JP5552563B1 - LED lighting device - Google Patents
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Abstract
【課題】天井面等の被取付部にあらたに穴あけ等の施工を加えることなく簡単な作業でLED照明装置を取り付けることができ、またLED等の発熱を効率的に放熱することができ、さらには部品点数を削減し、構成が簡単で安価に製造することができるLED照明装置を提供する。
【解決手段】LEDランプ本体1と、外部電源電線の挿通孔を有し前記LEDランプ本体を被取付部に取り付けるための取付板2とを備えている。LEDランプ本体1は、筐体10内に、LED照射方向から見て、透光性カバー20と、LED素子を実装したLEDユニット基板30と、絶縁カバー40と、放熱性の基板支持部材50とが順次配置されており、基板支持部材50の取付板2側に端子台60を装着されている。端子台60の外部電源電線との接続口は、取付板2の外部電源電線挿通孔を向いている。
【選択図】図1An LED lighting device can be attached by a simple operation without adding a hole or the like to a mounting portion such as a ceiling surface, and heat generated from an LED or the like can be efficiently radiated. Provides an LED lighting device with a reduced number of parts, a simple configuration and which can be manufactured at low cost.
An LED lamp main body 1 and an attachment plate 2 having an insertion hole for an external power supply wire and attaching the LED lamp main body to an attachment portion are provided. The LED lamp main body 1 includes a translucent cover 20, an LED unit substrate 30 on which LED elements are mounted, an insulating cover 40, and a heat radiating substrate support member 50 in the housing 10 when viewed from the LED irradiation direction. Are arranged in sequence, and a terminal block 60 is mounted on the mounting plate 2 side of the substrate support member 50. The connection port of the terminal block 60 with the external power supply wire faces the external power supply wire insertion hole of the mounting plate 2.
[Selection] Figure 1
Description
本発明は、LED素子を光源に使用したLED照明装置に関し、天井や壁面等の被取付部に直接取り付ける天井直付け型のLED照明装置に関するものである。 The present invention relates to an LED lighting device using an LED element as a light source, and relates to a ceiling-mounted LED lighting device that is directly attached to a mounted portion such as a ceiling or a wall surface.
近年、環境意識の高まりから、省電力化に優れたLED素子を光源に使用した、電源内蔵型の電球型LEDランプが普及してきた。更に最近は、天井埋め込み型のダウンライトや、天井直付け型のシーリングライトにおいても、LED素子を使用した照明装置が開発され、市場に導入されてきている。 2. Description of the Related Art In recent years, due to an increase in environmental awareness, a self-powered light bulb type LED lamp using an LED element excellent in power saving as a light source has been widespread. More recently, lighting devices using LED elements have also been developed and introduced into the market for ceiling-mounted downlights and ceiling-mounted ceiling lights.
たとえば特許文献1にはLEDモジュールの収納ケースを直接天井にネジ止めで装着するLED照明装置が開示されている。また、特許文献2には天井材に埋め込まれた器具本体にLEDユニットのベースをネジで装着する照明器具や、天井材に吊り具を装着して照明器具を吊るす形態が開示されている。 For example, Patent Literature 1 discloses an LED lighting device in which a storage case for an LED module is directly attached to a ceiling with screws. Patent Document 2 discloses a lighting fixture in which the base of the LED unit is attached to the fixture main body embedded in the ceiling material with a screw, and a form in which the lighting fixture is hung by attaching a hanging tool to the ceiling material.
しかしながら、特許文献1では、LEDモジュールの収納ケースの上面部が天井面と接しているため、LEDモジュールの発熱を効率的に放熱することができないという問題があり、また、LED基板とLED電力供給基板が独立して配置されているため部品点数が多くなり組立作業も複雑になる等の問題がある。同じく特許文献2でも、ベース、ホルダー、内カバー等の部品点数が多くなるため組立作業も面倒で、コストも高くなるという問題がある。しかも特許文献2では、給電線及びそのコネクタがLEDユニット本体の横方向に延びており、外部から見える位置にあるため体裁が悪いという問題や、天井面に器具本体を埋め込むために大きな穴を開けなければならず、その施工作業や器具本体への照明器具の取り付け作業が面倒であるという問題や、天井材に照明器具を吊り具で吊るす形式では、照明器具が不安定であるばかりでなく、吊り具の取り付け作業や、天井材から引き出された外部電源電線と照明器具との結線作業が面倒である等の問題がある。 However, in patent document 1, since the upper surface portion of the storage case of the LED module is in contact with the ceiling surface, there is a problem in that the heat generated by the LED module cannot be efficiently radiated. Since the boards are arranged independently, there are problems such as an increase in the number of parts and a complicated assembly operation. Similarly, Patent Document 2 has a problem that the number of parts such as a base, a holder, and an inner cover is increased, so that the assembling work is troublesome and the cost is increased. Moreover, in Patent Document 2, the power supply line and its connector extend in the lateral direction of the LED unit main body, and are in a position that can be seen from the outside, so that the appearance is bad, and a large hole is formed in order to embed the instrument main body on the ceiling surface. The problem that the construction work and the installation work of the lighting equipment to the equipment body is troublesome, and in the form of hanging the lighting equipment on the ceiling material with the hanging equipment, the lighting equipment is not only unstable, There are problems such as troublesome attachment work of the hanging tool and connection work between the external power supply wire drawn from the ceiling material and the lighting fixture.
本発明は、以上のような課題を解決するため提案されたものであり、天井面等の被取付部にあらたに穴あけ等の施工を加えることなく簡単な作業でLED照明装置を取り付けることができ、またLED等の発熱を効率的に放熱することができ、しかも外観上の体裁も良いLED照明装置を提供するものである。また本発明は、部品点数を削減し、構成が簡単で安価に製造することができるLED照明装置を提供するものである。 The present invention has been proposed in order to solve the above-described problems, and the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface. In addition, the present invention provides an LED lighting device that can efficiently dissipate heat generated by LEDs and the like, and also has a good appearance. The present invention also provides an LED lighting device that has a reduced number of parts, a simple configuration, and can be manufactured at low cost.
上記課題を解決するため、請求項1に係る発明にあっては、LEDランプ本体と、外部電源電線の挿通孔を有し前記LEDランプ本体を被取付部に取り付けるための取付板と、を備え、
前記LEDランプ本体は、筐体内に、LED素子及び該LED素子を点灯駆動する点灯回路の電子部品を実装する基板と、前記基板を支持する放熱性の基板支持部材と、前記基板と前記基板支持部材の間に配置される絶縁カバーと、を有しており、
前記点灯回路の電子部品を実装した基板部分は前記基板支持部材と前記絶縁カバーから離れるように配置され、
前記基板支持部材の前記取付板側に、前記取付板の挿通孔を通した外部電源電線を接続する端子台が装着されており、
前記取付板は、前記被取付部に直接取り付けられるとともに、前記基板支持部材が前記取付板に空間を開けて取り付けられることを特徴とする。
To solve the above problems, in the invention according to claim 1, comprising a LED lamp body, and a mounting plate for mounting the LED lamp body has an insertion hole of the external power source wire to the attached portion ,
The LED lamp main body includes a substrate on which an LED element and an electronic component of a lighting circuit that drives the LED element are mounted, a heat dissipation substrate support member that supports the substrate, and the substrate and the substrate support. An insulating cover disposed between the members,
The board portion on which the electronic components of the lighting circuit are mounted is arranged so as to be separated from the board support member and the insulating cover,
A terminal block for connecting an external power supply wire through an insertion hole of the mounting plate is mounted on the mounting plate side of the substrate support member,
The attachment plate is directly attached to the attached portion, and the substrate support member is attached to the attachment plate with a space therebetween .
また請求項2に係る発明にあっては、前記基板と前記絶縁カバーには、それぞれ対応した位置に、中央部より外側に張り出した張り出し部と、該張り出し部が形成されていない部分とを有しており、該張り出し部が形成されていない部分が、前記基板支持部材を前記取付板に装着するときの装着逃げ部となっており、
前記基板支持部材に有する前記取付板との装着面部に前記各装着逃げ部が位置するように前記基板と前記絶縁カバーとを前記基板支持部材に固定したことを特徴とする。
In the invention according to claim 2 , the substrate and the insulating cover each have a projecting portion projecting outward from the center portion and a portion where the projecting portion is not formed at the corresponding positions. The portion where the projecting portion is not formed is a mounting escape portion when mounting the substrate support member to the mounting plate,
The substrate and the insulating cover are fixed to the substrate support member so that the mounting relief portions are positioned on mounting surface portions of the substrate support member and the mounting plate.
また請求項3に係る発明にあっては、前記基板は、前記中央部に前記LED素子を配置するとともに、前記張り出し部に前記電子部品を配置したことを特徴とする。 Also In the invention according to claim 3, wherein the substrate is adapted to place the LED elements to the central unit, characterized in that a said electronic component on said projecting portion.
また請求項4に係る発明にあっては、前記絶縁カバーと前記基板支持部材とに、前記基板に実装された前記電子部品を収容する凹部を形成したことを特徴とする。 Also In the invention according to claim 4, wherein the insulating cover and said substrate support member, characterized in that a recess for accommodating the electronic component mounted on the substrate.
また請求項5に係る発明にあっては、前記筐体のLED照射方向の面部に、前記筐体の裏面側に配置した透光性カバーが露出する開口部を形成するとともに、前記筐体の周縁部に外側に傾斜した傾斜面部を形成したことを特徴とする。 Moreover, in the invention which concerns on Claim 5, while forming the opening part which the translucent cover arrange | positioned on the back surface side of the said housing | casing exposes in the surface part of the LED irradiation direction of the said housing | casing, An inclined surface portion inclined outward is formed at the peripheral edge portion.
また請求項6に係る発明にあっては、LEDランプ本体と、外部電源電線の挿通孔を有し前記LEDランプ本体を被取付部に取り付けるための取付板と、を備え、
前記LEDランプ本体は、筐体内に、LED素子と該LED素子を点灯駆動する点灯回路の電子部品とを同一面に実装する基板と、前記基板を支持する放熱性の基板支持部材と、前記基板と前記基板支持部材の間に配置される絶縁カバーと、前記基板に実装された電子部品を遮蔽する電源部遮蔽部材と、を有しており、
前記点灯回路の電子部品を実装した基板部分は前記基板支持部材と前記絶縁カバーから離れるように配置され、
前記基板支持部材の端部に切込口部を形成し、該切込口部に前記取付板の挿通孔を通した外部電源電線を接続する端子台が装着されており、
前記取付板は、前記被取付部に直接取り付けられるとともに、前記基板支持部材が前記取付板に空間を開けて取り付けられることを特徴とする。
The invention according to claim 6 includes an LED lamp main body, and an attachment plate for attaching the LED lamp main body to the attached portion, having an insertion hole for an external power supply wire,
The LED lamp main body includes, in a housing, a substrate on which an LED element and an electronic component of a lighting circuit that drives the LED element are mounted on the same surface, a heat-radiating substrate support member that supports the substrate, and the substrate And an insulating cover disposed between the board support member and a power supply shielding member that shields electronic components mounted on the board,
The board portion on which the electronic components of the lighting circuit are mounted is arranged so as to be separated from the board support member and the insulating cover,
Forming a notch at the end of the substrate support member, and a terminal block for connecting an external power supply wire through the insertion hole of the mounting plate is attached to the notch ;
The attachment plate is directly attached to the attached portion, and the substrate support member is attached to the attachment plate with a space therebetween .
また請求項7に係る発明にあっては、前記切込口部には、前記基板支持部材の端部を切り欠いて起立させた起立片が形成されており、該起立片に前記端子台を装着したことを特徴とする。 In the invention according to claim 7, an upright piece is formed at the cut-out opening portion by notching an end portion of the substrate support member, and the terminal block is provided on the upright piece. It is characterized by wearing.
また請求項8に係る発明にあっては、前記端子台に設けた係止突起を前記起立片に形成した係入孔に係入することにより、前記端子台を前記起立片に止着したことを特徴とする。 In the invention according to claim 8, the terminal block is fixed to the standing piece by engaging the engaging protrusion provided on the terminal block into the engaging hole formed in the standing piece. It is characterized by.
また請求項9に係る発明にあっては、前記基板支持部材に前記取付板との装着面部を設け、該装着面部の端部に前記切込口部を形成したことを特徴とする。 The invention according to claim 9 is characterized in that a mounting surface portion with the mounting plate is provided on the substrate support member, and the notch portion is formed at an end of the mounting surface portion.
また請求項10に係る発明にあっては、前記電源部遮蔽部材の中央部に、前記基板の中央部に実装されたLED素子が露出する開口部を形成し、該開口部に向かってすり鉢形状の傾斜面を形成し、該傾斜面を光反射面としたことを特徴とする。 Moreover, in the invention which concerns on Claim 10, the opening part which the LED element mounted in the center part of the said board | substrate is exposed in the center part of the said power supply part shielding member is formed, and a mortar shape toward this opening part The inclined surface is formed, and the inclined surface is used as a light reflecting surface.
また請求項11に係る発明にあっては、前記基板と、前記絶縁カバーと、前記基板支持部材とを合わせて固着し、前記電源遮蔽部材を前記基板支持部材に係止することを特徴とする。 The invention according to claim 11 is characterized in that the substrate, the insulating cover, and the substrate support member are fixed together, and the power shielding member is locked to the substrate support member. .
上述した請求項1〜請求項11に係る発明によれば、天井面等の被取付部にあらたに穴あけ等の施工を加えることなく簡単な作業でLED照明装置を取り付けることができ、またLED等の発熱を効率的に放熱することができ、しかも外観上の体裁も良いLED照明装置を提供することができる。また、部品点数を削減し、構成が簡単で安価に製造することができるLED照明装置を提供することができる。 According to the above-described inventions according to claims 1 to 11 , the LED lighting device can be attached by a simple operation without adding a hole or the like to the attached portion such as the ceiling surface, and the LED or the like. Thus, it is possible to provide an LED lighting device that can efficiently dissipate the heat generated and has a good appearance. Moreover, the number of parts can be reduced, and the LED illuminating device which can be manufactured at low cost can be provided.
以下に本発明の好適な実施の形態について、図面を参照しながら説明する。なお本実施形態は一例であり、これに限定されるものではない。 Preferred embodiments of the present invention will be described below with reference to the drawings. This embodiment is an example, and the present invention is not limited to this.
(第1の実施形態)
本発明のLED照明装置は、図1に示すように、LEDランプ本体1と取付板2からなっている。LEDランプ本体1は、LED照射方向から見て、筐体10と、この中に収納される透光性カバー20と、LEDユニット基板30と、絶縁カバー40と、基板支持部材50と、端子台(電源端子台)60とから概略構成されている。
(First embodiment)
As shown in FIG. 1, the LED lighting device of the present invention includes an LED lamp body 1 and a mounting plate 2. The LED lamp body 1 includes a housing 10, a translucent cover 20 accommodated in the housing 10, an LED unit substrate 30, an insulating cover 40, a substrate support member 50, and a terminal block as viewed from the LED irradiation direction. (Power supply terminal block) 60 and a schematic configuration.
前記筐体10は、図2に示すように下面部が開口し、上面部(照射方向)に透光性カバー20の露出孔10aが開口した偏平の略筒形状であり、ポリカーボネート樹脂等の合成樹脂で造られている。筐体10の上面周面部10bは露出孔10a側に傾斜するような傾斜面となっており、照射光が拡光するようになっている。また上端縁部10cは外側に傾斜した傾斜面となっており(図11)、その上端縁部10cからも反射光を照射させている。筒体10は、ここでは円筒体になっているが、楕円筒体、角筒体等、その形状は任意である。 As shown in FIG. 2, the casing 10 has a flat and substantially cylindrical shape with an open bottom surface and an exposed hole 10a of the translucent cover 20 on the top surface (irradiation direction). Made of resin. The upper surface peripheral surface portion 10b of the housing 10 has an inclined surface that inclines toward the exposure hole 10a, so that the irradiation light is expanded. The upper edge 10c is an inclined surface that is inclined outward (FIG. 11), and the reflected light is also emitted from the upper edge 10c. The cylindrical body 10 is a cylindrical body here, but the shape thereof is arbitrary, such as an elliptical cylindrical body or a rectangular cylindrical body.
前記透光性カバー20は、図3に示すように、全体が略蝶形の上面有底筒体であり、中央円盤部20aと、その両側部に張り出した円弧枠部(張り出し部)20b、20cが一体成形されており、円弧枠部20b,20cが形成されていない部分に装着逃げ部20d,20eが形成されている。中央円盤部20aと円弧枠部20b,20cは同心円の湾曲体である。ここでは、一方の円弧枠部20cが他方の円弧枠部20bよりも長い円弧長となっている。透光性カバー20はポリカーボネート樹脂に光拡散剤等を添加して透明又は乳白色となっている。 As shown in FIG. 3, the translucent cover 20 is a generally bottomed cylindrical body having a generally butterfly shape, and includes a central disk portion 20 a and arc frame portions (projecting portions) 20 b projecting on both sides thereof. 20c is integrally formed, and mounting relief portions 20d and 20e are formed in portions where the arc frame portions 20b and 20c are not formed. The central disk portion 20a and the arc frame portions 20b and 20c are concentric curved bodies. Here, one arc frame portion 20c has a longer arc length than the other arc frame portion 20b. The translucent cover 20 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin.
中央円盤部20aの装着逃げ部20d側における円弧枠部20bの端面部近くには、電源電線を係止する係止舌片20gが外側に突設されている。この係止舌片20gには係止孔20fが開口され、その一部に切欠部20hが形成されている。この係止舌片20gが設けられた近くの円弧枠部20bの端面部には、電源電線の挿通孔20jが開口されている。また、円弧枠部20b,20cの周方向端部には、後述する基板支持部材50に設けられた止めネジ50gが螺入されるネジ止着部20iが形成されている。ネジ止着部20iの裏面側には、図示しないが、ネジ穴が形成されている。ネジ止着部20iは、ここでは4箇所に設けられているが、これに限定されるものではない。 A locking tongue piece 20g for locking the power supply electric wire is provided on the outer side near the end face of the arc frame portion 20b on the mounting escape portion 20d side of the central disk portion 20a. A locking hole 20f is opened in the locking tongue piece 20g, and a notch 20h is formed in a part thereof. An insertion hole 20j for a power supply electric wire is opened in the end surface portion of the arcuate frame portion 20b near where the locking tongue piece 20g is provided. Further, screw fastening portions 20i into which set screws 50g provided on a substrate support member 50 described later are screwed are formed at the circumferential ends of the arc frame portions 20b and 20c. Although not shown, a screw hole is formed on the back surface side of the screw fixing portion 20i. Here, the screw fixing portions 20i are provided at four locations, but the present invention is not limited to this.
前記LEDユニット基板30は、図4に示すように、略蝶形の基板であり、中央円板部30aと、その両側部に張り出した円弧面部(張り出し面部)30b,30cが一体成形されている。中央円板部30aと円弧面部30b,30cは同心円の湾曲体である。ここでは、一方の円弧面部30cが他方の円弧面部30bよりも長い円弧長となっている。また、中央円板部30aと円弧面部30b,30cの間であって、円弧面部30b,30cが形成されていない部分は、装着逃げ部30d,30eが形成されている。このLEDユニット基板30の中央円板部30aの下面部(照射面側)には、図8に示すように複数のLED素子30fがサークル状に実装され、円弧面部30b,30cにはLED素子30fを点灯駆動する点灯回路の電子部品(図示せず)が実装されている。この電子面部品は、円弧面部30b,30cにおけるLED素子30fと同一平面部に配置してもよく、その裏面部に配置してもよい。 As shown in FIG. 4, the LED unit substrate 30 is a substantially butterfly-shaped substrate, and a central disk portion 30a and arc surface portions (projecting surface portions) 30b and 30c projecting on both sides thereof are integrally formed. . The central disk portion 30a and the arcuate surface portions 30b and 30c are concentric curved bodies. Here, one arcuate surface portion 30c has a longer arc length than the other arcuate surface portion 30b. In addition, mounting escape portions 30d and 30e are formed in a portion between the central disc portion 30a and the arc surface portions 30b and 30c where the arc surface portions 30b and 30c are not formed. As shown in FIG. 8, a plurality of LED elements 30f are mounted in a circle on the lower surface (irradiation surface side) of the central disk portion 30a of the LED unit substrate 30, and the LED elements 30f are mounted on the arcuate surfaces 30b and 30c. An electronic component (not shown) of a lighting circuit for driving and lighting is mounted. This electronic surface component may be disposed on the same plane portion as the LED element 30f in the circular arc surface portions 30b and 30c, or may be disposed on the back surface portion thereof.
ここでは、LEDユニット基板30の中央円板部30aにLED素子30fを配置し、円弧面部30b,30cに電子部品を配置しているが、必要であれば、中央円板部30aに電子部品を配置し、円弧面部30b,30cにLED素子を配置してもよい。この場合は、これに対応して筐体10、透光性カバー20、LEDユニット基板30、絶縁カバー40、基板支持部材50の形状が変更される。 Here, the LED element 30f is disposed on the central disk portion 30a of the LED unit substrate 30 and the electronic components are disposed on the arcuate surface portions 30b and 30c. However, if necessary, the electronic component is disposed on the central disk portion 30a. The LED elements may be arranged on the arcuate surface portions 30b and 30c. In this case, the shapes of the housing 10, the translucent cover 20, the LED unit substrate 30, the insulating cover 40, and the substrate support member 50 are changed correspondingly.
前記電子部品は、過電流保護、ノイズカット、整流、平滑、調光制御などを行うための各種ダイオード、コンデンサー、IC、抵抗などの公知の電子部品である。 The electronic components are known electronic components such as various diodes, capacitors, ICs, resistors, and the like for performing overcurrent protection, noise cut, rectification, smoothing, dimming control, and the like.
上述のように、LEDユニット基板30は、一枚の基板にLED素子30fと、LED素子30fを点灯駆動する点灯回路の電子部品を実装したことにより、部品点数が削減される。また、LED素子30fと電子部品が一枚の基板に整然と区分されて配置されることになり、LEDランプ本体1の小型化を図ることができる。 As described above, the LED unit substrate 30 has the number of components reduced by mounting the LED elements 30f and the electronic components of the lighting circuit that drives the LED elements 30f on the single substrate. In addition, the LED element 30f and the electronic component are arranged in an orderly manner on a single substrate, so that the LED lamp body 1 can be reduced in size.
前記絶縁カバー40は、図5に示すように、前記LEDユニット基板30の形状に対応した略蝶形に形成されており、絶縁性樹脂により造られている。絶縁性カバー40は、中央円板部40aと、その両側に張り出した凹状の円弧枠部(張り出し部)40b,40cが一体成形され、これら円弧枠部40b,40cが形成されていない部分が装着逃げ部40d,40eとなっている。中央円板部40aと円弧枠部40b,40cは同心円の湾曲体である。ここでは、一方の円弧枠部40cが他方の円弧枠部40dよりも長い円弧長となっている。 As shown in FIG. 5, the insulating cover 40 is formed in a substantially butterfly shape corresponding to the shape of the LED unit substrate 30, and is made of an insulating resin. The insulating cover 40 is formed by integrally forming a central disc portion 40a and concave arcuate frame portions (projecting portions) 40b and 40c projecting on both sides thereof, and portions where these arc frame portions 40b and 40c are not formed are mounted. The escape portions 40d and 40e are formed. The central disc portion 40a and the arc frame portions 40b and 40c are concentric curved bodies. Here, one arc frame portion 40c has a longer arc length than the other arc frame portion 40d.
前記LEDユニット基板30を支持する基板支持部材50は、図6に示すように、略円板形状であり、金属板で成形加工されている。基板支持部材50は、中央円板面部50aの周方向両側部に下面部方向(照射方向と反対方向)に凹設された円弧枠部50b,50cが形成されており、これら円弧枠部50b,50cが形成されていない部分が前記取付板2との装着面部50d,50eとなっている。この装着面部50d,50eにはダルマ状のネジ穴50fがそれぞれ開口されている。ここでは、一方の円弧枠部50cが他方の円弧枠部50bよりも長い円弧長となっている。 As shown in FIG. 6, the substrate support member 50 that supports the LED unit substrate 30 has a substantially disk shape and is formed by a metal plate. The substrate support member 50 is formed with arc frame portions 50b and 50c that are recessed in the lower surface direction (direction opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 50a. The portions where 50c is not formed are mounting surface portions 50d and 50e with the mounting plate 2. Dharma-shaped screw holes 50f are respectively opened in the mounting surface portions 50d and 50e. Here, one arc frame portion 50c has a longer arc length than the other arc frame portion 50b.
基板支持部材50のLEDユニット基板30の支持面側(図6の裏面側)には、図8に示すように、前記透光性カバー20のネジ止着部20iに対応して、複数の止めネジ50gが設けられている。また、装着面部50eには電源電線を挿通する切欠穴50hが形成されている。 On the support surface side of the LED unit substrate 30 of the substrate support member 50 (the back surface side in FIG. 6), a plurality of stoppers are provided corresponding to the screw fixing portions 20i of the translucent cover 20, as shown in FIG. A screw 50g is provided. Further, a notch hole 50h through which the power supply wire is inserted is formed in the mounting surface portion 50e.
前記端子台60は、前記基板支持部材50の下面部にネジ等で装着されており、天井等の被取付部から引き出された外部電源電線(Fケーブル)の接続口が、後述する取付板2の外部電源電線挿通孔2cを向けて設けられている。図10及び図12にはこの端子台60が示されているが、ここでは外部電源電線との接続口は裏面側に設けられているため図示されていない。端子台60の表面側には、外部電源電線とLEDユニット基板30の電源部とを導通する電源電線の接続口60aが設けられている。 The terminal block 60 is attached to the lower surface portion of the substrate support member 50 with screws or the like, and a connection port of an external power supply wire (F cable) drawn out from a mounted portion such as a ceiling is a mounting plate 2 described later. The external power supply electric wire insertion hole 2c is provided. FIGS. 10 and 12 show the terminal block 60, but the connection port with the external power supply wire is not shown here because it is provided on the back side. On the surface side of the terminal block 60, a connection port 60a for a power supply wire that conducts the external power supply wire and the power supply unit of the LED unit substrate 30 is provided.
接続口60aに接続された電源電線は、基板支持部材50の切欠穴50hを通し、図12に示すように、透光性カバー20の係止舌片20gの係止孔20fを通して挿通孔20jから透光性カバー20の内部に挿通することにより、LEDユニット基板30の電源部と結線される。係止孔20fには切欠部20hが形成されているので、組立順序に左右されずに電源電線を係止孔20fに通すことができる。これらの結線作業は、LEDランプ本体1の組立工程で行われる。なお、端子台60は公知のものが使用できる。 The power supply wire connected to the connection port 60a passes through the notch hole 50h of the substrate support member 50, and passes through the insertion hole 20j through the locking hole 20f of the locking tongue piece 20g of the translucent cover 20, as shown in FIG. By being inserted into the interior of the translucent cover 20, the power unit of the LED unit substrate 30 is connected. Since the notch 20h is formed in the locking hole 20f, the power supply wire can be passed through the locking hole 20f regardless of the assembly order. These connection operations are performed in the assembly process of the LED lamp main body 1. A known terminal block 60 can be used.
前記取付板2は、図7に示すように、全体が横長の金属板であり、長さ方向両端縁部が筐体10の外径面に合わせた円弧状に形成されている。この取付板2の本体面部2aの長辺側の両端部には、L字状に起立したLEDランプ本体1の装着面部2bが一対形成されている。この装着面部2bにはネジ穴2fが開口されている。本体面部2aの中央部には、外部電源電線の挿通孔2cが開口されており、装着部2b近くには取付板2を天井等の被取付部に装着するための複数のネジ穴2dが互いに向きを変えて形成されている。また本体面部2aには、複数のビード2eが形成されている。なお、取付板2と被取付部との間にスポンジ等の弾性部材を介装させて密封することにより、LEDランプ本体1に粉塵、虫等が入り込まないようにし、被取付部の振動がLEDランプ本体1に伝わるのを防止することができる。 As shown in FIG. 7, the mounting plate 2 is a horizontally long metal plate, and both end edges in the length direction are formed in an arc shape matching the outer diameter surface of the housing 10. A pair of mounting surface portions 2b of the LED lamp main body 1 erected in an L shape is formed at both ends on the long side of the main body surface portion 2a of the mounting plate 2. A screw hole 2f is opened in the mounting surface portion 2b. An insertion hole 2c for an external power source electric wire is opened at the center of the main body surface portion 2a, and a plurality of screw holes 2d for mounting the mounting plate 2 on a mounted portion such as a ceiling are mutually connected near the mounting portion 2b. It is formed in a different direction. A plurality of beads 2e are formed on the main body surface portion 2a. It should be noted that an elastic member such as a sponge is interposed between the mounting plate 2 and the mounted portion and sealed to prevent dust, insects, etc. from entering the LED lamp main body 1 and the vibration of the mounted portion is reduced to the LED. Propagation to the lamp body 1 can be prevented.
上述したLEDランプ本体1は、図8に示すように、基板支持部材50の上面部に絶縁カバー40を介してLEDユニット基板30がネジ止め等により装着され一体化される。この状態で、基板支持部材50の凹状円弧枠部50b,50cに絶縁カバー40の凹状円弧枠部40b,40cが嵌挿され、LEDユニット基板30の中央円板部30aは、絶縁カバー40の中央円板部40aを介して基板支持部材50の中央円板面部50aに接することになる。また、LEDユニット基板30の円弧面部30b,30cは、基板支持部材50の凹状円弧枠部50b,50c及び絶縁カバー40の凹状円弧枠部40b,40cから離間した状態となる。 As shown in FIG. 8, the LED lamp main body 1 is integrated by attaching the LED unit substrate 30 to the upper surface portion of the substrate support member 50 via an insulating cover 40 by screws or the like. In this state, the concave arc frame portions 40b and 40c of the insulating cover 40 are fitted into the concave arc frame portions 50b and 50c of the substrate support member 50, and the central disk portion 30a of the LED unit substrate 30 is located at the center of the insulating cover 40. The central disc surface portion 50a of the substrate support member 50 is in contact with the disc portion 40a. Further, the arc surface portions 30 b and 30 c of the LED unit substrate 30 are separated from the concave arc frame portions 50 b and 50 c of the substrate support member 50 and the concave arc frame portions 40 b and 40 c of the insulating cover 40.
そして、LEDユニット基板30の裏面部(照射面の反対面)に前記電子部品を実装した場合は、この離間した空間部にその電子部品が収容されることになり、LEDランプユニット基板30の表面部(照射面側)に電子部品を配置した場合は、その空間部が電子部品の放熱部となる。 And when the said electronic component is mounted in the back surface part (opposite surface of an irradiation surface) of the LED unit board | substrate 30, the electronic component will be accommodated in this spaced apart space part, The surface of the LED lamp unit board | substrate 30 When the electronic component is arranged on the portion (irradiation surface side), the space portion becomes the heat radiating portion of the electronic component.
前記LEDユニット基板30の上方(照射斜面側)には、図9、図12に示すように、前記透光性カバー20が被せられ、基板支持部材50の止めネジ50gを透光カバー20のネジ止着部20iに螺入することにより、基板支持部材50と透光カバー20を固定する。そして、この透光性カバー20に筐体10(図9、図12では図示せず)が被せられる。この状態で、透光性カバー20の円弧枠部20b,20cが、対応するLEDユニット基板30の円弧面部30d,30eを覆い、図11に示すように、透光性カバー20の中央円盤部20aが筐体10の露出孔10aから膨出することになる。また、LEDユニット基板30の円弧面部30d,30eに実装された電子部品等が筐体10の上面部の縁面部(上面周面部10b、上端縁部10c)及び透光性カバー20の円弧枠部20b,20cで隠されることになる。なお、基板支持部材50と透光カバー20の固定方法は、前述した構成に限定されるものではない。 As shown in FIGS. 9 and 12, the translucent cover 20 is put on the LED unit substrate 30 (on the irradiation slope side), and the set screw 50 g of the substrate support member 50 is screwed on the translucent cover 20. The board support member 50 and the translucent cover 20 are fixed by screwing into the fastening part 20i. The translucent cover 20 is covered with a casing 10 (not shown in FIGS. 9 and 12). In this state, the arc frame portions 20b and 20c of the translucent cover 20 cover the arc surface portions 30d and 30e of the corresponding LED unit substrate 30, and the central disk portion 20a of the translucent cover 20 as shown in FIG. Swells from the exposure hole 10 a of the housing 10. Further, the electronic components and the like mounted on the arc surface portions 30 d and 30 e of the LED unit substrate 30 are the edge surface portions (upper surface peripheral surface portion 10 b and upper end edge portion 10 c) of the housing 10 and the arc frame portion of the translucent cover 20. It will be hidden by 20b, 20c. In addition, the fixing method of the board | substrate support member 50 and the translucent cover 20 is not limited to the structure mentioned above.
上述したLEDユニット基板30の形状は、電子部品の配置位置によっては、円弧面部30b,30cの大きさや形状を変えることができ、それに対応して、透光カバー20の円弧枠部20c、絶縁カバー40の円弧枠部40b,40c、基板支持部材50の円弧枠部50b,50cの大きさや形状を変更することもできる。 The shape of the LED unit substrate 30 described above can change the size and shape of the arcuate surface portions 30b and 30c depending on the arrangement position of the electronic components. Correspondingly, the arc frame portion 20c of the translucent cover 20 and the insulating cover The size and shape of the 40 arc frame portions 40b and 40c and the arc frame portions 50b and 50c of the substrate support member 50 can be changed.
LEDランプ本体1を天井等の被取付部に取り付ける場合は、まず外部電源電線(F−ケーブル)を取付板2の外部電源線挿通孔2cに挿通し(外部電源電線は天井に開口されている通孔から引き出す)、天井に開口されている外部電源電線の通孔と、取付板2の外部電源線挿通孔2cを合わせ、取付板2の装着部2bを下向き(照射方向)となるようにネジ穴2dを通して被取付部に取付板2をネジ止めする。 When attaching the LED lamp main body 1 to a mounted portion such as a ceiling, first, an external power supply wire (F-cable) is inserted into the external power supply wire insertion hole 2c of the mounting plate 2 (the external power supply wire is opened in the ceiling). Pull out from the through-hole), match the through-hole of the external power supply wire opened in the ceiling and the external power line insertion hole 2c of the mounting plate 2 so that the mounting portion 2b of the mounting plate 2 faces downward (irradiation direction) The mounting plate 2 is screwed to the mounted portion through the screw hole 2d.
次に、端子台60に外部電源電線を接続した後、LEDランプ本体1の基板支持部材50の装着面部50d,50eと取付板の装着面部2bを合わせ、ネジ穴50f、2fを通してネジ3(図8、図9)で止着する。この際、筐体10を取り外しておけば、透光性カバー20の装着逃げ部20d、20e、LEDユニット基板30の装着逃げ部30d,30e、絶縁カバー40の装着逃げ部40d,40eが対応して形成されているため、ネジ止め作業を簡単に行うことができる。 Next, after connecting the external power supply wire to the terminal block 60, the mounting surface portions 50d, 50e of the substrate support member 50 of the LED lamp body 1 and the mounting surface portion 2b of the mounting plate are aligned, and the screw 3 (FIG. 8 and Fig. 9). At this time, if the housing 10 is removed, the mounting escape portions 20d and 20e of the translucent cover 20, the mounting escape portions 30d and 30e of the LED unit substrate 30, and the mounting escape portions 40d and 40e of the insulating cover 40 correspond. Therefore, the screwing operation can be easily performed.
このようにLEDランプ本体1を取付板2に装着することにより、図10に模式的に示すように、LED基板支持部材50と取付板2の間に空間部70が生じることになり、この空間部70に端子台60が配置されることになる。またLEDユニット基板30で発生した熱は、LED基板支持部材50に伝わって空間部70に放熱されることになる。 By mounting the LED lamp body 1 on the mounting plate 2 in this manner, a space portion 70 is generated between the LED board support member 50 and the mounting plate 2 as schematically shown in FIG. The terminal block 60 is disposed on the portion 70. Further, the heat generated in the LED unit substrate 30 is transmitted to the LED substrate support member 50 and radiated to the space portion 70.
(第2の実施形態)
図13〜図21は、本発明の第2の実施形態を示したものである。第2の実施形態のLED照明装置は、図13に示すように、LEDランプ本体100と取付板2からなっている。取付板2の構成は第1の実施形態と同じであるから、ここでは説明を省略する。LEDランプ本体100は、LED照射方向から見て、筐体10と、この中に収納される透光性カバー110と、電源部遮蔽部材120と、LEDユニット基板130と、絶縁カバー140と、基板支持部材150と、この基板支持部材150に装着される端子台(電源端子台)160とから概略構成されている。
(Second Embodiment)
13 to 21 show a second embodiment of the present invention. As shown in FIG. 13, the LED illumination device according to the second embodiment includes an LED lamp body 100 and a mounting plate 2. Since the configuration of the mounting plate 2 is the same as that of the first embodiment, the description thereof is omitted here. The LED lamp main body 100 includes a housing 10, a translucent cover 110 accommodated in the housing 10, a power source shielding member 120, an LED unit substrate 130, an insulating cover 140, and a substrate as viewed from the LED irradiation direction. The support member 150 and a terminal block (power supply terminal block) 160 mounted on the substrate support member 150 are schematically configured.
図14に示すランプ本体100の中で、筐体10の構成は、第1の実施形態と同じであるから、ここでは説明を省略する。電源部遮蔽部材120は、光を透過しないポリカーボネート樹脂等により造られており、LEDユニット基板130に実装されている点灯回路の電子部品を覆い隠すためのものである。 In the lamp main body 100 shown in FIG. 14, the configuration of the housing 10 is the same as that of the first embodiment, and thus the description thereof is omitted here. The power source shielding member 120 is made of polycarbonate resin or the like that does not transmit light, and covers the electronic components of the lighting circuit mounted on the LED unit substrate 130.
電源部遮蔽部材120は、図16に示すように、全体が略蝶形筒体であり、中央円盤部120aと、その両側部に張り出した円弧枠部(張り出し部)120b、120cが一体成形されており、円弧枠部120b,120cが形成されていない部分が装着逃げ部120d,120eとなっている。中央円盤部120aの中央部には開口部120fが形成されており、その開口部120fから後述するLEDユニット基板130のLED素子130fが露出するようになっている。また、中央円盤部120aはすり鉢形状となっており、開口部120fに向かって傾斜面が形成されている。その傾斜面には、高反射シートの貼付や、高反射用樹脂の塗布等の方法により光反射面となっている。なお、中央円盤部120aと円弧枠部120b,120cは同心円の湾曲体であり、ここでは、一方の円弧枠部120cが他方の円弧枠部120bよりも長い円弧長となっている。 As shown in FIG. 16, the power source shielding member 120 is generally a butterfly cylindrical body, and a central disk portion 120 a and arc frame portions (projecting portions) 120 b and 120 c projecting on both sides thereof are integrally formed. The portions where the arc frame portions 120b and 120c are not formed are mounting escape portions 120d and 120e. An opening 120f is formed at the center of the central disk portion 120a, and an LED element 130f of the LED unit substrate 130 described later is exposed from the opening 120f. Moreover, the center disk part 120a becomes mortar shape, and the inclined surface is formed toward the opening part 120f. The inclined surface is a light reflecting surface by a method such as sticking a highly reflecting sheet or applying a highly reflecting resin. The central disk portion 120a and the arc frame portions 120b and 120c are concentric curved bodies. Here, one arc frame portion 120c has a longer arc length than the other arc frame portion 120b.
電源部遮蔽部材120の中央円盤部120aの傾斜面の外縁部には透光カバー110が嵌着されている。透光カバー110は、ポリカーボネート樹脂等に光拡散剤等を添加して透明又は乳白色となっている。 A translucent cover 110 is fitted to the outer edge portion of the inclined surface of the central disk portion 120 a of the power source shielding member 120. The translucent cover 110 is transparent or milky white by adding a light diffusing agent or the like to polycarbonate resin or the like.
LEDユニット基板130は、第1実施態様のLEDユニット基板30と略同形であり、図17に示すように、中央円板部130aと、その両側部に張り出した円弧面部(張り出し面部)130b,130cが一体成形されている。中央円板部130aと円弧面部130b,130cは同心円の湾曲体である。ここでは、一方の円弧面部130cが他方の円弧面部130bよりも長い円弧長となっている。また、中央円板部130aと円弧面部130b,130cの間であって、円弧面部130b,130cが形成されていない部分は、装着逃げ部130d,130eとなっている。 The LED unit substrate 130 has substantially the same shape as the LED unit substrate 30 of the first embodiment, and as shown in FIG. 17, a central disk portion 130a and arcuate surface portions (extended surface portions) 130b, 130c protruding on both sides thereof. Is integrally molded. The central disk portion 130a and the arcuate surface portions 130b and 130c are concentric curved bodies. Here, one arc surface portion 130c has a longer arc length than the other arc surface portion 130b. Further, portions between the central disc portion 130a and the arc surface portions 130b and 130c, where the arc surface portions 130b and 130c are not formed, are mounting escape portions 130d and 130e.
第2の実施形態では、装着逃げ部130e側が中央円板部130aの中心部方向に切り込まれており、後述する端子台160の配置スペースを確保している。LEDユニット基板130の中央円板部130aの下面部(照射面側)には、複数のLED素子130fがサークル状に実装されるが、中央円板部130aは第1の実施態様の中央円板部30aに比べて実装面積が狭くなっているため、その分、LED素子130fの実装密度を高くしている。また、円弧面部130b,130cにはLED素子130fを点灯駆動する点灯回路の電子部品(図示せず)が実装されている。 In the second embodiment, the mounting escape portion 130e side is cut in the direction of the central portion of the central disc portion 130a, and a space for arranging the terminal block 160 described later is secured. A plurality of LED elements 130f are mounted in a circle on the lower surface portion (irradiation surface side) of the central disk portion 130a of the LED unit substrate 130. The central disk portion 130a is the central disk of the first embodiment. Since the mounting area is smaller than that of the portion 30a, the mounting density of the LED elements 130f is increased accordingly. Further, an electronic component (not shown) of a lighting circuit that drives the LED element 130f to be lit is mounted on the circular arc surface portions 130b and 130c.
前記絶縁カバー140は、後述する端子台160の配置スペースを確保するために装着逃げ部140d(図13参照)が形成されている。その他の構成は第1の実施形態と同じであるから、ここでは説明を省略する。 The insulating cover 140 is provided with a mounting relief portion 140d (see FIG. 13) in order to secure an arrangement space for a terminal block 160 described later. Since other configurations are the same as those of the first embodiment, description thereof is omitted here.
前記基板支持部材150は、金属板で成形加工されており、図18、図21に示すように、中央円板面部150aの周方向両側部に下面部方向(照射方向と反対方向)に凹設された円弧枠部150b,150cが形成されている。これら円弧枠部150b,150cが形成されていない部分が前記取付板2との装着面部150d,150eとなっている。この装着面部150d,150eにはダルマ状のネジ穴150fがそれぞれ開口されている。ここでは、一方の円弧枠部150cが他方の円弧枠部150bよりも長い円弧長となっている。 The substrate support member 150 is formed by a metal plate, and as shown in FIGS. 18 and 21, is recessed in the lower surface direction (opposite to the irradiation direction) on both sides in the circumferential direction of the central disk surface portion 150a. Arc frame portions 150b and 150c are formed. The portions where the arc frame portions 150b and 150c are not formed serve as mounting surface portions 150d and 150e with the mounting plate 2. Dharma-shaped screw holes 150f are respectively opened in the mounting surface portions 150d and 150e. Here, one arc frame portion 150c has a longer arc length than the other arc frame portion 150b.
基板支持部材150の端部、ここでは装着面部150eの端部には、後述の端子台160が収まる開口面積を有する切込口部150gが形成されている。この切込口部150gは、所定幅の切片を中央円板面部150aの中心部方向に切り欠いて形成され、略へ字状に屈曲した起立片150hが形成されている。この起立片150hには、端子台160を止着するための係入孔(図示せず)が形成されている。 At the end of the substrate support member 150, here, the end of the mounting surface 150e, a notch 150g having an opening area in which a terminal block 160 described later is accommodated is formed. The notch 150g is formed by cutting out a section having a predetermined width in the direction of the center of the central disk surface 150a, and an upright piece 150h that is bent substantially in a letter shape is formed. An engaging hole (not shown) for fixing the terminal block 160 is formed in the standing piece 150h.
前記端子台160は、図19に示すように、上面部に複数の係止突起160aが突設されている。この係止突起160aは特に限定されるものではないが、起立片150hの前記係入孔にワンタッチで係着できる構成にすれば、ネジ止め作業等の手間を省くことができる。この端子台160は、基板支持部材150の切込口部150gに挿入し、端子台150gの係止突起160aを起立片150hの係入孔に係入することにより基板支持部材150に装着する。端子台160に、外部電源電線が接続されること、外部電源電線との接続口が取付板2の外部電源電線挿入孔2cに向いていること、端子台160とLEDユニット基板130の電源部とを導通する電源電線の接続口が設けられていることは第1の実施形態と同じである。 As shown in FIG. 19, the terminal block 160 has a plurality of locking projections 160a provided on the upper surface thereof. The locking protrusion 160a is not particularly limited, but if it is configured to be able to be engaged with the engaging hole of the upright piece 150h with one touch, it is possible to save time and labor such as screwing. The terminal block 160 is inserted into the notch 150g of the substrate support member 150, and is attached to the substrate support member 150 by engaging the locking projection 160a of the terminal block 150g into the engagement hole of the upright piece 150h. An external power supply wire is connected to the terminal block 160, a connection port with the external power supply wire is directed to the external power supply wire insertion hole 2c of the mounting plate 2, and the power supply section of the terminal block 160 and the LED unit board 130 It is the same as that of the first embodiment that the connection port of the power supply wire that conducts is provided.
上述したLEDランプ本体100は、図17に示すように、基板支持部材150と絶縁カバー140及びLEDユニット基板130とを重ね合わせてネジ(図示せず)等で固定し、一体化されている。また、図15、図16に示すように、電源部遮蔽部材120は、基板支持部材150とネジ止め、係止機構等の手段により固定又は係止されている。図20は筐体10を取り外した状態の取付板2とLEDランプ本体100の取付状態を示しているが、取付板2とLEDランプ本体100との取付方法、端子台160と外部電源電線の接続手順等は、第1の実施形態と同じであるから、ここでは説明を省略する。 As shown in FIG. 17, the LED lamp main body 100 described above is integrated by superimposing the substrate support member 150, the insulating cover 140, and the LED unit substrate 130 and fixing them with screws (not shown) or the like. As shown in FIGS. 15 and 16, the power source shielding member 120 is fixed or locked to the substrate support member 150 by means such as screws and locking mechanisms. FIG. 20 shows the mounting state of the mounting plate 2 and the LED lamp body 100 with the housing 10 removed. The mounting method of the mounting plate 2 and the LED lamp body 100, the connection between the terminal block 160 and the external power supply wire. Since the procedure and the like are the same as those in the first embodiment, the description thereof is omitted here.
第2の実施形態によれば、端子台160が基板支持部材150の切込口部150gに装着されるため、図18、図21に示すように、端子台160が基板支持部材150の上方(電源部遮蔽部材120の配置方向)に突き出た状態になり、その分、LEDユニット基板130と、電源部遮蔽部材120に装着された透光カバー120の間隔が大きくなる。このため、LEDユニット基板130に実装されているLED素子130fが透光カバー120に粒々状に投影される状態を防止又は小さくすることができ、美麗な発光面とすることができる。 According to the second embodiment, since the terminal block 160 is attached to the notch 150g of the substrate support member 150, the terminal block 160 is located above the substrate support member 150 (see FIG. 18 and FIG. 21). In this state, the distance between the LED unit substrate 130 and the translucent cover 120 attached to the power supply shielding member 120 is increased. For this reason, it is possible to prevent or reduce the state in which the LED elements 130f mounted on the LED unit substrate 130 are projected in a granular shape on the translucent cover 120, and a beautiful light emitting surface can be obtained.
また、電源部遮蔽部材120をポリカーボネート樹脂製とすることにより、絶縁性が向上し、材料費を削減することができる。また、電源部遮蔽部材120にすり鉢形状の光反射面を形成したことにより、LED照射光を広範囲に均一に反射させることができる。さらに、基板支持部材150の切込口部150gに端子台160を配置したことにより、LEDユニット基板130のLED素子130fの実装面積が狭くなってLED素子130fが密に実装されるため、前記電源部遮蔽部材120のすり鉢形状の光反射面と相まってLED照射効率をアップさせることができる。 Further, by making the power source shielding member 120 made of polycarbonate resin, the insulation can be improved and the material cost can be reduced. Moreover, by forming the mortar-shaped light reflecting surface on the power supply unit shielding member 120, the LED irradiation light can be uniformly reflected over a wide range. Further, since the terminal block 160 is disposed in the cut-out opening portion 150g of the board support member 150, the mounting area of the LED elements 130f of the LED unit board 130 is reduced and the LED elements 130f are densely mounted. The LED irradiation efficiency can be increased in combination with the mortar-shaped light reflecting surface of the part shielding member 120.
なお、本実施形態ではLEDランプ本体2の形状を円筒形にしたが、これに限定されず断面が4角形等からなる扁平な多角柱であってもよい。 In the present embodiment, the shape of the LED lamp main body 2 is a cylindrical shape, but is not limited thereto, and may be a flat polygonal column having a quadrangular cross section.
以上、この発明の実施の形態を説明したが、この発明は、これらの実施の形態に限られるものではなく、この発明の要旨を逸脱しない範囲の設計変更があっても本発明に含まれる。すなわち、当業者であれば、当然なし得る各種変形、修正もまた本発明に含まれる。 As mentioned above, although embodiment of this invention was described, this invention is not restricted to these embodiment, Even if there is a design change of the range which does not deviate from the summary of this invention, it is included in this invention. That is, various changes and modifications that can be made by those skilled in the art are also included in the present invention.
1 LEDランプ本体
2 取付板
2b 装着面部
10 筐体
20 透光カバー
30 LEDユニット基板
40 絶縁カバー
50 基板支持部材
50a 装着面部
60 端子台
100 LEDランプ本体
110 透光性カバー
120 電源部遮光部材
130 LEDユニット基板
140 絶縁カバー
150 基板支持部材
150g 切込口部
150h 起立片
160 端子台
DESCRIPTION OF SYMBOLS 1 LED lamp main body 2 Mounting plate 2b Mounting surface part 10 Case 20 Translucent cover 30 LED unit board 40 Insulation cover 50 Substrate support member 50a Mounting surface part 60 Terminal block 100 LED lamp main body 110 Translucent cover 120 Power supply part light shielding member 130 LED Unit substrate 140 Insulation cover 150 Substrate support member 150g Cut opening 150h Standing piece 160 Terminal block
Claims (11)
前記LEDランプ本体は、筐体内に、LED素子及び該LED素子を点灯駆動する点灯回路の電子部品を実装する基板と、前記基板を支持する放熱性の基板支持部材と、前記基板と前記基板支持部材の間に配置される絶縁カバーと、を有しており、
前記点灯回路の電子部品を実装した基板部分は前記基板支持部材と前記絶縁カバーから離れるように配置され、
前記基板支持部材の前記取付板側に、前記取付板の挿通孔を通した外部電源電線を接続する端子台が装着されており、
前記取付板は、前記被取付部に直接取り付けられるとともに、前記基板支持部材が前記取付板に空間を開けて取り付けられることを特徴とするLED照明装置。 An LED lamp main body, and an attachment plate for attaching the LED lamp main body to the attachment portion, having an insertion hole for an external power supply wire,
The LED lamp main body includes a substrate on which an LED element and an electronic component of a lighting circuit that drives the LED element are mounted, a heat dissipation substrate support member that supports the substrate, and the substrate and the substrate support. An insulating cover disposed between the members,
The board portion on which the electronic components of the lighting circuit are mounted is arranged so as to be separated from the board support member and the insulating cover,
A terminal block for connecting an external power supply wire through an insertion hole of the mounting plate is mounted on the mounting plate side of the substrate support member,
The LED lighting device , wherein the mounting plate is directly mounted on the mounted portion, and the substrate support member is mounted on the mounting plate with a space .
前記基板支持部材に有する前記取付板との装着面部に前記各装着逃げ部が位置するように前記基板と前記絶縁カバーとを前記基板支持部材に固定したことを特徴とする請求項1に記載のLED照明装置。2. The substrate and the insulating cover are fixed to the substrate support member so that each of the mounting relief portions is positioned on a mounting surface portion of the substrate support member with the mounting plate. LED lighting device.
前記LEDランプ本体は、筐体内に、LED素子と該LED素子を点灯駆動する点灯回路の電子部品とを同一面に実装する基板と、前記基板を支持する放熱性の基板支持部材と、前記基板と前記基板支持部材の間に配置される絶縁カバーと、前記基板に実装された電子部品を遮蔽する電源部遮蔽部材と、を有しており、
前記点灯回路の電子部品を実装した基板部分は前記基板支持部材と前記絶縁カバーから離れるように配置され、
前記基板支持部材の端部に切込口部を形成し、該切込口部に前記取付板の挿通孔を通した外部電源電線を接続する端子台が装着されており、
前記取付板は、前記被取付部に直接取り付けられるとともに、前記基板支持部材が前記取付板に空間を開けて取り付けられることを特徴とするLED照明装置。 An LED lamp main body, and an attachment plate for attaching the LED lamp main body to the attachment portion, having an insertion hole for an external power supply wire,
The LED lamp main body includes, in a housing, a substrate on which an LED element and an electronic component of a lighting circuit that drives the LED element are mounted on the same surface, a heat-radiating substrate support member that supports the substrate, and the substrate And an insulating cover disposed between the board support member and a power supply shielding member that shields electronic components mounted on the board,
The board portion on which the electronic components of the lighting circuit are mounted is arranged so as to be separated from the board support member and the insulating cover,
Forming a notch at the end of the substrate support member, and a terminal block for connecting an external power supply wire through the insertion hole of the mounting plate is attached to the notch ;
The LED lighting device , wherein the mounting plate is directly mounted on the mounted portion, and the substrate support member is mounted on the mounting plate with a space .
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