CN102841662A - Radiating system - Google Patents

Radiating system Download PDF

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CN102841662A
CN102841662A CN2011101731053A CN201110173105A CN102841662A CN 102841662 A CN102841662 A CN 102841662A CN 2011101731053 A CN2011101731053 A CN 2011101731053A CN 201110173105 A CN201110173105 A CN 201110173105A CN 102841662 A CN102841662 A CN 102841662A
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air inlet
air
inlet opening
opening
heating element
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范振炉
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2011101731053A priority Critical patent/CN102841662A/en
Priority to TW100122988A priority patent/TW201301006A/en
Priority to US13/303,250 priority patent/US20120325432A1/en
Publication of CN102841662A publication Critical patent/CN102841662A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

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  • Theoretical Computer Science (AREA)
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  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热系统，包括一底板、一垂直于所述底板的第一侧板、一垂直于所述第一侧板的后板及一垂直于所述第一侧板的前板，所述底板上靠近后板装设一电脑主板，所述电脑主板上装设一第一发热元件，所述底板上靠近前板装设一第二发热元件，所述第一发热元件上装设一导风装置，所述导风装置上开设一第一进风开口、一第二进风开口和一第一出风开口，所述前板上开设一第二出风开口和一第三出风开口，来自散热系统外的风流经由第一进风开口和第二进风开口进入所述导风装置，并经由所述第一出风开口依次流经第一发热元件和第二发热元件后分别从第二出风开口和第三出风开口流出。

Figure 201110173105

A heat dissipation system comprising a bottom plate, a first side plate perpendicular to the bottom plate, a rear plate perpendicular to the first side plate and a front plate perpendicular to the first side plate, the bottom plate A computer main board is installed on the top near the rear board, a first heating element is installed on the computer main board, a second heating element is installed on the bottom board near the front board, an air guiding device is installed on the first heating element, A first air inlet opening, a second air inlet opening, and a first air outlet opening are provided on the air guiding device, and a second air outlet opening and a third air outlet opening are provided on the front plate, for heat dissipation. The wind outside the system enters the air guide device through the first air inlet opening and the second air inlet opening, and flows through the first heating element and the second heating element in sequence through the first air outlet opening, and then flows from the second outlet respectively. The air opening and the third air outlet opening flow out.

Figure 201110173105

Description

散热系统cooling system

技术领域 technical field

本发明涉及一种散热系统，特别是指一种电脑机箱散热系统。 The invention relates to a heat dissipation system, in particular to a computer case heat dissipation system.

背景技术 Background technique

工业电脑主要是指用在是专供工业界使用的个人电脑，可作为工业控制器使用。工业电脑注重在不同环境下的稳定性和可靠性，因此工业用电脑所要求的标准值都有要求符合严格的规范与扩充性。工业用电脑一般使用在高温高湿的恶劣环境下，因此对其散热性能具有较高的要求。传统的工业用电脑以不同角度放置时会将散热通道封闭，进而影响其散热性能。 Industrial computers mainly refer to personal computers that are specially used in the industry and can be used as industrial controllers. Industrial computers focus on stability and reliability in different environments, so the standard values required by industrial computers are required to meet strict specifications and expandability. Industrial computers are generally used in harsh environments with high temperature and high humidity, so there are high requirements for their heat dissipation performance. When traditional industrial computers are placed at different angles, the heat dissipation channels will be closed, which will affect its heat dissipation performance.

发明内容 Contents of the invention

鉴于以上内容，有必要提供一种散热性能高的散热系统。 In view of the above, it is necessary to provide a heat dissipation system with high heat dissipation performance.

一种散热系统，包括一底板、一垂直于所述底板的第一侧板、一垂直于所述第一侧板的后板及一垂直于所述第一侧板的前板，所述底板上靠近后板装设一电脑主板，所述电脑主板上装设一第一发热元件，所述底板上靠近前板装设一第二发热元件，所述第一发热元件上装设一导风装置，所述导风装置上开设一第一进风开口、一第二进风开口和一第一出风开口，所述前板上开设一第二出风开口和一第三出风开口，来自散热系统外的风流经由第一进风开口和第二进风开口进入所述导风装置，并经由所述第一出风开口依次流经第一发热元件和第二发热元件后分别从第二出风开口和第三出风开口流出。 A heat dissipation system comprising a bottom plate, a first side plate perpendicular to the bottom plate, a rear plate perpendicular to the first side plate and a front plate perpendicular to the first side plate, the bottom plate A computer main board is installed on the top near the rear board, a first heating element is installed on the computer main board, a second heating element is installed on the bottom board near the front board, an air guiding device is installed on the first heating element, A first air inlet opening, a second air inlet opening, and a first air outlet opening are provided on the air guiding device, and a second air outlet opening and a third air outlet opening are provided on the front plate, for heat dissipation. The wind outside the system enters the air guide device through the first air inlet opening and the second air inlet opening, and flows through the first heating element and the second heating element in sequence through the first air outlet opening, and then flows from the second outlet respectively. The air opening and the third air outlet opening flow out.

相较于现有技术，本发明散热系统通过所述导风装置上的第一进风开口和第二进风开口将来自散热系统外的风流引入所述导风装置，并经由所述第一出风开口依次流经第一发热元件和第二发热元件后分别从第二出风开口和第三出风开口流出，当第一进风开口和第二进风开口的其中之一被封闭后，来自散热系统外的风流也可从另一未被封闭的进风开口流入所述导风装置。 Compared with the prior art, the heat dissipation system of the present invention introduces the air flow from outside the heat dissipation system into the air guide device through the first air inlet opening and the second air inlet opening on the air guide device, and passes through the first air inlet opening. The air outlet opening flows through the first heating element and the second heating element in sequence, and then flows out from the second air outlet opening and the third air outlet opening respectively. When one of the first air inlet opening and the second air inlet opening is closed The wind flow from outside the heat dissipation system can also flow into the air guide device through another unclosed air inlet opening.

附图说明 Description of drawings

图1是本发明散热系统较佳实施方式中导风装置和电脑机箱的分解图。 Fig. 1 is an exploded view of the air guiding device and the computer case in the preferred embodiment of the heat dissipation system of the present invention.

图2是图1中导风装置的分解图。 Fig. 2 is an exploded view of the air guiding device in Fig. 1 .

图3是图1中散热系统较佳实施方式的组装图。 FIG. 3 is an assembly view of a preferred embodiment of the cooling system in FIG. 1 .

主要元件符号说明 Description of main component symbols

电脑机箱computer case 1010 底板Bottom plate 1111 第一侧板first side panel 1212 第一进风开孔first air inlet opening 121121 第二侧板second side panel 1313 第三进风开孔The third air inlet opening 131131 后板rear panel 1414 第二进风开孔Second air inlet opening 141141 前板Ger 1515 第二出风开口second air outlet 151151 第三出风开口third air outlet 152152 导风装置Air guide 2020 底壁bottom wall 21twenty one 第一出风开口first air outlet 211211 第一侧壁first side wall 22twenty two 第一进风开口first air inlet opening 221221 第二侧壁second side wall 23twenty three 第二进风开口second air inlet opening 231231 后壁back wall 24twenty four 第三进风开口third air intake opening 241241 挡风装置Windshield 2525 固定架Fixture 251251 弯折部Bending 25112511 把手handle 25122512 泡棉Foam 252252 导向部guide 2626 电脑主板Motherboard 3030 第一发热元件first heating element 4040 第一风扇first fan 4141 第二发热元件second heating element 5050

如下具体实施方式将结合上述附图进一步说明本发明。 The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

具体实施方式 Detailed ways

请一并参阅图1和图2，本发明散热系统一较佳实施方式包括一电脑机箱10和一装设于所述电脑机箱10内的导风装置20。所述电脑机箱10包括一底板11、垂直于所述底板11的一第一侧板12和一第二侧板13、一垂直于所述第一侧板12和第二侧板13的后板14及一垂直于所述第一侧板12和第二侧板13的前板15。 Please refer to FIG. 1 and FIG. 2 together. A preferred embodiment of the heat dissipation system of the present invention includes a computer case 10 and an air guiding device 20 installed in the computer case 10 . Described computer case 10 comprises a base plate 11, a first side plate 12 and a second side plate 13 perpendicular to described base plate 11, a rear plate perpendicular to described first side plate 12 and second side plate 13 14 and a front panel 15 perpendicular to the first side panel 12 and the second side panel 13.

所述底板11上靠近后板14装设一电脑主板30，所述电脑主板30上装设一第一发热元件40。所述第一发热元件40上装设一第一风扇41。所述底板11上靠近前板15装设一第二发热元件50。所述第一侧板12开设若干第一进风开孔121，所述后板14上开设若干第二进风开孔141，所述第二侧板13上开设若干第三进风开孔131。所述前板15上相对于第一发热元件40开设一第二出风开口151，所述电脑机箱10内靠近第二出风开口151处装设一第二风扇（图未示）。所述前板15上相对于第二发热元件40开设一第三出风开口152，所述电脑机箱10内靠近第三出风开口152处装设一第三风扇（图未示）。 A computer main board 30 is installed on the bottom board 11 close to the rear board 14 , and a first heating element 40 is installed on the computer main board 30 . A first fan 41 is mounted on the first heating element 40 . A second heating element 50 is installed on the bottom plate 11 close to the front plate 15 . The first side plate 12 is provided with a plurality of first air intake openings 121, the rear plate 14 is provided with a plurality of second air intake openings 141, and the second side plate 13 is provided with a plurality of third air intake openings 131. . A second air outlet opening 151 is opened on the front plate 15 relative to the first heating element 40 , and a second fan (not shown) is installed in the computer case 10 close to the second air outlet opening 151 . A third air outlet opening 152 is opened on the front plate 15 relative to the second heating element 40 , and a third fan (not shown) is installed in the computer case 10 close to the third air outlet opening 152 .

所述导风装置20包括一底壁21、一垂直于所述底壁21的前壁22和一垂直于所述底壁21的后壁23。所述前壁22和后壁23之间相对于若干第一进风开孔121开设一第一进风开口221。所述后壁23上相对于若干第二进风开孔141开设一第二进风开口231。所述前壁22和后壁23之间相对于若干第三进风开孔131开设一第三进风开口241。所述底壁21上相对于第一风扇41开设一第一出风开口211。 The air guiding device 20 includes a bottom wall 21 , a front wall 22 perpendicular to the bottom wall 21 , and a rear wall 23 perpendicular to the bottom wall 21 . A first air inlet opening 221 is defined between the front wall 22 and the rear wall 23 relative to the first air inlet openings 121 . A second air inlet opening 231 is defined on the rear wall 23 opposite to the plurality of second air inlet openings 141 . A third air inlet opening 241 is defined between the front wall 22 and the rear wall 23 relative to the third air inlet openings 131 . A first air outlet opening 211 is defined on the bottom wall 21 relative to the first fan 41 .

所述导风装置20上于第一进风开口221、第二进风开口231和第三进风开口241内分别装设一挡风装置25。每一挡风装置25包括一固定架251和一装设于所述固定架251上的泡棉252。所述固定架251包括一第一表面和一第二表面。所述固定架251上自第一表面垂直延伸出若干弯折部2511，所述泡棉252卡固于若干弯折部2511之间。所述固定架251上自第二表面垂直延伸出一把手2512，向上拉动所述把手2512可将固定架251滑动的装设于所述第一进风开口221、第二进风开口231和第三进风开口241内。所述导风装置20上于第一进风开口221、第二进风开口231和第三进风开口241两侧凸设若干相互平行的导向部26。每一固定架251自相邻两平行的导向部26之间滑入相应的第一进风开口221、第二进风开口231和第三进风开口241内。其中，相邻两平行的导向部26之间距离与所述固定架251的厚度相等。其中，所述导风装置20通过螺钉锁固或者铆合的方式固定在电脑机箱10上。 A wind shielding device 25 is respectively installed in the first air inlet opening 221 , the second air inlet opening 231 and the third air inlet opening 241 on the air guiding device 20 . Each windshield device 25 includes a fixing frame 251 and a foam 252 mounted on the fixing frame 251 . The fixing frame 251 includes a first surface and a second surface. A plurality of bent portions 2511 vertically extend from the first surface of the fixing frame 251 , and the foam 252 is fixed between the plurality of bent portions 2511 . A handle 2512 extends vertically from the second surface on the fixing frame 251, and the fixing frame 251 can be slidably installed on the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening 231 by pulling the handle 2512 upwards. Into the air opening 241. A plurality of parallel guiding portions 26 protrude from both sides of the first air inlet opening 221 , the second air inlet opening 231 and the third air inlet opening 241 on the air guiding device 20 . Each fixing bracket 251 slides into the corresponding first air inlet opening 221 , second air inlet opening 231 and third air inlet opening 241 from between two adjacent parallel guide portions 26 . Wherein, the distance between two adjacent parallel guide portions 26 is equal to the thickness of the fixing frame 251 . Wherein, the air guiding device 20 is fixed on the computer case 10 through screw locking or riveting.

请参阅图3，工作时，所述第一风扇41、第二风扇和第三风扇开始转动。当所述电脑机箱10以第一侧板12为支撑面放置时，此时所述第一进风开孔121被封闭。向上拉动固定架251上的把手2512将所述第二进风开口231和第三进风开口241内的挡风装置25移除。来自散热系统外的较低温度的气流经由所述第二进风开孔141、第三进风开孔131、第二进风开口231和第三进风开口241进入所述导风装置20，并在所述第一风扇41的作用下经由第一出风开口211加速流经所述第一发热元件40。较低温度的气流吸收了所述第一发热元件40的热量后一部分流经第二发热元件50，而后在所述第三风扇的作用下经由第三出风开口152加速排出散热系统。较低温度的气流吸收了所述第一发热元件40的热量后另一部分在第二风扇的作用下经由所述第二出风开口151直接排出散热系统。在所述电脑机箱10内外压力差的作用下，散热系统外较低温度的气流可经由所述第二进风开孔141、第三进风开孔131、第二进风开口231和第三进风开口241源源不断的进入电脑机箱10内，并依次带走所述第一发热元件40和第二发热元件50的热量后经由所述第二出风开口151和第三出风开口152流出电脑机箱10。其中，所述第一发热元件40为散热器，所述第二发热元件50为电源。同理，当所述电脑机箱10以第二侧板13为支撑面放置时，只需将所述第一进风开口221和第二进风开口231内的挡风装置25移除。当所述电脑机箱10以后板14为支撑面放置时，只需将所述第一进风开口221和第三进风开口241内的挡风装置25移除。 Please refer to FIG. 3 , when working, the first fan 41 , the second fan and the third fan start to rotate. When the computer case 10 is placed on the first side plate 12 as a supporting surface, the first air inlet opening 121 is closed at this time. Pull up the handle 2512 on the fixing bracket 251 to remove the wind shielding device 25 inside the second air inlet opening 231 and the third air inlet opening 241 . The lower-temperature airflow from outside the cooling system enters the air guiding device 20 through the second air inlet opening 141 , the third air inlet opening 131 , the second air inlet opening 231 and the third air inlet opening 241 , And under the action of the first fan 41 , the air is accelerated to flow through the first heating element 40 through the first air outlet opening 211 . After absorbing the heat of the first heating element 40 , part of the airflow at a lower temperature flows through the second heating element 50 , and then is accelerated out of the cooling system through the third air outlet 152 under the action of the third fan. After the lower-temperature airflow absorbs the heat of the first heating element 40 , the other part is directly discharged out of the heat dissipation system through the second air outlet opening 151 under the action of the second fan. Under the effect of the pressure difference between the inside and outside of the computer case 10, the airflow at a lower temperature outside the cooling system can pass through the second air inlet opening 141, the third air inlet opening 131, the second air inlet opening 231 and the third air inlet opening. The air inlet opening 241 continuously enters the computer case 10, and sequentially takes away the heat of the first heating element 40 and the second heating element 50, and then flows out through the second air outlet opening 151 and the third air outlet opening 152. computer case10. Wherein, the first heating element 40 is a radiator, and the second heating element 50 is a power supply. Similarly, when the computer case 10 is placed on the second side plate 13 as a supporting surface, it is only necessary to remove the wind shielding device 25 inside the first air inlet opening 221 and the second air inlet opening 231 . When the computer case 10 is placed on the rear panel 14 as a supporting surface, it is only necessary to remove the wind shielding device 25 inside the first air inlet opening 221 and the third air inlet opening 241 .

相较于现有技术，本发明散热系统通过所述导风装置20上的第一进风开口221、第二进风开口231和第三进风开口241将来自散热系统外的风流引入所述导风装置20，并经由所述第一出风开口211依次流经第一发热元件40和第二发热元件50后分别从第二出风开口151和第三出风开口152流出。当所述电脑机箱10以不同角度放置时使得第一进风开口221、第二进风开口231和第三进风开口241的其中之一被封闭后，来自散热系统外的风流也可从其它未被封闭的进风开口流入所述导风装置20。 Compared with the prior art, the heat dissipation system of the present invention introduces the airflow from outside the heat dissipation system into the airflow through the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening 241 on the air guiding device 20. The air guide device 20 , and flows through the first heating element 40 and the second heating element 50 sequentially through the first air outlet opening 211 , and then flows out from the second air outlet opening 151 and the third air outlet opening 152 respectively. When the computer case 10 is placed at different angles so that one of the first air inlet opening 221, the second air inlet opening 231 and the third air inlet opening 241 is closed, the airflow from the outside of the heat dissipation system can also come from other Unclosed air inlet openings flow into the air guiding device 20 .

Claims (10)

1.一种散热系统，包括一底板、一垂直于所述底板的第一侧板、一垂直于所述第一侧板的后板及一垂直于所述第一侧板的前板，所述底板上靠近后板装设一电脑主板，所述电脑主板上装设一第一发热元件，所述底板上靠近前板装设一第二发热元件，其特征在于：所述第一发热元件上装设一导风装置，所述导风装置上开设一第一进风开口、一第二进风开口和一第一出风开口，所述前板上开设一第二出风开口和一第三出风开口，来自散热系统外的风流经由第一进风开口和第二进风开口进入所述导风装置，并经由所述第一出风开口依次流经第一发热元件和第二发热元件后分别从第二出风开口和第三出风开口流出。 1. A cooling system comprising a base plate, a first side plate perpendicular to the base plate, a rear plate perpendicular to the first side plate and a front plate perpendicular to the first side plate, the A computer motherboard is installed on the base plate close to the rear plate, a first heating element is installed on the computer motherboard, a second heating element is installed on the base plate close to the front plate, and it is characterized in that: the first heating element is installed An air guide device is provided, and a first air inlet opening, a second air inlet opening and a first air outlet opening are provided on the air guide device, and a second air outlet opening and a third air outlet opening are provided on the front panel. The air outlet opening, the air flow from the outside of the heat dissipation system enters the air guide device through the first air inlet opening and the second air inlet opening, and flows through the first heating element and the second heating element in sequence through the first air outlet opening Then flow out from the second air outlet opening and the third air outlet opening respectively. 2.如权利要求1所述的散热系统，其特征在于：所述第一侧板上相对于第一进风开口开设若干第一进风开孔，所述后板上相对于第二进风开口开设若干第二进风开孔，来自散热系统外的风流经由第一进风开孔、第二进风开孔、第一进风开口和第二进风开口进入所述导风装置。 2. The heat dissipation system according to claim 1, characterized in that: the first side plate is provided with a number of first air intake openings relative to the first air intake opening, and the rear plate is relatively open with respect to the second air intake opening. The opening is provided with a plurality of second air inlet openings, and the air flow from outside the heat dissipation system enters the air guide device through the first air inlet opening, the second air inlet opening, the first air inlet opening and the second air inlet opening. 3.如权利要求1所述的散热系统，其特征在于：所述第一出风开口和第二出风开口与第一发热元件相对，所述第三出风开口与第二发热元件相对。 3. The heat dissipation system according to claim 1, wherein the first air outlet opening and the second air outlet opening are opposite to the first heating element, and the third air outlet opening is opposite to the second heating element. 4.如权利要求1所述的散热系统，其特征在于：所述第二出风开口上装设一第二风扇，所述第三出风开口上装设一第三风扇。 4. The cooling system according to claim 1, wherein a second fan is installed on the second air outlet opening, and a third fan is installed on the third air outlet opening. 5.如权利要求1所述的散热系统，其特征在于：所述散热系统还包括一垂直于所述底板的第二侧板，所述第一侧板和第二侧板相对，所述第二侧板上开设若干第三进风开孔，所述导风装置上相对于第三进风开孔开设一第三进风开口。 5. The heat dissipation system according to claim 1, characterized in that: the heat dissipation system further comprises a second side plate perpendicular to the bottom plate, the first side plate is opposite to the second side plate, and the first side plate A plurality of third air inlet openings are provided on the two side plates, and a third air inlet opening is provided on the air guiding device relative to the third air inlet openings. 6.如权利要求5所述的散热系统，其特征在于：所述导风装置上于第一进风开口、第二进风开口和第三进风开口内分别装设一挡风装置，每一挡风装置包括一固定架和一装设于所述固定架上的泡棉，所述固定架包括一第一表面和一第二表面，所述固定架上自第一表面垂直延伸出若干弯折部，所述泡棉卡固于若干弯折部之间。 6. The heat dissipation system according to claim 5, wherein a wind shielding device is respectively installed in the first air inlet opening, the second air inlet opening and the third air inlet opening on the air guiding device, each A windshield device includes a fixed frame and a foam installed on the fixed frame, the fixed frame includes a first surface and a second surface, and several vertically extending from the first surface on the fixed frame The bending part, the foam is fixed between several bending parts. 7.如权利要求6所述的散热系统，其特征在于：所述固定架包括一第二表面，所述固定架上自第二表面垂直延伸出一把手，向上拉动所述把手可将固定架滑动的装设于所述第一进风开口、第二进风开口和第三进风开口内。 7. The heat dissipation system according to claim 6, wherein the fixed frame includes a second surface, a handle vertically extends from the second surface on the fixed frame, and the fixed frame can be slid by pulling the handle upwards installed in the first air inlet opening, the second air inlet opening and the third air inlet opening. 8.如权利要求7所述的散热系统，其特征在于：所述导风装置包括一底壁、一垂直于所述底壁的前壁和一垂直于所述底壁的后壁，所述第一进风开口和第三进风开口分别开设于所述前壁和后壁之间，所述第二进风开口开设于后壁上。 8. The cooling system according to claim 7, wherein the air guiding device comprises a bottom wall, a front wall perpendicular to the bottom wall, and a rear wall perpendicular to the bottom wall, the The first air inlet opening and the third air inlet opening are opened between the front wall and the rear wall respectively, and the second air inlet opening is opened on the rear wall. 9.如权利要求7所述的散热系统，其特征在于：所述导风装置上于第一进风开口、第二进风开口和第三进风开口两侧凸设若干相互平行的导向部，每一固定架自相邻两平行的导向部之间滑入相应的第一进风开口、第二进风开口和第三进风开口内。 9. The heat dissipation system according to claim 7, characterized in that: on the air guiding device, a plurality of parallel guiding parts protrude from both sides of the first air inlet opening, the second air inlet opening and the third air inlet opening , each fixing frame slides into the corresponding first air inlet opening, second air inlet opening and third air inlet opening from between two adjacent parallel guide parts. 10.如权利要求9所述的散热系统，其特征在于：相邻两平行的导向部之间距离与所述固定架的厚度相等。 10 . The cooling system according to claim 9 , wherein the distance between two adjacent parallel guiding portions is equal to the thickness of the fixing frame. 11 .
CN2011101731053A 2011-06-24 2011-06-24 Radiating system Pending CN102841662A (en)

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US13/303,250 US20120325432A1 (en) 2011-06-24 2011-11-23 Heat dissipation system

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