TW201301006A - Heat dissipation system - Google Patents

Abstract

A heat dissipation system includes a base plate, a first side plate perpendicular to the base plate, a back plate perpendicular to the first side plate and a front plate perpendicular to the first side plate. The base plate has a motherboard attached thereon adjacent to the back plate. A first heat source is fixed on the motherboard. The base plate has a second heat source attached thereon adjacent to the front plate. An air guiding apparatus is fixed on the first heat source. The air guiding apparatus includes a first air inlet opening, a second air inlet opening and a first air outlet opening. The front plate defines a second air outlet opening and a third air outlet opening thereon. Cool air from outside is drawn into the air guiding apparatus via the first air inlet opening and the second air inlet opening. The cool air is blown through the first heat source and the second heat source and blown out of the system via the second air outlet opening and the third air outlet opening.

Description

cooling system

The invention relates to a heat dissipation system, in particular to a computer chassis heat dissipation system.

Industrial computers are mainly used for personal computers that are designed for industrial use and can be used as industrial controllers. Industrial computers focus on stability and reliability in different environments, so the standard values required for industrial computers are subject to strict specifications and scalability. Industrial computers are generally used in harsh environments with high temperatures and high humidity, so they have high requirements for heat dissipation. When the industrial computer is placed at different angles, the heat dissipation channel is closed, which affects the heat dissipation performance.

In view of the above, it is necessary to provide a heat dissipation system with high heat dissipation performance.

A heat dissipation system includes a bottom plate, a first side plate perpendicular to the bottom plate, a rear plate perpendicular to the first side plate, and a front plate perpendicular to the first side plate, wherein the bottom plate is mounted with a computer main board near the rear plate a first heating element is disposed on the computer motherboard, and a second heating element is disposed on the bottom plate adjacent to the front plate. The first heating element is provided with an air guiding device, and the air guiding device defines a first An air inlet opening, a second air inlet opening and a first air outlet opening, wherein the front panel defines a second air outlet opening and a third air outlet opening, and the airflow from the heat dissipation system passes through the first air inlet opening and The second air inlet opening enters the air guiding device, and sequentially flows through the first heat generating component and the second heat generating component through the first air outlet opening, and then flows out from the second air outlet opening and the third air outlet opening, respectively.

Compared with the prior art, the heat dissipation system introduces the wind flow from the heat dissipation system into the air guiding device through the first air inlet opening and the second air inlet opening on the air guiding device, and through the first air outlet opening After flowing through the first heating element and the second heating element in sequence, respectively flowing out from the second air outlet opening and the third air outlet opening, and when one of the first air inlet opening and the second air inlet opening is closed, the heat is dissipated The wind flow outside the system can also flow into the air guiding device from another unsealed air inlet opening.

Referring to FIG. 1 and FIG. 2 , a preferred embodiment of the heat dissipation system of the present invention includes a computer case 10 and a wind guide 20 mounted in the computer case 10 . The computer case 10 includes a bottom plate 11, a first side plate 12 and a second side plate 13 perpendicular to the bottom plate 11, a plate 14 perpendicular to the first side plate 12 and the second side plate 13, and a vertical plate The side panel 12 and the second side panel 13 are front panel 15.

A computer motherboard 30 is mounted on the bottom plate 11 adjacent to the rear panel 14. A first heating element 40 is mounted on the motherboard 30. A first fan 41 is mounted on the first heating element 40. A second heating element 50 is mounted on the bottom plate 11 adjacent to the front plate 15. The first side panel 12 defines a plurality of first air inlet openings 121, and a plurality of second air inlet openings 141 are defined in the rear panel 14, and a plurality of third air inlet openings 131 are defined in the second side panel 13. A second air outlet opening 151 is defined in the front panel 15 relative to the first heat generating component 40. A second fan (not shown) is disposed in the computer chassis 10 adjacent to the second air outlet opening 151. A third air outlet opening 152 is defined in the front panel 15 relative to the second heat generating component 40. A third fan (not shown) is disposed in the computer chassis 10 near the third air outlet opening 152.

The air guiding device 20 includes a bottom wall 21, a front wall 22 perpendicular to the bottom wall 21, and a rear wall 23 perpendicular to the bottom wall 21. A first air inlet opening 221 is defined between the front wall 22 and the rear wall 23 with respect to the plurality of first air inlet openings 121. A second air inlet opening 231 is defined in the rear wall 23 with respect to the plurality of second air inlet openings 141. A third air inlet opening 241 is defined between the front wall 22 and the rear wall 23 with respect to the plurality of third air inlet openings 131. A first air outlet opening 211 is defined in the bottom wall 21 relative to the first fan 41.

A wind shield 25 is disposed in the air inlet device 221, the second air inlet opening 231, and the third air inlet opening 241, respectively. Each wind shield 25 includes a mounting bracket 251 and a foam 252 mounted on the mounting bracket 251. The holder 251 includes a first surface and a second surface. The fixing frame 251 has a plurality of bent portions 2511 extending perpendicularly from the first surface, and the foam 252 is clamped between the plurality of bent portions 2511. A handle 2512 extends perpendicularly from the second surface of the fixing frame 251, and the handle 2512 is pulled upward to mount the fixing frame 251 to the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening. Within 241. A plurality of guiding portions 26 parallel to each other are protruded from the air guiding device 20 on the two sides of the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening 241. Each of the fixing frames 251 slides between the adjacent two parallel guiding portions 26 into the corresponding first air inlet opening 221, second air inlet opening 231 and third air inlet opening 241. The distance between the adjacent two parallel guiding portions 26 is equal to the thickness of the fixing frame 251. The air guiding device 20 is fixed to the computer case 10 by screwing or riveting.

Referring to FIG. 3, in operation, the first fan 41, the second fan, and the third fan start to rotate. When the computer case 10 is placed with the first side plate 12 as a supporting surface, the first air inlet opening 121 is closed at this time. The handle 2512 on the holder 251 is pulled upward to remove the windshield 25 in the second inlet opening 231 and the third inlet opening 241. The airflow from the lower temperature outside the heat dissipation system enters the air guiding device 20 through the second air inlet opening 141, the third air inlet opening 131, the second air inlet opening 231 and the third air inlet opening 241, and The first fan 41 accelerates through the first heating element 40 via the first air outlet opening 211. The lower temperature airflow absorbs the heat of the first heat generating component 40 and then flows through the second heat generating component 50, and then accelerates the heat dissipation system through the third air outlet opening 152 under the action of the third fan. The lower temperature airflow absorbs the heat of the first heating element 40 and the other part directly discharges the heat dissipation system through the second air outlet opening 151 under the action of the second fan. Under the action of the pressure difference between the inside and the outside of the computer case 10, the lower temperature airflow outside the heat dissipation system can pass through the second air inlet opening 141, the third air inlet opening 131, the second air inlet opening 231, and the third air inlet. The opening 241 continuously enters the computer case 10, and sequentially removes the heat of the first heating element 40 and the second heating element 50, and then flows out of the computer case 10 through the second air outlet opening 151 and the third air outlet opening 152. The first heating element 40 is a heat sink, and the second heating element 50 is a power source. Similarly, when the computer case 10 is placed with the second side plate 13 as a supporting surface, only the wind guiding device 25 in the first air inlet opening 221 and the second air inlet opening 231 is removed. When the computer case 10 and the rear plate 14 are placed on the support surface, only the windshield 25 in the first inlet opening 221 and the third inlet opening 241 are removed.

Compared with the prior art, the heat dissipation system of the present invention introduces the wind flow from the heat dissipation system into the guide through the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening 241 on the air guiding device 20. The wind device 20 flows through the first heat generating element 40 and the second heat generating element 50 through the first air outlet opening 211, and then flows out from the second air outlet opening 151 and the third air outlet opening 152, respectively. When the computer case 10 is placed at different angles, one of the first inlet opening 221, the second inlet opening 231, and the third inlet opening 241 is closed, and the airflow from the outside of the heat dissipation system may also be from other The enclosed inlet opening flows into the air guiding device 20.

In summary, the present invention is in accordance with the conditions of the invention patent application, and the patent application is filed according to law. The above is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the following claims.

10. . . Computer case

11. . . Bottom plate

12. . . First side panel

121. . . First air inlet opening

13. . . Second side panel

131. . . Third air inlet opening

14. . . Back plate

141. . . Second air inlet opening

15. . . Ger

151. . . Second outlet opening

152. . . Third outlet opening

20. . . Air guiding device

twenty one. . . Bottom wall

211. . . First outlet

twenty two. . . First side wall

221. . . First inlet opening

twenty three. . . Second side wall

231. . . Second inlet opening

twenty four. . . Back wall

241. . . Third inlet opening

25. . . Windshield

251. . . Fixing frame

2511. . . Bending section

2512. . . handle

252. . . Foam

26. . . Guide

30. . . Computer motherboard

40. . . First heating element

41. . . First fan

50. . . Second heating element

1 is an exploded view of an air guiding device and a computer case in a preferred embodiment of the heat dissipation system of the present invention.

Figure 2 is an exploded view of the air guiding device of Figure 1.

3 is an assembled view of a preferred embodiment of the heat dissipation system of FIG. 1.

10. . . Computer case

11. . . Bottom plate

12. . . First side panel

121. . . First air inlet opening

13. . . Second side panel

131. . . Third air inlet opening

14. . . Back plate

141. . . Second air inlet opening

15. . . Ger

151. . . Second outlet opening

152. . . Third outlet opening

20. . . Air guiding device

25. . . Windshield

251. . . Fixing frame

252. . . Foam

30. . . Computer motherboard

40. . . First heating element

41. . . First fan

50. . . Second heating element

Claims (10)

A heat dissipation system includes a bottom plate, a first side plate perpendicular to the bottom plate, a rear plate perpendicular to the first side plate, and a front plate perpendicular to the first side plate, wherein the bottom plate is mounted with a computer main board near the rear plate a first heating element is disposed on the computer motherboard, and a second heating element is disposed on the bottom plate adjacent to the front plate. The first heating element is provided with an air guiding device, and the air guiding device defines a first An air inlet opening, a second air inlet opening and a first air outlet opening, wherein the front panel defines a second air outlet opening and a third air outlet opening, and the airflow from the heat dissipation system passes through the first air inlet opening and The second air inlet opening enters the air guiding device, and sequentially flows through the first heat generating component and the second heat generating component through the first air outlet opening, and then flows out from the second air outlet opening and the third air outlet opening, respectively. The heat dissipation system of claim 1, wherein the first side panel defines a plurality of first air inlet openings relative to the first air inlet opening, and the rear panel defines a plurality of second holes relative to the second air inlet opening. The air inlet opening, the wind flow from outside the heat dissipation system enters the air guiding device via the first air inlet opening, the second air inlet opening, the first air inlet opening and the second air inlet opening. The heat dissipation system of claim 1, wherein the first air outlet opening and the second air outlet opening are opposite to the first heat generating component, and the third air outlet opening is opposite to the second heat generating component. The heat dissipation system of claim 1, wherein the second air outlet is provided with a second fan, and the third air outlet is provided with a third fan. The heat dissipation system of claim 1, wherein the heat dissipation system further comprises a second side plate perpendicular to the bottom plate, the first side plate and the second side plate are opposite, and the second side plate is provided with a plurality of third air inlets. Opening, the air guiding device defines a third air inlet opening relative to the third air inlet opening. The heat dissipation system of claim 5, wherein the air guiding device is respectively provided with a wind blocking device in the first air inlet opening, the second air inlet opening and the third air inlet opening, and each wind shielding device is provided The device includes a fixing frame and a foam mounted on the fixing frame, the fixing frame includes a first surface and a second surface, and the fixing frame vertically extends from the first surface to the plurality of bending portions, the bubble The cotton card is fastened between the plurality of bends. The heat dissipation system of claim 6, wherein the fixing frame comprises a second surface, the holder has a handle extending perpendicularly from the second surface, and the handle is slid upward to mount the fixing frame The first inlet opening, the second inlet opening, and the third inlet opening. The heat dissipation system of claim 7, wherein the air guiding device comprises a bottom wall, a front wall perpendicular to the bottom wall and a rear wall perpendicular to the bottom wall, the first air inlet opening and the third The inlet openings are respectively defined between the front wall and the rear wall, and the second inlet opening is formed on the rear wall. The heat dissipation system of claim 7, wherein the air guiding device has a plurality of mutually parallel guiding portions on each of the first inlet opening, the second inlet opening and the third inlet opening, each of which The fixing frame slides between the adjacent two parallel guiding portions into the corresponding first inlet opening, second inlet opening and third inlet opening. The heat dissipation system of claim 9, wherein the distance between adjacent two parallel guides is equal to the thickness of the mount.