JP2015061757A - Copper foil with carrier and laminated board, printed wiring board and electronic device using same, as well as method for producing printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a copper foil with a carrier which adheres suitably to a resin and is excellent in transparency of a resin after removing the copper foil by etching and to provide a laminated board using the same.SOLUTION: There is provided a copper foil with a carrier in which roughened particles are formed on an ultrathin copper layer surface by a roughening treatment, wherein the average roughness Rz of TD of the roughening-treated surface of the ultrathin copper layer is 0.20 to 0.80 μm, the 60-degree glossiness of MD of the roughening-treated surface is 76 to 350% and the ratio A/B between the surface area A of the roughened particles and the surface area B obtained when the roughened particles are planarly viewed from the surface side of the copper foil is 1.90 to 2.40.

Description

  The present invention relates to a copper foil with a carrier and a laminated board, a printed wiring board, an electronic device, and a printed wiring board manufacturing method using the same, and in particular, the transparency of the remaining resin after etching the copper foil is required. The present invention relates to a copper foil with a carrier suitable for a field to be used, a laminated board using the same, a printed wiring board, an electronic device, and a method for manufacturing a printed wiring board.

  In a small electronic device such as a smartphone or a tablet PC, a flexible printed wiring board (hereinafter referred to as FPC) is adopted because of easy wiring and light weight. In recent years, with the enhancement of functions of these electronic devices, the signal transmission speed has been increased, and impedance matching has become an important factor in FPC. As a measure for impedance matching with respect to an increase in signal capacity, a resin insulation layer (for example, polyimide) serving as a base of an FPC has been increased in thickness. On the other hand, processing such as bonding to a liquid crystal substrate and mounting of an IC chip is performed on the FPC, but the alignment at this time is the resin insulation remaining after etching the copper foil in the laminate of the copper foil and the resin insulating layer The visibility of the resin insulation layer is important because it is performed through a positioning pattern that is visible through the layer.

  Moreover, the copper clad laminated board which is a laminated board of copper foil and a resin insulating layer can also be manufactured even if it uses the rolled copper foil by which roughening plating was given to the surface. This rolled copper foil usually uses tough pitch copper (oxygen content of 100 to 500 ppm by weight) or oxygen-free copper (oxygen content of 10 ppm by weight or less) as a raw material, and after hot rolling these ingots, It is manufactured by repeating cold rolling and annealing to a thickness.

As such a technique, for example, in Patent Document 1, a polyimide film and a low-roughness copper foil are laminated, and a light transmittance at a wavelength of 600 nm of the film after copper foil etching is 40% or more, a haze value. An invention relating to a copper clad laminate having (HAZE) of 30% or less and an adhesive strength of 500 N / m or more is disclosed.
Further, Patent Document 2 has an insulating layer in which a conductive layer made of electrolytic copper foil is laminated, and the light transmittance of the insulating layer in the etching region when the circuit is formed by etching the conductive layer is 50% or more. In a flexible printed wiring board for chip-on-flex (COF), the electrolytic copper foil has a rust-proofing layer made of a nickel-zinc alloy on an adhesive surface bonded to an insulating layer, and the surface roughness (Rz) of the adhesive surface ) Is 0.05 to 1.5 μm, and the specular gloss at an incident angle of 60 ° is 250 or more, and an invention relating to a flexible printed wiring board for COF is disclosed.
Moreover, in patent document 3, in the processing method of the copper foil for printed circuits, after the roughening process by copper-cobalt-nickel alloy plating on the surface of copper foil, a cobalt-nickel alloy plating layer is formed, and also zinc-nickel An invention relating to a method for treating a copper foil for printed circuit, characterized by forming an alloy plating layer is disclosed.

  In addition, when the signal transmission speed is increased due to the higher functionality of electronic devices, the high frequency board is required to reduce transmission loss in order to ensure the quality of the output signal. The transmission loss mainly consists of a dielectric loss due to the resin (substrate side) and a conductor loss due to the conductor (copper foil side). The dielectric loss decreases as the dielectric constant and dielectric loss tangent of the resin decrease. In a high-frequency signal, the conductor loss is mainly caused by a decrease in the cross-sectional area through which the current flows due to the skin effect that only the surface of the conductor flows as the frequency increases, and the resistance increases.

  Patent Document 4 discloses an electrolytic copper foil characterized in that a part of the surface of the copper foil is a concavo-convex surface having a surface roughness of 2 to 4 μm made of bump-shaped protrusions. And according to this, it describes that the electrolytic copper foil excellent in the high frequency transmission characteristic can be provided.

JP 2004-98659 A WO2003 / 096776 Japanese Patent No. 2849059 JP 2004-244656 A

In Patent Document 1, a low-roughness copper foil obtained by improving adhesion with an organic treatment agent after blackening treatment or plating treatment is broken due to fatigue in applications where flexibility is required for a copper-clad laminate. May be inferior in resin transparency.
Moreover, in patent document 2, the roughening process is not made and the adhesive strength of copper foil and resin is low and inadequate in uses other than the flexible printed wiring board for COF.
Furthermore, in the processing method described in Patent Document 3, Cu-Co-Ni fine processing on the copper foil was possible, but the resin after bonding the copper foil with the resin and removing it by etching was excellent. Transparency is not realized.
In Patent Documents 1 to 3, reduction of transmission loss cannot be realized.
In Patent Document 4, excellent transparency cannot be realized for the resin after the copper foil is bonded to the resin and removed by etching.
The present invention provides a copper foil with a carrier that adheres favorably to a resin and is excellent in the transparency of a resin after the copper foil is removed by etching and has a small signal transmission loss, and a laminate using the same.

  As a result of intensive research, the present inventors have found that the copper foil in which the roughened particles are formed on the surface by the roughening treatment, the surface average roughness Rz on the side adhered to the resin substrate, the glossiness, and the roughness. The ratio of the surface area of the roughened particles to the area obtained when the roughened particles are viewed from the copper foil surface side affects the resin transparency and the signal transmission loss after the copper foil is etched away. It was.

  The present invention completed on the basis of the above knowledge is, in one aspect, a copper foil with a carrier having a carrier, an intermediate layer, and an ultrathin copper layer in this order, and is roughened by a roughening treatment on the surface of the ultrathin copper layer. Particles are formed, the TD average roughness Rz of the roughened surface is 0.20 to 0.80 μm, the 60 degree gloss of MD of the roughened surface is 76 to 350%, and the roughened particles The carrier-attached copper foil having a ratio A / B of 1.90 to 2.40 of the surface area A and the area B obtained when the roughened particles are planarly viewed from the copper foil surface side.

  In one embodiment of the copper foil with a carrier according to the present invention, the 60-degree glossiness of the MD is 90 to 250%.

  In another embodiment of the copper foil with a carrier according to the present invention, the average roughness Rz of the TD is 0.30 to 0.60 μm.

  In another embodiment of the copper foil with a carrier which concerns on this invention, said A / B is 2.00-2.20.

  In still another embodiment of the copper foil with a carrier according to the present invention, the ratio C of the 60 ° glossiness of MD and 60 ° glossiness of TD on the roughened surface (C = (60 ° glossiness of MD)) / (60 degree gloss of TD)) is 0.80 to 1.40.

  In still another embodiment of the copper foil with a carrier according to the present invention, the ratio C of the 60 ° glossiness of MD and 60 ° glossiness of TD on the roughened surface (C = (60 ° glossiness of MD)) / (60 degree gloss of TD)) is 0.90 to 1.35.

  In still another embodiment of the copper foil with a carrier according to the present invention, the ultra-thin copper layer is bonded to both surfaces of a 50 μm thick resin substrate from the roughened surface side, and then the copper on both sides is etched. When the foil is removed, the haze value of the resin substrate is 20 to 70%.

  In still another embodiment of the carrier-attached copper foil according to the present invention, the carrier-attached copper foil is bonded to both surfaces of a 50 μm thick resin substrate from the roughened surface side of the ultrathin copper layer, When the copper foils on both sides are removed by etching, the haze value of the resin substrate becomes 20 to 70%.

  In still another embodiment of the copper foil with carrier according to the present invention, the roughened surface of the ultra-thin copper layer of the copper foil with carrier is copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium and zinc. Any one or more selected from the group consisting of:

  In still another embodiment of the copper foil with carrier according to the present invention, the copper foil with carrier comprises a resin layer on the roughened surface of the ultrathin copper layer.

  In still another embodiment of the copper foil with a carrier according to the present invention, the resin layer includes a dielectric.

  In still another embodiment of the copper foil with a carrier according to the present invention, the ultrathin copper layer is provided on both surfaces of the carrier.

  In still another embodiment of the copper foil with a carrier according to the present invention, a roughening treatment layer is provided on the surface of the carrier opposite to the ultrathin copper layer side.

  In still another aspect, the present invention is a laminated board produced by laminating the copper foil with carrier of the present invention and a resin substrate.

  In yet another aspect, the present invention is a copper foil before the roughening treatment used for the copper foil with a carrier of the present invention.

  In still another aspect, the present invention is a printed wiring board using the copper foil with a carrier of the present invention.

  In still another aspect, the present invention is an electronic device using the printed wiring board of the present invention.

  In still another aspect, the present invention is a method of manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards of the present invention.

  In yet another aspect, the present invention includes a step of connecting at least one printed wiring board of the present invention and another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention, This is a method for manufacturing a printed wiring board in which two or more printed wiring boards are connected.

  In still another aspect, the present invention is an electronic apparatus using one or more printed wiring boards to which at least one printed wiring board of the present invention is connected.

  In still another aspect, the present invention is a method for manufacturing a printed wiring board, including at least a step of connecting the printed wiring board of the present invention and a component.

  In still another aspect of the present invention, the step of connecting at least one printed wiring board of the present invention to another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention, and the present invention Manufacturing a printed wiring board having two or more printed wiring boards connected, including at least a step of connecting a printed wiring board having two or more printed wiring boards manufactured by the method of the present invention and a component. It is a method to do.

In another aspect of the present invention, a step of preparing the carrier-attached copper foil of the present invention and an insulating substrate,
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Thereafter, the printed wiring board manufacturing method includes a step of forming a circuit by any one of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.

In another aspect of the present invention, the step of forming a circuit on the ultrathin copper layer side surface or the carrier side surface of the carrier-attached copper foil of the present invention,
Forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil with carrier so that the circuit is buried;
Forming a circuit on the resin layer;
After forming a circuit on the resin layer, peeling the carrier or the ultra-thin copper layer; and
After the carrier or the ultra-thin copper layer is peeled off, the ultra-thin copper layer or the carrier is removed to be buried in the resin layer formed on the ultra-thin copper layer-side surface or the carrier-side surface. It is a manufacturing method of a printed wiring board including the process of exposing the circuit which has been carried out.

  In another aspect of the present invention, in the step of forming a circuit on the resin layer, another carrier-attached copper foil is bonded to the resin layer from the ultrathin copper layer side and bonded to the resin layer. It is a manufacturing method of the printed wiring board which is the process of forming the said circuit using an attached copper foil.

  In another aspect of the present invention, there is provided a method for producing a printed wiring board, wherein another carrier-attached copper foil to be bonded onto the resin layer is the carrier-attached copper foil of the present invention.

  In another aspect of the present invention, the process for forming a circuit on the resin layer is performed by any one of a semi-additive method, a subtractive method, a partial additive method, or a modified semi-additive method. Is the method.

  In another aspect of the present invention, the copper foil with carrier for forming a circuit on the surface has a substrate or a resin layer on the carrier side surface of the copper foil with carrier or the surface on the ultrathin copper layer side. It is a manufacturing method of a board.

  According to the present invention, a copper foil with a carrier that adheres well to a resin and is excellent in transparency of a resin after removing the copper foil by etching and has a small signal transmission loss, and a laminate using the same Can be provided.

AC is a schematic diagram of the wiring board cross section in the process to circuit plating and the resist removal based on the specific example of the manufacturing method of the printed wiring board using the copper foil with a carrier of this invention. DF is a schematic diagram of a cross section of a wiring board in a process from lamination of a resin and copper foil with a second layer carrier to laser drilling according to a specific example of a method for producing a printed wiring board using a copper foil with a carrier of the present invention. It is. GI is a schematic diagram of the wiring board cross section in the process from the via fill formation to the first layer carrier peeling according to a specific example of the method for manufacturing a printed wiring board using the carrier-attached copper foil of the present invention. J to K are schematic views of a cross section of a wiring board in steps from flash etching to bump / copper pillar formation according to a specific example of a method of manufacturing a printed wiring board using the carrier-attached copper foil of the present invention.

[Form and manufacturing method of copper foil with carrier]
The copper foil with a carrier which is one embodiment of the present invention is useful for a copper foil used by making a laminate by bonding to a resin substrate and removing it by etching.
Usually, the surface of the ultrathin copper layer of the copper foil with carrier, which is bonded to the resin substrate, that is, the roughened (matte) surface, is for the purpose of improving the peel strength of the copper foil after lamination, after degreasing. A roughening treatment is performed on the surface of the copper foil to perform fist-like electrodeposition. The ultrathin copper layer of the copper foil with carrier has irregularities at the time of manufacture, but the irregularities are further increased by enhancing the convexity of the ultrathin copper layer of the copper foil with carrier by roughening treatment. In this invention, the roughening process about the ultra-thin copper layer of the copper foil with a carrier is performed by alloy plating, such as copper-cobalt-nickel alloy plating, copper-nickel-phosphorus alloy plating, and nickel-zinc alloy plating. Moreover, Preferably it can carry out by copper alloy plating. As the copper alloy plating bath, for example, a plating bath containing one or more elements other than copper and copper, more preferably any selected from the group consisting of copper and cobalt, nickel, arsenic, tungsten, chromium, zinc, phosphorus, manganese and molybdenum It is preferable to use a plating bath containing at least one kind. And in this invention, the said roughening process makes a current density higher than the conventional roughening process, and shortens roughening processing time.
Ordinary metal plating, alloy plating, copper plating, copper alloy plating, etc. may be performed as pretreatment before roughening treatment, and normal copper plating is used as a finishing treatment after roughening treatment to prevent electrodeposits from falling off. Plating or the like may be performed. In the present invention, such pretreatment and finishing treatment may be performed.
Moreover, in this invention, when the said pre-processing is performed to the ultra-thin copper layer, the ultra-thin copper layer by which the said pre-processing was also made into an ultra-thin copper layer.

Copper as roughening treatment - cobalt - nickel alloy plating, by electrolytic plating, coating weight is to be the 15~40mg / dm ² of copper -250~2000μg / dm ² of cobalt -50~1000μg / dm ² of nickel It can be carried out so as to form a ternary alloy layer. When the Co adhesion amount is less than 250 μg / dm ² , the heat resistance may be deteriorated, and the etching property may be deteriorated. When the amount of Co deposition exceeds 2000 μg / dm ² , signal transmission loss may increase. In addition, etching spots may occur, and acid resistance and chemical resistance may deteriorate. If the Ni adhesion amount is less than 50 μg / dm ² , the heat resistance may deteriorate. On the other hand, if the Ni adhesion amount exceeds 1000 μg / dm ² , signal transmission loss may increase. In addition, etching residue may increase. A preferable Co adhesion amount is 300 to 1800 μg / dm ² , and a preferable nickel adhesion amount is 100 to 800 μg / dm ² . Here, the etching stain means that Co remains without being dissolved when etched with copper chloride, and the etching residue means that Ni remains without being dissolved when alkaline etching is performed with ammonium chloride. It means that.

An example of a plating bath and plating conditions for forming such a ternary copper-cobalt-nickel alloy plating is as follows:
Plating bath composition: Cu 10-20 g / L, Co 1-10 g / L, Ni 1-10 g / L
pH: 1-4
Temperature: 30-50 ° C
Current density D _k : 25 to 50 A / dm ²
Plating time: 0.2 to 3.0 seconds In one embodiment of the present invention, in the roughening treatment, the current density of the roughening treatment is set higher than the conventional roughening treatment conditions, and the roughening treatment time is set to be longer. Shorten.
The balance of the treatment liquid used in the present invention for electrolysis, surface treatment or plating is water unless otherwise specified.

After the roughening treatment, one or more of layers selected from the group consisting of a heat-resistant layer, a rust-proof layer and a weather-resistant layer may be provided on the roughened surface. In addition, each layer may be a plurality of layers such as two layers, three layers, and the order of stacking the layers may be any order, and the layers may be stacked alternately.
In the copper foil with carrier of the present invention, the “roughened surface” means the surface of the ultrathin copper layer after the roughening treatment is performed on the ultrathin copper layer of the copper foil with carrier. In addition, if the surface treatment for providing a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. is performed after roughening the ultra-thin copper layer of the copper foil with carrier, the “roughened surface” Means the surface of the ultra-thin copper layer of the copper foil with carrier after the surface treatment. The “roughened surface” of the above-described copper foil with carrier includes “the roughened surface of the ultrathin copper layer of the copper foil with carrier”.

Here, a known heat-resistant layer can be used as the heat-resistant layer. Further, for example, the following surface treatment can be used.
As the heat-resistant layer and the rust-proof layer, known heat-resistant layers and rust-proof layers can be used. For example, the heat-resistant layer and / or the anticorrosive layer is a group of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, iron, tantalum A layer containing one or more elements selected from nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements Further, it may be a metal layer or an alloy layer made of one or more elements selected from the group consisting of iron, tantalum and the like. The heat-resistant layer and / or rust preventive layer is a group of nickel, zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, platinum group elements, iron, and tantalum. An oxide, nitride, or silicide containing one or more elements selected from the above may be included. Further, the heat-resistant layer and / or the rust preventive layer may be a layer containing a nickel-zinc alloy. Further, the heat-resistant layer and / or the rust preventive layer may be a nickel-zinc alloy layer. The nickel-zinc alloy layer may contain 50 wt% to 99 wt% nickel and 50 wt% to 1 wt% zinc, excluding inevitable impurities. The total adhesion amount of zinc and nickel in the nickel-zinc alloy layer may be 5 to 1000 mg / m ² , preferably 10 to 500 mg / m ² , preferably 20 to 100 mg / m ² . Further, the ratio of the nickel adhesion amount and the zinc adhesion amount of the layer containing the nickel-zinc alloy or the nickel-zinc alloy layer (= nickel adhesion amount / zinc adhesion amount) is 1.5 to 10. It is preferable. Further, the nickel - in adhesion amount of nickel in the zinc alloy layer is preferably from ^{0.5mg / m 2 ~500mg / m 2} , 1mg / m 2 ~50mg / m 2 - zinc alloy layer or the nickel containing More preferably. When the heat-resistant layer and / or rust prevention layer is a layer containing a nickel-zinc alloy, the interface between the copper foil and the resin substrate is eroded by the desmear liquid when the inner wall such as a through hole or via hole comes into contact with the desmear liquid. It is difficult to improve the adhesion between the copper foil and the resin substrate. The rust prevention layer may be a chromate treatment layer. A known chromate treatment layer can be used for the chromate treatment layer. For example, the chromate-treated layer refers to a layer treated with a liquid containing chromic anhydride, chromic acid, dichromic acid, chromate or dichromate. Chromate treatment layer is any element such as cobalt, iron, nickel, molybdenum, zinc, tantalum, copper, aluminum, phosphorus, tungsten, tin, arsenic and titanium (metal, alloy, oxide, nitride, sulfide, etc.) May be included). Specific examples of the chromate treatment layer include a pure chromate treatment layer and a zinc chromate treatment layer. In the present invention, a chromate treatment layer treated with an anhydrous chromic acid or potassium dichromate aqueous solution is referred to as a pure chromate treatment layer. In the present invention, a chromate treatment layer treated with a treatment liquid containing chromic anhydride or potassium dichromate and zinc is referred to as a zinc chromate treatment layer.

For example heat-resistant layer and / or anticorrosive layer has coating weight of 1 mg / m ² -100 mg / m ^2, preferably from 5 mg / m ² and to 50 mg / m ² of nickel or nickel alloy layer, the adhesion amount is 1 mg / m ² to 80 mg / m ^2, preferably it may be obtained by sequentially laminating a tin layer of ^{5mg / m 2 ~40mg / m 2} , wherein the nickel alloy layer of nickel - molybdenum, nickel - zinc, nickel - molybdenum - cobalt You may be comprised by any one of these. The heat-resistant layer and / or anticorrosive layer, it is ^{preferably, 10mg / m 2 ~70mg / m} 2 total deposition amount of nickel or nickel alloy and tin is 2mg / m ² ~150mg / m 2 It is more preferable. Further, the heat-resistant layer and / or the rust preventive layer is preferably [nickel or nickel adhesion amount in nickel or nickel alloy] / [tin adhesion amount] = 0.25 to 10, preferably 0.33 to 3. More preferred. When the heat-resistant layer and / or rust-preventing layer is used, the carrier-clad copper foil is processed into a printed wiring board, and the subsequent circuit peeling strength, the chemical resistance deterioration rate of the peeling strength, and the like are improved.
Further, as the heat-resistant layer and / or the rust-preventing layer, a cobalt-nickel alloy plating layer of nickel having an adhesion amount of 200 to 2000 μg / dm ² and 50 to 700 μg / dm ² can be formed. This treatment can be regarded as a kind of rust prevention treatment in a broad sense. This cobalt-nickel alloy plating layer needs to be performed to such an extent that the adhesive strength between the copper foil and the substrate is not substantially reduced. If the amount of cobalt adhesion is less than 200 μg / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance may be deteriorated. As another reason, if the amount of cobalt is small, the treated surface becomes reddish, which is not preferable. If the amount of deposited cobalt exceeds 2000 μg / dm ² , signal transmission loss increases, which is not preferable. In addition, etching spots may occur, and acid resistance and chemical resistance may deteriorate. As a heat-resistant layer and / or a rust-preventing layer, a preferable cobalt adhesion amount is 500 to 1000 μg / dm ² . On the other hand, when the nickel adhesion amount is less than 100 μg / dm ² , the heat-resistant peel strength is lowered, and the oxidation resistance and chemical resistance may be deteriorated. When nickel exceeds 1000 μg / dm ² , signal transmission loss increases. As a heat-resistant layer and / or a rust-preventing layer, a preferable nickel adhesion amount is 100 to 600 μg / dm ² .

An example of the conditions for cobalt-nickel alloy plating is as follows:
Plating bath composition: Co 1-20 g / L, Ni 1-20 g / L
pH: 1.5-3.5
Temperature: 30-80 ° C
Current density D _k : 1.0 to 20.0 A / dm ²
Plating time: 0.5-4 seconds

Moreover, you may form the zinc plating layer of 30-250 microgram / dm < ² > of the adhesion amount further on the said cobalt- nickel alloy plating. If the zinc adhesion amount is less than 30 μg / dm ² , the heat deterioration rate improving effect may be lost. On the other hand, when the zinc adhesion amount exceeds 250 μg / dm ² , the hydrochloric acid deterioration rate may be extremely deteriorated. Preferably, the zinc adhesion amount is 30 to 240 μg / dm ² , more preferably 80 to 220 μg / dm ² .

An example of the galvanizing conditions is as follows:
Plating bath composition: Zn 100 to 300 g / L
pH: 3-4
Temperature: 50-60 ° C
Current density D _k : 0.1 to 0.5 A / dm ²
Plating time: 1-3 seconds

  A zinc alloy plating layer such as zinc-nickel alloy plating may be formed in place of the zinc plating layer, and a rust prevention layer and a weather resistance layer are applied to the outermost surface by chromate treatment or application of a silane coupling agent. It may be formed.

A known weathering layer can be used as the weathering layer. Moreover, as a weather resistance layer, a well-known silane coupling process layer can be used, for example, The silane coupling process layer formed using the following silanes can be used.
As the silane coupling agent used for the silane coupling treatment, a known silane coupling agent may be used. For example, an amino silane coupling agent, an epoxy silane coupling agent, or a mercapto silane coupling agent may be used. Silane coupling agents include vinyltrimethoxysilane, vinylphenyltrimethoxylane, γ-methacryloxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, 4-glycidylbutyltrimethoxysilane, and γ-aminopropyl. Triethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) ptoxy) propyl-3-aminopropyltrimethoxysilane, imidazolesilane, triazinesilane, γ-mercaptopropyltrimethoxysilane or the like may be used.

  The silane coupling treatment layer may be formed using a silane coupling agent such as an epoxy silane, an amino silane, a methacryloxy silane, or a mercapto silane. In addition, you may use 2 or more types of such silane coupling agents in mixture. Especially, it is preferable to form using an amino-type silane coupling agent or an epoxy-type silane coupling agent.

  The amino silane coupling agent referred to here is N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane, 3- Aminopropyltriethoxysilane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, aminopropyltrimethoxysilane, N-methylaminopropyltrimethoxysilane, N-phenylaminopropyltrimethoxysilane, N- (3 -Acryloxy-2-hydroxypropyl) -3-aminopropyltriethoxysilane, 4-aminobutyltriethoxysilane, (aminoethylaminomethyl) phenethyltrimethoxysilane, N- (2-aminoethyl-3-aminopropyl) Trimethoxysilane, N (2-Aminoethyl-3-aminopropyl) tris (2-ethylhexoxy) silane, 6- (aminohexylaminopropyl) trimethoxysilane, aminophenyltrimethoxysilane, 3- (1-aminopropoxy) -3,3- Dimethyl-1-propenyltrimethoxysilane, 3-aminopropyltris (methoxyethoxyethoxy) silane, 3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, ω-aminoundecyltrimethoxysilane, 3- (2 -N-benzylaminoethylaminopropyl) trimethoxysilane, bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, (N, N-diethyl-3-aminopropyl) trimethoxysilane, (N, N- Dimethyl-3-aminopropyl) Limethoxysilane, N-methylaminopropyltrimethoxysilane, N-phenylaminopropyltrimethoxysilane, 3- (N-styrylmethyl-2-aminoethylamino) propyltrimethoxysilane, γ-aminopropyltriethoxysilane, N -Β (aminoethyl) γ-aminopropyltrimethoxysilane, N-3- (4- (3-aminopropoxy) ptoxy) propyl-3-aminopropyltrimethoxysilane Good.

The silane coupling treatment layer is 0.05 mg / m ^{2 to} 200 mg / m ² , preferably 0.15 mg / m ^{2 to} 20 mg / m ² , preferably 0.3 mg / m ^{2 to} 2.0 mg in terms of silicon atoms. / M ² is desirable. In the case of the above-mentioned range, adhesion between the base resin and the ultrathin copper layer of the carrier-attached copper foil can be further improved.

[Surface roughness Rz]
In the copper foil with a carrier of the present invention, roughened particles are formed on the surface of the ultrathin copper layer by a roughening treatment, and the TD (direction perpendicular to the rolling direction (width direction of the copper foil), In the case of copper foil, the average roughness Rz of the direction perpendicular to the direction of passing the copper foil in the electrolytic copper foil production apparatus and the direction perpendicular to the direction of foil passing in the apparatus for forming an ultrathin copper layer on the carrier is 0. 20 to 0.80 μm. In the copper foil with carrier of the present invention, the “roughened surface” means the surface of the ultrathin copper layer after the roughening treatment is performed on the ultrathin copper layer of the copper foil with carrier. In addition, if the surface treatment for providing a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. is performed after roughening the ultra-thin copper layer of the copper foil with carrier, the “roughened surface” Means the surface of the ultra-thin copper layer of the copper foil with carrier after the surface treatment. The “roughened surface” of the aforementioned copper foil with carrier includes “the roughened surface of the ultrathin copper layer of the copper foil with carrier”. With such a configuration, the peel strength becomes high and the resin adheres well to the resin, and the degree of haze (haze value) of the resin after the copper foil is removed by etching is reduced and the transparency is increased. As a result, alignment and the like when mounting an IC chip through a positioning pattern that is visible through the resin are facilitated. Moreover, since the surface unevenness | corrugation is very small, the length of the ultra-thin copper layer surface of the copper foil with a carrier corresponding to the length through which an electron flows becomes short, and a transmission loss becomes small. If the average roughness Rz of TD is less than 0.20 μm, there is a concern about manufacturing costs for manufacturing an ultra-smooth copper foil. On the other hand, if the average roughness Rz of TD is more than 0.80 μm, the unevenness of the resin surface after the copper foil is removed by etching increases, and as a result, the haze value of the resin increases. The average roughness Rz of the TD on the roughened surface is preferably 0.30 to 0.70 μm, more preferably 0.35 to 0.60 μm, still more preferably 0.35 to 0.55 μm, and 0.35 to Even more preferred is 0.50 μm.
In addition, when the copper foil with a carrier of this invention is used for the use which needs to make Rz small, the average roughness Rz of TD of the roughened surface is preferably 0.20 to 0.70 μm, 0 .25 to 0.60 μm is more preferable, 0.30 to 0.55 μm is still more preferable, and 0.30 to 0.50 μm is still more preferable.
In addition, in order to control the surface roughness Rz as described above, the carrier surface roughness Rz and the glossiness of the carrier-attached copper foil are set within predetermined ranges as described later, and the ultrathin copper layer is alloy-plated. It is necessary to perform roughening treatment plating, to increase the current density of the roughening treatment plating, and to shorten the roughening treatment plating time.

[Glossiness]
The glossiness of the surface of the roughened copper foil of the carrier-attached copper foil at the incident angle of 60 ° in the carrier foil passing direction (MD) greatly affects the haze value of the resin and the signal transmission loss. . That is, the copper foil having a higher glossiness on the roughened surface has a smaller haze value of the resin and a smaller signal transmission loss. For this reason, as for the copper foil with a carrier of this invention, the glossiness of the roughening process surface of an ultra-thin copper layer is 76 to 350%, It is preferable that it is 80 to 350%, and it is 90 to 300%. Preferably, it is 90 to 250%, more preferably 100 to 250%.

  Here, in order to obtain the visibility effect and the transmission loss reduction effect of the present invention, the TD (direction perpendicular to the rolling direction) of the surface of the copper foil with carrier on the side where the carrier intermediate layer is provided before forming the intermediate layer is provided. (In the width direction of the copper foil), in the case of the electrolytic copper foil, the roughness (Rz (ten-point average roughness Rz (JIS B0601 1994)) of the direction perpendicular to the foil passing direction of the copper foil in the electrolytic copper foil manufacturing apparatus And the glossiness (60-degree glossiness (measured in accordance with JIS Z8741). Same in this specification). is necessary. Specifically, the surface roughness (Rz) of TD on the surface on which the carrier intermediate layer is provided before forming the intermediate layer of the copper foil with carrier is 0.30 to 0.80 μm, preferably 0.30. 0.50 μm, and the glossiness at an incident angle of 60 degrees in the rolling direction (MD, in the case of electrolytic copper foil, the direction of the copper foil in the electrolytic copper foil manufacturing apparatus) is 350 to 800%, preferably A copper alloy plating bath (a plating bath containing one or more elements other than copper and copper, more preferably copper and cobalt, nickel, arsenic, tungsten, chromium, A plating bath containing at least one selected from the group consisting of zinc, phosphorus, manganese, and molybdenum), and the current density of the roughening treatment is made higher than that of the conventional roughening treatment, and the roughening treatment Conventional roughening treatment time The angle of incidence in the direction of foil passing (MD) in the apparatus for forming an ultrathin copper layer on the carrier on the roughened surface of the ultrathin copper foil of the copper foil with carrier after the surface treatment is reduced. The glossiness at 60 degrees is 76 to 350%, the surface roughness Rz of the roughened surface of the ultrathin copper foil, the surface area A of the roughened particles, and the roughened particles are planar from the copper foil surface side. The ratio A / B with the area B obtained when viewed can be controlled within the predetermined range of the present invention. The carrier of the copper foil with a carrier is prepared by adjusting the oil film equivalent of the rolling oil (high gloss rolling), or by chemical polishing such as chemical etching or electrolytic polishing in a phosphoric acid solution. be able to. Moreover, it is producible by manufacturing electrolytic copper foil with a predetermined electrolyte solution and predetermined electrolysis conditions.

  In addition, the glossiness of the roughened surface of the ultrathin copper foil of the copper foil with carrier at the incident angle of 60 degrees in the foil passing direction (MD) in the apparatus for forming the ultrathin copper layer on the carrier is higher (for example, carrier In the apparatus for forming an ultrathin copper layer, the glossiness at an incident angle of 60 degrees in the foil passing direction (MD) = 350%) is desired. The roughness of TD (Rz) is 0.18 to 0.80 μm, preferably 0.25 to 0.50 μm, and the rolling direction (MD, when the carrier is an electrolytic copper foil, an electrolytic copper foil manufacturing apparatus The glossiness at an incident angle of 60 degrees in the foil passing direction is 350 to 800%, preferably 500 to 800%, and a copper alloy plating bath (elements other than copper and copper) as a plating for further roughening treatment A plating bath containing at least one, more preferably copper and cobalt , Nickel, arsenic, tungsten, chromium, zinc, phosphorus, manganese, and a plating bath containing at least one selected from the group consisting of manganese and molybdenum), and the roughening treatment is more current than the conventional roughening treatment. Increase density and reduce roughening time.

The high gloss rolling can be performed by setting the oil film equivalent defined by the following formula to 13000 to 24000. When the glossiness at the incident angle of 60 degrees in the rolling direction (MD) after the surface treatment is desired to be higher (for example, the glossiness at the incident angle of 60 degrees in the rolling direction (MD) = 350%), the glossiness is high. Rolling is performed by setting the oil film equivalent defined by the following formula to 12000 or more and 24000 or less.
Oil film equivalent = {(rolling oil viscosity [cSt]) × (sheet feeding speed [mpm] + roll peripheral speed [mpm])} / {(roll biting angle [rad]) × (yield stress of material [kg / mm ² ])}
The rolling oil viscosity [cSt] is a kinematic viscosity at 40 ° C.
In order to set the oil film equivalent to 12000 to 24000, a known method such as using a low-viscosity rolling oil or slowing the sheet passing speed may be used.
Chemical polishing is performed over a long period of time using an etching solution such as sulfuric acid-hydrogen peroxide-water system or ammonia-hydrogen peroxide-water system at a concentration lower than usual.

Moreover, the manufacturing conditions etc. of the electrolytic copper foil which can be used for this invention are as follows.
-Electrolyte composition Copper: 80-120 g / L
Sulfuric acid: 80-120 g / L
Chlorine: 30-100ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
As the amine compound, an amine compound having the following chemical formula can be used.

(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)

Manufacturing conditions Current density: 70 to 100 A / dm ²
Electrolyte temperature: 50-65 ° C
Electrolyte linear velocity: 1.5-5 m / sec
Electrolysis time: 0.5 to 10 minutes (adjusted according to the thickness of copper to be deposited and current density)
Moreover, as an electrolytic copper foil that can be used in the present invention, an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metals Co., Ltd. can be used.

  The ratio C (C = (60 degree gloss of MD) / (60 degree gloss of TD)) of the 60 degree gloss of MD and 60 degree gloss of TD on the roughened surface is 0.80 to 1. 40 is preferred. If the ratio C between the 60 ° glossiness of MD and the 60 ° glossiness of TD on the roughened surface is less than 0.80, the haze value may be higher than when the ratio C is 0.80 or more. Further, if the ratio C is greater than 1.40, the haze value may be higher than when the ratio C is 1.40 or less. The ratio C is more preferably 0.90 to 1.35, and even more preferably 1.00 to 1.30.

[Haze value]
As described above, the copper foil with a carrier of the present invention is controlled for the average roughness Rz and glossiness of the roughened surface as described above. The haze value decreases. Here, the haze value (%) is a value calculated by (diffuse transmittance) / (total light transmittance) × 100. Specifically, the copper foil with a carrier of the present invention has a haze value of the resin substrate when the copper foil is removed by etching after being bonded to both surfaces of a 50 μm thick resin substrate from the roughened surface side. It is preferably 20 to 70%, more preferably 30 to 55%.

[Particle surface area]
The ratio A / B between the surface area A of the roughened particles and the area B obtained when the roughened particles are viewed in plan from the copper foil surface side greatly affects the haze value of the resin. That is, if the surface roughness Rz is the same, the haze value of the above-described resin decreases as the copper foil having a smaller ratio A / B. For this reason, as for the copper foil with a carrier of this invention, the said ratio A / B is 1.90-2.40, It is preferable that it is 2.00-2.20.

  By controlling the current density and the plating time during particle formation, the particle morphology and formation density are determined, and the surface roughness Rz, glossiness, and particle area ratio A / B can be controlled.

  As described above, the copper foil with a carrier of the present invention has a ratio A / B of 1.90 between the surface area A of the roughened particles and the area B obtained when the roughened particles are viewed from the copper foil surface side. It is controlled to ˜2.40, and surface irregularities exist to some extent. Further, since the average TD roughness Rz of the roughened surface is controlled to 0.20 to 0.80 μm, there is no extremely rough portion on the surface. On the other hand, the glossiness of the roughened surface is as high as 76 to 350%. Considering these, it can be seen that in the copper foil with carrier of the present invention, the particle size of the roughened particles on the roughened surface is controlled to be small. The particle size of the roughened particles affects the transparency of the resin after the copper foil is etched away, but the copper foil with a carrier of the present invention has a surface average roughness on the side bonded to the resin substrate in this way. Controlling the ratio of the surface roughness Rz, the glossiness, and the surface area of the roughened particles to the area obtained when the roughened particles are planarly viewed from the copper foil surface side is within the scope of the present invention. This means that the diameter is reduced within an appropriate range. For this reason, the resin transparency after removing the copper foil by etching becomes good, and the peel strength also becomes good. Since the roughened particle size is small in an appropriate range, surface irregularities exist to some extent, but are not large, so the length of the surface of the copper foil with a carrier corresponding to the length of the flow of electrons becomes shorter, resulting in transmission loss. Becomes smaller.

[Etching factor]
When the value of the etching factor when forming a circuit using copper foil is large, the bottom of the circuit that occurs during etching is reduced, so that the space between the circuits can be narrowed. Therefore, a larger etching factor is preferable because it is suitable for forming a circuit with a fine pattern. For example, the carrier-attached copper foil of the present invention preferably has an etching factor of 1.8 or more, preferably 2.0 or more, preferably 2.2 or more, and 2.3 or more. Preferably, it is 2.4 or more.
In the printed wiring board or copper-clad laminate, the surface roughness (Rz), particle area ratio (A / B), and gloss of the copper circuit or copper foil surface can be obtained by dissolving and removing the resin. The degree can be measured.

[Transmission loss]
When the transmission loss is small, attenuation of the signal when performing signal transmission at a high frequency is suppressed, so that a stable signal transmission can be performed in a circuit that transmits the signal at a high frequency. Therefore, a smaller transmission loss value is preferable because it is suitable for use in a circuit for transmitting a signal at a high frequency. After bonding the copper foil with a carrier to a commercially available liquid crystal polymer resin (Vecstar CTZ-50 μm manufactured by Kuraray Co., Ltd.), a microstrip line is formed by etching so that the characteristic impedance is 50Ω, and a network manufactured by HP When the transmission coefficient is measured using the analyzer HP8720C and the transmission loss at a frequency of 20 GHz and a frequency of 40 GHz is determined, the transmission loss at a frequency of 20 GHz is preferably less than 5.0 dB / 10 cm, and more preferably less than 4.1 dB / 10 cm. Preferably, less than 3.7 dB / 10 cm is even more preferable.

[Copper foil with carrier]
The copper foil with a carrier which is one embodiment of the present invention includes a carrier, an intermediate layer laminated on the carrier, and an ultrathin copper layer laminated on the intermediate layer. Moreover, the copper foil with a carrier may include a carrier, an intermediate layer, and an ultrathin copper layer in this order. The copper foil with a carrier may have a surface treatment layer such as a roughening treatment layer on one or both of the surface on the carrier side and the surface on the ultrathin copper layer side.
When a roughening treatment layer is provided on the carrier-side surface of the carrier-attached copper foil, when the carrier-attached copper foil is laminated on the support such as a resin substrate from the carrier-side surface side, the carrier and the support such as the resin substrate Has the advantage that it becomes difficult to peel off.

<Career>
Carriers that can be used in the present invention are typically metal foils or resin films, such as copper foil, copper alloy foil, nickel foil, nickel alloy foil, iron foil, iron alloy foil, stainless steel foil, aluminum foil, aluminum. It is provided in the form of alloy foil, insulating resin film (for example, polyimide film, liquid crystal polymer (LCP) film, polyethylene terephthalate (PET) film, polyamide film, polyester film, fluororesin film, etc.).
It is preferable to use a copper foil as a carrier that can be used in the present invention. This is because the copper foil has a high electrical conductivity, so that subsequent formation of an intermediate layer and an ultrathin copper layer becomes easy. The carrier is typically provided in the form of rolled copper foil or electrolytic copper foil. In general, the electrolytic copper foil is produced by electrolytic deposition of copper from a copper sulfate plating bath onto a drum of titanium or stainless steel, and the rolled copper foil is produced by repeating plastic working and heat treatment with a rolling roll. In addition to high-purity copper such as tough pitch copper and oxygen-free copper, the copper foil material is, for example, Sn-containing copper, Ag-containing copper, copper alloy added with Cr, Zr, Mg, etc., and Corson-based added with Ni, Si, etc. Copper alloys such as copper alloys can also be used.
The rolled copper foil that can be used for the carrier of the copper foil with carrier according to the present invention includes Ag, Sn, In, Ti, Zn, Zr, Fe, P, Ni, Si, Te, Cr, Nb, V, and the like. A copper alloy foil containing one or more of these elements is also included. When the concentration of the above elements increases (for example, 10% by mass or more in total), the conductivity may decrease. The conductivity of the rolled copper foil is preferably 50% IACS or more, more preferably 60% IACS or more, and still more preferably 80% IACS or more. The copper alloy foil may contain a total of elements other than copper of 0 mass% or more and 50 mass% or less, may contain 0.0001 mass% or more and 40 mass% or less, may contain 0.0005 mass% or more and 30 mass% or less, and 0.001 mass%. More than 20 mass% may be included.
In the present invention, the metal foil used for the carrier has a predetermined surface roughness Rz (ten-point average roughness (JIS B0601 1994) as described above for the surface on which the intermediate layer is formed before the intermediate layer is formed. Compliant)) as well as 60 degree gloss.

  The thickness of the carrier that can be used in the present invention is not particularly limited, but may be appropriately adjusted to a thickness suitable for serving as a carrier, for example, 12 μm or more. However, if it is too thick, the production cost becomes high, so generally it is preferably 35 μm or less. Accordingly, the thickness of the carrier is typically 12-70 μm, more typically 18-35 μm.

  Further, as described above, the carrier used in the present invention needs to have controlled surface roughness Rz and glossiness on the side where the intermediate layer is formed. This is for controlling the glossiness, surface roughness Rz, and surface area ratio A / B of the roughened surface of the ultrathin copper layer after the surface treatment.

<Intermediate layer>
An intermediate layer is provided on the carrier. Another layer may be provided between the carrier and the intermediate layer. In the intermediate layer used in the present invention, the ultrathin copper layer is hardly peeled off from the carrier before the copper foil with the carrier is laminated on the insulating substrate, while the ultrathin copper layer is separated from the carrier after the lamination step on the insulating substrate. There is no particular limitation as long as it can be peeled off. For example, the intermediate layer of the copper foil with a carrier of the present invention is Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn, alloys thereof, hydrates thereof, oxides thereof, One or two or more selected from the group consisting of organic substances may be included. The intermediate layer may be a plurality of layers.
Further, for example, the intermediate layer is a single metal layer composed of one kind of element selected from the element group composed of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn from the carrier side. Or forming an alloy layer composed of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, Zn, A layer made of a hydrate or oxide of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, Al, and Zn. It can comprise by forming.
Moreover, a well-known organic substance can be used for the intermediate | middle layer as said organic substance, and it is preferable to use any 1 or more types of a nitrogen containing organic compound, a sulfur containing organic compound, and carboxylic acid. For example, specific nitrogen-containing organic compounds include 1,2,3-benzotriazole, carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H, which are triazole compounds having a substituent. It is preferable to use -1,2,4-triazole and 3-amino-1H-1,2,4-triazole.
For the sulfur-containing organic compound, it is preferable to use mercaptobenzothiazole, 2-mercaptobenzothiazole sodium, thiocyanuric acid, 2-benzimidazolethiol, and the like.
As the carboxylic acid, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linolenic acid, or the like.
Further, for example, the intermediate layer can be configured by laminating nickel, a nickel-phosphorus alloy or a nickel-cobalt alloy, and chromium in this order on a carrier. Since the adhesive strength between nickel and copper is higher than the adhesive strength between chromium and copper, when the ultrathin copper layer is peeled off, it peels at the interface between the ultrathin copper layer and chromium. Further, the nickel of the intermediate layer is expected to have a barrier effect that prevents the copper component from diffusing from the carrier into the ultrathin copper layer. Adhesion amount of nickel in the intermediate layer is preferably 100 [mu] g / dm ² or more 40000μg / dm ² or less, more preferably 100 [mu] g / dm ² or more 4000μg / dm ² or less, more preferably 100 [mu] g / dm ² or more 2500 g / dm ² or less, more Preferably, it is 100 μg / dm ² or more and less than 1000 μg / dm ² , and the amount of chromium deposited on the intermediate layer is preferably 5 μg / dm ² or more and 100 μg / dm ² or less. When the intermediate layer is provided only on one side, it is preferable to provide a rust preventive layer such as a Ni plating layer on the opposite side of the carrier.
If the thickness of the intermediate layer becomes too large, it may affect the glossiness of the roughened surface of the ultrathin copper layer after the surface treatment of the intermediate layer and the size and number of roughened particles. The thickness of the intermediate layer on the roughened surface of the layer is preferably 1-1000 nm, preferably 1-500 nm, preferably 2-200 nm, preferably 2-100 nm, More preferably, it is 60 nm. An intermediate layer may be provided on both sides of the carrier.

<Ultrathin copper layer>
An ultrathin copper layer is provided on the intermediate layer. Another layer may be provided between the intermediate layer and the ultrathin copper layer. Further, an ultrathin copper layer may be provided on both sides of the carrier. The ultrathin copper layer having the carrier is a copper foil with a carrier which is one embodiment of the present invention. The thickness of the ultrathin copper layer is not particularly limited, but is generally thinner than the carrier, for example, 12 μm or less. Typically, it is 0.5 to 12 μm, and more typically 1.5 to 5 μm. Further, strike plating with a copper-phosphorus alloy may be performed before reducing the pinholes in the ultrathin copper layer before providing the ultrathin copper layer on the intermediate layer. Examples of the strike plating include a copper pyrophosphate plating solution.
The ultra-thin copper layer of the present application is formed under the following conditions. This is for controlling the size and number of particles of the roughening treatment and the glossiness after the roughening treatment by forming a smooth ultrathin copper layer.
-Electrolyte composition Copper: 80-120 g / L
Sulfuric acid: 80-120 g / L
Chlorine: 30-100ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
As the amine compound, an amine compound having the following chemical formula can be used.

(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)

Manufacturing conditions Current density: 70 to 100 A / dm ²
Electrolyte temperature: 50-65 ° C
Electrolyte linear velocity: 1.5-5 m / sec
Electrolysis time: 0.5 to 10 minutes (adjusted according to the thickness of copper to be deposited and current density)

[Resin layer on roughened surface]
You may provide a resin layer on the roughening surface of the copper foil with a carrier of this invention. The resin layer may be an insulating resin layer. In addition, in the copper foil with a carrier of the present invention, the “roughening treatment surface” refers to the surface when the surface treatment for providing a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. is performed after the roughening treatment. It means the ultrathin copper layer surface of the copper foil with a carrier after processing.

  The resin layer may be an adhesive, or an insulating resin layer in a semi-cured state (B stage state) for bonding. The semi-cured state (B stage state) is a state in which there is no sticky feeling even if the surface is touched with a finger, the insulating resin layer can be stacked and stored, and a curing reaction occurs when subjected to heat treatment. Including that.

  The resin layer may be an adhesive resin, that is, an adhesive, or an adhesive semi-cured (B stage state) insulating resin layer. The semi-cured state (B stage state) is a state in which there is no sticky feeling even if the surface is touched with a finger, the insulating resin layer can be stacked and stored, and a curing reaction occurs when subjected to heat treatment. Including that.

  The resin layer may contain a thermosetting resin or may be a thermoplastic resin. The resin layer may include a thermoplastic resin. The resin layer may contain a known resin, resin curing agent, compound, curing accelerator, dielectric, reaction catalyst, crosslinking agent, polymer, prepreg, skeleton material, and the like. The resin layer may be, for example, International Publication No. WO2008 / 004399, International Publication No. WO2008 / 053878, International Publication No. WO2009 / 084533, JP-A-11-5828, JP-A-11-140281, Patent 3184485, International Publication. No. WO 97/02728, Japanese Patent No. 3676375, Japanese Patent Laid-Open No. 2000-43188, Japanese Patent No. 3612594, Japanese Patent Laid-Open No. 2002-179722, Japanese Patent Laid-Open No. 2002-359444, Japanese Patent Laid-Open No. 2003-302068, Japanese Patent No. 3992225, Japanese Patent Laid-Open No. 2003 No. 249739, Japanese Patent No. 4136509, Japanese Patent Application Laid-Open No. 2004-82687, Japanese Patent No. 4025177, Japanese Patent Application Laid-Open No. 2004-349654, Japanese Patent No. 4286060, Japanese Patent Application Laid-Open No. 2005-262506, Japanese Patent No. 4570070, Japanese Patent Application Laid-Open No. No. 5-53218, Japanese Patent No. 3949676, Japanese Patent No. 4178415, International Publication No. WO2004 / 005588, Japanese Patent Application Laid-Open No. 2006-257153, Japanese Patent Application Laid-Open No. 2007-326923, Japanese Patent Application Laid-Open No. 2008-11169, and Japanese Patent No. 5024930. No. WO 2006/028207, Japanese Patent No. 4828427, JP 2009-67029, International Publication No. WO 2006/134868, Japanese Patent No. 5046927, JP 2009-173017, International Publication No. WO 2007/105635, Patent No. 5180815, International Publication Number WO2008 / 114858, International Publication Number WO2009 / 008471, Japanese Patent Application Laid-Open No. 2011-14727, International Publication Number WO2009 / 001850, International Publication Number WO2009 / 145179, International Publication Number Nos. WO2011 / 068157, JP-A-2013-19056 (resins, resin curing agents, compounds, curing accelerators, dielectrics, reaction catalysts, crosslinking agents, polymers, prepregs, skeletal materials, etc.) and / or You may form using the formation method and formation apparatus of a resin layer.

  The type of the resin layer is not particularly limited. For example, epoxy resin, polyimide resin, polyfunctional cyanate ester compound, maleimide compound, polymaleimide compound, maleimide resin, aromatic maleimide resin , Polyvinyl acetal resin, urethane resin, polyethersulfone (also referred to as polyethersulfone or polyethersulfone), polyethersulfone (also referred to as polyethersulfone or polyethersulfone) resin, aromatic polyamide resin, aromatic Polyamide resin polymer, rubber resin, polyamine, aromatic polyamine, polyamideimide resin, rubber modified epoxy resin, phenoxy resin, carboxyl group-modified acrylonitrile-butadiene resin, polyphenylene oxide, bismaleimide triazine tree Fat, thermosetting polyphenylene oxide resin, cyanate ester resin, carboxylic acid anhydride, polyvalent carboxylic acid anhydride, linear polymer having crosslinkable functional group, polyphenylene ether resin, 2,2-bis (4 -Cyanatophenyl) propane, phosphorus-containing phenol compound, manganese naphthenate, 2,2-bis (4-glycidylphenyl) propane, polyphenylene ether-cyanate resin, siloxane-modified polyamideimide resin, cyanoester resin, phosphazene resin, Select from the group of rubber-modified polyamide-imide resin, isoprene, hydrogenated polybutadiene, polyvinyl butyral, phenoxy, polymer epoxy, aromatic polyamide, fluororesin, bisphenol, block copolymerized polyimide resin, and cyanoester resin It can be mentioned resins containing one or more kinds as suitable to be.

The epoxy resin has two or more epoxy groups in the molecule and can be used without any problem as long as it can be used for electric / electronic materials. The epoxy resin is preferably an epoxy resin epoxidized using a compound having two or more glycidyl groups in the molecule. Also, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, brominated (brominated) epoxy Resin, phenol novolac type epoxy resin, naphthalene type epoxy resin, brominated bisphenol A type epoxy resin, orthocresol novolac type epoxy resin, rubber modified bisphenol A type epoxy resin, glycidylamine type epoxy resin, triglycidyl isocyanurate, N, N -Glycidyl amine compounds such as diglycidyl aniline, glycidyl ester compounds such as diglycidyl tetrahydrophthalate, phosphorus-containing epoxy resins, biphenyl type epoxy resins, One or two or more types selected from the group of phenyl novolac type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylethane type epoxy resin can be used, or a hydrogenated product of the epoxy resin or Halogenated substances can be used.
As the phosphorus-containing epoxy resin, a known epoxy resin containing phosphorus can be used. The phosphorus-containing epoxy resin is, for example, an epoxy resin obtained as a derivative from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide having two or more epoxy groups in the molecule. Is preferred.

  The epoxy resin obtained as a derivative from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide is converted to 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. After reacting naphthoquinone or hydroquinone to obtain a compound represented by the following chemical formula 3 (HCA-NQ) or chemical formula 4 (HCA-HQ), an epoxy resin is reacted with the OH group portion to obtain a phosphorus-containing epoxy resin. Is.

  The phosphorus-containing epoxy resin, which is the E component obtained using the above-mentioned compound as a raw material, is used by mixing one or two of the compounds having the structural formula shown in any one of the following chemical formulas 5 to 7. Is preferred. This is because the resin quality in a semi-cured state is excellent in stability, and at the same time, the flame retardant effect is high.

Further, as the brominated (brominated) epoxy resin, a known brominated (brominated) epoxy resin can be used. For example, the brominated (brominated) epoxy resin is a brominated epoxy resin having the structural formula shown in Chemical Formula 8 obtained as a derivative from tetrabromobisphenol A having two or more epoxy groups in the molecule. It is preferable to use one or two brominated epoxy resins having the structural formula shown in FIG.

As the maleimide resin, aromatic maleimide resin, maleimide compound or polymaleimide compound, known maleimide resins, aromatic maleimide resins, maleimide compounds or polymaleimide compounds can be used. For example, as maleimide resin or aromatic maleimide resin or maleimide compound or polymaleimide compound, 4,4′-diphenylmethane bismaleimide, polyphenylmethane maleimide, m-phenylene bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl -5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 4,4'-diphenyl ether bismaleimide, 4,4'-diphenylsulfone bismaleimide, 1, It is possible to use 3-bis (3-maleimidophenoxy) benzene, 1,3-bis (4-maleimidophenoxy) benzene and a polymer obtained by polymerizing the above compound with the above compound or other compounds. The maleimide resin may be an aromatic maleimide resin having two or more maleimide groups in the molecule, and an aromatic maleimide resin having two or more maleimide groups in the molecule and a polyamine or aromatic polyamine. Polymerization adducts obtained by polymerizing and may be used.
As the polyamine or aromatic polyamine, known polyamines or aromatic polyamines can be used. For example, as polyamine or aromatic polyamine, m-phenylenediamine, p-phenylenediamine, 4,4′-diaminodicyclohexylmethane, 1,4-diaminocyclohexane, 2,6-diaminopyridine, 4,4′-diaminodiphenylmethane, 2,2-bis (4-aminophenyl) propane, 4,4′-diaminodiphenyl ether, 4,4′-diamino-3-methyldiphenyl ether, 4,4′-diaminodiphenyl sulfide, 4,4′-diaminobenzophenone, 4,4′-diaminodiphenylsulfone, bis (4-aminophenyl) phenylamine, m-xylenediamine, p-xylenediamine, 1,3-bis [4-aminophenoxy] benzene, 3-methyl-4,4 ′ -Diaminodiphenylmethane, 3,3'-diethyl-4 4'-diaminodiphenylmethane, 3,3'-dichloro-4,4'-diaminodiphenylmethane, 2,2 ', 5,5'-tetrachloro-4,4'-diaminodiphenylmethane, 2,2-bis (3- Methyl-4-aminophenyl) propane, 2,2-bis (3-ethyl-4-aminophenyl) propane, 2,2-bis (2,3-dichloro-4-aminophenyl) propane, bis (2,3 -Dimethyl-4-aminophenyl) phenylethane, ethylenediamine and hexamethylenediamine, 2,2-bis (4- (4-aminophenoxy) phenyl) propane and the above compound and the above compound or other compounds were polymerized. A polymer or the like can be used. Moreover, 1 type, or 2 or more types of well-known polyamine and / or aromatic polyamine or the above-mentioned polyamine or aromatic polyamine can be used.
A known phenoxy resin can be used as the phenoxy resin. Moreover, what is synthesize | combined by reaction of bisphenol and a bivalent epoxy resin can be used as said phenoxy resin. As an epoxy resin, a well-known epoxy resin and / or the above-mentioned epoxy resin can be used.
As the bisphenol, known bisphenols can be used, and bisphenol A, bisphenol F, bisphenol S, tetrabromobisphenol A, 4,4′-dihydroxybiphenyl, HCA (9,10-Dihydro-9-Oxa- Bisphenol obtained as an adduct of 10-phosphophenanthrene-10-oxide) and quinones such as hydroquinone and naphthoquinone can be used.
As the linear polymer having a crosslinkable functional group, a known linear polymer having a crosslinkable functional group can be used. For example, the linear polymer having a crosslinkable functional group preferably has a functional group that contributes to the curing reaction of an epoxy resin such as a hydroxyl group or a carboxyl group. And it is preferable that the linear polymer which has this crosslinkable functional group is soluble in the organic solvent of the temperature of 50 to 200 degreeC of boiling points. Specific examples of the linear polymer having a functional group mentioned here include polyvinyl acetal resin, phenoxy resin, polyethersulfone resin, polyamideimide resin and the like.
The resin layer may contain a crosslinking agent. A known crosslinking agent can be used as the crosslinking agent. For example, a urethane-based resin can be used as the crosslinking agent.
A known rubber resin can be used as the rubber resin. For example, the rubber resin is described as a concept including natural rubber and synthetic rubber. The latter synthetic rubber includes styrene-butadiene rubber, butadiene rubber, butyl rubber, ethylene-propylene rubber, acrylonitrile butadiene rubber, acrylic rubber ( Acrylic ester copolymer), polybutadiene rubber, isoprene rubber and the like. Furthermore, when ensuring the heat resistance of the resin layer to be formed, it is also useful to select and use a synthetic rubber having heat resistance such as nitrile rubber, chloroprene rubber, silicon rubber, urethane rubber or the like. Regarding these rubber resins, it is desirable to have various functional groups at both ends in order to produce a copolymer by reacting with an aromatic polyamide resin or a polyamideimide resin. In particular, it is useful to use CTBN (carboxy group-terminated butadiene nitrile). Moreover, among acrylonitrile butadiene rubbers, a carboxyl-modified product can take a crosslinked structure with an epoxy resin and improve the flexibility of the cured resin layer. As the carboxyl-modified product, carboxy group-terminated nitrile butadiene rubber (CTBN), carboxy group-terminated butadiene rubber (CTB), and carboxy-modified nitrile butadiene rubber (C-NBR) can be used.
A known polyimide amide resin can be used as the polyamide imide resin. In addition, as the polyimide amide resin, for example, trimellitic anhydride, benzophenonetetracarboxylic anhydride and vitorylene diisocyanate are heated in a solvent such as N-methyl-2-pyrrolidone and / or N, N-dimethylacetamide. By heating the resin obtained by doing so, trimellitic anhydride, diphenylmethane diisocyanate and carboxyl group-terminated acrylonitrile-butadiene rubber in a solvent such as N-methyl-2-pyrrolidone and / or N, N-dimethylacetamide What is obtained can be used.
A known rubber-modified polyamideimide resin can be used as the rubber-modified polyamideimide resin. The rubber-modified polyamideimide resin is obtained by reacting a polyamideimide resin and a rubber resin. The reaction of the polyamide-imide resin and the rubber resin is performed for the purpose of improving the flexibility of the polyamide-imide resin itself. That is, the polyamideimide resin and the rubber resin are reacted to replace a part of the acid component (cyclohexanedicarboxylic acid or the like) of the polyamideimide resin with the rubber component. A known polyamideimide resin can be used as the polyamideimide resin. As the rubber resin, a known rubber resin or the aforementioned rubber resin can be used. Solvents used for dissolving the polyamideimide resin and the rubbery resin when polymerizing the rubber-modified polyamideimide resin include dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, dimethylsulfoxide, nitromethane, nitroethane, tetrahydrofuran , Cyclohexanone, methyl ethyl ketone, acetonitrile, γ-butyrolactone, and the like are preferably used alone or in combination.
A known phosphazene resin can be used as the phosphazene resin. The phosphazene resin is a resin containing phosphazene having a double bond having phosphorus and nitrogen as constituent elements. The phosphazene resin can dramatically improve the flame retardancy due to the synergistic effect of nitrogen and phosphorus in the molecule. In addition, unlike 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide derivatives, it exists stably in the resin, and the effect of preventing the occurrence of migration is obtained.
A known fluororesin can be used as the fluororesin. Examples of the fluororesin include PTFE (polytetrafluoroethylene (tetrafluoroethylene)), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), FEP (tetrafluoroethylene / hexafluoropropylene copolymer (4.6). Fluoride)), ETFE (tetrafluoroethylene / ethylene copolymer), PVDF (polyvinylidene fluoride (difluoride)), PCTFE (polychlorotrifluoroethylene (trifluoride)), polyallylsulfone, aromatic A fluororesin composed of at least one thermoplastic resin selected from polysulfide and aromatic polyether and a fluororesin may be used.
The resin layer may contain a resin curing agent. A known resin curing agent can be used as the resin curing agent. For example, resin curing agents include amines such as dicyandiamide, imidazoles and aromatic amines, phenols such as bisphenol A and brominated bisphenol A, novolaks such as phenol novolac resins and cresol novolac resins, and acid anhydrides such as phthalic anhydride. Products, biphenyl type phenol resins, phenol aralkyl type phenol resins and the like can be used. The resin layer may contain one or more of the aforementioned resin curing agents. These curing agents are particularly effective for epoxy resins.
A specific example of the biphenyl type phenol resin is shown in Chemical formula 10.

  A specific example of the phenol aralkyl type phenol resin is shown in Chemical Formula 11.

Known imidazoles can be used, for example, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl- 2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5- Hydroxymethylimidazole etc. are mentioned, These can be used individually or in mixture.
Of these, imidazoles having the structural formula shown in Chemical Formula 12 below are preferably used. By using the imidazole having the structural formula shown in Chemical Formula 12, the moisture absorption resistance of the semi-cured resin layer can be remarkably improved, and the long-term storage stability is excellent. This is because imidazoles function as a catalyst during curing of the epoxy resin and contribute as a reaction initiator that causes a self-polymerization reaction of the epoxy resin in the initial stage of the curing reaction.

As the amine resin curing agent, known amines can be used. As the amine resin curing agent, for example, the above-mentioned polyamines and aromatic polyamines can be used, and aromatic polyamines, polyamides, and these are obtained by polymerizing or condensing with epoxy resins or polyvalent carboxylic acids. One or more selected from the group of amine adducts to be used may be used. Examples of the resin curing agent for the amines include 4,4′-diaminodiphenylene sulfone, 3,3′-diaminodiphenylene sulfone, 4,4-diaminodiphenylel, and 2,2-bis [4. It is preferable to use at least one of-(4-aminophenoxy) phenyl] propane and bis [4- (4-aminophenoxy) phenyl] sulfone.
The resin layer may contain a curing accelerator. A known curing accelerator can be used as the curing accelerator. For example, as the curing accelerator, tertiary amine, imidazole, urea curing accelerator and the like can be used.
The resin layer may include a reaction catalyst. A known reaction catalyst can be used as the reaction catalyst. For example, finely pulverized silica or antimony trioxide can be used as a reaction catalyst.

  The polyhydric carboxylic acid anhydride is preferably a component that contributes as a curing agent for the epoxy resin. The anhydride of the polyvalent carboxylic acid is phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, tetrahydroxyphthalic anhydride, hexahydroxyphthalic anhydride, methylhexahydroxyphthalic anhydride, nadine. Acid and methyl nadic acid are preferred.

The thermoplastic resin may be a thermoplastic resin having a functional group other than an alcoholic hydroxyl group polymerizable with an epoxy resin.
The polyvinyl acetal resin may have a functional group polymerizable with an epoxy resin or a maleimide compound other than an acid group and a hydroxyl group. The polyvinyl acetal resin may have a carboxyl group, an amino group or an unsaturated double bond introduced in the molecule.
Examples of the aromatic polyamide resin polymer include those obtained by reacting an aromatic polyamide resin and a rubber resin. Here, the aromatic polyamide resin is synthesized by condensation polymerization of an aromatic diamine and a dicarboxylic acid. As the aromatic diamine at this time, 4,4′-diaminodiphenylmethane, 3,3′-diaminodiphenylsulfone, m-xylenediamine, 3,3′-oxydianiline and the like are used. As the dicarboxylic acid, phthalic acid, isophthalic acid, terephthalic acid, fumaric acid or the like is used.
As the rubber resin to be reacted with the aromatic polyamide resin, a known rubber resin or the aforementioned rubber resin can be used.
This aromatic polyamide resin polymer is used for the purpose of not being damaged by under-etching by an etchant when etching a copper foil after being processed into a copper-clad laminate.

  The resin layer is a cured resin layer (the “cured resin layer” means a cured resin layer) and a half in order from the copper foil side (that is, the ultrathin copper layer side of the copper foil with carrier). The resin layer which formed the cured resin layer sequentially may be sufficient. The cured resin layer may be composed of a resin component of any one of a polyimide resin, a polyamideimide resin, and a composite resin having a thermal expansion coefficient of 0 ppm / ° C. to 25 ppm / ° C.

  Moreover, you may provide the semi-hardened resin layer whose thermal expansion coefficient after hardening is 0 ppm / degrees C-50 ppm / degrees C on the said cured resin layer. In addition, the thermal expansion coefficient of the entire resin layer after the cured resin layer and the semi-cured resin layer are cured may be 40 ppm / ° C. or less. The cured resin layer may have a glass transition temperature of 300 ° C. or higher. The semi-cured resin layer may be formed using a maleimide resin or an aromatic maleimide resin. The resin composition for forming the semi-cured resin layer preferably contains a maleimide resin, an epoxy resin, and a linear polymer having a crosslinkable functional group. As the epoxy resin, a known epoxy resin or an epoxy resin described in this specification can be used. In addition, as maleimide resins, aromatic maleimide resins, linear polymers having crosslinkable functional groups, known maleimide resins, aromatic maleimide resins, linear polymers having crosslinkable functional groups, or the aforementioned maleimide resins. An aromatic maleimide resin or a linear polymer having a crosslinkable functional group can be used.

Moreover, when providing the copper foil with a carrier which has a resin layer suitable for a three-dimensional molded printed wiring board manufacture use, it is preferable that the said cured resin layer is a polymeric polymer layer which has hardened | cured flexibility. The polymer layer is preferably made of a resin having a glass transition temperature of 150 ° C. or higher so that it can withstand the solder mounting process. The polymer polymer layer is preferably made of one or a mixture of two or more of a polyamide resin, a polyether sulfone resin, an aramid resin, a phenoxy resin, a polyimide resin, a polyvinyl acetal resin, and a polyamideimide resin. The thickness of the polymer layer is preferably 3 μm to 10 μm.
Moreover, it is preferable that the said high molecular polymer layer contains any 1 type, or 2 or more types of an epoxy resin, a maleimide-type resin, a phenol resin, and a urethane resin. The semi-cured resin layer is preferably composed of an epoxy resin composition having a thickness of 10 μm to 50 μm.

Moreover, it is preferable that the said epoxy resin composition contains each component of the following A component-E component.
Component A: An epoxy resin comprising one or more selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a bisphenol AD type epoxy resin that have an epoxy equivalent of 200 or less and are liquid at room temperature.
B component: High heat resistant epoxy resin.
Component C: Phosphorus-containing flame-retardant resin, which is any one of phosphorus-containing epoxy resin and phosphazene-based resin, or a resin obtained by mixing these.
Component D: A rubber-modified polyamide-imide resin modified with a liquid rubber component having a property that is soluble in a solvent having a boiling point in the range of 50 ° C. to 200 ° C.
E component: Resin curing agent.

The B component is a “high heat resistant epoxy resin” having a high so-called glass transition point Tg. The “high heat-resistant epoxy resin” referred to here is preferably a polyfunctional epoxy resin such as a novolac-type epoxy resin, a cresol novolac-type epoxy resin, a phenol novolac-type epoxy resin, or a naphthalene-type epoxy resin.
As the phosphorus-containing epoxy resin of component C, the aforementioned phosphorus-containing epoxy resin can be used. The phosphazene resin described above can be used as the C component phosphazene resin.
The rubber-modified polyamide-imide resin described above can be used as the rubber-modified polyamide-imide resin of component D. The resin curing agent described above can be used as the E component resin curing agent.

  A solvent is added to the resin composition shown above and used as a resin varnish, and a thermosetting resin layer is formed as an adhesive layer of a printed wiring board. The resin varnish is prepared by adding a solvent to the above resin composition so that the resin solid content is in the range of 30 wt% to 70 wt%, and the resin flow when measured in accordance with MIL-P-13949G in the MIL standard. A semi-cured resin film in the range of 5% to 35% can be formed. As the solvent, a known solvent or the aforementioned solvent can be used.

  The resin layer is a resin layer having a first thermosetting resin layer and a second thermosetting resin layer located on the surface of the first thermosetting resin layer in order from the copper foil side, The curable resin layer is formed of a resin component that does not dissolve in chemicals during desmear processing in the wiring board manufacturing process, and the second thermosetting resin layer dissolves in chemicals during desmear processing in the wiring board manufacturing process. Then, it may be formed using a resin that can be washed and removed. The first thermosetting resin layer may be formed using a resin component obtained by mixing one or more of polyimide resin, polyethersulfone, and polyphenylene oxide. The second thermosetting resin layer may be formed using an epoxy resin component. The thickness t1 (μm) of the first thermosetting resin layer is Rz (μm) of the roughened surface roughness of the copper foil with carrier, and the thickness of the second thermosetting resin layer is t2 (μm). Then, t1 is preferably a thickness that satisfies the condition of Rz <t1 <t2.

  The resin layer may be a prepreg in which a skeleton material is impregnated with a resin. The resin impregnated in the skeleton material is preferably a thermosetting resin. The prepreg may be a known prepreg or a prepreg used for manufacturing a printed wiring board.

The skeleton material may include aramid fibers, glass fibers, or wholly aromatic polyester fibers. The skeleton material is preferably an aramid fiber, a glass fiber, or a nonwoven fabric or woven fabric of wholly aromatic polyester fibers. The wholly aromatic polyester fiber is preferably a wholly aromatic polyester fiber having a melting point of 300 ° C. or higher. The wholly aromatic polyester fiber having a melting point of 300 ° C. or higher is a fiber produced using a resin called a so-called liquid crystal polymer, and the liquid crystal polymer contains 2-hydroxyl-6-naphthoic acid and p-hydroxybenzoic acid. The main component is an acid polymer. Since this wholly aromatic polyester fiber has a low dielectric constant and low dielectric loss tangent, it has excellent performance as a constituent material of an electrically insulating layer and can be used in the same manner as glass fiber and aramid fiber. is there.
In addition, in order to improve the wettability with the resin of the surface, it is preferable to perform the silane coupling agent process for the fiber which comprises the said nonwoven fabric and woven fabric. As the silane coupling agent at this time, a known amino-based or epoxy-based silane coupling agent or the aforementioned silane coupling agent can be used depending on the purpose of use.

  The prepreg is a prepreg obtained by impregnating a thermosetting resin into a nonwoven fabric using an aramid fiber or glass fiber having a nominal thickness of 70 μm or less, or a skeleton material made of glass cloth having a nominal thickness of 30 μm or less. Also good.

(When the resin layer contains a dielectric (dielectric filler))
The resin layer may include a dielectric (dielectric filler).
When a dielectric (dielectric filler) is included in any of the above resin layers or resin compositions, it can be used for the purpose of forming a capacitor layer and increase the capacitance of the capacitor circuit. The dielectric (dielectric filler) includes a composite oxide having a perovskite structure such as BaTiO3, SrTiO3, Pb (Zr-Ti) O3 (common name PZT), PbLaTiO3 / PbLaZrO (common name PLZT), SrBi2Ta2O9 (common name SBT). Dielectric powder is used.

The dielectric (dielectric filler) may be powdery. When the dielectric (dielectric filler) is powdery, the powder characteristics of the dielectric (dielectric filler) are as follows. First, the particle size is 0.01 μm to 3.0 μm, preferably 0.02 μm to 2.0 μm. Must be in range. The particle size referred to here is indirect in which the average particle size is estimated from the measured values of the laser diffraction scattering type particle size distribution measurement method and the BET method because the particles form a certain secondary aggregation state. It cannot be used because the accuracy is inferior in measurement, and it refers to the average particle diameter obtained by directly observing a dielectric (dielectric filler) with a scanning electron microscope (SEM) and image analysis of the SEM image. It is. In this specification, the particle size at this time is indicated as DIA. The image analysis of the dielectric (dielectric filler) powder observed using a scanning electron microscope (SEM) in this specification is performed using IP-1000PC manufactured by Asahi Engineering Co., Ltd. Circular particle analysis was performed with a threshold value of 10 and an overlapping degree of 20, and the average particle diameter DIA was obtained.
According to the above-described embodiment, the resin layer containing the dielectric for forming the capacitor circuit layer having a low dielectric loss tangent is improved by improving the adhesion between the inner layer circuit surface of the inner layer core material and the resin layer containing the dielectric. The copper foil with a carrier which has can be provided.

Examples of the resin and / or resin composition and / or compound contained in the resin layer include methyl ethyl ketone (MEK), cyclopentanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, toluene, methanol, ethanol, propylene glycol monomethyl ether , Dimethylformamide, dimethylacetamide, cyclohexanone, ethyl cellosolve, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide and the like to obtain a resin liquid (resin varnish). On the roughened surface of the copper foil with a carrier, for example, it is applied by a roll coater method or the like, and then heated and dried as necessary to remove the solvent to obtain a B-stage state. For example, a hot air drying furnace may be used for drying, and the drying temperature may be 100 to 250 ° C, preferably 130 to 200 ° C. The composition of the resin layer is dissolved using a solvent, and the resin solid content is 3 wt% to 70 wt%, preferably 3 wt% to 60 wt%, preferably 10 wt% to 40 wt%, more preferably 25 wt% to 40 wt%. It is good also as a resin liquid. In addition, it is most preferable at this stage from an environmental standpoint to dissolve using a mixed solvent of methyl ethyl ketone and cyclopentanone. In addition, it is preferable to use the solvent whose boiling point is the range of 50 to 200 degreeC as a solvent.
The resin layer is preferably a semi-cured resin film having a resin flow in the range of 5% to 35% when measured according to MIL-P-13949G in the MIL standard.
In this specification, the resin flow is based on MIL-P-13949G in the MIL standard. Four 10 cm square samples are sampled from a copper foil with a carrier with a resin having a resin thickness of 55 μm. A value calculated based on Equation 1 from the result of measuring the resin outflow weight at the time when the sample was laminated (laminate) under the conditions of a press temperature of 171 ° C., a press pressure of 14 kgf / cm ² , and a press time of 10 minutes. It is.

  The copper foil with a carrier provided with the resin layer (copper foil with a carrier with resin) is superposed on the base material, and the whole is thermocompression bonded to thermally cure the resin layer, and then the carrier is peeled off. And expose the ultrathin copper layer (which is naturally the surface on the intermediate layer side of the ultrathin copper layer), and the surface opposite to the roughened side of the copper foil with carrier Are used in the form of forming a predetermined wiring pattern.

  If this resin-attached copper foil with a carrier is used, the number of prepreg materials used when manufacturing a multilayer printed wiring board can be reduced. In addition, the copper-clad laminate can be manufactured even if the resin layer is made thick enough to ensure interlayer insulation or no prepreg material is used. At this time, the surface smoothness can be further improved by undercoating the surface of the substrate with an insulating resin.

In addition, when the prepreg material is not used, the material cost of the prepreg material is saved and the laminating process is simplified, which is economically advantageous. Moreover, the multilayer printed wiring board manufactured by the thickness of the prepreg material is used. The thickness is reduced, and there is an advantage that an extremely thin multilayer printed wiring board in which the thickness of one layer is 100 μm or less can be manufactured.
The thickness of the resin layer is preferably 0.1 to 120 μm.

When the thickness of the resin layer is less than 0.1 μm, the adhesive strength is reduced, and when the copper foil with a carrier with the resin is laminated on the base material provided with the inner layer material without interposing the prepreg material, the circuit of the inner layer material It may be difficult to ensure interlayer insulation between the two. On the other hand, if the thickness of the resin layer is greater than 120 μm, it is difficult to form a resin layer having a target thickness in a single coating process, which may be economically disadvantageous because of extra material costs and man-hours.
In addition, when the copper foil with a carrier having a resin layer is used for manufacturing an extremely thin multilayer printed wiring board, the thickness of the resin layer is 0.1 μm to 5 μm, more preferably 0.5 μm to 5 μm, More preferably, the thickness is 1 μm to 5 μm in order to reduce the thickness of the multilayer printed wiring board.
When the resin layer includes a dielectric, the thickness of the resin layer is preferably 0.1 to 50 μm, preferably 0.5 μm to 25 μm, and more preferably 1.0 μm to 15 μm. preferable.
The total resin layer thickness with the cured resin layer and the semi-cured resin layer is preferably 0.1 μm to 120 μm, more preferably 5 μm to 120 μm, and preferably 10 μm to 120 μm, 10 μm to 60 μm. Are more preferred. The thickness of the cured resin layer is preferably 2 μm to 30 μm, preferably 3 μm to 30 μm, and more preferably 5 to 20 μm. Moreover, it is preferable that the thickness of a semi-hardened resin layer is 3 micrometers-55 micrometers, it is preferable that they are 7 micrometers-55 micrometers, and it is more desirable that it is 15-115 micrometers. If the total resin layer thickness exceeds 120 μm, it may be difficult to produce a thin multilayer printed wiring board. If the total resin layer thickness is less than 5 μm, it is easy to form a thin multilayer printed wiring board, but an insulating layer between inner layer circuits This is because the resin layer may become too thin and the insulation between the circuits of the inner layer tends to become unstable. Moreover, when the cured resin layer thickness is less than 2 μm, it may be necessary to consider the surface roughness of the roughened surface of the copper foil with carrier. Conversely, if the cured resin layer thickness exceeds 20 μm, the effect of the cured resin layer may not be particularly improved, and the total insulating layer thickness becomes thick.

In the case where the thickness of the resin layer is 0.1 μm to 5 μm, in order to improve the adhesion between the resin layer and the copper foil with carrier, the heat-resistant layer and the roughened surface of the copper foil with carrier are provided. After providing the rust preventive layer and / or the weather resistant layer, it is preferable to form a resin layer on the heat resistant layer, the rust preventive layer or the weather resistant layer.
In addition, the thickness of the above-mentioned resin layer says the average value of the thickness measured by cross-sectional observation in arbitrary 10 points | pieces.

  Furthermore, as another product form when this copper foil with a carrier is a very thin copper layer of a copper foil with a carrier, on the roughened surface of the ultra thin copper layer (copper foil with carrier) After the resin layer is provided and the resin layer is in a semi-cured state, the carrier is then peeled off and can be manufactured in the form of an ultrathin copper layer with resin (copper foil with carrier) in which no carrier is present.

  Below, some examples of the manufacturing process of the printed wiring board using the copper foil with a carrier which concerns on this invention are shown.

  In one embodiment of a method for producing a printed wiring board according to the present invention, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention, a step of laminating the copper foil with a carrier and an insulating substrate, and with the carrier After laminating the copper foil and the insulating substrate so that the ultrathin copper layer side faces the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the copper foil with carrier, and then a semi-additive method, a modified semi-conductor A step of forming a circuit by any one of an additive method, a partial additive method, and a subtractive method. It is also possible for the insulating substrate to contain an inner layer circuit.

  In the present invention, the semi-additive method refers to a method in which a thin electroless plating is performed on an insulating substrate or a copper foil seed layer, a pattern is formed, and then a conductive pattern is formed using electroplating and etching.

Therefore, in one embodiment of a method for producing a printed wiring board according to the present invention using a semi-additive method, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Removing all of the ultrathin copper layer exposed by peeling the carrier by a method such as etching or plasma using a corrosive solution such as acid
Providing a through hole or / and a blind via in the resin exposed by removing the ultrathin copper layer by etching;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the resin and the through hole or / and the blind via;
Providing a plating resist on the electroless plating layer;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using a semi-additive method, a step of preparing a copper foil with a carrier and an insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Removing all of the ultrathin copper layer exposed by peeling the carrier by a method such as etching or plasma using a corrosive solution such as acid
Providing an electroless plating layer on the surface of the resin exposed by removing the ultrathin copper layer by etching;
Providing a plating resist on the electroless plating layer;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer and the ultrathin copper layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

  In the present invention, the modified semi-additive method is a method in which a metal foil is laminated on an insulating layer, a non-circuit forming portion is protected by a plating resist, and the copper is thickened in the circuit forming portion by electrolytic plating, and then the resist is removed. Then, a method of forming a circuit on the insulating layer by removing the metal foil other than the circuit forming portion by (flash) etching is indicated.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using the modified semi-additive method, the step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Providing a plating resist on the surface of the ultrathin copper layer exposed by peeling the carrier,
Forming a circuit by electrolytic plating after providing the plating resist;
Removing the plating resist;
Removing the ultra-thin copper layer exposed by removing the plating resist by flash etching;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using the modified semi-additive method, the step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a plating resist on the exposed ultrathin copper layer by peeling off the carrier;
Exposing the plating resist, and then removing the plating resist in a region where a circuit is formed;
Providing an electrolytic plating layer in a region where the circuit from which the plating resist has been removed is formed;
Removing the plating resist;
Removing the electroless plating layer and the ultrathin copper layer in a region other than the region where the circuit is formed by flash etching or the like;
including.

  In the present invention, the partial additive method means that a catalyst circuit is formed on a substrate provided with a conductor layer, and if necessary, a substrate provided with holes for through holes or via holes, and etched to form a conductor circuit. Then, after providing a solder resist or a plating resist as necessary, it refers to a method of manufacturing a printed wiring board by thickening through holes, via holes, etc. on the conductor circuit by electroless plating.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using a partly additive method, a step of preparing the copper foil with carrier and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Applying catalyst nuclei to the region containing the through-holes and / or blind vias;
Providing an etching resist on the surface of the ultrathin copper layer exposed by peeling the carrier,
Exposing the etching resist to form a circuit pattern;
Removing the ultrathin copper layer and the catalyst nucleus by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
A step of providing a solder resist or a plating resist on the surface of the insulating substrate exposed by removing the ultrathin copper layer and the catalyst core by a method such as etching or plasma using a corrosive solution such as an acid;
Providing an electroless plating layer in a region where the solder resist or plating resist is not provided,
including.

  In the present invention, the subtractive method refers to a method of forming a conductor pattern by selectively removing unnecessary portions of a copper foil on a copper clad laminate by etching or the like.

Therefore, in one embodiment of the method for producing a printed wiring board according to the present invention using a subtractive method, a step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Providing an electroplating layer on the surface of the electroless plating layer;
A step of providing an etching resist on the surface of the electrolytic plating layer or / and the ultrathin copper layer;
Exposing the etching resist to form a circuit pattern;
Removing the ultrathin copper layer and the electroless plating layer and the electrolytic plating layer by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
including.

In another embodiment of the method for producing a printed wiring board according to the present invention using a subtractive method, a step of preparing the carrier-attached copper foil and the insulating substrate according to the present invention,
Laminating the copper foil with carrier and an insulating substrate;
A step of peeling the carrier of the copper foil with carrier after laminating the copper foil with carrier and the insulating substrate;
Providing a through hole or / and a blind via on the insulating substrate and the ultrathin copper layer exposed by peeling the carrier;
Performing a desmear process on the region including the through hole or / and the blind via,
Providing an electroless plating layer for the region including the through hole or / and the blind via;
Forming a mask on the surface of the electroless plating layer;
Providing an electroplating layer on the surface of the electroless plating layer on which no mask is formed;
A step of providing an etching resist on the surface of the electrolytic plating layer or / and the ultrathin copper layer;
Exposing the etching resist to form a circuit pattern;
Removing the ultra-thin copper layer and the electroless plating layer by a method such as etching or plasma using a corrosive solution such as an acid to form a circuit;
Removing the etching resist;
including.

  The process of providing a through hole or / and a blind via and the subsequent desmear process may not be performed.

Here, the specific example of the manufacturing method of the printed wiring board using the copper foil with a carrier of this invention is demonstrated in detail using drawing. Here, the carrier-attached copper foil having an ultrathin copper layer on which a roughened layer is formed will be described as an example. However, the present invention is not limited thereto, and the carrier has an ultrathin copper layer on which a roughened layer is not formed. The following method for producing a printed wiring board can be similarly performed using an attached copper foil.
First, as shown to FIG. 1-A, the copper foil with a carrier (1st layer) which has the ultra-thin copper layer in which the roughening process layer was formed on the surface is prepared.
Next, as shown in FIG. 1-B, a resist is applied onto the roughened layer of the ultrathin copper layer, exposed and developed, and etched into a predetermined shape.
Next, as shown in FIG. 1-C, after the plating for the circuit is formed, the resist is removed to form a circuit plating having a predetermined shape.
Next, as shown in FIG. 2-D, an embedding resin is provided on the ultrathin copper layer so as to cover the circuit plating (so that the circuit plating is buried), and then the resin layer is laminated, followed by another carrier. A copper foil (second layer) is bonded from the ultrathin copper layer side.
Next, as shown to FIG. 2-E, a carrier is peeled from the copper foil with a carrier of the 2nd layer.
Next, as shown in FIG. 2-F, laser drilling is performed at a predetermined position of the resin layer to expose the circuit plating and form a blind via.
Next, as shown in FIG. 3G, copper is embedded in the blind via to form a via fill.
Next, as shown in FIG. 3H, circuit plating is formed on the via fill as shown in FIGS. 1-B and 1-C.
Next, as shown to FIG. 3-I, a carrier is peeled from the copper foil with a carrier of the 1st layer.
Next, as shown in FIG. 4J, the ultrathin copper layers on both surfaces are removed by flash etching, and the surface of the circuit plating in the resin layer is exposed.
Next, as shown in FIG. 4K, bumps are formed on the circuit plating in the resin layer, and copper pillars are formed on the solder. Thus, the printed wiring board using the copper foil with a carrier of this invention is produced.

  As the another copper foil with a carrier (second layer), the copper foil with a carrier of the present invention may be used, a conventional copper foil with a carrier may be used, and a normal copper foil may be further used. Further, one or more circuits may be formed on the second layer circuit shown in FIG. 3H, and these circuits may be formed by a semi-additive method, a subtractive method, a partial additive method, or a modified semi-conductor method. You may carry out by any method of an additive method.

The copper foil with a carrier according to the present invention is preferably controlled so that the color difference on the surface of the ultrathin copper layer satisfies the following (1). In the present invention, the “color difference on the surface of the ultrathin copper layer” means the color difference on the surface of the ultrathin copper layer, or the color difference on the surface of the surface treatment layer when various surface treatments such as roughening treatment are applied. . That is, it is preferable that the copper foil with a carrier according to the present invention is controlled so that the color difference of the roughened surface of the ultrathin copper layer satisfies the following (1). In addition, in the copper foil with a carrier of the present invention, the “roughening treatment surface” refers to the surface when the surface treatment for providing a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. is performed after the roughening treatment. It means the ultrathin copper layer surface of the copper foil with a carrier after processing.
(1) The color difference on the surface of the ultrathin copper layer has a color difference ΔE * ab based on JIS Z8730 of 45 or more.

  Here, the color differences ΔL, Δa, and Δb are respectively measured with a color difference meter, and are shown using the L * a * b color system based on JIS Z8730, taking into account black / white / red / green / yellow / blue. It is a comprehensive index and is expressed as ΔL: black and white, Δa: reddish green, Δb: yellow blue. ΔE * ab is expressed by the following formula using these color differences.

The above-described color difference can be adjusted by increasing the current density when forming the ultrathin copper layer, decreasing the copper concentration in the plating solution, and increasing the linear flow rate of the plating solution.
Moreover, the above-mentioned color difference can also be adjusted by performing a roughening process on the surface of an ultra-thin copper layer and providing a roughening process layer. In the case of providing the roughening treatment layer, the current density is made higher than conventional (for example, 40 to 60 A) using an electrolytic solution containing copper and one or more elements selected from the group consisting of nickel, cobalt, tungsten, and molybdenum. / Dm ² ), and the processing time can be shortened (for example, 0.1 to 1.3 seconds). When a roughening layer is not provided on the surface of the ultrathin copper layer, use a plating bath in which the concentration of Ni is twice or more that of other elements, and use an ultrathin copper layer, heat resistant layer, rust preventive layer or chromate. Ni alloy plating (for example, Ni-W alloy plating, Ni-Co-P alloy plating, Ni-Zn alloy plating) is applied to the surface of the treatment layer or the silane coupling treatment layer at a lower current density (0.1 to 1.. 3A / dm ² ), and the processing time can be set long (20 to 40 seconds).

  When the color difference ΔE * ab based on JIS Z8730 is 45 or more when the color difference on the surface of the ultrathin copper layer is 45 or more, for example, when forming a circuit on the surface of the ultrathin copper layer of the copper foil with carrier, As a result, the visibility is improved and the circuit alignment can be performed with high accuracy. The color difference ΔE * ab based on JIS Z8730 on the ultrathin copper layer surface is preferably 50 or more, more preferably 55 or more, and even more preferably 60 or more.

  When the color difference on the surface of the ultrathin copper layer is controlled as described above, the contrast with the circuit plating becomes clear and the visibility becomes good. Therefore, in the manufacturing process of the printed wiring board as described above, for example, as shown in FIG. 2-C, the circuit plating can be accurately formed at a predetermined position. In addition, according to the method for manufacturing a printed wiring board as described above, circuit plating is embedded in a resin layer, and thus, for example, removal of an ultrathin copper layer by flash etching as shown in FIG. At this time, the circuit plating is protected by the resin layer and the shape thereof is maintained, thereby facilitating the formation of a fine circuit. Further, since the circuit plating is protected by the resin layer, the migration resistance is improved, and the continuity of the circuit wiring is satisfactorily suppressed. For this reason, formation of a fine circuit becomes easy. Also, as shown in FIGS. 4-J and 4-K, when the ultra-thin copper layer is removed by flash etching, the exposed surface of the circuit plating has a shape recessed from the resin layer, so that bumps are formed on the circuit plating. In addition, copper pillars can be easily formed thereon, and the production efficiency is improved.

  A known resin or prepreg can be used as the embedding resin (resin). For example, a prepreg that is a glass cloth impregnated with BT (bismaleimide triazine) resin or BT resin, an ABF film or ABF manufactured by Ajinomoto Fine Techno Co., Ltd. can be used. Moreover, the resin layer and / or resin and / or prepreg as described in this specification can be used for the embedding resin (resin).

  Moreover, the copper foil with a carrier used for the first layer may have a substrate or a resin layer on the surface of the copper foil with a carrier. By having the said board | substrate or resin layer, the copper foil with a carrier used for the first layer is supported, and since it becomes difficult to wrinkle, there exists an advantage that productivity improves. As the substrate or resin layer, any substrate or resin layer can be used as long as it has an effect of supporting the copper foil with carrier used in the first layer. For example, as the substrate or resin layer, the carrier, prepreg, resin layer and known carrier, prepreg, resin layer, metal plate, metal foil, inorganic compound plate, inorganic compound foil, organic compound plate described in the present specification, Organic compound foils can be used.

The copper foil with a carrier of the present invention can be bonded to a resin substrate from the roughened surface side to produce a laminate. The resin substrate is not particularly limited as long as it has characteristics applicable to a printed wiring board or the like. For example, a paper base phenol resin, a paper base epoxy resin, a synthetic fiber cloth base epoxy resin for rigid PWB Glass cloth / paper composite base material epoxy resin, glass cloth / glass nonwoven fabric composite base material epoxy resin and glass cloth base material epoxy resin, etc. are used, polyester film, polyimide film, liquid crystal polymer (LCP) film, fluorine for FPC Resin etc. can be used. In addition, when a liquid crystal polymer (LCP) film or a fluororesin film is used, the peel strength between the film and the copper foil with a carrier tends to be smaller than when a polyimide film is used. Therefore, when a liquid crystal polymer (LCP) film or a fluororesin film is used, the copper circuit is covered with a coverlay after the copper circuit is formed, so that the film and the copper circuit are not easily peeled off, and the peel strength is reduced. The film can be prevented from peeling off from the copper circuit.
Since the liquid crystal polymer (LCP) film or fluororesin film has a small dielectric loss tangent, the copper-clad laminate using the liquid crystal polymer (LCP) film or fluororesin film and the copper foil with carrier according to the present invention, printed wiring Boards and printed circuit boards are suitable for high-frequency circuits (circuits that transmit signals at high frequencies). Further, the copper foil with a carrier according to the present invention has a small surface roughness Rz and a high glossiness, so that the surface is smooth and suitable for high frequency circuit applications.

  In the case of the rigid PWB, a prepreg is prepared by impregnating a base material such as a glass cloth with a resin and curing the resin to a semi-cured state. It can be carried out by superposing the copper foil on the prepreg from the surface subjected to the roughening treatment and heating and pressing it. In the case of FPC, it is laminated on a copper foil under high temperature and high pressure without using an adhesive on a substrate such as a polyimide film, or a polyimide precursor is applied, dried, cured, etc. A laminated board can be manufactured by performing.

  The laminate of the present invention can be used for various printed wiring boards (PWB) and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, the single-sided PWB, the double-sided PWB, and the multilayer PWB (3 It is applicable to rigid PWB, flexible PWB (FPC), and rigid flex PWB from the viewpoint of the type of insulating substrate material.

[Lamination board and printed wiring board positioning method using the same]
A method for positioning the laminate of the copper foil with carrier and the resin substrate of the present invention will be described. First, the laminated board of copper foil with a carrier and a resin substrate is prepared. As a specific example of the laminated board of the copper foil with a carrier and the resin substrate of the present invention, at least one of a resin substrate such as a polyimide used for electrically connecting the main body substrate and the attached circuit substrate and them. In an electronic device composed of a flexible printed circuit board with copper wiring formed on the surface, a laminated board manufactured by accurately positioning the flexible printed circuit board and crimping it to the wiring ends of the main circuit board and the attached circuit board Is mentioned. That is, in this case, the laminate is a laminate in which the wiring end portions of the flexible printed circuit board and the main body substrate are bonded together by pressure bonding, or the wiring edge portions of the flexible printed circuit board and the circuit board are bonded together by pressure bonding. Laminated board. The laminated board has a mark formed of a part of the copper wiring and a separate material. The position of the mark is not particularly limited as long as it can be photographed by photographing means such as a CCD camera through the resin constituting the laminated plate. Here, the mark refers to a mark used to detect, position, or align the position of a laminated board, printed wiring board, or the like. In addition, when the copper foil with a carrier of this invention is the ultra-thin copper layer (ultra-thin copper layer which has a carrier) of the copper foil with a carrier, from the laminated board of copper foil with a carrier and a resin substrate as needed Remove the carrier.

  In the laminated plate thus prepared, when the above-described mark is photographed by the photographing means through the resin, the position of the mark can be detected satisfactorily. And the position of the said mark can be detected in this way, and the positioning of the laminated board of copper foil with a carrier and a resin substrate can be favorably performed based on the detected position of the mark. Similarly, when a printed wiring board is used as the laminated board, the photographing means can detect the position of the mark well by such a positioning method, and the printed wiring board can be positioned more accurately.

  Therefore, when one printed wiring board and another printed wiring board are connected, it is considered that the connection failure is reduced and the yield is improved. In addition, as a method of connecting one printed wiring board and another printed wiring board, connection via soldering or anisotropic conductive film (ACF), anisotropic conductive paste (Anisotropic Conductive Paste, A known connection method such as connection via ACP) or connection via a conductive adhesive can be used. In the present invention, the “printed wiring board” includes a printed wiring board, a printed circuit board, and a printed board on which components are mounted. Also, it is possible to manufacture a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards according to the present invention, and at least one printed wiring board according to the present invention. One printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention can be connected, and an electronic apparatus can be manufactured using such a printed wiring board. In the present invention, “copper circuit” includes copper wiring. Furthermore, the printed wiring board of the present invention may be connected to a component to produce a printed wiring board. Further, at least one printed wiring board of the present invention is connected to another printed wiring board of the present invention or a printed wiring board not corresponding to the printed wiring board of the present invention. A printed wiring board in which two or more printed wiring boards are connected may be manufactured by connecting two or more printed wiring boards and components. Here, as “components”, connectors, LCDs (Liquid Crystal Display), electronic components such as glass substrates used in LCDs, ICs (Integrated Circuits), LSIs (Large scale integrated circuits), VLSIs (Very Large scale circuits). ), Electronic components including semiconductor integrated circuits such as ULSI (Ultra-Large Scale Integration) (for example, IC chips, LSI chips, VLSI chips, ULSI chips), components for shielding electronic circuits, and covers on printed wiring boards Examples include parts necessary for fixing.

The positioning method according to the embodiment of the present invention may include a step of moving a laminated board (including a laminated board of copper foil and a resin substrate and a printed wiring board). In the moving process, for example, it may be moved by a conveyor such as a belt conveyor or a chain conveyor, may be moved by a moving device provided with an arm mechanism, or may be moved by floating a laminated plate using gas. It may be moved by a moving means, a moving device or moving means (including a roller or a bearing) that moves a laminated plate by rotating an object such as a substantially cylindrical shape, a moving device or moving means that uses hydraulic pressure as a power source, Moving devices and moving means powered by air pressure, moving devices and moving means powered by motors, gantry moving linear guide stages, gantry moving air guide stages, stacked linear guide stages, linear motor drive stages, etc. It may be moved by a moving device or moving means having a stage. Moreover, you may perform the movement process by a well-known moving means. In the step of moving the laminated plate, the laminated plate can be moved for alignment. Then, it is considered that by performing alignment, connection failure is reduced and yield is improved when one printed wiring board is connected to another printed wiring board or components.
The positioning method according to the embodiment of the present invention may be used for a surface mounter or a chip mounter.
Moreover, the printed wiring board which has the circuit provided on the resin board and the said resin board may be sufficient as the laminated board of the copper foil with a carrier and the resin board which are positioned in this invention. In that case, the mark may be the circuit.

  In the present invention, “positioning” includes “detecting the position of a mark or an object”. In the present invention, “alignment” includes “after detecting the position of a mark or object, moving the mark or object to a predetermined position based on the detected position”.

As Examples 1 to 30 and Comparative Examples 1 to 13, various carriers described in Table 9 were prepared, and an intermediate layer described in Table 10 was formed on the surface of the carrier with a roll-to-roll type continuous plating line. . And the ultra-thin copper layer of the thickness of Table 10 was formed on the surface of the intermediate layer on the following conditions. And the surface of the ultra-thin copper layer was plated on the conditions of Tables 1-8 as a roughening process.

In addition, for example, “Ni / electrolytic pure chromate” in the column of the intermediate layer in Table 10 indicates that electrolytic pure chromate was performed after Ni plating.

<Intermediate layer>
(1) “Ni”: indicates that Ni plating was performed under the following conditions.
Liquid composition: nickel sulfate: 270-280 g / L, nickel chloride: 35-45 g / L, nickel acetate: 10-20 g / L, boric acid: 30-40 g / L, brightener: saccharin, butynediol, dodecyl sulfate Sodium: 55-75 ppm
pH: 4-6
Bath temperature: 55-65 ° C
Current density: 10 A / dm ²
Ni adhesion amount: 500 to 20000 μg / dm ²
(2) “Electrolytically pure chromate”: Indicates that electrolytically pure chromate treatment was performed under the following conditions.
Liquid composition: potassium dichromate 1-10 g / L, zinc 0 g / L
pH: 7-10
Liquid temperature: 40-60 degreeC
Current density: 2 A / dm ²
Cr adhesion amount: 10 to 100 μg / dm ²
(3) “Electrolytic zinc chromate”: indicates that electrolytic zinc chromate treatment was performed under the following conditions.
Liquid composition: potassium dichromate 1-10 g / L, zinc 0.5-5 g / L
pH: 7-10
Liquid temperature: 40-60 degreeC
Current density: 2 A / dm ²
Cr adhesion amount: 10 to 100 μg / dm ²
(4) “Immersion pure chromate”: indicates that immersion pure chromate treatment was performed under the following conditions.
Liquid composition: potassium dichromate 1-10 g / L, zinc 0 g / L
pH: 7-10
Liquid temperature: 40-60 degreeC
Immersion time: 5 to 30 seconds (5) “Ni—Mo”: Indicates that nickel molybdenum alloy plating was performed under the following conditions.
Liquid composition: Ni sulfate sulfate hexahydrate: 50 g / dm ³ , sodium molybdate dihydrate: 60 g / dm ³ , sodium citrate: 90 g / dm ³
Liquid temperature: 30 ° C
Current density: 1-4 A / dm ²
Energizing time: 3 to 25 seconds Total adhesion amount of Ni and Mo: 500 to 5000 μg / dm ²
(6) “Co—Mo”: indicates that cobalt molybdenum alloy plating was performed under the following conditions.
Liquid composition: Co sulfate 50 g / L, sodium molybdate dihydrate: 60 g / L, sodium citrate: 90 g / L
Liquid temperature: 30 ° C
Current density: 1-4 A / dm ²
Energizing time: 3 to 25 seconds Total adhesion amount of Co and Mo: 200 to 2000 μg / dm ²

<Ultrathin copper layer>
As described above, after forming an intermediate layer on the carrier, an ultrathin copper layer with a predetermined thickness is formed on the intermediate layer by electroplating under the following conditions on a roll-to-roll type continuous plating line. A copper foil with a carrier was prepared.
Copper concentration: 90-110 g / L
Sulfuric acid concentration: 90-110 g / L
Chloride ion concentration: 50-90ppm
Leveling agent 1 (bis (3sulfopropyl) disulfide): 10 to 30 ppm
Leveling agent 2 (amine compound): 10 to 30 ppm
In addition, the following amine compound was used as the leveling agent 2.
(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, an aromatic substituted alkyl group, an unsaturated hydrocarbon group, and an alkyl group.)
Electrolyte temperature: 50-80 ° C
Current density: 100 A / dm ²
Electrolyte linear velocity: 1.5-5 m / sec

After performing the plating treatment (described in Tables 1 to 8) as the roughening treatment described above, Examples 1 to 13, 15 to 20, 22 to 24, 26 to 28, Comparative Examples 2, 4, and 7 to 10 are described below. The plating treatment for forming the heat resistant layer and the rust preventive layer was performed. In Table 10, “Ni—Co”, “Ni—P”, “Ni—Zn”, “Ni—W”, “chromate”, and “silane coupling treatment” mean the following surface treatments. To do.
The conditions for forming the heat-resistant layer 1 are shown below.
・ Heat resistant layer 1
[Ni-Co]: Nickel-cobalt alloy plating solution composition: nickel 5-20 g / L, cobalt 1-8 g / L
pH: 2-3
Liquid temperature: 40-60 degreeC
Current density: 5 to 20 A / dm ²
Coulomb amount: 10-20 As / dm ²
[Ni-P]: Nickel-phosphorus alloy plating Liquid composition: Nickel 5-20 g / L, phosphorus 2-8 g / L
pH: 2-3
Liquid temperature: 40-60 degreeC
Current density: 5 to 20 A / dm ²
Coulomb amount: 10-20 As / dm ²

A heat-resistant layer 2 was formed on the copper foil provided with the heat-resistant layer 1. In Comparative Examples 3, 5, and 6, the heat-resistant layer 2 was directly formed on the ultrathin copper layer without performing the rough plating treatment. The conditions for forming the heat-resistant layer 2 are shown below.
・ Heat resistant layer 2
[Ni-Zn]: Nickel-zinc alloy plating Liquid composition: Nickel 2-30 g / L, zinc 2-30 g / L
pH: 3-4
Liquid temperature: 30-50 degreeC
Current density: 1 to ^{2 A} / dm ²
Coulomb amount: 1-2 As / dm ²
[Ni-W]: Nickel-tungsten alloy plating solution composition: nickel 2-30 g / L, tungsten 0.5-20 g / L
pH: 3-4
Liquid temperature: 30-50 degreeC
Current density: 1 to ^{2 A} / dm ²
Coulomb amount: 1-2 As / dm ²

On the copper foil which gave the said heat-resistant layers 1 and 2, the antirust layer was further formed. The conditions for forming the rust preventive layer are shown below.
Rust prevention layer [chromate]: Chromate treatment Liquid composition: Potassium dichromate 1-10 g / L, Zinc 0-5 g / L
pH: 3-4
Liquid temperature: 50-60 degreeC
Current density: 0 to ^{2 A} / dm ² (for immersion chromate treatment)
Coulomb amount: 0 to ^{2 As} / dm ² (for immersion chromate treatment)

A weather-resistant layer was further formed on the copper foil to which the heat-resistant layers 1 and 2 and the rust-proof layer were applied or on the copper foil to which the heat-resistant layers 1 and 2 and the rust-proof layer were not applied. The formation conditions are shown below.
As silane coupling agents having amino groups, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane (Example 17), N-2- (aminoethyl) -3-aminopropyltriethoxysilane (implementation) Examples 1-13, 15, 16, 24, 26-30 Comparative Examples 2-10), N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane (Example 18), 3-aminopropyltrimethoxysilane (Example 19), 3-aminopropyltriethoxysilane (Example 20), 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine (Example 22), N-phenyl-3- Application and drying were performed with aminopropyltrimethoxysilane (Example 23) to form a weather-resistant layer. These silane coupling agents can be used in combination of two or more.

In addition, the rolled copper foil was manufactured as follows. After manufacturing the copper ingot of the composition shown in Table 9 and performing hot rolling, annealing and cold rolling of a continuous annealing line at 300 to 800 ° C. were repeated to obtain a rolled sheet having a thickness of 1 to 2 mm. This rolled plate was annealed and recrystallized in a continuous annealing line at 300 to 800 ° C., and finally cold-rolled to the thickness shown in Table 9 to obtain a copper foil. “Tough pitch copper” in the “Type” column of Table 9 indicates tough pitch copper standardized in JIS H3100 C1100, and “Oxygen-free copper” indicates oxygen-free copper standardized in JIS H3100 C1020. “Tough pitch copper + Ag: 100 ppm” means that 100 mass ppm of Ag is added to tough pitch copper.
The electrolytic copper foil used was an electrolytic copper foil HLP foil manufactured by JX Nippon Mining & Metals. When electrolytic polishing was performed, the plate thickness after electrolytic polishing was described.
Table 9 shows the points of the copper foil preparation process before the surface treatment. “High gloss rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the value of the oil film equivalent. “Normal rolling” means that the final cold rolling (cold rolling after the final recrystallization annealing) was performed at the oil film equivalent value described. “Chemical polishing” and “electropolishing” mean the following conditions.
“Chemical polishing” was performed using an etching solution of 1 to 3% by mass of H ₂ SO ₄ , 0.05 to 0.15% by mass of H ₂ O ₂ , and the remaining water, and the polishing time was 1 hour.
“Electropolishing” is a condition of phosphoric acid 67% + sulfuric acid 10% + water 23%, voltage 10 V / cm ² , and the time shown in Table 9 (when electropolishing for 10 seconds, the polishing amount is 1 to 2 μm. ).

Various evaluation was performed as follows about each sample of the Example and comparative example which were produced as mentioned above.
(1) Measurement of surface roughness (Rz);
Ten-point average roughness was measured on the roughened surface using a contact roughness meter Surfcorder SE-3C manufactured by Kosaka Laboratory Co., Ltd. in accordance with JIS B0601-1994. In an apparatus for forming an ultrathin copper layer on a carrier in a direction perpendicular to MD (measured length 0.8 mm, evaluation length 4 mm, cut-off value 0.25 mm, feed rate 0.1 mm / second) The measurement position was changed 10 times (perpendicular to the foil passing direction), and the values obtained by 10 measurements were obtained. In addition, when the surface treatment is performed to provide a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. after roughening the surface of the ultra-thin copper layer of the copper foil with carrier or without performing the roughening treatment The above measurement was performed on the surface of the ultrathin copper layer of the carrier-attached copper foil after the surface treatment of the heat-resistant layer, the rust-proof layer, the weather-resistant layer, and the like.
In addition, the surface roughness (Rz) was similarly calculated | required about the surface by which the intermediate | middle layer of the carrier before intermediate | middle layer formation was provided.

(2) Particle area ratio (A / B);
The surface area of the roughened particles was measured by a laser microscope. An area B equivalent to 100 × 100 μm at a magnification of 2000 times of the roughened surface of the ultrathin copper layer of the copper foil with carrier of each example and comparative example using a laser microscope VK8500 manufactured by Keyence Corporation (in the actual data, 9982.52 μm) The three-dimensional surface area A in ² ) was measured, and the setting was performed by the method of three-dimensional surface area A ÷ two-dimensional surface area B = area ratio (A / B). In addition, after roughening the surface of the ultra-thin copper layer of the copper foil with carrier, or when performing surface treatment to provide a heat-resistant layer, rust-proof layer, weather-resistant layer, etc. without roughening treatment Measured the surface of the ultrathin copper layer after the surface treatment of the heat-resistant layer, the rust-proof layer, the weather-resistant layer and the like.

(3) Glossiness;
Using Nippon Denshoku Industries Co., Ltd. gloss meter handy gloss meter PG-1 conforming to JIS Z8741, MD (foil passing direction in an apparatus for forming an ultra thin copper layer on a carrier) and TD (ultra thin copper on a carrier) It measured about the roughening surface of the ultra-thin copper layer of copper foil with a carrier at each incident angle of 60 degree | times (direction perpendicular | vertical to the foil passing direction in the apparatus which forms a layer). In addition, after performing a surface treatment to provide a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. without performing the roughening treatment after the ultrathin copper layer of the copper foil with carrier, Said measurement was performed about the surface of the ultra-thin copper layer of the copper foil with a carrier after surface-treating the said heat-resistant layer, a rust prevention layer, a weather resistance layer, etc. When the carrier-attached copper foil was the ultrathin copper layer of the carrier-attached copper foil, the above measurement was performed on the roughened surface of the ultrathin copper layer.
The glossiness of the surface on the side where the intermediate layer of the carrier before forming the intermediate layer is provided was determined in the same manner.

(4) haze value;
The roughened surface of the ultrathin copper layer of the copper foil with carrier of each Example and Comparative Example was bonded to both sides of a polyimide film with a thermosetting adhesive for lamination (thickness 50 μm, Upilex made by Ube Industries), and the carrier was removed. After that, the ultrathin copper layer was removed by etching (ferric chloride aqueous solution) to prepare a sample film. A haze value of a sample film was measured using a haze meter HM-150 manufactured by Murakami Color Research Laboratory based on JIS K7136 (2000). In addition, when the surface treatment is performed to provide a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. after roughening the surface of the ultra-thin copper layer of the copper foil with carrier or without performing the roughening treatment The above measurement was performed on the surface of the ultrathin copper layer after the surface treatment of the heat-resistant layer, the rust-proof layer, the weather-resistant layer, and the like.

(5) Visibility (resin transparency);
The surface of the ultra-thin copper layer of the copper foil with carrier of each example and comparative example was bonded to both sides of a polyimide film with a thermosetting adhesive for lamination (thickness 50 μm, Ube Industries Upilex), The carrier was removed, and then the ultrathin copper layer was removed by etching (ferric chloride aqueous solution) to prepare a sample film. A printed material (black circle with a diameter of 6 cm) was attached to one surface of the obtained resin layer, and the visibility of the printed material was judged from the opposite surface through the resin layer. “◎” indicates that the outline of the black circle of the printed material is clear when the length is 90% or more of the circumference, and “Clear” indicates that the outline of the black circle is clear when the length is 80% or more and less than 90% of the circumference. “O” (passed above), a black circle with a clear outline of 0 to less than 80% of the circumference and a broken outline were evaluated as “x” (failed). In addition, when surface treatment is performed to provide a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. after roughening the surface of the copper foil or without performing the roughening treatment, the heat-resistant layer, rust-proof Said measurement was performed about the surface of the ultra-thin copper layer of the copper foil with a carrier after surface-treating a layer, a weather resistance layer, etc.

(6) Peel strength (adhesive strength);
After laminating the surface of the ultra-thin copper layer of the copper foil with carrier of each Example and Comparative Example on a polyimide film with a thermosetting adhesive for lamination (thickness 50 μm, Upilex manufactured by Ube Industries), IPC Based on -TM-650, the normal peel strength was measured with a tensile tester Autograph 100. The normal peel strength of 0.7 N / mm or more can be used for laminated substrates.
The lamination conditions of the carrier-attached copper foil and the polyimide film were the conditions recommended by the polyimide film manufacturer. In addition, the specific measurement was performed as follows.
After laminating the surface of the surface treated copper foil with carrier on a polyimide film with a thermosetting adhesive for lamination (thickness 50 μm, Upilex manufactured by Ube Industries), the carrier is peeled off and laminated with the polyimide film. The peel strength was measured after copper plating was performed so that the thickness of the ultrathin copper layer was 12 μm. In addition, when the surface treatment is performed to provide a heat-resistant layer, a rust-proof layer, a weather-resistant layer, etc. after roughening the surface of the ultra-thin copper layer of the copper foil with carrier or without performing the roughening treatment The above measurement was performed on the surface of the ultrathin copper layer of the carrier-attached copper foil after the surface treatment of the heat-resistant layer, the rust-proof layer, the weather-resistant layer, and the like.

(7) Solder heat resistance evaluation;
The surface of the ultra-thin copper layer of the copper foil with carrier of each Example and Comparative Example was bonded to both surfaces of a polyimide film with a thermosetting adhesive for lamination (thickness 50 μm, Upilex made by Ube Industries). . About the obtained double-sided laminated board, the test coupon based on JISC6471 was created. The prepared test coupon was exposed to high temperature and high humidity of 85 ° C. and 85% RH for 48 hours, and then floated in a solder bath at 300 ° C. to evaluate solder heat resistance. After the solder heat resistance test, at the interface between the copper foil roughening surface and the polyimide resin adhesion surface, the area where the interface discolored due to blistering in an area of 5% or more of the copper foil area in the test coupon is x (failed), area When the color change was less than 5%, the case was evaluated as ◯, and the case where no color change occurred was evaluated as ◎.
In addition, after roughening the surface of the ultra-thin copper layer of the copper foil with carrier, or when performing surface treatment to provide a heat-resistant layer, rust-proof layer, weather-resistant layer, etc. without roughening treatment Measured the surface of the ultrathin copper layer of the carrier-attached copper foil after the surface treatment of the heat-resistant layer, the rust-proof layer, the weather-resistant layer and the like.

(8) Circuit shape by etching (fine pattern characteristics)
The surface of the ultra-thin copper layer of the copper foil with carrier of each Example and Comparative Example was bonded to both surfaces of a polyimide film with a thermosetting adhesive for lamination (thickness 50 μm, Upilex made by Ube Industries). . In order to perform fine pattern circuit formation, it is necessary to make the copper foil thickness the same, and here, a thickness of 12 μm copper foil was used as a reference. That is, when the thickness was thicker than 12 μm, the thickness of the ultrathin copper layer was reduced to 12 μm by electrolytic polishing. On the other hand, when the thickness was thinner than 12 μm, the thickness of the ultrathin copper layer was increased to 12 μm by copper plating. On one side of the resulting double-sided laminate, a fine pattern circuit is printed on the copper foil glossy side of the laminate by a photosensitive resist coating and exposure process, and unnecessary portions of the ultrathin copper layer are etched under the following conditions: Then, a fine pattern circuit having L / S = 20/20 μm was formed. Here, the circuit width was set such that the bottom width of the circuit cross section was 20 μm.
(Etching conditions)
Equipment: Spray type small etching equipment Spray pressure: 0.2 MPa
Etching solution: Ferric chloride aqueous solution (specific gravity 40 Baume)
Liquid temperature: 50 ° C
After forming the fine pattern circuit, the photosensitive resist film was peeled off by dipping in a 45 ° C. NaOH aqueous solution for 1 minute.

(9) Calculation of etching factor (Ef) The fine pattern circuit sample obtained above was observed from the top of the circuit at a magnification of 2000 using a scanning electron micrograph S4700 manufactured by Hitachi High-Technologies Corporation. The top width (Wa) at the top and the bottom width (Wb) at the bottom of the circuit were measured. The copper foil thickness (T) was 12 μm. The etching factor (Ef) was calculated by the following formula.
Etching factor (Ef) = (2 × T) / (Wb−Wa)
In addition, after roughening the surface of the ultra-thin copper layer of the copper foil with carrier, or when performing surface treatment to provide a heat-resistant layer, rust-proof layer, weather-resistant layer, etc. without roughening treatment Made the above measurements on the surface of the carrier-attached copper foil after the surface treatment of the heat-resistant layer, rust-proof layer, weather-resistant layer and the like.
(10) Measurement of transmission loss About the copper foil with a carrier of each Example and Comparative Example, the surface of the ultra-thin copper layer of the copper foil with a carrier, the surface treated side surface, and a commercially available liquid crystal polymer resin (Vecstar manufactured by Kuraray Co., Ltd.) After bonding to CTZ-50 μm), a microstrip line is formed by etching so that the characteristic impedance is 50Ω, and the transmission coefficient is measured using a network analyzer HP8720C manufactured by HP, and at a frequency of 20 GHz and a frequency of 40 GHz. Transmission loss was determined. As an evaluation of transmission loss at a frequency of 20 GHz, 未 満 less than 3.7 dB / 10 cm, ◎ 3.7 dB / 10 cm or more and less than 4.1 dB / 10 cm, 、 ４ 4.1 dB / 10 cm or more and less than 5.0 dB / 10 cm, △, 5.0 dB / 10 cm or more was defined as x.
In addition, after roughening the surface of the ultra-thin copper layer of the copper foil with carrier, or when performing surface treatment to provide a heat-resistant layer, rust-proof layer, weather-resistant layer, etc. without roughening treatment Made the above measurements on the surface of the carrier-attached copper foil after the surface treatment of the heat-resistant layer, rust-proof layer, weather-resistant layer and the like.
The conditions and evaluation results of the above tests are shown in Tables 1 to 11.

In Table 10, "-" in the column of heat-resistant layer 1, heat-resistant layer 2, rust-proof layer, and weather-resistant layer is treatment for forming the heat-resistant layer 1, heat-resistant layer 2, rust-proof layer, and weather-resistant layer. Indicates not to go.

〔Evaluation results〕
Examples 1 to 30 all had good haze values, visibility, and peel strength. The solder heat resistance evaluation was also good. Also, the transmission loss was small and good.
Since Comparative Examples 1-2, 4, 7-11, and 13 had remarkably high haze values and large surface roughness, the visibility was poor.
In Comparative Examples 3, 5, 6, and 12, the visibility was excellent, but the peel strength was insufficient and the substrate adhesion was poor. In Comparative Examples 1 to 13, the solder heat resistance evaluation was poor.
Further, in Example 5, the 60 degree glossiness of Rz and MD and the surface area ratio A / B are substantially the same values as in Example 15, but the 60 degree glossiness of MD and TD of the roughened surface of Example 5 are the same. Since the value of the ratio C to 60 degree glossiness was in the range of 0.84 and 0.80 to 1.40, the C value was outside the range of 0.75 and 0.80 to 1.40. The haze value was smaller than in Example 15.
For the same reason, the haze value of Example 16 was smaller than that of Example 17.
FIG. 1 shows (a) Comparative Example 1, (b) Comparative Example 2, (c) Comparative Example 3, (d) Comparative Example 4, (e) Example 1, and (f) in the Rz evaluation. The SEM observation photograph of the copper foil surface of Example 2 is shown, respectively.
In addition, after forming the intermediate layer and the ultra-thin copper layer on both sides of the carrier under the same conditions using the same carrier as each of the above examples and comparative examples, the same surface treatment is performed to produce a surface-treated copper foil As a result of the evaluation, the same evaluation results as those of the respective Examples and Comparative Examples were obtained on both sides. In addition, when electrolytic polishing or chemical polishing was performed on the carrier, surface treatment was performed after electrolytic polishing or chemical polishing was performed on both surfaces. Moreover, about Example 21, Example 25, and the comparative example 10, the glossy surface (surface on the side which is in contact with the drum at the time of electrolytic copper foil production) is subjected to electrolytic polishing and / or chemical polishing, A predetermined surface treatment or formation of an intermediate layer or the like was performed after setting the roughness Rz and glossiness of TD to be the same as the deposition surface.
When surface treatment such as roughening treatment is performed on both surfaces of the copper foil, the surface treatment may be performed on both surfaces simultaneously, or the surface treatment may be separately performed on one surface and the other surface. In addition, when performing surface treatment on both surfaces simultaneously, it is good to perform surface treatment using the surface treatment apparatus (plating apparatus) which provided the anode on both surfaces side of copper foil. In this example, surface treatment was performed on both sides simultaneously.

Claims (27)

A copper foil with a carrier having a carrier, an intermediate layer, and an ultrathin copper layer in this order. Is 0.20 to 0.80 μm, the 60 ° glossiness of MD of the roughened surface is 76 to 350%,
The copper foil with a carrier whose ratio A / B of the surface area A of the said roughening particle | grain and the area B obtained when the said roughening particle | grain is planarly viewed from the said copper foil surface side is 1.90-2.40.   The copper foil with a carrier according to claim 1, wherein the MD has a 60-degree glossiness of 90 to 250%.   The copper foil with a carrier according to claim 1 or 2, wherein the average roughness Rz of the TD is 0.30 to 0.60 µm.   Said A / B is 2.00-2.20, Copper foil with a carrier as described in any one of Claims 1-3.   The ratio C (C = (60 degree gloss of MD) / (60 degree gloss of TD)) of the 60 degree gloss of MD and 60 degree gloss of TD on the roughened surface is 0.80 to 1. It is 40, Copper foil with a carrier as described in any one of Claims 1-4.   The ratio C (C = (60 ° gloss of MD) / (60 ° gloss of TD)) of the 60 ° gloss of MD and 60 ° gloss of TD on the roughened surface is 0.90 to 1. The copper foil with a carrier according to claim 5, which is 35.   After laminating the copper foil with a carrier on both surfaces of a 50 μm thick resin substrate from the roughened surface side of the ultrathin copper layer, the carrier was removed, and the ultrathin copper layers on both sides were removed by etching. When the haze value of the resin substrate is 20 to 70%, the copper foil with a carrier according to any one of claims 1 to 6.   A copper foil with a carrier having a carrier, an intermediate layer, and an ultrathin copper layer in this order, and the carrier is removed after being bonded to both surfaces of a 50 μm thick resin substrate from the roughened surface side of the ultrathin copper layer. And the copper foil with a carrier from which the haze value of the said resin substrate will be 20 to 70% when the said ultra-thin copper layer of both surfaces is removed by an etching.   The said roughening process surface contains any 1 or more types selected from the group which consists of copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium, and zinc, as described in any one of Claims 1-8. Copper foil with carrier.   The copper foil with a carrier as described in any one of Claims 1-9 which equips the said roughening process surface with a resin layer.   The copper foil with a carrier according to claim 10, wherein the resin layer includes a dielectric.   The copper foil with a carrier as described in any one of Claims 1-11 provided with the said ultra-thin copper layer on both surfaces of the said carrier.   The copper foil with a carrier as described in any one of Claims 1-11 provided with the roughening process layer in the surface on the opposite side to the said ultra-thin copper layer side of the said carrier.   The laminated board manufactured by laminating | stacking the copper foil with a carrier and resin substrate as described in any one of Claims 1-13.   The printed wiring board using the copper foil with a carrier as described in any one of Claims 1-13.   An electronic device using the printed wiring board according to claim 15.   A method for manufacturing a printed wiring board in which two or more printed wiring boards are connected by connecting two or more printed wiring boards according to claim 15.   Connecting at least one printed wiring board according to claim 15 and another printed wiring board according to claim 15 or a printed wiring board not corresponding to the printed wiring board according to claim 15; A method of manufacturing a printed wiring board in which two or more printed wiring boards are connected.   An electronic apparatus using at least one printed wiring board to which at least one printed wiring board manufactured by the method according to claim 17 is connected.   A method for producing a printed wiring board, comprising at least a step of connecting the printed wiring board according to claim 15 and a component. Connecting at least one printed wiring board according to claim 15 to another printed wiring board according to claim 15 or a printed wiring board not corresponding to the printed wiring board according to claim 15, and
Two printed wiring boards comprising at least a step of connecting a printed wiring board according to claim 15 or two or more printed wiring boards manufactured by the method according to claim 18 and a component. A method of manufacturing a printed wiring board connected as described above. A step of preparing the carrier-attached copper foil according to any one of claims 1 to 13 and an insulating substrate;
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, a copper-clad laminate is formed through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method. A step of forming a circuit on the ultrathin copper layer side surface or the carrier side surface of the carrier-attached copper foil according to any one of claims 1 to 13,
Forming a resin layer on the ultrathin copper layer side surface or the carrier side surface of the copper foil with carrier so that the circuit is buried;
Forming a circuit on the resin layer;
After forming a circuit on the resin layer, peeling the carrier or the ultra-thin copper layer; and
After the carrier or the ultra-thin copper layer is peeled off, the ultra-thin copper layer or the carrier is removed to be buried in the resin layer formed on the ultra-thin copper layer-side surface or the carrier-side surface. A method of manufacturing a printed wiring board including a step of exposing a circuit that is connected.   The step of forming a circuit on the resin layer includes attaching another carrier-attached copper foil on the resin layer from the ultrathin copper layer side, and using the carrier-attached copper foil attached to the resin layer to form the circuit. The method for manufacturing a printed wiring board according to claim 23, wherein the method is a forming step.   The method for producing a printed wiring board according to claim 24, wherein another carrier-attached copper foil to be bonded onto the resin layer is the carrier-attached copper foil according to any one of claims 1 to 13.   The print according to any one of claims 23 to 25, wherein the step of forming a circuit on the resin layer is performed by any one of a semi-additive method, a subtractive method, a partial additive method, and a modified semi-additive method. A method for manufacturing a wiring board.   27. The copper foil with a carrier that forms a circuit on the surface has a substrate or a resin layer on the surface on the carrier side or the surface on the ultrathin copper layer side of the copper foil with carrier. The manufacturing method of the printed wiring board of description.