CN102841662A - Radiating system - Google Patents
Radiating system Download PDFInfo
- Publication number
- CN102841662A CN102841662A CN2011101731053A CN201110173105A CN102841662A CN 102841662 A CN102841662 A CN 102841662A CN 2011101731053 A CN2011101731053 A CN 2011101731053A CN 201110173105 A CN201110173105 A CN 201110173105A CN 102841662 A CN102841662 A CN 102841662A
- Authority
- CN
- China
- Prior art keywords
- air
- air intake
- intake opening
- opening
- cooling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
A radiating system comprises a bottom plate, a first side plate vertical to the bottom plate, a back plate vertical to the first side plate and a front plate vertical to the first side plate, wherein a computer main board is installed on the bottom plate and near the back plate; a first heating element is installed on the computer main board; a second heating element is installed on the bottom plate and near the front plate; an air guiding device is installed on the first heating element; a first air inlet opening, a second air inlet opening and a first air outlet opening are formed on the air guiding device; a second air outlet opening and a third air outlet opening are formed on the front plate; and an air flow from the exterior of the radiating system enters the air guiding device through the first air inlet opening and the second air inlet opening, sequentially flows through the first heating element and the second heating element through the first air outlet opening, and flows out from the second air outlet opening and the third air outlet opening respectively.
Description
Technical field
The present invention relates to a kind of cooling system, be meant a kind of computer case radiation system especially.
Background technology
Industrial computer is meant that mainly being used in is to specialize in the PC that industry member is used, and can be used as industrial control unit (ICU) and uses.Industrial computer is paid attention to stability and the reliability under varying environment, so the desired standard value of industrial computer all has requirement to meet strict standard and extendibility.Industrial computer generally uses under hot and humid rugged surroundings, therefore its heat dispersion is had higher requirement.Can heat dissipation channel be sealed when Traditional industrial is placed with different angles with computer, and then influence its heat dispersion.
Summary of the invention
In view of above content, be necessary the cooling system that provides a kind of heat dispersion high.
A kind of cooling system; Comprise a base plate, first side plate perpendicular to said base plate, a back plate and the header board perpendicular to said first side plate perpendicular to said first side plate; Install a computer main board near the back plate on the said base plate; Installing one first heater element on the said computer main board; Install one second heater element near header board on the said base plate; Installing one air ducting is offered one first air intake opening, one second air intake opening and one first air-out opening on said first heater element on the said air ducting, offers one second air-out opening and one the 3rd air-out opening on the said header board; Get into said air ducting from outer distinguished and admirable of cooling system via the first air intake opening and the second air intake opening, and flow through successively via the said first air-out opening and to flow out from the second air-out opening and the 3rd air-out opening respectively behind first heater element and second heater element.
Compared to prior art; Cooling system of the present invention will be from the outer said air ducting of distinguished and admirable introducing of cooling system through the first air intake opening on the said air ducting and the second air intake opening; And flow through successively via the said first air-out opening and to flow out from the second air-out opening and the 3rd air-out opening respectively behind first heater element and second heater element; After one of them of the first air intake opening and the second air intake opening is closed, also can flow into said air ducting from another air intake opening that is not closed from outer distinguished and admirable of cooling system.
Description of drawings
Fig. 1 is the exploded view of air ducting and computer housing in the cooling system preferred embodiments of the present invention.
Fig. 2 is the exploded view of air ducting among Fig. 1.
Fig. 3 is the assembly drawing of cooling system preferred embodiments among Fig. 1.
The main element symbol description
| |
10 |
| |
11 |
| |
12 |
| The first air intake perforate | 121 |
| |
13 |
| The 3rd air intake perforate | 131 |
| |
14 |
| The second air intake perforate | 141 |
| |
15 |
| The second air-out opening | 151 |
| The 3rd air-out opening | 152 |
| |
20 |
| Diapire | 21 |
| The first air-out opening | 211 |
| The |
22 |
| The first air intake opening | 221 |
| |
23 |
| The second air intake opening | 231 |
| Rear wall | 24 |
| The 3rd |
241 |
| Abat- |
25 |
| Fixed |
251 |
| Kink | 2511 |
| |
2512 |
| Foam | 252 |
| |
26 |
| Computer |
30 |
| |
40 |
| |
41 |
| |
50 |
Following embodiment will combine above-mentioned accompanying drawing to further specify the present invention.
Embodiment
Please consult Fig. 1 and Fig. 2 in the lump, cooling system one preferred embodiments of the present invention comprises that a computer housing 10 and is installed in the air ducting 20 in the said computer housing 10.Said computer housing 10 comprises a base plate 11, perpendicular to one first side plate 12 of said base plate 11 and one second side plate 13, a back plate 14 and the header board 15 perpendicular to said first side plate 12 and second side plate 13 perpendicular to said first side plate 12 and second side plate 13.
Near back plate 14 installings one computer main board 30, install one first heater element 40 on the said computer main board 30 on the said base plate 11.Installing one first fan 41 on said first heater element 40.Install one second heater element 50 near header board 15 on the said base plate 11.Said first side plate 12 is offered some first air intake perforates 121, offers some second air intake perforates 141 on the plate 14 of said back, offers some the 3rd air intake perforates 131 on said second side plate 13.Offer one second air-out opening 151 with respect to first heater element 40 on the said header board 15, install one second fan (figure does not show) near the second air-out opening, 151 places in the said computer housing 10.Offer one the 3rd air-out opening 152 with respect to second heater element 40 on the said header board 15, install a three fan (figure does not show) near the 3rd air-out opening 152 places in the said computer housing 10.
Said air ducting 20 comprises a diapire 21, an antetheca 22 and the rear wall 23 perpendicular to said diapire 21 perpendicular to said diapire 21.Offer one first air intake opening 221 with respect to some first air intake perforates 121 between said antetheca 22 and the rear wall 23.Offer one second air intake opening 231 with respect to some second air intake perforates 141 on the said rear wall 23.Offer one the 3rd air intake opening 241 with respect to some the 3rd air intake perforates 131 between said antetheca 22 and the rear wall 23.Offer one first air-out opening 211 with respect to first fan 41 on the said diapire 21.
In the first air intake opening 221, the second air intake opening 231 and the 3rd air intake opening 241, install an abat-vent 25 respectively on the said air ducting 20.Each abat-vent 25 comprises that a fixed mount 251 and is installed in the foam 252 on the said fixed mount 251.Said fixed mount 251 comprises a first surface and a second surface.Vertically extend some kinks 2511 from first surface on the said fixed mount 251, said foam 252 is fastened between some kinks 2511.Vertically extend leader 2512 from second surface on the said fixed mount 251, upwards spurring said handle 2512 can be with in the said first air intake opening 221 of being installed in of sliding of fixed mount 251, the second air intake opening 231 and the 3rd air intake opening 241.Be convexly equipped with some guide parts that are parallel to each other 26 in the first air intake opening 221, the second air intake opening 231 and the 3rd air intake opening 241 both sides on the said air ducting 20.Each fixed mount 251 slips between adjacent two parallel guide parts 26 in the corresponding first air intake opening 221, the second air intake opening 231 and the 3rd air intake opening 241.Wherein, distance equates with the thickness of said fixed mount 251 between the adjacent two parallel guide parts 26.Wherein, said air ducting 20 is fixed on the computer housing 10 through the mode of screw locking or riveted.
See also Fig. 3, during work, said first fan 41, second fan and three fan begin to rotate.When said computer housing 10 was the supporting surface placement with first side plate 12, the said first air intake perforate 121 this moment was closed.The handle 2512 that upwards spurs on the fixed mount 251 removes the abat-vent 25 in said second air intake opening 231 and the 3rd air intake opening 241.Get into said air ducting 20 from the air-flow of the outer lower temperature of cooling system via the said second air intake perforate 141, the 3rd air intake perforate 131, the second air intake opening 231 and the 3rd air intake opening 241, and under the effect of said first fan 41 via the first air-out opening, 211 accelerating flow through said first heater element 40.The air-flow of lower temperature has absorbed behind the heat of said first heater element 40 part second heater element 50 of flowing through, and then under the effect of said three fan, quickens to discharge cooling systems via the 3rd air-out opening 152.Another part was directly discharged cooling systems via the said second air-out opening 151 after the air-flow of lower temperature had absorbed the heat of said first heater element 40 under second action of fan.Under the effect of said computer housing 10 external and internal pressure differences; The air-flow of the outer lower temperature of cooling system can get in the computer housing 10 via the said second air intake perforate 141, the 3rd air intake perforate 131, the second air intake opening 231 and the 3rd air intake opening 241 endlessly, and takes away the heat of said first heater element 40 and second heater element 50 successively after by said second air-out opening 151 and the 3rd air-out opening 152 outflow computer housings 10.Wherein, said first heater element 40 is a heating radiator, and said second heater element 50 is a power supply.In like manner, when said computer housing 10 is the supporting surface placement with second side plate 13, only need the abat-vents 25 in the said first air intake opening 221 and the second air intake opening 231 are removed.When plate 14 is placed for supporting surface after the said computer housing 10, only need the abat-vent 25 in said first air intake opening 221 and the 3rd air intake opening 241 is removed.
Compared to prior art; Cooling system of the present invention will be from the outer said air ducting 20 of distinguished and admirable introducing of cooling system through the first air intake opening 221, the second air intake opening 231 and the 3rd air intake opening 241 on the said air ducting 20, and flows through successively behind first heater element 40 and second heater element 50 respectively from the second air-out opening 151 and 152 outflows of the 3rd air-out opening via the said first air-out opening 211.After one of them that when said computer housing 10 is placed with different angles, makes win air intake opening 221, the second air intake opening 231 and the 3rd air intake opening 241 is closed, also can flow into said air ducting 20 from other air intake opening that is not closed from outer distinguished and admirable of cooling system.
Claims (10)
1. cooling system; Comprise a base plate, first side plate perpendicular to said base plate, a back plate and the header board perpendicular to said first side plate perpendicular to said first side plate; Install a computer main board near the back plate on the said base plate; Installing one first heater element on the said computer main board; Install one second heater element near header board on the said base plate; It is characterized in that: installing one air ducting on said first heater element, offer one first air intake opening, one second air intake opening and one first air-out opening on the said air ducting, offer one second air-out opening and one the 3rd air-out opening on the said header board; Get into said air ducting from outer distinguished and admirable of cooling system via the first air intake opening and the second air intake opening, and flow through successively via the said first air-out opening and to flow out from the second air-out opening and the 3rd air-out opening respectively behind first heater element and second heater element.
2. cooling system as claimed in claim 1; It is characterized in that: offer some first air intake perforates with respect to the first air intake opening on said first side plate; Offer some second air intake perforates with respect to the second air intake opening on the plate of said back, get into said air ducting via the first air intake perforate, the second air intake perforate, the first air intake opening and the second air intake opening from outer distinguished and admirable of cooling system.
3. cooling system as claimed in claim 1 is characterized in that: the said first air-out opening is relative with first heater element with the second air-out opening, and said the 3rd air-out opening is relative with second heater element.
4. cooling system as claimed in claim 1 is characterized in that: installing one second fan on the said second air-out opening, installing one three fan on said the 3rd air-out opening.
5. cooling system as claimed in claim 1; It is characterized in that: said cooling system also comprises second side plate perpendicular to said base plate; Said first side plate is relative with second side plate; Offer some the 3rd air intake perforates on said second side plate, offer one the 3rd air intake opening with respect to the 3rd air intake perforate on the said air ducting.
6. cooling system as claimed in claim 5; It is characterized in that: in the first air intake opening, the second air intake opening and the 3rd air intake opening, install an abat-vent respectively on the said air ducting; Each abat-vent comprises that a fixed mount and is installed in the foam on the said fixed mount; Said fixed mount comprises a first surface and a second surface, vertically extends some kinks from first surface on the said fixed mount, and said foam is fastened between some kinks.
7. cooling system as claimed in claim 6; It is characterized in that: said fixed mount comprises a second surface; Vertically extend the leader from second surface on the said fixed mount, upwards spurring said handle can be installed in the said first air intake opening, the second air intake opening and the 3rd air intake opening what fixed mount slided.
8. cooling system as claimed in claim 7; It is characterized in that: said air ducting comprises a diapire, an antetheca and the rear wall perpendicular to said diapire perpendicular to said diapire; Said first air intake opening and the 3rd air intake opening are opened in respectively between said antetheca and the rear wall, and the said second air intake opening is opened on the rear wall.
9. cooling system as claimed in claim 7; It is characterized in that: be convexly equipped with some guide parts that are parallel to each other in the first air intake opening, the second air intake opening and the 3rd air intake opening both sides on the said air ducting, each fixed mount slips in the corresponding first air intake opening, the second air intake opening and the 3rd air intake opening between adjacent two parallel guide parts.
10. cooling system as claimed in claim 9 is characterized in that: distance equates with the thickness of said fixed mount between the adjacent two parallel guide parts.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101731053A CN102841662A (en) | 2011-06-24 | 2011-06-24 | Radiating system |
| TW100122988A TW201301006A (en) | 2011-06-24 | 2011-06-30 | Heat dissipation system |
| US13/303,250 US20120325432A1 (en) | 2011-06-24 | 2011-11-23 | Heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101731053A CN102841662A (en) | 2011-06-24 | 2011-06-24 | Radiating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102841662A true CN102841662A (en) | 2012-12-26 |
Family
ID=47360717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101731053A Pending CN102841662A (en) | 2011-06-24 | 2011-06-24 | Radiating system |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20120325432A1 (en) |
| CN (1) | CN102841662A (en) |
| TW (1) | TW201301006A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113944941A (en) * | 2020-07-16 | 2022-01-18 | 广东美的厨房电器制造有限公司 | Microwave oven with a heat exchanger |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104375604A (en) * | 2013-08-16 | 2015-02-25 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| US10925183B2 (en) * | 2019-02-21 | 2021-02-16 | Adlink Technology Inc. | 3D extended cooling mechanism for integrated server |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4781736A (en) * | 1986-11-20 | 1988-11-01 | United Air Specialists, Inc. | Electrostatically enhanced HEPA filter |
| US5559673A (en) * | 1994-09-01 | 1996-09-24 | Gagnon; Kevin M. | Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control panel |
| US5963424A (en) * | 1995-11-07 | 1999-10-05 | Sun Microsystems, Inc. | Pulsar desk top system that will produce 500 watts of heat |
| TW484721U (en) * | 2000-11-06 | 2002-04-21 | Giga Byte Tech Co Ltd | Improved airflow guiding structure of server |
| US6400568B1 (en) * | 2001-07-11 | 2002-06-04 | Sun Microsystems, Inc. | Method and apparatus for cooling electronic components |
| US20040095723A1 (en) * | 2002-11-15 | 2004-05-20 | Enlight Corporation | Internal heat sink construction for CPU cabinet |
| TWM244718U (en) * | 2003-08-22 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | Heat dissipating device employing air duct |
| TWI242706B (en) * | 2004-03-08 | 2005-11-01 | Avance Technologies Inc | Convective cooling chassis air guide |
| US7106586B2 (en) * | 2004-09-07 | 2006-09-12 | Shutlle Inc. | Computer heat dissipating system |
| US20060181846A1 (en) * | 2005-02-11 | 2006-08-17 | Farnsworth Arthur K | Cooling system for a computer environment |
| CN201041654Y (en) * | 2007-03-20 | 2008-03-26 | 鸿富锦精密工业（深圳）有限公司 | Computer shell with wind guiding cover |
| US7611402B2 (en) * | 2007-03-28 | 2009-11-03 | Adc Dsl Systems, Inc. | Apparatus for cooling electronics |
| BRPI0704566A2 (en) * | 2007-09-18 | 2009-05-12 | Whirlpool Sa | docking station for a computer |
| JP4530054B2 (en) * | 2008-01-23 | 2010-08-25 | ソニー株式会社 | Cooling ducts and electronics |
| FR2934906B1 (en) * | 2008-08-05 | 2010-09-03 | Thales Sa | ON-BOARD CALCULATOR EQUIPPED WITH AN AUTONOMOUS AERAULIC COOLING DEVICE |
| US7643292B1 (en) * | 2008-12-23 | 2010-01-05 | Chenbro Micom Co., Ltd. | Adjustable air director |
| CN201562214U (en) * | 2009-10-14 | 2010-08-25 | 鸿富锦精密工业（深圳）有限公司 | Electronic device shell |
-
2011
- 2011-06-24 CN CN2011101731053A patent/CN102841662A/en active Pending
- 2011-06-30 TW TW100122988A patent/TW201301006A/en unknown
- 2011-11-23 US US13/303,250 patent/US20120325432A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113944941A (en) * | 2020-07-16 | 2022-01-18 | 广东美的厨房电器制造有限公司 | Microwave oven with a heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120325432A1 (en) | 2012-12-27 |
| TW201301006A (en) | 2013-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121226 |