WO2019012834A1

WO2019012834A1 - Power supply device and noise removal filter

Info

Publication number: WO2019012834A1
Application number: PCT/JP2018/020690
Authority: WO
Inventors: 諒石川; 篤史一瀬
Original assignee: パナソニックＩｐマネジメント株式会社
Priority date: 2017-07-12
Filing date: 2018-05-30
Publication date: 2019-01-17
Also published as: CN210743710U; JP2019021669A

Abstract

A power supply device having a circuit substrate, a cylindrical or columnar metal member, and a ring core. A wiring part is provided to the circuit substrate. The metal member constitutes at least a part of a draw-out wiring part drawn out from the wiring part to the exterior of the circuit substrate. The ring core has a ring-shaped inner peripheral surface. The metal member forms a current path along the center axis of the metal member, and has an outer peripheral surface around the center axis. The ring core surrounds, with the inner peripheral surface thereof, at least a part of the outer peripheral surface of the metal member.

Description

Power supply and noise rejection filter

The present disclosure relates to a power supply device and a noise removal filter.

Power supply devices such as chargers and inverters are known. In this type of power supply device, a ring core (also referred to as a toroidal core) may be disposed in the power line as a noise removal filter or a measure against surge voltage (see, for example, Patent Document 1).

The ring core has a cylindrical shape, and generally, by inserting a wire into the ring, the ring core acts on a magnetic field generated by a current flowing through the wire to form an inductance. The ring core is small in size and easy to obtain a large inductance as compared with a mode in which the wiring is wound around a circuit board to form an inductance, and high performance of noise suppression is possible.

JP, 2009-247092, A

2. Description of the Related Art In recent years, power supply devices have been required to be smaller in size, lower in cost, and higher in power. In response to such a demand, a wiring design has been considered in which a lead-out wiring portion drawn from the wiring portion formed on the circuit board to the outside is constituted by a bus bar which is a flat metal member. In particular, by using a bus bar having a wide plate surface, the wiring can be easily reduced in resistance to cope with a large current.

However, in such a configuration, when the ring core is provided, a wide bus bar is inserted into the ring of the ring core, and a large ring core is required. On the other hand, the inductance value of the ring core required to remove noise or the like may not require an inductance value of a ring diameter large enough to surround a wide bus bar.

As described above, using a ring core larger than necessary for removing noise and the like in order to insert a wide bus bar leads to an increase in the size of the power supply device itself. It also runs counter to the need for lower costs.

The present disclosure has been made in view of the above problems, and it is an object of the present disclosure to provide a power supply device and a noise removal filter that can be miniaturized as the entire device while reducing the resistance of the lead-out wiring portion. .

A power supply device according to the present disclosure includes a circuit board, a cylindrical or cylindrical metal member, and a ring core. A wiring portion is provided on the circuit board. The metal member constitutes at least a part of the lead-out wiring portion drawn from the wiring portion to the outside of the circuit board. The ring core has a ring-shaped inner circumferential surface. The metal member forms a current path along the central axis of the metal member and has an outer peripheral surface around the central axis. The ring core surrounds at least a portion of the outer peripheral surface of the metal member on the inner peripheral surface.

Moreover, the noise removal filter which concerns on this indication has a cylindrical or cylindrical metal member and a ring core which has ring-shaped inner peripheral surface. The metal member constitutes at least a part of the lead-out wiring portion drawn to the outside of the circuit board from the wiring portion formed on the circuit board. The metal member forms a current path along the central axis of the metal member and has an outer peripheral surface around the central axis. The ring core surrounds at least a portion of the outer peripheral surface of the metal member on the inner peripheral surface.

According to the power supply device of the present disclosure, it is possible to reduce the overall size of the device while reducing the resistance of the lead-out wiring portion.

The figure which shows an example of a structure of the power supply device which concerns on embodiment of this indication. Equivalent circuit diagram of the noise removal filter of the power supply device shown in FIG. 1 A perspective view of an inductor portion of a power supply device according to an embodiment of the present disclosure Longitudinal sectional view of the inductor portion shown in FIG. 3 FIG. 3 is a cross-sectional view of the inductor section Side view showing the inductor section shown in FIG. 3 The figure which represented typically the manufacturing process at the time of forming an inductor part in the modification of embodiment of this indication.

Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. In the following description, components having substantially the same functional configuration will be assigned the same reference numerals and redundant description will be omitted.

FIG. 1 is a diagram showing an example of the configuration of a power supply device A according to the present embodiment. FIG. 2 is an equivalent circuit diagram of the noise removal filter AT included in the power supply device A.

The power supply device A has a noise removal filter AT in the power line. A ring core described later is applied to the noise removal filter AT.

Although the circuit configuration of the noise removal filter AT is not particularly limited, it is configured of, for example, a π-type filter. As shown in FIG. 2, the π-type filter includes an inductor portion L, a first capacitor portion C1, and a second capacitor portion C2. In the π type filter, the inductor portion L is connected in series in the high side power line Ha. The first capacitor unit C1 has one end connected to the high side power line Ha and the other end connected to the low side power line Hb on the input side of the inductor unit L. The second capacitor unit C2 has one end connected to the high side power line Ha and the other end connected to the low side power line Hb on the output side of the inductor unit L.

As shown in FIG. 1, in the noise removal filter AT, the first capacitor portion C1 is provided at the output end of the wiring portion of the first circuit board 40 (the front stage of the first wiring portion 41 described later with reference to FIG. 6). It is arranged. The second capacitor portion C2 is disposed at the input end of the wiring portion of the second circuit board 50 (following the second wiring portion 51 described later with reference to FIG. 6). The first capacitor unit C1 and the second capacitor unit C2 are, for example, a film capacitor or an electrolytic capacitor.

In the noise removal filter AT, the inductor portion L is formed by the ring core 10 (see FIGS. 3 to 7) in the power line Ha connecting the wiring portion of the first circuit board 40 and the wiring portion of the second circuit board 50. Be done.

The first circuit board 40 is, for example, a circuit board that constitutes a power conversion circuit (AC / DC conversion circuit, DC / DC conversion circuit, DC / AC conversion circuit, etc.). The first circuit board 40 converts the power input from one end side (the INPUT side in FIG. 1) by switching or the like and outputs the converted power to the other end side.

The second circuit board 50 is, for example, a circuit board provided for disposing the second capacitor portion C2. The second circuit board 50 receives the power output from one end side from the other end side of the first circuit board 40 and removes the noise component from the other end side (the OUTPUT side in FIG. 1) as a load device Output to etc.

Each of the first circuit board 40 and the second circuit board 50 may be a general printed board or a metal board such as an aluminum board.

With such a configuration, the noise removal filter AT removes, for example, switching noise and the like generated in the power conversion circuit formed on the first circuit board 40.

However, the position at which the noise removal filter AT is disposed is arbitrary, and may be disposed on the input side (the INPUT side in FIG. 1) of the first circuit board 40. Further, the noise to be removed by the noise removal filter AT is not limited to the switching noise generated in the power conversion circuit, and may be a noise component flowing into the first circuit board 40 from the load side.

Hereinafter, the configuration of the inductor portion L will be described in detail with reference to FIGS. 3 to 6.

FIGS. 3, 4 and 5 are a perspective view, a longitudinal sectional view and a transverse sectional view, respectively, of the inductor portion L. FIG. 6 is a side view showing the inductor portion L. As shown in FIG. In FIGS. 3 to 5, the second circuit board 50 is omitted for the convenience of description.

3 to 6 show a common orthogonal coordinate system (X, Y, Z) in order to clarify the positional relationship of the respective components. In the following, the positive direction of the Z axis will be described as indicating the upward direction.

The inductor portion L includes a ring core 10 and a first metal member (hereinafter, metal member) 11.

The metal member 11 constitutes at least a part of a lead-out wiring portion drawn from the first wiring portion 41 of the first circuit board 40 to the outside of the first circuit board 40. The metal member 11 electrically connects the first wiring portion 41 formed on the first circuit board 40 and the second wiring portion 51 (see FIG. 6) formed on the second circuit board 50.

The first wiring portion 41 on the first circuit substrate 40 and the second wiring portion 51 on the second circuit substrate 50 are, for example, patterning wirings formed on the respective substrates. The configurations of the first circuit board 40 and the second circuit board 50 are as described above with reference to FIGS. 1 and 2. As described above, the first wiring portion 41 is a wiring portion downstream of the first capacitor portion C1, and the second wiring portion 51 corresponds to a wiring portion upstream of the second capacitor portion C2.

A current flows in the metal member 11 as shown by the dotted line in FIG. The current flowing through the metal member 11 is a direct current or alternating current flowing in the power line Ha.

The metal member 11 has a cylindrical or cylindrical shape, and forms a current path along the direction of the central axis (the alternate long and short dash line M in FIG. 4). In other words, the cut surface orthogonal to the current flow direction of the metal member 11 has a circular shape or an annular shape, as shown in FIG. Such a shape of the metal member 11 realizes a reduction in the electrical resistance of the metal member 11 in the ring core 10. However, only a part of the integrally formed member may have such a cylindrical or cylindrical shape. In FIGS. 4 and 5, the central axis of the metal member 11 and the central axis of the ring core 10 are the same axis.

The outer peripheral surface 11L around the central axis of the metal member 11 is enclosed in the ring core 10 along the ring-shaped inner peripheral surface 10K of the ring core 10. In other words, the outer circumferential surface 11L and the inner circumferential surface 10K are disposed concentrically with a gap therebetween.

The first end of the metal member 11 is connected to a first wiring portion 41 formed on the first circuit board 40. The first wiring portion 41 is provided on the substrate surface 40S of the first circuit board 40. The metal member 11 is erected from the substrate surface 40S of the first circuit substrate 40 in the vertical direction. That is, the metal member 11 extends in the direction perpendicular to the substrate surface 40S of the first circuit substrate 40.

Further, the bus bar 30 which is a flat second metal member is connected to the second end of the metal member 11. As shown in FIG. 3, the width of the plate surface of the bus bar 30 is formed wide. Thereby, the bending process of the bus bar 30 is facilitated while securing the cross-sectional area of the bus bar 30 in order to cope with a large current.

The first end of the metal member 11 is connected to the first wiring portion 41 of the first circuit board 40 by, for example, solder or the like. Further, the second end of the metal member 11 is fastened to the bus bar 30 by, for example, a bolt 30 a or the like, and connected to the bus bar 30. Thus, the second end of the metal member 11 has a structure connected to the bus bar 30. Then, the bus bar 30 extends in the horizontal direction with respect to the substrate surface 40S of the first circuit board 40 from the connection position with the metal member 11, and is connected to the second wiring portion 51 of the second circuit board 50. However, the connection method of the metal member 11 and another member can be changed suitably.

As a material of the metal member 11, any material can be used as long as it is a metal having high conductivity. For example, it is formed of an aluminum material, a copper material or a magnesium material, or an alloy containing at least one of these metals. That is, the metal member 11 contains a metal selected from the group consisting of aluminum, copper and magnesium.

The outer diameter of the outer peripheral surface 11L of the metal member 11 is shorter than the length (longest distance) of the bus bar 30 in the width direction. In other words, the inner diameter of the inner circumferential surface 10K of the ring core 10 is shorter than the length (longest distance) of the bus bar 30 in the width direction. More preferably, when the inner diameter of the inner peripheral surface 10K of the ring core 10 is 1 (100%), the outer diameter of the outer peripheral surface 11L of the metal member 11 is 0.8 (80%) or more. By this, the occupied area of the cross-sectional area of the metal member 11 in the ring of the ring core 10 can be maximized, and both the miniaturization of the ring core 10 and the resistance reduction of the metal member 11 can be realized. The upper limit of the outer diameter of the outer peripheral surface 11L of the metal member 11 is a value that allows the metal member 11 to be surrounded by the ring-shaped inner peripheral surface 10K of the ring core 10.

The ring core 10 has an undivided cylindrical shape, and surrounds the outer circumferential surface 11L of the metal member 11 with a ring-shaped inner circumferential surface 10K along the path of the current flowing inside. That is, the metal member 11 forms a current path along the central axis M of the metal member 11, and has the outer peripheral surface 11L around the central axis M, and the ring core 10 has the inner peripheral surface 10K. At least a part of the outer circumferential surface 11L is enclosed. The ring core 10 acts on an annular magnetic field generated by a current flowing through the metal member 11 to form an inductance. In addition, the above-mentioned non-dividing has shown that it does not exhibit a cylindrical shape by joining a several core.

The ring core 10 removes the noise component contained in the current flowing through the metal member 11 by such an inductance. The action of noise removal by the ring core 10 is due to the current limiting effect by the high impedance to the noise component and the magnetic loss to the noise component. Thus, the metal member 11 and the ring core 10 constitute a noise removal filter AT.

The material for forming the ring core 10 may be any magnetic material, and for example, ferrite or cobalt-based amorphous may be used.

An outer peripheral surface around the central axis of the ring core 10 is surrounded by an insulating case 10 a. By providing the case 10a, the insulation distance required to secure the insulation of the ring core 10 can be shortened, and the surplus space can be omitted. The ring core 10 is fixed to the first circuit board 40 using an adhesive 10 b and the like together with the case 10 a.

As described above, the power supply device A has a configuration in which a part of the lead-out wiring portion is formed by the cylindrical or cylindrical metal member 11 and the metal member 11 is concentrically disposed in the ring-shaped internal space of the ring core 10 Have. Therefore, according to the power supply device A, it is possible to realize the miniaturization of the ring core 10 and the miniaturization of the power supply device itself while reducing the resistance of the lead-out wiring portion.

Further, in the power supply device A, the metal member 11 is disposed so as to stand vertically from the substrate surface 40S of the first circuit board 40. Therefore, according to the power supply device A, the occurrence of a short circuit or the like between the first wiring portion 41 and the lead wiring portion of the first circuit board 40 can be suppressed.

Further, the power supply device A has a configuration in which the bus bar 30 is connected to the second end of the metal member 11. Therefore, according to the power supply device A, the power line can be freely routed.

(Modification)
The power supply device A is particularly suitable when using a metal substrate (for example, an aluminum substrate) as the first circuit substrate 40. The metal substrate is obtained by forming an insulating film and a wiring pattern on a metal plate as a base, and is excellent in heat dissipation.

FIG. 7 is a diagram schematically showing a manufacturing process when forming the inductor portion L. As shown in FIG.

In the case of a metal substrate such as an aluminum substrate, the boss B1 is provided on the first circuit substrate 40 formed of a metal substrate in order to ensure insulation between the underlying metal material and a part of the mounted components (for example, microcomputer). In some cases, the mounting component B2 may be provided on the boss B1.

The metal member 11 can be made of the same material as the boss B1 of this type, and can be formed on the first circuit board 40 simultaneously with the formation of the boss B1. By this, it is possible to form the above-mentioned inductor part L by a simple manufacturing process.

(Other embodiments)
The present disclosure is not limited to the above embodiment, and various modifications can be considered.

In the said embodiment, noise removal filter AT was shown as an example of a target to which the inductor part L comprised with the ring core 10 and the metal member 11 is applied. However, the above-described inductor portion L can be applied to applications such as surge voltage suppression and smoothing of direct current.

In the above embodiment, the first wiring portion 41 and the second circuit board 50 formed on the first circuit board 40 are an example of the position where the inductor portion L constituted by the ring core 10 and the metal member 11 is provided. The position which electrically connects with the 2nd wiring part 51 formed in these was shown. However, as long as it is a part of the lead-out wiring portion drawn from the first wiring portion 41 of the first circuit board 40 to the outside of the first circuit board 40, it may be disposed at other positions. For example, the inductor portion L may be formed as a part of the lead-out wiring portion for supplying power to the drive motor from the first wiring portion 41 of the first circuit board 40.

The specific examples of the present disclosure have been described above in detail, but these are merely examples and do not limit the scope of the claims. The art set forth in the claims includes various variations and modifications of the specific examples illustrated above.

A Power supply device AT Noise removal filter L Inductor portion C1 First capacitor portion C2 Second capacitor portion Ha, Hb Power line 10 Ring core 10a Case 10b Adhesive material 10K Inner circumferential surface 11 Metal member 11L Outer circumferential surface 30 Busbar 30a Bolt 40 First circuit Substrate 40S Substrate surface 41 First wiring portion 50 Second circuit substrate 51 Second wiring portion B1 Boss B2 Mounting parts

Claims

A first circuit board having a substrate surface provided with a first wiring portion;
A cylindrical or cylindrical first metal member constituting at least a part of a lead-out wiring portion drawn from the first wiring portion to the outside of the first circuit board;
A ring core having a ring-like inner circumferential surface;
The first metal member forms a current path along the central axis of the first metal member, and has an outer peripheral surface around the central axis,
The ring core surrounds at least a portion of the outer peripheral surface of the first metal member on the inner peripheral surface.
Power supply.
The first metal member has a first end connected to the first wiring portion, and extends in a direction perpendicular to the substrate surface of the first circuit substrate.
The power supply device according to claim 1.
The first metal member has a second end opposite to the first end, and the second end has a structure connected to a flat second metal member.
The power supply device according to claim 2.
It further comprises a second circuit board provided with a second wiring portion,
The lead-out wiring portion is connected to the second wiring portion of the second circuit board outside the first circuit board.
The power supply device according to claim 1.
The first metal member includes a metal selected from the group consisting of aluminum, copper, and magnesium.
The power supply device according to claim 1.
The ring core further has an outer circumferential surface around a central axis of the ring core,
The power supply device further includes an insulating case surrounding the outer peripheral surface of the ring core.
The power supply device according to claim 1.
The first circuit board is a metal board,
The power supply device according to claim 1.
A power conversion circuit is provided on the first circuit board,
The first wiring unit is an input unit or an output unit of the power conversion circuit.
The power supply device according to claim 1.
A cylindrical or cylindrical metal member constituting at least a part of a lead-out wiring portion drawn from the wiring portion formed on the circuit board to the outside of the circuit board;
A ring core having a ring-like inner circumferential surface;
The metal member forms a current path along the central axis of the metal member and has an outer peripheral surface around the central axis,
The ring core surrounds at least a portion of the outer peripheral surface of the metal member on the inner peripheral surface.
Noise removal filter.