JP2015023293A - 発光素子 - Google Patents
発光素子 Download PDFInfo
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- JP2015023293A JP2015023293A JP2014148938A JP2014148938A JP2015023293A JP 2015023293 A JP2015023293 A JP 2015023293A JP 2014148938 A JP2014148938 A JP 2014148938A JP 2014148938 A JP2014148938 A JP 2014148938A JP 2015023293 A JP2015023293 A JP 2015023293A
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- 239000004065 semiconductor Substances 0.000 claims abstract description 146
- 239000000758 substrate Substances 0.000 claims description 49
- 238000005530 etching Methods 0.000 claims description 12
- 239000010410 layer Substances 0.000 description 175
- 239000000463 material Substances 0.000 description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 239000002019 doping agent Substances 0.000 description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000010948 rhodium Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 239000011787 zinc oxide Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 4
- 229910002704 AlGaN Inorganic materials 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 3
- 229910052788 barium Inorganic materials 0.000 description 3
- 229910052791 calcium Inorganic materials 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 229910052741 iridium Inorganic materials 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229910052703 rhodium Inorganic materials 0.000 description 3
- 229910052712 strontium Inorganic materials 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- 229910018229 Al—Ga Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- WZMARNWNQFFBKK-UHFFFAOYSA-N [In+3].[O-2].[Zn+2].[In+3].[O-2].[O-2].[O-2] Chemical compound [In+3].[O-2].[Zn+2].[In+3].[O-2].[O-2].[O-2] WZMARNWNQFFBKK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- VRIVJOXICYMTAG-IYEMJOQQSA-L iron(ii) gluconate Chemical compound [Fe+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O VRIVJOXICYMTAG-IYEMJOQQSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 1
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
【解決手段】発光素子200Aは、複数個の発光セル100と、隣接する2つの発光セル100を電気的に接続するブリッジ電極150とを含み、複数個の発光セル100は、第1導電型半導体層122、第2導電型半導体層126、第1導電型半導体層122と第2導電型半導体層126との間の活性層124を含む発光構造物120と、第1導電型半導体層122上の第1電極130と、第2導電型半導体層126上の第2電極140とをそれぞれ含み、ブリッジ電極150は、第1電極130または第2電極140よりも厚い部分を有する。
【選択図】図3
Description
110 基板
120 発光構造物
122 第1導電型半導体層
124 活性層
126 第2導電型半導体層
130 第1電極
140 第2電極
150 ブリッジ電極
151 第1部分
152 第2部分
153 第3部分
160 絶縁層
200A〜200C、300A〜300D 発光素子
310 パッケージボディー
421、422 第1、2リードフレーム
430 ワイヤ
440 モールディング部
450 蛍光体
710 発光モジュール
720 リフレクタ
730 シェード
800 表示装置
810 ボトムカバー
820 反射板
840 導光板
850 第1プリズムシート
860 第2プリズムシート
870 パネル
880 カラーフィルター
Claims (15)
- 複数個の発光セルと、
隣接する2つの発光セルを電気的に接続するブリッジ電極とを含み、
前記複数個の発光セルは、第1導電型半導体層、第2導電型半導体層、前記第1導電型半導体層と前記第2導電型半導体層との間の活性層を含む発光構造物と、前記第1導電型半導体層上の第1電極と、前記第2導電型半導体層上の第2電極とをそれぞれ含み、
前記ブリッジ電極は、前記第1電極または前記第2電極よりも厚い部分を有する、発光素子。 - 前記ブリッジ電極の幅が、前記第1電極または前記第2電極の幅よりも大きい、請求項1に記載の発光素子。
- 前記発光構造物は、一部がエッチングされて、前記第1導電型半導体層を露出するエッチング領域を含み、前記第1電極は、露出された前記第1導電型半導体層上に配置された、請求項1又は2に記載の発光素子。
- 前記ブリッジ電極は、隣接する2つの発光セルのいずれか一方の発光セルの第1電極と接する第1部分と、他方の発光セルの第2電極と接する第2部分と、前記第1部分と前記第2部分との間の第3部分とを含む、請求項1ないし3のいずれかに記載の発光素子。
- 前記ブリッジ電極は、前記第3部分の厚さが最も大きい、請求項4に記載の発光素子。
- 前記第3部分は、隣接する2つの発光セルの間に配置される、請求項4に記載の発光素子。
- 前記ブリッジ電極は、前記第1部分または前記第2部分において、それぞれ前記第1電極または前記第2電極と高さが同一である、請求項4に記載の発光素子。
- 前記ブリッジ電極は、隣接する2つの発光セルの間に複数個存在する、請求項4に記載の発光素子。
- 前記第1部分の一部が前記第1電極の上部に配置され、前記第2部分の一部が前記第2電極の上部に配置される、請求項4に記載の発光素子。
- 前記ブリッジ電極は、前記第1部分と前記第3部分との間及び前記第2部分と前記第3部分との間に配置される第4部分をさらに含み、
前記第4部分の厚さが、前記第1部分、前記第2部分または前記第3部分のそれぞれの厚さよりも小さい、請求項4に記載の発光素子。 - 前記第1電極及び前記第2電極は第1方向の長手方向を有し、前記複数個のブリッジ電極は、前記第1方向と異なる第2方向の長手方向をそれぞれ有する、請求項8に記載の発光素子。
- 前記複数の発光セルの下に配置される基板と、
隣接する発光セルの間に位置する前記基板の上部面の一領域に形成される第1凹凸とをさらに含む、請求項4ないし11のいずれかに記載の発光素子。 - 前記ブリッジ電極の第3部分は、前記隣接する発光セルの間に位置する前記基板の上部面の前記一領域上に配置され、
前記ブリッジ電極の第3部分の上部面には、前記第1凹凸に対応する第2凹凸が形成される、請求項12に記載の発光素子。 - 前記基板の上部面を基準として前記ブリッジ電極の第3部分の上部面の高さは、前記ブリッジ電極の第1部分の上部面の高さよりも低いか、または同一である、請求項12に記載の発光素子。
- 前記発光セルと前記ブリッジ電極との間に配置される絶縁層をさらに含む、請求項1ないし14のいずれかに記載の発光素子。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2013-0085959 | 2013-07-22 | ||
KR20130085959 | 2013-07-22 | ||
KR1020140083640A KR102194805B1 (ko) | 2013-07-22 | 2014-07-04 | 발광소자 |
KR10-2014-0083640 | 2014-07-04 |
Publications (3)
Publication Number | Publication Date |
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JP2015023293A true JP2015023293A (ja) | 2015-02-02 |
JP2015023293A5 JP2015023293A5 (ja) | 2017-08-03 |
JP6442177B2 JP6442177B2 (ja) | 2018-12-19 |
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JP2014148938A Active JP6442177B2 (ja) | 2013-07-22 | 2014-07-22 | 発光素子 |
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JP (1) | JP6442177B2 (ja) |
KR (1) | KR102194805B1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110957404A (zh) * | 2019-12-17 | 2020-04-03 | 佛山市国星半导体技术有限公司 | 一种高压led芯片及其制作方法 |
JP2022527622A (ja) * | 2020-03-03 | 2022-06-02 | 東莞市中麒光電技術有限公司 | 発光ダイオード及びその製造方法 |
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KR102343087B1 (ko) * | 2017-04-28 | 2021-12-24 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
KR102619665B1 (ko) * | 2018-06-29 | 2023-12-29 | 삼성전자주식회사 | 발광 장치 |
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JP2011171739A (ja) * | 2010-02-19 | 2011-09-01 | Samsung Led Co Ltd | マルチセルアレイを有する半導体発光装置、発光モジュール及び照明装置 |
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KR101014155B1 (ko) * | 2010-03-10 | 2011-02-10 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
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JP2022527622A (ja) * | 2020-03-03 | 2022-06-02 | 東莞市中麒光電技術有限公司 | 発光ダイオード及びその製造方法 |
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