JP2010129488A - Lamp device, and illumination fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamp device capable of improving heat dissipation characteristics, and to provide an illumination fixture using this lamp device. <P>SOLUTION: An LED module substrate 48 is airtightly connected and mounted on a metal light source mounting face 36 of the lamp device body 31. This is connected to the base part 35 side from the light source mounting face 36 side with a screw 42 to be heat-conductive. Heat generated by the LED 32 is efficiently heat-conducted to the light source mounting face 36, and thermally conducted also to the base part 35 from the light source mounting face 36. Heat conducted to the base part 35 is conducted to the fixture body 12, and heat is efficiently dissipated. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a lamp device that is flat and has a cap portion provided on one surface side thereof, and a light source disposed on the other surface side, and a lighting apparatus using the lamp device.

  Conventionally, there is a lamp device using a base part of a GX53 type standardized by IEC (International Electrotechnical Commission). This lamp device is flat and has a base part of GX53 type on the upper surface side thereof, a light source mounting surface part on which a flat fluorescent lamp is arranged as a light source on the lower surface side, and a fluorescent lamp inside the base part. A lighting circuit for lighting is housed, and is configured in a thin shape with a small dimension in the height direction formed by the upper surface side and the lower surface side.

  A pair of lamp pins having a large-diameter portion at the tip is projected from the upper surface of the base portion with the height direction of the lamp device as the axial direction. Then, the lamp pin of the lamp device is inserted into the socket portion of the socket device from below, the lamp device is rotated and the lamp pin is hooked on the socket portion, thereby holding the lamp device on the socket device and receiving the socket portion on the lamp pin. Power is supplied to the lamp pins by contact with gold.

In order to protect the lighting circuit from the influence of heat generated by the lighting of the fluorescent lamp, a part of the base part that accommodates the lighting circuit is made of a metal heat sink or the whole base part is made of metal (for example, patents) Reference 1).
Japanese Patent Laying-Open No. 2007-287684 (pages 4-5 and 7, FIGS. 3 and 12)

  Since the light source generates heat when the lamp device is turned on, heat dissipation is necessary. In particular, when an LED is used as a light source, if sufficient heat dissipation is not performed, the temperature of the LED itself becomes high, causing the LED to be thermally deteriorated, resulting in a short life, and in some cases, the luminous efficiency is lowered. Heat dissipation is required.

  In the conventional lamp device, a part of the base part is made of a metal heat sink or the whole part of the base part is made of metal for the purpose of protecting the lighting circuit from the influence of heat generated by lighting of the fluorescent lamp. However, there is a problem that heat conduction is not actively performed from the light source mounting surface side to the base side, and sufficient heat dissipation cannot be obtained when an LED is used as the light source.

  This invention is made | formed in view of such a point, and it aims at providing the lamp device which can improve heat dissipation, and the lighting fixture using this lamp device.

  The lamp device according to claim 1 is flat and has a base portion provided on one surface side thereof and a light source mounting surface provided on the other surface side, and is thermally conductively connected from the light source mounting surface side to the base portion side. A metal lamp device main body connected to be thermally conductive by means; an LED module board on which an LED is mounted and attached in close contact with a light source mounting surface of the lamp device main body; a lighting circuit for lighting the LED; It is equipped with.

  In the lamp device main body, the base part side and the light source mounting surface side may be separate or integrated. If they are separate bodies, they are brought into close contact with each other by heat conduction connecting means such as screwing or screwing together, and connected from the light source mounting surface side to the base part side so as to allow heat conduction. If a monolithic structure is used as the heat conduction connecting means, a state is established in which heat conduction is possible from the light source mounting surface side to the base part side. A glove that covers the LED module substrate may be attached to the other surface side of the lamp device body.

  For the base part, for example, a base structure such as GX53 type is used.

  The lighting circuit may be housed in the lamp device main body or may be disposed together with the LED on the other surface side of the lamp device main body.

  For example, the LED module substrate has a wiring pattern formed on a metal substrate via an insulating layer, the LED is connected to the wiring pattern, and is attached so as to be in close contact with the light source mounting surface of the lamp device main body by screws or the like. .

  The lighting fixture according to claim 2; a fixture main body; a socket device that is attached to the fixture main body, holds the base of the lamp device, and supplies power; and is detachably attached to the socket device, and the fixture main body in the mounted state The lamp device main body is in contact with the lamp device main body so as to be capable of conducting heat.

  The instrument body is made of, for example, metal, and may be integrated with or separate from the reflector. The place where the fixture main body comes into contact with the lamp device main body so as to be capable of conducting heat may be any of the peripheral surface of the base part, the end face of the base part, and the like.

  According to the lamp device of claim 1, the LED module substrate is attached in close contact with the light source mounting surface of the metal lamp device body, and the heat conduction connecting means is capable of conducting heat from the light source mounting surface side to the base portion side. Therefore, the heat generated by the LED can be efficiently conducted from the light source mounting surface to the base portion side, and the heat dissipation can be improved.

  According to the lighting fixture of the second aspect, since the lamp device main body mounted on the socket device comes into contact with the fixture main body so as to be able to conduct heat, heat can be efficiently conducted from the lamp device main body to the fixture main body, and heat dissipation can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 show a first embodiment, in which FIG. 1 is a sectional view of a lighting fixture, and FIG. 2 is a perspective view of an exploded state of a socket device and a lamp device of the lighting fixture.

  The lighting fixture 11 is, for example, a downlight, and includes a fixture main body 12, a socket device 13 attached to the fixture main body 12, and a lamp device 14 that can be attached to and detached from the socket device 13. Hereinafter, the directional relationship such as the vertical direction will be described with the base side as the upper side and the light source side as the lower side, based on the state in which the lamp device 14 is mounted horizontally.

  The instrument body 12 is made of metal and has a reflector integrally formed, and includes a circular flat plate portion 17 and a reflective plate portion 18 that is bent downward from the periphery of the flat plate portion 17 in a curved shape. Yes. The diameter of the reflecting plate portion 18 is increased toward the lower side.

  The socket device 13 has a cylindrical socket device body 21 made of a synthetic resin having insulation properties, and a fitting hole 22 is formed through the center of the socket device body 21 in the vertical direction.

  A pair of socket portions 24 are formed on the lower surface of the socket device body 21. These socket portions 24 are formed with connection holes 25, and a receiving member (not shown) for supplying power to the inside of the connection holes 25 is disposed. The connection hole 25 is an arcuate groove portion that is rotationally symmetric with respect to the center of the socket device main body 21, and an enlarged diameter portion 26 is formed at one end of the arcuate groove portion.

  The lamp device 14 has a flat lamp device main body 31, a plurality of LEDs 32 as light sources arranged on the lower surface side of the lamp device main body 31, a globe 33 covering the LEDs 32, and a lighting circuit 34 for lighting the LEDs 32. However, it is formed in a thin shape with a small dimension in the height direction.

  A base portion 35 of the GX53 type is formed on the upper surface side, which is one surface side of the lamp device main body 31, and a planar light source mounting surface 36 for attaching the LED 32 is formed on the lower surface side, which is the other surface side. An accommodating portion 37 that accommodates the circuit 34 is formed.

  The lamp device main body 31 is entirely formed of a metal such as aluminum having excellent heat dissipation, and is made of, for example, aluminum die casting, and includes a base-side metal component 38 and a light source mounting surface 36 constituting the base portion 35. The light source side metal component 39 is formed separately. The base metal part 38 is formed in a disk shape opened downward, and a contact surface 41 with which the light source side metal part 39 contacts is formed on the end face of the annular outer peripheral part 40. The light source side metal part 39 is formed in a flat disk shape capable of closing the lower surface opening of the base side metal part 38, and the peripheral part of the upper surface can contact the contact surface of the base side metal part 38. The light source side metal part 39 is fastened and fixed to the base metal part 38 by a plurality of screws 42 as heat conduction connecting means, and is closely connected to the base side metal part 38 from the light source side metal part 39 so as to be capable of conducting heat. .

  An annular contact surface 43 that contacts the lower surface of the socket device 13 is formed in the base portion 35, and a cylindrical protrusion that can be fitted into the fitting hole 22 of the socket device 13 from the center of the contact surface 43. The part 44 is protruded.

  On the contact surface 43, a pair of conductive metal lamp pins 45 protrudes through an insulating material 46. A large-diameter portion 47 is formed at the tip of these lamp pins 45. The large diameter portion 47 of each lamp pin 45 is inserted from the enlarged diameter portion 26 of each connection hole 25 of the socket device 13, and the lamp pin 45 is moved to the connection hole 25 by the rotation of the lamp device 14, whereby the lamp pin 45 is The lamp device 14 is configured to be held in the socket device 13 by being brought into electrical contact with the receiver and the large-diameter portion 47 being caught by the edge of the connection hole 25.

  The plurality of LEDs 32 are mounted on the LED module substrate 48, and the upper surface of the LED module substrate 48 is attached in close contact with the light source attachment surface 36 of the lamp device main body 31. In the LED module substrate 48, a wiring pattern is formed on the lower surface of a metal substrate via an insulating layer, and a plurality of LEDs 32 are connected to the wiring pattern. The LED module substrate 48 is attached by screws or the like so that the upper surface of the LED module substrate 48 is in close contact with the light source attachment surface 36 of the lamp device main body 31.

  The globe 33 is made of transparent glass or light diffusing glass or synthetic resin having translucency.

  The lighting circuit 34 includes a circuit board 49 and a lighting circuit component 50 mounted on the circuit board 49. The lamp pin 45 is electrically connected to the input portion of the circuit board 49 with a lead wire 51. The LED module substrate 48 is electrically connected to the output portion by a lead wire or the like. The circuit board 49 is accommodated in the accommodating portion 37 of the lamp device main body 31 with an insulating material (not shown) interposed therebetween.

  In order to attach the lamp device 14 to the socket device 13, the lamp device 14 is raised so that each lamp pin 45 of the lamp device 14 is inserted in accordance with the enlarged diameter portion 26 of each connection hole 25 of the socket device body 21. After that, by rotating the lamp device 14 in the mounting direction and moving each lamp pin 45 to each connection hole 25, each lamp pin 45 is electrically in contact with the socket device 13 and each lamp pin 45 The large-diameter portion 47 of 45 is caught on the edge of the connection hole 25, and the lamp device 14 can be attached to the socket device 13.

  In a state in which the lamp device 14 is mounted on the socket device 13, the outer peripheral portion 40 of the lamp device main body 31 is in contact with the reflector 18 of the fixture main body 12 so that heat conduction is possible, and the upper surface of the protruding portion 44 of the lamp device main body 31 is the fixture. It contacts the flat plate portion 17 of the main body 12 so as to be able to conduct heat.

  A plurality of slits that divide the reflector plate 18 in the circumferential direction are provided in the reflector plate 18 so that the small pieces of the divided reflector plate 18 have elasticity, so that the outer periphery of the lamp device main body 31 is provided. You may comprise so that 38 and the reflecting plate part 18 may be stuck. Further, a metal spring member that is in close contact with the outer peripheral portion 38 of the lamp device main body 31 may be separately received and thermally conducted.

  Further, when the LED 32 of the lamp device 14 is turned on, the heat generated from the LED 32 is efficiently radiated. That is, the LED module substrate 48 is attached in close contact with the light source attachment surface 36 of the metal lamp device main body 31, and the screw 42, which is a heat conduction connection means, is capable of conducting heat from the light source attachment surface 36 side to the base portion 35 side. Therefore, the heat generated by the LED 32 can be efficiently conducted to the light source mounting surface 36 and also efficiently conducted from the light source mounting surface 36 side to the base portion 35 side. The heat conducted to the base part 35 is conducted to the instrument body 12 with which the base part 35 comes into contact, and can be radiated efficiently.

  Therefore, the temperature rise of the LED 32 of the lamp device 14 can be suppressed, and the light emission efficiency of the LED 32 can be maintained in a high state.

  Next, FIG. 3 shows a second embodiment, and FIG. 3 is a sectional view of the lighting fixture.

  The threaded portion 54 is used as a heat conduction connecting means for connecting the lamp device body 31 from the light source mounting surface 36 side to the base portion 35 side so as to allow heat conduction. That is, the screw part 55 is formed on the outer peripheral part 40 of the base metal part 38, and the screw part 56 that is screwed to the screw part 55 of the base metal part 38 is formed on the peripheral part of the light source side metal part 39.

  Thus, even when a screwed structure is used as the heat conduction connecting means, heat conduction can be efficiently performed from the light source mounting surface 36 side to the base part 35 side.

  The lamp device main body 31 may be divided vertically by a dividing line in the height direction passing through the center, and these may be coupled by screwing or the like. In this case, the light source attachment surface 36 side and the base part 35 side are integrated as heat conduction connection means, and heat can be efficiently conducted from the light source attachment surface 36 side to the base part 35 side.

  Next, FIG. 4 and FIG. 5 show a third embodiment, FIG. 4 is a side view of the lamp device, and FIG. 5 is a sectional view of the lighting fixture.

  A flat light source mounting surface 36 to which the LED module substrate 48 is mounted so as to be capable of conducting heat is formed on the lower surface of the base portion 35 of the lamp device main body 31, and the lighting circuit 34 is accommodated inside the protruding portion 44 of the base portion 35. A portion 37 is formed. The lamp pin 45 and the lighting circuit 34 may be connected by forming a groove in the light source mounting surface 36 and arranging a lead wire for connecting the lamp pin 45 and the lighting circuit 34 in the groove. A part or all of the projecting portion 44 of the lamp device main body 31 is divided and formed so that the lighting circuit 34 can be accommodated in the accommodating portion 37.

  Further, by attaching the lamp device 14 to the socket device 13, the contact surface 43 of the cap portion 35 of the lamp device 14 is configured to be in close contact with the instrument body 12 so as to be capable of conducting heat. In this case, an opening is formed in the fixture main body 12 corresponding to the position of the lamp pin 45 of the lamp device 14, and the socket device 13 is arranged facing the opening, so that the lamp pin 45 does not contact the fixture main body 12. The socket device 13 can be mounted.

  Since the light source attachment surface 36 side and the base part 35 side are integrated as heat conduction connection means, heat can be efficiently conducted from the light source attachment surface 36 side to the base part 35 side.

  The heat conducted to the base part 35 is efficiently conducted to the instrument main body 12 with which the contact surface 43 of the base part 35 contacts, and can be radiated efficiently.

  The lighting circuit 34 may be disposed together with the LED 32 on the lower surface side of the lamp device body 31. In this case, the lamp device main body 31 does not need to be provided with the accommodating portion 37 for accommodating the lighting circuit 34 or is formed separately, and the lamp device main body 31 can be simplified.

It is sectional drawing of the lighting fixture which shows the 1st Embodiment of this invention. It is a perspective view of the decomposition | disassembly state of the socket apparatus and lamp device of a lighting fixture same as the above. It is sectional drawing of the lighting fixture which shows the 2nd Embodiment of this invention. It is a side view of the lamp device which shows the 3rd Embodiment of this invention. It is sectional drawing of a lighting fixture same as the above.

Explanation of symbols

11 Lighting equipment
12 Instrument body
13 Socket device
14 Lamp device
31 Lamp unit
32 LED
34 Lighting circuit
35 Base part
36 Light source mounting surface
42 Screws as a means of heat conduction connection
48 LED module board
54 Threaded part as heat conduction connection means

Claims (2)

It is flat and has a base part provided on one surface side thereof and a light source mounting surface provided on the other side, and is connected to the base part side from the light source mounting surface side so as to be capable of conducting heat by means of heat conduction connecting means. A metal lamp device body;
An LED module board on which an LED is mounted and attached in close contact with the light source mounting surface of the lamp device body;
A lighting circuit for lighting the LED;
A lamp device comprising: An instrument body;
A socket device that is attached to the fixture body and holds the base of the lamp device and supplies power;
The lamp device according to claim 1, wherein the lamp device main body is detachably mounted on the socket device, and the lamp device main body contacts the fixture main body so as to conduct heat in the mounted state;
The lighting fixture characterized by comprising.

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