiator 82 may be provided integrally. The protrusion 93 may also be provided on the socket 83 as long as it is provided on the heat conduction surface 92 with which the contact surface 50 of the base 30 contacts.
 また、口金30に凹部51を有するランプ装置14においても、口金30の凹部51の内径や深さと、器具装置15の突起93の直径や突出量とを種類毎に変えることにより、複数種類の組み合わせを設定することができる。 Also, in the lamp device 14 having the recess 51 in the base 30, a combination of a plurality of types is possible by changing the inner diameter and depth of the recess 51 of the base 30 and the diameter and protrusion amount of the projection 93 of the instrument device 15 for each type. Can be set.
 さらに、ここで説明した凹部51と突起93との関係を有し、前述した溝部46と規制突部99との適合方法を組み合わせることで、さらにランプ装置14の種類が増加した場合に対応させることができる。 Furthermore, it has a relationship between the recess 51 and the protrusion 93 described here, and it is possible to cope with the case where the type of the lamp device 14 further increases by combining the matching method of the groove 46 and the restriction protrusion 99 described above. Can do.
 例えば、上記説明では、入力電圧が予め設定された器具装置15とランプ装置14との適合について説明したが、ランプ装置14の種類として100V、200Vの両方で使用することができるランプ装置14を想定した場合であっても、誤装着を防止することができる。 For example, in the above description, the adaptation of the fixture device 15 and the lamp device 14 in which the input voltage is set in advance has been described, but the lamp device 14 that can be used at both 100 V and 200 V is assumed as the type of the lamp device 14. Even in this case, it is possible to prevent erroneous mounting.
 つまり、100V、200Vに対応するランプ装置14に凹部51を設け、100V、200Vに対応する器具装置15に突起93を設ける。ここで、100V、200Vに対応する器具装置15とは、使用者によって100V、200Vが使い分けられ、構成部材は共通であることを意味する。以下に、100V、200Vに対応する器具装置15として、200V用のソケット83を用いる場合について説明する。 That is, the recess 51 is provided in the lamp device 14 corresponding to 100V and 200V, and the protrusion 93 is provided in the instrument device 15 corresponding to 100V and 200V. Here, the instrument device 15 corresponding to 100V and 200V means that 100V and 200V are properly used by the user, and the constituent members are common. Below, the case where the socket 83 for 200V is used as the instrument apparatus 15 corresponding to 100V and 200V is demonstrated.
 この場合、図10(a)に示すように、100V用、200V用のランプ装置14は、凹部51がないため100V、200Vに対応する器具装置15には突起93が干渉して装着することができない。仮に、突起93が無い100V、200V対応の器具装置15に100Vを接続したことを想定すると、200V用のランプ装置14に100V電源が供給されることがあり、この場合にはランプ装置14を点灯させることができない。 In this case, as shown in FIG. 10 (a), the lamp device 14 for 100V and 200V does not have the recess 51, so that the protrusion 93 can be mounted on the instrument device 15 corresponding to 100V and 200V. Can not. Assuming that 100V is connected to the 100V and 200V compatible appliance device 15 without the projection 93, 100V power may be supplied to the 200V lamp device 14, and in this case, the lamp device 14 is turned on. I can't let you.
 一方、突起93が無い100V用、200V用の器具装置15に凹部51を有するランプ装置14を装着する場合、図10(b)に示すように装着可能である。 On the other hand, when the lamp device 14 having the recess 51 is attached to the instrument device 15 for 100V and 200V having no protrusion 93, it can be attached as shown in FIG. 10 (b).
 さらに、100V用と200V用とで規制突部99、溝部46の位置をずらし、小さい出力と大きい出力とでこれらの寸法を変えている場合について、100V、200Vに対応するランプ装置14と100V用、200V用の器具装置15との適合方法について説明する。 Further, when the positions of the restricting protrusion 99 and the groove 46 are shifted between 100V and 200V, and these dimensions are changed between a small output and a large output, the lamp devices 14 and 100V corresponding to 100V and 200V are used. A method of fitting with the instrument device 15 for 200V will be described.
 図11は、器具装置15のソケット83とランプ装置14の口金30とを位置合わせした状態を示す一部拡大図である。図11(a)は、小さい出力のランプ装置14に適合するソケット83の規制突部99を示し、図11(b)は、大きい出力のランプ装置14に適合するソケット83の規制突部99を示している。規制突部99として、100V用の規制突部99(100V用)と、200V用の規制突部99(200V用)とを同図に示している。直線L1は、口金30の中心と基準となるキー47sとを結んだ直線を示している。直線L2は、口金30の基準となるキー47sとソケット83のキー溝100とを位置合わせしたときの、口金30の中心と100V用の規制突部99(100V用)の中心とを結んだ直線を示している。直線L3は、口金30の中心と200V用の規制突部99(200V用)の中心とを結んだ直線を示している。直線L2と直線L3との成す角θは、例えば5°に設定されている。 FIG. 11 is a partially enlarged view showing a state in which the socket 83 of the fixture device 15 and the base 30 of the lamp device 14 are aligned. FIG. 11 (a) shows the restricting protrusion 99 of the socket 83 that fits the lamp device 14 with a small output, and FIG. 11 (b) shows the restricting protrusion 99 of the socket 83 that fits the lamp device 14 with a large output. Show. As the restriction protrusion 99, a restriction protrusion 99 for 100V (for 100V) and a restriction protrusion 99 for 200V (for 200V) are shown in FIG. A straight line L1 indicates a straight line connecting the center of the base 30 and the reference key 47s. The straight line L2 is a straight line connecting the center of the base 30 and the center of the 100V regulating protrusion 99 (for 100V) when the key 47s serving as the reference of the base 30 and the key groove 100 of the socket 83 are aligned. Is shown. A straight line L3 indicates a straight line connecting the center of the base 30 and the center of the regulating protrusion 99 for 200V (for 200V). The angle θ formed by the straight line L2 and the straight line L3 is set to 5 °, for example.
 ここで、100Vおよび200Vの入力電圧に対応するランプ装置14の口金30の溝部46は、図11に示すように、100V用の規制突部99(100V用)と200V用の規制突部99(200V用)との両方とも通過可能な寸法で形成されている。ここで、図11(a)に示す溝部46Sは図11(b)に示す溝部46Lよりも周方向の寸法が大きく設定されている。そして、溝部46Sは出力の大きいランプ装置14が適合する100V用の規制突部99(100V用)および200V用の規制突部99(200V用)が挿通可能であるが、溝部46Lは出力の小さいランプ装置14が適合する100V用の規制突部99(100V用)および200V用の規制突部99(200V用)の両方に干渉して挿通することができない。 Here, as shown in FIG. 11, the groove 46 of the base 30 of the lamp device 14 corresponding to the input voltages of 100V and 200V is a regulation projection 99 for 100V (for 100V) and a regulation projection 99 for 200V ( (For 200V) and both are formed with dimensions that can pass through. Here, the groove 46S shown in FIG. 11 (a) is set to have a larger dimension in the circumferential direction than the groove 46L shown in FIG. 11 (b). The groove 46S can be inserted with a 100V regulating projection 99 (for 100V) and a 200V regulating projection 99 (for 200V) to which the lamp device 14 having a large output can be fitted, but the groove 46L has a small output. The lamp device 14 cannot be inserted by interfering with both the regulation protrusion 99 for 100V (for 100V) and the regulation protrusion 99 for 200V (for 200V).
 これによって、100V用および200V用の器具装置15に適合し、対応する出力が異なる器具装置15に対する誤装着を防止することができるランプ装置14を実現することができる。 Thus, it is possible to realize the lamp device 14 that is compatible with the instrument device 15 for 100V and 200V and that can prevent erroneous mounting on the instrument device 15 having different corresponding outputs.
 また、口金30に凹部51を有するランプ装置14において、口金30の凹部51の内径や深さと、器具装置15の突起93の直径や突出量とを種類毎に変えることにより、100V、200Vに対応する器具装置15とランプ装置14とを出力の違いに応じて適合させることができる。 In addition, in the lamp device 14 having the recess 51 in the base 30, the inner diameter and depth of the recess 51 of the base 30 and the diameter and protrusion amount of the projection 93 of the instrument device 15 are changed depending on the type, thereby supporting 100 V and 200 V. The fixture device 15 and the lamp device 14 to be adapted can be adapted according to the difference in output.
 例えば、出力が大きいランプ装置14に対応する器具装置15の突起93の突出寸法h1を、出力が小さいランプ装置14に対応する器具装置15の突起93の突出寸法h1よりも小さくする。さらに、ランプ装置14の凹部51を突起93の寸法に合わせて形成する。 For example, the protrusion dimension h1 of the protrusion 93 of the fixture device 15 corresponding to the lamp device 14 having a high output is made smaller than the protrusion dimension h1 of the protrusion 93 of the fixture device 15 corresponding to the lamp device 14 having a low output. Further, the recess 51 of the lamp device 14 is formed in accordance with the dimension of the protrusion 93.
 従って、図12(a)に示すように、出力の小さいランプ装置14は出力の大きいランプ装置14に対応する器具装置15に装着可能であるが、図12(b)に示すように出力の大きいランプ装置14は出力の小さいランプ装置14に対応する器具装置15には装着することができない。 Accordingly, as shown in FIG. 12 (a), the lamp device 14 having a small output can be mounted on the fixture device 15 corresponding to the lamp device 14 having a large output, but has a large output as shown in FIG. 12 (b). The lamp device 14 cannot be mounted on the fixture device 15 corresponding to the lamp device 14 having a small output.
 本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。 Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.
 11  照明装置
 14  ランプ装置
 15  器具装置
 21  筐体
 22  熱伝導シート
 23  光源
 25  点灯回路
 30  口金
 48  口金面
 49  突出部
 50  接触面
 51  凹部
 83  ソケット
 92  熱伝導面
 93  突起
 95  ソケット本体
 96  開口部
 97  ソケット面
 101  着脱構造
 106  押付構造
11 Lighting device 14 Lamp device 15 Appliance device 21 Housing 22 Heat conduction sheet 23 Light source 25 Lighting circuit 30 Base 48 Base surface 49 Protrusion 50 Contact surface 51 Recess 83 Socket 92 Thermal conduction surface 93 Protrusion 95 Socket body 96 Opening 97 Socket Surface 101 Detachable structure 106 Pushing structure

Claims (7)

  1.  口金を有する筐体、この筐体内に収納された光源および点灯回路を備え、前記口金に接触面が設けられるとともにこの接触面に凹部が設けられたランプ装置と;
     前記口金が着脱可能に装着されるソケット、このソケットに前記口金が装着されることで前記接触面が接触する熱伝導面、およびこの熱伝導面よりも前記口金が装着される側に突出する突起を有し、この突起が前記凹部に入り込んで前記口金が前記ソケットに装着される器具装置と;
     を具備していることを特徴とする照明装置。
    A lamp device including a housing having a base, a light source housed in the housing, and a lighting circuit, wherein the contact surface is provided with a contact surface and a recess is provided on the contact surface;
    A socket to which the base is detachably attached, a heat conduction surface that comes into contact with the contact surface when the base is attached to the socket, and a protrusion that protrudes to the side on which the base is attached from the heat conduction surface An instrument device in which the protrusion enters the recess and the base is attached to the socket;
    An illumination device comprising:
  2.  前記凹部は前記接触面の中央に設けられているとともに、前記突起は前記熱伝導面の中央に設けられている
     ことを特徴とする請求項1記載の照明装置。
    The lighting device according to claim 1, wherein the recess is provided in the center of the contact surface, and the protrusion is provided in the center of the heat conducting surface.
  3.  前記口金と前記ソケットとは、前記口金を前記ソケットに対して回動させて着脱する着脱構造を有している
     ことを特徴とする請求項2記載の照明装置。
    The lighting device according to claim 2, wherein the base and the socket have an attachment / detachment structure for attaching and detaching the base by rotating the base with respect to the socket.
  4.  前記接触面は、前記接触面より突出する熱伝導シートを有している
     ことを特徴とする請求項2または3記載の照明装置。
    The lighting device according to claim 2, wherein the contact surface includes a heat conductive sheet protruding from the contact surface.
  5.  前記熱伝導面からの前記突起の突出寸法は、前記接触面からの前記凹部の深さ寸法と前記接触面からの前記熱伝導シートの突出寸法とを合わせた寸法より小さい
     ことを特徴とする請求項4記載の照明装置。
    The protrusion dimension of the protrusion from the heat conduction surface is smaller than the total dimension of the depth dimension of the recess from the contact surface and the protrusion dimension of the heat conduction sheet from the contact surface. Item 5. The lighting device according to Item 4.
  6.  前記ソケットは、前記熱伝導面に対して垂直に移動可能とし、前記口金が装着されることによって前記熱伝導面から離反移動するとともに前記接触面を前記熱伝導面に押し付ける押付構造を有し、
     前記熱伝導面からの前記突起の突出寸法は、前記ソケットの移動寸法と前記接触面からの前記熱伝導シートの突出寸法とを合わせた寸法より大きい
     ことを特徴とする請求項5記載の照明装置。
    The socket has a pressing structure that is movable vertically to the heat conduction surface, moves away from the heat conduction surface when the base is attached, and presses the contact surface against the heat conduction surface,
    The lighting device according to claim 5, wherein a protrusion dimension of the protrusion from the heat conduction surface is larger than a dimension obtained by combining a movement dimension of the socket and a protrusion dimension of the heat conduction sheet from the contact surface. .
  7.  前記口金は、環状の口金面、この口金面の内側から突出する突出部を有し、この突出部の先端に前記接触面が設けられ、
     前記ソケットは、前記突出部が挿入される開口部、および前記口金面が対向する環状のソケット面が設けられたソケット本体を有し、前記開口部の奥側に前記熱伝導面が配置されており、
     前記熱伝導面からの前記突起の突出寸法は、前記熱伝導面から前記ソケット面までの寸法より小さい
     ことを特徴とする請求項1ないし6いずれか一記載の照明装置。
    The base has an annular base surface, and a projecting portion that projects from the inside of the base surface, and the contact surface is provided at the tip of the projecting portion,
    The socket has a socket body provided with an opening into which the protruding portion is inserted, and an annular socket surface facing the base surface, and the heat conducting surface is disposed on the back side of the opening. And
    The lighting device according to any one of claims 1 to 6, wherein a protrusion dimension of the protrusion from the heat conduction surface is smaller than a dimension from the heat conduction surface to the socket surface.
PCT/JP2011/062060 2011-05-26 2011-05-26 Illuminating apparatus WO2012160688A1 (en)

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JP2020102467A (en) * 2020-04-02 2020-07-02 三菱電機株式会社 Lighting device
JP7065902B2 (en) 2020-04-02 2022-05-12 三菱電機株式会社 Lighting equipment

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