JP4591732B2 - Recyclable adhesive tape - Google Patents

Recyclable adhesive tape Download PDF

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Publication number
JP4591732B2
JP4591732B2 JP2000162161A JP2000162161A JP4591732B2 JP 4591732 B2 JP4591732 B2 JP 4591732B2 JP 2000162161 A JP2000162161 A JP 2000162161A JP 2000162161 A JP2000162161 A JP 2000162161A JP 4591732 B2 JP4591732 B2 JP 4591732B2
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
adhesive tape
resin
adhesive
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JP2001342441A (en
Inventor
晃 山上
伸一 市原
弘介 田辺
昭洋 山田
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DIC Corp
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DIC Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、溶融リサイクル可能な樹脂成型部品を固定する粘着テープに関する。詳しくは、ポリスチレン(以下、PStと略す)およびアクリロニトリル−ブタジエン−スチレン(以下、ABSと略す)系樹脂成型部品に対してはテープを剥がさずに溶融リサイクルでき、被着体が上記以外の樹脂成型部品の場合は、加熱処理あるいは溶剤処理などの特別な剥離処理をしなくても、該被着体から糊残りやチギレがなく剥離できる粘着テープに関する。(以下、糊残りやチギレなく剥離することを再剥離、再剥離できる性能のことを再剥離性という。)
【0002】
【従来の技術】
近年環境対策の一環として、電子機器等の樹脂成型部品には、溶融リサイクル可能なPSt、ABS、ポリカーボネート/アクリロニトリル−ブタジエン−スチレン(以下、PC/ABSと略す)等の熱可塑性樹脂が採用されている。
これらの熱可塑性樹脂成型部品を固定する場合、接着剤を使用する方法やウェルダリング法もあるが、加工性や作業性が良好であることから、粘着テープが多用されている。特に両面粘着テープによる固定は、固定される部品の形状が複雑な場合や、自動化ラインでの生産性を要求される場合等に有利である。
【0003】
従来、これらの粘着テープで固定された樹脂成型部品をリサイクルする場合、貼着された粘着テープを剥離した後に溶融リサイクルされるのが一般的であったが、剥離に際して加熱や溶剤を使用して粘着剤を軟化させたり、物理的に切り取る、あるいは削り取るといった手間のかかる工程を必要とした。特開平8−209086号公報には、樹脂成型部品の固定時には強い接着力を発揮し、剥離する際には糊残りやチギレのない粘着テープが開示されている。
【0004】
一方、粘着テープを貼着したまま樹脂成型部品を溶融リサイクルする方法が、特開平4−136082号公報や特開平7−3218号公報に開示されている。この方法は、被着体と粘着テープが互いに相溶性を有する組合せの場合には使用できるが、必ずしもこのような特定の組合せでのみ使用されるとは限らない。互いに相溶性をもたない組合せの場合は、従来通り剥離しなければならないこととなるが、これまで、貼着したまま溶融リサイクルできる粘着テープで、同時に再剥離性を有するものは知られていない。
【0005】
特開平8−34088号公報にも、シート状部材を貼着したまま溶融リサイクル可能な電子機器の部品が開示されているが、被着体とシート状部材の接着剤として、被着体およびシート状部材との相溶性を有するPMMAのみが例示されているにすぎず、粘着テープとしての具体的な構成や、その再剥離性等については何ら記載も示唆もされていない。
【0006】
【発明が解決しようとする課題】
本発明は上記問題点に鑑みてなされたもので、その課題とするところは、特定の樹脂成型部品に対しては貼着したまま溶融リサイクルが可能で、それ以外の樹脂成型部品に対しては、固定時には長期間にわたって強い接着力を発揮し、剥離する際にはチギレや糊残りのない、いわゆる再剥離可能な粘着テープを提供することにある。
樹脂成形部品に粘着テープを貼着したまま溶融リサイクルする場合、単に被着体樹脂と粘着テープが相溶するというだけでは不十分である。溶融リサイクルされた再生樹脂成形部品の機械的特性と、純正樹脂成形部品の機械的特性との変動をできる限り小さく抑えることも課題となる。
【0007】
【課題を解決するための手段】
本発明者らは、上記課題を解決するため鋭意検討した結果、本発明を完成させるに至った。
すなわち、本発明の粘着テープは、樹脂成型部品用熱可塑性樹脂として多用されているPStおよび/またはABSとの相溶性を有し、該樹脂成型部品に貼着したまま溶融リサイクル可能であり、かつ該熱可塑性樹脂以外の樹脂成型部品に対しては、良好な再剥離性を有する粘着テープである。その構成は、PSt、ABS、PC/ABSと相溶性を有し、かつ流れ方向(以下、MDと略す)および幅方向(以下、TDと略す)にそれぞれ20N/20mm以上の引張強度を有する支持体フィルムの少なくとも片面に、スチレン系ブロックコポリマーおよび粘着付与樹脂を含有する粘着剤層を設けたものである。
なお、本発明の粘着テープは、PStやABS以外の被着体樹脂であっても、相溶性を有し、かつ再生樹脂成型品の機械的特性が純正樹脂成形部品の機械的特性と比較して大きく変動しない場合は、貼着したまま溶融リサイクルすることができる。
【0008】
前記課題を解決するために、本発明では粘着剤の主成分として、PStやABSとの相溶性を有するスチレン系ブロックコポリマーを使用する。中でも、スチレン−イソプレン−スチレンブロックコポリマー(以下、SISと略す)が好適である。また、十分な接着力を付与するために粘着剤に添加する粘着付与樹脂としては公知慣用のものを使用することができるが、特に水酸基価が15以上100以下のロジン系樹脂が、ミクロ相分離させやすく好ましい。
【0009】
しかしながら、ロジン系樹脂は空気中の酸素によってフリーラジカルを発生しやすく、このフリーラジカルが粘着剤を分解劣化させることが下記文献1に記載されている。
文献1:遠山ら,日本接着協会誌,Vol.9,No.3,120(1973)
本発明者等は、本発明のSIS−ロジン系樹脂の系においても、SISの主鎖の二重結合が切断されて分解劣化が起こっており、しかもロジン系樹脂の水酸基価が高いほど分解劣化しやすいことを見出した。SISが分解劣化すると、粘着剤の凝集力が低下する結果、接着強度が低下するとともに、剥離時に糊残りの原因となる。そのため、上記架橋剤としては、分解劣化の誘因となるロジン系樹脂の水酸基量を適宜制御できるものが望ましい。この目的のためには、水酸基と架橋反応するイソシアネート系架橋剤が好適である。
【0010】
また、本発明者等は、上記文献1に記載された樹脂溶液の一定条件下、一定時間内の酸素吸収量を、粘着付与樹脂による粘着剤の分解劣化しやすさの指標として使用し得ることを見出した。その結果、本発明の粘着剤に使用する粘着付与樹脂の酸素吸収量は、1ml以下であることが好ましい。
【0011】
【発明の実施の形態】
以下に本発明をさらに詳細に説明する。
本発明の支持体フィルムは、溶融時にPStおよび/またはABSに相溶することと、再剥離時にチギレを起こさせないために、MDおよびTD方向にそれぞれ20N/20mm以上の引張強度を有すること以外は特に限定されるものではない。具体的には、例えばPStフィルム、ハイインパクトポリスチレン(以下、HIPStと略す)フィルム、二軸延伸ポリスチレン(以下、OPStと略す)フィルム、ABSフィルム等が挙げられる。フィルムの厚みとしては、5〜200μmのものが好ましい。また粘着剤との密着性を改善するために、支持体フィルム表面にコロナ処理やプライマー処理を行ってもよい。
【0012】
本発明では、支持体フィルムの引張強度は、標線長さ100mm、幅20mmのダンベル状に打ち抜いたサンプルを用い、テンシロン引張試験機を用い、23℃で引張速度300mm/minの条件で測定した。
【0013】
本発明のスチレン系ブロックコポリマーとしては、SIS、スチレン−ブタジエン−スチレン(以下、SBSと略す)、スチレン−エチレンプロピレン−スチレン等のブロックコポリマーが挙げられる。分子量は1万〜80万であることが好ましい。1万未満では粘着剤の凝集力が低く、80万を越えると充分な接着力が得られない。またジブロック量は30〜80質量%以下であることが好ましい。30質量%未満では充分な接着力が得られず、80質量%を越えると充分な保持力が得られない。
【0014】
本発明の粘着付与樹脂としては、C5系石油樹脂、脂環族系石油樹脂、脂環族/芳香族系石油樹脂、テルペン系樹脂、ロジン系樹脂、ロジンエステル系樹脂、テルペン−フェノール樹脂、アルキルフェノール樹脂等が挙げられる。添加量は、スチレン系ブロックコポリマーに対し60〜200質量%が好ましい。60質量%未満の場合は、充分な接着力が得られず、200質量%を越える場合は、耐熱保持力が低下する。
ロジン系樹脂の場合、水酸基価の好ましい範囲は15〜100である。SISとの系においては、ロジン系樹脂の水酸基価が高いほどミクロ相分離させやすいが、100を超えると前述したSISの分解劣化が促進され、逆に15未満では架橋剤による高分子量化が不十分となり、粘着剤の粘度が上がらないため、十分な曲面接着力が得られない。
【0015】
前述のように、粘着付与樹脂の酸素吸収量は、少ないほど粘着剤の分解劣化が抑制される。酸素吸収量は0であるのが最も好ましいが、通常好ましい範囲は0.01〜1mlである。なお、粘着付与樹脂の酸素吸収量の測定は、前記文献1に記載された方法に従い、Bollandの高圧酸素吸収測定装置を用い、粘着付与樹脂10gをo−ジクロルベンゼン10mlに溶解し、70℃15分間放置したときの酸素吸収量を、酸素圧760mmHg、25℃の容積として求めた。
【0016】
本発明の架橋剤としては、公知慣用のポリイソシアネート、メラミン樹脂、尿素樹脂、エポキシ樹脂、金属キレート、金属酸化物、金属塩、金属水酸化物、酸無水物、ポリアミン等が使用できる。中でも特に、水酸基との反応性を有するイソシアネート系架橋剤を使用するのが好ましい。その添加量は、粘着剤の粘度と架橋反応後の残存水酸基量との良好なバランスを得るためには、粘着付与樹脂の水酸基に対するイソシアネート基のモル当量を0.1〜10とするのが好ましい。
【0017】
粘着剤層には、酸化防止剤、紫外線吸収剤、充填剤、顔料、増粘剤等、公知慣用の各種添加剤を、接着力を損なわない範囲で添加することができる。
【0018】
上記スチレン系ブロックコポリマー、粘着付与樹脂、架橋剤、および各種添加剤を、公知慣用の溶剤、例えばトルエン、酢酸エチル、n−ヘキサン、ヘプタン、シクロヘキサン、アセトン、メチルエチルケトン、テトラヒドロフランなどの単独、あるいは混合溶剤に溶解または分散させ、固形分濃度10〜80質量%の粘着剤組成物を調製する。
【0019】
粘着剤層は、粘着テープの塗工に一般的に使用されている方法で支持体フィルム上に形成することができる。粘着剤組成物を支持体フィルムに直接塗工し乾燥してもよいが、いったんセパレータに塗工し、乾燥後、支持体フィルムに貼り合わせるのが好ましい。
【0020】
本発明の粘着剤層の厚みは特に限定されるものではないが、一般の粘着テープと同程度の5〜400μmが好ましい。
【0021】
【実施例】
以下に、本発明の実施例と比較例を記載して、本発明をより具体的に説明する。しかし、本発明はこれに限定されるものではない。また、「部」および「%」は、特に断らない限りそれぞれ「質量部」および「質量%」を意味する。
【0022】
<粘着剤組成物>
スチレン系ブロックコポリマー、アクリル系ポリマー、表1に記載した粘着付与樹脂、酸化防止剤、および架橋剤を、表2に掲げる割合で配合し、トルエンに溶解して、固形物濃度50%の粘着剤組成物 I〜VI を調製した。
表2中、イルガノックスNC−4は酸化防止剤、バーノックスNC−40はイソシアネート系架橋剤である。
【0023】
【表1】

Figure 0004591732
【0024】
【表2】
Figure 0004591732
【0025】
<粘着テープ>
アプリケーターを用い、粘着剤組成物を、乾燥後の厚さが30μmとなるようにセパレータ上に塗布し、80℃で3分間乾燥した後、表3に記載の基材A〜Dの両面に貼り合わせ、実施例1〜6、および比較例1〜3の両面粘着テープを作製した。
【0026】
【表3】
Figure 0004591732
【0027】
<粘着テープの試験および結果の評価>
実施例1〜6、および比較例1〜3の粘着テープについて、接着力、再剥離性、および溶融リサイクル適性を、下記の方法で試験し、評価した。
【0028】
〔接着力〕
20mm幅×100mm長さの23μmのPETフィルムで片面をバッキングした粘着テープを23℃にてポリスチレン板に貼付し、2kgローラーで1往復加圧した。30分間放置後、23℃にて180°方向に300mm/minで剥離し、接着力を測定した。結果を表5に示す。
【0029】
〔再剥離性〕
23℃にて25mm幅×100mm長さの粘着フィルムをポリスチレン板およびステンレス板に貼付し、60℃90%RHで5日間の条件で放置後、135°方向に5〜10m/minの速度で引き剥がしたときのテープのチギレおよび粘着剤の糊残りを観察し、両面粘着テープのMD方向とTD方向で評価した。評価結果を表5に示す。
再剥離性の評価基準は以下の通り。
◎:糊残り、および粘着テープのチギレがなく、ポリスチレン板およびステンレス板とも再剥離可能。
○:剥離きっかけ部に一部糊残りするが、ポリスチレン板およびステンレス板とも再剥離可能。
×:ポリスチレン板あるいはステンレス板に対し、全面糊残りまたは粘着テープのチギレがあり、再剥離不可能。
【0030】
〔溶融リサイクル適性〕
HIPSt樹脂(大日本インキ化学工業製「GH−8300−1」)に、実施例1〜6、および比較例1〜3の粘着テープを5質量%の割合で混合し、再ペレット化したものを射出成型器で成型し、試験サンプルとした。「GH−8300−1」のみの成型品を標準サンプルとし、各試験サンプルの機械的特性(引張強度、引張伸び)を測定した。引張強度[MPa]、および引張伸び[伸び%]は、いずれもJIS K6871に従い、引張速度5mm/minで測定した。測定結果を表4に、評価結果を表5に示す。
溶融リサイクル適性の評価基準は以下の通り。
標準サンプルの測定値を100としたとき、標準サンプルと各試験サンプルの測定値の差(ΔV)が、
◎:両項目とも 0≦ΔV<5の場合。
△:どちらか1項目が 0≦ΔV<5、他項目が5≦ΔV<10 、または両項目とも 5≦ΔV<10の場合。
×:少なくともどちらか1項目が 10≦ΔV の場合。
【0031】
【表4】
Figure 0004591732
【0032】
【表5】
Figure 0004591732
【0033】
表5に記載した結果から明らかなように、実施例はいずれも高い接着力を示しており、かつ再剥離性、溶融リサイクル適性の両面に優れている。
【発明の効果】
本発明の粘着テープは、構成する支持体フィルムおよび粘着剤がともにPStおよび/またはABSに相溶する。被着体がPStまたはABSの樹脂成型部品である場合は、該粘着テープを貼着したまま、機械的特性を損なうことなく溶融リサイクルすることができる。被着体が上記樹脂以外の場合は、リサイクルに際して剥離する必要があるが、本発明の粘着テープに使用する支持体フィルムは、MD方向とTD方向に強い引張強度を有しており、また粘着剤は分解劣化しにくい特徴を有するので、高い接着力を持ちながら、糊残りやチギレを起こすことなく容易に剥離することができ、加熱処理あるいは溶剤処理等の、従来剥離のために必要とされた特殊な工程が不要であるという、顕著な効果を発現する。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pressure-sensitive adhesive tape for fixing a melt-recyclable resin molded part. Specifically, polystyrene (hereinafter abbreviated as PSt) and acrylonitrile-butadiene-styrene (hereinafter abbreviated as ABS) resin molded parts can be melt-recycled without removing the tape, and the adherend is resin molded other than the above. In the case of components, the present invention relates to an adhesive tape that can be peeled off from the adherend without any adhesive residue or tears without performing special peeling treatment such as heat treatment or solvent treatment. (Hereinafter, the ability to peel off without adhesive residue or scratches is called re-peeling, and the ability to re-peel is called re-peeling.)
[0002]
[Prior art]
As part of environmental measures in recent years, thermoplastic resins such as PSt, ABS, polycarbonate / acrylonitrile-butadiene-styrene (hereinafter abbreviated as PC / ABS) that can be melt-recycled have been adopted for resin molded parts such as electronic devices. Yes.
When fixing these thermoplastic resin molded parts, there are a method of using an adhesive and a welding method, but an adhesive tape is frequently used because of good workability and workability. In particular, the fixing with the double-sided adhesive tape is advantageous when the shape of the component to be fixed is complicated or when productivity in an automated line is required.
[0003]
Conventionally, when recycling resin molded parts fixed with these adhesive tapes, it was common to melt and recycle after peeling the attached adhesive tape. A time-consuming process such as softening, physically cutting, or scraping the adhesive was required. JP-A-8-209086 discloses a pressure-sensitive adhesive tape that exhibits a strong adhesive force when a resin molded part is fixed and has no adhesive residue or tear when peeled.
[0004]
On the other hand, methods for melting and recycling resin molded parts with an adhesive tape attached are disclosed in Japanese Patent Application Laid-Open Nos. 4-136082 and 7-3218. This method can be used in the case of a combination in which the adherend and the adhesive tape are compatible with each other, but is not necessarily used only in such a specific combination. In the case of a combination that is not compatible with each other, it will have to be peeled off as before, but until now, no adhesive tape that can be melt-recycled while being stuck and has removability at the same time is not known .
[0005]
Japanese Patent Application Laid-Open No. 8-34088 also discloses an electronic device component that can be melt-recycled with a sheet-like member attached, and the adherend and the sheet are used as an adhesive between the adherend and the sheet-like member. Only PMMA having compatibility with the shaped member is illustrated, and there is no description or suggestion about a specific configuration as an adhesive tape, re-peelability, or the like.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above problems, and the problem is that it can be melt-recycled while sticking to a specific resin molded part, and for other resin molded parts. It is an object of the present invention to provide a so-called re-peelable pressure-sensitive adhesive tape that exhibits a strong adhesive force for a long period of time when fixed, and has no tear or adhesive residue when peeled.
In the case of melting and recycling with an adhesive tape attached to a resin molded part, it is not sufficient that the adherend resin and the adhesive tape are merely compatible. It is also an issue to suppress the fluctuation between the mechanical characteristics of the recycled resin molded part melted and recycled and the mechanical characteristics of the genuine resin molded part as small as possible.
[0007]
[Means for Solving the Problems]
As a result of intensive studies to solve the above problems, the present inventors have completed the present invention.
That is, the pressure-sensitive adhesive tape of the present invention has compatibility with PSt and / or ABS, which is frequently used as a thermoplastic resin for resin molded parts, can be melt-recycled while being stuck to the resin molded parts, and For resin molded parts other than the thermoplastic resin, the adhesive tape has good removability. The structure is compatible with PSt, ABS, PC / ABS, and has a tensile strength of 20 N / 20 mm or more in the flow direction (hereinafter abbreviated as MD) and the width direction (hereinafter abbreviated as TD). An adhesive layer containing a styrene block copolymer and a tackifying resin is provided on at least one surface of the body film.
The adhesive tape of the present invention is compatible with adherend resins other than PSt and ABS, and the mechanical properties of the recycled resin molded product are compared with those of genuine resin molded parts. If it does not fluctuate greatly, it can be melted and recycled with it attached.
[0008]
In order to solve the above-mentioned problems, in the present invention, a styrene block copolymer having compatibility with PSt and ABS is used as the main component of the pressure-sensitive adhesive. Among these, styrene-isoprene-styrene block copolymer (hereinafter abbreviated as SIS) is preferable. In addition, as a tackifying resin to be added to the pressure-sensitive adhesive for imparting sufficient adhesive force, a known and commonly used resin can be used. Particularly, a rosin resin having a hydroxyl value of 15 or more and 100 or less is used for microphase separation. It is easy to make it preferable.
[0009]
However, it is described in the following document 1 that the rosin resin easily generates free radicals by oxygen in the air, and the free radicals decompose and degrade the adhesive.
Reference 1: Toyama et al., Japan Adhesion Association, Vol. 9, no. 3,120 (1973)
In the SIS-rosin resin system of the present invention, the present inventors also have degradation degradation due to cleavage of the double bond of the main chain of SIS, and the degradation degradation as the hydroxyl value of the rosin resin increases. I found it easy to do. When SIS degrades and degrades, the cohesive force of the pressure-sensitive adhesive decreases, resulting in a decrease in adhesive strength and a cause of adhesive residue at the time of peeling. For this reason, the crosslinking agent is preferably one that can appropriately control the amount of hydroxyl groups in the rosin resin that causes degradation. For this purpose, an isocyanate-based crosslinking agent that undergoes a crosslinking reaction with a hydroxyl group is suitable.
[0010]
In addition, the present inventors can use the amount of oxygen absorbed within a certain time under a certain condition of the resin solution described in the above-mentioned document 1 as an index of the ease of decomposition and degradation of the pressure-sensitive adhesive by the tackifier resin. I found. As a result, the oxygen absorption amount of the tackifying resin used for the pressure-sensitive adhesive of the present invention is preferably 1 ml or less.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is described in further detail below.
The support film of the present invention is compatible with PSt and / or ABS at the time of melting, and has a tensile strength of 20 N / 20 mm or more in the MD and TD directions in order not to cause tearing at the time of re-peeling. It is not particularly limited. Specific examples include a PSt film, a high impact polystyrene (hereinafter abbreviated as HIPSt) film, a biaxially stretched polystyrene (hereinafter abbreviated as OPSt) film, and an ABS film. The thickness of the film is preferably 5 to 200 μm. Moreover, in order to improve adhesiveness with an adhesive, you may perform a corona treatment and a primer process to the support body film surface.
[0012]
In the present invention, the tensile strength of the support film was measured using a sample punched into a dumbbell shape having a marked line length of 100 mm and a width of 20 mm, using a Tensilon tensile tester at 23 ° C. under a tensile speed of 300 mm / min. .
[0013]
Examples of the styrenic block copolymer of the present invention include block copolymers such as SIS, styrene-butadiene-styrene (hereinafter abbreviated as SBS), and styrene-ethylenepropylene-styrene. The molecular weight is preferably 10,000 to 800,000. If it is less than 10,000, the cohesive force of the pressure-sensitive adhesive is low, and if it exceeds 800,000, sufficient adhesive force cannot be obtained. The diblock amount is preferably 30 to 80% by mass or less. If it is less than 30% by mass, sufficient adhesion cannot be obtained, and if it exceeds 80% by mass, sufficient holding force cannot be obtained.
[0014]
Examples of the tackifying resin of the present invention include C5 petroleum resins, alicyclic petroleum resins, alicyclic / aromatic petroleum resins, terpene resins, rosin resins, rosin ester resins, terpene-phenol resins, alkylphenols. Examples thereof include resins. The addition amount is preferably 60 to 200% by mass with respect to the styrenic block copolymer. When the amount is less than 60% by mass, sufficient adhesive strength cannot be obtained, and when it exceeds 200% by mass, the heat resistant holding force decreases.
In the case of a rosin resin, the preferred range of the hydroxyl value is 15-100. In the system with SIS, the higher the hydroxyl value of the rosin resin, the easier the microphase separation occurs. However, when it exceeds 100, the above-described degradation of SIS is promoted. It becomes sufficient, and the viscosity of the pressure-sensitive adhesive does not increase, so that a sufficient curved surface adhesive force cannot be obtained.
[0015]
As described above, the smaller the oxygen absorption amount of the tackifying resin, the more the degradation and degradation of the pressure-sensitive adhesive are suppressed. The oxygen absorption amount is most preferably 0, but the usually preferable range is 0.01 to 1 ml. In addition, the oxygen absorption amount of the tackifying resin was measured according to the method described in the above-mentioned literature 1, using a high-pressure oxygen absorption measuring apparatus of Bolund, dissolving 10 g of the tackifying resin in 10 ml of o-dichlorobenzene, The amount of oxygen absorbed when left for 15 minutes was determined as an oxygen pressure of 760 mmHg and a volume of 25 ° C.
[0016]
As the crosslinking agent of the present invention, known and commonly used polyisocyanates, melamine resins, urea resins, epoxy resins, metal chelates, metal oxides, metal salts, metal hydroxides, acid anhydrides, polyamines and the like can be used. Among these, it is particularly preferable to use an isocyanate-based crosslinking agent having reactivity with a hydroxyl group. In order to obtain a good balance between the viscosity of the pressure-sensitive adhesive and the amount of residual hydroxyl group after the crosslinking reaction, it is preferable that the molar equivalent of the isocyanate group with respect to the hydroxyl group of the tackifier resin is 0.1 to 10. .
[0017]
Various known and conventional additives such as antioxidants, ultraviolet absorbers, fillers, pigments, thickeners and the like can be added to the pressure-sensitive adhesive layer as long as the adhesive strength is not impaired.
[0018]
The styrenic block copolymer, tackifying resin, cross-linking agent, and various additives may be used in a known or commonly used solvent, for example, toluene, ethyl acetate, n-hexane, heptane, cyclohexane, acetone, methyl ethyl ketone, tetrahydrofuran or the like alone or in a mixed solvent. The pressure-sensitive adhesive composition having a solid content of 10 to 80% by mass is prepared by dissolving or dispersing in the solution.
[0019]
The pressure-sensitive adhesive layer can be formed on the support film by a method generally used for coating an adhesive tape. The pressure-sensitive adhesive composition may be directly applied to the support film and dried, but it is preferable that the pressure-sensitive adhesive composition is once applied to the separator, dried and then bonded to the support film.
[0020]
The thickness of the pressure-sensitive adhesive layer of the present invention is not particularly limited, but is preferably 5 to 400 μm, which is about the same as a general pressure-sensitive adhesive tape.
[0021]
【Example】
Hereinafter, the present invention will be described more specifically by describing examples and comparative examples of the present invention. However, the present invention is not limited to this. Further, “parts” and “%” mean “parts by mass” and “mass%”, respectively, unless otherwise specified.
[0022]
<Adhesive composition>
Styrenic block copolymer, acrylic polymer, tackifying resin listed in Table 1, antioxidant, and crosslinking agent are blended in the proportions listed in Table 2, dissolved in toluene, and a solids concentration of 50%. Compositions I-VI were prepared.
In Table 2, Irganox NC-4 is an antioxidant and Vernox NC-40 is an isocyanate crosslinking agent.
[0023]
[Table 1]
Figure 0004591732
[0024]
[Table 2]
Figure 0004591732
[0025]
<Adhesive tape>
Using an applicator, the pressure-sensitive adhesive composition was applied onto the separator so that the thickness after drying was 30 μm, dried at 80 ° C. for 3 minutes, and then applied to both surfaces of the substrates A to D described in Table 3 In addition, double-sided pressure-sensitive adhesive tapes of Examples 1 to 6 and Comparative Examples 1 to 3 were produced.
[0026]
[Table 3]
Figure 0004591732
[0027]
<Test of adhesive tape and evaluation of results>
For the pressure-sensitive adhesive tapes of Examples 1 to 6 and Comparative Examples 1 to 3, adhesive strength, removability, and melt recyclability were tested and evaluated by the following methods.
[0028]
[Adhesive strength]
A pressure-sensitive adhesive tape, one side of which was backed up with a 20 mm wide × 100 mm long 23 μm PET film, was attached to a polystyrene plate at 23 ° C., and pressed once with a 2 kg roller. After standing for 30 minutes, the film was peeled off at 300 mm / min in the 180 ° direction at 23 ° C., and the adhesive strength was measured. The results are shown in Table 5.
[0029]
[Removability]
An adhesive film with a width of 25 mm × 100 mm at 23 ° C. was attached to a polystyrene plate and a stainless steel plate, left at 60 ° C. and 90% RH for 5 days, and then pulled at a speed of 5 to 10 m / min in the 135 ° direction. The tape was peeled off when peeled and the adhesive residue of the adhesive was observed, and evaluated in the MD direction and TD direction of the double-sided adhesive tape. The evaluation results are shown in Table 5.
The evaluation criteria for removability are as follows.
A: There is no adhesive residue and no adhesive tape, and it can be re-peeled from polystyrene plates and stainless steel plates.
○: Part of the adhesive remains on the peeling trigger part, but can be removed again from the polystyrene plate and the stainless steel plate.
X: The entire surface of the polystyrene plate or stainless steel plate has adhesive residue or adhesive tape that cannot be removed again.
[0030]
[Melting recycling suitability]
HIPSt resin ("GH-8300-1" manufactured by Dainippon Ink & Chemicals, Inc.) was mixed with the adhesive tapes of Examples 1 to 6 and Comparative Examples 1 to 3 at a ratio of 5% by mass and re-pelletized. Molded with an injection molding machine and used as a test sample. The molded product of only “GH-8300-1” was used as a standard sample, and the mechanical properties (tensile strength and tensile elongation) of each test sample were measured. Tensile strength [MPa] and tensile elongation [elongation%] were both measured according to JIS K6871 at a tensile speed of 5 mm / min. The measurement results are shown in Table 4, and the evaluation results are shown in Table 5.
The evaluation criteria for melt recycling suitability are as follows.
When the measured value of the standard sample is 100, the difference (ΔV) between the measured value of the standard sample and each test sample is
A: Both items are 0 ≦ ΔV <5.
Δ: Either one item is 0 ≦ ΔV <5, the other item is 5 ≦ ΔV <10, or both items are 5 ≦ ΔV <10.
×: When at least one of the items is 10 ≦ ΔV.
[0031]
[Table 4]
Figure 0004591732
[0032]
[Table 5]
Figure 0004591732
[0033]
As is clear from the results described in Table 5, all of the examples show high adhesive strength, and are excellent in both removability and melt recyclability.
【The invention's effect】
In the pressure-sensitive adhesive tape of the present invention, the constituting support film and the pressure-sensitive adhesive are both compatible with PSt and / or ABS. When the adherend is a molded resin part of PSt or ABS, it can be melt-recycled without damaging the mechanical properties while the adhesive tape is stuck. When the adherend is other than the above-mentioned resin, it is necessary to peel off when recycling. However, the support film used for the adhesive tape of the present invention has a strong tensile strength in the MD direction and the TD direction, and is also adhesive. Since the agent has the feature that it is difficult to decompose and degrade, it can be easily peeled off without causing adhesive residue or tearing while having high adhesive strength, and is required for conventional peeling such as heat treatment or solvent treatment. This produces a remarkable effect that no special process is required.

Claims (3)

ポリスチレン樹脂および/またはアクリロニトリル−ブタジエン−スチレン樹脂成型部品を被着体とし、該樹脂と相溶性を有し、該被着体に貼着したまま溶融リサイクル可能な粘着テープであって
流れ方向および幅方向にそれぞれ20N/20mm以上の引張強度を有する支持体フィルムの少なくとも片面に、スチレン系ブロックコポリマーおよび水酸基価15以上100以下のロジン系樹脂を含有する粘着剤層を有し、
前記支持体フィルムがポリスチレン、ハイインパクトポリスチレン、二軸延伸ポリスチレン又はアクリロニトリル−ブタジエン−スチレンからなるフィルムであり、
前記粘着剤層がイソシアネート系架橋剤を含有することを特徴とする粘着テープ。
A pressure-sensitive adhesive tape having a polystyrene resin and / or acrylonitrile-butadiene-styrene resin molded part as an adherend, compatible with the resin, and melt-recyclable while attached to the adherend. Flow direction and width Having a pressure-sensitive adhesive layer containing a styrene-based block copolymer and a rosin-based resin having a hydroxyl value of 15 or more and 100 or less on at least one surface of a support film having a tensile strength of 20 N / 20 mm or more in each direction;
The support film is a film made of polystyrene, high impact polystyrene, biaxially stretched polystyrene or acrylonitrile-butadiene-styrene,
The pressure-sensitive adhesive tape, wherein the pressure-sensitive adhesive layer contains an isocyanate-based crosslinking agent.
スチレン系ブロックコポリマーがスチレン−イソプレン−スチレンブロックコポリマーである請求項1に記載の粘着テープ。  The pressure-sensitive adhesive tape according to claim 1, wherein the styrenic block copolymer is a styrene-isoprene-styrene block copolymer. 粘着付与樹脂の酸素吸収量が1ml以下である請求項1又は2に記載の粘着テープ。The pressure-sensitive adhesive tape according to claim 1 or 2, wherein the oxygen-absorbing amount of the tackifying resin is 1 ml or less.
JP2000162161A 2000-05-31 2000-05-31 Recyclable adhesive tape Expired - Lifetime JP4591732B2 (en)

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JP4699031B2 (en) * 2005-01-13 2011-06-08 日東電工株式会社 Adhesive products and substrates for adhesive products
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US20130245191A1 (en) 2012-03-16 2013-09-19 Nitto Denko Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
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JPH0366765U (en) * 1989-11-02 1991-06-28
JPH07126583A (en) * 1993-10-28 1995-05-16 Nitto Denko Corp Double-coated adhesive tape
JPH0867857A (en) * 1994-08-31 1996-03-12 Kuramoto Sangyo:Kk Pressure-sensitive adhesive sheet for adherend made of abs resin

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JPH0356278U (en) * 1989-10-02 1991-05-30

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0366765U (en) * 1989-11-02 1991-06-28
JPH07126583A (en) * 1993-10-28 1995-05-16 Nitto Denko Corp Double-coated adhesive tape
JPH0867857A (en) * 1994-08-31 1996-03-12 Kuramoto Sangyo:Kk Pressure-sensitive adhesive sheet for adherend made of abs resin

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