JP2015038477A5 - - Google Patents

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Publication number
JP2015038477A5
JP2015038477A5 JP2014163258A JP2014163258A JP2015038477A5 JP 2015038477 A5 JP2015038477 A5 JP 2015038477A5 JP 2014163258 A JP2014163258 A JP 2014163258A JP 2014163258 A JP2014163258 A JP 2014163258A JP 2015038477 A5 JP2015038477 A5 JP 2015038477A5
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JP
Japan
Prior art keywords
sample
probe
bond
holder
attaching
Prior art date
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Application number
JP2014163258A
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English (en)
Japanese (ja)
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JP6453580B2 (ja
JP2015038477A (ja
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Publication of JP2015038477A publication Critical patent/JP2015038477A/ja
Publication of JP2015038477A5 publication Critical patent/JP2015038477A5/ja
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Publication of JP6453580B2 publication Critical patent/JP6453580B2/ja
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JP2014163258A 2013-08-14 2014-08-10 試料調製中におけるtem試料からのプローブの分離 Active JP6453580B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361865929P 2013-08-14 2013-08-14
US61/865,929 2013-08-14

Publications (3)

Publication Number Publication Date
JP2015038477A JP2015038477A (ja) 2015-02-26
JP2015038477A5 true JP2015038477A5 (enExample) 2017-08-31
JP6453580B2 JP6453580B2 (ja) 2019-01-16

Family

ID=51301214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014163258A Active JP6453580B2 (ja) 2013-08-14 2014-08-10 試料調製中におけるtem試料からのプローブの分離

Country Status (4)

Country Link
US (1) US10053768B2 (enExample)
EP (1) EP2837926B1 (enExample)
JP (1) JP6453580B2 (enExample)
CN (1) CN104374633B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10175295B2 (en) * 2015-06-25 2019-01-08 Fei Company Optical nanoprobing of integrated circuits
CN105500389A (zh) * 2016-02-03 2016-04-20 苏州大学 微纳机器人末端执行器自动更换装置
US10401265B1 (en) 2018-03-30 2019-09-03 Micron Technology, Inc. Methods for acquiring planar view stem images of device structures
US10410829B1 (en) * 2018-03-30 2019-09-10 Micron Technology, Inc. Methods for acquiring planar view stem images of device structures
US11972923B2 (en) 2021-12-31 2024-04-30 Fei Company Systems and methods for performing sample lift-out for highly reactive materials

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999005506A1 (fr) * 1997-07-22 1999-02-04 Hitachi, Ltd. Procede et dispositif de preparation d'echantillons
JP2004093353A (ja) * 2002-08-30 2004-03-25 Seiko Instruments Inc 試料作製装置
US20070278421A1 (en) * 2006-04-24 2007-12-06 Gleason K R Sample preparation technique
US7511282B2 (en) * 2006-05-25 2009-03-31 Fei Company Sample preparation
US8357913B2 (en) 2006-10-20 2013-01-22 Fei Company Method and apparatus for sample extraction and handling
JP5270558B2 (ja) 2006-10-20 2013-08-21 エフ・イ−・アイ・カンパニー S/temのサンプルを作成する方法およびサンプル構造
US8835845B2 (en) * 2007-06-01 2014-09-16 Fei Company In-situ STEM sample preparation
EP2151848A1 (en) 2008-08-07 2010-02-10 FEI Company Method of machining a work piece with a focused particle beam
US8258473B2 (en) * 2010-11-12 2012-09-04 Nanotem, Inc. Method and apparatus for rapid preparation of multiple specimens for transmission electron microscopy
US8859998B2 (en) * 2011-01-28 2014-10-14 Fei Company TEM sample preparation
US8859963B2 (en) 2011-06-03 2014-10-14 Fei Company Methods for preparing thin samples for TEM imaging
JP2013057533A (ja) * 2011-09-07 2013-03-28 Toppan Printing Co Ltd 試料作製方法および集束イオンビーム加工装置

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