JP2015002320A - Heat radiation unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation unit capable of changing an air-cooling system without interrupting operation of an electronic apparatus.SOLUTION: The heat radiation unit which is mounted in a cabinet rack adjacently to an electronic apparatus comprises: a frame fixed to the cabinet rack; a cable accommodation part provided in a space formed from an inner side surface of the frame for accommodating a cable connected to the electronic apparatus; and a shared accommodation part which is provided in the space formed from the inner side surface of the frame for accommodating a convection guide plate used for a natural air-cooling system or a fan unit to be used for a forced air-cooling system. In the case where either the convection guide plate or the fan unit is accommodated in the shaped accommodation part in accordance with a change of the air-cooling system, in the space formed from the inner side surface of the frame, the cable accommodation part and the shared accommodation part are separated spatially.

Description

  The present invention relates to a heat dissipation unit that dissipates heat generated from an electronic device.

  Prior art relating to a heat dissipation structure of an electronic device includes Patent Documents 1 to 5.

  The electronic device accommodated in the cabinet rack needs to be appropriately arranged according to the installation environment temperature of the accommodated cabinet rack and the heat radiation specification of the electronic device accommodated in the cabinet rack. Also, when arranging multiple electronic devices, to prevent the exhaust heat of one electronic device from exceeding the operating environment temperature of the other electronic device, place the other electronic device outside the exhaust area of the one electronic device. It is necessary to install it, to induce the exhaust heat of one electronic device outside the area of other electronic devices, or to suppress the temperature rise of the exhaust heat of one electronic device within the operating environment temperature of other electronic devices .

  Heat dissipation in the cabinet rack is performed by exchanging heat generated in the apparatus with air around the heat generating portion and exhausting the generated air outside the apparatus. Typical heat dissipation methods include a natural air cooling method and a forced air cooling method.

  The natural air cooling method is a method in which heat in an electronic device is naturally exhausted outside the electronic device casing by using buoyancy due to a rise in temperature of air to be exhausted. The exhaust temperature rise is higher than that of forced air cooling described later. Therefore, to prevent the exhaust heat of the electronic equipment from flowing into the area of other electronic equipment accommodated in the same cabinet rack, the exhaust heat is induced toward the rear area in the cabinet rack using the convection induction plate, and the intake air is sucked. It has a structure that takes in from the front side and flows into the electronic equipment. In general, the convection induction plate is incorporated in an electronic device casing as a single structure, or is housed in a casing (ventilation shelf) independent of the electronic equipment and mounted between the electronic equipment in the cabinet rack. Is.

  The forced air cooling method is a method for forcibly exhausting the heat generated in the electronic device to the outside of the electronic device casing using a fan. The exhaust direction can be arbitrarily set by adjusting the direction of the fan or using a convection guide plate in combination. The fan that becomes the forced air cooling unit is incorporated in the electronic device casing as an integral structure, or is housed in a casing (fan shelf) independent of the electronic device and mounted at an arbitrary position in the cabinet rack. Is common.

  The forced air cooling method includes a chimney method and an individual intake / exhaust method. The chimney method is a method in which the air flow generated by the fan is shared with other electronic devices accommodated in the same cabinet rack. Thereby, the heat generation of the entire electronic device housed in the cabinet is suppressed, and the temperature of each electronic device is suppressed within the allowable ambient environment temperature range. The individual intake / exhaust method is a method in which an electronic device is individually provided with a fan and a convection guide plate so that air flowing in the electronic device is thermally blocked from other electronic devices and intake / exhaust is made an independent flow path.

  In the related art, when a high heat generation is predicted in the future, the forced air cooling method has been selected in advance. On the other hand, the air cooling method can be changed as necessary during operation of the electronic device. In order to change the air cooling method, it is necessary to replace the convection induction plate and the forced air cooling unit.

Re-specialized WO2007 / 123140 JP2007-266521 JP 2000-277654 A JP-A-11-307969 JP 06-013777 A

  However, the heat dissipation structure for electronic devices in the related art has the following problems. In other words, when the convection guide plate or forced air cooling unit is incorporated in the apparatus as an integral structure, there is a problem that when changing the air cooling method, the operation of the electronic device must be interrupted and the electronic device itself must be replaced. It was. Even if the convection guide plate or forced air cooling unit is independent from the electronic equipment, such as a ventilation shelf or a fan shelf, the ventilation shelf or the fan shelf exists in a pair with the electronic equipment. In general, it is also used to accommodate and fix cables and optical fibers connected to electronic devices. Therefore, when exchanging the ventilation shelf and the fan shelf, there is a problem in that the cable connected to the electronic device must be removed and the operation of the electronic device must be interrupted.

  The objective of this invention is providing the thermal radiation unit which solves the above-mentioned subject.

  The heat dissipating unit of the present invention is a heat dissipating unit mounted on a cabinet rack adjacent to an electronic device, and is provided in a space formed by a frame fixed to the cabinet rack and an inner surface of the frame. A cable housing portion for housing a cable to be connected, and a common housing portion that is provided in a space formed by the inner surface of the frame and that houses a convection induction plate used in a natural air cooling system or a fan unit used in a forced air cooling system. When either the convection guide plate or the fan unit is accommodated in the shared accommodating portion according to the change in the air cooling method, the cable accommodating portion and the shared accommodating portion in the space formed on the inner side surface of the frame Are characterized by spatial separation.

  ADVANTAGE OF THE INVENTION According to this invention, the thermal radiation unit which can change an air cooling system, without interrupting operation | movement of an electronic device can be provided.

It is a figure which shows the external appearance of the cabinet rack 10 concerning 1st Embodiment. It is a figure which shows the external appearance of the electronic device 20 and the thermal radiation unit 30 concerning 1st Embodiment. It is a figure which shows the structure of 30 A of thermal radiation units at the time of employ | adopting the natural air cooling system concerning 1st Embodiment. It is a figure which shows the structure of the thermal radiation unit 30B at the time of employ | adopting the forced air cooling system concerning 1st Embodiment. It is a figure which shows an example of the thermal radiation path | route in the cabinet rack 10 concerning 1st Embodiment. It is a figure which shows the structure of 40 A of thermal radiation units at the time of employ | adopting the natural air cooling system concerning 2nd Embodiment. It is a figure which shows the structure of the thermal radiation unit 40B at the time of employ | adopting the forced air cooling system concerning 2nd Embodiment. It is sectional drawing of 40 A of thermal radiation units. 4 is a front view of the heat dissipation unit 40. FIG. It is a figure which shows 40 A of thermal radiation units in the state in which the convection induction board 43 was accommodated. It is a figure which shows the thermal radiation unit 40B of the state in which the fan unit 44 was accommodated.

[First Embodiment]
[Configuration / Operation]
FIG. 1 is an external view of a cabinet rack 10 according to the first embodiment.

  FIG. 2 is a diagram illustrating the external appearance of the electronic device 20 and the heat dissipation unit 30 according to the first embodiment.

  The heat radiating unit 30 includes a heat radiating unit 30A or a heat radiating unit 30B in accordance with the change of the air cooling system.

  FIG. 3 is a diagram illustrating a configuration of the heat dissipation unit 30A when the natural air cooling method is employed. FIG. 4 is a diagram illustrating a configuration of the heat dissipation unit 30B when the forced air cooling method is employed. In FIG. 3 and FIG. 4, the same components are described with the same reference numerals.

  The heat radiating units 30 </ b> A and 30 </ b> B according to the first embodiment include a frame 31, a cable housing part 310, and a shared housing part 313.

  The heat radiating units 30 </ b> A and 30 </ b> B are provided adjacent to the electronic device 20 that is expected to generate heat, and are mounted on the cabinet rack 10 by fixing the frame 31 to the column of the cabinet rack 10.

  The cable housing portion 310 is provided in a space formed on the inner surface of the frame. Cables 310 such as cables connected to the electronic device 20 and optical fibers are accommodated in the cable accommodation unit 310.

  The shared accommodating portion 313 is provided in a space formed on the inner side surface of the frame, and accommodates either the convection guide plate 33 or the fan unit 34 according to the change of the air cooling method.

  The convection guide plate 33 and the fan unit 34 are configured to radiate heat generated from the electronic device 20. The convection guide plate 33 is used in a natural air cooling system, and has a function of guiding heat generated from the electronic device 20 to a rear region in the cabinet rack 10. The fan unit 34 is used in a forced air cooling system and has a function of forcibly exhausting heat generated from the electronic device 20. The fan unit 34 includes at least one fan. FIG. 5 is a diagram illustrating an example of a heat dissipation path in the cabinet rack 10 when the natural air cooling method is employed.

  The shared accommodation portion 313 accommodates the convection guide plate 33 when the natural air cooling method is adopted, and accommodates the fan unit 34 when the forced air cooling method is adopted.

  When either the convection guide plate 33 or the fan unit 34 is accommodated in the shared accommodating portion 313 in accordance with the change of the air cooling method, the cable accommodating portion 310 and the shared accommodating portion 313 are formed in the space formed by the inner surface of the frame 31. Are spatially separated.

[Function and effect]
According to the heat dissipation units 30A and 30B according to the first embodiment, when either the convection guide plate 33 or the fan unit 34 is accommodated in the shared accommodation portion 313, the cable is formed in the space formed on the inner side surface of the frame 31. The accommodating part 310 and the shared accommodating part 313 are spatially separated. Thereby, when the convection guide plate 33 and the fan unit 34 are replaced, they do not interfere with the cables. As a result, the convection guide plate 33 and the fan unit 34 can be exchanged without removing the cables connected to the electronic device 20 during operation of the electronic device 20. That is, the air cooling method can be changed without interrupting the operation of the electronic device 20.

[Second Embodiment]
[Configuration / Operation]
Similar to the first embodiment, an electronic device and a heat dissipation unit (ventilation shelf) 40 are mounted on the cabinet rack. An electronic device is any electronic device that is expected to generate heat. The heat radiating unit 40 includes a heat radiating unit 40A or a heat radiating unit 40B according to the change of the air cooling system.

  FIG. 6 is a diagram showing a configuration of the heat radiating unit 40A when the natural air cooling method is adopted.

  FIG. 7 is a diagram illustrating a configuration of the heat dissipation unit 40B when the forced air cooling method is employed.

  FIG. 8 is a cross-sectional view along A-A ′ in FIG. 6. In FIG. 8, configurations other than the cable tray 412 and the convection guide plate 43 are omitted.

  FIG. 9 is a front view of the heat dissipation unit 40.

  The heat radiation unit 40 is fixed to the cabinet rack by fixing the frame 41 to the column of the cabinet rack by the flange 42.

  The frame 41 includes a left and right side plate 411 and a cable tray 412 that connects the left and right side plates.

  As shown in FIG. 8, the cable tray 412 includes a horizontal plate 412a and an intake panel 412b. The horizontal plate 412a has an area that can accommodate cables connected to an electronic device such as an optical fiber. 412b is a plate-like intake panel provided perpendicular to the horizontal plate 412a. As shown in FIG. 9, an intake port 412c for taking in air and a cable introduction port 412e for introducing cables are provided at both ends of the intake panel 412b. Further, the cable tray 412 can be equipped with a clamp 412d capable of holding a cable.

  A cable duct 414, a guide rail 415, and a flange 416 are provided on the side plate 411 of the frame 41. The cable is introduced into the cable introduction port 412e through the cable duct 414 from the back of the cabinet and is accommodated in the cable tray 412. And it is wound around the clamp 412d and connected to the front surface of the electronic device arranged on the upper part of the heat dissipation unit. The clamp 412d is a rectangular frame, and the cable 50 is prevented from protruding from the cable tray 412 by passing the cable 50 through the frame. Several clamps 412d (three and four in FIGS. 6 and 7) are arranged in a circle on the cable tray 412, and the cable 50 is passed through the frame of the clamp 412d one to several times. Thereby, the length of the cable 50 from the cable tray 412 to the front surface of the electronic device is adjusted to perform extra length processing.

  The cable tray 412 and the cable duct 414 correspond to the cable housing portion 310 in the first embodiment.

  The guide rail 415 is provided on the side plate 411 so as to be positioned above the cable duct 414, and holds the convection guide plate 43 or the fan unit 44 when the convection guide plate 43 or the fan unit 44 is inserted from the back of the cabinet. It has the function to do.

  The flange 416 is a ledge used to fix the convection guide plate 43 or the fan unit 44 to the frame 41.

  The shared accommodating portion 413 is provided in a space formed on the inner side surface of the frame, and accommodates either the convection guide plate 43 or the fan unit 44 according to the change of the air cooling method as described later.

  When either the convection guide plate 43 or the fan unit 44 is accommodated in the shared accommodating portion 413 according to the change of the air cooling method, the cable tray 412 and the cable duct 414 are commonly accommodated in the space formed on the inner surface of the frame 41. The portion 413 is spatially separated.

  The convection guide plate 43 and the fan unit 44 are configured to dissipate heat generated from the electronic device.

  The convection guide plate 43 is a flat plate. Further, the convection guide plate 43 is used in a natural air cooling system and has a function of guiding heat generated from the electronic device to a back region in the cabinet rack.

  The accommodation of the convection guide plate 43 in the shared accommodation portion 413 will be described. The convection guide plate 43 is inserted from the upper part of the flange 416 provided on the frame 41, and the front end side 43 a of the convection guide plate 43 is moved to the cable tray 412 side while being placed on the guide rail 415. Then, as shown in FIG. 8, the rear end side of the cable tray 412 and the front end side 43 a of the convection guide plate 43 are accommodated. In the present embodiment, the rear end side 43b is positioned above the front end side 43a, and the convection guide plate 43 is accommodated so as to have an angle with respect to the horizontal plane. This is to efficiently exhaust the heat generated from the electronic device. At both ends of the rear end side 43b, flanges 43c facing the flange 416 are provided (FIG. 6). After accommodating the convection guide plate 43, the flange 416 and the flange 43c are fixed with screws. FIG. 10 is a diagram showing the heat radiating unit 40 </ b> A in a state where the convection guide plate 43 is housed in the shared housing portion 413. In FIG. 10, an optical fiber bundle 50 ′ passes through the cable duct 414.

  The fan unit 44 includes a hexahedral frame 441 and accommodates at least one fan inside the frame 441. The fan unit 44 is used in a forced air cooling system and has a function of forcibly exhausting heat generated from the electronic device.

  The accommodation of the fan unit 44 in the shared accommodation unit 413 will be described. In a state where the frame 441 of the fan unit 44 is placed on the guide rail 415, the frame 441 is moved along the guide rail 415 toward the cable tray 412 to be accommodated in the shared accommodation portion 413. FIG. 11 is a diagram illustrating the heat dissipation unit 40 </ b> B in a state where the fan unit 44 is accommodated in the shared accommodation portion 413.

[Function and effect]
According to the heat radiating units 40A and 40B of the electronic device according to the second embodiment, when either the convection guide plate 43 or the fan unit 44 is accommodated in the shared accommodating portion 413 according to the change of the air cooling method, the frame 41 The cable tray 412, the cable duct 414, and the shared housing portion 413 are spatially separated in the space formed by the inner surface of the cable. Further, the convection guide plate 43 or the fan unit 44 is accommodated in the shared accommodation portion 413 while being placed on the guide rail 415. Therefore, when the convection guide plate 43 and the fan unit 44 are replaced, the convection guide plate 43 or the fan unit 44 and the cables accommodated in the cable duct 414 below the guide rail 415 do not interfere with each other. As a result, the convection guide plate 43 and the fan unit 44 can be exchanged without removing the cables connected to the electronic device during operation of the electronic device. That is, the air cooling method can be changed without interrupting the operation of the electronic device.

[Modification 1]
In the above-described embodiment, an example of a method of air cooling in a direction (push type) in which exhaust heat is blown to an electronic device to be cooled has been described. In this case, the heat dissipation unit (ventilation shelf) is mounted under the electronic device in the cabinet. Therefore, the cables connected to the front surface of the electronic device are introduced from the cable tray of the heat dissipation unit.

  On the other hand, in the case of a method of air cooling in the sucking direction (pull type) with respect to the electronic device, the heat radiating unit (ventilation shelf) is mounted on the electronic device to be cooled. In this case, the cables connected to the front surface of the electronic device are introduced into the cable tray of the heat dissipation unit from above the communication device. When cables are accommodated under the communication device, a cable accommodating portion can be provided under the communication device separately from the heat dissipation unit.

[Modification 2]
A plurality of shared accommodation units can be provided in the same frame. That is, a plurality of shared accommodation portions are provided so that a shared accommodation portion that accommodates the convection guide plate and a shared accommodation portion that accommodates the fan unit coexist in one frame. As a result, the convection guide plate and the fan unit can be partially exchanged according to the heat generated in the mounting slot of the plug-in unit accommodated in the electronic device. That is, it is possible to partially set the natural air cooling method and the forced air cooling method.

  As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, Of course, unless it deviates from the meaning of this invention, another modification and an application example are included. .

10 cabinet rack 20 electronic device 30, 30A, 30B, 40, 40A, 40B heat dissipation unit 31, 41 frame 33, 43 convection guide plate 34, 44 fan unit 42 flange 43a front end side of convection guide plate 43b rear end of convection guide plate Side 43c Flange 50 Cable 50 'Bundle of optical fibers 310 Cable housing portion 313, 413 Shared housing portion 411 Side plate 412 Cable tray 412a Horizontal plate 412b Air intake panel 412c Air intake port 412d Clamp 412e Cable introduction port 414 Cable duct 415 Guide rail 416 Flange 441 Fan Unit frame

Claims (6)

A heat dissipation unit mounted on a cabinet rack next to an electronic device,
A frame fixed to the cabinet rack;
A cable housing portion that is provided in a space formed by an inner surface of the frame and that accommodates a cable connected to the electronic device;
A convection guide plate used in a natural air cooling system or a fan housing unit used in a forced air cooling system provided in a space formed by the inner surface of the frame;
When either the convection guide plate or the fan unit is accommodated in the shared accommodating portion in accordance with the change in the air cooling method, the cable accommodating portion and the shared accommodating in a space formed on the inner side surface of the frame The heat dissipation unit is characterized in that the part is spatially separated.   The heat dissipation unit according to claim 1, wherein a guide rail that supports the convection guide plate or the fan unit when the convection guide plate or the fan unit is accommodated is provided on an inner surface of the frame.   The heat radiating unit according to claim 1, comprising a plurality of the shared accommodating portions. The shared accommodation portion is provided in the center of the space formed by the inner surface of the frame,
The heat dissipation unit according to any one of claims 1 to 3, wherein the cable housing portion is provided outside the shared housing portion.   The cable housing portion is provided on a surface of the frame that is provided on a surface along the insertion direction of the convection guide plate or the fan unit, and on a surface that is perpendicular to the insertion direction of the convection guide plate or the fan unit of the frame. The heat radiating unit according to any one of claims 1 to 4, comprising a cable tray provided.   The heat radiating unit according to claim 5, wherein the cable tray includes a plurality of clamps for holding a cable that passes through the cable duct, and an excess length portion of the cable is adjusted by holding with the plurality of clamps.