JP2015022518A - Working device and working system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a working device and a working system that are capable of detecting various processing states and are more compact compared to conventional ones.SOLUTION: A working device comprises: working means for working a workpiece; imaging means for imaging the workpiece worked by the working means and for forming a picked-up image of the workpiece; control means including a transmission unit for transmitting the picked-up image of the workpiece imaged and formed by the imaging means to a server connected via a communication line, and a reception unit for receiving worked state information in which image processing is applied to the picked-up image of the workpiece transmitted to the server at an image processing unit that the server has and a worked state is detected; and display means for displaying the worked state information received by the reception unit.

Description

  The present invention relates to a processing apparatus and a processing system for processing a workpiece.

  In various processing devices such as grinding devices, polishing devices, cutting devices, and laser processing devices, the processing state is confirmed based on the captured image of the workpiece formed by imaging the processed workpiece with the imaging unit. doing.

  For example, in a grinding apparatus, a wafer can be processed to a predetermined thickness. However, if scratches or the like occur on the ground surface of the wafer, the bending strength of a device chip formed by dividing the wafer is reduced. .

  Therefore, for example, Japanese Patent Application Laid-Open No. 2009-95903 or Japanese Patent Application Laid-Open No. 2010-17792 proposes a scratch detection device that detects whether or not a scratch has occurred on the ground surface of the wafer.

  On the other hand, in the cutting apparatus, an operation (hairline alignment) of matching a reference line of a camera mounted on the cutting apparatus in advance with the center line of the cutting blade is performed. However, if cutting of the workpiece is continued, thermal expansion occurs in the spindle with high-speed rotation.

  Even when the cutting blade and the reference line are aligned at the start of cutting, this thermal expansion causes a shift in the position of the cutting blade. Accordingly, it is necessary to perform a kerf check during cutting and to align the cutting blade with the reference line of the camera (see, for example, Japanese Patent Laid-Open No. 2000-48203 or Japanese Patent Laid-Open No. 2009-246015).

  More specifically, the captured image of the workpiece imaged by the camera is subjected to image processing by an image processing unit built in the controller of the processing apparatus, and the number and size of scratches, chipping, particles are detected or formed. Groove width and misalignment are detected.

JP 2009-95903 A JP 2010-17792 A JP 2000-48203 A JP 2009-246015 A

  However, for example, the image processing applied to the captured image of the workpiece to detect scratches and the image processing applied to the captured image to detect chipping differ in calculation content, and the calculation processing capacity is also large. In order to detect scratches, chipping, and the like on the processing apparatus, dedicated processing units must be provided in the processing apparatus, which increases the size of the processing apparatus.

  The present invention has been made in view of these points, and an object of the present invention is to provide a more compact machining apparatus and machining system capable of detecting various machining states.

  According to the first aspect of the present invention, there is provided a processing apparatus, a processing means for processing a workpiece, and an imaging means for imaging the workpiece processed by the processing means to form an image of the workpiece. A transmission unit that transmits a captured image of the workpiece imaged and formed by the imaging unit to a server connected via a communication line; and a captured image of the workpiece transmitted to the server A receiving unit that receives processing state information in which a processing state is detected by image processing performed by an image processing unit of the server, and displays the processing state information received by the receiving unit. And a processing device characterized by comprising display means.

  According to a second aspect of the present invention, there is provided a machining system comprising a plurality of machining devices and a server connected to the plurality of machining devices via a communication line, wherein each machining device is a workpiece. Processing means for processing the workpiece, imaging means for imaging the workpiece processed by the processing means to form a captured image of the workpiece, and imaging of the workpiece formed by imaging by the imaging means A processing unit is detected by performing image processing on a captured image of the workpiece transmitted to the server and an image processing unit included in the server, which transmits the image to the server via a communication line. A control unit including a receiving unit that receives the processing state information, and a display unit that displays the processing state information received by the receiving unit, and the server is connected to each processing device via the communication line. The captured image of the workpiece that has been transmitted A server-side receiving unit, the image processing unit that performs processing on the captured image of the workpiece received by the server-side receiving unit to generate processing state information, and the image processing unit that generates the processing state information. There is provided a processing system including a server-side transmission unit that transmits processing state information to a processing apparatus that has transmitted a captured image of the workpiece via the communication line.

  According to the present invention, since the image processing unit is disposed not on the processing apparatus but on the server, various processing states can be detected and the processing apparatus can be made more compact.

It is a perspective view of the grinding device concerning a 1st embodiment of the present invention in which a control means was connected to a server via a communication line. It is a schematic block diagram of the processing system which concerns on 2nd Embodiment of this invention with which the control means of the some grinding apparatus was connected to the server via the communication line.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1, a perspective view of a grinding apparatus 2 according to the first embodiment of the present invention in which a controller (control means) 78 is connected to a server 88 via a communication line 86 is shown. Reference numeral 4 denotes a base of the grinding apparatus 2, and two columns 6 a and 6 b are vertically provided behind the base 4.

  A pair of guide rails (only one is shown) 8 extending in the vertical direction is fixed to the column 6a. A rough grinding unit 10 is mounted along the pair of guide rails 8 so as to be movable in the vertical direction. The rough grinding unit 10 is attached to a moving base 12 whose housing 20 moves up and down along a pair of guide rails 8.

  The rough grinding unit 10 includes a housing 20, a spindle (not shown) rotatably accommodated in the housing 20, a servo motor 22 that rotationally drives the spindle, a wheel mount that is fixed to the tip of the spindle, and a detachable attachment to the wheel mount. It includes a grinding wheel 24 that is mounted as possible. The grinding wheel 24 is configured by a plurality of grinding wheels 26 fixed in an annular shape on the outer periphery of the lower end of the annular base.

  The rough grinding unit 10 includes a rough grinding unit moving mechanism 18 including a ball screw 14 and a pulse motor 16 that move the rough grinding unit 10 up and down along a pair of guide rails 8. When the pulse motor 16 is pulse-driven, the ball screw 14 rotates and the moving base 12 is moved in the vertical direction.

  A pair of guide rails (only one is shown) 48 extending in the vertical direction are also fixed to the other column 6b. A finish grinding unit 28 is mounted along the pair of guide rails 48 so as to be movable in the vertical direction.

  The finish grinding unit 28 is attached to a moving base (not shown) whose housing 36 moves up and down along a pair of guide rails 48. The finish grinding unit 28 includes a housing 36, a spindle (not shown) rotatably accommodated in the housing 36, a servo motor 38 that rotationally drives the spindle, and a grinding wheel 42 for finish grinding fixed to the tip of the spindle. A grinding wheel 40 is included.

  The finish grinding unit 28 includes a finish grinding unit moving mechanism 34 including a ball screw 30 and a pulse motor 32 that move the finish grinding unit 28 in the vertical direction along a pair of guide rails 48. When the pulse motor 32 is driven, the ball screw 30 rotates and the finish grinding unit 28 is moved in the vertical direction.

  The grinding device 2 includes a turntable 44 disposed so as to be substantially flush with the upper surface of the base 4 on the front side of the columns 6a and 6b. The turntable 44 is formed in a relatively large-diameter disk shape, and is rotated in a direction indicated by an arrow 45 by a rotation drive mechanism (not shown).

  On the turntable 44, three chuck tables (holding tables) 46 are disposed so as to be rotatable in a horizontal plane while being spaced apart from each other by 120 ° in the circumferential direction. The chuck table 46 has a suction holding portion formed in a disk shape by a porous ceramic material, and sucks and holds the wafer placed on the holding surface of the suction holding portion by operating a vacuum suction means.

  The three chuck tables 46 arranged on the turntable 44 have a wafer carry-in / out area (wafer attach / detach area) A, a rough grinding area B, a finish grinding area C, as the turntable 44 rotates appropriately. And sequentially moved to the wafer carry-in / carry-out area A.

  A front portion of the base 4 includes a wafer cassette 50, a wafer transfer robot 54 having a hand 52, a positioning table 56 having a plurality of positioning pins 58, a wafer carry-in mechanism (loading arm) 60, and a wafer carry-out mechanism (an unloader). A loading arm 62, a spinner cleaning device 64 that cleans and spin-drys the ground wafer, and a storage cassette 66 that stores the ground wafer that has been cleaned and spin-dried by the spinner cleaning device 64.

  The spinner cleaning device 64 is provided with a spinner table 68 having a diameter smaller than that of the semiconductor wafer 11 that rotates while sucking and holding the ground semiconductor wafer 11. Reference numeral 70 denotes a cover of the spinner cleaning device 64.

  Adjacent to the spinner table 68, an image pickup unit 76 (image pickup means) for picking up an image of the ground surface of the ground wafer that has been spin cleaned and spin dried by the spinner cleaning device 64 is disposed. The imaging unit 76 includes a microscope and a camera such as a CCD camera that captures an image magnified by the microscope. The captured image captured by the imaging unit 76 is input to a controller (control means) 78.

  Adjacent to the chuck table 46 positioned in the rough grinding region B, a first thickness detection unit (first height gauge) 72 is disposed on the base 4, and the chuck table 46 positioned in the finish grinding region C. A second thickness detection unit (second height gauge) 74 is disposed on the base 4 adjacent to the base 4.

  The first thickness detection unit 72 includes a chuck table upper surface height position detection needle 72a and a workpiece upper surface height position detection needle 72b. Similarly, the second thickness detection unit 74 includes a chuck table upper surface height position detection needle 74a and a workpiece upper surface height position detection needle 74b.

  The control unit 78 of the grinding apparatus 2 includes a transmission unit 80 that transmits a captured image of a workpiece such as a wafer imaged and formed by the imaging unit 76 to the server 88 via a communication line 86 such as the Internet, and the server 88. The receiving unit 82 receives the machining state information transmitted from the communication line 86 via the communication line 86. The machining state information received by the receiving unit 82 is displayed on a display 84 (display unit) connected to the control unit 78.

  The server 88 includes a server-side receiving unit 90 that receives a captured image of the workpiece from the communication line 86, and an image processing unit that performs processing on the captured image of the workpiece to generate processing state information. 94 and a server-side transmission unit 92 that transmits processing state information detected by image processing performed by the image processing unit 94 to the control unit 78 of the grinding apparatus 2 via the communication line 86.

  Image processing in the image processing unit 94 is performed using, for example, a two-dimensional filter. For example, a Sobel filter is suitable for detecting scratches on the ground surface. For example, a sharpening filter is suitable for detecting particles.

  The processing state information detected by the image processing unit 94 includes the number and size of scratches on the grinding surface, the number and size of edge chipping on the workpiece, the number and size of particles adhering to the grinding surface, and the like. .

  Preferably, the server 88 is installed on the manufacturer side that manufactured the grinding apparatus 2. By installing the high-speed and large-capacity server 88 on the manufacturer side, the load on the control means 78 of the grinding apparatus 2 installed in the customer's factory can be reduced, and scratch image processing and chipping image processing are performed. Although the calculation contents are different from the image processing of particles, a plurality of image processing can be quickly executed by the high-speed and large-capacity server 88. Therefore, the control means 78 of the grinding apparatus 2 can be made compact.

  Processing state information such as scratches and edge chipping received by the receiving unit 82 of the control means 78 is displayed on the display 84, and the operator of the grinding apparatus 2 can observe the processing state on the display 84.

Referring to FIG. 2, there is shown a schematic configuration diagram of a processing system according to the second embodiment of the present invention. In the processing system of this embodiment, control means 78A, 78B, 78C of a plurality of grinding apparatuses 2A, 2B, 2C are connected to a server 88 installed on the manufacturer side of the grinding apparatus via a communication line 86 such as the Internet. The configuration of each of the control means 78A, 78B, 78C is the same as that of the control means 78 shown in FIG. 1, and has a transmission unit 80 and a reception unit 82. The control means 78A, 78B and 78C are connected to the display 84, but the display is omitted in FIG.

  The configuration of the server 88 shown in FIG. 2 is the same as the configuration of the server 88 shown in FIG.

  In the present embodiment, since the control means 78A, 78B, 78C of the plurality of grinding apparatuses 2A, 2B, 2C are connected to the server 88 installed on the manufacturer side of the grinding apparatus via the communication line 86, high speed and large size are achieved. Since the processing for detecting the machining state can be executed by the image processing unit 94 of the capacity server 88, the control means 78A, 78B, 78C of the grinding apparatuses 2A, 2B, 2C can be made compact.

  In each of the above-described embodiments, an example in which the present invention is applied to the grinding devices 2 and 2A to 2C has been described. However, the present invention is not limited to this, and detection of a processing state of a cutting device, a laser processing device, or the like. It can be similarly applied to.

  When applied to a cutting device, the processing state information includes the number and size of chipping, groove depth, width, processing position deviation, number of particles and size, etc. When applied to a laser processing device, the processing state information is , Chipping number and size, particle number and size, groove depth, groove width, processing position deviation, and the like.

2, 2A to 2C Grinding device 10 Rough grinding unit 28 Finish grinding unit 64 Spinner cleaning device 76 Imaging unit 78, 78A to 78C Control means (controller)
84 Display 86 Communication line 88 Server 94 Image processing section

Claims (2)

A processing device,
Processing means for processing the workpiece;
Imaging means for imaging a workpiece processed by the processing means to form a captured image of the workpiece;
A transmission unit that transmits a captured image of the workpiece imaged and formed by the imaging means to a server connected via a communication line; and the captured image of the workpiece transmitted to the server A receiving unit that receives processing state information in which a processing state is detected by performing image processing in an image processing unit of the server;
Display means for displaying the machining state information received by the receiving unit;
A processing apparatus comprising: A machining system comprising a plurality of machining devices and a server connected to the plurality of machining devices via a communication line,
Each processing device
Processing means for processing the workpiece;
Imaging means for imaging a workpiece processed by the processing means to form a captured image of the workpiece;
The server has a transmission unit that transmits a captured image of the workpiece formed by the imaging unit to the server via a communication line, and the server has a captured image of the workpiece transmitted to the server. A receiving unit that receives processing state information in which the processing state is detected by performing image processing in the image processing unit;
Display means for displaying the machining state information received by the receiving unit,
The server
A server-side receiving unit for receiving a captured image of the workpiece transmitted from each processing device via the communication line;
The image processing unit that performs image processing on a captured image of the workpiece received by the server-side receiving unit to generate processing state information;
A server-side transmission unit that transmits the processing state information generated by the image processing unit to the processing apparatus that has transmitted the captured image of the workpiece via the communication line;
The processing system characterized by including.

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