JP2015088749A - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP2015088749A
JP2015088749A JP2014211848A JP2014211848A JP2015088749A JP 2015088749 A JP2015088749 A JP 2015088749A JP 2014211848 A JP2014211848 A JP 2014211848A JP 2014211848 A JP2014211848 A JP 2014211848A JP 2015088749 A JP2015088749 A JP 2015088749A
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JP
Japan
Prior art keywords
heating
lamp
processing apparatus
substrate
gas injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014211848A
Other languages
English (en)
Japanese (ja)
Inventor
ドゥヨン ユン
Doo Young Youn
ドゥヨン ユン
サンヒョン ジ
Sang-Hyun Ji
サンヒョン ジ
ソンヨン イ
Song Yeon Lee
ソンヨン イ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AP Systems Inc
Original Assignee
AP Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AP Systems Inc filed Critical AP Systems Inc
Publication of JP2015088749A publication Critical patent/JP2015088749A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2014211848A 2013-10-28 2014-10-16 基板処理装置 Pending JP2015088749A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130128524 2013-10-28
KR10-2013-0128524 2013-10-28

Publications (1)

Publication Number Publication Date
JP2015088749A true JP2015088749A (ja) 2015-05-07

Family

ID=53051176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014211848A Pending JP2015088749A (ja) 2013-10-28 2014-10-16 基板処理装置

Country Status (2)

Country Link
JP (1) JP2015088749A (zh)
CN (1) CN104576358A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015226069A (ja) * 2014-05-29 2015-12-14 エーピー システムズ インコーポレイテッド ヒーターブロックおよび基板熱処理装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102462263B1 (ko) * 2017-10-30 2022-11-02 어플라이드 머티어리얼스, 인코포레이티드 Epi에서의 다중 구역 스폿 가열
KR102161165B1 (ko) * 2018-05-18 2020-09-29 에이피시스템 주식회사 히터 블록, 열 처리 장치 및 방법
CN114388654B (zh) * 2021-12-13 2023-10-24 泰州隆基乐叶光伏科技有限公司 一种硅片加热装置及方法
CN117497461B (zh) * 2023-12-29 2024-04-12 无锡尚积半导体科技有限公司 晶圆镀膜前处理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015226069A (ja) * 2014-05-29 2015-12-14 エーピー システムズ インコーポレイテッド ヒーターブロックおよび基板熱処理装置

Also Published As

Publication number Publication date
CN104576358A (zh) 2015-04-29

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