JP2015082411A - Method for manufacturing organic electroluminescence display device, and mask substrate for fabricating organic electroluminescence display device to be used for the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic EL display device having excellent qualities, by which organic layers can be separately applied with high definition.SOLUTION: The method for manufacturing an organic EL display device includes: an adhesion step of disposing an organic EL substrate and a mask substrate comprising a support substrate and a laser-absorption layer, with the laser-absorption layer opposing to the organic EL substrate, and adhering the organic El substrate to the mask substrate; a laser light irradiation step of irradiating the mask substrate with laser light to form a cut line in the laser-absorption layer; an opening formation step of forming an opening in the laser-absorption layer; and an organic EL layer formation step of forming an organic EL layer on a pixel electrode. The adhesion step, the laser light irradiation step, the opening formation step, and the organic EL layer formation step are repeated a plurality of times corresponding to the number of colors.

Description

  The present invention relates to a method for manufacturing an organic electroluminescence display device in which an organic layer is separately applied using a mask base material.

  The organic electroluminescence element has high visibility due to self-coloring, is an all-solid-state display unlike a liquid crystal display device, has excellent impact resistance, has a fast response speed, is less affected by temperature changes, and Advantages such as a wide viewing angle are attracting attention. Further, since the organic electroluminescence element is a self-luminous display device, a color filter is unnecessary. Therefore, there is an advantage that the light use efficiency is high and the power consumption can be reduced. Hereinafter, organic electroluminescence may be abbreviated as organic EL.

  Generally, in manufacturing an organic EL display device, organic layers such as a light emitting layer are separately applied from the viewpoint of high color purity and contrast and low power consumption. For example, a coating method or a vapor deposition method is known as a method for coating the organic layer. From the viewpoint of coating the organic layer with high definition, a metal mask provided with openings is applied to the organic layer forming surface. It is considered that a vapor deposition method in which an organic material is vapor-deposited through the metal mask is advantageous.

  However, when an organic layer is separately applied using a metal mask, the temperature of the metal mask attached to the surface on which the organic layer is formed rises, which may cause the metal mask to thermally expand and cause dimensional variation. is there. Further, as the temperature of the metal mask increases as described above, the temperature of the substrate, which is the formation surface of the organic layer in close contact with the metal mask, also increases, which may cause thermal expansion and dimensional variation. As described above, when the metal mask and the substrate on which the organic layer is to be formed are thermally expanded, there is a gap between the position of the opening provided in the metal mask and the formation position of the organic layer on the surface of the substrate. There is a problem that the accuracy of separation is reduced. Moreover, such a problem becomes more prominent as the manufactured organic EL display device has a larger area.

  Furthermore, when the organic layer is separately applied using a metal mask, the size of the metal mask increases as the organic EL display device to be manufactured has a large area. Therefore, when manufacturing a large-area organic EL display device, there is a problem that the weight of the metal mask is increased by an amount corresponding to the size of the metal mask, and the manufacturing efficiency is lowered.

  With respect to the above-described problem, in Patent Document 1, a resin mask member that transmits visible light is formed on a pixel electrode, and an opening is formed by irradiating the mask member with laser light. As a method, the organic layer is separately applied. Specifically, the following method has been proposed. That is, as illustrated in FIG. 11A, the pixel electrodes 20R, 20G, and 20B and the insulating layer 30 are formed on the substrate 10 between the pixel electrodes 20R, 20G, and 20B. Next, as illustrated in FIG. 11B, a mask member 40 is formed on the pixel electrodes 20R, 20G, and 20B. Subsequently, as illustrated in FIG. 11C, an area corresponding to the pixel electrode 20 </ b> R in the mask member 40 is irradiated with the laser light L to form an opening in the mask member 40. Thereafter, as illustrated in FIG. 11D, an organic layer 50R is formed on the pixel electrode 20R exposed through the opening of the mask member 40, and as illustrated in FIG. 11E, the mask member 40 is formed. Then, the organic layer 50R is formed in a pattern. Next, the organic 50G is formed by a method similar to the method for forming the organic layer 50R illustrated in FIGS. That is, the mask member 40 is formed as illustrated in FIG. Subsequently, as illustrated in FIG. 11G, the laser light L is irradiated to form an opening in a region corresponding to the pixel electrode 20 </ b> G in the mask member 40. Thereafter, as illustrated in FIG. 11H, the organic layer 50G is formed on the pixel electrode 20G exposed through the opening of the mask member 40, and as illustrated in FIG. 11I, the mask member 40 is formed. Then, the organic layer 50G is formed in a pattern. Finally, the organic layer 50B is formed by a method similar to the method of forming the organic layers 50R and 50G illustrated in FIGS. That is, as illustrated in FIG. 11J, the mask member 40 is formed. Subsequently, as illustrated in FIG. 11K, the laser light L is irradiated to form an opening in a region corresponding to the pixel electrode 20 </ b> B in the mask member 40. Thereafter, as illustrated in FIG. 11L, an organic layer 50B is formed on the pixel electrode 20B exposed through the opening of the mask member 40, and as illustrated in FIG. 11M, the mask member 40 is formed. Is removed to form the organic layer 50B in a pattern.

  In the method described in Patent Document 1 illustrated in FIGS. 11A to 11M, as described above, the mask member 40 is formed directly on the substrate in which the pixel region is defined by the insulating layer 30, and then the mask is formed. Each organic layer 50R, 50G, and 50B can be formed in a pattern by forming an opening in the member 40. For this reason, when each organic layer is formed by arranging a metal mask having a pattern-shaped opening in advance on a substrate in which a pixel region is defined, the accuracy of separation of the organic layer is reduced due to the dimensional variation of the metal mask. Can solve the problem of the Further, even in the case of manufacturing a large area organic EL display device, unlike the conventional method using a metal mask, a large increase in the weight of the mask due to the use of the large area mask is prevented. The reduction in manufacturing efficiency can be eliminated. However, in such a method, as illustrated in FIGS. 11 (f) and 11 (j), the mask member 40 is directly formed on the deposited organic layers 50 </ b> R and 50 </ b> G. Or the mask member 40 directly formed on the pixel electrodes 20R, 20G, and 20B is irradiated with laser light, as illustrated in FIGS. 11C, 11G, and 11K. Since the opening is formed, there is a problem that the dust of the removed mask member 40 is scattered to adversely affect the quality of the organic EL display device.

JP2013-2076A

  The present invention has been made in view of the above circumstances, and is a method of manufacturing an organic EL display device capable of performing high-definition coating of an organic layer, and the coating of the organic layer without using a metal mask. The masked organic layer can be prevented from being damaged, and when the opening is formed in the member used as a mask by irradiating the laser beam, the dust from the removed mask is scattered. The main object of the present invention is to provide a method for manufacturing an organic EL display device excellent in quality that can be prevented.

  To achieve the above object, the present invention provides a substrate, a plurality of pixel electrodes formed on the substrate and forming pixel regions of a plurality of colors, a spacer portion formed in a frame shape so as to surround the pixel electrodes, An organic EL display device manufacturing method for manufacturing an organic EL display device including an organic EL layer having a plurality of colors having at least a light emitting layer formed in the pixel region and an upper electrode formed on the organic EL layer. The method for manufacturing the organic EL display device includes an organic EL layer coating process for coating the organic EL layers of the plurality of colors in the pixel region, and the organic EL layer coating process is performed on the substrate. On the organic EL substrate on which the pixel electrode and the spacer portion are formed, a mask base material composed of a support base material that transmits laser light and a laser absorption layer that absorbs laser light is applied to the laser absorbing material. An adhesion step in which the organic EL substrate and the mask base material are in close contact with each other, and a frame shape surrounding the pixel electrode in the pixel region of one color among the plurality of colors A laser light irradiation step of irradiating a laser beam from the mask base material side along the outer periphery of the spacer portion to form a cut line in the laser absorption layer, and from the organic EL substrate, the support base material and the above Peeling off the laser absorption layer surrounded by the cut line formed in the laser light irradiation step to form an opening in the laser absorption layer, and the color of the color through the opening. An organic EL layer forming step of forming an organic EL layer having the light emitting layer of the color on the pixel electrode in a pixel region, the adhesion step, the laser light irradiation step, the opening Forming step, and the organic EL layer forming step to provide a method of manufacturing the organic EL display device, characterized in that it is repeated a few minutes the color of the plurality of colors.

  According to the present invention, the mask substrate disposed on the organic EL substrate is irradiated with laser light to form an opening in the laser absorption layer, and thus the pixel in which the opening of the laser absorption layer and the pixel electrode are formed. Positioning with the region can be made unnecessary. As a result, the manufacturing efficiency can be improved, and the deterioration of the patterning accuracy of the organic layer due to the misalignment between the position of the opening of the laser absorption layer and the position of the pixel region can be prevented. A high-quality organic EL display device with different colors can be obtained. In addition, since the mask base material has two layers of a support base material that transmits laser light and a laser absorption layer that absorbs laser light, the support base material is peeled off after forming a cut line in the laser light irradiation process. In addition to the support substrate, the laser absorption layer surrounded by the cut line can be partially peeled off, and a desired opening can be easily formed in the laser absorption layer. Furthermore, since the mask base material has two layers of the support base material and the laser absorption layer, when the mask base material is irradiated with laser light to form a cut line in the laser absorption layer, the support base material and the mask base material The space between the organic EL substrate can be kept sealed. Thereby, the malfunction that the dust of the laser absorption layer removed by the laser beam scatters to a wide area | region, and the display characteristic of an organic electroluminescent display apparatus falls can be suppressed. Furthermore, since the spacer portion is formed on the organic EL substrate, it is possible to prevent the mask base material from coming into contact with the surface of the formed organic EL layer, so that the quality deteriorates due to damage to the organic EL layer. An organic EL display device capable of suppressing the above can be obtained.

  The present invention is a mask substrate for forming an organic EL display device used in the above-described method of manufacturing an organic EL display device, and is formed on the support substrate that transmits laser light and the laser beam. And a mask substrate for forming an organic EL display device, comprising: a laser absorbing layer that absorbs light.

  According to the present invention, the mask substrate for forming an organic EL display device can be used in the above-described method for manufacturing an organic EL display device. In addition, an organic EL display device can be obtained that can be applied separately and that can suppress deterioration in display characteristics due to contamination of the pixel region.

  In the present invention, the organic layer can be applied with high definition by forming the opening in the laser absorption layer of the mask substrate easily and with high precision, and the deterioration of display characteristics due to contamination of the pixel region is suppressed. Further, there is an effect that an organic EL display device capable of suppressing deterioration in quality due to damage of the organic EL layer or the like can be obtained.

It is process drawing which shows an example of the manufacturing method of the organic electroluminescent display apparatus of this invention. It is a schematic perspective view which shows an example of the organic electroluminescent board | substrate in this invention. It is a schematic diagram explaining the spacer part in this invention. It is a schematic plan view which shows an example of the organic electroluminescent board | substrate in this invention. It is a schematic diagram explaining the tear line formed in the laser absorption layer in this invention. It is a schematic diagram explaining the tear line formed in the laser absorption layer in this invention. It is a schematic diagram explaining the tear line formed in the laser absorption layer in this invention. It is a schematic diagram explaining the opening part formed in the laser absorption layer in this invention. It is process drawing which shows an example of the laser beam irradiation process and opening part formation process in this invention. It is process drawing explaining the process order of the manufacturing method of the organic electroluminescence display of this invention. It is process drawing which shows an example of the manufacturing method of the conventional organic EL display apparatus.

  Hereinafter, the manufacturing method of the organic EL display device of the present invention and the mask substrate for forming the organic EL display device will be described in detail.

A. Manufacturing method of organic EL display device The manufacturing method of an organic EL display device according to the present invention includes a substrate, a plurality of pixel electrodes formed on the substrate and forming pixel regions of a plurality of colors, and a frame shape so as to surround the pixel electrodes. Organic EL device for manufacturing an organic EL display device having a spacer portion formed on the organic EL layer, a plurality of color organic EL layers having at least a light emitting layer formed in the pixel region, and an upper electrode formed on the organic EL layer A method for manufacturing a display device, wherein the method for manufacturing an organic EL display device includes an organic EL layer coating step for coating the pixel area with the organic EL layers of the plurality of colors, and the organic EL layer coating method. The process is composed of a support base material that transmits laser light and a laser absorption layer that absorbs laser light on an organic EL substrate in which the pixel electrode and the spacer portion are formed on the substrate. A mask base material is disposed so that the laser absorption layer and the organic EL substrate face each other, and the organic EL substrate and the mask base material are in close contact with each other, and the pixel region of one color among the plurality of colors A laser beam irradiation step of irradiating a laser beam from the mask base material side along the outer periphery of the frame-shaped spacer portion surrounding the pixel electrode, and forming a cut line in the laser absorption layer; and the organic EL substrate From the support substrate and the laser absorption layer surrounded by the cut line formed in the laser light irradiation step, the opening forming step of forming an opening in the laser absorption layer, and the opening An organic EL layer forming step of forming an organic EL layer having the light emitting layer of the color on the pixel electrode of the pixel region of the color through a portion, and the adhesion step, Za light irradiation step, a manufacturing method of the opening forming step, and the organic EL layer forming step is characterized by being performed by Kaee repeated number of colors of the plurality of colors.

  1A to 1G are process diagrams showing an example of a method for producing an organic EL display device of the present invention. First, as illustrated in FIG. 1A, a pixel electrode 2 is formed on a substrate 1 and a pixel electrode forming step for forming red, green, and blue pixel regions is performed. Therefore, in this example, the red pixel electrode 2 in the red pixel region R, the green pixel electrode 2 in the green pixel region G, and the blue pixel electrode 2 in the blue pixel region B are formed as the pixel electrode 2. Next, a spacer part forming step is performed in which a frame-like spacer part 3 is formed so as to surround the red pixel electrode 2, the green pixel electrode 2, and the blue pixel electrode 2. In this manner, an organic EL substrate forming process for forming the organic EL substrate 10 is performed. Subsequently, as illustrated in FIG. 1B, a mask base material composed of a support base material 4a that transmits laser light and a laser absorption layer 4b that absorbs laser light is prepared, and the mask base material is organic EL. It arrange | positions so that it may oppose a board | substrate, and the adhesion process which adhere | attaches an organic EL board | substrate and a mask base material is performed. At this time, the laser absorption layer 4b in the mask base is placed on the organic EL substrate side, and the laser absorption layer 4b is brought into contact with the top of the spacer portion 3. Next, as illustrated in FIG. 1C, the laser beam L is irradiated from the mask base material side along the outer periphery of the frame-shaped spacer portion 3 surrounding the pixel electrode 2 in the red pixel region R, and the mask A laser light irradiation process for forming a frame-shaped cut line X on the laser absorption layer 4b of the substrate is performed. Subsequently, as illustrated in FIG. 1D, from the organic EL substrate, together with the support base material 4a, on the pixel electrode 2 in the red pixel region R along the cut line formed in the laser light irradiation process. The laser absorbing layer 4b is peeled off, and an opening forming step for forming an opening in the red pixel region R of the laser absorbing layer 4b is performed. Next, as illustrated in FIG. 1E, the organic EL layer 5R having at least a red light emitting layer on the pixel electrode 2 in the red pixel region R through the opening formed in the red pixel region R. An organic EL layer forming step of forming is performed. Next, although not shown, a step of peeling the laser absorption layer having an opening in the red pixel region from the organic EL substrate is performed. Thereafter, as illustrated in FIGS. 1B to 1E, the organic EL layer 5G is formed in the green pixel region G in the same manner as the step of forming the organic EL layer 5R in the red pixel region R. Further, a step of forming the organic EL layer 5B in the blue pixel region B is performed. In this manner, as illustrated in FIG. 1F, an organic EL layer coating process is performed to form an organic EL substrate in which the organic EL layers 5R, 5G, and 5B are coated in each pixel region. Finally, an upper electrode forming step for forming the upper electrode 6 on the organic EL substrate is performed. Thereby, the organic EL display device 100 according to the present invention is obtained.

  Here, the “top portion of the spacer portion” refers to the upper bottom surface H of the spacer portion 3 when the spacer portion 3 has a trapezoidal shape as illustrated in FIGS. 1, 3A, and 3B, for example. . In addition, when the spacer portion has a shape other than the trapezoid, it points to the uppermost portion of the spacer portion, and when the organic EL substrate and the mask base material are brought into contact with each other and sealed under reduced pressure, the mask base material is first in the spacer portion. Refers to the contact part.

  In the present invention, the mask substrate disposed on the organic EL substrate is irradiated with laser light to form an opening in the laser absorption layer of the mask substrate. Positioning with the formed pixel region can be made unnecessary. As a result, the manufacturing efficiency can be improved, and a decrease in the patterning accuracy of the organic layer due to the deviation between the position of the opening of the laser absorption layer and the position of the pixel region can be prevented. Moreover, in this invention, a laser beam is irradiated, a cutting line is formed in a laser absorption layer, and an opening part is formed by peeling a laser absorption layer in pattern shape along the cutting line. In this way, by forming the opening using laser light having excellent straightness, it becomes possible to form a high-definition opening, and the organic layer formed through the opening can be formed with higher definition. Can be formed. Thereby, a high-quality organic EL display device can be obtained.

  In the present invention, since the mask base material has two layers of a support base material that transmits laser light and a laser absorption layer that absorbs laser light, the support base material is formed after forming a cut line in the laser light irradiation step. By peeling off, the laser absorbing layer surrounded by the tear line can be partly peeled together with the supporting substrate, and a desired opening can be easily formed in the laser absorbing layer. Furthermore, since the mask base material has two layers of the support base material and the laser absorption layer, when the mask base material is irradiated with laser light to form a cut line in the laser absorption layer, the support base material and the mask base material The space between the organic EL substrate can be kept sealed. Thereby, the malfunction that the dust of the laser absorption layer removed by the laser beam scatters to a wide area | region, and the display characteristic of an organic electroluminescent display apparatus falls can be suppressed.

  Further, in the present invention, the spacer portion is formed in a frame shape so as to surround each pixel electrode, and in the laser light irradiation step, laser light is irradiated along the outer periphery of the spacer portion. That is, the portion irradiated with the laser light and the adjacent pixel region are separated by the spacer portion. Thereby, it is possible to more effectively suppress the dust of the laser absorption layer from being scattered in the pixel region, and it is possible to obtain an organic EL display device capable of suppressing a deterioration in display characteristics.

  Furthermore, in the present invention, since the frame-shaped spacer portion is formed so as to surround each pixel electrode, the mask base material is organic when the mask base material is disposed on the organic EL substrate so as to face each other. Contact with the surface of the pixel region of the EL substrate can be prevented. Therefore, for example, as illustrated in FIGS. 1A to 1G, the organic EL layer 5R is formed in the red pixel region R, and subsequently, the organic EL layer 5G is formed in the green pixel region G and the blue pixel region B. 5B are formed in order, and the film is formed when a mask base material is disposed on the organic EL substrate in order to form the organic EL layers 5G and 5B in the green pixel region G and the blue pixel region B. It is possible to prevent the mask base material from coming into contact with the surface of the finished organic EL layer 5R. Thereby, damage and contamination of the organic EL layer due to contact of the mask base material with the surface of the organic EL layer in the pixel region can be prevented, and a high-quality organic EL display device can be obtained.

  Moreover, the mask base material used in the present invention is suitable for manufacturing a large-area organic EL display device, unlike a conventional manufacturing method using a metal mask. Moreover, since it becomes possible to apply to the roll-to-roll manufacturing technique of a mask base material, it becomes possible to aim at the improvement of manufacturing efficiency.

  Here, in the present invention, the “frame-shaped spacer portion” refers to a spacer portion 3 formed so as to surround adjacent pixel electrodes 2 as illustrated in FIG. 2A, for example. In addition, as illustrated in FIG. 2B, when the pixel electrodes 2 in the pixel regions of each color are formed in parallel for each color of the pixel region, the pixel electrodes arranged in parallel for each color of the pixel region are The spacer part formed so that it may separate. 2A and 2B are schematic perspective views showing an example of the organic EL substrate in the present invention, and the reference numerals not described in FIGS. 2A and 2B are the same as those in FIG. The description here is omitted.

  Further, “along the outer periphery of the frame-shaped spacer portion surrounding the pixel electrode” means, for example, a frame-shaped spacer portion 3 surrounding the pixel electrode 2 in the red pixel region R as shown by an arrow illustrated in FIG. It refers to traveling while maintaining a certain distance. FIG. 4 is a schematic plan view showing an example of the organic EL substrate according to the present invention. Reference numerals not described in FIG. 4 can be the same as those in FIG.

  Furthermore, “irradiate a laser beam to form a cut line in the laser absorption layer” means to irradiate a laser beam L from the support substrate 4a side of the mask substrate as illustrated in FIG. 5A, for example. As shown in FIG. 5B, by removing the portion irradiated with the laser beam L in the laser absorption layer 4b disposed as the lower layer, a region for forming an opening in the laser absorption layer 4b is partially It refers to forming a tear line X for peeling.

  Hereinafter, each process in the manufacturing method of the organic EL display device of the present invention will be described.

1. Organic EL substrate forming step The organic EL substrate forming step in the present invention is not particularly limited as long as it is a step capable of forming an organic EL substrate in which a pixel electrode and a spacer portion are formed on the substrate. As the organic EL substrate forming step in the present invention, for example, a pixel electrode forming step for forming a plurality of pixel electrodes for forming a plurality of color pixel regions on the substrate, and a spacer portion in a frame shape so as to surround the pixel electrodes. And a step of forming a spacer part.
Hereinafter, the pixel electrode forming step and the spacer portion forming step will be described as specific examples.

(1) Pixel electrode formation process This process is a process of forming a plurality of pixel electrodes for forming a plurality of color pixel regions on a substrate.
Hereinafter, members used in this step and a specific pixel electrode forming step will be described.

(A) Substrate The substrate in this step supports a pixel electrode, a spacer portion, an organic EL layer, and an upper electrode described later.

  The substrate used in the present invention may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device. Examples of such a substrate material include glass and resin. A gas barrier layer may be formed on the surface of the substrate.

  The thickness of the substrate is appropriately selected depending on the material of the substrate and the use of the organic EL display device, and is specifically about 0.005 mm to 5 mm.

(B) Pixel electrode The pixel electrode in this step is formed in a pattern on the substrate. Such a pixel electrode may or may not have optical transparency.

The pixel electrode may be either an anode or a cathode.
When the pixel electrode is an anode, it is preferable that the resistance is small, and generally a metal material that is a conductive material is used, but an organic compound or an inorganic compound may be used.
For the anode, a conductive material having a large work function is preferably used so that holes can be easily injected. Examples thereof include metals such as Au, Cr, and Mo; inorganic oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide, and indium oxide; and conductive polymers such as metal-doped polythiophene. It is done. These conductive materials may be used alone or in combination of two or more. When two or more types are used, layers made of each material may be stacked.

When the pixel electrode is a cathode, a metal material that is a conductive material is generally used, but an organic compound or an inorganic compound may be used.
For the cathode, it is preferable to use a conductive material having a low work function so that electrons can be easily injected. Examples thereof include magnesium alloys such as MgAg, aluminum alloys such as AlLi, AlCa, and AlMg, and alloys of alkali metals and alkaline earth metals such as Li, Cs, Ba, Sr, and Ca.

  The thickness of the pixel electrode is appropriately adjusted according to the presence or absence of leakage current from the edge portion of the pixel electrode, and can be set to, for example, about 10 nm to 1000 nm, and preferably about 20 nm to 500 nm.

  Further, the interval between adjacent pixel electrodes is not particularly limited as long as a frame-shaped spacer portion can be formed so as to surround each pixel electrode. Specifically, it is preferably in the range of 1 μm to 50 μm, and more preferably in the range of 2 μm to 30 μm. Note that the interval between adjacent pixel electrodes and auxiliary electrodes refers to the distance d shown in FIG.

(C) Pixel electrode formation process This process will not be specifically limited if a pixel electrode can be formed on a board | substrate, The formation method of a general electrode is employable. For example, the vapor deposition method using a mask, the photolithographic method, etc. are mentioned. Examples of the vapor deposition method include a sputtering method and a vacuum vapor deposition method.

(2) Spacer part formation process This process is a process of forming a spacer part in a frame shape so as to surround the pixel electrode.
Hereinafter, the spacer part formed in this process and the concrete spacer part formation process are demonstrated.

(A) Spacer part The spacer part formed in this process will not be specifically limited if it is formed in frame shape so that the said pixel electrode may be enclosed.

  The vertical cross-sectional shape of such a spacer part is not particularly limited as long as the function of the spacer part described above can be exhibited. For example, a forward taper shape, a reverse taper shape, a rectangle and the like can be mentioned, and among them, a forward taper shape is preferable. This is because the upper electrode described later can be uniformly formed on the entire surface, and sufficient conduction can be obtained.

  Moreover, the spacer part formed in this process will not be specifically limited if the top part of an adjacent spacer part does not mutually contact. For example, as illustrated in FIGS. 3A and 3B, the top portions H of the adjacent spacer portions 3 are not in contact with each other and have a predetermined width w between the top portions H of the adjacent spacer portions 3. Formed. The width w between the tops of the adjacent spacer portions is preferably in the range of 0.1 μm to 20 μm, more preferably in the range of 1 μm to 10 μm, and particularly in the range of 1 μm to 5 μm. It is preferable. Since the width between the tops of the adjacent spacer portions is within the above range, when the mask base material is opposed to the organic EL substrate in the vacuum sealing process described later, the space is surrounded by the adjacent spacer portion and the mask base material. Enough space can be secured. As a result, when the space between the organic EL substrate and the mask base material is reduced in pressure, the adhesion at the contact surface between the organic EL substrate and the mask base material is improved. It can suppress that the dust of the removed laser absorption layer scatters. As illustrated in FIG. 3B, the case where the spacer portion 3 is formed on the insulating layer 11 will be described in the section of “(3) Other steps” described later. Description is omitted.

  Also, the spacer portions formed corresponding to the respective pixel electrodes are all formed at the same height. Here, the “same height” means that the height of the spacer portion corresponding to each pixel electrode has the same level. Specifically, it means that the difference in height between the spacer portions is at least within a range of ± 1 μm, especially within a range of ± 0.5 μm, and particularly within a range of ± 0.2 μm. Since the difference in the height of each spacer portion formed in this step is within the above range, the top portion of the spacer portion and the mask base material are opposed to each other with the organic EL substrate and the mask base material facing each other in the vacuum sealing step described later. When placed in contact with each other, the top of each spacer and the mask base material are in close contact with each other with a uniform force, and the space between the organic EL substrate and the mask base material can be uniformly sealed under reduced pressure. Become.

The height of the spacer portion is such that when the organic EL substrate and the mask base material are opposed to each other in the vacuum sealing step described later, the spacer portion can be arranged such that the top of the spacer portion and the mask base material are in contact with each other. If it is, it will not specifically limit. The specific height of the spacer portion is preferably in the range of 0.1 μm to 10 μm, more preferably in the range of 0.5 μm to 5 μm, and particularly in the range of 1 μm to 3 μm. Is preferred. When the height of the spacer portion is within the above range, the volume of the space surrounded by the adjacent spacer portion and the mask base material when the mask base material is opposed to the organic EL substrate in the vacuum sealing process described later. Can be secured sufficiently. Thereby, when the space between the organic EL substrate and the mask base material is depressurized, the gas entering from the outside air through the mask base material, the gas generated by the laser light in the laser light irradiation process described later, etc. Can be sufficiently suppressed, and adhesion at the contact surface between the organic EL substrate and the mask base material can be maintained.
Note that the height of the spacer portion refers to a height h from the bottom surface of the spacer portion 3 to the top portion as illustrated in FIGS. 3 (a) and 3 (b).

  The material used for such a spacer portion is not particularly limited as long as it does not adversely affect the characteristics of the organic EL display device obtained by the present invention, but an insulating material is used. preferable. By forming the spacer portion so as to cover the edge portion of the pixel electrode, problems due to leakage current from the edge portion of the pixel electrode can be prevented, and a function as an insulating layer can be exhibited. Specific examples include photo-curable resins such as photosensitive polyimide resins and acrylic resins, thermosetting resins, and inorganic materials.

(B) Spacer part formation process This process has the process of forming a spacer part in frame shape so that each pixel electrode may be surrounded. As a method for forming the spacer portion, a general method such as a lamination method, a photolithography method, or a printing method can be used. Another example is a method in which a spacer portion is separately formed using a mold or the like, and the spacer portion is bonded using an adhesive or the like so as to surround the pixel region.

(3) Other steps In the present invention, the organic EL substrate forming step may have other steps in addition to the pixel electrode forming step and the spacer portion forming step described above. Examples of other processes include an insulating layer forming process.
Hereinafter, the insulating layer formed in the insulating layer forming step and a specific insulating layer forming step will be described.

(A) Insulating Layer When the present invention includes an insulating layer forming step, an insulating layer 11 is formed so as to cover the edge portion of the pixel electrode 2 formed on the substrate 1 as illustrated in FIG. The spacer portion 3 is formed on the insulating layer 11.

  Since such an insulating layer is formed so as to cover the edge portion of the pixel electrode, it is appropriately formed according to the arrangement of the pixel electrodes. For example, it can be formed in a lattice shape. Note that a pixel region is defined by the insulating layer.

  As a material of the insulating layer, a material of a general insulating layer in an organic EL display device can be used. For example, a photo-curable resin such as a photosensitive polyimide resin or an acrylic resin, a thermosetting resin, an inorganic material, or the like. Can be mentioned.

  The thickness of the insulating layer is not particularly limited as long as it defines a pixel region and can insulate the pixel electrode. For example, the thickness of the insulating layer is within a range of 0.3 μm to 100 μm. Among them, it is preferable to be in the range of 0.5 to 50 μm, and it is particularly preferable to be in the range of 1 to 20 μm.

(B) Insulating layer formation process This process has a process of forming an insulating layer so that the edge part of a pixel electrode may be covered. The method for forming the insulating layer is not particularly limited as long as it is a general insulating layer forming method. For example, spin coating, die coating, dip coating, bar coating, gravure printing, screen, and the like. The printing method etc. are mentioned.

2. Organic EL layer coating step In the organic EL coating step in the present invention, the organic EL substrate having the pixel electrode and the spacer portion formed on the substrate absorbs the supporting base material that transmits laser light and the laser light. A mask substrate composed of a laser absorbing layer to be disposed so that the laser absorbing layer and the organic EL substrate face each other, and the organic EL substrate and the mask substrate are in close contact with each other, and the plurality of colors A laser beam that forms a cut line in the laser absorption layer by irradiating a laser beam from the mask base material side along the outer periphery of the frame-shaped spacer portion surrounding the pixel electrode in the pixel region of one color of And the laser absorption surrounded by the support substrate and the cut line formed in the laser light irradiation step from the organic EL substrate. An opening forming step of peeling the light collecting layer to form an opening in the laser absorption layer, and the light emitting layer of the color on the pixel electrode of the pixel region of the color through the opening An organic EL layer forming step for forming an organic EL layer, and the adhesion step, the laser light irradiation step, the opening forming step, and the organic EL layer forming step are repeated for the number of colors of the plurality of colors. It is a process performed.
Hereinafter, the adhesion process, the laser beam irradiation process, the opening forming process, and the organic EL layer forming process constituting this process will be described.

(1) Adhering Step As the adhering step in the present invention, a support base material that transmits laser light and a laser absorbing layer that absorbs laser light are formed on the organic EL substrate on which the pixel electrode and the spacer portion are formed on the substrate. Is a step of placing the organic EL substrate and the mask base material in close contact with each other so that the laser absorbing layer and the organic EL substrate face each other.
Hereinafter, the mask base material used in this process and a specific adhesion process will be described.

(A) Mask base material The mask base material used in this process is comprised from the support base material which permeate | transmits a laser beam, and the laser absorption layer which absorbs a laser beam.
Hereinafter, the support substrate and the laser absorption layer will be described.

(I) Support base material The support base material which comprises a mask base material permeate | transmits a laser beam.

  Here, the support substrate “transmits laser light” is not particularly limited as long as it can transmit the laser light used in the laser light irradiation process described later. For example, light transmission at a wavelength of 355 nm is possible. The rate is preferably 80% or more.

  In addition, the light transmittance of the support base material in wavelength 355nm can be measured by Shimadzu Corporation ultraviolet visible light spectrophotometer UV-3600, for example.

The material for such a support substrate is not particularly limited as long as it transmits laser light, and examples thereof include a resin material and glass. Among these, a resin material is preferable. Specific examples of the resin material include polyethylene (PE), polycarbonate (PC), polyethylene terephthalate (PET), and cyclic polyolefin (COP). Of these, polyethylene terephthalate is preferable. A resin film made of polyethylene terephthalate has an oxygen permeability lower than that of a resin film made of other materials, and is advantageous when, for example, the following method is used as the adhesion step. That is, the mask base material and the organic EL substrate are disposed so as to face each other in the vacuum space chamber, and the mask base material and the organic EL substrate are taken out from the chamber into the atmospheric pressure space. This is a method in which the mask base material and the organic EL substrate are brought into close contact with each other by providing a difference in pressure between the space between them and the outer peripheral space. In the above method, by using a resin film having a low oxygen permeability such as polyethylene terephthalate as the supporting base material, the side opposite to the side facing the organic EL substrate in the mask base material is used in the laser light irradiation step described later. From the surface, it is possible to more effectively prevent gas from entering the space between the organic EL substrate and the mask base material. Therefore, also in the laser light irradiation process, the difference in pressure between the space between the mask base material and the organic EL substrate and the outer peripheral space can be maintained, and the mask base material and the organic EL substrate can be sufficiently adhered. .
In addition, since the specific contact | adherence process is mentioned later, description here is abbreviate | omitted.

(Ii) Laser absorption layer The laser absorption layer which comprises a mask base material absorbs a laser beam.

  The material used for such a laser absorption layer is not particularly limited as long as it absorbs laser light, and examples thereof include a resin material and a thin metal foil. Among these, a resin material is preferable. Specific examples of the resin material include polyimide.

  The thickness of the laser absorption layer is not particularly limited as long as it is a thickness that can form a cut line in the laser absorption layer by the laser light irradiated in the laser light irradiation step described later. It is appropriately adjusted depending on the type and energy. The thickness of the laser absorption layer is, for example, preferably in the range of 1 μm to 100 μm, more preferably in the range of 1 μm to 50 μm, and particularly preferably in the range of 1 μm to 10 μm.

(Iii) Formation method of mask base material It does not specifically limit as a formation method of the mask base material which has the support base material and laser absorption layer which were mentioned above. For example, a mask substrate may be formed by arranging a laser absorption layer on a support substrate, a mask substrate may be formed by laminating a support substrate and a laser absorption layer, and further a support substrate. Alternatively, the mask base material may be formed by adhering with an easy-adhesion layer capable of easily peeling the laser absorption layer.

  The easy-adhesion layer used when forming the mask base material by adhering the support base material and the laser-absorbing layer with the easy-adhesion layer is based on the adhesive force that allows the support base material and the laser-absorbing layer to be easily peeled off. There is no particular limitation as long as it can be adhered. The “adhesive force that can be easily peeled” here refers to an adhesive strength that can peel the support substrate from the laser absorbing layer in the opening forming step described later.

  The material used for the easy-adhesion layer is not particularly limited as long as it is a material that transmits the laser light irradiated in the laser light irradiation step described later. This is because when the easy-adhesion layer transmits laser light, the laser absorption layer can be irradiated with laser light from the support substrate side through the easy-adhesion layer. In addition, about the material of a specific easily bonding layer, since the material generally used can be used, description here is abbreviate | omitted.

(B) Adhering Step A mask base material composed of a support base material that transmits laser light and a laser absorption layer that absorbs laser light faces the organic EL substrate so that the laser absorption layer and the organic EL substrate face each other. Examples of the method for arranging the organic EL substrate and the mask base material in close contact with each other include the following methods. That is, by providing a difference in the pressure between the space between the mask base material and the organic EL substrate and the outer peripheral space, the mask base material and the organic EL substrate are placed in close contact with each other, or disposed on the organic EL substrate. For example, a method of placing a heavy article that transmits laser light used in a laser light irradiation process described later on the mask base material to closely adhere the mask base material and the organic EL substrate may be used. In the present invention, it is particularly preferable to use the method mentioned above.
Hereinafter, a method for bringing the mask base material and the organic EL substrate into close contact with each other by providing a difference in pressure between the space between the mask base material and the organic EL substrate and the outer peripheral space will be described in detail.

  First, as a method for providing a difference in pressure between the space between the mask base material and the organic EL substrate and the outer peripheral space, for example, the mask base material and the organic EL substrate are brought into close contact with each other in a reduced pressure space, and then Examples include a method of exposing the mask base material and the organic EL substrate to a normal pressure space, and a method of bringing the mask base material and the organic EL substrate into close contact with each other in a decompressed space and then pressurizing the outer periphery of the mask base material and the organic EL substrate. It is done. The above-mentioned “normal pressure space” when the mask base material and the organic EL substrate are exposed to a normal pressure space is, for example, an oxygen concentration and a water concentration of at least 1 ppm or less from the viewpoint of suppressing deterioration of the organic EL substrate. A space filled with an inert gas such as nitrogen or argon is preferable.

Here, as a method of “adhering the mask base material and the organic EL substrate in a decompressed space”, an organic EL in which a sealant is formed on the outer periphery in a vacuum chamber set to a predetermined degree of vacuum. In a method of sealing the space between the organic EL substrate and the mask base material by placing the substrate and the mask base material facing each other and bringing the organic EL substrate and the mask base material into contact with each other, or in a vacuum chamber, The method of sealing the space between an organic electroluminescent board | substrate and a mask base material using a tool etc. is mentioned.
Examples of the “jig” include a magnetic body and a metal layer that is in close contact with the magnetic body by a magnetic force. Specifically, the organic EL substrate and the mask substrate are formed by forming a magnetic body and a metal layer in close contact with the magnetic body by a magnetic force on the outer peripheral portion on the substrate side of the organic EL substrate and the support base material side of the mask base material. The material can be brought into close contact.

The specific degree of vacuum of the above-mentioned “depressed space” is that when the mask base material and the organic EL substrate are exposed to a normal pressure space, or when the outer periphery of the mask base material and the organic EL substrate is pressurized, A laser, which will be described later, is provided by providing a difference in pressure between the space between the base material and the organic EL substrate and the space around the mask base material and the organic EL substrate, and sufficiently adhering the mask base material and the organic EL substrate. There is no particular limitation as long as dust in the laser absorption layer removed by the laser light in the light irradiation step can be prevented from scattering into the pixel region. Specifically, it is preferable that the value of the degree of vacuum is as large as possible as compared with the normal pressure, that is, the space pressure between the mask base material and the organic EL substrate is as small as possible as compared with the normal pressure. Among these, in this step, the space between the organic EL substrate and the mask base material is preferably a vacuum space, and is preferably in the range of, for example, 1 × 10 ⁻⁵ Pa to 1 × 10 ⁴ Pa. Especially, it is preferable to be in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ³ Pa, and it is particularly preferable to be in the range of 1 × 10 ⁻⁵ Pa to 1 × 10 ² Pa.

(2) Laser light irradiation step As the laser light irradiation step in the present invention, the mask base material is formed along the outer periphery of the frame-shaped spacer portion surrounding the pixel electrode of the pixel region of one color among the plurality of colors. This is a step of forming a cut line in the laser absorption layer by irradiating a laser beam from the side. In addition, as a contact | adherence process, as mentioned above, a mask base material and an organic electroluminescent board | substrate are closely_contact | adhered in the vacuum chamber decompressed, Then, gas is made to flow in into a vacuum chamber and it pressurizes, and a mask base material and In the case of using a method of closely attaching the organic EL substrate, this step can be performed by the following method, for example. That is, it is a method of irradiating a laser beam through a laser beam transmitting window or the like installed in a vacuum chamber composed of a transparent substrate such as glass and forming a cut line in the laser absorption layer.
Hereinafter, the laser beam used in this step, the cut line formed in the laser absorption layer in this step, and a specific laser beam irradiation step will be described.

(A) Laser light The laser light used in this step is capable of removing the laser absorbing layer through the support substrate when irradiated with laser light from the support substrate side of the mask substrate. If it is, it will not specifically limit. The wavelength range of the laser beam is not particularly limited as long as it is a wavelength range that can pass through the support substrate in the mask substrate used in the present invention and efficiently remove the laser absorption layer. For example, it is preferable to be in the ultraviolet region. The specific ultraviolet region is preferably within a range of 300 nm to 400 nm, more preferably within a range of 320 nm to 380 nm, and particularly preferably within a range of 340 nm to 360 nm. Examples of laser light having such a wavelength range include solid lasers such as YAG and YVO ₄ , excimer lasers such as XeCl and XeF, and semiconductor lasers.

(B) Cut line The cut line formed in this step is formed by irradiating the above-described laser absorption layer with laser light, and is peeled off together with the supporting substrate in the opening forming step described later. A laser absorbing layer, ie, an opening is defined.

  In this step, when the red pixel region, the green pixel region, and the blue pixel region are randomly arranged, as illustrated in FIGS. 5A and 5B, for example, in the laser absorption layer 4b. In order to form an opening at a position corresponding to the red pixel region R, a cut line X is formed along the outer periphery of a frame-shaped spacer portion surrounding the pixel electrode 2 formed in the red pixel region R. FIGS. 5A and 5B show an example in which an opening is formed at a position corresponding to the red pixel region R in the laser absorption layer 4b. Although not shown, the laser absorption layer has a green color. The same applies to the case where the opening is formed at a position corresponding to the pixel region or the blue pixel region. In FIG. 5A, the spacer portion is omitted for the sake of simplicity.

  In this step, when the red pixel region, the green pixel region, and the blue pixel region are arranged in a line, as illustrated in FIGS. 6A and 6B, for example, the laser absorption layer In order to form an opening at a position corresponding to the red pixel region R in 4b, a cut line along the outer periphery of a frame-shaped spacer portion surrounding the plurality of pixel electrodes 2 in the red pixel region R arranged in a row X may be formed. FIGS. 6A and 6B show an example in which openings are collectively formed at positions corresponding to the red pixel region R in the laser absorption layer 4b. Although not shown, the green pixel region G is illustrated. The same applies to the case where the blue pixel regions B are arranged in a line and the openings are collectively formed at positions corresponding to the green pixel region or the blue pixel region in the laser absorption layer. is there. In FIG. 6A, the spacer portion is omitted for the sake of simplicity of explanation. Furthermore, since reference numerals not described in FIGS. 6A and 6B can be the same as those in FIGS. 1A to 1G, description thereof is omitted here.

  The tear line formed in this step is particularly limited as long as it can peel a part of the laser absorption layer defined by the tear line together with the support base material in the opening forming step described later. For example, as illustrated in FIG. 7A, the cut lines X may be formed in stripes by continuously irradiating laser light, or as illustrated in FIG. 7B. The cut line X may be formed in a dot shape by irradiating the laser beam as a shot.

(C) Laser light irradiation step As a method of irradiating the mask base material with the above-described laser light to form a cut line in the laser absorption layer of the mask base material, a cut line is defined so as to define a region for forming an opening. Although it is not particularly limited as long as it is a method that can be formed, in the case of forming a plurality of openings, cut lines formed according to the number of openings are collectively formed using a plurality of laser beams. It is preferable to do. This is because the manufacturing efficiency can be improved.

(3) Opening part formation process The opening part formation process in this invention peels the said laser absorption layer enclosed by the cut line formed in the said support base material and the said laser beam irradiation process from the said organic electroluminescent board | substrate. And forming an opening in the laser absorption layer.
Hereinafter, the opening formed in this step and a specific opening forming step will be described.

(A) Opening The opening formed in this step peels off the laser absorbing layer surrounded by the support base and the cut line formed in the laser light irradiation step from the organic EL substrate. It is formed by.

  FIG. 8A shows an example in which an opening P is formed in the laser absorption layer 4b in this step when the cut line X is formed as illustrated in FIG. 5B in the laser light irradiation step. It is a schematic plan view which shows. FIG. 8B shows the case where the opening P is formed in the laser absorption layer 4b in this step when the cut line X is formed as illustrated in FIG. 6B in the laser light irradiation step. It is a schematic plan view which shows an example. As described above, the shape of the opening formed in this step is appropriately selected according to the cut line formed in the laser light irradiation step described above, and is not particularly limited.

(B) Opening part formation process This process opens an opening to a laser absorption layer by peeling the said laser absorption layer surrounded by the support base material and the cutting line formed in the said laser beam irradiation process from an organic electroluminescent board | substrate. The method is not particularly limited as long as the method can form the part.

  In this step, when the supporting base material is peeled from the organic EL substrate, a part of the laser absorption layer surrounded by the cut line is peeled together with the supporting base material. Therefore, it is preferable that the supporting substrate and a part of the laser absorption layer surrounded by the cut line have predetermined adhesion. As a method for imparting a predetermined adhesion between the support substrate and a part of the laser absorption layer surrounded by the cut line, for example, a predetermined energy is applied to a part of the laser absorption layer to be peeled off together with the support substrate. The method of irradiating the laser beam which has and welding a part of laser absorption layer to a support base material is mentioned. Specifically, first, as illustrated in FIG. 9A, the cut line X is formed in the laser absorption layer 4b by irradiating the laser light L from the support base material 4a side of the mask base material. FIG. 9A is an example showing a case where the cut line X is formed along the outer periphery of the frame-shaped spacer portion 3 formed so as to surround the pixel electrode 2 in the red pixel region R. Next, as illustrated in FIG. 9B, the laser absorbing layer 4 b in the region corresponding to the red pixel region R surrounded by the cut line X is formed on the mask base material from the support base material 4 a side. The laser beam Ls having an energy weaker than that of the laser beam L used in (a) is irradiated. Thereby, the laser absorption layer 4b in the region corresponding to the red pixel region R is welded to the support base material 4a, and when the support base material 4a is peeled from the organic EL substrate as illustrated in FIG. 9C. The laser absorption layer 4b in the region corresponding to the red pixel region R can be easily peeled from the organic EL substrate together with the support base 4a. In addition, about the code | symbol which is not demonstrated in Fig.9 (a)-(c), since it can be made the same as that of FIG. 1, description here is abbreviate | omitted.

(4) Organic EL layer forming step In the organic EL layer forming step of the present invention, at least the light emitting layer of the color is provided on the pixel electrode of the pixel region of one color among the plurality of colors through the opening. This is a step of forming an organic EL layer.
Hereinafter, the organic EL layer formed in this step and a specific organic EL layer forming step will be described.

(A) Organic EL layer As an organic layer which comprises an organic EL layer, a positive hole injection layer, a positive hole transport layer, an electron injection layer, an electron transport layer, etc. other than a light emitting layer are mentioned.
Hereinafter, each organic layer constituting the organic EL layer will be described.

(I) Light emitting layer In this step, a light emitting layer of a plurality of colors is formed. The type of luminescent color is appropriately selected according to the application of the organic EL display device to be manufactured. For example, three luminescent layers of red, green, and blue may be formed. , Blue and white light emitting layers of four colors may be formed.

  The light emitting material used for the light emitting layer may be any material that emits fluorescence or phosphorescence, and examples thereof include dye materials, metal complex materials, and polymer materials. Note that specific pigment materials, metal complex materials, and polymer materials can be the same as those generally used, and thus description thereof is omitted here.

  The thickness of the light-emitting layer is not particularly limited as long as it can provide a function of emitting light by providing a recombination field of electrons and holes, and may be, for example, about 10 nm to 500 nm. it can.

(Ii) Hole Injecting and Transporting Layer As the organic EL layer formed in this step, a hole injecting and transporting layer may be formed between the light emitting layer and the anode.
The hole injection transport layer may be a hole injection layer having a hole injection function, or a hole transport layer having a hole transport function, and the hole injection layer and the hole transport layer are laminated. And may have both a hole injection function and a hole transport function.

  The material used for the hole injecting and transporting layer is not particularly limited as long as it can stabilize the injection and transportation of holes to the light emitting layer, and a general material can be used. .

  The thickness of the hole injecting and transporting layer is not particularly limited as long as the hole injecting function and the hole transporting function are sufficiently exhibited. Specifically, the thickness is in the range of 0.5 nm to 1000 nm, particularly 10 nm to It is preferable to be in the range of 500 nm.

(Iii) Electron Injecting and Transporting Layer As the organic EL layer formed in this step, an electron injecting and transporting layer may be formed between the light emitting layer and the cathode.
The electron injection / transport layer may be an electron injection layer having an electron injection function, may be an electron transport layer having an electron transport function, or may be a laminate of an electron injection layer and an electron transport layer. It may have both an electron injection function and an electron transport function.

The material used for the electron injection layer is not particularly limited as long as it can stabilize the injection of electrons into the light emitting layer, and the material used for the electron transport layer is from the cathode. The material is not particularly limited as long as the injected electrons can be transported to the light emitting layer.
A general material can be used as a specific material used for the electron injection layer and the electron transport layer.

  The thickness of the electron injection / transport layer is not particularly limited as long as the electron injection function and the electron transport function are sufficiently exhibited.

(B) Organic EL layer formation process This process has the process of forming the organic EL layer mentioned above on a pixel electrode. Here, a case where the organic EL layer is laminated in the order of the hole injection transport layer, the light emitting layer, and the electron injection transport layer will be described.

  The method for forming the hole injecting and transporting layer is not particularly limited as long as it can be formed on at least the pixel electrode, and is appropriately selected according to the kind of material. For example, a wet process in which a coating solution for forming a hole injecting and transporting layer in which a material or the like is dissolved or dispersed in a solvent, a dry process such as a vacuum deposition method using the above-described mask substrate, and the like can be given.

  Next, as a formation method of a light emitting layer, dry processes, such as a vacuum evaporation method using the mask base material mentioned above, are mentioned.

  Next, the method for forming the electron injecting and transporting layer is not particularly limited as long as it can be formed on the light emitting layer, and is appropriately selected according to the type of material. For example, a dry process such as a wet process in which a coating solution for forming an electron injecting and transporting layer in which a material or the like is dissolved or dispersed in a solvent, or a vacuum deposition method using the above-described mask base material is used.

(5) Organic EL layer coating step In the organic EL layer coating step in the present invention, there is a method of coating each organic layer in the following process order. For example, an opening is formed in the pixel region of the first color of the laser absorption layer to form a plurality of organic layers such as a hole injecting and transporting layer, a light emitting layer, and an electron injecting and transporting layer. Forming a plurality of organic layers such as a hole injecting and transporting layer, a light emitting layer, and an electron injecting and transporting layer in the pixel region of the second color of the laser absorption layer using a material, A method of coating each organic layer by repeating the number of colors, or forming a hole injection transport layer by forming an opening in the pixel region of the first color of the laser absorption layer, and then the laser absorption layer The step of forming an opening in the pixel region of the second color and forming the hole injecting and transporting layer is repeated for the number of colors of the pixel region, and then the light emitting layer and the electron injecting and transporting layer are formed by the same method. By performing the process, there is a method to paint each organic layer separately It is. In the present invention, it is preferable from the viewpoint of production efficiency that each organic layer is applied separately according to the order of steps shown in the former.

  In addition, in the organic EL layer coating step, in order to form the organic EL layer in the pixel region of the first color, the above-described adhesion step, laser light irradiation step, opening formation step, and organic EL layer formation step are performed. After performing, the laser absorption layer peeling process which peels the laser absorption layer which has an opening part in the pixel area of the 1st color from an organic EL substrate is performed, Then, an organic EL layer is applied to the pixel area of the 2nd color Each process for forming is repeated. Therefore, for example, as shown in FIG. 1E, after the process using the laser absorption layer 4b having an opening in the red pixel region R is completed, the laser absorption having the opening in the red pixel region R is completed. A laser absorption layer peeling process for peeling the layer 4b from the organic EL substrate is performed, and then the process proceeds to a process of forming an organic EL layer by forming an opening in a green or blue pixel region.

  The method of peeling the laser absorption layer from the organic EL substrate is not particularly limited, for example, a method of attaching a base material having an adhesive layer to the laser absorption layer and peeling the laser absorption layer from the organic EL substrate, Examples thereof include a method of peeling the laser absorption layer from the organic EL substrate by a physical method using a peeler or the like. In addition, by providing a difference in the pressure between the space between the mask base material and the organic EL substrate and the outer peripheral space, when the mask base material and the organic EL substrate are sealed under reduced pressure, they absorb laser. The following method is mentioned as a layer peeling process. That is, a laser beam is irradiated to a predetermined position of the laser absorption layer to form a through hole, and a gas is allowed to flow between the laser absorption layer sealed under reduced pressure from the through hole and the organic EL substrate, so that the laser absorption layer And the method of peeling a laser absorption layer from an organic EL substrate by eliminating the difference in pressure between the space between the organic EL substrate and the outer peripheral space. For example, as shown in FIGS. 1 (e) and 8 (a), the through hole is formed in the green pixel region G and the laser absorbing layer 4b having an opening in the red pixel region R. It is formed on the laser absorption layer 4b corresponding to the blue pixel region B.

Specifically, the organic EL layer coating step can be performed in the following order of steps.
Hereinafter, specific examples of the organic EL layer coating step in the present invention will be described with reference to the drawings.
For example, the organic EL layer coating step can be performed in the order of steps illustrated in FIG. That is, by performing an adhesion process after the organic EL substrate formation process, and then performing a laser light irradiation process, a cut line is formed so as to surround the area corresponding to the pixel area of the first color in the laser absorption layer, and thereafter Then, an opening portion forming step is performed in which an opening portion is formed by peeling off a part of the laser absorbing layer surrounded by the support base and the cut line. Using the laser absorption layer having an opening in the first color pixel region thus obtained, a hole injection transport layer, a light emitting layer, and an electron injection transport layer are sequentially formed in the first color pixel region. To do. Finally, a laser absorption layer peeling process is performed for peeling the laser absorption layer having an opening in the pixel area of the first color from the organic EL substrate. Similar to the method of forming the organic EL layer in the first color pixel region, the laser absorption having the opening in the second color pixel region by performing the adhesion step, the laser light irradiation step, and the opening formation step. A layer is formed, and a hole injecting and transporting layer, a light emitting layer, and an electron injecting and transporting layer are sequentially formed in the pixel region of the second color using the laser absorption layer. Finally, a laser absorption layer peeling process is performed for peeling the laser absorption layer having an opening in the pixel region of the second color from the organic EL substrate. As shown by the arrows in FIG. 10A, the hole injection / transport layer, the light-emitting layer, and the electron injection / transport layer are separately applied by repeating the above-described process according to the type of the pixel region. By performing the upper electrode forming step, the organic EL display device of the present invention can be obtained.

  In addition, the organic EL layer coating step can be performed in the order of steps illustrated in FIG. That is, an organic EL substrate forming step is performed, and a hole injecting and transporting layer forming step for forming a hole injecting and transporting layer on the obtained organic EL substrate is performed. Thereafter, an adhesion process is performed, and then a laser beam irradiation process is performed to form a cut line so as to surround an area corresponding to the pixel area of the first color in the laser absorption layer. An opening forming step of forming an opening by peeling a part of the laser absorption layer surrounded by the line is performed. A light emitting layer is formed in the pixel region of the first color using the laser absorption layer having an opening in the pixel region of the first color obtained in this way. Finally, a laser absorption layer peeling process is performed for peeling the laser absorption layer having an opening in the pixel area of the first color from the organic EL substrate. Similar to the method of forming the light emitting layer in the first color pixel region, the laser absorbing layer having the opening in the second color pixel region by performing the adhesion process, the laser light irradiation process, and the opening forming process. And a light emitting layer is formed in the pixel region of the second color using the laser absorption layer. Finally, a laser absorption layer peeling process is performed for peeling the laser absorption layer having an opening in the pixel region of the second color from the organic EL substrate. As shown by the arrow in FIG. 10B, the above-described steps are repeated according to the type of the pixel region to separately coat the light emitting layer, and finally the upper electrode forming step described later is performed to thereby complete the present invention. An organic EL display device can be obtained.

3. Upper electrode formation process The upper electrode formation process in this invention will not be specifically limited if an upper electrode can be formed on the said organic EL board | substrate with which the said organic EL layer was formed.
Hereinafter, the upper electrode formed in this step and a specific upper electrode forming step will be described.

(1) Upper electrode The upper electrode in this process is formed on the organic EL substrate on which the organic EL layer is formed. Such an upper electrode may or may not have optical transparency.

The upper electrode may be either an anode or a cathode.
When the upper electrode is an anode, it is preferable that the resistance is small, and generally a metal material which is a conductive material is used, but an organic compound or an inorganic compound may be used.
For the anode, a conductive material having a large work function is preferably used so that holes can be easily injected. Examples thereof include metals such as Au, Cr, and Mo; inorganic oxides such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide, and indium oxide; and conductive polymers such as metal-doped polythiophene. It is done. These conductive materials may be used alone or in combination of two or more. When two or more types are used, layers made of each material may be stacked.

When the upper electrode is a cathode, a metal material that is a conductive material is generally used, but an organic compound or an inorganic compound may be used.
For the cathode, it is preferable to use a conductive material having a low work function so that electrons can be easily injected. Examples thereof include magnesium alloys such as MgAg, aluminum alloys such as AlLi, AlCa, and AlMg, and alloys of alkali metals and alkaline earth metals such as Li, Cs, Ba, Sr, and Ca.

(2) Upper electrode forming step As a method for forming the upper electrode, a general electrode forming method can be used. For example, a PVD method such as a vacuum evaporation method, a sputtering method, an EB evaporation method, an ion plating method, Or CVD method etc. can be mentioned.

4). Other Steps The present invention is not particularly limited as long as it has the steps described above, and may have other steps. As another process, the sealing process which seals an organic EL display device with a sealing substrate is mentioned, for example.
Hereinafter, the sealing substrate will be described.

  The sealing substrate may or may not have optical transparency. Further, the sealing substrate may or may not have flexibility, and is appropriately selected depending on the use of the organic EL display device.

The material of the sealing substrate is not particularly limited as long as it is a material generally used for the sealing substrate. For example, inorganic materials such as quartz and glass, acrylic resin, and cyclohexane called COP are used. Examples thereof include resins such as olefin polymers, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyimide, polyamide imide, polyether sulfone, polyether imide, and polyether ether ketone.
A gas barrier layer may be formed on the surface of the resin sealing substrate.

  The thickness of the sealing substrate is appropriately selected depending on the material of the sealing substrate and the use of the organic EL display device. Specifically, the thickness of the sealing substrate is about 0.001 mm to 5 mm.

B. Organic EL display device forming mask base material The organic EL display device forming mask base material of the present invention is used in the above-described organic EL display device manufacturing method, and a supporting base material that transmits laser light; It has the laser absorption layer which is formed on the said support base material and absorbs a laser beam, It is characterized by the above-mentioned. Hereinafter, the mask substrate for forming an organic EL display device may be abbreviated as a mask substrate.

  The mask base material of this invention can be used for the manufacturing method of the above-mentioned organic electroluminescence display. Therefore, the following effects can be obtained. That is, in the present invention, since the mask base material has two layers of a support base material that transmits laser light and a laser absorption layer that absorbs laser light, the support base material is formed after forming a cut line in the laser light irradiation step. By peeling off, the laser absorbing layer surrounded by the tear line can be partly peeled together with the supporting substrate, and a desired opening can be easily formed in the laser absorbing layer. Furthermore, since the mask base material has two layers of the support base material and the laser absorption layer, when the mask base material is irradiated with laser light to form a cut line in the laser absorption layer, the support base material and the mask base material The space between the organic EL substrate can be kept sealed. Thereby, the malfunction that the dust of the laser absorption layer removed by the laser beam scatters to a wide area | region, and the display characteristic of an organic electroluminescent display apparatus falls can be suppressed.

  About the said mask base material, since it is the same as that of what was described in the above-mentioned "A. Manufacturing method of an organic EL display device 2. Organic EL layer coating process (1) Adhesion process (a) Mask base material", The description here is omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Pixel electrode 3 ... Spacer part 4a ... Support base material 4b ... Laser absorption layer 5 ... Organic EL layer 6 ... Upper electrode 10 ... Organic EL substrate 100 ... Organic EL display device X ... Cut line P ... Opening part

Claims (2)

A substrate, a plurality of pixel electrodes formed on the substrate and forming pixel regions of a plurality of colors, a spacer portion formed in a frame shape so as to surround the pixel electrodes, and at least a light emitting layer formed in the pixel region An organic electroluminescence display device manufacturing method for manufacturing an organic electroluminescence display device having an organic electroluminescence layer of a plurality of colors and an upper electrode formed on the organic electroluminescence layer,
The manufacturing method of the organic electroluminescence display device includes an organic electroluminescence layer coating step for coating the organic electroluminescence layer of the plurality of colors on the pixel region,
The organic electroluminescence layer coating step is composed of a support base material that transmits laser light and a laser absorption layer that absorbs laser light on the organic electroluminescence substrate in which the pixel electrode and the spacer portion are formed on the substrate. An adhesion step of placing the mask base material so that the laser absorption layer and the organic electroluminescence substrate face each other, and bringing the organic electroluminescence substrate and the mask base material into close contact with each other;
A laser beam is irradiated from the mask substrate side along the outer periphery of the frame-shaped spacer portion surrounding the pixel electrode of the pixel region of one color of the plurality of colors to form a cut line in the laser absorption layer Laser light irradiation process to
Forming an opening in the laser absorption layer by peeling the laser absorption layer surrounded by the support substrate and the cut line formed in the laser light irradiation step from the organic electroluminescence substrate Process,
An organic electroluminescence layer forming step of forming an organic electroluminescence layer having the light emitting layer of the color on the pixel electrode of the pixel region of the color through the opening;
The method for manufacturing an organic electroluminescence display device, wherein the adhesion step, the laser light irradiation step, the opening portion formation step, and the organic electroluminescence layer formation step are repeated for the number of colors of the plurality of colors. A mask base material for forming an organic electroluminescence display device used in the method for producing an organic electroluminescence display device according to claim 1,
A support substrate that transmits laser light;
A mask base material for forming an organic electroluminescence display device, comprising: a laser absorption layer that is formed on the support base material and absorbs laser light.

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