JP2015041697A - Solder ball printing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solder ball printing apparatus capable of performing matching between a metal mask and a surface-mounted package component efficiently and accurately in a short time and conveying the package component on which a solder ball is printed to a heating device that is used in a next step, while keeping an excellent solder ball print state without dropping the solder ball from the package component.SOLUTION: While being interlocked with an upper operation lever 21U, a top parallel plate 22T and a bottom parallel plate 22BU are relatively moved point-symmetrically with respect to a center C and parallelly proximately to or separately from a top side 23TU and a bottom side 23BU of an upper opening frame body 23U. While being interlocked with a lower operation lever 21L, a left parallel plate 22LL and a right parallel plate 22RL are relatively moved point-symmetrically with respect to the center C and parallelly proximately to or separately from a left side 23LU and a right side 23RU of the upper opening frame body 23U. The upper opening frame body 23U and a lower opening frame body 23L are formed in the same shape.

Description

  INDUSTRIAL APPLICABILITY The present invention enables a solder ball printing apparatus, particularly a matching operation between a metal mask and a surface mount type package component to be performed efficiently and accurately in a short time, and a package component on which a solder ball is printed is used in the next process. The present invention relates to a solder ball printing apparatus capable of transporting a solder ball while maintaining a good solder ball printing state without dropping the solder ball from a package component to a heating device (a printed circuit board rework device or a repair device).

In recent years, IC chip components are mounted on the surface of a rectangular printed circuit board (package surface), and the mounted IC chip components are covered with a flat and wide rectangular resin molded product, and the back surface of the printed circuit board (the back surface of the package). ), Package-type mounting components in which lead terminals are arranged are widely used. Package-type mounting components include lead insertion type packages (types in which lead terminals are inserted into through-holes on a printed circuit board and solder mounting) and surface mount type packages (surface mounting directly on the surface of the printed circuit board). Type). As one of the surface mount packages, there is a surface mount package called “BGA” (Ball Grid Array) in which lead terminals are composed of lattice-shaped solder balls having a constant pitch. BGA can arrange lead terminals with high density and is widely used in various printed wiring boards.
2. Description of the Related Art A solder printing apparatus that prints (solders) solder balls on a back terminal of a BGA type surface mount package (hereinafter referred to as “BGA package”) is known (for example, see Patent Document 1).
According to the solder printing apparatus, in order to print solder balls on the back terminal (indicated as land (51) in Patent Document 1) of the BGA package (indicated as mounting component (12) in Patent Document 1), first, An alignment operation (matching operation) between the land (51) of the mounting component (12) and the opening (14) of the mask screen (11) must be performed. Since the mask screen (11) is configured to be positioned by the positioning pins (24), the matching operation is performed on the land (51) of the mounting component (12) with respect to the opening (14) of the mask screen (11). ) To match. More specifically, the operator visually measures the positional deviation (X direction deviation, Y direction deviation, and Z axis phase deviation (θ direction deviation)) in each direction of the mounted component (12). Then, the position adjustment mechanism (micrometer, etc.) in each direction is operated until all the positional deviations in each direction disappear, and the land (51) of the mounting component (12) and the opening (14) of the mask screen (11) coincide. It is necessary to adjust the position.
After completing the matching operation between the land (51) of the mounting component (12) and the opening (14) of the mask screen (11), the mask screen (11) is fixed by the suction device (72), and the mask screen ( 11) Apply cream solder (52) with a spatula (41) and print the cream solder (52) on the lands (51). Thereafter, the mask screen (11) is replaced with a mask screen (55) having a larger hole diameter, the solder balls (53) are packed in the openings of the mask screen (55), and the land (51) coated with the cream solder (52) is applied. A solder ball (53) is printed.

Japanese Patent No. 3039543

As described above, the matching operation of the mounting component (12) and the mask screen (11) is performed by matching the land (51) of the mounting component (12) with the opening (14) of the mask screen (11). However, the number of lands (51) of the mounting component (12) is generally innumerable, and there are positional deviation in the X direction, positional deviation in the Y direction, and positional deviation in the θ direction as parameters for position adjustment. In addition, since each positional deviation depends on each other, even if the positional deviation in one direction is corrected, if the positional deviation in the other direction is corrected, there is a possibility that the previously corrected positional deviation will occur again. is there.
As described above, in the solder printing apparatus of Patent Document 1, the matching work between the mounting component (12) and the mask screen (11) has a problem that a considerable work time and work effort are required.
Moreover, in the mounting component (12) in a state where the solder ball (53) is printed, the solder ball (53) is in an unstable state temporarily fixed by the cream solder (52). Therefore, there is a problem that the solder ball (53) falls off from the mounted component (12) when transported to a heating device (print board rework device or repair device) used in the next process.
Therefore, the present invention has been made in view of the above-described problems of the prior art, and can perform a matching operation between a metal mask and a surface-mount type package component efficiently and accurately in a short time, and can print a solder ball. Solder that can transport the packaged part to the heating device (printing board rework device or repair device) used in the next process while keeping the solder ball in a good printed state without dropping the solder ball from the packaged component An object is to provide a ball printing apparatus.

Among the present inventions for solving the above technical problems, the means of the invention according to claim 1 includes a metal mask assembly having a hole pattern that matches a land pattern of a surface-mounted component, and an X-direction position of the surface-mounted component. , A position adjustment mechanism that adjusts the Y-direction position and the Z-direction position and the rotational position around the Z-axis, and a suction mechanism that fixes the surface-mounted component to the component stage, and a diagonal line of the mounting base provided on the upper surface A solder ball printing device comprising a device body having a reference pin for positioning the metal mask assembly thereon,
It consists of a rectangular frame-shaped upper and lower opening frame that has a reference hole that is diagonal and centrosymmetric and concentric with the reference pin, and that has an opening at the center. The opening is on the top or bottom of the opening frame. A pair of parallel upper and lower parallel plates and a pair of left and right parallel plates parallel to the left or right side of the opening frame are provided symmetrically about the center point, respectively, and the upper and lower parallel plates or the left and right parallel plates are provided. A component positioning mechanism for positioning the surface-mounted component so as to be concentric / in-phase with the upper / lower opening frame by operating an upper / lower operation lever linked to a plate is provided.

In the above-described configuration, the surface mount component is positioned concentrically and in phase with the upper and lower opening frame by the component positioning mechanism, while the upper and lower opening frames are the reference pins of the apparatus main body. Will be positioned. Eventually, the surface-mounted component is positioned by the reference pin of the apparatus main body. On the other hand, since the metal mask assembly is also positioned by the reference pins of the apparatus main body, if the positioning conditions for the reference pins of the surface mount component and the positioning conditions for the reference pins of the metal mask assembly are the same, the component positioning mechanism The solder application position of the surface-mounted component positioned by the above and the hole pattern of the metal mask assembly are preferably matched.
In other words, after positioning the surface mount component by the component positioning mechanism, the operator fixes the position by the suction mechanism unit, removes the component positioning mechanism from the apparatus main body, and passes the metal mask assembly through the reference pin instead. Thus, the matching operation between the surface mount component and the metal mask assembly is completed.
As described above, in the solder ball printing apparatus of the present invention, the matching operation between the surface mount component and the metal mask assembly is substantially performed by operating the operation lever of the component positioning mechanism and the component positioning mechanism of the apparatus main body. Therefore, it is possible to complete the matching operation between the surface mount component and the metal mask assembly, which conventionally required a lot of time, in a short time.

  According to a second aspect of the present invention, the upper and right parallel plates are orthogonal plates of a T-shaped slider, the lower and left parallel plates are orthogonal plates of an L-shaped slider, and the upper and lower operation levers are fulcrums. And linking to the T-shaped slider and the L-shaped slider through first and second elongated holes provided at equal intervals from each other.

  In the above configuration according to claim 2, when the upper operation lever is actuated, the upper parallel plate and the lower parallel plate move in parallel with each other and with the same movement amount, and finally join on the bisector of the left side or the right side. To do. On the other hand, when the lower operation lever is operated, the left parallel plate and the right parallel plate move in parallel with each other and with the same amount of movement, and finally join on the bisector of the upper side or the bottom side. Now, when a surface mount component is inserted into the opening surrounded by the upper and lower parallel plates and the left and right parallel plates, the upper and lower parallel plates and the right parallel plate and the left parallel plate are operated when the upper and lower operation levers are activated. The plate causes the surface-mounted component to be placed in a state parallel to each parallel plate toward the center point (the center of the upper and lower opening frame bodies) where each bisector intersects. Since the opening frame and the device main body are concentric / in-phase, and the metal mask and device main body are also concentric / in-phase, when the upper control lever and lower operation lever are operated, the surface mount component is substantially against the metal mask. Since they are placed in a concentric / in-phase state, the solder application position (land pattern) of the surface mount component and the hole pattern of the mask match (match).

  According to a third aspect of the present invention, guide rails are attached to the T-shaped slider and the L-shaped slider in parallel to each other, and the guide rail is embedded in the upper opening frame or the lower opening frame. It slides along.

  In the above-described configuration, the guide rail and the guide groove allow the upper parallel plate and the lower parallel plate, and the left parallel plate and the right parallel plate to be moved toward or away from each other in parallel with the same movement amount. .

  According to a fourth aspect of the present invention, there is provided a component transfer mechanism for holding the position / posture by sandwiching the surface-mounted component on which the solder ball is printed while being fitted to the reference pin of the apparatus main body from both sides by a grip portion. It is in having.

  According to a fourth aspect of the present invention, the component transfer mechanism is configured to be able to grip the surface-mounted component from both sides in a state of being attached to the apparatus main body. For this reason, it is not necessary to move the surface mount component on which the solder balls are printed, and as a result, it is difficult for the surface mount component to be subjected to excessive vibration or vibration caused by the movement. Therefore, it is possible to carry while maintaining a solder ball printing state.

  According to a fifth aspect of the present invention, the component transfer mechanism can attach a multi-hole metal mesh heating stage plate to the lower surface.

  In the above-described configuration, it is not necessary to replace the surface-mounted component on which the solder balls are printed with another jig. That is, the surface-mounted component on which the solder ball is printed is heated while maintaining a good solder ball printing state without being exposed to human hands.

According to the solder ball printing apparatus of the present invention, it is possible to position the surface mount component by the same positioning reference as that of the metal mask assembly by the component positioning mechanism having the above characteristics, and as a result, conventionally, it takes time. The matching work between the metal mask and the mounted parts can be done efficiently and accurately in a short time, and the solder ball printing work for the solder application position of the mounted parts can be done efficiently and in a short time. Become.
Further, the solder ball printing apparatus of the present invention is a heating device (printing device) used in the next process without causing the solder ball temporarily fixed to the surface mounted component to fall off from the surface mounted component by the component transfer mechanism having the above characteristics. To the substrate rework device or repair device) while maintaining a good solder ball printing state.
Furthermore, by combining the above-described component transfer mechanism with the heating stage plate having the above-described features having a multi-hole metal mesh on the bottom surface, it is possible to heat the mounting state on which the solder balls are printed without taking it out. It becomes like this.

It is explanatory drawing (front view) which shows the reball unit which is an example of the solder ball printer of this invention. It is explanatory drawing (top view) which shows the reball unit which is an example of the solder ball printer of this invention. It is explanatory drawing (top view) which shows the apparatus main body which concerns on this invention. It is explanatory drawing (front view) which shows the apparatus main body which concerns on this invention. It is explanatory drawing (rear view) which shows the apparatus main body which concerns on this invention. It is explanatory drawing which shows the component positioning mechanism which concerns on this invention. It is explanatory drawing which shows the upper component positioning mechanism which concerns on this invention. It is explanatory drawing which shows the lower component positioning mechanism which concerns on this invention. It is explanatory drawing which shows the metal mask assembly which concerns on this invention. It is explanatory drawing which shows the phase with respect to the center of a mounting component and a metal mask assembly. It is explanatory drawing which shows the components transfer mechanism which concerns on this invention. It is explanatory drawing which shows the holding | grip mechanism of the components transfer mechanism which concerns on this invention. It is explanatory drawing which shows the heating stage plate which concerns on this invention. It is explanatory drawing which shows the combination of a component transfer mechanism and a heating stage plate.

  Hereinafter, the present invention will be described in more detail with reference to embodiments shown in the drawings.

FIG. 1-2 is an explanatory view showing a reball unit 100 which is an example of the solder ball printing apparatus of the present invention. 1 is a front view, and FIG. 2 is a top view. 1 also shows a metal mask assembly 30 for convenience of explanation.
The reball unit 100 prints (solders) solder balls on grid-like lead terminals (electrode pad portion, land, or solder application position) of a surface-mount package component (hereinafter simply referred to as “mount component”). Although the details will be described later, the mounting component is determined in advance so that the operator can easily perform the positioning operation (matching operation) of the lead terminal of the mounting component with respect to the hole position of the metal mask. A component positioning mechanism 20 is provided for positioning at the reference position. The “predetermined reference position” referred to here is a virtual quadrangle (square in this embodiment) having two reference pins 14a (FIG. 2) provided on the upper surface of the apparatus body 10 as diagonal vertices. On the other hand, it is a position that is concentric and in phase. Note that the center is the same state as the concentric core, and the same phase is in a state of being similar to each other (there is a relationship in which either one is overlapped by enlarging or reducing in the X direction or / and the Y direction with respect to the center). is there. Therefore, when the worker places the mounted component in the opening of the component positioning mechanism 20 (FIG. 2) and operates the upper / lower operation levers 21U and 21L, the mounted component is in a concentric / in-phase state with respect to the virtual square. Will be placed. On the other hand, the metal mask assembly is also positioned in advance so as to be concentric and in phase with respect to the virtual square formed by the reference pin 14a. Therefore, the lead terminals of the mounted components positioned by the component positioning mechanism 20 are preferably matched with the hole positions of the metal mask assembly. Hereinafter, each configuration will be further described.

  In addition to the component positioning mechanism 20 (FIGS. 6-8), the configuration of the reball unit 100 adjusts the XYZ position or the rotation angle θ of the mounted component as necessary and sucks and fixes the positioned mounted component. Furthermore, the apparatus main body 10 (FIG. 3-5) which collects an excess solder ball, and the metal mask in which the hole pattern matched (matched) with the lattice-like terminal group of the mounted component positioned at the reference position is formed. A component transfer mechanism 40 (FIG. 9) and a component transfer mechanism 40 that conveys the solder ball without dropping it to a heating device (printing board rework device or repair device) for the printed mounting component on which the solder ball is printed. 11 to 14).

  In addition, the component positioning mechanism 20 and the metal mask assembly 30 are not used at the same time, and the operator first positions the mounted component using the component positioning mechanism 20 and then moves the component positioning mechanism 20 to the metal mask. It replaces with the assembly 30, and a flux and a solder ball are printed on the solder application position of a mounting component using the metal mask assembly 30.

3-5 is explanatory drawing which shows the apparatus main body 10 which concerns on this invention. 3 is a top view, FIG. 4 is a front view, and FIG. 5 is a rear view.
As shown in FIG. 3, the apparatus main body 10 has an upper plate 11, side plates 12, 12 and a bottom plate 13 in the structure, and includes a position adjusting mechanism portion for the mounted component and a suction mechanism portion for the mounted component or solder ball. Yes. As shown in FIG. 4, the configuration of the position adjustment mechanism unit includes a mounting base 14 having a central portion that is opened and penetrated into a quadrangle (a square in the present embodiment), a component stage 15 on which a mounting component is placed and fixed, A rotary moving stage 16 that rotates the component stage 15 around the Z-axis direction, a Z-axis moving stage 17 that displaces the component stage 15 in the Z-axis direction (height direction), and the component stage 15 in the X-axis direction (front-rear direction). And an X-axis moving stage 18 that displaces the component stage 15 in the Y-axis direction (left-right direction), and a stage mounting base 21 on which the stages are stacked. . Since the mounted component is positioned concentrically and in phase with the reference pin 14a by the component positioning mechanism 20, only the Z-axis moving stage 17 is actually used in the moving stage.

  Further, as shown in FIG. 5, the structure of the suction mechanism section includes a regulator 22 for reducing the pressure of the compressed air source located upstream to a predetermined pressure, a solder ball collection bottle 23 for storing the collected solder balls, The component suction switch 24 for turning on / off the suction to the mounted component, the ball suction switch 25 for turning on / off the suction to the solder ball, the primary air line 26 through which high-pressure air from the compressed air source flows, and the flow velocity The secondary air line 27 communicates with the component adsorption switch, the primary suction line 29 that becomes negative pressure by the secondary air line 27 with a high flow velocity, and the downstream of the primary suction line 29 and branches. A secondary suction line 31 communicating with the component stage 15, a tertiary suction line 32 branched and communicating with the ball suction switch 25, and a solder ball Quartic suction line 33 communicating with the bottle 23, and is configured by including the fifth-order suction line 34 for sucking the excess solder balls from the metal mask assembly 30.

  The principle of adsorption / suction utilizes a so-called Venturi effect when an air flow having a high flow velocity flowing through the secondary air line 27 flows out to the outside. The operation of the suction mechanism will be briefly described. When the component suction switch 24 is turned on, an air flow having a high flow velocity flows through the secondary air line 27 downstream of the regulator 22. As a result, the vicinity of the secondary air line 27 of the primary suction line 29 intersecting (orthogonal) with the secondary air line 27 becomes negative pressure. Be sucked. As a result, the secondary suction line 31 communicating with the primary suction line 29, and thus the component stage 15, is also sucked by the air flow of the secondary air line 27. On the other hand, when the ball suction switch 25 is turned on, the tertiary suction line 32 and the fourth suction line 33 communicate with each other, and the fourth suction line 33 and the fifth suction line 34 are also sucked. The operator points the fifth suction line 34 toward the metal mask assembly 30 and sucks excess solder balls on the metal mask assembly 30. The sucked solder balls are collected into the solder ball collection bottle 23 through the fifth suction line 34.

FIG. 6 is an explanatory view showing a component positioning mechanism 20 according to the present invention. 6A is a top view and FIG. 6B is a side view.
The component positioning mechanism 20 includes an upper component positioning mechanism 20U and a lower component positioning mechanism 20L. When the operator operates the upper operation lever 21U, the upper parallel plate 22TU and the lower parallel plate 22BU move in parallel to the upper side 23TU and the bottom side 23BU of the upper opening frame 23U and move relative to each other by the same distance. Operates to be close or remote. Similarly, by operating the lower operation lever 21L, the left parallel plate 22LL and the right parallel plate 22RL move relative to each other in parallel and at the same distance from the left side 23LU and the right side 23RU of the upper opening frame 23U, respectively. Operates to be close or remote. As a result, the opening (hatched portion) surrounded by the parallel plates has a concentric / in-phase relationship with the upper opening frame body 23U. Further, the upper opening frame body 23U and the lower opening frame body 23L have the same shape.
Accordingly, the mounting component placed in the opening is positioned concentrically and in phase with respect to the upper opening frame 23U (lower opening frame 23L). Hereinafter, the component positioning mechanism 20 will be described in more detail.

FIG. 7 is an explanatory view showing an upper part positioning mechanism 20U according to the present invention. 7A is a rear view of the upper part positioning mechanism 20U in FIG. 6, and FIG. 7B is a cross-sectional view taken along line AA in FIG. 7A.
The upper component positioning mechanism 20U positions the mounted component parallel to the upper side 23TU and the bottom side 23BU of the upper opening frame 23U and on the vertical bisector of the left side 23LU (right side 23RU).
Therefore, the T-shaped slider 22TSU is arranged so that its upper parallel plate 22TU is parallel to the upper side 23TU, while the L-shaped slider 22LSU is arranged so that its lower parallel plate 22BU is parallel to the bottom 23BU. It is installed. Further, the upper parallel plate 22TU and the lower parallel plate 22BU are arranged so that the distances from the center C to the upper parallel plate 22TU and the lower parallel plate 22BU are equal.

  Furthermore, the fulcrum 21aU of the operation lever 21U is, for example, the upper side 23TU (so that the upper parallel plate 22TU and the lower parallel plate 22BU move with respect to the upper side 23TU and the bottom side 23BU, respectively, by the same amount of operation of the operation lever 21U. The first long hole 21bU and the second long hole 21cU are respectively disposed at positions equidistant from the fulcrum 21aU.

  Further, as shown in FIG. 7B, the upper parallel plate 22TU and the lower parallel plate 22BU are stably moved in parallel to the upper side 23TU and the bottom side 23BU, respectively. A guide rail 25U is attached to the parallel plate 22BU, and a guide groove 26U that engages with the guide rail 25U is embedded in the upper opening frame 23U.

  Further, on the diagonal lines of the upper left corner and the lower right corner of the upper opening frame 23U so that the positioning of the metal mask assembly 30 to be described later with respect to the mounting component and the positioning of the component positioning mechanism 20 with respect to the mounting component are the same condition (same reference). Are provided with upper reference holes 24U and 24U, respectively. That is, the upper reference holes 24U and 24U are provided so that a virtual square having the upper reference holes 24U and 24U at the vertices of the diagonal lines is concentric and in phase with the upper opening frame 23U.

  Further, when the height of the mounted component is low, the upper parallel plate 22TU and the lower parallel plate 22BU may not hit the mounted component, and the positioning function of the upper component positioning mechanism 20U may not be exhibited. In order to prevent such a situation, when the upper component positioning mechanism 20U positions the mounted component, the upper parallel plate 22TU and the lower parallel plate 22BU have the upper A T plate 27T and a lower T plate 27B are provided.

  A lower part positioning mechanism 20L and an upper part positioning mechanism 20U, which will be described later as a pair, are tightly fixed by the stud bolt 28U in the state of the same positioning reference (concentric / in-phase).

FIG. 8 is an explanatory view showing a lower part positioning mechanism 20L according to the present invention. 8A is a top view of the lower part positioning mechanism 20L in FIG. 6, and FIG. 8B is a bottom view of FIG. 8A.
The lower component positioning mechanism 20L positions the mounted component parallel to the left side 23LL and the right side 23RL of the lower opening frame 23L and on the vertical bisector of the upper side 23TL (bottom side 23BL).

  The mechanism for moving the left parallel plate 22LL and the right parallel plate 22RL relative to the left side 23LL and the right side 23RL in parallel and at the same distance is the same as the upper part positioning mechanism 20U.

  Similarly to the upper component positioning mechanism 20U, the left parallel plate 22LL and the right parallel plate 22RL are provided with a left L plate 27LL and a right L plate 27RL, respectively, in order to stably position the mounted component.

  In addition, lower reference holes 24L and 24L are provided in diagonal lines at the lower right corner and the upper right corner of the lower opening frame 23L, respectively. That is, the lower reference holes 24L and 24L are provided so that a virtual square having the lower reference holes 24L and 24L at the vertices of the diagonal lines is concentric and in phase with the lower opening frame 23L.

FIG. 9 is an explanatory view showing a metal mask assembly 30 according to the present invention. 9A is a top view, and FIG. 9B is a bottom view of FIG. 9A.
The metal mask assembly 30 includes a metal mask 31M provided with a hole pattern 32M that matches (matches) a grid-shaped solder application position of a mounted component, an opening frame 33M to which the metal mask 31M is attached, and a metal mask 31M. The mask holding plate 34M and the fastener 35M are fixed to the opening frame 33M.

  For example, the hole pattern 32M is centered so that the center of the mounting component and the center C of the opening frame 33M are aligned, and then each side of the mounting component is parallel to the upper side 33TM and the bottom side 33BM, or the left side 33LM and the right side 33RM. This corresponds to the grid-like solder application position of the mounted component in a state set to be in phase. As shown in FIG. 10B, the “in-phase (same phase)” here refers to the reference axis of the mounting component and the reference of the opening frame 33M when the mounting component and the opening frame 33M are concentric. A state in which the axes coincide with each other.

Accordingly, when the two reference holes 36M and 36M are provided point-symmetrically on the diagonal line of the opening frame 33M with respect to the center C, the virtual square having the reference holes 36M and 36M at the vertices of the diagonal line is the opening frame body. 33 is concentric and in phase.
Therefore, when the relative positional relationship between the reference hole 36M of the opening frame 33M and the upper reference hole 24U and the lower reference hole 24L of the component positioning mechanism 20 is equal (in the case of concentricity), the hole pattern 32M of the metal mask 31M, The solder application positions of the mounted components positioned by the component positioning mechanism 20 coincide (match).

FIG. 11 is an explanatory view showing a component transfer mechanism 40 according to the present invention. FIG. 11A is a top view, and FIG. 11B is a bottom view of FIG.
This component transfer mechanism 40 is a mechanism for stably transporting a mounted component coated with solder balls to a rework device. Therefore, the first holding part 41 and the second holding part 42 that sandwich and hold the mounted component from both sides, the slide lever 43 for driving them, and the upper holding frame 44 and the lower holding frame 45 for holding them. And a through hole 46 for fitting into the reference pin 14a (FIG. 3) of the apparatus main body 10.

  When the operator slides the slide lever 43 forward, the first gripping portion 41 and the second gripping portion 42 move to approach each other and grip the mounted component. On the other hand, when the operator slides the slide lever 43 backward, the first gripping portion 41 and the second gripping portion 42 move away from each other to release the mounted components. In addition, the slide lever 43 is provided on the upper surface and the lower surface, and the slide lever 43 on the upper surface and the slide lever 43 on the lower surface are screw-coupled, so by tightening the screws, the first grip portion 41 and the second grip portion 42 are It will be fixed stably.

FIG. 12 is an explanatory view showing a drive unit of the component transfer mechanism 40, in which the upper holding frame 44 is removed from the component transfer mechanism 40 of FIG.
A first rack gear portion 47 to which the slide lever 43 and the first gripping portion 41 are connected and a second rack gear portion 48 to which the second gripping portion is connected are provided in parallel while being engaged with the connecting gear portion 49. Therefore, when the slide lever 43 is moved forward, the connecting gear portion 49 rotates as shown in the figure, and the second rack gear portion 48 is moved rearward. As a result, the first grip portion 41 and the second grip portion 42 move so as to be close to each other.

  The component transfer mechanism 40 can be used alone. However, considering that the next step is a heating step for the mounted component on which the solder balls are printed, the heating stage plate 50 shown in FIG. The attachment to the lower part of the component transfer mechanism 40 is more preferable from the viewpoint of maintaining a good solder ball printing state. Hereinafter, the heating stage plate 50 will be described.

FIG. 13 is an explanatory view showing a heating stage plate 50 according to the present invention. FIG. 11A is a top view, and FIG. 11B is a bottom view of FIG.
The heating stage plate 50 is a mechanism for holding the mounted component on which the solder balls are printed in the heating process. Therefore, it is normally attached to the lower part of the component transfer mechanism, and when the worker transports the mounted component to the heating device (printing board rework device or repair device), it is separated from the component transfer mechanism 40 and used alone. The The structure includes a multi-hole metal mesh 51, an opening frame 52 to which the metal mesh 51 is attached, a mesh holding plate 53 for holding the metal mesh 51, a fastener 54 for fixing the mesh holding plate 53, and a component transfer mechanism. 40 and a pin 55 to be fitted.

  That is, when the worker transports the mounted component to the heating device (printed circuit board rework device or repair device), the slide lever 43 of the component transfer mechanism 40 is loosened, and mounting is performed by the first grip portion 41 and the second grip portion 42. The gripping of the component is released, the component transfer mechanism 40 is removed from the heating stage plate 50, and heating can be performed as it is without removing the mounted component on which the solder balls are printed. The heating method is performed, for example, by irradiating infrared rays from above and below. The multi-holes in the metal mesh 51 make it possible to efficiently and uniformly apply radiant heat (radiant heat) to the mounting component from below, and in combination with heat radiation from above, solder balls are placed on the mounting component. It becomes possible to solder in a good bonding state.

As described above, according to the reball unit 100 of the present invention, the component positioning mechanism 20 can position the mounted component based on the same positioning reference as that of the metal mask assembly 30. As a result, conventionally, it takes time. The matching work between the metal mask and the mounted component can be performed efficiently and accurately in a short time, and the solder ball printing operation for the solder application position of the mounted component can be efficiently completed in a short time. It becomes like this.
In addition, the reball unit 100 of the present invention is a heating device (print board rework device) used in the next step without causing the component transfer mechanism 40 to drop the solder ball temporarily fixed to the mounting component from the mounting component. Or a repair device) can be carried while maintaining a good solder ball printing state.
Further, by combining the component transfer mechanism 40 with the heating stage plate 50 having the multi-hole metal mesh 51 on the bottom surface, it is possible to heat the mounting state on which the solder balls are printed without taking out the mounting component. become able to do.

  The reball unit of the present invention is suitably applied to a solder ball printing operation in which solder balls are soldered to lead terminals of a surface mount package component.

DESCRIPTION OF SYMBOLS 10 Main body 11 Upper plate 12 Side plate 13 Bottom plate 14 Mounting base 14a Reference pin 15 Component stage 16 Rotation moving stage 17 Z-axis moving stage 18 X-axis moving stage 19 Y-axis moving stage 21 Stage mounting base 22 Regulator 23 Solder ball recovery bottle 24 Component suction switch 25 Ball suction switch 26 Primary air line 27 Secondary air line 29 Primary suction line 30 Metal mask assembly 31 Secondary suction line 32 Tertiary suction line 33 Fourth suction line 34 Fifth suction line 20 Component positioning mechanism 20U Upper part positioning mechanism 21U Upper operation lever 22TSU T type slider 22LSU L type slider 23TU Upper side 23BU Bottom side 23LU Left side 23RU Right side 24U Upper reference hole 25U Guide rail 26U Guide groove 27T Upper T plate 27B Lower T plate 28U Stud Bolt 20L Lower part positioning mechanism 21L Lower operation lever 22TSL T slider 22LSL L slider 23TL Upper side 23BL Bottom side 23LL Left side 23RL Right side 24L Lower reference hole 25L Guide rail 26L Guide groove 27LL Left L plate 27RL Right L plate 28L Through hole 30 Metal mask Assembly 31M Metal mask 32M Hole pattern 33M Opening frame 33TM Upper side 33BM Bottom side 33LM Left side 33RM Right side 34M Mask holding plate 35M Fastener 36M Reference hole 40 Parts transfer mechanism 41 Slide lever 42 First gripping part 43 Second gripping part 44 Upper holding frame 45 Lower holding frame 50 Heating stage plate 51 Metal mesh 100 Reball unit

Claims (5)

A metal mask assembly (30) having a hole pattern (32M) matching the land pattern of the surface mount component, and adjusting the X direction position, the Y direction position, the Z direction position, and the rotation position about the Z axis of the surface mount component. The metal mask assembly (30) is positioned on a diagonal line of a mounting base (14) provided on the upper surface, comprising a position adjusting mechanism and a suction mechanism for fixing the surface-mounted component to the component stage (15). A solder ball printing device comprising a device body (10) having a reference pin (14a),
It consists of upper and lower opening frame bodies (23U, 23L) having a rectangular frame shape having reference holes (24U, 24L) concentric with the reference pins (14a) in a diagonal line and symmetrical with the center point and having an opening at the center. The opening has a pair of upper and lower parallel plates (22TU, 22BU) parallel to the upper side (23TU, 23TL) or the bottom side (23BU, 23BL) of the opening frame, and the left side (23LU, 23LL) of the opening frame. )) Or a pair of left and right parallel plates (22LL, 22RL) parallel to the right side (23RU, 23RL) are provided symmetrically about the center point, and are linked to the upper / lower parallel plates or the left / right parallel plates. A component positioning mechanism (20) for positioning the surface-mounted component so as to be concentric / in-phase with the upper / lower opening frame by operating the lower operation lever (21U, 21L). Solder ball printing apparatus according to claim the door.   The upper and right parallel plates (22TU, 22RL) are orthogonal plates of T-shaped sliders (22TSU, 22TSL), and the lower and left parallel plates (22BU, 22LL) are orthogonal plates of L-shaped sliders (22LSU, 22LSL). The upper and lower operation levers (21U, 21L) are formed in the T shape by first elongated holes (21bU, 21bL) and second elongated holes (21cU, 21cL) provided at equal intervals from the fulcrum (21aU, 21aL). The solder ball printing device according to claim 1, wherein the solder ball printing device is linked to a slider (22TSU, 22TSL) and the L-shaped slider (22LSU, 22LSL).   Guide rails (25U, 25L) are attached in parallel to the T-shaped sliders (22TSU, 22TSL) and the L-shaped sliders (22LSU, 22LSL), and the guide rails (25U, 25L) are connected to the upper opening frame ( The solder ball printing device according to claim 2, wherein the solder ball printing device slides along guide grooves (26U, 26L) embedded in the lower opening frame (23L).   Component transfer for holding the position / posture by sandwiching the surface-mounted component on which the solder ball is printed while being fitted to the reference pin (14a) of the apparatus body (10) from both sides by the gripping portions (41, 42) The solder ball printing device according to claim 1, further comprising a mechanism (40).   The solder ball printing apparatus according to claim 4, wherein the component transfer mechanism (40) is capable of attaching a heating stage plate (50) having a multi-hole metal mesh (51) to a lower surface.

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