JP2015053536A - Electronic component and electronic component package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress occurrence of conduction failure and stabilize operation by suppressing capacity formation with other electrodes, thereby improving reliability, in an electronic component and an electronic component package.SOLUTION: A first layer 160 of a base 120 includes first electrodes 161a-161f electrically connected to an electronic device 180 and first connection electrodes 161g, 161h extending from the first electrodes 161b, 161e. A second layer 150 of the base 120 includes: second electrodes 151a, 151b electrically connected to a piezoelectric vibration piece 130; castellation electrodes 153a, 153b formed in castellations 150e, 150f being formed by cutting a part of the outer periphery and electrically connected to the first connection electrodes 161g, 161h, and second connection electrodes 151c, 151d electrically connecting between the second electrodes 151a, 151b and the castellation electrodes 153a, 153b.

Description

  The present invention relates to an electronic component and an electronic component package.

  Electronic devices such as a mobile terminal and a mobile phone are equipped with electronic components such as a crystal resonator and a crystal oscillator. As one configuration example of such an electronic component, a piezoelectric vibrating piece and an electronic device are disposed in an internal space of an electronic component package (hereinafter, referred to as a “package”) formed by joining a base and a lid. A so-called one-room configuration is known. In this configuration, the base includes a layer that holds the electronic device, and a frame-like layer that is bonded on the layer and holds the piezoelectric vibrating piece (see Patent Document 1).

  Further, when inspecting the piezoelectric vibrating piece and the electronic device, it is necessary to connect to the piezoelectric vibrating piece and the electronic device from the outside of the package. For this reason, a castellation is provided by cutting out a part of the outer peripheral portion of the base, and an inspection electrode is formed on this castellation. The inspection electrode is formed from the electrode connected to the piezoelectric vibrating piece to the castellation in the base frame-like layer. Further, the electrode connected to the piezoelectric vibrating piece is electrically connected to the connection electrode of the underlying electronic device via a through electrode penetrating the frame-like layer. As described above, since the inspection electrode is electrically connected to the piezoelectric vibrating piece and the electronic device, the piezoelectric vibrating piece and the electronic device are inspected by bringing the probe or the like into contact with the inspection electrode. Can be done.

JP 2010-11173 A

  However, since the electrode formed in the castellation and the electronic device are connected via the through electrode penetrating the frame-like layer, the connection distance becomes long. If the connection distance is increased in this way, there is a possibility that a conduction failure may occur in the middle, which is not preferable. Further, when a long wiring is formed for connection, a capacitor may be formed between other terminals or electrodes in the electronic component or on the substrate. When such a capacitor is formed, the frequency of the electric signal may be changed. This causes the problem that the operation of the piezoelectric vibrating piece and the electronic device becomes unstable, and the reliability of the electronic component is lowered.

  In view of the circumstances as described above, the present invention reduces the connection distance to the piezoelectric vibrating piece and the electronic device with respect to the inspection electrode formed on the castellation, thereby suppressing the occurrence of poor conduction. Another object is to provide a highly reliable electronic component and electronic component package by suppressing the formation of capacitance with other electrodes to stabilize the operation.

  In the present invention, an electronic component in which a piezoelectric vibrating piece and an electronic device are accommodated in an internal space formed by joining a base and a lid, the base including a first layer that holds the electronic device, and the first layer A first layer that is electrically connected to the electronic device, a first connection electrode extending from the first electrode, and a frame-shaped second layer that is bonded to the frame and holds the piezoelectric vibrating piece. And the second layer is a castellation electrode formed in a castellation in which a part of the outer peripheral portion is cut out and electrically connected to the first connection electrode. And a second connection electrode for electrically connecting the second electrode and the castellation electrode.

  In the second layer, castellations and castellation electrodes may be formed on each of the opposing sides. Further, the castellation may be formed at a central portion in the longitudinal direction of the side portion. The base may have a frame-shaped third layer bonded onto the second layer and bonded to the lid. The base may have a fourth layer bonded to the back surface of the first layer, and an external electrode electrically connected to the first electrode may be formed on the back surface of the fourth layer.

  According to the present invention, there is provided an electronic component package for housing the piezoelectric vibrating piece and the electronic device in an internal space formed by joining the base and the lid, the base including the first layer holding the electronic device and A frame-shaped second layer bonded on the first layer and holding the piezoelectric vibrating piece, the first layer electrically connecting with the electronic device, and a first electrode extending from the first electrode The second layer is formed in a castellation in which a part of the outer peripheral portion is cut out and electrically connected to the first connection electrode. A castellation electrode to be connected and a second connection electrode to electrically connect the second electrode and the castellation electrode may be provided.

  According to the present invention, since the second connection electrode is connected between the second electrode and the castellation electrode, the connection distance to the electronic device is shortened, and the occurrence of poor conduction or the like is suppressed. In addition, since the connection distance is shortened, it is possible to suppress the formation of a capacitance with other terminals and electrodes. Thereby, the fluctuation | variation of the characteristic with respect to a piezoelectric vibrating piece or an electronic device can be suppressed, operation | movement can be stabilized, and a highly reliable electronic component and electronic component package can be provided.

The electronic component which concerns on embodiment is shown, (a) is sectional drawing which shows the whole structure, (b) is a side view. It is a disassembled perspective view of the electronic component shown in FIG. It is a figure which shows the structure of the surface of the 3rd layer of a base. The 2nd layer of a base is shown, (a) is a figure showing the composition of the surface, and (b) is the figure showing the composition of the back side when seeing through the surface. It is a figure when the 2nd layer of a base is seen from the side. It is a figure which shows the structure of the surface of the state which hold | maintained the piezoelectric vibrating piece in the 2nd layer. The 1st layer of a base is shown, (a) is a figure which shows the structure of the surface, (b) is a figure which shows the structure of the back surface when it permeate | transmits and sees through the surface. The 4th layer of a base is shown, (a) is a figure which shows the structure of the surface, (b) is a figure which shows the structure of the back surface when it permeate | transmits and sees through the surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to this. Further, in the drawings, in order to describe the embodiment, the scale is appropriately changed and expressed by partially enlarging or emphasizing the description. The hatched portion in the drawing represents a metal film. In the following drawings, directions in the drawings will be described using an XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the surface of the piezoelectric vibrating piece is defined as an XZ plane. In this XZ plane, the longitudinal direction of the piezoelectric vibrating piece is denoted as the X direction, and the direction orthogonal to the X direction is denoted as the Z direction. A direction perpendicular to the XZ plane (thickness direction of the piezoelectric vibrating piece) is expressed as a Y direction. In each of the X direction, the Y direction, and the Z direction, the direction of the arrow in the figure is the + direction, and the direction opposite to the arrow direction is the − direction.

  An oscillator (electronic component) 100 according to this embodiment will be described with reference to FIGS. 1 and 2. FIG. 1A is a cross-sectional view showing the overall configuration of the oscillator 100, and FIG. FIG. 2 is an exploded perspective view of the oscillator 100. 1B shows a side surface of the package body (electronic component package) 190. FIG. As the oscillator 100 shown in FIG. 1A, for example, a temperature compensated crystal oscillator (TCXO) is used. The oscillator 100 has a built-in temperature compensation circuit that compensates for the temperature characteristics of the crystal, and can provide good temperature characteristics over a wide temperature range.

  As shown in FIG. 1A, the oscillator 100 includes a package body 190, a piezoelectric vibrating piece 130, and an electronic device 180 such as an IC or LSI. The package main body 190 has a lid 110 and a base 120.

  The lid 110 is formed in a rectangular plate shape. A surface 110 a of the lid 110 is a surface 190 a of the package body 190. For example, a metal plate is used as the lid 110, but glass, quartz, ceramics, or the like may be used instead. When a metal is used as the lid 110, for example, resistance welding using a joining ring 115 or the like is used for joining to the base 120. However, it is not limited to using the joining ring 115 for joining the lid 110 and the base. For example, you may join both using an adhesive agent. Further, depending on the material of the lid 110 and the base 120, both may be directly joined.

  The base 120 is disposed on the −Y side of the lid 110. The base 120 is composed of a plurality of layers, and holds the piezoelectric vibrating piece 130 and the electronic device 180 inside. The base 120 includes a first layer 160, a second layer 150, a third layer 140, and a fourth layer 170. The first layer 160, the second layer 150, the third layer 140, and the fourth layer 170 are the third layer 140, the second layer 150, the first layer 160, and the fourth layer from the + Y side to the −Y side. They are stacked in the Y direction in the order of 170.

  The first layer 160 is formed in a rectangular plate shape. An electronic device 180 is mounted on the surface 160 a of the first layer 160. The electronic device 180 includes various processing circuits such as an oscillation circuit and a temperature compensation circuit. As shown in FIG. 1A, the electronic device 180 is arranged at a position slightly deviated to the + X side with respect to the center of the first layer 160 in the X direction when viewed from the Y direction. The electronic device 180 has a plurality of terminals on the back surface (the surface on the −Y side), and is held on the front surface 160a of the first layer 160 via bumps 181 such as gold or lead.

  The second layer 150 is formed in a frame shape, and the back surface 150 b is bonded to the front surface 160 a of the first layer 160. The outer dimensions of the second layer 150 are formed in substantially the same manner as the first layer 160. The second layer 150 has a through portion 150t that penetrates in the Y direction. The through portion 150t is set larger than the planar shape of the electronic device 180 when viewed from the Y direction, and is formed in a rectangular shape so as to surround the electronic device 180. Further, the through portion 150t is formed at a position slightly deviated to the + X side with respect to the center of the second layer 150 in the X direction when viewed from the Y direction.

  The third layer 140 is formed in a frame shape, and the back surface 140 b is bonded to the front surface 150 a of the second layer 150. The outer dimensions of the third layer 140 are formed in substantially the same manner as the first layer 160 and the second layer 150. The third layer 140 has a through portion 140t that penetrates in the Y direction. The penetration part 140t is set larger than the planar shape of the piezoelectric vibrating piece 130 when viewed from the Y direction, and is formed in a rectangular shape so as to surround the piezoelectric vibrating piece 130.

  Further, the through portion 140t is formed in the approximate center in the X direction of the third layer 140 when viewed from the Y direction, and is formed in a state of being expanded to the −X side from the through portion 150t of the second layer 150. Has been. For this reason, as shown to Fig.1 (a), the one part area | region 150g of the surface 150a of the 2nd layer 150 is exposed to the penetration part 140t. In the exposed region 150g, the piezoelectric vibrating piece 130 is held by, for example, a conductive adhesive material.

  Thus, the third layer 140 and the second layer 150 are each formed in a frame shape. Since the first layer 160 is bonded to the back surface 150b of the second layer 150, the base 120 is in a state where a recess is formed. Further, as shown in FIG. 1A, an internal space K is formed in the package body 190 by joining the lid 110 to the surface 140 a of the third layer 140 of the base 120. The piezoelectric vibrating piece 130 and the electronic device 180 are accommodated in the internal space K. The internal space K is set to a vacuum atmosphere, for example. However, the internal space K is not limited to a vacuum atmosphere, and may be an inert gas atmosphere such as nitrogen gas or argon gas, for example.

  The fourth layer 170 is formed in a rectangular plate shape, and the front surface 170 a is bonded to the back surface 160 b of the first layer 160. The outer dimensions of the fourth layer 170 are formed in substantially the same manner as the first layer 160. The back surface 170 b of the fourth layer 170 is the back surface 190 b of the package body 190. External electrodes 172 a to 172 f are formed on the back surface 170 b of the fourth layer 170. Of these external parts 172a to 172f, the external electrodes 172a to 172d are used as terminals for connection to the outside, and the external electrodes 172e and 172f are used as dummy terminals. However, whether or not the external electrodes 172e and 172f are formed as dummy terminals is arbitrary.

  The thicknesses of the first layer 160, the second layer 150, the third layer 140, and the fourth layer 170 are arbitrarily set. Therefore, the first layer to the fourth layer 140 to 170 may be set to the same thickness. However, the second layer 150 has a thickness larger than the height of the electronic device 180 in the Y direction. The third layer 140 has a thickness that does not interfere with the piezoelectric vibrating piece 130 when the lid 110 is bonded.

  Each of the first to fourth layers 140 to 170 is formed of, for example, ceramics, but instead of this, glass, crystal, or the like may be used. When the first to fourth layers 140 to 170 are formed of ceramics, for example, a green sheet (ceramic sheet) is used for each of the first to fourth layers 140 to 170. In the green sheet, shapes corresponding to the first to fourth layers 140 to 170 are formed, and electrodes to be described later are formed on the first layer 160, the second layer 150, and the fourth layer 170. The base 120 is formed by superimposing these, for example, pressurizing and then baking.

  FIG. 1B shows a side surface of the package body 190 viewed from the + Z side. As shown in FIG. 1B, castellations 140f, 150f, and 160f are formed on the side surface (± Z side surface) of the package main body 190 in a state of being connected in the Y direction. The castellation 140f is formed on a part of the outer peripheral portion of the third layer 140. The castellation 150f is formed in a part of the outer peripheral portion of the second layer 150. The castellation 160f is formed in a part of the outer peripheral portion of the first layer 160.

  These castellations 140f, 150f, and 160f are formed at the same position and in the same shape in each layer as shown in FIG. Therefore, when the layers are stacked, they are connected in the Y direction. The castellations 140f, 150f, and 160f are formed in a rectangular shape (groove shape) when viewed from the Y direction. However, the shape is not limited to this, and for example, each layer may be cut out with a curved surface such as an arc shape when viewed from the Y direction. Although not shown, each of the third layer 140, the second layer 150, and the first layer 160 has a castellation on the opposite side surface (the side surface viewed from the −Z side) of the package body 190. 140e, 150e, and 160e are formed.

  A castellation electrode 153 b is formed on the castellation 150 f of the second layer 150. Similarly, although not shown, a castellation electrode 153a is formed on the opposite castellation 150e (see FIG. 4). These castellation electrodes 153 a and 153 b are exposed in the package body 190. As will be described later, the castellation electrodes 153a and 153b are electrically connected to the piezoelectric vibrating piece 130 and the electronic device 180, respectively. Therefore, after the piezoelectric vibrating piece 130 and the electronic device 180 are mounted and the lid 110 is joined, an inspection probe or the like is brought into contact with the castellation electrodes 153a and 153b, so that the piezoelectric vibrating piece 130 and The electronic device 180 can be inspected. Whether or not the castellations 140f and 160f are formed in the third layer 140 and the first layer 160 is arbitrary.

  3 to 8 individually show the first to fourth layers 140 to 170 constituting the base 120. The third layer 140, the second layer 150, the first layer 160, in order from FIG. The fourth layer 170 and those arranged on the + Y side (close to the lid 110) are shown in order.

  FIG. 3 is a diagram showing a configuration when the third layer 140 is viewed from the surface 140a side. As shown in FIG. 3, a castellation 140 e is formed on a part on the −Z side of the outer peripheral portion of the third layer 140. A castellation 140f is formed on a part of the outer peripheral portion of the third layer 140 on the + Z side. The castellations 140e and 140f are formed in a rectangular groove shape in the X-direction center portion of the opposing side portions 140c and 140d on the outer periphery of the third layer 140, respectively. In FIG. 3, the front surface 140a of the third layer is shown, but the same applies to the back surface 140b.

  FIG. 4A is a diagram showing the configuration when the second layer 150 is viewed from the surface 150a side, and FIG. 4B is the second layer 150 when viewed through the surface 150a from the + Y side. It is a figure which shows the structure of the back surface 150b. As shown in FIGS. 4A and 4B, a castellation 150e is formed on a part of the outer peripheral portion of the second layer 150 on the −Z side. A castellation 150 f is formed on a part of the outer peripheral portion of the second layer 150 on the + Z side. The castellations 150e and 150f are each formed in a rectangular groove shape in the X-direction central portion of the opposite side portions 150c and 150d on the outer periphery of the second layer 150, respectively.

  The castellations 150e and 150f are formed at the same positions and the same dimensions as the castellations 140e and 140f provided on the third layer 140. Therefore, when the second layer 140 and the third layer 150 are overlapped, the castellations 150e and 150f are continuously in the Y direction with the castellations 140e and 140f, respectively.

  As shown in FIG. 4A, second electrodes 151 a and 151 b are formed on the surface 150 a of the second layer 150. The second electrodes 151a and 151b are each formed in a rectangular shape and arranged side by side in the Z direction. The second electrodes 151 a and 151 b are partially exposed when bonded to the third layer 140. The exposed portions of the second electrodes 151a and 151b are used as portions for connecting a piezoelectric vibrating piece 130 described later.

  The second electrodes 151a and 151b are electrically connected to the castellation electrodes 153a and 153b via the second connection electrodes 151c and 151d. The second connection electrode 151c extends from the second electrode 151a to the −Z side so as to bypass the through portion 150t, bends in the + X direction, extends along the side portion 150c, and is drawn to the castellation 150e. . The second connection electrode 151d extends from the second electrode 151b to the + Z side so as to bypass the through portion 150t, bends in the + X direction, extends along the side portion 150d, and is drawn to the castellation 150f.

  As shown in FIG. 4B, electrodes 152 a and 152 b are formed on the back surface 150 b of the second layer 150. The electrode 152a is drawn out in the + Z direction from the castellation electrode 153a and formed in a rectangular shape. The electrode 152b is drawn out in the −Z direction from the castellation electrode 153b and formed in a rectangular shape. The electrode 152a is connected to the second electrode 151a via the castellation electrode 153a and the second connection electrode 151c. The electrode 152b is connected to the second electrode 151b via the castellation electrode 153b and the second connection electrode 151d.

  FIG. 5 is a diagram showing a configuration when the second layer 150 is viewed from the + Z side. As shown in FIG. 5, the castellations 150 e and 150 f are formed at the central portions of the side portions 150 c and 150 d in the longitudinal direction of the second layer 150. The castellation electrodes 153a and 153b are formed on almost the entire XY plane of the castellations 150e and 150f, respectively.

  FIG. 6 is a diagram illustrating a configuration of the surface 150 a in a state where the piezoelectric vibrating piece 130 is held on the second layer 150. As shown in FIG. 6, the piezoelectric vibrating piece 130 is mounted on the surface 150 a of the second layer 150. The piezoelectric vibrating piece 130 is formed in a rectangular shape having a long side in the X-axis direction and a short side in the Z-axis direction when viewed from the Y direction. As the piezoelectric vibrating piece 130, for example, an AT-cut quartz crystal vibrating piece is used. However, the present invention is not limited to this, and a crystal piece such as a BT cut, a GT cut, or an XT cut may be used, or a tuning fork type crystal vibrating piece may be used. For example, lithium tantalate or lithium niobate may be used as the piezoelectric vibrating piece 130.

  An excitation electrode 131 a and an extraction electrode 132 a are formed on the surface (+ Y side surface) of the piezoelectric vibrating piece 130. Similarly, an excitation electrode 131 b and an extraction electrode 132 b are formed on the back surface (the surface on the −Y side) of the piezoelectric vibrating piece 130. The excitation electrodes 131a and 131b are each formed in a rectangular shape so as to sandwich the vibrating portion of the piezoelectric vibrating piece 130, and are formed at positions and dimensions that overlap when viewed from the Y direction. The excitation electrodes 131a and 131b and the extraction electrodes 132a and 132b are formed, for example, by forming a conductive metal film by sputtering vapor deposition or vacuum vapor deposition using a metal mask. As the metal film, for example, a laminated structure in which nickel tungsten (NiW) is formed as a base film and gold (Au) or silver (Ag) is formed as a conductive film thereon is used.

  The extraction electrodes 132a and 132b are formed to extend in the −X direction from the excitation electrodes 131a and 131b toward the −X side end of the piezoelectric vibrating piece 130, respectively. The extraction electrode 132a is extracted from a position on the −Z side of the excitation electrode 131a, and the connection electrode 132b is extracted from a position on the + Z side of the excitation electrode 131b.

  As shown in FIG. 6, the piezoelectric vibrating piece 130 is held on the surface 150a of the second layer 150 by conductive adhesives 133a and 133b. The lead electrodes 132a and 132b of the piezoelectric vibrating piece 130 are connected to the second electrodes 151a and 151b via conductive adhesives 133a and 133b, respectively. Accordingly, the lead electrode 132a of the piezoelectric vibrating piece 130 is connected to the castellation electrode 153a via the conductive adhesive 133a, the second electrode 151a, and the second connection electrode 151c. Similarly, the lead electrode 132b of the piezoelectric vibrating piece 130 is connected to the castellation electrode 153b via the conductive adhesive 133b, the second electrode 151b, and the second connection electrode 151d.

  FIG. 7A is a diagram illustrating a configuration when the first layer 160 is viewed from the surface 160a side, and FIG. 7B is a diagram illustrating the first layer 160 when viewed through the surface 160a from the + Y side. It is a figure which shows the structure of the back surface 160b. As shown in FIGS. 7A and 7B, a castellation 160e is formed on a part of the outer peripheral portion of the first layer 160 on the −Z side. Further, a castellation 160f is formed on a part of the outer peripheral portion of the second layer 150 on the + Z side. The castellations 160e and 160f are each formed in a rectangular groove shape in the X-direction center portion of the opposing side portions 160c and 160d on the outer periphery of the first layer 160, respectively.

  The castellations 160e and 160f are formed at the same positions and the same dimensions as the castellations 150e and 150f provided on the second layer 150. Therefore, when the first layer 160 and the second layer 150 are overlapped, the castellations 160e and 160f are continuously connected to the castellations 150e and 150f in the Y direction, respectively. Accordingly, the castellations 140e, 150e, and 160e and the castellations 140f, 150f, and 160f are each continuous in the Y direction.

  As illustrated in FIG. 7A, rectangular first electrodes 161 a to 161 f are provided on the surface 160 a of the first layer 160. The first electrodes 161a to 161f are electrically connected to a plurality of terminals of the electronic device via the bumps 181. The first electrodes 161a to 161f are arranged so as to correspond to the terminals of the electronic device. In FIG. 7A, the first electrodes 161a to 161f are formed at six locations, but may be formed at, for example, eight locations according to the number of terminals of the electronic device 180.

  On the surface 160a of the first layer 160, first connection electrodes 161g and 161h are provided. The first connection electrode 161g is formed to extend from the first electrode 161e toward the castellation 160e. The first connection electrode 161g is extended to a region facing the electrode 152a formed on the back surface 150b of the second layer 150. The first connection electrode 161h is formed to extend from the first electrode 161b toward the castellation 160f. The first connection electrode 161h is extended to a region facing the electrode 152b formed on the back surface 150b of the second layer 150.

  Therefore, when the first layer 160 and the second layer 150 are bonded, the first connection electrodes 161g and 161h on the surface 160a of the first layer 160 are not directly connected to the second connection electrode via a conductive bonding material (not shown). The electrodes 150a and 152b on the back surface 150b of the layer 150 are electrically connected to each other. As a result, the first electrode 161e is connected to the castellation electrode 153a via the first connection electrode 161g and the electrode 152a. Similarly, the first electrode 161b is connected to the castellation electrode 153b via the first connection electrode 161h and the electrode 152b.

  As shown in FIG. 7B, electrodes 162a, 162c, 162d, and 162f are formed on the back surface 160b of the first layer 160. The electrodes 162a, 162c, 162d, and 162f are connected to the first electrodes 161a, 161c, 161d, and 161f through the through electrodes 163a, 163c, 163d, and 163f, respectively. In FIG. 7, among the first electrodes 161a to 161f, the one connected to the electrode 162a on the back surface 160b through the through electrode 163a and the like, and the one connected to the first connection electrodes 161g and 161h are shown. Although each is shown, this is an example, and the first connection electrode may be connected to the other first electrode in accordance with the terminal of the electronic device 180. Also, the first electrode connected to the first connection electrode (for example, the first electrode 161b) may be connected to the electrode on the back surface 160b through the through electrode.

  Further, in the first to third layers 140 to 160 shown in FIGS. 3 to 7, the castellation 140e and the like are formed in the central portion in the longitudinal direction of the side portion 140c and the like, but are not limited thereto. For example, castellations may be formed in portions off the center, such as the side portions 140c, or corner portions.

  As shown in FIG. 4, the castellation electrodes 153a and 153b are formed in the central portions of the side portions 150c and 150d, so that, for example, in FIG. Even if it is rotated, the castellation electrodes 153a and 153b are simply replaced, and the position does not shift. Therefore, there is an advantage that it is not necessary to determine the orientation of the electronic component 100 when the inspection probe or the like is brought into contact with the castellation electrodes 153a and 153b.

  FIG. 8A is a diagram showing the configuration of the front surface 170a of the fourth layer 170, and FIG. 8B is the configuration of the back surface 170b of the fourth layer 170 when viewed through the front surface 170a from the + Y side. FIG. As shown in FIG. 8A, on the surface 170a of the fourth layer 170, rectangular electrodes 171a to 171d, similarly rectangular electrodes 174a, 174c, 174d, 174f, and electrodes 175a connecting these electrodes, 175c, 175d, and 175f are provided.

  The electrodes 171a to 171d are disposed at the four corners of the fourth layer 170, respectively. The electrodes 174a, 174c, 174d, and 174f are disposed at positions corresponding to the electrodes 162a, 162c, 162d, and 162f disposed on the back surface 160b of the first layer 160. Therefore, when the first layer 160 and the fourth layer 170 are joined, the electrodes 174a, 174c, 174d, and 174f are connected to the electrodes 162a, 162c, 162d, and 162f via a conductive joining material (not shown) or directly. Connected.

  The connection electrode 175a connects the electrode 174a and the electrode 171a. The connection electrode 175c connects the electrode 174c and the electrode 171c. The connection electrode 175d connects the electrode 174d and the electrode 171d. The connection electrode 175f connects the electrode 174f and the electrode 171b.

  As shown in FIG. 8B, six rectangular external electrodes 172 a to 172 f are formed on the back surface 170 b of the fourth layer 170. Of these, the four external electrodes 172a, 172b, 172c, and 172d are connected to the electrodes 171a, 171b, 171c, and 171d through the through electrodes 173a, 173b, 173c, and 173d, respectively. Further, the external electrodes 172a to 172d are arranged at four corners (four corners) of the back surface 170b of the fourth layer 170 (the back surface 190b of the package body 190). The external electrodes 172a to 172d are used for power supply, output, ground connection, and the like, for example.

  The through electrodes 173a to 173d are not limited to the connection between the external electrodes 172a to 172d and the electrodes 171a to 171d. For example, a castellation may be formed on the outer peripheral portion of the fourth layer 170, and the external electrodes 172a to 172d and the electrodes 171a to 171d may be connected via the electrodes formed on the castellation.

  The remaining two external electrodes 172e and 172f are used as dummy terminals. In the present embodiment, the external electrode 172e which is a dummy terminal is disposed between the external electrode 172a and the external electrode 172c in the X direction. The external electrode 172f, which is a dummy terminal, is disposed between the external connection terminal 172b and the external connection terminal 172d in the X direction. Whether or not to form such a dummy terminal is arbitrary.

  Here, taking the external electrode 172a as an example, the connection destination will be described. As shown in FIG. 8, the external electrode 172a is connected to the electrode 174a through the through electrode 173a, the electrode 171a, and the electrode 175a. As shown in FIG. 7, the electrode 174a is connected to one of the terminals of the electronic device 180 via the electrode 162a, the through electrode 163a, and the first electrode 161a (and further via the bump 181). The other external electrodes 172b to 172d are also connected to the terminals of the electronic device 180 through the first electrodes 161c, 161d, and 161f through the same path.

  The first electrodes 161b and 161e connected to the terminals of the electronic device 180 are the first connection electrodes 161g and 161h, the electrodes 152a and 152b, the castellation electrodes 153a and 153b, the second connection electrodes 151c and 151d, and the second The electrodes 151a and 151b are connected to the extraction electrodes 132a and 132b and the excitation electrodes 131a and 131b of the piezoelectric vibrating piece 130 via the conductive adhesives 133a and 133b, respectively.

  In this embodiment, the castellation electrodes 153a and 153b to the extraction electrodes 132a and 132b of the piezoelectric vibrating piece 130 are electrically connected via the second connection electrodes 151c and 151d and the second electrodes 151a and 151b as shown in FIG. Connected. As shown in FIG. 7, the castellation electrodes 153a and 153b to the terminals of the electronic device 180 are electrically connected via the electrodes 152a and 152b, the first connection electrodes 161g and 161h, and the first electrodes 161e and 161f. It is connected.

  As described above, according to the present embodiment, both the piezoelectric vibrating piece 130 and the electronic device 180 are connected at a short distance from the castellation electrodes 153a and 153b. Therefore, unlike the conventional case where the castellation electrodes 153a, 153b and the electronic device 180 are connected through a complicated path via a through electrode or the like, there is a low possibility that an electrical conduction failure or the like occurs. Further, since the paths from the castellation electrodes 153a and 153b to the piezoelectric vibrating piece 130 and the electronic device 180 are short, the formation of capacitance with other electrodes and external terminals is suppressed.

  Therefore, fluctuations in characteristics with respect to the piezoelectric vibrating piece 130 and the electronic device 180 can be suppressed to stabilize the operation, and the highly reliable oscillator (electronic component) 100 or package body (electronic component package) 190 can be provided. Can be provided.

  The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention. For example, in the above embodiment, the temperature compensated crystal oscillator (TCXO) has been described as an example of the electronic component 100. However, the present invention is not limited to this, and the voltage controlled crystal oscillator (VCXO) or the package crystal oscillator (SPXO) is not limited thereto. Or other types of crystal oscillators.

  In the above-described embodiment, the third layer 140 is bonded to the surface 150a of the second layer 150. However, the present invention is not limited to this. Instead of using the third layer 140, for example, a structure in which a recess is formed on the back surface 110 b of the lid 110 or a structure in which a frame-like protrusion is formed on the surface 150 a of the second layer 150 is used. Interference with the piezoelectric vibrating piece 130 may be avoided.

  In the above-described embodiment, the external electrodes 172a to 172f are formed on the back surface 170b of the fourth layer 170, but the present invention is not limited to this. For example, the fifth layer may be bonded to the back surface 170b of the fourth layer 170, and external electrodes connected to the external electrodes 172a to 172f of the fourth layer 170 may be formed on the back surface of the fifth layer 170, respectively.

K ... Internal space 100 ... Oscillator (electronic component)
DESCRIPTION OF SYMBOLS 110 ... Lid 120 ... Base 130 ... Piezoelectric vibrating piece 140 ... 3rd layer 140t ... Penetration part 140e, 140f ... Castellation 150 ... 2nd layer 150t ... Penetration part 150a ... Surface 150e, 150f ... Castellation 150c, 150d ... Side part 151a, 151b ... 2nd electrode 151c, 151d ... 2nd connection electrode 153a, 153b ... Castellation electrode 160 ... 1st layer 160a ... Front surface 160b ... Back surface 160e, 160f ... Castellation 161a-161f ... 1st electrode 161g, 161h ... 1st connection electrode 170 ... 4th layer 172a-172f ... External electrode 180 ... Electronic device 190 ... Package main body (electronic component package)

Claims (6)

An electronic component containing a piezoelectric vibrating piece and an electronic device in an internal space formed by joining a base and a lid,
The base includes a first layer that holds the electronic device, and a frame-shaped second layer that is bonded onto the first layer and holds the piezoelectric vibrating piece.
The first layer includes a first electrode electrically connected to the electronic device, and a first connection electrode extending from the first electrode,
The second layer includes a second electrode that is electrically connected to the piezoelectric vibrating piece, and a castellation electrode that is formed in a castellation in which a part of the outer peripheral portion is cut out and is electrically connected to the first connection electrode. And an electronic component comprising: a second connection electrode that electrically connects the second electrode and the castellation electrode.   2. The electronic component according to claim 1, wherein the castellation and the castellation electrode are formed on each of the opposing side portions of the second layer.   The electronic component according to claim 2, wherein the castellation is formed at a central portion in a longitudinal direction of the side portion.   4. The electronic component according to claim 1, wherein the base has a frame-shaped third layer bonded to the second layer and bonded to the lid. 5. The base has a fourth layer bonded to the back surface of the first layer;
The electronic component according to claim 1, wherein an external electrode that is electrically connected to the first electrode is formed on a back surface of the fourth layer. An electronic component package for accommodating a piezoelectric vibrating piece and an electronic device in an internal space formed by joining a base and a lid,
The base includes a first layer that holds the electronic device, and a frame-shaped second layer that is bonded onto the first layer and holds the piezoelectric vibrating piece.
The first layer includes a first electrode electrically connected to the electronic device, and a first connection electrode extending from the first electrode,
The second layer includes a second electrode that is electrically connected to the piezoelectric vibrating piece, and a castellation electrode that is formed in a castellation in which a part of the outer peripheral portion is cut out and is electrically connected to the first connection electrode. And an electronic component package comprising: a second connection electrode that electrically connects the second electrode and the castellation electrode.

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