JP2015073271A - オーバーモード音響反射体層を用いた温度補償型バルク弾性波デバイス - Google Patents

オーバーモード音響反射体層を用いた温度補償型バルク弾性波デバイス Download PDF

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Publication number
JP2015073271A
JP2015073271A JP2014202936A JP2014202936A JP2015073271A JP 2015073271 A JP2015073271 A JP 2015073271A JP 2014202936 A JP2014202936 A JP 2014202936A JP 2014202936 A JP2014202936 A JP 2014202936A JP 2015073271 A JP2015073271 A JP 2015073271A
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JP
Japan
Prior art keywords
layer
reflector
baw device
baw
acoustic wave
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JP2014202936A
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English (en)
Japanese (ja)
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JP2015073271A5 (enExample
Inventor
アイグナー、ロバート
Aigner Robert
タジク、アリレザ
Tajic Alireza
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Qorvo US Inc
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Triquint Semiconductor Inc
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Publication of JP2015073271A publication Critical patent/JP2015073271A/ja
Publication of JP2015073271A5 publication Critical patent/JP2015073271A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175—Acoustic mirrors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H03H2003/025—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks the resonators or networks comprising an acoustic mirror
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2014202936A 2013-10-02 2014-10-01 オーバーモード音響反射体層を用いた温度補償型バルク弾性波デバイス Pending JP2015073271A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/044,782 2013-10-02
US14/044,782 US9219517B2 (en) 2013-10-02 2013-10-02 Temperature compensated bulk acoustic wave devices using over-moded acoustic reflector layers

Publications (2)

Publication Number Publication Date
JP2015073271A true JP2015073271A (ja) 2015-04-16
JP2015073271A5 JP2015073271A5 (enExample) 2017-11-09

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Family Applications (1)

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JP2014202936A Pending JP2015073271A (ja) 2013-10-02 2014-10-01 オーバーモード音響反射体層を用いた温度補償型バルク弾性波デバイス

Country Status (2)

Country Link
US (1) US9219517B2 (enExample)
JP (1) JP2015073271A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018535595A (ja) * 2015-10-21 2018-11-29 コーボ ユーエス，インコーポレイティド 音響振動のせん断モードおよび縦モードの反射を増強した共振器構造体
WO2024242267A1 (ko) * 2023-05-24 2024-11-28 서울대학교산학협력단 탄성파의 전방위 단일모드 반사체

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8601655B2 (en) * 2007-08-14 2013-12-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Process of making a bulk acoustic wave structure with an aluminum copper nitride piezoelectric layer
US9735755B2 (en) * 2015-08-20 2017-08-15 Qorvo Us, Inc. BAW resonator having lateral energy confinement and methods of fabrication thereof
JP6572812B2 (ja) * 2016-03-23 2019-09-11 横浜ゴム株式会社 音響透過性部材
GB2600838A (en) 2016-10-20 2022-05-11 Skyworks Solutions Inc Elastic wave device with sub-wavelength thick piezoelectric layer
US11223342B2 (en) 2016-12-07 2022-01-11 Qorvo Us, Inc. Bulk acoustic wave sensor having an overmoded resonating structure
EP3556014B1 (en) 2017-01-05 2021-03-10 Huawei Technologies Co., Ltd. Bragg mirror, resonator and filter device
DE102018108608B3 (de) * 2018-04-11 2019-08-29 RF360 Europe GmbH BAW-Resonator mit verbesserter Leistungsbeständigkeit und Wärmeresistenz und BAW-Resonator umfassendes HF-Filter
DE102018117248B4 (de) * 2018-07-17 2020-03-19 RF360 Europe GmbH BAW-Resonator mit einem hohen Q-Wert und Störmodenunterdrückung
US11362638B2 (en) * 2020-08-19 2022-06-14 RF360 Europe GmbH Bulk acoustic wave resonator with a heatsink region and electrical insulator region
CN112953447B (zh) 2021-02-09 2023-08-11 偲百创(深圳)科技有限公司 谐振器及电子设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235886A (ja) * 2003-01-29 2004-08-19 Kyocera Kinseki Corp 圧電薄膜素子
US20080204857A1 (en) * 2007-02-28 2008-08-28 Maxim Integrated Products, Inc. Bragg mirror optimized for shear waves
JP2009521141A (ja) * 2005-12-21 2009-05-28 エプコス アクチエンゲゼルシャフト バルク超音波により動作する共振器
JP2013098991A (ja) * 2011-11-02 2013-05-20 Triquint Semiconductor Inc 電気ドメインにおける音響共振器の温度補償

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6107721A (en) 1999-07-27 2000-08-22 Tfr Technologies, Inc. Piezoelectric resonators on a differentially offset reflector
US6420820B1 (en) 2000-08-31 2002-07-16 Agilent Technologies, Inc. Acoustic wave resonator and method of operating the same to maintain resonance when subjected to temperature variations
DE10262056B4 (de) 2002-11-07 2008-08-28 Infineon Technologies Ag BAW-Resonator mit akustischem Reflektor und Filterschaltung
US7400217B2 (en) 2003-10-30 2008-07-15 Avago Technologies Wireless Ip Pte Ltd Decoupled stacked bulk acoustic resonator band-pass filter with controllable pass bandwith
DE602004013534D1 (de) 2004-03-09 2008-06-19 Infineon Technologies Ag Akustischer Volumenwellen - Filter und Verfahren zur Vermeidung unerwünschter Seitendurchgänge
DE102004035812A1 (de) * 2004-07-23 2006-03-16 Epcos Ag Mit akustischen Volumenwellen arbeitender Resonator
DE102004062312B3 (de) 2004-12-23 2006-06-01 Infineon Technologies Ag Piezoelektrischer Resonator mit verbesserter Temperaturkompensation und Verfahren zum Herstellen desselben
FR2951024B1 (fr) * 2009-10-01 2012-03-23 St Microelectronics Sa Procede de fabrication de resonateur baw a facteur de qualite eleve
FR2951026B1 (fr) * 2009-10-01 2011-12-02 St Microelectronics Sa Procede de fabrication de resonateurs baw sur une tranche semiconductrice
US8253513B2 (en) 2010-03-16 2012-08-28 Hao Zhang Temperature compensated thin film acoustic wave resonator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235886A (ja) * 2003-01-29 2004-08-19 Kyocera Kinseki Corp 圧電薄膜素子
JP2009521141A (ja) * 2005-12-21 2009-05-28 エプコス アクチエンゲゼルシャフト バルク超音波により動作する共振器
US20080204857A1 (en) * 2007-02-28 2008-08-28 Maxim Integrated Products, Inc. Bragg mirror optimized for shear waves
JP2013098991A (ja) * 2011-11-02 2013-05-20 Triquint Semiconductor Inc 電気ドメインにおける音響共振器の温度補償

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018535595A (ja) * 2015-10-21 2018-11-29 コーボ ユーエス，インコーポレイティド 音響振動のせん断モードおよび縦モードの反射を増強した共振器構造体
WO2024242267A1 (ko) * 2023-05-24 2024-11-28 서울대학교산학협력단 탄성파의 전방위 단일모드 반사체

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US20150094000A1 (en) 2015-04-02
US9219517B2 (en) 2015-12-22

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