JP2015023157A - シリコン基板のエッチング方法 - Google Patents
シリコン基板のエッチング方法 Download PDFInfo
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- JP2015023157A JP2015023157A JP2013150188A JP2013150188A JP2015023157A JP 2015023157 A JP2015023157 A JP 2015023157A JP 2013150188 A JP2013150188 A JP 2013150188A JP 2013150188 A JP2013150188 A JP 2013150188A JP 2015023157 A JP2015023157 A JP 2015023157A
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
- H01L21/30655—Plasma etching; Reactive-ion etching comprising alternated and repeated etching and passivation steps, e.g. Bosch process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
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- Inorganic Chemistry (AREA)
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Abstract
Description
以下、本発明の実施例1について説明する。
以下、本発明の実施例2について説明する。実施例1との違いは、エッチングマスク3の厚さと、希ガス導入のタイミングである。
以下、本発明の実施例3について説明する。実施例1との違いは、保護膜エッチング時の基板電極のバイアス条件である。
Claims (10)
- プラズマで発生するイオンによりシリコン基板を第一の面からエッチングして凹部を形成する、シリコン基板のエッチング方法であって、
反応系内に希ガスを導入してイオン化する工程を含むことを特徴とするシリコン基板のエッチング方法。 - 前記シリコン基板に形成された未貫通孔の開口内に保護膜を形成する工程(1)と、前記開口の底部に形成された保護膜部分をイオンによりエッチングする工程(2)と、前記開口の底部に露出したシリコン基板部分をイオンによりエッチングする工程(3)と、をこの順で繰り返すことにより、前記凹部を形成する、請求項1に記載のシリコン基板のエッチング方法。
- 前記希ガスの導入及びイオン化を、前記工程(2)中であって、保護膜のエッチングの間に行う請求項2に記載のシリコン基板のエッチング方法。
- 前記希ガスの導入及びイオン化を、前記工程(3)中であって、シリコン基板のエッチングの間に行う請求項2又は3に記載のシリコン基板のエッチング方法。
- 前記開口の底部に形成された保護膜部分をエッチングしながら、前記希ガスの導入及びイオン化を行う、請求項2に記載のシリコン基板のエッチング方法。
- 前記開口の底部に露出したシリコン基板部分をエッチングしながら、前記希ガスの導入及びイオン化を行う、請求項2又は5に記載のシリコン基板のエッチング方法。
- 前記工程(2)及び前記工程(3)の間に、前記希ガスの導入及びイオン化を行う、請求項2乃至6のいずれかに記載のシリコン基板のエッチング方法。
- 高周波電源によって前記希ガスに放電することによって、前記希ガスをプラズマ化させてイオン化する請求項1乃至7のいずれかに記載のシリコン基板のエッチング方法。
- 前記保護膜をエッチングする際、基板電極のバイアスがパルス化されている請求項1乃至8のいずれかに記載のシリコン基板のエッチング方法。
- 前記第一の面と反対側の面である第二の面の上にエッチングストップ層が形成されており、前記エッチングストップ層に達すまでエッチングを行う請求項1乃至9のいずれかに記載のシリコン基板のエッチング方法。
Priority Applications (2)
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JP2013150188A JP6173086B2 (ja) | 2013-07-19 | 2013-07-19 | シリコン基板のエッチング方法 |
US14/322,235 US9548207B2 (en) | 2013-07-19 | 2014-07-02 | Method of etching a silicon substrate |
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JP2013150188A JP6173086B2 (ja) | 2013-07-19 | 2013-07-19 | シリコン基板のエッチング方法 |
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JP2015023157A true JP2015023157A (ja) | 2015-02-02 |
JP2015023157A5 JP2015023157A5 (ja) | 2016-09-01 |
JP6173086B2 JP6173086B2 (ja) | 2017-08-02 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017103403A (ja) * | 2015-12-04 | 2017-06-08 | 株式会社日立ハイテクノロジーズ | ドライエッチング方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US9741584B1 (en) * | 2016-05-05 | 2017-08-22 | Lam Research Corporation | Densification of dielectric film using inductively coupled high density plasma |
JP2019098558A (ja) * | 2017-11-29 | 2019-06-24 | キヤノン株式会社 | インクジェットヘッド用基板の製造方法 |
Citations (11)
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US627756A (en) * | 1899-04-22 | 1899-06-27 | Henry J Mark | Corrugated wood veneer. |
JPH07503815A (ja) * | 1992-12-05 | 1995-04-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | ケイ素の異方性エッチング法 |
JP2000299310A (ja) * | 1999-02-12 | 2000-10-24 | Denso Corp | 半導体装置の製造方法 |
JP2001284320A (ja) * | 2000-04-03 | 2001-10-12 | Nippon Soken Inc | ドライエッチング方法及び半導体力学量センサの製造方法 |
US20040097077A1 (en) * | 2002-11-15 | 2004-05-20 | Applied Materials, Inc. | Method and apparatus for etching a deep trench |
JP2006148156A (ja) * | 1998-11-04 | 2006-06-08 | Surface Technology System Plc | 基板をエッチングするための方法と装置 |
JP2007509506A (ja) * | 2003-10-21 | 2007-04-12 | ウナクシス ユーエスエイ、インコーポレイテッド | 時分割多重法及びrfバイアス変調を用いた高アスペクトsoi構造の無ノッチエッチング |
JP2007115839A (ja) * | 2005-10-19 | 2007-05-10 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及びプラズマ処理装置 |
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US6187685B1 (en) * | 1997-08-01 | 2001-02-13 | Surface Technology Systems Limited | Method and apparatus for etching a substrate |
US20040256353A1 (en) * | 2003-04-24 | 2004-12-23 | Tokyo Electron Limited | Method and system for deep trench silicon etch |
KR101083558B1 (ko) * | 2003-12-01 | 2011-11-14 | 파나소닉 주식회사 | 플라즈마 에칭 방법 |
US8802571B2 (en) * | 2011-07-28 | 2014-08-12 | Lam Research Corporation | Method of hard mask CD control by Ar sputtering |
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2013
- 2013-07-19 JP JP2013150188A patent/JP6173086B2/ja active Active
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- 2014-07-02 US US14/322,235 patent/US9548207B2/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US627756A (en) * | 1899-04-22 | 1899-06-27 | Henry J Mark | Corrugated wood veneer. |
JPH07503815A (ja) * | 1992-12-05 | 1995-04-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | ケイ素の異方性エッチング法 |
JP2007129260A (ja) * | 1992-12-05 | 2007-05-24 | Robert Bosch Gmbh | ケイ素の異方性エッチング法 |
JP2006148156A (ja) * | 1998-11-04 | 2006-06-08 | Surface Technology System Plc | 基板をエッチングするための方法と装置 |
US6277756B1 (en) * | 1999-02-12 | 2001-08-21 | Denso Corporation | Method for manufacturing semiconductor device |
JP2000299310A (ja) * | 1999-02-12 | 2000-10-24 | Denso Corp | 半導体装置の製造方法 |
JP2001284320A (ja) * | 2000-04-03 | 2001-10-12 | Nippon Soken Inc | ドライエッチング方法及び半導体力学量センサの製造方法 |
US20040097077A1 (en) * | 2002-11-15 | 2004-05-20 | Applied Materials, Inc. | Method and apparatus for etching a deep trench |
JP2007509506A (ja) * | 2003-10-21 | 2007-04-12 | ウナクシス ユーエスエイ、インコーポレイテッド | 時分割多重法及びrfバイアス変調を用いた高アスペクトsoi構造の無ノッチエッチング |
JP2007115839A (ja) * | 2005-10-19 | 2007-05-10 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法及びプラズマ処理装置 |
JP2007123412A (ja) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
WO2009110567A1 (ja) * | 2008-03-07 | 2009-09-11 | 株式会社アルバック | プラズマ処理方法 |
US20090242512A1 (en) * | 2008-03-27 | 2009-10-01 | Dalsa Semiconductor Inc. | Deep reactive ion etching |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017103403A (ja) * | 2015-12-04 | 2017-06-08 | 株式会社日立ハイテクノロジーズ | ドライエッチング方法 |
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US9548207B2 (en) | 2017-01-17 |
US20150024604A1 (en) | 2015-01-22 |
JP6173086B2 (ja) | 2017-08-02 |
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