JP2015042404A - Substrate processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing device which removes metal ions from a process liquid and achieves downsizing to thereby reduce installation space and costs.SOLUTION: A substrate processing device 1 removes metal ions from a process liquid L used for processing a substrate W. The substrate processing device 1 includes: a substrate processing mechanism 2 which supplies the process liquid L to the substrate W; a storage tank 3 which recovers the process liquid L used for processing the substrate W; process liquid regeneration units 5 which are disposed in the storage tank 3 and remove metal ions from the process liquid L used for processing the substrate W; and a liquid feeding unit 29 for feeding the process liquid L from which metal ions have been removed by the process liquid regeneration part 5 to the substrate processing mechanism 2.

Description

  Embodiments described herein relate generally to a substrate processing apparatus used for processing a liquid crystal glass substrate such as a liquid crystal display.

  For example, when manufacturing various substrates such as a liquid crystal glass substrate, a semiconductor substrate, and an electronic device, a process for processing the substrate, for example, by supplying a processing solution such as a hydrogen fluoride solution, an etching solution, or a cleaning solution to the substrate. There is a step of performing desired processing on the substrate.

  As a substrate processing apparatus for processing a surface of a substrate with a processing liquid, there is one described in Patent Document 1. The substrate processing apparatus described in Patent Document 1 includes a substrate processing mechanism, a storage tank, a first processing liquid circulation mechanism, a second processing liquid circulation mechanism, and two adsorption towers.

  The first processing liquid circulation mechanism circulates the processing liquid between the storage tank and the substrate processing mechanism, and the processing liquid used for substrate processing in the substrate processing mechanism is collected in the storage tank. The second processing liquid circulation mechanism selects the processing liquid recovered in the storage tank by switching the flow path of the pipe to one of the two adsorption towers by the pumping force of the pump. In one of the adsorption towers, the metal ions in the treatment liquid are adsorbed.

  In this manner, by alternately switching the supply of the processing liquid to the two adsorption towers, the replacement cycle of the processing liquid is lengthened to prevent the substrate processing efficiency from being lowered, and the substrate processing cost is suppressed. In the substrate manufacturing process, if metal ions adhere to the substrate, the product performance becomes a problem. To prevent contamination with metal ions, the metal ions are removed from the processing solution and then the processing solution is circulated. (For example, refer to Patent Document 1).

JP 2008-252049 A

  However, in the substrate processing apparatus as described above, the second processing liquid circulation mechanism and the two adsorption towers are installed externally to the unit composed of the substrate processing mechanism and the storage tank. An installation space for separately installing the circulation mechanism and the two adsorption towers is necessary, and an increase in the installation space of the entire substrate processing apparatus is inevitable.

  The second processing liquid circulation mechanism is provided with a switching valve mechanism and a pressure feed pump in order to supply the processing liquid used for the substrate processing to one of the two adsorption towers by switching the flow path. Since it is necessary, the structure of the substrate processing apparatus becomes complicated, and an increase in size and cost of the substrate processing apparatus cannot be avoided.

  The problem to be solved by the present invention is to provide a substrate processing apparatus that can remove metal ions from a processing solution and can reduce installation space and cost by downsizing.

  According to one aspect of the present invention, in a substrate processing apparatus for processing a substrate by supplying processing liquid from a plurality of supply nozzles, the processing liquid used for processing the substrate is collected and supplied to the nozzle. A storage tank, and a treatment liquid regeneration section that is detachably provided in the storage tank and regenerates the treatment liquid, and the treatment liquid regeneration section forms a side surface of the treatment liquid regeneration section. A plurality of partition members fixed to the partition member and the side partition member so as to be parallel to a bottom portion of the storage tank; and an end portion between the plurality of partition members; A plurality of processing liquid guide members integrally formed with the partition member, and the side partition member and the processing liquid regeneration section are installed in the storage tank, whereby a flow path is formed in the storage tank. Configured as follows.

  According to the present invention, it is possible to provide a substrate processing apparatus that can remove metal ions from a processing solution and can reduce installation space and cost by downsizing.

It is a figure which shows the whole structure of the substrate processing apparatus which concerns on this embodiment. It is a perspective view which shows the structural example of the process liquid reproduction | regeneration part of a substrate processing apparatus. It is a figure which shows the whole structure of the substrate processing apparatus of another embodiment of this invention.

  An embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a diagram showing an overall structure of a substrate processing apparatus according to the present embodiment.

  As shown in FIG. 1, the substrate processing apparatus 1 of the present embodiment is an apparatus that performs arbitrary processing on a substrate W. The substrate processing apparatus 1 is an apparatus that removes an oxide film or natural organic matter formed on a main surface S of a substrate W such as a liquid crystal glass substrate used in a liquid crystal display, using a processing liquid L. In the substrate processing apparatus 1, for example, HF (hydrogen fluoride) can be used as a processing liquid for removing an oxide film and natural organic substances formed on the main surface S of the substrate W.

  The substrate processing apparatus 1 is disposed in the substrate processing mechanism unit 2, the storage tank 3, the liquid feeding unit 29, and the storage tank 3, and removes metal ions from the processing liquid L to regenerate the processing liquid. A liquid regeneration unit 5 is provided.

  The substrate processing mechanism unit 2 shown in FIG. 1 supplies a treatment liquid L to the main surface S of the substrate W described above, and is to be removed such as an oxide film or natural organic matter formed on the main surface S of the substrate W. Object D is removed. The substrate processing mechanism section 2 includes a chamber 2A, a substrate transport section 2B, a processing liquid supply pipe 2C, and a processing liquid collection receiving section 6.

  In the closed space of the chamber 2A, the substrate transport part 2B, the processing liquid supply pipe 2C, and the upper part of the processing liquid recovery receiving part 6 are arranged. The substrate transport unit 2B includes a plurality of transport rollers 2F and a motor 2G that rotates the transport rollers 2F. The substrate W is placed on the plurality of transfer rollers 2F. Therefore, the motor 2G is driven by a command from the control unit 100 to rotate the transport roller 2F and transport the substrate W in the arrow Y direction (the direction perpendicular to the paper surface in FIG. 1) at a predetermined speed. be able to.

  The processing liquid supply pipe 2 </ b> C is disposed above the substrate W. The processing liquid supply pipe 2 </ b> C is connected to the storage tank 3 through the pipe 30 and the pump 4. The processing liquid supply pipe 2C has a plurality of supply nozzles 2H. The processing liquid L accommodated in the storage tank 3 can be supplied to the main surface S of the substrate W from the plurality of supply nozzles 2H of the processing liquid supply pipe 2C.

  As shown in FIG. 1, the processing liquid collection receiving portion 6 is located below the substrate W. The processing liquid recovery receiving unit 6 has a function of recovering the entire amount of the processing liquid L used for processing the main surface S of the substrate W and guiding it to the processing liquid regeneration unit 5 side in the storage tank 3.

  The treatment liquid collection receiving part 6 includes a treatment liquid guide part 6A inclined so as to descend in the Z1 direction, and a guide pipe part 6B for guiding the treatment liquid L collected by the treatment liquid guide part 6A into the storage tank 3. Have. The guide pipe part 6B is inserted in the storage tank 3 along the Z1 direction, and the open end part 6C of the guide pipe part 6B is positioned at an interval from the inner surface 3C of the bottom part 3B of the storage tank 3. ing.

  The storage tank 3 has a closed storage space 3F having a rectangular parallelepiped shape, for example. The storage tank 3 is disposed, for example, at a lower part or a side part of the substrate processing mechanism unit 2, and the storage tank 3 has a side wall part 3A, a bottom part 3B, and a lid part 3D. The lid 3D is placed to close the opening 3E in the upper part of the side wall 3A so that it can be opened and closed. By removing the lid 3D in the Z2 direction, for example, the accommodation space 3F is opened through the opening 3E. be able to. The open end 6C of the guide pipe 6B is inserted in the Z1 direction into the accommodation space 3F through the central hole 3G of the lid 3D. A processing liquid supply source 222 is connected to the processing liquid regeneration unit 5 in the storage tank 3 as a processing liquid supply tank, and the processing liquid can be replenished into the storage tank 3 from the processing liquid supply source 222.

  In the storage space 3 </ b> F of the storage tank 3, a plurality of treatment liquid regeneration units 5 are arranged. A treatment liquid reservoir 7 is formed between the treatment liquid regeneration unit 5 in the storage space 3 </ b> F and the side wall 3 </ b> A of the storage tank 3. In the example of FIG. 1, by removing the lid 3 </ b> D, each processing liquid regeneration unit 5 can be removed from the storage tank 3 from the storage space 3 </ b> F of the storage tank 3 through the opening 3 </ b> E.

  FIG. 2 is a perspective view showing an example of the structure of the treatment liquid regeneration unit 5.

  The structure of the treatment liquid regeneration unit 5 shown in FIG. 2 is not limited to the structure example shown in FIGS. 1 and 2, and can be arbitrarily selected. The treatment liquid regeneration unit 5 has a unit structure so that an operator can easily lift and take out the handle 8 shown in FIG. 2 from the storage tank 3 in the Z2 direction. Here, an example of the structure of the processing liquid regeneration unit 5 will be described.

  The processing liquid regeneration unit 5 is made of, for example, a metal plate, and includes a plurality of horizontal partition members 10, 11, 12, 13, 14, and 15 shown in FIGS. 1 and 2, and left and right side parts shown in FIG. Partition members 16 and 17 and treatment liquid guide members 18, 19, 20P, 21P, 22P and 23P shown in FIG. The plurality of horizontal partition members 10, 11, 12, 13, 14, and 15, the left and right side partition members 16 and 17, and the processing liquid guide members 18, 19, 20P, 21P, 22P, and 23P are metal plates. It is made by. However, in order to make the drawing easy to see, the illustration of the partition members 16 and 17 on the left and right sides is omitted in FIG. 1, and the illustration of the treatment liquid guide members 18, 19, 20P, 21P, and 22P is omitted in FIG. .

  As shown in FIGS. 1 and 2, the partition members 10, 11, 12, 13, 14, 15 are parallel to the left and right partition members 16, 17, for example, at the same interval along the X direction. It is fixed to. The partition members 10, 11, 12, 13, 14, 15 are slightly shifted in position along the X direction to secure the flow paths 10 R, 11 R, 12 R, 13 R, 14 R of the processing liquid L. Yes. As described above, the processing liquid regeneration unit 5 is formed with a plurality of flow paths 10R, 11R, 12R, 13R, and 14R through which the processing liquid L is passed so as to be stacked along the Z2 direction. Chelating agents 20 and 21 and ion exchange resins 22 and 23 as metal ion removal members for removing metal ions from the treatment liquid L are detachably attached to the plurality of flow paths 10R, 11R, 12R, 13R, and 14R, respectively. Has been placed.

  As shown in FIG. 1, a chelating agent 20 is detachably disposed in the flow path 10 </ b> R of the partition members 10 and 11. A chelating agent 21 is detachably disposed in the flow path 11R of the partition members 11 and 12. An ion exchange resin 22 is detachably disposed in the flow path 12R of the partition members 12 and 13. An ion exchange resin 23 is detachably disposed in the flow path 13R of the partition members 13 and 14.

The chelating agent 20 is positioned on the most upstream side of the flow path for flowing the processing liquid L in the processing liquid regeneration unit 5, from the upstream side to the downstream side of the flow path of the processing liquid L, that is, from the lower side to the upper side. The chelating agents 20 and 21 and the ion exchange resins 22 and 23 are positioned in this order in the Z2 direction. However, the chelating agents 20 and 21 and the ion exchange resins 22 and 23 are not arranged in the flow path 14R of the partition members 14 and 15, and the flow path 14R is merely a guide path for the processing liquid L.
These chelating agents 20 and 21 and ion exchange resins 22 and 23 are examples of metal ion removing members, and are preferably made in a block shape. Thereby, the operator easily takes out the chelating agents 20 and 21 and the ion exchange resins 22 and 23 from the plurality of flow paths 10R, 11R, 12R, and 13R of the partition members 10, 11, 12, 13, and 14 and replaces them. can do.

  Here, the chelating agents 20 and 21 are generally generic names of organic aminocarboxylates, and adsorb metal ions in the treatment liquid L, and the adsorbed metal depends on a specific solution. It has the property of being liberated. Specific examples of the chelating agents 20 and 21 include EDTA (ethylenediaminetetraacetic acid) and NTA (nitrilotriacetic acid), but are not particularly limited thereto. In the embodiment of the present invention, the chelating agents 20 and 21 can remove a specific substance from the treatment liquid L, for example, boron ions.

  In addition, the ion exchange resins 22 and 23 are, for example, spherical fine-grained organic polymer polymers, which adsorb metal ions in the treatment liquid L, and instead of the adsorbed metal ions, the ion exchange resins are used in the ion exchange resin. Ions with the same sign that existed are put out. The ion exchange resins 22 and 23 can remove metal ions from the treatment liquid L, for example, Fe ions, Al ions, Ni ions, Cu ions, and Cr ions.

  In the treatment liquid regenerating part 5, the number of partition members 10, 11, 12, 13, 14, 15 is changed, the number of chelating agents and ion exchange resins is changed, or the order of arrangement of chelating agents and ion exchange resins is changed. Can be done arbitrarily.

  As shown in FIG. 1, a treatment liquid reservoir 7 is provided in the storage tank 3 on the lateral side of the treatment liquid regeneration unit 5. As a result, the processing liquid L processed through the processing liquid regenerating unit 5 is once stored in the processing liquid reservoir 7. As already described, the treatment liquid reservoir 7 of the storage tank 3 and the treatment liquid supply pipe 2 </ b> C are connected by the pipe 30. A pump 4 is connected in the middle of the pipe 30. The pipe 30 and the pump 4 constitute a liquid supply unit 29 for returning the processing liquid L from which the metal ions have been removed by the processing liquid regenerating unit 5 to the substrate processing mechanism unit 2. That is, the pump 4 can return the processing liquid L from which the metal ions accumulated in the processing liquid reservoir 7 have been removed to the processing liquid supply pipe 2 </ b> C according to a command from the control unit 100. In this way, in the storage tank 3, the processing liquid L from which the metal ions have been removed is once stored in the processing liquid reservoir 7, so that the pump 4 is smoothly and stably moved toward the processing liquid supply pipe 2C. Can be pumped.

  In the manufacturing process of the substrate W described above, product performance becomes a problem when metal ions adhere to the substrate. Therefore, in order not to contaminate the metal ions, the metal ions are removed from the processing liquid L. The processing liquid L is circulated through the processing liquid supply pipe 2C of the substrate processing mechanism unit 2.

  Next, an operation example of the substrate processing apparatus 1 when the substrate W is processed by the substrate processing apparatus 1 having the above-described configuration will be described.

  In FIG. 1, the flow of the processing liquid L when the processing liquid L is circulated is indicated by arrows M1 to M7.

  In the substrate processing mechanism section 2, the substrate W is placed on the transport roller 2F and can be transported at a predetermined speed in the direction of arrow Y (the direction perpendicular to the plane of FIG. 1). The processing liquid L accommodated in the processing liquid supply pipe 2C is supplied to the main surface S of the substrate W from the plurality of supply nozzles 2H of the processing liquid supply pipe 2C. The removal target D of the main surface S is removed.

  When the processing liquid L removes the removal target D on the main surface S of the substrate W, the processing liquid L contains metal ions. The total amount of the processing liquid L containing the metal ions falls from the substrate W to the processing liquid guide section 6A of the processing liquid collection receiving section 6. The dropped processing liquid L is guided along the arrow M1 through the guide pipe section 6B, and is sent from the open end 6C to the processing liquid guide member 18 side as indicated by the arrow M2. Then, the processing liquid L is guided by the processing liquid guide member 18 and passes through the chelating agent 20 in the flow path 10R. The processing liquid L that has passed through the chelating agent 20 passes between the processing liquid guide member 19 and the partition member 11 so as to rise as indicated by an arrow M3, and then passes through the chelating agent 21 in the flow path 11R.

  The processing liquid L that has passed through the chelating agent 21 passes between the processing liquid guide member 20P and the partition member 12 so as to rise as indicated by an arrow M4, and passes through the ion exchange resin 22 in the flow path 12R. The processing liquid L that has passed through the ion exchange resin 22 passes between the processing liquid guide member 21P and the partition member 13 so as to rise as indicated by an arrow M5, and then passes through the ion exchange resin 23 in the flow path 13R. The processing liquid L that has passed through the ion exchange resin 23 passes between the processing liquid guide member 22P and the partition member 14 so as to rise as indicated by an arrow M6, and then passes through the flow path 14R. After the treatment, the treatment liquid L once accumulates in the treatment liquid reservoir 7 as indicated by an arrow M7.

  In this way, the processing liquid L sequentially passes through the chelating agents 20, 21 and the ion exchange resins 22, 23, whereby the metal ions in the processing liquid L are processed in the processing liquid regeneration unit 5 disposed in the storage tank 3. The chelating agents 20 and 21 and the ion exchange resins 22 and 23 can be reliably removed.

  As shown in FIG. 1, a plurality of processing liquid regeneration units 5 are arranged in advance in the storage space 3 </ b> F of the storage tank 3, so that the conventional unit is composed of the substrate processing mechanism unit 2 and the storage tank 3. Thus, there is no need to separately attach a regeneration processing apparatus for removing metal ions from the processing liquid L, and a switching valve for switching the flow path to one of the two adsorption towers that has been necessary in the past. There is no need to provide a mechanism or a pump for feeding the treatment liquid to the two adsorption towers. The processing liquid L from which the metal ions have been removed only needs to be sent to the processing liquid supply pipe 2 </ b> C using a single pump 4. For this reason, the structure of the substrate processing apparatus 1 can be simplified, and the substrate processing apparatus 1 can be reduced in size and cost.

  Metal ions are removed from the treatment liquid L stored in the treatment liquid reservoir 7, and the treatment liquid L in the reservoir 7 can be pumped into the treatment liquid supply pipe 2 </ b> C by the operation of the pump 4. As a result, the processing liquid L can be reused. In this way, by circulating the treatment liquid L, metal ions can be removed from the treatment liquid L and recirculated for reuse.

  By the way, when taking out the processing liquid reproduction | regeneration part 5 arrange | positioned in the storage tank 3 shown in FIG. 1 from the storage tank 3, an operator lifts lid part 3D from the storage tank 3, and removes it to Z2 direction. Then, the handle 8 of the treatment liquid regeneration unit 5 is grasped and lifted in the Z2 direction. Thereby, it can take out from the opening part 3E of the storage tank 3. FIG.

  The operator removes the used chelating agents 20 and 21 and the ion exchange resins 22 and 23 from the flow paths 10R, 11R, 12R and 13R, respectively, and passes the new chelating agents 20 and 21 and the ion exchange resins 22 and 23 through the flow paths. Mounted in 10R, 11R, 12R, and 13R, respectively. At this time, since the chelating agents 20 and 21 and the ion exchange resins 22 and 23 are preferably made in a block shape, the operator can easily hold the chelating agents 20 and 21 and the ion exchange resins 22 and 23. Mounted in the space formed by the members 10, 11, 12, 13, 14 or, conversely, easily removed from the space formed by the partition members 10, 11, 12, 13, 14 and replaced. Can do. Note that the chelating agent and the ion exchange resin may be exchanged in units in addition to exchange for each block. That is, the chelating agent and the ion exchange resin integrated as a unit can be exchanged for each ion exchange resin.

  Thereafter, the treatment liquid regeneration unit 5 in which the chelating agents 20 and 21 and the ion exchange resins 22 and 23 are exchanged is mounted again in the storage tank 3 through the opening 3E of the storage tank 3, and the opening 3E is opened by the lid 3D. Close it.

  Next, another embodiment of the present invention will be described. FIG. 3 is a diagram showing the overall structure of a substrate processing apparatus 1A according to another embodiment of the present invention. When the part of the substrate processing apparatus 1A shown in FIG. 3 is substantially the same as the corresponding part of the substrate processing apparatus 1 shown in FIG. In the substrate processing apparatus 1A shown in FIG. 3, the structure of the processing liquid regeneration unit 55 disposed in the storage tank 3 is the same as that of the processing liquid regeneration unit 5 disposed in the storage tank 3 of the substrate processing apparatus 1 shown in FIG. Different from structure.

  The processing liquid regenerating part 55 shown in FIG. 3 has a spiral pipe part 56, and the internal space of the pipe part 56 is a flow path through which the processing liquid L passes. The open end 6N of the guide pipe 6B is detachably connected to the start end 56A of the pipe 56. On the other hand, the terminal end portion 56B of the tube portion 56 is an open end portion with respect to the treatment liquid reservoir portion 7. In the middle of the flow path of the pipe portion 56, the chelating agents 40 and 41 and the ion exchange resins 42 and 43 are arranged in order from the start end portion 56A toward the end end portion 56B with an interval.

  In the substrate processing mechanism section 2 shown in FIG. 3, the substrate W is placed on the transporting roller 2F and can be transported at a predetermined speed in the arrow Y direction (the direction perpendicular to the paper surface of FIG. 1). The processing liquid L accommodated in the processing liquid supply pipe 2C is supplied to the main surface S of the substrate W from the plurality of supply nozzles 2H of the processing liquid supply pipe 2C. The removal target D of the main surface S is removed. The removal object D of the main surface S of the substrate W is removed, and the processing liquid L contains metal ions to be removed.

  The processing liquid L falls from the substrate W to the processing liquid guide section 6A of the processing liquid collection receiving section 6. The dropped processing liquid L is guided along the arrow M1 through the guide pipe portion 6B, enters from the open end portion 6N and the start end portion 56A of the pipe portion 56 as indicated by the arrow M12, and as indicated by arrows M13 and M14. Through the chelating agent 40. The treatment liquid L that has passed through the chelating agent 40 passes through the chelating agent 41 as indicated by arrows M15 and M16.

  The treatment liquid L that has passed through the chelating agent 41 passes through the ion exchange resin 42 as indicated by arrows M17 and M18. The treatment liquid L that has passed through the ion exchange resin 42 passes through the ion exchange resin 43 as indicated by arrows M19 and M20. The treatment liquid L that has passed through the ion exchange resin 43 passes through the pipe portion 56 as indicated by an arrow M21, and the treatment liquid L temporarily accumulates in the treatment liquid reservoir 7 as indicated by an arrow M22.

  Thereby, the metal ions in the treatment liquid L can be removed by the chelating agents 40 and 41 and the ion exchange resins 42 and 43 in the treatment liquid regeneration unit 55 disposed in the storage tank 3.

  As shown in FIG. 3, in the storage space 3 </ b> F of the storage tank 3, a plurality of processing liquid regeneration units 5 are arranged, so that the processing liquid L from the substrate processing mechanism unit 2 and the unit of the storage tank 3 There is no need to attach a regeneration processing device externally to remove metal ions, and a switching valve mechanism for switching the flow path to one of the two adsorption towers, which has been necessary in the past, or two adsorption towers There is no need to provide a pump for feeding the treatment liquid. The processing liquid L from which the metal ions have been removed only needs to be sent from the processing liquid reservoir 7 to the processing liquid supply pipe 2 </ b> C using a single pump 4. For this reason, the structure of the substrate processing apparatus can be simplified, and the size and cost of the substrate processing apparatus can be reduced.

  Thus, metal ions are removed from the processing liquid L stored in the processing liquid reservoir 7, and the processing liquid L in the reservoir 7 is moved into the processing liquid supply pipe 2 </ b> C by the operation of the pump 4. Since it can be pumped, the processing liquid L can be circulated and reused.

  By the way, when taking out the process liquid reproduction | regeneration part 55 arrange | positioned in the storage tank 3 shown in FIG. 3 from the storage tank 3, an operator lifts lid | cover part 3D from the storage tank 3, and removes it. The operator removes the connection between the open end portion 6N of the guide pipe portion 6B and the start end portion 56A of the pipe portion 56, removes the guide pipe portion 6B from the storage tank 3, holds the handle 88, and holds the treatment liquid regeneration portion 55. Is removed from the storage tank 3.

  Then, the operator attaches the new treatment liquid regeneration unit 55 to the storage tank 3 again through the opening 3E of the storage tank 3, puts the guide pipe part 6B into the storage tank 3, and opens the open end of the guide pipe part 6B. 6N may be connected to the start end portion 56A of the pipe portion 56, and the opening portion 3E may be closed by the lid portion 3D.

  As described above, when the substrate processing apparatus 1 according to the embodiment of the present invention is used to manufacture, for example, a liquid crystal substrate or a thin film transistor (TFT), the metal ions in the processing liquid L can be used without throwing away the processing liquid L. The treatment liquid L can be circulated and reused while controlling the concentration. Compared with the case where the processing liquid is disposable, the amount of the processing liquid used can be greatly reduced.

  In the substrate processing apparatus and the substrate processing method of the embodiment of the present invention, when manufacturing various substrates such as a semiconductor substrate and an electronic device in addition to the liquid crystal glass substrate, a processing solution such as an etching solution or a cleaning solution is supplied to the substrate. Thus, the present invention can be applied to a process for processing a substrate.

  A substrate processing apparatus according to an embodiment of the present invention is a substrate processing apparatus that processes a substrate with a processing liquid, a substrate processing mechanism that supplies the processing liquid to the substrate, and a storage that collects the processing liquid used for processing the substrate. A processing liquid regenerating unit disposed in the tank and the storage tank to remove metal ions from the processing liquid used for processing the substrate, and a processing liquid from which the metal ions have been removed by the processing liquid regenerating unit are sent to the substrate processing mechanism unit. A liquid feeding unit. As a result, metal ions can be removed from the processing liquid, and the processing liquid regeneration unit is disposed in the storage tank in advance, so that no space is required to separately install the processing liquid regeneration unit. Reduction and cost reduction. Moreover, by stacking the flow paths, not only space efficiency but also the length of the flow paths can be earned. This makes it possible to reliably remove metal ions and ion exchange in the treatment liquid.

  A plurality of flow paths for passing the processing liquid are stacked in the processing liquid regeneration section, and a metal ion removing member for removing metal ions from the processing liquid is arranged in each flow path. By using the metal ion removing member in the flow path, metal ions can be removed from the processing liquid in the storage tank.

  The metal ion removing member is a chelating agent and an ion exchange resin. Thereby, a metal ion can be removed from a processing liquid with a chelating agent and an ion exchange resin.

  The treatment liquid regeneration unit is detachably disposed in the storage tank from the storage tank, and the chelating agent and the ion exchange resin are in a block shape. The treatment liquid regeneration unit can be removed and replaced from inside the storage tank, and the chelating agent and ion exchange resin are in a block shape, so the operator can remove the used chelating agent and ion exchange resin from the treatment liquid regeneration unit. Can be easily exchanged for new chelating agents and ion exchange resins.

The treatment liquid is hydrogen fluoride that removes oxides or natural organic substances on the main surface of the substrate. Thereby, the hydrogen fluoride which is a process liquid can process the main surface of a board | substrate.
A substrate processing method according to an embodiment of the present invention is a substrate processing method for processing a substrate with a processing liquid, wherein the substrate processing mechanism unit supplies the processing liquid to the substrate and stores the processing liquid used for processing the substrate. The substrate processing mechanism unit collects the processing liquid recovered by the processing solution regeneration unit disposed in the storage tank, removes the metal ions from the processing solution used for processing the substrate, and removes the metal ions by the processing solution regeneration unit. Send to. As a result, the metal ions can be removed from the processing liquid, and the processing liquid regeneration unit is disposed in the storage tank, so that no space is required to separately install the processing liquid regeneration unit. Reduction and cost reduction are possible. Moreover, by stacking the flow paths, not only space efficiency but also the length of the flow paths can be earned. This makes it possible to reliably remove metal ions and ion exchange in the treatment liquid.

  As mentioned above, although embodiment of this invention was described, this embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1,1A Substrate processing apparatus 2 Substrate processing mechanism part 3 Storage tank 5 Process liquid reproduction | regeneration part 7 Reservoir storage part 10R, 11R, 12R, 13R, 14R Flow path 20, 21 Chelating agent 22, 23 Ion exchange resin 29 Liquid sending Part L Treatment liquid W Substrate

According to one aspect of the present invention, in the substrate processing apparatus for processing a substrate by supplying a processing liquid from a plurality of supply nozzles, and savings Tomeso recovering the processing solution used in the processing of the substrate, this A liquid feed section for supplying the treatment liquid collected in the storage tank to the nozzle; and a treatment liquid regeneration section that is detachably provided in the storage tank and regenerates the treatment liquid. The regeneration unit includes a side partition member forming a side surface of the treatment liquid regeneration unit, a plurality of partition members fixed to the side partition member so as to be parallel to a bottom of the storage tank, and the plurality of partition members of and a multiple of the treatment liquid guide member is provided et the on the end portion between the partition members together, before Symbol treatment solution regeneration section, the passage to the storage tank by placing the storage tank Is formed.

Claims (2)

In a substrate processing apparatus for processing a substrate by supplying a processing liquid from a plurality of supply nozzles,
A storage tank for recovering the processing liquid used for processing the substrate and supplying the nozzle to the nozzle;
A treatment liquid regeneration unit that is detachably provided in the storage tank and regenerates the treatment liquid;
The treatment liquid regeneration unit
A side partition member forming a side surface of the treatment liquid regeneration unit;
A plurality of partition members fixed so as to be parallel to the bottom of the storage tank, with respect to the side partition member,
A plurality of treatment liquid guide members provided at end portions between the plurality of partition members, and integrating the plurality of partition members;
The substrate processing apparatus configured to form a flow path in the storage tank by installing the side partition member and the processing liquid regeneration section in the storage tank. The processing liquid regeneration unit is configured to be provided in the storage tank so that a reservoir for storing the processing liquid that supplies the liquid to the flow path and the supply nozzle is formed in the storage tank. Item 2. The substrate processing apparatus according to Item 1.

Images