JP2015055582A - Circuit board inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect insulation between conductor patterns and inspect electronic components and also avoid the degradation of the electronic components while avoiding the complication of a configuration and the degradation of an inspection signal.SOLUTION: A circuit board inspection device comprises: a scanner 3 for separating all of probe pins 21 from a first inspection unit 4 and connecting a discretionary probe pin 21 to the first inspection unit 4; a second inspection unit 5 directly connected via wiring to the probe pins 21 which are in contact with a conductor pattern P configuring one conductor pattern group GP and connected to an electronic component; a power supply unit 8 for supplying voltage V1 to the first inspection unit 4 etc.; a floating power supply unit 9 for supplying, to the second inspection unit 5, voltage V2 which is electrically insulated from the voltage V1; and a control unit 6 for controlling the second inspection unit 5 at a time when the on/off state of a selector switch configuring the scanner 3 is switched and causing a DC rated voltage of a predefined value to be supplied from the second inspection unit 5 to all of the probe pins 21 connected via wiring with the second inspection unit 5.

Description

  The present invention relates to a circuit board inspection apparatus that performs a predetermined electrical inspection on a circuit board in which a conductor pattern is formed and an electronic component connected to the conductor pattern is incorporated.

  As this type of circuit board inspection apparatus, the present applicant has already proposed the circuit board inspection apparatus disclosed in Patent Document 1 below. In this circuit board inspection apparatus, the control unit specifies all conductor patterns connected in a chain via electronic components based on the conductor pattern data and the electronic component connection data as one conductor pattern group, and the conductor Performing a first process of supplying an inspection signal between any conductor pattern in one conductor pattern group and any conductor pattern in another conductor pattern group when there are a plurality of pattern groups; Each of the conductors based on a physical quantity generated between the conductor pattern of one conductor pattern group and the conductor pattern of another conductor pattern group in accordance with the supply of the inspection signal when the inspection unit executes the first process. Inspect the insulation between patterns.

  Therefore, according to this circuit board inspection apparatus, the conductor pattern and the electronic component included in one conductor pattern group are basically maintained at the same potential, so that the electronic component mounted on the circuit board is damaged. Thus, it is possible to surely inspect the insulation state between the conductor patterns that should be insulated without causing them. Further, in this circuit board inspection apparatus, it is possible to calculate, for example, a resistance value of an electronic component mounted on the circuit board, and to perform a quality inspection (component inspection) of the electronic component based on the calculated resistance value. It has become.

  Further, as a configuration for providing another operation waveform or the like from an external measuring instrument to an electronic component (IC (integrated circuit)) on a circuit board to enable, for example, a simple function test, the following Patent Document 2 is disclosed. Also known is a configuration disclosed in the prior art, that is, a configuration including an external input / output terminal and a switch for switching a probe pin attached to each arm to either the scanner board side or the external input / output terminal side. It has been.

  However, the above-described conventional circuit board inspection apparatus has the following problems to be improved. That is, in order to carry out component inspection for electronic components such as the above-described function test as well as the inspection of the insulation state between conductor patterns using this circuit board inspection device, it is disclosed in the above-mentioned Patent Document 2. Must be configured so that the probe pin is switched to the scanner board side when inspecting the insulation state and the probe pin is switched to the external input / output terminal side when performing component inspection. Therefore, in such a configuration, the device configuration becomes complicated by the addition of the switch, and the inspection signal for component inspection deteriorates when passing through the switch (signal attenuation or noise mixing). ) Existed and there was a need to improve this problem.

  Therefore, in order to improve this problem, the applicant of the present application disclosed in Japanese Patent Application No. 2012-200288, a circuit that can perform insulation inspection between conductor patterns and component inspection of electronic components while avoiding complicated device configuration and deterioration of inspection signals. A board inspection system is proposed. In this circuit board inspection apparatus, a second inspection unit for inspecting an electronic component built in the circuit board is supplied with an operating voltage from the floating power supply unit to the second inspection unit, and the second inspection unit With the configuration in which the exchange of data and signals between the two is performed via an isolator, the first inspection unit that performs the insulation inspection has a floating structure. As a result, in this circuit board inspection apparatus, the scanner that switches the signal from the first inspection unit and supplies it to any probe pin of the fixture or separates the first inspection unit from all the probe pins, and the probe pin are provided. The inspection device and the probe pin constituting the second inspection unit are always connected by wiring while being always connected by wiring, and the scanner on the first inspection unit side and the inspection device on the second inspection unit side are not switched by a switch. The structure may be acceptable.

Japanese Patent No. 4532570 (page 3-6, Fig. 1) Japanese Patent Laid-Open No. 6-331699 (2nd page, FIG. 3)

  By the way, the applicant of the present application continuously studied the above-described circuit board inspection apparatus proposed in Japanese Patent Application No. 2012-200288. As a result, it does not occur when mechanical relays or photomoss relays are used as switch elements that make up the scanner that is always connected to the probe pins via wiring, but when analog switches (especially high-voltage analog switches) are used, We found that there was a problem caused by spike noise. Specifically, since this analog switch is composed of an FET (field effect transistor), spike-like noise is parasitic on the source terminal side and drain terminal side at the rise and fall of the control signal supplied to the gate terminal. The phenomenon of leakage through the capacitance occurs, and this noise is supplied to electronic components (particularly electronic components with low breakdown voltage such as ICs) built in the circuit board via wiring and probe pins. We found the existence of a problem to be improved that there is a risk of deteriorating electronic components.

  The present invention has been made in view of such problems, and can perform insulation inspection between conductor patterns and component inspection of electronic components while avoiding complicated device configuration and deterioration of inspection signals, and deterioration of electronic components. It is a main object to provide a circuit board inspection apparatus that can avoid the above.

  In order to achieve the above object, a circuit board inspection apparatus according to claim 1, wherein a plurality of conductor patterns are formed and an electronic component connected to any one of the plurality of conductor patterns is incorporated. A circuit board inspection apparatus for inspecting a board, wherein the fixture has a plurality of probe pins that are brought into contact with the plurality of conductor patterns, and has a pair of connection terminals and is connected to the pair of connection terminals. A first inspection unit that inspects an insulation state between inspection target parts and a plurality of changeover switches, and is connected to the plurality of probe pins and the pair of connection terminals via wiring. It is disposed between the fixture and the first inspection unit, and the on / off state of the changeover switch is controlled so that all of the plurality of probe pins are connected to the pair. A scanner that transitions to any one of a separated state in which the probe is separated from the connection terminal and a connection state in which any of the plurality of probe pins is connected to the pair of connection terminals, and chained via the electronic component When all the connected conductor patterns are defined as one conductor pattern group, the probe pins that are in contact with the conductor pattern that constitutes one conductor pattern group are connected to the probe pins via wiring. A second inspection unit that is directly connected to execute component inspection on the electronic component, a control unit that performs control on the first inspection unit, the scanner, and the second inspection unit, and the first inspection. A power supply unit for supplying a first operating voltage to the scanning unit, the scanner and the control unit, and a second operating voltage electrically insulated from the first operating voltage. A floating power supply unit that supplies the second inspection unit, and the control unit executes control of the scanner to perform any one of the conductor patterns in the one conductor pattern group and the other one of the conductor patterns. Any two of the conductor patterns in the group and the conductor patterns that do not constitute the conductor pattern group are connected to the pair of connection terminals as the inspection target part and control to the first inspection unit is performed. Insulation inspection processing for executing the inspection of the insulation state between the inspection target parts, and controlling the scanner to shift the scanner to the separated state and executing the control for the second inspection unit. And a component inspection process for inspecting, and control for the scanner to execute the switching switch. At the timing of switching control of the on / off state of the switch, the second inspection unit is controlled to be defined in advance for all the probe pins connected to the second inspection unit via the wiring. A DC constant voltage having a voltage value is supplied from the second inspection unit.

  The circuit board inspection apparatus according to claim 2 is the circuit board inspection apparatus according to claim 1, wherein the control unit is configured to use one of the conductor pattern groups as the inspection target portion when the insulation inspection process is performed. The control for the scanner is executed so that the conductor patterns constituting the same potential are mutually equal.

  According to another aspect of the circuit board inspection apparatus of the present invention, the second inspection unit connected to the conductor pattern group via the wiring operates when supplied with a voltage from the floating power supply unit. Therefore, according to this circuit board inspection apparatus, even if the control unit executes the insulation inspection process in a state where the second inspection unit is connected to the probe pin through the wiring, the reference potential of the second inspection unit and Since the voltage and the reference potential and voltage of the power supply unit on the control unit side are electrically separated from each other, current wraparound between the second inspection unit and the circuit on the power supply unit side such as the control unit is prevented. This can prevent the damage of the second inspection part. Further, according to this circuit board inspection apparatus, since the second inspection unit and the probe pin of the fixture may remain in a directly connected state via wiring, the second inspection unit It is possible to eliminate the need for a switch for separating the fixture pin from the fixture pin, thereby avoiding the complexity of the apparatus configuration and inspecting the electronic component built in the circuit board from the second inspection unit. Signals can also be supplied while avoiding deterioration.

  Further, in this circuit board inspection apparatus, the control unit controls the second inspection unit at the timing of executing the control on the scanner and switching the on / off state of the changeover switch, and performs the second inspection via the wiring. A DC constant voltage having a predetermined voltage value is supplied from the second inspection unit to all probe pins connected to the unit. Therefore, according to this circuit board inspection apparatus, the rising edge of the control signal supplied to the gate terminal for controlling the changeover switch constituting the scanner from one of the on state and the off state to the other state. Since the impedance between each conductor pattern can be set to a low value by supplying a DC constant voltage at at least one of the time and the falling time, the voltage value of the noise voltage generated between any pair of conductor patterns can be As a result of being able to suppress to a low value, it is possible to avoid the deterioration of the electronic component directly connected to the second inspection unit.

  According to another aspect of the circuit board inspection apparatus of the present invention, the controller controls the scanner so that the conductor patterns constituting one conductor pattern group as the inspection object part have the same potential when the insulation inspection process is executed. To control. Therefore, according to this circuit board inspection apparatus, it is ensured that a leakage current is generated in the same conductor pattern group due to a potential difference between the conductor patterns in the same conductor pattern group, thereby damaging the electronic component. Can be prevented.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG.

  Hereinafter, an embodiment of a circuit board inspection apparatus will be described with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described. A circuit board inspection apparatus 1 shown in FIG. 1 includes a fixture (pin board) 2, a scanner 3, a first inspection unit 4, a second inspection unit 5, a control unit 6, a storage unit 7, a power supply unit 8, and a floating power supply unit 9. The circuit board 51 is configured to be able to perform a predetermined electrical inspection.

  The circuit board 51 to be inspected is a circuit board with a built-in component in which an electronic component is built. As shown in FIG. 1, as an example, a plurality of conductor patterns P1 to P16 (hereinafter, unless otherwise distinguished) , Also referred to as “conductor pattern P”), and resistors R1, R2, R3, and R4 as electronic components, capacitors C1, C2, and C3, and integrated circuits IC1 and IC2 are incorporated therein. The conductor patterns P1 to P15 connected to the built-in electronic component are connected to the surface of the circuit board 51 (upper surface as an example in this example) and the electronic component via vias (or through holes) not shown. It is formed between the inside of the circuit board 51 provided. The conductor pattern P16 is formed on the surface of the circuit board 51 as an example. The integrated circuit IC1 is a filter element having a predetermined frequency characteristic, and the integrated circuit IC2 is, for example, a logic input to an input pin (for example, pins connected to the conductor patterns P11, P12, and P9). It is assumed that the D / A converter outputs a voltage corresponding to the value indicated by (2) from an output pin (for example, a pin connected to the conductor pattern P8).

  A plurality of electronic components are mounted on the surface of the circuit board 51 later. In this example, as an example, as indicated by a broken line in FIG. 1, a capacitor C11 is mounted between the conductor pattern P15 and the conductor pattern P16, and a resistor R11 is mounted between the conductor pattern P13 and the conductor pattern P16. The Therefore, when the circuit board 51 is inspected by the circuit board inspection apparatus 1, the conductor pattern 16 is not connected to any electronic component.

  The fixture 2 is configured to include a plurality (m pieces) of probe pins 21. The fixture 2 is supported so as to be movable toward and away from the circuit board 51 by a support mechanism (not shown) above the circuit board 51 mounted on the upper surface of a mounting table (not shown). Further, the plurality of probe pins 21 are erected at positions corresponding to contact portions (contact points) of the contacting conductor pattern on the surface on the mounting table side of the fixture 2 (lower surface in this example). In this example, one contact portion is defined for each conductor pattern. Therefore, m (= 16) probe pins 21 are erected as an example. With this configuration, when the probe 2 is moved to a state (probing state) in which each probe pin 21 comes into contact with the corresponding contact portion, the fixture 2 is sandwiched and held between the mounting bases.

  The scanner 3 includes a plurality of changeover switches, and is disposed between the fixture 2 and the first inspection unit 4 as shown in FIG. The scanner 3 is connected to a plurality of (m) probe pins 21 via wiring (the number is m), and a pair of connection terminals 4a and 4b (to be described later) of the first inspection unit 4 and wiring (2). Book wiring). Further, the scanner 3 is separated so that all of the plurality of probe pins 21 are separated from the pair of connection terminals 4 a and 4 b of the first inspection unit 4 by controlling the on / off states of the plurality of changeover switches by the control unit 6. The state and an arbitrary probe pin 21 of the plurality of probe pins 21 are connected to any one of the pair of connection terminals 4a and 4b of the first inspection unit 4, and the one connection terminal Transition to any one of the connection states in which an arbitrary probe pin 21 of the other probe pins 21 excluding the connected probe pin 21 is connected to the other connection terminal of the pair of connection terminals 4a and 4b. Is possible. Each changeover switch uses an analog switch (particularly a high withstand voltage analog switch) composed of an FET (field effect transistor).

  The 1st test | inspection part 4 has a pair of connecting terminal 4a, 4b, and test | inspects the insulation state between the test object site | parts connected to this pair of connecting terminal 4a, 4b. As an example, the 1st test | inspection part 4 is provided with the insulation resistance meter and the process part (all are not shown) with a pair of connection terminals 4a and 4b. With this configuration, the processing unit is controlled by the control unit 6 to operate the insulation resistance meter, and the insulation resistance between the inspection target parts connected to the pair of connection terminals 4a and 4b is measured. By comparing the resistance value of the resistor with a predetermined reference resistance value, the insulation state between the parts to be inspected is inspected (for example, the insulation state is good when the calculated resistance value is equal to or greater than the reference resistance value). When it is less than the reference resistance value, the insulation state is inspected to be defective), and the result data D1 indicating the inspection result is output to the control unit 6.

  The second inspection unit 5 is an electronic device that performs component inspection of the built-in electronic components (in this example, resistors R1, R2, R3, R4, capacitors C1, C2, C3, and integrated circuits IC1, IC2). The probe pins 21 that are in contact with the conductor patterns connected to the components are connected to the probe pins 21 via n wirings, and component inspection is performed on these electronic components. In this example, there are two electronic components IC1 and IC2 as an example for executing the component inspection. Accordingly, the second inspection unit 5 includes a filter element corresponding to the number of electronic components that execute the component inspection. An inspection apparatus A (for example, a frequency characteristic measuring device) for measuring and inspecting frequency characteristics of the integrated circuit IC1 and an inspection apparatus B for operating and inspecting the integrated circuit IC2 that is a D / A converter. (For example, a signal output device capable of outputting a plurality of bits of digital data for operating the integrated circuit IC2 and a voltage measuring device for measuring the output voltage of the integrated circuit IC2), each integrated circuit IC1, Nine wires (n = 9) are connected to nine probe pins 21 that are in contact with conductor patterns (in this example, nine conductor patterns P1, P2, P3, P8 to P13) connected to IC2. It is connected via a.

  In this case, the inspection apparatus A includes n (9 in this example) wires on the three probe pins 21 that are in contact with the conductor patterns P1, P2, and P3 connected to the integrated circuit IC1 to be inspected. Are connected through the three wires. In addition, the inspection apparatus B passes the other six wires out of the n wires to the six probe pins 21 that contact the conductor patterns P8 to P13 connected to the integrated circuit IC2 to be inspected. Connected. Further, the inspection apparatuses A and B are electrically separated from each other.

  Further, the second inspection unit 5 is different from the scanner 3, the first inspection unit 4, the control unit 6 and the storage unit 7 that operate based on the voltage (first operation voltage) V1 output from the power supply unit 8, The voltage supplied from the floating power supply unit 9 (the voltage electrically insulated from the voltage V1 side) is used as the operating voltage. Specifically, the inspection device A of the second inspection unit 5 is electrically insulated from a voltage V2 (a reference potential G1 and voltage V1 described later on the voltage V1 side) supplied from the floating power supply unit 9 to the power supply terminal 5a. The second operating voltage generated based on a reference potential G2 described later is used as the operating voltage. On the other hand, another inspection device B of the second inspection unit 5 is electrically insulated from the voltage V3 (the reference potential G1 on the voltage V1 side and the voltage V1) supplied from the floating power supply unit 9 to the power supply terminal 5b, and A voltage generated based on a later-described reference potential G3 that is also electrically insulated from the reference potential G2 and the voltage V2 is operated as an operation voltage.

  The inspection apparatus A of the second inspection unit 5 operates under the control of the control unit 6 (operates based on the control signal Sa output from the control unit 6) to inspect the integrated circuit IC1. A test for the integrated circuit IC1 is performed by generating a test signal and outputting it to the integrated circuit IC1. The inspection apparatus A operates under the control of the control unit 6 and outputs the result data Da indicating the result of the inspection on the integrated circuit IC1 to the control unit 6. Further, the inspection apparatus A operates under the control of the control unit 6, and the DC constant voltage defined in advance on the three probe pins 21 contacting the conductor patterns P1, P2, P3 connected to the integrated circuit IC1. Is output. Specifically, the inspection apparatus A outputs a DC constant voltage having the same potential as the reference potential G2 to the probe pin 21 that contacts the conductor pattern P2, and the reference to the two probe pins 21 that contact the conductor patterns P1 and 3. A DC constant voltage having a voltage value arbitrarily defined in advance (a voltage value lower than the maximum rated voltage of the integrated circuit IC1) within a voltage range between the potential G2 and the voltage V2 is output.

  Similarly, the other inspection device B of the second inspection unit 5 is also controlled and operated by the control unit 6 (operated based on the control signal Sb output from the control unit 6), and the integrated circuit. A test signal for inspecting the IC 2 is generated and output to the integrated circuit IC2, thereby executing a test on the integrated circuit IC2. The inspection apparatus B operates under the control of the control unit 6 and outputs the result data Db indicating the result of the inspection on the integrated circuit IC2 to the control unit 6. The inspection device B operates under the control of the control unit 6 and outputs a DC constant voltage to the six probe pins 21 that are in contact with the conductor patterns P8 to P13 connected to the integrated circuit IC2. Specifically, the inspection apparatus B outputs a DC constant voltage having the same potential as the reference potential G3 to the probe pin 21 that contacts the conductor pattern P13, and the reference to the five probe pins 21 that contact the conductor patterns P8 to P12. A DC constant voltage having a voltage value arbitrarily defined in advance (a voltage value lower than the maximum rated voltage of the integrated circuit IC2) is output from a voltage range between the potential G3 and the voltage V3.

  Note that the exchange of the control signal Sa and the result data Da between the inspection apparatus A and the control unit 6 and the exchange of the control signal Sb and the result data Db between the inspection apparatus B and the control unit 6 are performed via the isolator 10. Done.

  Further, the integrated circuits IC1 and IC2 inspected by the inspection devices A and B of the second inspection unit 5 are different conductor pattern groups GP1 and GP2 that are electrically insulated from each other, as will be described later. (Also referred to as “conductor pattern group GP”).

  In this way, the inspection devices A and B are electrically separated from each other inside the second inspection unit 5, and the voltage V2 supplied to the inspection device A from the floating power supply unit 9 and its reference potential G2, and the inspection The voltage V3 supplied from the floating power supply unit 9 to the device B and its reference potential G3 are electrically insulated (separated) from each other, and the inspection devices A and B are both electrically insulated from the control unit 6 via the isolator 10. Since the conductor pattern groups GP1 and GP2 connected to the integrated circuits IC1 and IC2 to which the inspection apparatuses A and B are directly connected via wiring are electrically insulated, the second The inspection part 5 (in this example, each inspection apparatus A and B) is always in a floating state.

  The control unit 6 includes a computer or the like, and executes control on the first inspection unit 4, the scanner 3, and the second inspection unit 5 as described above, and performs constant voltage supply processing, insulation inspection processing, and components. Perform inspection processing.

  The storage unit 7 includes a semiconductor memory such as a ROM and a RAM, an HDD (Hard Disk Drive), and the like. The storage unit 7 stores an operation program for the control unit 6, and the control unit 6 performs the first inspection unit 4. And the result data D1, Da, Db acquired from the second inspection unit 5 are stored. Further, the storage unit 7 includes data on the circuit board 51, that is, data that can specify the probe pins 21 that are in contact with the conductor patterns P1 to P16, and electronic components (resistors R1) connected to the conductor patterns P1 to P16. , R2, R3, R4, capacitors C1, C2, C3, and integrated circuits IC1, IC2) and electronic components that perform component inspection (resistors R1, R2, capacitor C2, and integrated circuits IC1, IC2) Is stored in advance.

  The power supply unit 8 generates and outputs a voltage V1 (voltage based on the reference potential G1) for operating the scanner 3, the first inspection unit 4, the control unit 6, and the storage unit 7. As an example, the floating power supply unit 9 is composed of an insulation type DC / DC converter configured using a transformer having two independent secondary windings, and the AC voltage induced in each secondary winding is electrically Are converted into voltages V2 and V3 as DC voltages by two separated rectifying and smoothing circuits, respectively, and output. With this configuration, the floating power supply unit 9 generates and outputs the voltage V2 based on the voltage V1 and the reference potential G2 electrically insulated from the reference potential G1 of the voltage V1, and outputs the voltage V1 and the reference potential G1. , And generates and outputs a voltage V3 based on a reference potential G3 that is electrically insulated from both the voltage V2 and the reference potential G2. The isolator 10 is disposed between the control unit 6 and the second inspection unit 5, and receives the control signals Sa and Sb output from the control unit 6 and electrically insulates the second inspection unit 5. Output. Further, the isolator 10 inputs the result data Da and Db output from the second inspection unit 5 and outputs them to the control unit 6 while being electrically insulated.

  Next, the operation of the circuit board inspection apparatus 1 will be described with reference to the drawings. It is assumed that the circuit board 51 is placed on a mounting table (not shown) and is sandwiched (held) between the mounting table and the fixture 2.

  In this state, in the circuit board inspection apparatus 1, the control unit 6 first performs an insulation inspection process on the circuit board 51. In this insulation inspection process, the control unit 6 first controls the second inspection unit 5 by outputting the control signals Sa and Sb to the second inspection unit 5 via the isolator 10, and the second inspection unit 5. The inspection devices A and B are shifted to a stopped state (a state where a signal for component inspection is not output to the probe pin 21).

  Next, the control unit 6 makes all the conductor patterns connected in a chain via the electronic components built in the circuit board 51 based on the data related to the circuit board 51 stored in the storage unit 7. P is specified as one conductor pattern group GP. In the circuit board 51, as shown in FIG. 1, conductor patterns P1 to P4 are connected in a chain via a resistor R1, a capacitor C1, and an integrated circuit IC1 as electronic components. Conductor patterns P5 to P15 are connected in a chain via resistors R2, R3, and R4, capacitors C2 and C3, and integrated circuit IC2 as electronic components. For this reason, the control part 6 specifies the conductor patterns P1-P4 as one conductor pattern group GP1, and specifies the conductor patterns P5-P15 as another one conductor pattern group GP2. Note that no electronic component (an electronic component built in the circuit board 51 in advance) is connected to the conductor pattern P16. For this reason, the conductor pattern P16 exists as a conductor pattern that does not constitute the conductor pattern group GP.

  Subsequently, the control unit 6 sets one of the conductor patterns P in one conductor pattern group GP, one of the conductor patterns P in the other conductor pattern group GP, and the conductor pattern P that does not constitute the conductor pattern group GP. Any two of them are used as inspection target parts, and the insulation state between the inspection target parts is inspected (in this example, the insulation state between one conductor pattern group GP1 and another conductor pattern group GP2, the conductor pattern The insulation state between the group GP1 and the conductor pattern P16 that does not constitute the conductor pattern group and the insulation state between the conductor pattern group GP2 and the conductor pattern P16 are inspected).

  Specifically, when inspecting the insulation state between the conductor pattern group GP1 and the conductor pattern group GP2, the control unit 6 executes a control for the scanner 3 and any one of the conductor patterns P in the conductor pattern group GP1. Probe pins 21 (in this example, all probe pins 21 in contact with all the conductor patterns P1 to P4 in the conductor pattern group GP1) are connected to the pair of connection terminals 4a of the first inspection unit 4 via the scanner 3. 4b (for example, the connection terminal 4a) is connected as a part to be inspected (that is, all conductor patterns P1 to P4 in the conductor pattern group GP1 are set to the same potential), and in another conductor pattern group GP2. Probe pins 21 in contact with any of the conductor patterns P (in this example, all the conductors in the conductor pattern group GP2 All the probe pins 21) that come in contact with the patterns P <b> 5 to P <b> 15 are connected to the other (for example, the connection terminal 4 b) of the pair of connection terminals 4 a and 4 b of the first inspection unit 4 through the scanner 3 as a part to be inspected. (That is, all the conductor patterns P5 to P15 in the conductor pattern group GP2 are set to the same potential).

  Next, when executing the control for the scanner 3, the control unit 6 executes the constant voltage supply process by outputting the control signals Sa and Sb to the second inspection unit 5 via the isolator 10. The second inspection unit 5 (specifically, the inspection device) is connected via n wires at a timing at which the changeover switch constituting the switch is controlled to be switched from one of the ON state and the OFF state to the other state. The second inspection section 5 (inspection apparatus A, B) is supplied with the above-mentioned DC constant voltage from the second inspection section 5 (inspection apparatus A, B) to all the probe pins 21 connected to A, B). B) is controlled. In addition, the control unit 6 completes control of the scanner 3 in a state where a constant DC voltage is supplied from the second inspection unit 5 to the probe pin 21 via n wires (switching that configures the scanner 3). When the switch is switched from one of the on state and the off state to the other state), the control signals Sa and Sb are output to the second inspection unit 5 via the isolator 10. To control the second inspection unit 5 to shift the inspection devices A and B of the second inspection unit 5 to the stopped state (stop the supply of the DC constant voltage described above).

  Since the changeover switch constituting the scanner 3 is composed of an FET, a control signal supplied to the gate terminal to control the changeover switch from one of the on state and the off state to the other state. The phenomenon that spike noise (specifically, spike current) leaks to the source terminal side and drain terminal side via parasitic capacitance at at least one of the rising edge and falling edge. Arise. However, a DC constant voltage is supplied from the second inspection unit 5 to the conductor patterns P1 to P3 and P8 to P13 connected to the integrated circuits IC1 and IC2 that are likely to be deteriorated by the spiked noise voltage. The impedance between the conductor patterns P1 to P3 and P8 to P13 is defined to be lower than that when the potentials of the conductor patterns P1 to P3 and P8 to P13 are indefinite. Thereby, even if a current flows in a spike shape between any pair of conductor patterns among the conductor patterns P1 to P3 and P8 to P13, noise generated between the pair of conductor patterns due to the current flowing. Since the voltage value of the voltage is suppressed to a low value, deterioration of the integrated circuits IC1 and IC2 is avoided.

  Subsequently, the control part 6 performs control with respect to the 1st test | inspection part 4, and test | inspects the insulation state between test object site | parts (between the conductor pattern group GP1 and the conductor pattern group GP2).

  Further, the control unit 6 controls the scanner 3 when inspecting the insulation state between the conductor pattern group GP1 and the conductor pattern P16, and makes contact with any one of the conductor patterns P in the conductor pattern group GP1. The pins 21 (in this example, all the probe pins 21 that contact all the conductor patterns P1 to P4 in the conductor pattern group GP1) are connected to each of the pair of connection terminals 4a and 4b of the first inspection unit 4 via the scanner 3. A probe pin 21 connected to either one (for example, the connection terminal 4a) as a site to be inspected (the conductor patterns P1 to P4 are set to the same potential) and in contact with the conductor pattern P16 is connected via the scanner 3 to the first inspection unit 4. The other of the pair of connection terminals 4a and 4b (for example, the connection terminal 4b) is connected as an inspection target part.

  Also in this case, the control unit 6 executes the constant voltage supply process to configure the scanner 3 in the same manner as when the insulation state between the conductor pattern group GP1 and the conductor pattern group GP2 is inspected. At the timing when the changeover switch is switched from one of the ON state and the OFF state to the other state, all the probe pins 21 connected to the second inspection unit 5 are connected to the second inspection unit 5 from the second inspection unit 5. The second inspection unit 5 is controlled so that the above-described DC constant voltage is supplied. In addition, the control unit 6 completes the control for the scanner 3 in a state where the DC constant voltage is supplied from the second inspection unit 5 to the probe pin 21 (the changeover switch constituting the scanner 3 is turned on and off). When the switching control from one state to the other state is completed), the second inspection unit 5 is controlled to shift the second inspection unit 5 to the stop state (the above-described DC constant voltage) The supply is stopped).

  As a result, at least one of the rising edge and the falling edge of the control signal supplied to the gate terminal to control the changeover switch from one of the ON state and the OFF state to the other state. In this case, since the impedance between the conductor patterns P1 to P3 and P8 to P13 is regulated to a low value by the supply of the DC constant voltage, the voltage value of the noise voltage generated between any pair of conductor patterns is a low value. Therefore, the deterioration of the integrated circuits IC1 and IC2 is avoided.

  Subsequently, the control part 6 performs control with respect to the 1st test | inspection part 4, and test | inspects the insulation state between test object site | parts (between the conductor pattern group GP1 and the conductor pattern P16).

  Further, the control unit 6 controls the scanner 3 when inspecting the insulation state between the conductor pattern group GP2 and the conductor pattern P16, and makes contact with any one of the conductor patterns P in the conductor pattern group GP2. Pins 21 (in this example, all probe pins 21 in contact with all the conductor patterns P5 to P15 in the conductor pattern group GP2) are connected to one of the pair of connection terminals 4a and 4b of the first inspection unit 4 via the scanner 3. The probe pin 21 that is connected to either one (for example, the connection terminal 4a) as an inspection target part (the conductor patterns P5 to P15 are set to the same potential) and contacts the conductor pattern P16 is connected to the first inspection unit 4 via the scanner 3. The other of the pair of connection terminals 4a and 4b (for example, the connection terminal 4b) is connected as an inspection target part.

  Also in this case, the control unit 6 executes the constant voltage supply process to configure the scanner 3 in the same manner as when the insulation state between the conductor pattern group GP1 and the conductor pattern group GP2 is inspected. At the timing when the changeover switch is switched from one of the ON state and the OFF state to the other state, all the probe pins 21 connected to the second inspection unit 5 are connected to the second inspection unit 5 from the second inspection unit 5. The second inspection unit 5 is controlled so that the above-described DC constant voltage is supplied. In addition, the control unit 6 completes the control for the scanner 3 in a state where the DC constant voltage is supplied from the second inspection unit 5 to the probe pin 21 (the changeover switch constituting the scanner 3 is turned on and off). When the switching control from one state to the other state is completed), the second inspection unit 5 is controlled to shift the second inspection unit 5 to the stop state (the above-described DC constant voltage) The supply is stopped).

  As a result, at least one of the rising edge and the falling edge of the control signal supplied to the gate terminal to control the changeover switch from one of the ON state and the OFF state to the other state. In this case, since the impedance between the conductor patterns P1 to P3 and P8 to P13 is regulated to a low value by the supply of the DC constant voltage, the voltage value of the noise voltage generated between any pair of conductor patterns is a low value. Therefore, the deterioration of the integrated circuits IC1 and IC2 is avoided.

  Subsequently, the control part 6 performs control with respect to the 1st test | inspection part 4, and test | inspects the insulation state between test object site | parts (between the conductor pattern group GP2 and the conductor pattern P16).

  During the inspection of the insulation state by the first inspection unit 4, the insulation resistance test voltage output from the pair of connection terminals 4 a and 4 b of the first inspection unit 4 (generally a high voltage such as several hundred volts). Between the conductor pattern group GP1 and another conductor pattern group GP2 and between the conductor pattern group GP1 and the conductor pattern P16 not constituting the conductor pattern group via the scanner 3 and the probe pin 21 of the fixture 2. The second inspection section 5 is sequentially applied between the conductor pattern group GP2 and the conductor pattern P16 while being connected to the probe pin 21 of the fixture 2 via n wires.

  As a result, when the inspection voltage is applied between the conductor pattern group GP1 and the other conductor pattern group GP2, the conductor pattern group GP1 is configured through three of the n wirings. Conductor pattern constituting conductor pattern group GP2 through inspection device A connected to probe pin 21 in contact with conductor patterns P1 to P3 to be performed and the other six wires out of the n wires A high inspection voltage is also applied to the inspection device B connected to the probe pin 21 in contact with P8 to P13. However, as described above, in the inspection apparatuses A and B, the reference potentials G2 and G3 are electrically separated from each other, and the voltages V2 and V3, which are the respective operating voltages, are also electrically separated from each other. Since the control unit 6 is also electrically separated by the isolator 10, current flows from the inspection apparatus A to the inspection apparatus B (or from the inspection apparatus B to the inspection apparatus A) when the inspection voltage is applied, Current flows from the inspection device A to the circuit on the power supply unit 8 side such as the control unit 6 (or from the circuit on the power supply unit 8 side such as the control unit 6 to the inspection device A), and from the inspection device B to the control unit 6 etc. Current is prevented from flowing into the circuit on the power supply unit 8 side (or from the circuit on the power supply unit 8 side such as the control unit 6 to the inspection apparatus B). Thereby, the damage of the inspection apparatus A and the inspection apparatus B is avoided.

  In addition, when the inspection voltage is applied between the conductor pattern group GP1 and the conductor pattern P16, the probes that are in contact with the conductor patterns P1 to P3 constituting the conductor pattern group GP1 through three wires. A high inspection voltage is applied between the inspection apparatus A connected to the pin 21 and the conductor pattern P16. However, as described above, in the inspection apparatus A, the reference potential G2 is electrically separated from the reference potential G1 on the power supply unit 8 side, and the voltage V2 that is the operating voltage is also electrically connected to the voltage V1 on the power supply unit 8 side. And is also electrically separated from the control unit 6 by the isolator 10, so that the circuit (or control) on the power supply unit 8 side such as the control unit 6 from the inspection device A when the inspection voltage is applied. Current from a circuit on the power supply unit 8 side such as the unit 6 to the inspection apparatus A) is prevented. Thereby, the damage of the inspection apparatus A is avoided.

  Further, even when the inspection voltage is applied between the conductor pattern group GP2 and the conductor pattern P16, the probes that are in contact with the conductor patterns P8 to P13 constituting the conductor pattern group GP2 through six wires. A high inspection voltage is applied between the inspection device B connected to the pin 21 and the conductor pattern P16, but the reference potential G3 is electrically separated from the reference potential G1, and the voltage V3 is also Since it is electrically separated from the voltage V1 and further electrically separated from the control unit 6 by the isolator 10, damage to the inspection apparatus B is performed in the same manner as in the inspection using the inspection apparatus A described above. Has been avoided.

  Finally, the control unit 6 executes control on the first inspection unit 4 to output the result data D1 indicating the inspection result regarding the insulation state between the inspection target parts, and obtains and stores the result data D1. Store in the unit 7. Thereby, the insulation inspection process is completed.

  Next, the control unit 6 executes a component inspection process for inspecting electronic components (in this example, the integrated circuits IC1 and IC2) built in the circuit board 51. In this component inspection process, the control unit 6 first executes control on the scanner 3 and all the m (16 in this example) wires connected to the plurality of probe pins 21 are the first inspection unit 4. By disconnecting from both of the pair of connection terminals 4a and 4b, the scanner 3 is shifted to the separated state.

  Also in this case, the control unit 6 performs the constant voltage supply process in the same manner as the control for the scanner 3 executed when the insulation state between the conductor pattern group GP1 and the conductor pattern group GP2 is inspected. At the timing when all the changeover switches constituting the scanner 3 are controlled to be turned off, all the probe pins 21 connected to the second inspection unit 5 are connected to the DC constant voltage described above from the second inspection unit 5. The second inspection unit 5 is controlled so as to be supplied. In addition, the control unit 6 controls the scanner 3 when the DC constant voltage is supplied from the second inspection unit 5 to the probe pin 21 (controls the changeover switch constituting the scanner 3 to the off state). When finished, the second inspection unit 5 is controlled to shift the second inspection unit 5 to the stop state (the supply of the DC constant voltage described above is stopped).

  As a result, when the control signal supplied to the gate terminal for controlling the changeover switch from the on state to the off state is raised (or at the fall time), the conductor patterns P1 to P3 and P8 to P13 are supplied by the supply of the DC constant voltage. Since the impedance between them is regulated to a low value, the voltage value of the noise voltage generated between any pair of conductor patterns is suppressed to a low value, and the deterioration of the integrated circuits IC1 and IC2 is avoided.

  Next, the control unit 6 controls the inspection device A by outputting a control signal Sa to the inspection device A of the second inspection unit 5 through the isolator 10, and performs component inspection on the integrated circuit IC1 (filter element). Let In this case, the inspection apparatus A is connected to the integrated circuit IC1 that is directly connected (meaning that there is no changeover switch) via the three wires and the probe pins 21 connected to these wires. The frequency characteristic of the integrated circuit IC1 is measured by supplying a signal for measuring the frequency characteristic and measuring the signal output from the integrated circuit IC1 at that time. Further, the second inspection unit 5 inspects the integrated circuit IC1 based on whether or not the measured frequency characteristic is included in a predetermined reference range (for example, the measured frequency characteristic is included in the reference range). The product is inspected so that it is a non-defective product when it is out of the standard range and a defective product when it is out of the standard range.

  Subsequently, the control unit 6 controls the inspection device B by outputting a control signal Sb to the inspection device B of the second inspection unit 5 via the isolator 10 to control the integrated circuit IC2 (D / A converter). Have parts inspection run. In this case, the inspection apparatus B is connected to the integrated circuit IC2 that is directly connected (meaning that there is no changeover switch) via the six wires and the probe pins 21 connected to these wires. The signal output device outputs a plurality of patterns of digital data to the input pins of the integrated circuit IC2, and the voltage measuring device measures the output voltage output from the output pins of the integrated circuit IC2 at each pattern and corresponds to each pattern. The integrated circuit IC2 is inspected based on whether or not the output voltage is included in the reference range defined in advance (for example, it is a non-defective product when the voltage value of the output voltage is included in the reference range, When it is out of the reference range, it is inspected as a defective product).

  Finally, the control unit 6 executes control on the second inspection unit 5, and results data Da indicating the inspection result of the integrated circuit IC1 by the inspection apparatus A and results indicating the inspection result of the integrated circuit IC2 by the inspection apparatus B. The data Db is output, and the result data Da and Db are acquired and stored in the storage unit 7. Thus, the component inspection process is completed, and all the inspection processes for the circuit board 51 are completed. When the circuit board inspection apparatus 1 includes an output unit (not shown), the control unit 6 reads the result data D1, Da, Db from the storage unit 7 and outputs the result data to the output unit. Thereby, when the output unit is constituted by a display device, each result data D1, Da, Db is displayed on the screen of the display device. When the output unit is composed of an external interface circuit, each result data D1, Da, Db is output to an external device connected to the circuit board inspection apparatus 1 via the external interface circuit.

  As described above, in the circuit board inspection apparatus 1, the probe pins 21 that are in contact with the conductor patterns P1 to P3 connected to the integrated circuit IC1 constituting one conductor pattern group GP1 are directly connected via wiring. Then, wiring is made to the probe pins 21 that are in contact with the conductor patterns P8 to P13 connected to the integrated circuit IC2 constituting the inspection apparatus A that performs component inspection on the integrated circuit IC1 and the other conductor pattern group GP2. The second inspection unit 5 having the inspection device B that is directly connected to the integrated circuit IC2 and performs the component inspection on the integrated circuit IC2 is electrically insulated from the power supply unit 8 on the control unit 6 side. And a floating power supply unit 9 configured to supply operating voltages V2 and V3 to the inspection devices A and B of the second inspection unit 5. And the control of the first inspection unit 4, and between the conductor pattern group GP1 and another conductor pattern group GP2, between the conductor pattern group GP1 and the conductor pattern P16 that does not constitute the conductor pattern group, and the conductor pattern group An insulation inspection process for causing the first inspection unit 4 to perform an inspection of the insulation state between the GP2 and the conductor pattern P16, and a control for the scanner 3 are performed to shift the scanner 3 to the separated state and to the second inspection unit 5 Control is executed to execute component inspection processing for performing component inspection on the integrated circuits IC1 and IC2 built in the circuit board 51.

  Therefore, according to the circuit board inspection device 1, the control unit 6 performs the insulation inspection process in a state where the inspection devices A and B of the second inspection unit 5 are connected to the probe pins 21 via the wiring. The reference potential G2 and voltage V2 of the inspection apparatus A connected to the conductor pattern group GP1 via wiring, and the reference potential G3 and voltage V3 of the inspection apparatus B connected to the conductor pattern group GP2 via wiring. Since the reference potential G1 and the voltage V1 of the power supply unit 8 on the control unit 6 side are electrically separated from each other, the current from the inspection device A to the inspection device B (or the inspection device B to the inspection device A) Wraparound, current wrap around from the inspection device A to the circuit on the power supply unit 8 side such as the control unit 6 (or from the circuit on the power supply unit 8 side such as the control unit 6 to the inspection device A), and from the inspection device B to the control unit 6 Current in the power supply unit 8 side (or a circuit on the power supply unit 8 side such as the control unit 6 to the inspection apparatus B) can be prevented, and thereby the second inspection unit 5 (in this example, Damage to the inspection apparatus A and the inspection apparatus B) can be avoided.

  Further, since the second inspection unit 5 (inspection apparatus A and inspection apparatus B in this example) and the probe pin 21 of the fixture 2 may be in a state of being directly connected via wiring, an insulation inspection is performed. In this case, a switch for separating the second inspection unit 5 and the probe pin 21 of the fixture 2 can be dispensed with, thereby making it possible to avoid complication of the apparatus configuration and to provide the second inspection unit 5. The inspection signals to the electronic components (in this example, the integrated circuits IC1 and IC2) built in the circuit board 51 can be supplied while avoiding deterioration.

  In the circuit board inspection apparatus 1, the control unit 6 executes the control for the scanner 3 to switch the on / off state of the changeover switch (consisting of the FET) (on state and off state). The timing of switching from one of the states to the other state), the second inspection unit 5 is controlled so that all the probe pins 21 connected to the second inspection unit 5 via the wiring are preliminarily provided. A constant voltage supply process for supplying a DC constant voltage having a specified voltage value from the second inspection unit 5 is executed. Therefore, according to the circuit board inspection apparatus 1, the control signal supplied to the gate terminal in order to switch the changeover switch constituting the scanner 3 from one of the on state and the off state to the other state. Since the impedance between the conductor patterns P1 to P3 and P8 to P13 can be set to a low value by supplying a DC constant voltage at at least one of the rising time and the falling time of As a result of suppressing the voltage value of the noise voltage generated at 1 to a low value, deterioration of the integrated circuits IC1 and IC2 can be avoided.

  Further, in this circuit board inspection apparatus 1, the control unit 6 is configured so that the conductor patterns P constituting one conductor pattern group GP as the inspection target part have the same potential at the time of execution of the insulation inspection process. In this example, the scanner 3 is controlled so that the conductor patterns P1 to P4 constituting the conductor pattern group GP1 have the same potential, and the conductor patterns P5 to P15 constituting the conductor pattern group GP2 have the same potential. Therefore, according to the circuit board inspection apparatus 1, a leakage current (current wraparound) is generated in the same conductor pattern group GP due to a potential difference between the conductor patterns P in the same conductor pattern group GP, thereby causing an electronic component. Can be reliably prevented from occurring.

  Note that, depending on the electronic components in which the conductor patterns P are connected in a chain, there may be little potential difference between the conductor patterns P in the same conductor pattern group GP. For this reason, in such a conductor pattern group GP, since it is not necessary to make all the conductor patterns P that constitute the conductor pattern group GP have the same potential, any conductor pattern that constitutes one conductor pattern group GP. It is also possible to adopt a configuration in which P is connected to the first inspection unit 4 as an inspection target site.

1 Circuit board inspection equipment
2 Fixture
3 Scanner
4 1st inspection department
5 Second inspection department
6 Control unit
8 Power supply
9 Floating power supply unit 21 Probe pin 51 Circuit board C1 to C3 Capacitor GP1, GP2 Conductor pattern group IC1, IC2 Integrated circuit P1 to P16 Conductor pattern R1 to R4 Resistance

Claims (2)

A circuit board inspection apparatus for inspecting a circuit board in which electronic components connected to any one of the plurality of conductor patterns are formed and a plurality of conductor patterns are formed,
A fixture in which a plurality of probe pins that are brought into contact with the plurality of conductor patterns are erected,
A first inspection unit that has a pair of connection terminals and inspects an insulation state between inspection target parts connected to the pair of connection terminals;
The switch includes a plurality of changeover switches, and is disposed between the fixture and the first inspection unit in a state of being connected to the plurality of probe pins and the pair of connection terminals via wiring. Then, by controlling the on / off state of the changeover switch, the separated state in which all of the plurality of probe pins are disconnected from the pair of connection terminals, and any probe pin of the plurality of probe pins is disposed in the pair of pairs. A scanner that transitions to one of the connection states connected to the connection terminal;
When all the conductor patterns connected in a chain via the electronic parts are defined as one conductor pattern group, the conductor patterns connected to the electronic parts constituting one conductor pattern group A second inspection unit that is directly connected to the probe pins that are in contact with each other via wiring and performs a component inspection on the electronic component;
A control unit that executes control for the first inspection unit, the scanner, and the second inspection unit;
A power supply unit that supplies a first operating voltage to the first inspection unit, the scanner, and the control unit;
A floating power supply unit that supplies a second operating voltage electrically insulated from the first operating voltage to the second inspection unit;
The control unit executes control on the scanner, and selects one of the conductor patterns in one conductor pattern group, one of the conductor patterns in another conductor pattern group, and the conductor pattern group. Insulation in which any two of the conductor patterns that are not configured are connected to the pair of connection terminals as the inspection target part and the control of the first inspection unit is performed to inspect the insulation state between the inspection target parts. And performing an inspection process, a control for the scanner to shift the scanner to the separated state, a control for the second inspection unit to execute the part inspection, and the scanner. Timing for controlling the on / off state of the changeover switch by executing control on the switch In this case, the second inspection unit is controlled so that a DC constant voltage having a voltage value defined in advance for all the probe pins connected to the second inspection unit via the wiring is applied to the second inspection unit. Circuit board inspection device to be supplied from.   The said control part performs control with respect to the said scanner so that each said conductor pattern which comprises one said conductor pattern group as said test object site | part may become the same electric potential at the time of execution of the said insulation test process. The circuit board inspection apparatus according to 1.

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