JP2015056604A - Conductive material filling method, and conductive material filling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a filling rate of metallic powders included in a through-veer formed on a sheet material.SOLUTION: A plurality of through-veers 11 are formed on a sheet material 10. Then, on the one surface 10a side of the sheet material 10, an upper side mask 200 formed with a through-hole 203 communicating with the through-veers 11 is disposed, and on the other surface 10b side on the opposite side to the one surface 10a of the sheet material 10, a solvent adsorbing sheet 180 for adsorbing a solvent, and a lower side mask 170 formed with a through-hole 173 at a part corresponding to the through-hole 203 formed on the upper side mask 200 are successively disposed. The lower side mask 170, the solvent adsorbing sheet 180, the sheet material 10, and the upper side mask are mechanically fixed. While the inside of the through-veers 11 is sucked through the through-hole 173 formed on the lower side mask 170 from the other surface 10b side of the sheet material 10, conductive material 2 is filled into the through-veers 11 through the through-hole 203 formed on the upper side mask 200 from the one surface 10a side of the sheet material 10.

Description

  The present invention relates to a conductive material filling method and a conductive material filling apparatus for filling a conductive material into a through via formed in a sheet material.

  Conventionally, a multilayer board configured by laminating a plurality of sheet materials (resin films) on which wiring patterns are formed has been proposed. In this multilayer substrate, through-vias are formed in each sheet material by a laser processing machine or the like, and interlayer connection portions are arranged in the respective through-vias. And the wiring pattern formed in each layer is electrically connected via the interlayer connection part. Note that the interlayer connection portion is configured by filling a through-via with a conductive material mixed with a metal powder and a solvent to form a paste, and sintering the metal powder contained in the conductive material.

  In such a multilayer substrate, as a method for filling a conductive material into a through via formed in a sheet material, for example, Patent Document 1 proposes the following method. That is, in this method, first, the suction sheet and the sheet material are sequentially stacked on the mounting surface of the filling base. Note that suction grooves are formed on the mounting surface of the filling base, and the suction sheet and the sheet material are fixed to the filling base by suction from the suction grooves. Then, the conductive material is applied on the sheet material, and the squeegee is moved in the horizontal direction (the surface direction of the sheet material) in a state where the squeegee is in contact with the sheet material, thereby filling the through vias with the conductive material. .

  According to this, the solvent contained in the conductive material can be absorbed by the adsorption sheet. Moreover, since the inside of the through via is also sucked by suction for fixing the sheet material to the filling base, the solvent contained in the conductive material can be further adsorbed to the suction sheet. Therefore, the filling rate of the metal powder in the through via can be increased.

JP 2011-187619 A

  However, in the above-described filling method of the conductive material, since the suction sheet and the sheet material are fixed to the filling base by suction, it is difficult to efficiently suck only the through vias in the sheet material. For this reason, there is a demand to efficiently adsorb the solvent contained in the conductive material to the adsorption sheet and further increase the filling rate of the metal powder in the through via.

  In view of the above points, an object of the present invention is to provide a conductive material filling method and a conductive material filling apparatus capable of increasing the filling rate of metal powder contained in a through via formed in a sheet material.

  In order to achieve the above object, according to the first aspect of the present invention, a plurality of through vias (11) penetrating the sheet material (10) are filled with a conductive material (2) containing a metal powder and a solvent. A method of filling a material, the step of forming a plurality of through vias that penetrate between one surface (10a) and the other surface (10b) opposite to the one surface on the sheet material, An upper mask (200) formed with a through hole (203) communicating with the through via is disposed, and a solvent adsorbing sheet (180) for adsorbing a solvent on the other side of the sheet material, and a through formed in the upper mask A fixing step in which a lower mask (170) in which a through hole (173) is formed in a portion corresponding to the hole is sequentially disposed, and the lower mask, the solvent adsorption sheet, the sheet material, and the upper mask are mechanically fixed; Shape from the other side of the material to the lower mask And filling a conductive material into the through via from the one surface side of the sheet material through the through hole formed in the upper mask while sucking the through via through the formed through hole. It is said.

  According to this, a through hole is formed in the lower mask at a portion corresponding to the through hole formed in the upper mask. For this reason, the inside of the through via filled with the conductive material can be efficiently sucked, and the solvent contained in the conductive material can be efficiently adsorbed to the solvent adsorption sheet. Therefore, the filling rate of the metal powder filled in the through via can be increased.

  In the invention according to claim 5, there is provided a conductive material filling apparatus for filling a plurality of through vias (11) penetrating the sheet material (10) with a conductive material (2) containing a metal powder and a solvent. And a lower base portion (151) in which a through hole (153) that communicates the bottom surface of the concave portion and the outside is formed, and a lower base portion that closes the concave portion. The lower mask (170) in which a through hole (173) that is fixed and communicated with the recess is formed, and the sheet material through the through hole formed in the lower base portion and the through hole formed in the lower mask. A suction part (160) for sucking the inside of the formed through via, an upper mask (200) disposed on the opposite side of the lower mask with the sheet material interposed therebetween, and an upper mask formed with a through hole (203) Fixed and the upper mask is the lower mask The upper base portion (191) fixed to the lower base portion so as to face each other, the filling head (110) filling the through material with the conductive material, and the filling head are moved in a predetermined direction in the surface direction of the sheet material And a feed mechanism (230), characterized by the following points.

  That is, the upper base portion and the lower base portion are arranged such that a solvent adsorbing sheet (180) that adsorbs a solvent and a sheet material are sequentially arranged on the lower mask, and then the solvent adsorbing sheet and the sheet material are used as the lower mask and the upper mask. The lower mask, solvent adsorbing sheet, sheet material, and upper mask are integrated so as to be mechanically fixed by sandwiching them in, and the through hole formed in the upper mask is formed so as to communicate with the through via The through-hole formed in the lower mask is formed in a portion corresponding to the through-hole formed in the upper mask, and the suction part is formed on the lower side when the conductive material is filled in the through via by the filling head. The inside of the through via is sucked through the through hole formed in the base portion and the through hole formed in the lower mask.

  According to this, a through hole is formed in the lower mask at a portion corresponding to the through hole formed in the upper mask. Then, when filling the conductive material into the through via with the filling head, the through via filled with the conductive material is sucked through the through hole formed in the lower base and the through hole formed in the lower mask. doing. For this reason, the inside of the through via filled with the conductive material can be efficiently sucked, and the solvent contained in the conductive material can be efficiently adsorbed to the solvent adsorption sheet. Therefore, the filling rate of the metal powder filled in the through via can be increased.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

It is a typical sectional view of a multilayer substrate in a 1st embodiment of the present invention. It is a fragmentary sectional view of the electrically-conductive material filling apparatus in 1st Embodiment of this invention. It is a fragmentary sectional view of the electrically-conductive material filling apparatus in 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing process of the multilayer substrate shown in FIG. It is sectional drawing shown in detail which shows the manufacturing process in the process of FIG.4 (c). FIG. 6 is a cross-sectional view showing a manufacturing process subsequent to FIG. 5. It is sectional drawing which shows the manufacturing process in 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be described with the same reference numerals.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings. In this embodiment, a conductive paste filling method and a conductive material filling apparatus performed when a multilayer substrate (for example, PALAP (registered trademark)) is manufactured will be described.

  First, the multilayer substrate will be briefly described. As shown in FIG. 1, the multilayer substrate 1 collectively heats and compresses a laminated body in which a plurality (four in this embodiment) of resin films 10 on which wiring patterns (conductor patterns) 12 are formed are laminated. It is formed by. The multilayer substrate 1 is formed with an interlayer connection portion 13 for electrically connecting the wiring patterns 12 of each layer.

  In addition, the interlayer connection part 13 is configured by filling the through via 11 formed in the resin film 10 with a conductive paste containing a metal powder and a solvent, and sintering the metal powder contained in the conductive paste.

  Next, a conductive material filling device for filling the through vias 11 formed in the resin film 10 with a conductive paste as a conductive material will be described with reference to FIGS. In the present embodiment, the resin film 10 corresponds to the sheet material of the present invention.

  As shown in FIGS. 2 and 3, the conductive material filling apparatus 100 according to the present embodiment includes a controller (not shown) as control means for controlling the filling head 110, the lower stage 150, the upper stage 190, the filling head 110, and the like. It has.

  In FIG. 2, the filling head 110 is shown as a schematic diagram, and the lower stage 150, a part of the upper stage 190, and the resin film 10 are shown as sectional views. 3 shows the filling head 110 as a schematic view seen from the direction A in FIG. 2, and the lower stage 150, the upper stage 190, and the resin film 10 are in a cross section taken along line III-III in FIG. It corresponds.

  The filling head 110 performs filling (imprinting) of a conductive paste containing metal powder and a solvent into the through via 11 formed in the resin film 10. In this embodiment, the first and second filling heads are used. 120 and 130.

  The first and second filling heads 120 and 130 include first and second vertical sliders 121 and 131, first and second vertical drive cylinders 122 and 132, first and second squeegee mechanisms 123 and 133, respectively. have.

  In the present embodiment, the first and second vertical sliders 121 and 131 are the first and second linear bushes 121a and 131a and the first and second linear bushes 121a and 131a, respectively. And shafts 121b and 131b. The first and second linear shafts 121b and 131b are inserted so as to be slidable in the axial direction of the first and second linear bushes 121a and 131a (the vertical direction in the drawing in FIG. 2).

  Two first and second vertical sliders 121 and 131 are provided in a direction perpendicular to the moving direction of the filling head 110 (the left and right direction in FIG. 2). The support plate 140 is provided so that one end portions of the first and second linear shafts 121b and 131b pass through the through holes formed in the support plate 140. The first and second vertical sliders 121 and 131 are connected by first and second connection plates 124 and 134 at the other end opposite to the one end protruding from the support plate 140, respectively.

  The first and second vertical drive cylinders 122 and 132 move the first and second vertical sliders 121 and 131 up and down by moving the first and second connection plates 124 and 134 in the vertical direction under the control of a controller (not shown). Move in the direction. In the present embodiment, the first and second vertical drive cylinders 122 and 132 are disposed between the first and second vertical sliders 121 and 131, respectively. The first and second vertical drive cylinders 122 and 132 are controlled independently. That is, the vertical movement of the first and second vertical sliders 121 and 131 can be performed independently.

  In the first and second squeegee mechanisms 123 and 133, the first and second squeegee holders 123b and 133b are provided with first and second squeegees 123a and 133a made of urethane rubber or the like. By being provided at one end of the first and second linear shafts 121b and 131b, the first and second linear shafts 121 and 131 can be moved in the vertical direction. The first and second squeegees 123a and 133a are provided so as to be inclined by a predetermined angle opposite to each other with respect to the normal direction to the surface of the upper mask 200 described later.

  The support plate 140 has first and second vertical sliders 121 and 131 (first and second linear shafts 121b and 131b) sandwiched between one surface of the first and second squeegee mechanisms 123 and 133. A pair of slide blocks 141 are provided. The slide block 141 is engaged with a slide guide 220 described later.

  The lower stage 150 includes a lower base portion 151, a vacuum pump 160, a lower mask 170, and the like.

  In the lower base portion 151, a recess 152 is formed at a substantially central portion, and a through-hole 153 that connects the inside and the outside of the recess 152 is formed at a substantially central portion of the recess 152. The through hole 153 is connected to the vacuum pump 160, and the concave portion 152 is vacuum-sucked through the through hole 153. In the present embodiment, the vacuum pump 160 corresponds to the suction unit of the present invention.

  The lower mask 170 is disposed on the lower base portion 151 so as to close the recess 152. Specifically, the lower mask 170 has a protective plate 171 disposed on an outer edge portion, and is fastened to the lower base portion 151 together with the protective plate 171 via a screw 172. The lower mask 170 corresponds to a through-hole 203 formed in the upper mask 200 described later, and a cylindrical through-hole 173 communicating with the recess 152 is formed.

  On the lower mask 170, a solvent adsorbing sheet (hereinafter simply referred to as an adsorbing sheet) 180 for adsorbing a solvent is disposed. The adsorbing sheet 180 may be made of any material that can absorb the solvent contained in the conductive paste, and common fine paper, porous resin, or the like is used.

  In addition, since the solvent is adsorbed (absorbed) in the adsorption sheet 180 as the conductive paste is filled in the through vias 11, the adsorption sheet 180 is replaced with a new one as appropriate according to the degree of adsorption of the solvent.

  Then, the other surface 10 b of the resin film 10 on which the plurality of through vias 11 are formed is arranged on the suction sheet 180 so as to face the suction sheet 180. Here, the through hole 173 of the present embodiment has a lower mask 170 in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10 when viewed from the normal direction to the one surface 10 a of the resin film 10. It forms so that it may be located inside the opening end of the side.

  The upper stage 190 includes a frame-shaped upper base 191, an upper mask 200, a slide guide 220, and the like.

  The upper mask 200 is disposed so as to close one opening end (lower opening end in FIG. 1) of the upper base portion 191. Specifically, the upper mask 200 has a protective plate 201 disposed on an outer edge portion thereof, and is fastened to the upper base portion 191 together with the protective plate 201 via screws 202. Further, the upper mask 200 is formed with a through hole 203 communicating with the through via 11 formed in the resin film 10. The through hole 203 of the present embodiment has an opening end on the upper mask 200 side in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10 when viewed from the normal direction to the one surface 10 a of the resin film 10. It is formed so that it may be located inside.

  The upper base portion 191 is screwed to the lower base portion 151 so that the suction sheet 180 and the resin film 10 are sandwiched between the upper mask 200 and the lower mask 170 and mechanically fixed. It is integrated with the lower base part 151 by being fastened via

  Although not particularly shown in the present embodiment, the lower base portion 151 is provided with pins, and the lower mask 170, the suction sheet 180, the resin film 10, and the upper mask 200 are positioned at predetermined positions. Holes are formed. And by inserting a pin into each positioning hole, it is possible to prevent the lower mask 170, the suction sheet 180, the resin film 10, and the upper mask 200 from being displaced.

  The slide guide 220 is provided so as to cross the opening end of the base portion 191 opposite to the side on which the upper mask 200 is provided and to be parallel to the surface direction of the resin film 10. Specifically, the slide guide 220 is composed of a pair of rod-shaped members corresponding to the interval between the slide blocks 141 in the filling head 110, and the slide block 141 is engaged therewith.

  In addition, the slide block 141 in the filling head 110 is connected to a feed mechanism 230 including, for example, a feed screw and a feed motor. The feed screw is rotated by the feed motor, so that the feed screw can move along the slide guide 220 as the feed screw rotates. That is, the filling head 110 can move in the surface direction of the resin film 10.

  The conductive material filling apparatus 100 of this embodiment is configured as described above. Next, the manufacturing process of the multilayer substrate 1 will be described with reference to FIG.

  First, as shown in FIG. 4A, a resin film 10 that is an insulating substrate is prepared. In the present embodiment, a thermoplastic resin film made of a polyether ether ketone resin and a polyetherimide resin is prepared as the resin film 10. In addition, as the resin film 10, you may prepare things other than a thermoplastic resin film.

  Next, as shown in FIG. 4B, a plurality of through vias 11 are formed at predetermined positions of the prepared resin film 10 by a laser processing machine or the like. The through via 11 formed in the resin film 10 is not limited to the cylindrical shape shown in the figure, and may be a tapered shape such as a conical shape or each cylindrical shape.

  Subsequently, as shown in FIG. 4C, specifically, as will be described later, the conductive paste 2 is filled into the through via 11. In the present embodiment, as the conductive paste 2, for example, a paste obtained by adding terpine or the like having a melting point of room temperature as a solvent to a metal powder such as silver or tin is used.

  Then, as shown in FIG. 4D, a metal foil (for example, copper foil) for forming a wiring pattern is attached to one surface of the resin film 10 in which the conductive paste 2 is filled in the through via 11.

  Next, as shown in FIG. 4E, by forming an etching mask (not shown) with a photoresist on the surface of the metal foil of the resin film 10, and etching the metal foil using this etching mask, A desired wiring pattern 12 is formed.

  Subsequently, as shown in FIG. 4 (f), the resin film 10 having the wiring pattern 12 formed on one side thereof is aligned and sequentially laminated to constitute a laminate of a plurality of resin films 10.

  Next, as shown in FIG. 4G, the laminate in which a plurality of resin films 10 are laminated is sandwiched between vacuum press machines (not shown), and heated and compressed at a predetermined temperature for a predetermined time. In this heat compression step, for example, heating and compression are performed at 320 ° C. for about 3 hours with a pressure of 3 to 5 MPa (preferably about 4 MPa).

  Thereby, the metal powder contained in the conductive paste 2 is sintered, and the interlayer connection for electrically connecting the wiring patterns 12 formed in the respective layers by diffusion bonding with the metal foil constituting the wiring pattern 12. Part 13 is formed. In this way, the multilayer substrate 1 shown in FIG. 1 is manufactured.

  The above is the basic manufacturing process of the multilayer substrate 1 in the present embodiment. Next, the filling process in FIG. 4C will be specifically described. 5 and 6 are enlarged views of a portion in the vicinity of the resin film 10 shown in FIG.

  First, as shown in FIGS. 2, 3, and 5 (a), the resin film 10 is disposed on the suction sheet 180. Then, the lower stage 150 and the upper stage 190 are fastened with screws 210 so that the suction sheet 180 and the resin film 10 are sandwiched between the upper mask 200 and the lower mask 170 and mechanically fixed. To do.

  When the lower stage 150 and the upper stage 190 are fastened, as described above, the positioning pins pass through the lower mask 170, the suction sheet 180, the resin film 10, and the upper mask 200, thereby shifting the position. Can be prevented from occurring.

  Then, a desired amount of the conductive paste 2 is weighed, and the weighed conductive paste 2 is disposed on the outer edge portion of the upper mask 200. Specifically, the conductive paste 2 is disposed on the outer edge portion of the upper mask 200 where the through-hole 203 is formed, and on one end side in the moving direction of the filling head 110 (left and right direction in FIG. 5). To do.

  Further, vacuum suction is performed by the vacuum pump 160 and the inside of the through via 11 in the resin film 10 is sucked through the through holes 153 and 173. The vacuum suction by the vacuum pump 160 is continuously performed until a resin film 10 described later is taken out.

  Next, as shown in FIG. 5B, the first squeegee 123 a is brought into contact with the surface of the upper mask 200. The first squeegee 123a may be moved in the vertical direction by operating the first vertical drive cylinder 122 and moving the first connecting plate 124 downward. Further, the second squeegee 133 a is separated from the surface of the upper mask 200.

  Then, as shown in FIG. 5C, the first and second squeegees 123a and 133a (slide block 141) are moved to the right side of the drawing by the feed mechanism 230. As a result, the conductive paste 2 is imprinted into the through via 11 formed in the resin film 10 by the first squeegee 123a.

  In this case, since the inside of the through via 11 is sucked by the operation of the vacuum pump 160, the solvent contained in the conductive paste 2 is sucked and sucked on the suction sheet 180. At this time, in this embodiment, the through hole 173 of the lower mask 170 is formed in a portion corresponding to the through hole 203 of the upper mask 200. In other words, the through hole 173 of the lower mask 170 is formed in a portion corresponding only to the through via 11 into which the conductive paste 2 is imprinted. For this reason, the solvent contained in the conductive paste 2 can be efficiently sucked and adsorbed on the suction sheet 180.

  Since the solvent contained in the conductive paste 2 is adsorbed by the adsorption sheet 180, a space where the conductive paste 2 is not disposed is formed on the upper mask 200 side of the through via 11.

  Next, as shown in FIG. 6A, after the first and second squeegees 123a and 133a are moved to the end position on the right side of the paper, the first squeegee 123a is separated from the surface of the upper mask 200, and The second squeegee 133 a is brought into contact with the surface of the upper mask 200. The first and second squeegees 123a and 133a may be moved in the vertical direction by operating the first and second vertical drive cylinders 122 and 132 to move the first and second connection plates 124 and 134.

  Then, as shown in FIGS. 6B and 6C, the first and second squeegees 123a and 133a (slide block 141) are moved to the left side of the drawing by the feed mechanism 230. Thus, the conductive paste 2 is imprinted on the through via 11 formed in the resin film 10 by the second squeegee 133a.

  Also in this step, since the inside of the through via 11 is sucked by the operation of the vacuum pump 160, the solvent contained in the conductive paste 2 is efficiently sucked and sucked on the suction sheet 180.

  In this way, regardless of the composition ratio of the conductive paste, that is, the ratio of the metal powder such as silver or tin and the solvent, the metal powder can be concentrated in the through via 11 and the filling rate of the metal powder can be increased. .

  When the feed mechanism 230 includes a feed screw and a feed motor as in the present embodiment, the moving direction of the filling head 110 can be reversed by reversing the rotation direction of the feed screw.

  Finally, although not particularly illustrated, the vacuum suction by the vacuum pump 160 is stopped, the lower stage 150 and the upper stage 190 are separated, and the resin film 10 is taken out. Thus, the resin film 10 in which the through via 11 is filled with the conductive paste 2 is manufactured.

  Here, the example in which the first and second squeegees 123a and 133a are reciprocated once to fill the through via 11 with the conductive paste 2 has been described. However, the first and second squeegees 123 a and 133 a may be moved a plurality of times to imprint the conductive paste 2 on the through vias 11.

  As described above, in the present embodiment, the suction sheet 180 and the resin film 10 are mechanically fixed between the lower mask 170 and the upper mask 200. A through hole 173 is formed in the lower mask 170 at a portion corresponding to the through hole 203 formed in the upper mask 200. For this reason, the inside of the through via 11 into which the conductive paste 2 is imprinted can be efficiently sucked, and the solvent contained in the conductive paste 2 can be efficiently adsorbed to the adsorption sheet 180. Therefore, the filling rate of the metal powder filled in the through via 11 can be increased. Moreover, since the filling rate of the metal powder filled in the through via 11 can be increased, it is possible to suppress the occurrence of poor conduction between the wiring pattern 12 and the interlayer connection portion 13 when the conductive paste 2 is sintered.

  Furthermore, in this embodiment, when viewed from the normal direction with respect to one surface 10 a of the resin film 10, the through-hole 173 has a lower mask 170 in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10. It forms so that it may be located inside the opening end of the side. For this reason, it can suppress that the electrically conductive paste 2 penetrates into the minute space between the resin film 10 and the adsorption sheet 180 (seeps out).

  Further, in the present embodiment, when viewed from the normal direction to the one surface 10 a of the resin film 10, the through hole 203 is on the upper mask 200 side in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10. It is formed so that it may be located inside the opening end of. For this reason, even if the upper mask 200 and the resin film 10 are misaligned, it is possible to prevent the through hole 203 formed in the upper mask 200 and the through via 11 formed in the resin film 10 from communicating with each other.

(Second Embodiment)
A second embodiment of the present invention will be described. The present embodiment is different from the first embodiment in that the through via 11 is filled with the first and second conductive pastes, and the other parts are the same as those in the first embodiment, and the description thereof is omitted here. .

  As shown in FIG. 7A, in the present embodiment, first, a first upper mask 200a in which a through hole 203a communicating with a part of the plurality of through vias 11 formed in the resin film 10 is prepared. To do. Also, a first lower mask 170a having a through hole 173a formed in a portion corresponding to the through hole 203a formed in the first upper mask 200a is prepared. Then, a first fixing step of mechanically fixing the suction sheet 180 and the resin film 10 is performed using the first upper mask 200a and the first lower mask 170a.

  FIG. 7 is an enlarged view of a portion in the vicinity of the resin film 10 shown in FIG. The through hole 173a is an opening on the first lower mask 170a side in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10 when viewed from the normal direction to the one surface 10a of the resin film 10. It is formed so as to be located inside the end.

  Next, as shown in FIG. 7B, the first conductive paste is formed by performing the steps of FIGS. 5 and 6 in the through via 11 communicating with the through hole 203a formed in the first upper mask 200a. A first filling step for filling 2a is performed.

  At this time, the first lower mask 170a has a through hole 173a only in a portion corresponding to the through hole 203a. For this reason, only the through vias 11 filled with the first conductive paste 2a are efficiently sucked. In the present embodiment, as the first conductive paste 2a, a paste containing metal powder such as Bi—Sb—Te constituting a P-type thermoelectric material is used.

  Subsequently, as shown in FIG. 7C, a second upper mask 200 b in which through holes 203 b communicating with the remaining portions of the plurality of through vias 11 formed in the resin film 10 are prepared. Further, a second lower mask 170b having a through hole 173b formed in a portion corresponding to the through hole 203b formed in the second upper mask 200b is prepared. Then, a second fixing step of mechanically fixing the suction sheet 180 and the resin film 10 is performed using the second upper mask 200b and the second lower mask 170b.

  The through hole 173b is an opening on the second lower mask 170b side in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10 when viewed from the normal direction to the one surface 10a of the resin film 10. It is formed so as to be located inside the end.

  Thereafter, as shown in FIG. 7D, the process of FIGS. 5 and 6 is performed in the through via 11 communicating with the through hole 203b formed in the second upper mask 200b to perform the second conductive paste 2b. A second filling step for filling is performed.

  At this time, the through hole 173b is formed only in the portion corresponding to the through hole 203b in the second lower mask 170b. For this reason, only the through via 11 filled with the second conductive paste 2b is efficiently sucked. In the present embodiment, as the second conductive paste 2b, a paste containing metal powder such as Bi-Te constituting an N-type thermoelectric material is used.

  In this way, the resin film 10 in which the through vias 11 are filled with different first and second conductive pastes 2a and 2b is manufactured.

  As described above, the present invention can be applied to the case where the first conductive paste 2a is filled in a part of the plurality of through vias 11 and the second conductive paste 2b is filled in the remaining part of the plurality of through vias 11. .

  The through holes 173a and 173b are first and second lower sides in the through via 11 in which the opening end on the resin film 10 side is formed in the resin film 10 when viewed from the normal direction to the one surface 10a of the resin film 10. It is formed so as to be located inside the opening end on the mask 170a, 170b side. For this reason, when the resin film 10 is filled with the first and second conductive pastes 2a and 2b as in the present embodiment, the resin film 10 is mixed through a minute space between the resin film 10 and the suction sheet 180. Can be suppressed.

(Other embodiments)
The present invention is not limited to the embodiment described above, and can be appropriately changed within the scope described in the claims.

  For example, in each of the above embodiments, the filling head 110 may be provided with a holding unit that holds the conductive paste 2.

  In each of the above embodiments, terpine is exemplified as a solvent having a melting point of room temperature. For example, dihydroterpineol, glycol ether, isopropyl alcohol, butyl carbitol acetate, cyclohexane, methyl ethyl ketone, and the like may be employed.

  Further, in each of the above embodiments, for example, a solvent such as paraffin having a melting point of 43 ° may be employed. In this case, for example, the lower stage 150 may be provided with a heating mechanism, and the conductive paste 2 may be imprinted while the lower stage 150 (conductive paste 2) is heated to melt the conductive paste 2. Such solvents include other paraffinic hydrocarbons (eicosane), turpentine oil (eg alpha terpine), fatty acids (eg capric acid, undecylic acid, lauric acid, tridecylic acid, myristic acid, pentadecylic acid, palmitic acid, heptadecyl. Acid, stearic acid, nodecanoic acid, arachidic acid) and the like can also be employed.

  In the first embodiment, when viewed from the normal direction to the one surface 10a of the resin film 10, the opening end on the lower mask 170 side of the through via 11 is the opening end of the through hole 173 on the resin film 10 side. It may be located inside. According to this, the suction force of the through via 11 can be further increased, and the filling rate of the metal powder in the through via 11 can be further increased. Similarly, in the second embodiment, when viewed from the normal direction to the one surface 10a of the resin film 10, the opening ends on the first and second lower masks 170a, 170b side of the through via 11 are formed as through holes 173a, You may be located inside the opening end by the side of the resin film 10 in 173b.

  Moreover, in each said embodiment, the through-hole 173 may be not only cylindrical shape but tapered shape, such as a cone shape, for example, and may be each cylindrical shape.

  In the first embodiment, the method of filling the resin film 10 constituting the multilayer substrate 1 with the conductive paste 2 has been described. However, this invention can also be employ | adopted as a method of filling the said resin film 10 with the electrically conductive paste 2 at the time of comprising a board | substrate only with the single layer resin film 10, for example.

10 Resin film (sheet material)
DESCRIPTION OF SYMBOLS 11 Through-via 100 Conductive material filling apparatus 170 Lower mask 173 Through-hole 180 Adsorption sheet 200 Upper mask 203 Through-hole

Claims (5)

A conductive material filling method of filling a plurality of through vias (11) penetrating a sheet material (10) with a conductive material (2) containing a metal powder and a solvent,
Forming the plurality of through vias penetrating between one surface (10a) and the other surface (10b) opposite to the one surface in the sheet material;
A solvent adsorbing sheet that disposes an upper mask (200) in which a through hole (203) communicating with the through via is formed on one surface side of the sheet material and adsorbs the solvent on the other surface side of the sheet material. (180), a lower mask (170) having a through-hole (173) formed in a portion corresponding to the through-hole formed in the upper mask is sequentially disposed, the lower mask, the solvent adsorbing sheet, A fixing step of mechanically fixing the sheet material and the upper mask;
While sucking the inside of the through via from the other surface side of the sheet material through the through hole formed in the lower mask, from the one surface side of the sheet material through the through hole formed in the upper mask. And a filling step of filling the conductive material into the through via.   When the sheet material and the lower mask are viewed from a direction normal to the one surface of the sheet material, an opening end on the sheet material side in the through hole formed in the lower mask is formed in the sheet material. 2. The method of filling conductive material according to claim 1, wherein the conductive material is located inside an opening end on the lower mask side of the through via.   When the sheet material and the lower mask are viewed from a normal direction to one surface of the sheet material, an opening end on the lower mask side in the through via formed in the sheet material is formed in the lower mask. 2. The method for filling a conductive material according to claim 1, wherein the conductive material is located inside an opening end on the sheet material side in the through-hole. Repeat the fixing step and the filling step,
In the first fixing step, the first upper mask (200a) is used as the upper mask in which a through hole (203a) communicating with a part of the plurality of through vias formed in the sheet material is used. Using the first lower mask (170a) as the lower mask in which a through hole (173a) is formed in a portion corresponding to the through hole formed in the first upper mask,
In the first first filling step, the first conductive material (2a) as the conductive material is filled in the through via that communicates with the through hole formed in the first upper mask,
In a second fixing step after the first filling step, a second upper mask as the upper mask in which through holes (203b) communicating with the remaining portions of the plurality of through vias formed in the sheet material are formed. 200b) and a second lower mask (170b) as the lower mask in which a through hole (173b) is formed in a portion corresponding to the through hole formed in the second upper mask,
In a second filling step after the second fixing step, a metal powder different from the metal powder contained in the first conductive material is placed in the through via communicating with the through hole formed in the second upper mask. The method for filling a conductive material according to any one of claims 1 to 3, wherein the second conductive material (2b) as the conductive material is filled. A conductive material filling device for filling a plurality of through vias (11) penetrating a sheet material (10) with a conductive material (2) containing a metal powder and a solvent,
A lower base portion (151) in which a recess (152) is formed and a through hole (153) communicating the inside and the outside of the recess is formed;
A lower mask (170) fixed to the lower base portion so as to close the concave portion and having a through hole (173) communicating with the concave portion;
A suction part (160) for sucking the inside of the through via formed in the sheet material through the through hole formed in the lower base part and the through hole formed in the lower mask;
An upper mask (200) disposed on the opposite side of the lower mask across the sheet material and having a through hole (203) formed;
An upper base portion (191) fixed to the lower base portion so that the upper mask is fixed and the upper mask faces the lower mask;
A filling head (110) for filling the conductive material into the through via;
A feeding mechanism (230) for moving the filling head in a predetermined direction in the surface direction of the sheet material,
The upper base portion and the lower base portion arrange the solvent adsorbing sheet (180) that adsorbs the solvent on the lower mask and the sheet material in this order, and then lower the solvent adsorbing sheet and the sheet material to the lower mask. The lower mask, the solvent adsorption sheet, the sheet material, and the upper mask are integrated so as to be mechanically fixed by being sandwiched between the side mask and the upper mask,
The through hole formed in the upper mask is formed to communicate with the through via,
The through hole formed in the lower mask is formed in a portion corresponding to the through hole formed in the upper mask,
The suction part passes through the through hole formed in the lower base part and the through hole formed in the lower mask when the conductive material is filled into the through via by the filling head. A conductive material filling apparatus, wherein the inside of the through via is sucked.

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