JPH0511494U - Electronic device cooling structure - Google Patents

Abstract

(57) [Abstract] [Purpose] To make it possible to switch between cooling structures by sharing the basic structure of the natural convection air cooling structure and the forced convection air cooling structure. A convection guide plate 2 for guiding cooling air into an electronic unit, a back guide plate 3 provided on the back surface of the convection guide plate 2 for guiding and discharging exhaust air from the electronic unit to the outside air, The cooling fan mounting member 6 provided on the front surface of the convection guide plate 2 is provided with a cooling fan mounting hole 7 for forcibly sending cooling air into the electronic unit, and the cooling fan is mounted on the cooling fan mounting member 6. The cooling structure, which is attached to the rear of the back guiding plate 3 when the device is mounted on the air-conditioning device, and which shields the air flow generated on the rear surface of the electronic unit so as not to go around downward, It has become possible to switch between them, and it has become possible to select either natural convection air cooling or forced convection air cooling for each electronic unit that constitutes the electronic device.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a cooling structure for an electronic device including one or a plurality of electronic units, which radiates the heat generated by the electronic unit to the outside air to prevent the function of the electronic device from deteriorating and from failing.

[0002]

[Prior Art]

 Conventionally, in an electronic device including one or a plurality of electronic units, a cooling structure of either natural convection air cooling or forced convection air cooling is usually adopted for each electronic device. That is, the electronic device adopts a natural convection air cooling structure as long as the heat generated from each of the individual electronic units constituting the electronic device is sufficiently radiated by natural convection of air. When the heat dissipation by natural convection air cooling is not enough, it was designed for the forced convection air cooling structure by a cooling fan.

3 to 6 relate to a cooling structure used in a conventional electronic device, FIG. 3 is a perspective view of a natural convection air cooling structure, and FIG. 4 is a perspective view of a forced convection air cooling structure. FIG. 5 is an illustration of an electronic device incorporating a natural convection air cooling structure, and FIG. 6 is an illustration of an electronic device incorporating a forced convection air cooling structure.

The air flowing into the frame 15 of the natural convection air cooling structure 14 from the front opening of the frame 15 is guided into the electronic unit 18 located above the natural convection air cooling structure 14. A convection guide plate 2 is provided. Further, on the back surface of the convection guide plate 2, a back guide plate 3 for guiding the exhaust air from the electronic unit 18 located below the natural convection air cooling structure 14 to the outside air is attached. With the above configuration, the heat generated in the electronic unit 18 warms the air in the electronic unit 18 to generate warm exhaust air, which rises from an exhaust hole (not shown) of the electronic unit 18 to raise the temperature of the other electronic units 18 above. The natural convection air cooling structure 14 is discharged into the outside air along the back guide plate 3. On the other hand, cooling air is taken in from the front opening of the body 15 and guided into the electronic unit 18 along the convection guide plate 2. The arrow C in FIG. 5 represents the air flow of the natural convection air cooling structure 14.

Further, in the forced convection air cooling structure 16, as shown in FIG. 4, a plurality of cooling fan units 20 incorporating a cooling fan (not shown) are provided at the bottom of the skeleton 17. Then, for example, as shown in FIG. 6, the forced convection air cooling structure 16 is provided at the top of the electronic device in which a plurality of electronic units 19 are stacked in a frame structure to drive the cooling fan to force the air to flow. A flow is generated to release heat from the electronic unit 19. The arrow D in FIG. 6 represents the air flow of the forced convection air cooling structure 16.

[0006]

[Problems to be solved by the device]

 However, since the conventional cooling structure described above has different configurations of the natural convection air cooling structure and the forced convection air cooling structure, the natural convection air cooling structure or the forced convection air cooling structure is used when designing the electronic device. I had to choose one. Therefore, in an electronic device that has an electronic unit that requires forced convection air cooling even in part, it is uneconomical to design the entire electronic device into a forced convection air cooling structure. Also, when the forced convection air cooling structure is adopted, the air flow from the cooling fan becomes turbulent, and the cooling performance varies depending on the part of the electronic device.Therefore, the best part considering the heat dissipation efficiency of each electronic unit is adopted. In addition, the forced convection air cooling structure had to be provided, and the design was troublesome.

The present invention has been made in view of the above problems, and an object of the present invention is to cool a natural convection air cooling structure and a forced convection air cooling structure by using a common basic configuration. In order to obtain a cooling structure for an electronic device that enables switching between structures and can select either natural convection air cooling or forced convection air cooling for each electronic unit that constitutes the electronic device. is there.

[0008]

[Means for Solving the Problems]

 In order to achieve the above object, the cooling structure of an electronic device according to the present invention is a cooling structure for an electronic device, which radiates the heat generated by an electronic unit that constitutes the electronic device to the outside air to cool the electronic device. A convection guide plate for guiding cooling air therein, a back guide plate provided on the back surface of the convection guide plate for guiding and discharging exhaust gas from the electronic unit to the outside air, and forcibly in the electronic unit. A cooling fan mounting member having a cooling fan mounting hole for feeding cooling air and provided on the front surface of the convection guide plate; and the back guiding plate when the cooling fan is mounted on the cooling fan mounting member. And an air flow shield plate that is attached to the rear of the electronic unit and shields the air flow generated on the rear surface of the electronic unit so as not to go around downward.

[0009]

[Action]

 Since the cooling structure of the electronic device of the present invention is configured as described above, the natural convection air cooling structure and the forced convection air cooling structure can be installed by attaching and detaching the cooling fan to the front surface of the convection guide plate. Switching can be done very easily and quickly. Further, by appropriately installing an airflow shield behind the back guide plate, it is possible to prevent the turbulent flow generated behind the electronic unit due to the forced convection of the cooling fan from wrapping around.

[0010]

【Example】

 An embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of the cooling structure of the present invention. In this embodiment, the same parts and members as those of the conventional example are designated by the same reference numerals, and detailed description thereof will be omitted.

A cooling fan mounting member 6 for mounting the cooling fan unit 5 is provided at a front opening of the body 4 to which the convection guide plate 2 and the back guide plate 3 are attached. A plurality of circular cooling fan mounting holes 7 (three in this embodiment) are formed in the cooling fan mounting member 6, and a bolt hole 9 is formed around the cooling fan mounting hole 7. ing. The cooling fan unit 5 contains a cooling fan (not shown) together with a motor as a drive source. The cooling fan unit 5 is mounted on the front surface of the cooling fan mounting member 6 and fixed by screwing the mounting bolt 8 into the bolt hole 9.

An airflow shield plate 10 is attached to the rear side of the frame 4 to prevent forced convection by the cooling fan from swirling on the rear surface of the electronic unit to form a turbulent flow and circulate downward. ing. The air flow shield plate 10 is attachable to and detachable from the body 4 by a mounting bolt 8 '.

FIG. 2 is a diagram showing an example in which the cooling structure 1 having the above-described configuration is applied to an electronic device including a plurality of electronic units in a rack structure. In FIG. 2, 11 is an electronic unit that generates a large amount of heat and needs to be cooled by forced convection air, and 12 is an electronic unit that generates a small amount of heat and is sufficiently cooled by natural convection air. The natural convection air cooling structure 1 ′ to which the cooling fan unit 5 is not attached is located below the electronic unit 12. The air taken into the natural convection air cooling structure 1 ′ from the cooling fan mounting hole 7 is guided into the electronic unit 12 by the convection guide plate 2 as shown by an arrow A in the figure, and the electronic unit 12 is cooled. Dissipate the generated heat into the outside air. In addition, in the cooling structure 1, the air flow shielding plate 10 may not be attached.

On the other hand, the forced convection air cooling structure 1 to which the cooling fan unit 5 is attached is located below the electronic unit 11, and the forced convection by the cooling fan is indicated by an arrow B in the figure. After passing through the inside of the electronic unit 11, it is discharged to the outside air along the back guide plate 3 of the natural convection air cooling structure 1 ′ located above the electronic unit 11. Due to the forced convection of the cooling fan, the vortex of the air flow generated in the rear of the electronic unit 11 is blocked by the air flow shield plate 10 mounted in the rear of the cooling structure 1 and flows into the lower electronic unit 13. Therefore, the heat dissipation efficiency of the electronic unit 13 is not adversely affected.

In the above embodiment, the number of the cooling fan units 5 that can be attached to the cooling structure 1 has been described as three, but the number is not limited to this, and four or more cooling fan units are provided. It goes without saying that it may be formed as a cooling structure 1 to which 5 can be attached. Further, by forming a plurality of holes or fins for controlling convection in the convection guide plate 2, the heat dissipation efficiency of the electronic unit can be further enhanced.

[0016]

[Effect of the device]

 According to the cooling structure of the present invention, a convection guide plate for guiding cooling air into the electronic unit and a rear guide plate provided on the back surface of the convection guide plate for guiding and discharging the exhaust air from the electronic unit to the outside air. Plate, a cooling fan mounting hole for forcibly sending cooling air into the electronic unit, a cooling fan mounting member provided on the front surface of the convection guide plate, and the cooling fan. Since it has an air flow shield plate that is attached to the rear of the rear guide plate when it is attached to the attachment member and that shields the air flow generated on the rear surface of the electronic unit from going around downward, it has a forced convection air flow. The cooling structure and the natural convection air cooling structure can be shared, and the switching can be extremely easily performed only by attaching and detaching the cooling fan. In addition, either forced convection air cooling or natural convection air cooling can be selected for each electronic unit that constitutes an electronic device, so there is no need to design the entire electronic device for a forced convection air cooling structure, which is economical. It is possible to obtain a cooling structure for a typical electronic device.

[Brief description of drawings]

FIG. 1 is an exploded perspective view illustrating a configuration of a cooling structure of the present invention.

FIG. 2 is a diagram showing an example in which the cooling structure of the present invention is applied to an electronic device in which an electronic unit requiring forced convection air cooling and an electronic unit requiring natural convection air cooling coexist.

FIG. 3 is a perspective view of a natural convection air cooling structure according to a conventional example of a cooling structure.

FIG. 4 is a perspective view of a forced convection air cooling structure according to a conventional example of a cooling structure.

FIG. 5 is a view showing a conventional cooling structure of an electronic device and a flow of cooling air, and is an explanatory view of a natural convection air cooling structure.

FIG. 6 is an explanatory view showing a forced convection air cooling structure in a conventional cooling structure of an electronic device and a flow of cooling air.

[Explanation of symbols]

 1, 1'Cooling structure 2 Convection guide plate 3 Back guide plate 4 Body 5 Cooling fan unit 6 Cooling fan mounting member 7 Cooling fan mounting hole 8, 8'Mounting bolt 9 Bolt hole 10 Airflow shield plate 11, 12, 13 Electronic unit 14 Natural convection air cooling structure 15,17 Body 16 Forced convection air cooling structure 18,19 Electronic unit 20 Cooling fan unit A, B, C, D Air flow

Claims (1)

Claims for utility model registration 1. A cooling structure for an electronic device, which radiates the heat generated by an electronic unit that constitutes the electronic device to the outside air to cool the electronic device, wherein cooling air is provided in the electronic unit. A convection guide plate for guiding, a back guide plate provided on the back surface of the convection guide plate for guiding and discharging exhaust gas from the electronic unit to the outside air, and a cooling fan for forcibly sending cooling air into the electronic unit. And a cooling fan mounting member provided on the front surface of the convection guide plate, and attached to the rear of the back guide plate when the cooling fan is mounted on the cooling fan mounting member, A cooling structure for an electronic device, comprising: an air flow shielding plate that shields an air flow generated on the rear surface from going downward.