JP2015053516A5

JP2015053516A5 -

Info

Publication number: JP2015053516A5
Application number: JP2014234280A
Authority: JP
Filing date: 2014-11-19
Publication date: 2015-11-19
Anticipated expiration: 2027-03-30

Claims

A first lead frame;
A second lead frame spaced from the first lead frame in the first direction;
A semiconductor light emitting device bonded to the die bonding portion of the first lead frame and conducting to the second lead frame;
Surrounds the semiconductor light emitting element into an annular shape so as to expose through the opening, and having a frame-like portion for reflecting light from the semiconductor light-emitting element in the emission direction, for supporting the first lead frame and the second lead frame A resin case,
With
The first lead frame is provided integrally with the die bonding portion, and the back surface thereof is located on the emission direction side from the back surface of the die bonding portion, and from the die bonding portion to the first direction in a plan view. Extending to a region overlapping with the frame-shaped portion in a second direction orthogonal to each other, and having a first extending portion having a width in the first direction smaller than a width in the first direction of the die bonding portion,
The case is configured to cover and cover the surface of the first extension part in close contact with the frame-shaped part, and to cover the back surface of the first extension part in close contact with the back surface of the die bonding part. A semiconductor light emitting device having a holding portion.

2. The semiconductor light emitting device according to claim 1, wherein the first extending portion is provided so as to extend in a second direction at least in a central region in the first direction of the die bonding portion.

The said 1st extension part is provided so that it may extend in the said 2nd direction at least in the edge part area | region by the side of the said 2nd lead frame in the said 1st direction of the said die bonding part. Semiconductor light emitting device.

The first extending portion is provided so as to extend in the second direction at least in an end region opposite to the second lead frame in the first direction of the die bonding portion. A semiconductor light-emitting device according to any one of the above.

The semiconductor light emitting device according to claim 1, wherein a plurality of the first extending portions are provided.

The semiconductor light-emitting device according to claim 1, wherein the surface of the first extension portion is flush with the die bonding portion.

The semiconductor light emitting device according to claim 1, wherein the back surface of the die bonding portion is flush with the back surface of the case.

The first lead frame has a first terminal portion protruding in the first direction from the case, and the thickness of the portion other than the first terminal portion is a thickness of no more than the thickness of the first terminal portion A semiconductor light-emitting device according to claim 1, comprising:

The second lead frame is provided integrally with the main body part, the main surface part of which the front surface is exposed from the opening of the case and the back surface is exposed from the case, and the back surface is formed from the back surface of the main body part. It is located on the emission direction side, and has a second extension portion that extends from the main body portion to the region overlapping the frame-like portion in the second direction in plan view,
The case is configured to closely cover the surface of the second extending portion with the frame-shaped portion and to cover the back surface of the second extending portion while exposing the back surface of the main body portion. The semiconductor light-emitting device according to claim 1, which has two holding portions.

The second lead frame is provided integrally with the main body, and a back surface thereof is located on the emission direction side from the back surface of the main body, and extends from the main body in the first direction in plan view. A third extending portion is provided,
The semiconductor light-emitting device according to claim 9, wherein the case has a third holding portion that covers the back surface of the third extending portion in close contact.

Said a second extending portion and the third extending portion, is continuous so as to surround the main body portion, the semiconductor light-emitting device according to claim 10.

The second extending portion and the third extending portion has a surface which is flush with the surface of the body portion, the semiconductor light-emitting device according to claim 11.

The semiconductor light emitting device according to claim 9, wherein the back surface of the main body is flush with the back surface of the case.

The second lead frame has a second terminal portion projecting in the first direction from the case, and the thickness of the portion other than the second terminal portion is a thickness of no more than the thickness of the second terminal portion The semiconductor light-emitting device according to claim 1, comprising:

The first lead frame and the second lead frame consists of a lead frame which has not been bent, the semiconductor light-emitting device according to any one of claims 1 to 14.

The semiconductor light-emitting device according to claim 1, wherein a distal end portion of each extension portion is included in the case by being positioned on an inner side than a side surface of the case.

17. The semiconductor light emitting device according to claim 1, wherein the back surface of each extending portion has a plane parallel to the front surface of each extending portion.

The semiconductor light-emitting device according to claim 1, wherein the opening of the frame-shaped portion is rectangular.

The semiconductor light-emitting device according to claim 1, wherein the case is made of a white resin.

The first extending portion having the first direction of the smaller the first width than the width of the semiconductor light-emitting element, a semiconductor light emitting device according to any one of claims 1 to 19.

21. The semiconductor light emitting device according to claim 1, wherein at least one first extending portion is formed on each side of the die bonding portion in the second direction.

The semiconductor light emitting device according to claim 1, wherein a plurality of the first extending portions are formed on one side in the second direction of the die bonding portion.

23. The semiconductor light emitting device according to claim 21, wherein the plurality of first extending portions have the same length extending in the second direction.

  A first lead frame;
  A second lead frame spaced apart from the first lead frame;
  A semiconductor light emitting device bonded to the first lead frame and conducting to the second lead frame;
  A resin case supporting the first lead frame and the second lead frame;
With
  The semiconductor light emitting device, wherein the first lead frame is supported by the case by being in close contact with the case on both the upper surface side and the lower surface side.