JP2015026811A5 - - Google Patents

Download PDF

Info

Publication number
JP2015026811A5
JP2015026811A5 JP2014065942A JP2014065942A JP2015026811A5 JP 2015026811 A5 JP2015026811 A5 JP 2015026811A5 JP 2014065942 A JP2014065942 A JP 2014065942A JP 2014065942 A JP2014065942 A JP 2014065942A JP 2015026811 A5 JP2015026811 A5 JP 2015026811A5
Authority
JP
Japan
Prior art keywords
substrate
mold resin
electronic component
cut
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014065942A
Other languages
Japanese (ja)
Other versions
JP2015026811A (en
JP6115505B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2014065942A priority Critical patent/JP6115505B2/en
Priority claimed from JP2014065942A external-priority patent/JP6115505B2/en
Priority to PCT/JP2014/002924 priority patent/WO2014203477A1/en
Priority to US14/894,637 priority patent/US9941182B2/en
Publication of JP2015026811A publication Critical patent/JP2015026811A/en
Publication of JP2015026811A5 publication Critical patent/JP2015026811A5/ja
Application granted granted Critical
Publication of JP6115505B2 publication Critical patent/JP6115505B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (5)

基板（１０）と、
前記基板の一面（１１）上に搭載された電子部品（２０、３０）と、
前記電子部品と共に前記基板の一面を封止するモールド樹脂（４０）と、を備え、
前記基板における前記一面と反対側の他面（１２）が前記モールド樹脂から露出する電子装置であって、
前記基板の一面と他面との間の側面の少なくとも１つの側面（１０ａ）は、前記モールド樹脂と共に切断された切断面とされており、
前記モールド樹脂は、前記基板と共に切断され、前記切断面と同一平面となる面（４０ｃ）を有し、当該面を構成する部分は前記同一平面となる面と連結され、かつ前記基板の一面と平行な面（４０ｂ）を有すると共に前記電子部品を封止する部分の厚さよりも薄くされ、
前記モールド樹脂のうち前記切断面と同一平面となる面（４０ｃ）を構成する部分は、前記基板の一面と平行な面であって前記同一平面となる面と連結された面である平行面（４０ｂ）を有すると共に、前記モールド樹脂のうち前記平行面を挟んで前記切断面とは反対側に位置する部分であって前記電子部品を封止する部分の厚さよりも薄くされた薄肉部（４２）として構成されており、
前記基板の一面と前記モールド樹脂のうち前記切断面と同一平面となる面との境界線の方向において、前記薄肉部が形成された封止領域と前記薄肉部が形成されていない露出領域とが交互に配置された部分である交互配置部分（５）を有する構成とされ、
前記交互配置部分における異なる前記露出領域において、前記基板の一面上に異なる電位の電極である複数の第１電極（１６）が設けられていることを特徴とする電子装置。 A substrate (10);
Electronic components (20, 30) mounted on one side (11) of the substrate;
A mold resin (40) for sealing one surface of the substrate together with the electronic component,
The other surface (12) opposite to the one surface of the substrate is an electronic device exposed from the mold resin,
At least one side surface (10a) between the one surface and the other surface of the substrate is a cut surface cut together with the mold resin,
The mold resin is cut together with the substrate and has a surface (40c) that is coplanar with the cut surface, a portion constituting the surface is connected to the coplanar surface, and one surface of the substrate Having a parallel surface (40b) and being thinner than the thickness of the portion for sealing the electronic component ;
A portion constituting the surface (40c) that is coplanar with the cut surface of the mold resin is a plane parallel to one surface of the substrate and connected to the coplanar surface ( 40b) and a thin-walled portion (42) that is a portion of the mold resin that is located on the opposite side of the cut surface across the parallel surface and that seals the electronic component. )
In the direction of a boundary line between one surface of the substrate and a surface of the mold resin that is flush with the cut surface, a sealing region where the thin portion is formed and an exposed region where the thin portion is not formed It is configured to have interleaved portions (5) that are alternately disposed portions,
The electronic device according to claim 1, wherein a plurality of first electrodes (16) that are electrodes having different potentials are provided on one surface of the substrate in the different exposed regions in the alternately arranged portions . 前記薄肉部は、異なる前記露出領域に配置された電位の異なる前記第１電極それぞれの間に配置された前記封止領域に位置する前記モールド樹脂の厚さが、該電位の異なる前記第１電極の厚さよりも厚くされていることを特徴とする請求項１に記載の電子装置。 The thin-walled portion includes the first electrodes having different thicknesses of the molding resin positioned in the sealing regions disposed between the first electrodes having different potentials disposed in the different exposed regions. The electronic device according to claim 1 , wherein the electronic device is thicker than the thickness of the electronic device. 前記薄肉部は、前記交互配置部分における前記露出領域を挟んで前記モールド樹脂のうち前記電子部品を封止する部分とは反対側において、前記封止領域が配置された構成とされており、
前記複数の第１電極は、それぞれ、前記モールド樹脂のうち、前記交互配置部分における前記封止領域に位置する部分と、前記電子部品を封止する部分と、前記電子部品を封止する部分とは反対側に配置された前記封止領域に位置する部分と、によって囲まれた構成とされていることを特徴とする請求項１または２に記載の電子装置。 The thin-walled portion is configured such that the sealing region is disposed on the opposite side of the mold resin from the portion that seals the electronic component across the exposed region in the alternately arranged portion,
Each of the plurality of first electrodes includes a portion of the mold resin that is located in the sealing region in the alternately arranged portion, a portion that seals the electronic component, and a portion that seals the electronic component. 3. The electronic device according to claim 1 , wherein the electronic device is surrounded by a portion located in the sealing region disposed on the opposite side. 4. 前記薄肉部が、前記モールド樹脂のうち前記電子部品を封止する部分を挟んで両側にそれぞれ配置されており、前記基板の一面と前記モールド樹脂のうち前記切断面と同一平面となる面との境界線の方向において、前記モールド樹脂のうち前記電子部品を封止する部分よりも外側に突出したモールド突出部（４３）を有し、
前記基板の一面には、前記モールド突出部を有する前記薄肉部におけるそれぞれの前記突き出し部の間の領域において、第１電極とは別の電極である第２電極（１３）が設けられていることを特徴とする請求項１ないし３のいずれか１つに記載の電子装置。 The thin portions are respectively disposed on both sides of a portion of the mold resin that seals the electronic component, and one surface of the substrate and a surface that is flush with the cut surface of the mold resin In the direction of the boundary line, the mold resin has a mold protrusion (43) protruding outward from a portion of the mold resin that seals the electronic component,
One surface of the substrate is provided with a second electrode (13) which is an electrode different from the first electrode in a region between the protruding portions of the thin-walled portion having the mold protruding portion. electronic device according to any one of claims 1 to 3, wherein the. 基板（１０）と、A substrate (10);
前記基板の一面（１１）上に搭載された電子部品（２０、３０）と、Electronic components (20, 30) mounted on one side (11) of the substrate;
前記電子部品と共に前記基板の一面を封止するモールド樹脂（４０）と、を備え、A mold resin (40) for sealing one surface of the substrate together with the electronic component,
前記基板における前記一面と反対側の他面（１２）が前記モールド樹脂から露出する電子装置であって、The other surface (12) opposite to the one surface of the substrate is an electronic device exposed from the mold resin,
前記基板の一面と他面との間の側面の少なくとも１つの側面（１０ａ）は、前記モールド樹脂と共に切断された切断面とされており、At least one side surface (10a) between the one surface and the other surface of the substrate is a cut surface cut together with the mold resin,
前記モールド樹脂は、前記基板と共に切断され、前記切断面と同一平面となる面（４０ｃ）を有し、当該面を構成する部分は前記同一平面となる面と連結され、かつ前記基板の一面と平行な面（４０ｂ）を有すると共に前記電子部品を封止する部分の厚さよりも薄くされ、The mold resin is cut together with the substrate and has a surface (40c) that is coplanar with the cut surface, a portion constituting the surface is connected to the coplanar surface, and one surface of the substrate Having a parallel surface (40b) and being thinner than the thickness of the portion for sealing the electronic component;
前記薄肉部が、前記モールド樹脂のうち前記電子部品を封止する部分を挟んで両側にそれぞれ配置されており、前記基板の一面と前記モールド樹脂のうち前記切断面と同一平面となる面との境界線の方向において、前記モールド樹脂のうち前記電子部品を封止する部分よりも外側に突出したモールド突出部（４３）を有し、The thin portions are respectively disposed on both sides of a portion of the mold resin that seals the electronic component, and one surface of the substrate and a surface that is flush with the cut surface of the mold resin In the direction of the boundary line, the mold resin has a mold protrusion (43) protruding outward from a portion of the mold resin that seals the electronic component,
前記基板の一面には、前記モールド突出部を有する前記薄肉部におけるそれぞれの前記突き出し部の間の領域において、第１電極とは別の電極である第２電極（１３）が設けられていることを特徴とする電子装置。One surface of the substrate is provided with a second electrode (13) which is an electrode different from the first electrode in a region between the protruding portions of the thin-walled portion having the mold protruding portion. An electronic device characterized by the above.
JP2014065942A 2013-06-21 2014-03-27 Electronic equipment Active JP6115505B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014065942A JP6115505B2 (en) 2013-06-21 2014-03-27 Electronic equipment
PCT/JP2014/002924 WO2014203477A1 (en) 2013-06-21 2014-06-03 Electronic device and method for manufacturing same
US14/894,637 US9941182B2 (en) 2013-06-21 2014-06-03 Electronic device and method for manufacturing same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013130304 2013-06-21
JP2013130304 2013-06-21
JP2014065942A JP6115505B2 (en) 2013-06-21 2014-03-27 Electronic equipment

Publications (3)

Publication Number Publication Date
JP2015026811A JP2015026811A (en) 2015-02-05
JP2015026811A5 true JP2015026811A5 (en) 2015-10-15
JP6115505B2 JP6115505B2 (en) 2017-04-19

Family

ID=52104229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014065942A Active JP6115505B2 (en) 2013-06-21 2014-03-27 Electronic equipment

Country Status (3)

Country Link
US (1) US9941182B2 (en)
JP (1) JP6115505B2 (en)
WO (1) WO2014203477A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6194804B2 (en) 2014-01-23 2017-09-13 株式会社デンソー Mold package
EP3613075B1 (en) * 2017-05-02 2020-11-18 ABB Schweiz AG Resin encapsulated power semiconductor module with exposed terminal areas
JP7369510B2 (en) 2017-10-16 2023-10-26 大倉工業株式会社 Sleeve packaging method using stretch film, stretch film for sleeve packaging, and manufacturing method of sleeve packaging body

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01175240A (en) 1987-12-28 1989-07-11 Sharp Corp Manufacture of semiconductor chip
US5834336A (en) * 1996-03-12 1998-11-10 Texas Instruments Incorporated Backside encapsulation of tape automated bonding device
JP3569386B2 (en) 1996-05-27 2004-09-22 株式会社ルネサステクノロジ Method for manufacturing semiconductor integrated circuit device, module substrate obtained by the method, and electronic device
DE19640304C2 (en) * 1996-09-30 2000-10-12 Siemens Ag Chip module in particular for implantation in a chip card body
JP3859318B2 (en) 1997-08-29 2006-12-20 シチズン電子株式会社 Electronic circuit packaging method
JP2000040711A (en) 1998-07-23 2000-02-08 Sony Corp Resin sealed semiconductor device and manufacture thereof
JP2002110718A (en) 2000-09-29 2002-04-12 Hitachi Ltd Manufacturing method of semiconductor device
JP2002190565A (en) 2000-12-20 2002-07-05 Taiyo Yuden Co Ltd Hybrid ic and its manufacturing method
JP3820991B2 (en) * 2002-01-08 2006-09-13 日立電線株式会社 Semiconductor device and manufacturing method thereof
JP2005161695A (en) * 2003-12-03 2005-06-23 Towa Corp Resin sealing apparatus and resin sealing method
JP4477976B2 (en) * 2004-09-30 2010-06-09 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
WO2006129926A1 (en) 2005-06-02 2006-12-07 Tsp Co., Ltd. Mold for manufacturing semiconductor device and semiconductor device manufactred using the same
JP2007109831A (en) 2005-10-13 2007-04-26 Towa Corp Resin sealing molding method for electronic component
FR2893764B1 (en) * 2005-11-21 2008-06-13 St Microelectronics Sa STACKABLE SEMICONDUCTOR HOUSING AND METHOD FOR MANUFACTURING THE SAME
JP2007281207A (en) 2006-04-07 2007-10-25 Renesas Technology Corp Method for manufacturing semiconductor device
JP4836661B2 (en) * 2006-05-17 2011-12-14 Ｔｏｗａ株式会社 Resin sealing molding method for electronic parts and mold for resin sealing molding
JP4376884B2 (en) * 2006-09-20 2009-12-02 シャープ株式会社 Semiconductor device and manufacturing method of semiconductor device
JP2008082768A (en) 2006-09-26 2008-04-10 Kobe Steel Ltd Thermal flow sensor
TWI336502B (en) * 2006-09-27 2011-01-21 Advanced Semiconductor Eng Semiconductor package and semiconductor device and the method of making the same
JP4926869B2 (en) 2007-07-26 2012-05-09 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
JP5157456B2 (en) * 2008-01-08 2013-03-06 富士通セミコンダクター株式会社 Semiconductor device and manufacturing method of semiconductor device
JP2009170476A (en) * 2008-01-11 2009-07-30 Panasonic Corp Semiconductor device and method of manufacturing the same
DE102008052393B3 (en) 2008-10-21 2010-02-25 Continental Automotive Gmbh Mass flow sensor device for use as air mass sensor for determining flow rate of air in internal-combustion engine, has flow-type body arranged in bypass such that mass flow sensor is partly arranged into recess of flow-type body
JP2011077199A (en) * 2009-09-29 2011-04-14 Sumitomo Bakelite Co Ltd Semiconductor package and semiconductor device
JP2012238725A (en) * 2011-05-12 2012-12-06 Toshiba Corp Semiconductor device, manufacturing method of the same and semiconductor module using the same
JP5419230B2 (en) * 2011-08-01 2014-02-19 ルネサスエレクトロニクス株式会社 Semiconductor device and manufacturing method thereof
CN102931105A (en) 2011-08-10 2013-02-13 飞思卡尔半导体公司 Tube core bonding method of semiconductor device
JP5994613B2 (en) * 2012-12-05 2016-09-21 株式会社デンソー Electronic device mounting structure
CN106158778B (en) * 2015-03-12 2020-07-17 恩智浦美国有限公司 Integrated circuit package with side contact pads and bottom contact pads
US9443830B1 (en) * 2015-06-09 2016-09-13 Apple Inc. Printed circuits with embedded semiconductor dies

Similar Documents

Publication Publication Date Title
JP2015156800A5 (en) Power semiconductor device
JP2015062079A5 (en)
JP2016006857A5 (en) Semiconductor device and electronic equipment
JP2016213452A5 (en) Semiconductor device
JP2014195064A5 (en)
JP2013038399A5 (en) Semiconductor device
JP2015188064A5 (en) Semiconductor device
JP2015144273A5 (en) Display device
JP2013168419A5 (en)
JP2016028423A5 (en) Transistor
JP2014197522A5 (en) Light emitting device
JP2017097096A5 (en)
JP2013178522A5 (en) Semiconductor device
JP2015195327A5 (en)
JP2016021230A5 (en) Touch panel and touch panel module
JP2017520899A5 (en)
JP2011159974A5 (en)
JP2020526004A5 (en)
JP2016040992A5 (en)
JP2016139056A5 (en)
JP2016125927A5 (en) Electronic device, electronic apparatus, moving object, and method of manufacturing electronic device
JP2016009791A5 (en) Semiconductor device
JP2015216367A5 (en)
JP2012199525A5 (en)
JP2018137324A5 (en)