JP2015045027A5 - - Google Patents

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JP2015045027A5
JP2015045027A5 JP2014240427A JP2014240427A JP2015045027A5 JP 2015045027 A5 JP2015045027 A5 JP 2015045027A5 JP 2014240427 A JP2014240427 A JP 2014240427A JP 2014240427 A JP2014240427 A JP 2014240427A JP 2015045027 A5 JP2015045027 A5 JP 2015045027A5
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resin
adhesive composition
pressure
sensitive adhesive
terpene phenol
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JP2014240427A
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JP2015045027A (en
JP6016874B2 (en
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Claims (14)

モノビニル置換芳香族化合物と共役ジエン化合物とのブロック共重合体からなるベースポリマーと、
水酸基価８０ｍｇＫＯＨ／ｇ以上２００ｍｇＫＯＨ／ｇ未満の粘着付与樹脂（ＴＨ）と、
を含有する、粘着剤組成物。 A base polymer comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound;
A hydroxyl value 80 mg KOH / g or more 200 mg KOH / g of less than tackifier resin (T H),
A pressure-sensitive adhesive composition comprising: 前記粘着付与樹脂（ＴＨ）として、軟化点が１２０℃以上の高軟化点樹脂を含む、請求項１に記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to claim 1, comprising a high softening point resin having a softening point of 120 ° C or higher as the tackifying resin ( TH ). 前記粘着付与樹脂（ＴＨ）として、テルペンフェノール樹脂を含む、請求項１または２に記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to claim 1 or 2, comprising a terpene phenol resin as the tackifier resin ( TH ). 水酸基価８０ｍｇＫＯＨ／ｇ未満の粘着付与樹脂（ＴＬ）をさらに含有する、請求項１から３のいずれか一項に記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to any one of claims 1 to 3, further comprising a tackifying resin (T L ) having a hydroxyl value of less than 80 mgKOH / g. 前記粘着付与樹脂（ＴＬ）として、石油樹脂およびテルペン樹脂の少なくとも一方を含む、請求項４に記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to claim 4, comprising at least one of a petroleum resin and a terpene resin as the tackifying resin (T L ). 前記粘着付与樹脂（ＴＬ）として、軟化点が１２０℃未満の低軟化点樹脂を含む、請求項４または５に記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to claim 4 or 5, comprising a low softening point resin having a softening point of less than 120 ° C as the tackifying resin (T L ). 前記粘着付与樹脂（ＴＬ）として、軟化点が１２０℃以上の高軟化点樹脂を含む、請求項４から６のいずれか一項に記載の粘着剤組成物。 The pressure-sensitive adhesive composition according to any one of claims 4 to 6, comprising a high softening point resin having a softening point of 120 ° C or higher as the tackifying resin (T L ). 前記ベースポリマーは、スチレンイソプレンブロック共重合体およびスチレンブタジエンブロック共重合体の少なくとも一方からなる、請求項１から７のいずれか一項に記載の粘着剤組成物。   The pressure-sensitive adhesive composition according to any one of claims 1 to 7, wherein the base polymer comprises at least one of a styrene isoprene block copolymer and a styrene butadiene block copolymer. 前記粘着剤組成物は、粘着付与樹脂として、テルペンフェノール樹脂Ａおよびテルペンフェノール樹脂Ｂを含有し、
前記テルペンフェノール樹脂Ａの水酸基価ＡＯＨ（ｍｇＫＯＨ／ｇ）は、前記テルペンフェノール樹脂Ｂの水酸基価ＢＯＨ（ｍｇＫＯＨ／ｇ）よりも高い、請求項１から８のいずれか一項に記載の粘着剤組成物。 The pressure-sensitive adhesive composition contains terpene phenol resin A and terpene phenol resin B as a tackifier resin,
The adhesion according to any one of claims 1 to 8, wherein the hydroxyl value A OH (mgKOH / g) of the terpene phenol resin A is higher than the hydroxyl value B OH (mgKOH / g) of the terpene phenol resin B. Agent composition. 前記テルペンフェノール樹脂Ａの水酸基価ＡＯＨは８０ｍｇＫＯＨ／ｇ以上であり、前記テルペンフェノール樹脂Ｂの水酸基価ＢＯＨは８０ｍｇＫＯＨ／ｇ未満である、請求項９に記載の粘着剤組成物。 The hydroxyl value A OH terpene phenol resin A is 80 mg KOH / g or more, a hydroxyl value B OH of the terpene phenol resin B is less than 80 mg KOH / g, pressure-sensitive adhesive composition according to claim 9. 前記テルペンフェノール樹脂Ａの含有量ｍＡと前記テルペンフェノール樹脂Ｂの含有量ｍＢとの質量比（ｍＡ：ｍＢ）が１：５〜５：１である、請求項９または１０に記載の粘着剤組成物。 The mass ratio of the content m B of the content of the terpene phenol resin A m A and the terpene phenol resin B (m A: m B) is 1: 5 to 5: 1, according to claim 9 or 10 Adhesive composition. 前記テルペンフェノール樹脂Ａおよび前記テルペンフェノール樹脂Ｂは、いずれも、軟化点が１２０℃以上の高軟化点樹脂である、請求項９から１１のいずれか一項に記載の粘着剤組成物。   12. The pressure-sensitive adhesive composition according to claim 9, wherein each of the terpene phenol resin A and the terpene phenol resin B is a high softening point resin having a softening point of 120 ° C. or higher. モノビニル置換芳香族化合物と共役ジエン化合物とのブロック共重合体からなるベースポリマーと、
水酸基価８０ｍｇＫＯＨ／ｇ以上２００ｍｇＫＯＨ／ｇ未満の粘着付与樹脂（ＴＨ）と、
を含む粘着剤層を有する、粘着シート。 A base polymer comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound;
A hydroxyl value 80 mg KOH / g or more 200 mg KOH / g of less than tackifier resin (T H),
The adhesive sheet which has an adhesive layer containing this. 請求項１から１２のいずれか一項に記載の粘着剤組成物から形成された粘着剤層を有する、粘着シート。   The adhesive sheet which has an adhesive layer formed from the adhesive composition as described in any one of Claims 1-12.
JP2014240427A 2012-03-16 2014-11-27 Adhesive composition and adhesive sheet Active JP6016874B2 (en)

Priority Applications (1)

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JP2014240427A JP6016874B2 (en) 2012-03-16 2014-11-27 Adhesive composition and adhesive sheet

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JP2012060665 2012-03-16
JP2012060665 2012-03-16
JP2014240427A JP6016874B2 (en) 2012-03-16 2014-11-27 Adhesive composition and adhesive sheet

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JP2015045027A JP2015045027A (en) 2015-03-12
JP2015045027A5 true JP2015045027A5 (en) 2015-10-08
JP6016874B2 JP6016874B2 (en) 2016-10-26

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JP7246858B2 (en) * 2018-02-27 2023-03-28 日東電工株式会社 THERMOPLASTIC ADHESIVE SHEET AND USE THEREOF
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JPWO2022050360A1 (en) * 2020-09-03 2022-03-10
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