JP2015002654A - Circuit board, and circuit unit employing the board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit unit at low cost, the circuit unit being structured by stacking circuit boards each packaging a unit circuit, when forming a target circuit by serially connecting the same unit circuit for a plurality of stages.SOLUTION: In a printed circuit board 500P for packaging a plurality of electronic components included in unit circuits, input terminal lands 501L-503L are arranged side by side along one side of the rectangular printed circuit board 500P, output terminal lands 504L-506L are arranged side by side along an opposite side and in addition to these lands 501L-506L, lands 508L1-514L1 and 508L2-514L2 for soldering the electronic components are disposed in line symmetry with respect to a centerline C. Thus, the electronic components are also disposed in line symmetry with respect to the centerline C. As a result, packaging of components onto the printed circuit board 500P is simplified and reduction of cost of a circuit board 500 can be attained.

Description

  The present invention relates to a circuit board in which a plurality of electronic components are mounted on a printed circuit board and a circuit unit using the board, and more specifically, a plurality of stages of the same electronic circuit are connected in series to form a target circuit. And a circuit unit using the substrate.

  Conventionally, a high-voltage power supply device using a booster circuit configured by connecting multiple voltage rectifier circuits in multiple stages is known. The most typical and frequently used booster circuit is the Cockcroft-Walton circuit. The Cockcroft-Walton circuit has several configuration variations, but the basis is a voltage doubler rectifier circuit that combines a capacitor and a diode. A voltage can be output (see Patent Document 1).

  In a high-voltage power supply device using a Cockcroft-Walton circuit, if an attempt is made to obtain a high voltage by increasing the number of voltage doubler rectifier circuits, a large circuit board is required and the device becomes large. Therefore, in order to reduce the size of the device, in the high voltage power supply device described in Patent Documents 2 and 3, a voltage doubler rectifier circuit including a capacitor and a diode is mounted on a single circuit board (so-called printed circuit board). A booster circuit having a configuration in which a plurality of substrates are stacked in a direction orthogonal to the direction in which the substrate spreads is used. Although the apparatus can be reduced in size by such a configuration, there are the following problems.

  That is, when a multi-stage voltage doubler rectifier circuit is mounted on a single large printed circuit board, only one printed circuit board is required. On the other hand, when the stacked structure as described above is adopted, a large number of printed circuit boards are used. is necessary. When manufacturing such a small printed circuit board, usually, a large number of small substrates are formed on a large substrate, and the small substrates are obtained by separating them one by one. For this reason, the number of processing steps is increased as compared with the case of manufacturing a single large printed circuit board, and thus the cost of the printed circuit board required to configure the same booster circuit is increased. In addition, since a plurality of circuit boards are stacked, the assembly cost is also increased.

JP 2006-304506 A JP-A-7-312300 JP 2008-41318 A

  For the above reason, the booster circuit having a stacked structure tends to be higher in manufacturing cost than the booster circuit having a planar structure. The present invention has been made in view of these problems, and its main object is to improve its assembly when obtaining the desired circuit by connecting the same electronic circuit in multiple stages in series. It is an object of the present invention to provide a circuit board that can reduce the manufacturing cost and a circuit unit using the board.

A circuit board according to the present invention to solve the above problems is a circuit board for connecting a plurality of identical unit circuits in series to form a target circuit. In the circuit board on which the electronic components are mounted,
The printed circuit board on which one unit circuit is mounted has a land for a signal input terminal, a land for a signal output terminal, and a land for mounting a plurality of electronic components, and divides the printed circuit board in half. Centering on the center line to be arranged, the outer shape of the printed circuit board and the arrangement of the lands are line symmetric,
In a state where a plurality of electronic components are mounted on the printed circuit board, the arrangement of these electronic components is also symmetrical with respect to the center line.

  The “land” here includes both those having a through-hole through which a lead of an electronic component and the like are inserted and those having no through-hole.

  In the case of the booster circuit using the Cockcroft-Walton circuit described above, a voltage doubler rectifier circuit using electronic components such as a diode and a capacitor corresponds to the unit circuit.

  In the circuit board according to the present invention, the lands are arranged symmetrically with respect to the center line on the printed circuit board. For example, an operator manually attaches electronic components to the printed circuit board (specifically, electronic components). When inserting a component lead into a through-hole on a printed circuit board or performing soldering, the operation is easy, and mistakes such as incorrect component insertion are easily noticed. Also, the program can be simplified when the work is automated not by manual work but by an automatic insertion machine or robot. Thereby, the cost at the time of component mounting to a printed circuit board can be held down, and manufacturing cost reduction can be aimed at.

  In addition, when a plurality of circuit boards are stacked and connected in the vertical direction, for example, in order to obtain a target circuit, since all the circuit boards are common, it is possible to prevent the occurrence of mistakes that mix the circuit boards. The assemblability is also good.

In the circuit board according to the present invention, preferably, the printed board has a rectangular shape, and a plurality of lands for the signal input end are arranged along one side of the printed board, and the signal output along the side opposite to the land. It is preferable that a plurality of end lands are arranged.
According to this configuration, since the signal output end and the signal input end are separated from each other on the circuit board, the insulation distance between the input and output can be reduced even when a high voltage is handled as in the booster circuit, for example. It is easy to secure.

Moreover, the circuit unit according to the present invention is a circuit unit using the circuit board having the above preferred configuration,
The circuit boards are alternately switched in each direction so that the input land of the circuit board one level above is positioned immediately above the output land of one circuit board. An output land of the circuit board and an input land of the circuit board on the upper stage are electrically connected via a conductive support member, and the circuit board is formed by a plurality of support members including the conductive support member. It is characterized in that they are held at a predetermined interval.

  In the circuit unit according to the present invention, a plurality of circuit boards on which unit circuits are mounted are stacked. A signal between upper and lower circuit boards (a voltage of each board is used by using a support member for maintaining the stacked structure. Output). This eliminates the need for a cable line for connecting the upper and lower circuit boards, and the electrical connection between the upper and lower circuit boards can be achieved simply by performing, for example, screwing to fix the conductive support member to the circuit board. Yes.

  According to the circuit board according to the present invention, it is possible to suppress the cost of component mounting work on a printed board, and to obtain an inexpensive circuit board. In addition, according to the circuit unit of the present invention, the assembling work for stacking the circuit boards is facilitated, and an inexpensive circuit unit can be obtained. In addition, according to the circuit board and the circuit unit according to the present invention, it is difficult to cause a mistake in mounting the circuit board during the work of stacking and assembling the circuit boards, so that a normal circuit device that operates as designed can be obtained. it can.

The block block diagram of the direct-current high-voltage power supply device which is one Example of the apparatus using the circuit unit which concerns on this invention. FIG. 3 is a circuit diagram of a one-stage voltage doubler rectifier circuit in the DC high-voltage power supply device according to the present embodiment. The external appearance top view of the circuit board which mounted the double voltage rectifier circuit of 1 step | paragraph in the direct-current high voltage power supply device of a present Example. The schematic partial sectional view which shows the attachment structure of the support | pillar member used for the booster circuit unit in the direct-current high-voltage power supply device of a present Example. 1 is an external perspective view of a booster circuit unit in a DC high-voltage power supply device according to the present embodiment. The front view (a) and right view (b) of the booster circuit unit shown in FIG.

  Hereinafter, a DC high voltage power supply device will be described as an example of a device using a circuit board and a circuit unit using the substrate according to the present invention with reference to the accompanying drawings. FIG. 1 is a block diagram of a DC high-voltage power supply device according to this embodiment.

  The DC high-voltage power supply device of this embodiment includes a commercial AC rectifier circuit 2 connected to an external commercial AC power source (for example, AC 200V / 220V single phase) 1, a high-frequency inverter circuit 3, a high-frequency step-up transformer 4, an N-stage A booster circuit unit 5 including (N) voltage doubler rectifier circuits 51 to 5N, and the output voltage of the final voltage doubler rectifier circuit 5N in the booster circuit unit 5 is applied to an external load 6.

  The operation of each part will be schematically described. The AC power supplied from the commercial AC power source 1 is AC-DC converted in the commercial AC rectifier circuit 2, and the DC power obtained by this conversion is converted by the high-frequency inverter circuit 3 into an AC voltage (having a higher frequency than the commercial AC power). High frequency voltage). This high-frequency voltage is boosted to a high-frequency voltage having a predetermined amplitude value by the high-frequency step-up transformer 4. In the high-frequency step-up transformer 4, for example, an amplitude value of about 110 rms can be boosted to about several kVrms. The boosted high-frequency voltage is rectified while being boosted twice in each stage of the voltage doubler rectifier circuits 51 to 5N included in the booster circuit unit 5, and finally, for example, about several tens kV to several tens of kV. Is generated and output from the booster circuit unit 5.

  The N-stage voltage doubler rectifier circuits 51 to 5N constituting the booster circuit unit 5 have the same circuit configuration. Therefore, when describing the voltage doubler rectifier circuit common to the N-stage voltage doubler rectifier circuits 51 to 5N, the voltage doubler rectifier circuit 50 is described in order to clearly indicate that the voltage is common to all the stages. When describing the voltage doubler rectifier circuit at a specific stage, for example, in the first stage, the voltage doubler rectifier circuit 51 and reference numerals 51, 52,.

  FIG. 2 is a circuit diagram of the double voltage rectifier circuit 50 for one stage. As shown in FIG. 2, the booster circuit unit 5 used in the DC high-voltage power supply apparatus of this embodiment is a so-called symmetric cockcroft-Walton circuit, and the double voltage rectifier circuit 50 for one stage has a second input A DC column capacitor 510 connected between the terminal 502 and the second output terminal 505; a first AC column capacitor 508 connected between the first input terminal 501 and the first output terminal 504; and a third input. A second AC column capacitor 509 connected between the end 503 and the third output end 506 and four diodes 511 to 514 connected in a bridge shape so as to form a full-wave rectifier circuit are included. Here, the three capacitors 508, 509, and 510 are all film capacitors, but are not limited thereto.

  In the first-stage voltage doubler rectifier circuit 51 connected to the output of the high-frequency step-up transformer 4, one terminal of the secondary winding 4 b of the transformer 4 is the first terminal as described in the frame indicated by the dotted line in FIG. 2. The other terminal is connected to the third input terminal 503, and the center terminal is connected to the second input terminal 502.

  Although the voltage multiplication operation of the voltage doubler rectifier circuit 50 is well known (see, for example, Patent Document 1), it will not be described in detail, but the charge accumulation of each of the capacitors 508 to 509 through the diodes 511 to 514 is 1 of the input voltage. By repeating every cycle, the input voltage applied to the input terminals 501 to 503 is boosted twice and output. Therefore, the booster circuit unit 5 in which N voltage doubler rectifier circuits 50 (that is, voltage doubler rectifier circuits 51 to 5N) are connected in series boosts the input voltage to the booster circuit unit 5 by 2 × N times. Will be output. The output DC high voltage is taken out from the second output terminal 505 of the final stage voltage doubler rectifier circuit 5N. Note that the DC high-voltage power supply device of this embodiment outputs a negative high voltage, but can be easily changed to output a positive high voltage.

  The one-stage voltage doubler rectifier circuit 50 shown in FIG. 2 corresponds to the unit circuit in the present invention. FIG. 3 is an external top view of a circuit board 500 on which the voltage doubler rectifier circuit 50 is mounted. The reference numerals in FIG. 3 are the same as the reference numerals of the electronic components in the circuit diagram shown in FIG.

  The circuit board 500 is obtained by mounting a plurality of electronic components on a printed board 500P, and a pattern wiring (reference numeral 523 in FIG. 4) made of a metal foil such as copper is formed on the back surface of the printed board 500P. In FIG. 3, the electrical connection between the components realized by the pattern wiring provided on the back surface of the printed board 500P is indicated by a thick dotted line. In addition, lands provided on the back surface of the printed circuit board 500P that are continuously formed on the pattern wiring are also indicated by dotted lines. As is well known, a land is a metal foil portion to which a lead of an electronic component is soldered.

  As shown in FIG. 3, the printed circuit board 500 </ b> P has a rectangular shape when viewed from the top, and has a first input end 501 and a second input end that are substantially straight along one opposing side (the left side in FIG. 3). Lands 501L, 502L, and 503L corresponding to 502 and the third input terminal 503 are formed. Further, lands 504L, 505L corresponding to the first output end 504, the second output end 505, and the third output end 506 are arranged on a substantially straight line along the other side (the right side in FIG. 3) facing each other. 506L is formed. As shown in FIG. 3, the second input end land 502L and the second output end land 505L are located on the center line C at the substantially center in the vertical direction of the printed circuit board 500P. The distance between 502L and the first input end land 501L, the distance between the second input end land 502L and the third input end land 503L, and the distance between the second output end land 505L and the first output end land 504L The distance between the second output end land 505L and the third output end land 506L is the same (distance d). That is, the lands 501L to 506L are arranged symmetrically with respect to the center line C.

  Also, lands 511L1 and 511L2 for inserting a pair of leads of the diode 511, lands 513L1 and 513L2 for inserting a pair of leads of the diode 513, and a pair of leads of the capacitor 508, respectively. The lands 508L1 and 508L2, the lands 512L1 and 512L2 for inserting the pair of leads of the diode 512, the lands 514L1 and 514L2 for inserting the pair of leads of the diode 514, and the pair of leads of the capacitor 509, respectively. The lands 509L1 and 509L2 for insertion are arranged symmetrically with respect to the center line C. Further, since the lands 510L1 and 510L2 for inserting the pair of leads of the capacitor 510 are arranged on the center line C, they are also arranged symmetrically with respect to the center line C. Therefore, the arrangements of the diodes 511 to 514 and the capacitors 508 to 510 are symmetrical with respect to the center line C. Note that the shape and component arrangement of the circuit board 500 corresponding to N stages (N) of voltage doubler rectifier circuits 51 to 5N are exactly the same (that is, common).

  Since the lands for mounting the electronic components are arranged in line symmetry in this way, mistakes are unlikely to occur when these components are manually mounted on the printed circuit board 500P, and the work can be performed efficiently. . Even when component mounting is automatically performed by an automatic insertion machine or the like, a program for such work is simple.

  As shown in FIG. 4, the lands 501L to 506L corresponding to the three input ends 501 to 503 and the three output ends 504 to 506 all have circular through holes 521 having the same inner diameter. The lands 501L to 506L are continuously formed on the front surface, the back surface, and the inner peripheral surface of the through hole 521 of the printed board 500P, and are also continuous with the wiring pattern 523 on the back surface of the printed board 500P. . The lands 501L to 506L are electrical contacts between the circuit on the circuit board 500 and the outside.

  5 is an external perspective view of the booster circuit unit 5 configured by stacking a plurality of voltage doubler rectifier circuits 50 shown in FIG. 3, and FIG. 6 is a front view of the booster circuit unit 5 shown in FIG. It is a right view (b). In this example, the circuit board 500 mounted with the voltage doubler rectifier circuit 50 is stacked in eight stages (that is, N = 8), and an output voltage obtained by multiplying the input voltage by 2 × 8 = 16 is obtained. 5 and 6, the description of the two diodes 511 and 512 among the four diodes 511 to 514 mounted on one circuit board 500 is omitted in order to avoid complicated drawing. doing.

  As described above, on the circuit board 500, the three input end lands 501L to 503L are provided on a substantially straight line, and their intervals are all d. Similarly, the three output end lands 504L to 504L 506L is also provided on a substantially straight line, and the interval between them is d. Therefore, for example, when the circuit board 500 shown in FIG. 3 is rotated by 180 ° about an axis orthogonal to the paper surface and superimposed on the circuit board 500 before the rotation, the circuit board 500 for the first input terminal of the circuit board 500 before the rotation is used. The land 501L, the second input end land 502L, and the third input end land 503L, the third output end land 506L, the second output end land 505L, and the first output end land of the rotated circuit board Each of the first output end lands 504L, the second output end lands 505L, and the third output end lands 506L of the circuit board 500 before rotation is overlapped with the third input end land of the circuit board after rotation. 503L, the second input end land 502L, and the first input end land 501L overlap each other.

  For this reason, when stacking a plurality of stages of circuit boards 500 on which the voltage doubler rectifier circuit 50 is mounted, if the direction of the circuit board 500 immediately above a certain stage of the circuit board 500 is rotated by 180 ° as described above, The input terminal lands 501L to 503L of the upper circuit board 500 are positioned vertically above the output terminal lands 504L to 506L of the voltage doubler rectifier circuit 50 mounted on the circuit board 500 of the certain stage. Can do. Therefore, in the DC high-voltage power supply device of this embodiment, as shown in FIGS. 5 and 6, the orientation of the circuit board 500 is alternately inverted by 180 ° step by step. The conductive support member 530 is disposed between the lands that need to be electrically connected to the circuit board 500 at a certain stage and the circuit board 500 that is one level above, while between the lands that are not electrically connected. In this case, an insulating support member 531 having the same length as that of the conductive support member 530 is disposed. The conductive support member 530 is made of a conductor such as stainless steel, and the insulating support member 531 is made of an insulator such as ceramic.

  Specifically, the circuit board 500 on which the voltage doubler rectifier circuit 51 is mounted at the lowest stage has the input terminals 501 to 503 positioned on the right end side in FIGS. 5 and 6A. The high-frequency voltage boosted by the high-frequency boost transformer 4 is input to the voltage doubler rectifier circuit 51 through the cable lines 533 connected to the input terminals 501 to 503. The circuit board 500 on which the voltage doubler rectifier circuit 52 is mounted in the second stage from the bottom has the input terminals 501 to 503 located on the left end side in FIGS. 5 and 6A. It is located immediately above the output ends 504 to 506 in the circuit board 500 located in the lower stage. Therefore, three conductive support members 530 are interposed between the output ends 504 to 506 of the circuit board 500 positioned at the lowest level and the input ends 501 to 503 of the circuit board 500 positioned at the upper level. Thereby, the electrical connection between the output terminals 504 to 506 and the input terminals 501 to 503 is ensured.

  On the other hand, the input terminals 501 to 503 of the circuit board 500 on which the voltage doubler rectifier circuit 51 is mounted and the output terminals 504 of the circuit board 500 on which the voltage doubler rectifier circuit 52 positioned on the upper stage is mounted. Insulating strut member 531 is interposed between each of ˜506. As a result, the upper stage circuit board 500 is held directly above the lower stage circuit board 500 with the three conductive support members 530 and the three insulating support members 531 as support posts. That is, the conductive support member 530 functions as a wiring for transmitting an electrical signal between the upper and lower circuit boards 500, while holding the distance between the upper and lower circuit boards 500 at a predetermined distance together with the insulating support member 531. However, it functions as a support for fixing and maintaining the structure in which the structures are stacked.

  Similarly, the circuit boards 500 in the third and subsequent stages from the bottom are stacked using the three conductive support members 530 and the three insulating support members 531. In the example of FIGS. 5 and 6, the circuit board 500 on which the voltage doubler rectifier circuit 5N located at the uppermost stage is mounted has the output terminals 504 to 506 on the right end side in FIGS. 5 and 6A. Voltage output cable lines 534 are connected to the output terminals 504 to 506, respectively.

  The conductive support member 530 and the insulating support member 531 have, for example, a columnar shape, a cylindrical shape, a polygonal column shape, a polygonal cylinder shape, and the like. For example, as shown in FIG. An internal thread 53b is formed at the end. Then, as shown in FIG. 4B, the circuit board 500 (printed circuit board 500P) is sandwiched between the two support members 530 and 531 and the one support member inserted through the through holes 521 of the lands 501L to 506L. The male screw 53a is screwed into the female screw 53b of the other column member 530 (or 531), thereby fixing the column members 530 and 531 to each other and fixing the circuit board 500 between the column members 530 and 531. It is said. At this time, the end surface of the conductive support member 530 is in close contact with the lands 501L to 506L, thereby ensuring electrical contact.

  For the circuit board 500 on which the voltage doubler rectifier circuit 5N located at the uppermost stage is mounted, the conductive support member 530 and the insulating support member 531 are fixed from above the circuit board 500 with screws. Further, a leg portion made of an insulating member is attached to the lower surface of the circuit board 500 on which the voltage doubler rectifier circuit 51 located at the lowest stage is mounted.

As described above, in the DC high-voltage power supply device of the present embodiment, the booster circuit unit 5 includes a plurality of circuit boards 500 each mounted with a double voltage rectifier circuit 50 for one stage, a plurality of conductive support members 530, and insulation. It is comprised from the property support | pillar member 531. FIG.
Further, the booster circuit unit 5 configured by stacking the circuit boards 500 as shown in FIG. 5 is molded entirely with a resin material with the cable wires 533 and 534 extending outward. . The resin mold can be molded, for example, by storing the booster circuit unit 5 assembled in a box-shaped mold and pouring the resin material into the mold to be hardened.

  In the direct-current high-voltage power supply device of the present embodiment, it is not necessary to connect the circuit boards 500 with cable lines by configuring the booster circuit unit 5 as described above. Therefore, the trouble of soldering the cable wire to the circuit board or attaching with the screw is reduced, and the assemblability is improved.

  In addition, when manufacturing DC high-voltage power supply devices having different output voltages, it is only necessary to reduce or increase the number of circuit boards 500 to be stacked, so that it is easy to cope with changes in output voltage. In addition, when the electronic components (capacitor and diode) mounted on the circuit board 500 are changed to those having different heights, the lengths of the conductive support member 530 and the insulating support member 531 are changed, and the circuit board 500 is changed. A predetermined distance (insulation distance) may be ensured between the upper surface of the capacitor or diode mounted on the upper surface and the lower surface of the upper circuit board 500. Therefore, it is possible to easily cope with such a change. Further, since the circuit boards 500 to be stacked are made common, it is possible to prevent mistakes such as mistaken circuit boards at the time of assembling, and the assemblability is also good in that respect. Further, not only the manufacturing cost but also the cost required for the substrate design can be reduced.

In addition, the said Example is only an example of this invention, Even if it changes suitably, amends, and is added in the range of the meaning of this invention, it is naturally included in the claim of this application.
For example, the above embodiment is an example in which the circuit board and the circuit unit according to the present invention are used in a high voltage power supply device, but the use of the circuit board and the circuit unit according to the present invention is not limited to this, The present invention can be applied to various circuit devices in which a target circuit is configured by connecting a plurality of stages of the same configuration in series.

5 ... Booster circuit unit 50, 51-5N ... Voltage doubler rectifier circuit 500 ... Circuit board 500P ... Printed circuit board 501-503 ... Input end 504-506 ... Output end 501L-506L, 508L1-514L1, 508L2-514L2 ... Land 508- 510 ... Capacitors 511-514 ... Diode 521 ... Through hole 523 ... Wiring pattern 530 ... Conductive support member 531 ... Insulating support member 533, 534 ... Cable wire

Claims (3)

A circuit board for configuring a target circuit by connecting the same unit circuit in a plurality of stages in series, in which a plurality of electronic components are mounted on a printed circuit board,
The printed circuit board on which one or more unit circuits are mounted has a land for a signal input end, a land for a signal output end, and a land for mounting a plurality of electronic components, and the printed circuit board is half Centered on the center line divided into the outer shape of the printed circuit board and the arrangement of the lands are line symmetric,
A circuit board, wherein a plurality of electronic components are mounted on the printed circuit board, and the arrangement of the electronic components is also symmetrical with respect to the center line. The circuit board according to claim 1,
The printed circuit board is rectangular, and a plurality of the signal input end lands are arranged along one side of the printed circuit board, and a plurality of the signal output end lands are arranged along the opposite side. A circuit board characterized by. A circuit unit using the circuit board according to claim 2,
The circuit boards are alternately switched in each direction so that the input land of the circuit board one level above is positioned immediately above the output land of one circuit board. An output land of the circuit board and an input land of the circuit board on the upper stage are electrically connected via a conductive support member, and the circuit board is formed by a plurality of support members including the conductive support member. A circuit unit characterized in that they are held at predetermined intervals.

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