JP2015001635A - Electro-optic device, method for manufacturing electro-optic device, and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optic device having an optical resonant structure that can decrease a leakage current generated between pixels and can extract light of a resonant wavelength for each pixel with high accuracy, and a method for manufacturing an electro-optic device and electronic equipment including the electro-optic device.SOLUTION: An organic EL device 100 as an electro-optic device has light-emitting pixels 20B, 20G, 20R formed on a material 10s of a device substrate 10. The light-emitting pixels 20B, 20G, 20R include an optical resonant structure which shares a power supply line 14 as a reflection layer, a functional layer 32 including a light-emitting layer, and a counter electrode 33, and in which a thickness of an insulating layer between the power supply line 14 and the pixel electrodes 31B, 31G, 31R varies. A recessed portion 28a as a step structure is formed by etching the insulating layer between adjoining pixel electrodes 31B, 31G, 31R.

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus.

The electro-optical device has first, second, and third pixels that emit light having different wavelengths, and the film thickness of the optical distance adjustment layer in each of the first, second, and third pixels However, an electro-optical device having an optical resonance structure that satisfies the relationship of first pixel> second pixel> third pixel and a manufacturing method thereof are disclosed (Patent Document 1).
According to the method for manufacturing an electro-optical device disclosed in Patent Document 1, a light-transmitting film for forming the optical distance adjusting layer is formed, and the film thickness is first pixel> second pixel> third on the light-transmitting film. A mask that satisfies the pixel relationship is formed. After that, the step of removing the masks having different thicknesses by ashing stepwise and the step of etching the light-transmitting film exposed by ashing are combined, so that the thickness of the first pixel> second pixel> third. An example is shown in which the optical distance adjustment layer that satisfies the pixel relationship is formed.

As another electro-optical device, a plurality of organic electroluminescence elements (hereinafter referred to as organic EL elements) and an insulating film provided in an inter-element region between the plurality of organic EL elements are formed on a substrate. A display device in which a groove is provided in the insulating film at a position between adjacent organic EL elements is disclosed (Patent Document 2).
According to the display device disclosed in Patent Document 2, it is possible to suppress the leakage of the drive current between adjacent organic EL elements by providing the groove.

JP 2009-134067 A JP 2012-216338 A

Applying the technique disclosed in Patent Document 2 to the electro-optical device of Patent Document 1 to suppress leakage of drive current between pixels requires a step of forming the groove in the optical distance adjustment layer. There has been a problem that the manufacturing method of the optical device becomes complicated.
In the electro-optical device of Patent Document 1, in order to extract light having a desired resonance wavelength from each of the first pixel, the second pixel, and the third pixel, the thickness of the optical distance adjustment layer is set to the first pixel, the second pixel, and the second pixel. It is required to realize with high accuracy in each of the pixel and the third pixel. However, the method of manufacturing the electro-optical device disclosed in Patent Document 1 has a problem that it is difficult to etch the light-transmitting film with high accuracy. The reason for this is, for example, if an excess or deficiency occurs with respect to the appropriate amount of ashing in the above-mentioned stepwise ashing, the film thickness of the mask after ashing will vary, and the translucent film will be adequate over a desired range. It cannot be etched with the amount of etching. In addition, for example, it is difficult to realize stable etching conditions (such as an etching rate), and the thickness of the light-transmitting film after etching is likely to vary.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example An electro-optical device according to this application example includes a substrate, a first pixel formed on the substrate, and a second pixel adjacent to the first pixel. One pixel includes a reflective layer having light reflectivity, a counter electrode having light reflectivity and light transmissivity, an insulating layer provided between the reflective layer and the counter electrode, and a first pixel electrode. And the functional layer including a light emitting layer, wherein the second pixel includes the reflective layer, the counter electrode, the insulating layer provided between the reflective layer and the counter electrode, A first pixel thickness of the insulating layer between the reflective layer and the first pixel electrode, and a gap between the reflective layer and the second pixel electrode. Unlike the second film thickness of the insulating layer, a step structure is formed in the insulating layer between the adjacent first pixel electrode and the second pixel electrode. And wherein the are.

According to this application example, the first film thickness of the insulating layer between the reflective layer and the first pixel electrode is different from the second film thickness of the insulating layer between the reflective layer and the second pixel electrode. As a result, a step structure is formed in the insulating layer between the adjacent first pixel electrode and second pixel electrode. Accordingly, it is possible to provide an electro-optical device that can reduce the leakage current between the first pixel and the second pixel without newly providing a step for providing the step structure.
Note that the reflective layer may be provided in common to the first pixel and the second pixel, or provided in correspondence with the reflective layer provided corresponding to the first pixel and the second pixel. And a reflective layer. In addition, the light emitting layer may be provided in common to the first pixel and the second pixel, or is provided corresponding to the light emitting layer provided corresponding to the first pixel and the second pixel. It may have a light emitting layer.

In the electro-optical device according to the application example, each of the first pixel electrode and the second pixel electrode has a rectangular shape in plan view, and is adjacent to the first pixel electrode and the second pixel electrode in a short direction. Preferably, the step structure is formed in the insulating layer between the first and second pixel electrodes, and the step structure extends in a longitudinal direction of the first pixel electrode and the second pixel electrode.
According to this configuration, since the step structure is formed on the side where the leakage current easily flows between the first pixel and the second pixel, the leakage current can be effectively reduced.

  In the electro-optical device according to the application example, the insulating layer includes a first insulating layer, a second insulating layer, and a third insulating layer stacked in order from the reflective layer side, and the step structure includes at least the second step structure. Preferably, the recess is formed through the insulating layer and the third insulating layer.

In the electro-optical device according to the application example, the insulating layer includes a first insulating layer, a second insulating layer, and a third insulating layer stacked in order from the reflective layer side, and the step structure includes at least the second step structure. It is good also as a convex part formed using the insulating layer and the said 3rd insulating layer.
According to these configurations, the leakage current between the first pixel and the second pixel can be reduced by providing the stepped structure of the concave portion or the convex portion in the insulating layer.

The electro-optical device according to the application example further includes a third pixel adjacent to the second pixel, and the third pixel includes the reflective layer, the counter electrode, and the reflective layer. The insulating layer, the third pixel electrode, and the functional layer provided between the electrodes, and the insulating layer is a first insulating layer and a second insulating layer stacked in order from the reflective layer side , The third pixel electrode is disposed on the third insulating layer, and a third film thickness of the insulating layer between the reflective layer and the counter electrode is the insulating layer. Unlike the first film thickness and the second film thickness, the step structure is preferably formed in the insulating layer between the adjacent second pixel electrode and the third pixel electrode.
According to this configuration, in addition to reducing the leakage current between the first pixel and the second pixel, the leakage current between the second pixel and the third pixel can also be reduced. If the first pixel, the second pixel, and the third pixel emit light of red (R), green (G), and blue (color), for example, excellent full color display quality is obtained. An electro-optical device having the above can be realized.

In the electro-optical device according to the application example, it is preferable that the reflective layer is not provided between the substrate and the step structure on the substrate.
According to this configuration, even if a leakage current occurs between the first pixel and the second pixel and unintentional light emission occurs, the reflective layer is not provided in a portion corresponding to the area between the pixels. Unintentional light emission is inconspicuous, that is, it is difficult to see.

  [Application Example] A method of manufacturing an electro-optical device according to this application example includes a substrate, a first pixel formed on the substrate, and a second pixel adjacent to the first pixel. The first pixel includes a reflective layer having light reflectivity, a counter electrode having light reflectivity and light transmittance, an insulating layer provided between the reflective layer and the counter electrode, The insulating layer including one pixel electrode and a functional layer including a light emitting layer, wherein the second pixel is provided between the reflective layer, the counter electrode, and the reflective layer and the counter electrode. And a second pixel electrode and the functional layer, wherein the insulating layer is formed over the first pixel and the second pixel, and the reflection is performed. A first film thickness of the insulating layer between the layer and the first pixel electrode, and a front layer between the reflective layer and the second pixel electrode. Etching the insulating layer so that the second thickness of the insulating layer is different, and etching the insulating layer between the adjacent first pixel electrode and the second pixel electrode to form a step structure Forming the first pixel electrode on the insulating layer having the first film thickness, and forming the second pixel electrode on the insulating layer having the second film thickness. The method includes a forming step, a step of forming the functional layer in contact with the first pixel electrode and the second pixel electrode, and a step of forming the counter electrode covering the functional layer.

  According to the method for manufacturing the electro-optical device according to this application example, the first film thickness of the insulating layer between the reflective layer and the first pixel electrode, and the insulating layer between the reflective layer and the second pixel electrode. In the step of etching the insulating layer so that the second film thickness is different, a step structure is formed in the insulating layer between the adjacent first pixel electrode and the second pixel electrode. Accordingly, it is possible to provide an electro-optical device manufacturing method capable of reducing the leakage current between the first pixel and the second pixel without newly providing a step for providing the step structure.

  In the method of manufacturing the electro-optical device according to the application example, in the step of etching the insulating layer, the insulating layer between the adjacent first pixel electrode and the second pixel electrode is etched to form the step structure. A recess is formed.

In the method of manufacturing the electro-optical device according to the application example, in the step of etching the insulating layer, the insulating layer between the adjacent first pixel electrode and the second pixel electrode is etched to form the step structure. The convex portion may be formed.
According to these methods, since the insulating layer is etched to form the concave portion or the convex portion as the step structure, the leakage current between the first pixel and the second pixel can be reduced.

In the method of manufacturing the electro-optical device according to the application example, in the step of forming the insulating layer, a first insulating layer, a second insulating layer, and a third insulating layer are stacked in order from the reflective layer side. In the step of etching the insulating layer, the third insulating layer is etched to form a first opening at a position corresponding to the first pixel electrode and the second pixel electrode, and the first opening is formed. Etching the exposed second insulating layer to form a second opening at a position corresponding to the first pixel electrode. In the pixel electrode forming step, the first insulating layer is formed in the second opening. The first pixel electrode is formed thereon, and the second pixel electrode is formed on the second insulating layer in the first opening.
According to this method, the third insulating layer is etched to form the first opening, and then the second insulating layer is etched to form the second opening. Therefore, the first insulating layer is not etched as compared to the case where one insulating layer is etched stepwise as in Patent Document 1 described above, and therefore, between the reflective layer and the first pixel electrode, and between the reflective layer and the first layer. Variation in film thickness, that is, optical distance due to etching of the insulating layer between the two pixel electrodes can be suppressed. Therefore, an electro-optical device including the first pixel and the second pixel that can obtain desired optical characteristics can be manufactured.

The electro-optical device manufacturing method according to the application example further includes a third pixel formed on the substrate, wherein the third pixel includes the reflective layer, the counter electrode, and the reflective layer. In the step including the insulating layer, the third pixel electrode, and the functional layer provided between the counter electrode and etching the insulating layer, between the reflective layer and the third pixel electrode. The insulating layer is etched so that the third film thickness of the insulating layer differs from the first film thickness and the second film thickness of the insulating layer, and the adjacent second pixel electrode The step structure is formed by etching the insulating layer between the first pixel electrode and the third pixel electrode.
According to this method, in addition to reducing the leakage current between the first pixel and the second pixel, the leakage current between the second pixel and the third pixel can also be reduced. If the first pixel, the second pixel, and the third pixel emit light of red (R), green (G), and blue (color), for example, excellent full color display quality is obtained. Can be manufactured.

In the method of manufacturing the electro-optical device according to the application example, the method includes: forming the reflective layer on the substrate so as to correspond to the first pixel electrode, the second pixel electrode, and the third pixel electrode. Preferably, the step of forming the reflective layer includes a step of removing the reflective layer between the substrate and the step structure.
According to this method, even if a leakage current occurs between the first pixel and the second pixel and unexpected light emission occurs, the reflective layer corresponding to the portion between the pixels is removed. Thus, it is possible to manufacture an electro-optical device in which unexpected light emission is hardly noticeable, that is, difficult to be visually recognized.

  [Application Example] An electronic apparatus according to this application example includes the electro-optical device described in the application example.

  Another electronic apparatus according to the application example includes an electro-optical device formed by using the method for manufacturing the electro-optical device described in the application example.

  According to these application examples, the leakage current between the pixels is reduced, and desired optical characteristics are realized, and an electronic apparatus having excellent display quality can be provided.

1 is a schematic plan view illustrating a configuration of an organic EL device as an electro-optical device according to a first embodiment. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of a light emitting pixel. The schematic plan view which shows the structure of a luminescent pixel. The schematic sectional drawing which shows a structure when a luminescent pixel is cut along the X direction. The schematic sectional drawing which shows a structure when a luminescent pixel is cut along the Y direction. The schematic plan view which shows arrangement | positioning of a power wire. The flowchart which shows the manufacturing method of the organic electroluminescent apparatus of 1st Embodiment. (A)-(f) is a schematic sectional drawing which shows the manufacturing method of the organic electroluminescent apparatus of 1st Embodiment. The schematic plan view which shows the structure of the light emission pixel in the organic electroluminescent apparatus of 2nd Embodiment. The schematic sectional drawing which shows the structure of the light emission pixel in the organic electroluminescent apparatus of 2nd Embodiment. The flowchart which shows the manufacturing method of the organic electroluminescent apparatus of 2nd Embodiment. (A)-(f) is a schematic sectional drawing which shows the manufacturing method of the organic electroluminescent apparatus of 2nd Embodiment. Schematic which shows the head mounted display as an example of an electronic device. The schematic sectional drawing which shows the structure of the light emission pixel of the organic electroluminescent apparatus of a modification. (A) And (b) is a schematic plan view which shows the level | step difference structure of a modification.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

  In the following embodiments, for example, when “on the substrate” is described, the substrate is disposed so as to be in contact with the substrate, or is disposed on the substrate via another component, or the substrate. It is assumed that a part is arranged so as to be in contact with each other and a part is arranged via another component.

(First embodiment)
<Electro-optical device>
First, as an example of the electro-optical device according to the present embodiment, an organic electroluminescence device (hereinafter referred to as an organic EL device) will be given and described with reference to FIGS.

FIG. 1 is a schematic plan view showing a configuration of an organic EL device as an electro-optical device according to the first embodiment, FIG. 2 is an equivalent circuit diagram showing an electrical configuration of a light emitting pixel, and FIG. 3 is a schematic showing a configuration of the light emitting pixel. It is a top view.
As shown in FIG. 1, an organic EL device 100 as an electro-optical device according to this embodiment includes an element substrate 10 as a substrate, and a plurality of light emitting pixels 20 arranged in a matrix in a display area E of the element substrate 10. A data line driving circuit 101 and a scanning line driving circuit 102 which are peripheral circuits for driving and controlling the plurality of light emitting pixels 20, and a plurality of external connection terminals 103 for electrical connection with an external circuit. Yes.

The light emitting pixel 20 includes a light emitting pixel 20B that can emit blue (B) light, a light emitting pixel 20G that can emit green (G) light, and a light emitting pixel 20R that can emit red (R) light. The light emitting pixels 20 that can emit light of the same color are arranged in the vertical direction on the drawing, and the light emitting pixels 20 that can emit light of different colors are repeatedly arranged in the order of B, G, and R in the horizontal direction on the drawing. ing. Such an arrangement of the light emitting pixels 20 is called a stripe method, but is not limited thereto. For example, the arrangement in the horizontal direction of the light emitting pixels 20 that can emit light of different colors may not be in the order of B, G, and R, and may be in the order of R, G, and B, for example.
Hereinafter, the vertical direction in which the light emitting pixels 20 that can emit light of the same color are arranged is referred to as the Y direction, and the direction orthogonal to the Y direction is referred to as the X direction.

  Although the detailed configuration of the light emitting pixel 20 will be described later, each of the light emitting pixels 20B, 20G, and 20R in the present embodiment is an organic electroluminescent element (hereinafter referred to as an organic EL element) as a light emitting element, and B, G, R. And a color filter corresponding to each of the colors, and the light emitted from the organic EL element is converted into each color of B, G, and R to enable full color display. In addition, an optical resonant structure that improves the luminance of a specific wavelength in the emission wavelength range from the organic EL element is constructed for each of the light emitting pixels 20B, 20G, and 20R.

  In the organic EL device 100, the light emitting pixels 20B, 20G, and 20R function as sub-pixels. In the image display, the three light emitting pixels 20B, 20G, and 20R that can emit light corresponding to B, G, and R are used. One pixel unit is configured. The configuration of the pixel unit is not limited to this, and the light emitting pixel 20 that can obtain a light emission color (including white) other than B, G, and R may be included in the pixel unit.

  A plurality of external connection terminals 103 are arranged in the X direction along the first side of the element substrate 10. In addition, the data line driving circuit 101 is disposed between the external connection terminal 103 and the display area E in the Y direction and extends in the X direction. In addition, a pair of scanning line driving circuits 102 are provided so as to face each other across the display region E in the X direction.

As described above, the display area E is provided with a plurality of light emitting pixels 20 in a matrix, and the element substrate 10 has scanning lines 11 as signal lines corresponding to the light emitting pixels 20 as shown in FIG. A data line 12, a lighting control line 13, and a power line 14 are provided.
In the present embodiment, the scanning line 11 and the lighting control line 13 extend in parallel in the X direction, and the data line 12 and the power supply line 14 extend in parallel in the Y direction.
In the display area E, a plurality of scanning lines 11 and a plurality of lighting control lines 13 are provided corresponding to M rows in the plurality of light emitting pixels 20 arranged in a matrix, and the pair of scanning lines shown in FIG. Each of the driving circuits 102 is connected. A plurality of data lines 12 and a plurality of power supply lines 14 are provided corresponding to N columns in the plurality of light emitting pixels 20 arranged in a matrix, and the plurality of data lines 12 are the data lines shown in FIG. Connected to the drive circuit 101, the plurality of power supply lines 14 are connected to one of the plurality of external connection terminals 103.

Near the intersection of the scanning line 11 and the data line 12, a first transistor 21, a second transistor 22, a third transistor 23, a storage capacitor 24, and an organic EL element that is a light emitting element are included in the pixel circuit of the light emitting pixel 20. 30 is provided.
The organic EL element 30 includes a pixel electrode 31 that is an anode, a counter electrode 33 that is a cathode, and a functional layer 32 including a light emitting layer sandwiched between these electrodes. The counter electrode 33 is an electrode provided in common across the plurality of light emitting pixels 20, and, for example, a lower reference potential Vss or GND potential is applied to the power supply voltage Vdd applied to the power supply line 14.

  The first transistor 21 and the third transistor 23 are, for example, n-channel transistors. The second transistor 22 is, for example, a p-channel type transistor.

The gate electrode of the first transistor 21 is connected to the scanning line 11, one current end is connected to the data line 12, and the other current end is connected to the gate electrode of the second transistor 22 and one electrode of the storage capacitor 24. It is connected.
One current end of the second transistor 22 is connected to the power supply line 14 and to the other electrode of the storage capacitor 24. The other current end of the second transistor 22 is connected to one current end of the third transistor 23. In other words, the second transistor 22 and the third transistor 23 share one current end of the pair of current ends.
The gate electrode of the third transistor 23 is connected to the lighting control line 13, and the other current end is connected to the pixel electrode 31 of the organic EL element 30.
One of the pair of current ends in each of the first transistor 21, the second transistor 22, and the third transistor 23 is a source, and the other is a drain.

  In such a pixel circuit, when the voltage level of the scanning signal Yi supplied from the scanning line driving circuit 102 to the scanning line 11 becomes Hi level, the n-channel first transistor 21 is turned on (ON). The data line 12 and the storage capacitor 24 are electrically connected via the first transistor 21 in the on state (ON). When a data signal is supplied from the data line driving circuit 101 to the data line 12, a potential difference between the voltage level Vdata of the data signal and the power supply voltage Vdd applied to the power supply line 14 is stored in the storage capacitor 24.

  When the voltage level of the scanning signal Yi supplied from the scanning line driving circuit 102 to the scanning line 11 becomes low level, the n-channel first transistor 21 is turned off (OFF), and the second transistor 22 is connected between the gate and the source. The voltage Vgs is held at the voltage when the voltage level Vdata is given. In addition, after the scanning signal Yi becomes Low level, the voltage level of the lighting control signal Vgi supplied to the lighting control line 13 becomes Hi level, and the third transistor 23 is turned on (ON). Then, a current corresponding to the gate-source voltage Vgs of the second transistor 22 flows between the source and drain of the second transistor 22. Specifically, this current flows through a path from the power supply line 14 to the organic EL element 30 via the second transistor 22 and the third transistor 23.

  The organic EL element 30 emits light according to the magnitude of the current flowing through the organic EL element 30. The current flowing through the organic EL element 30 is determined by the operating point of the second transistor 22 and the organic EL element 30 set by the gate-source voltage Vgs of the second transistor 22. The gate-source voltage Vgs of the second transistor 22 is a voltage held in the storage capacitor 24 due to the potential difference between the voltage level Vdata of the data line 12 and the power supply voltage Vdd when the scanning signal Yi is at the Hi level. As described above, the light emission luminance of the light emitting pixel 20 is defined by the voltage level Vdata in the data signal and the length of the period during which the third transistor 23 is turned on. That is, the value of the voltage level Vdata in the data signal can give the luminance gradation in accordance with the image information in the light emitting pixels 20 and enables full color display.

In the present embodiment, the pixel circuit of the light emitting pixel 20 is not limited to having the three transistors 21, 22, and 23, and may be configured to have a switching transistor and a driving transistor. In addition, a transistor included in the pixel circuit may be an n-channel transistor, a p-channel transistor, or may include both an n-channel transistor and a p-channel transistor. The transistor constituting the pixel circuit of the light emitting pixel 20 may be a MOS transistor having an active layer on a semiconductor substrate, a thin film transistor, or a field effect transistor.
Further, the arrangement of the lighting control lines 13 and the power supply lines 14 which are signal lines other than the scanning lines 11 and the data lines 12 depends on the arrangement of the transistors and the storage capacitors 24, and is not limited thereto.
In the present embodiment, an example in which a MOS transistor having an active layer on a semiconductor substrate is employed as a transistor constituting the pixel circuit of the light emitting pixel 20 will be described below.

<Configuration of light emitting pixel>
A specific configuration of the light emitting pixel 20 will be described with reference to FIG. As shown in FIG. 3, each of the light emitting pixels 20 </ b> B, 20 </ b> G, and 20 </ b> R has a rectangular shape in plan view, and the longitudinal direction is arranged along the Y direction. Each of the light emitting pixels 20B, 20G, and 20R is provided with the organic EL element 30 of the equivalent circuit shown in FIG. In order to distinguish the organic EL element 30 provided for each of the light emitting pixels 20B, 20G, and 20R, the organic EL elements 30B, 30G, and 30R may be described. Further, in order to distinguish the pixel electrode 31 of the organic EL element 30 for each of the light emitting pixels 20B, 20G, and 20R, the pixel electrode 31 may be described as the pixel electrodes 31B, 31G, and 31R.

The light emitting pixel 20B is provided with a pixel electrode 31B and a contact portion 31Bc that electrically connects the pixel electrode 31B and the third transistor 23. Similarly, the light emitting pixel 20G is provided with a pixel electrode 31G and a contact portion 31Gc that electrically connects the pixel electrode 31G and the third transistor 23. The light emitting pixel 20 </ b> R is provided with a pixel electrode 31 </ b> R and a contact portion 31 </ b> Rc that electrically connects the pixel electrode 31 </ b> R and the third transistor 23.
The pixel electrodes 31B, 31G, and 31R are also rectangular in plan view, and the contact portions 31Bc, 31Gc, and 31Rc are arranged on the upper side in the longitudinal direction.

Each of the light emitting pixels 20B, 20G, and 20R electrically insulates the adjacent pixel electrodes 31 from each other, and the opening 29B that defines a region in contact with the functional layer 32 (see FIG. 4) on the pixel electrodes 31B, 31G, and 31R. , 29G, 29R are formed.
Further, the insulating structure is a recess 28a as a step structure provided at a position corresponding to a boundary between the light emitting pixel 20B and the light emitting pixel 20G adjacent to each other in the X direction and between the light emitting pixel 20G and the light emitting pixel 20R. have. The recess 28a is provided along the longitudinal direction of the rectangular light emitting pixels 20B, 20G, and 20R. The light emitting pixels 20B, 20G, and 20R are not limited to a rectangular shape, and the length of one side only needs to be longer than the other side, and a track shape or an ellipse having sides formed by arcs. It may be in shape. The detailed configuration and structure of the recess 28a will be described later.

  In the present embodiment, the light emitting pixel 20B corresponds to the first pixel of the present invention, the light emitting pixel 20G corresponds to the second pixel of the present invention, and the light emitting pixel 20R corresponds to the present invention. This corresponds to the third pixel. Accordingly, the pixel electrode 31B corresponds to the first pixel electrode of the present invention, the pixel electrode 31G corresponds to the second pixel electrode of the present invention, and the pixel electrode 31R corresponds to the third pixel electrode of the present invention.

  Further, the functions of the pixel electrodes 31B, 30G, and 30R for injecting charges into the functional layers 32 of the organic EL elements 30B, 30G, and 30R are defined by the openings 29B, 29G, and 29R in the insulating structure. , Each of which is in contact with the functional layer 32. Therefore, in each of the pixel electrodes 31B, 31G, and 31R, a portion covered with a fourth insulating layer 29 (see FIGS. 4 and 5), which will be described later, passes through the contact portions 31Bc, 31Gc, and 31Rc. The wiring portion is electrically connected to the transistor 23. That is, it can be said that the portions of the pixel electrodes 31B, 31G, and 31R that are in contact with the functional layer 32 correspond to the first pixel electrode, the second pixel electrode, and the third pixel electrode in the present invention.

  The width in the short direction of the recess 28a is preferably half or more than the space between the substantially functioning pixel electrodes 31B, 31G, 31R in the openings 29B, 29G, 29R. For example, in this embodiment, the size of the openings 29B, 29G, and 29R is 4 μm × 12 μm, the interval is 1 μm, and the width in the short direction of the recess 28a is 0.5 μm.

<Structure of light-emitting pixels>
Next, the structure of the light emitting pixel 20 will be described with reference to FIGS. 4 is a schematic cross-sectional view showing a structure when the light-emitting pixel is cut along the X direction, and FIG. 5 is a schematic cross-sectional view showing a structure when the light-emitting pixel is cut along the Y direction. In FIG. 4, in the pixel circuit, the first transistor 21 and the second transistor 22, the wiring related to the first transistor 21 and the second transistor 22, and the like are shown, and the third transistor 23 is not shown. FIG. 5 shows the second transistor 22 and the third transistor 23 in the pixel circuit, wirings related to the second transistor 22 and the third transistor 23, and the like, and the illustration of the first transistor 21 is omitted. FIG. 5 shows a structure when the light emitting pixel 20G is cut along the Y direction.

  As shown in FIG. 4, the organic EL device 100 includes an element substrate 10 on which light emitting pixels 20B, 20G, and 20R, a color filter 50, and the like are formed, and a light-transmitting sealing substrate 70. The element substrate 10 and the sealing substrate 70 are bonded together by a resin layer 60 having both adhesiveness and transparency. The color filter 50 has filter layers 50B, 50G, and 50R corresponding to B, G, and R colors. The filter layers 50B, 50G, and 50R are arranged on the element substrate 10 so as to correspond to the light emitting pixels 20B, 20G, and 20R, respectively. The light emitted from the functional layer 32 passes through one of the corresponding filter layers 50B, 50G, and 50R and is emitted from the sealing substrate 70 side. That is, the organic EL device 100 has a top emission structure.

Since the organic EL device 100 has a top emission structure, the base material 10s of the element substrate 10 can use not only a transparent glass substrate but also an opaque ceramic substrate or semiconductor substrate.
In the present embodiment, a semiconductor substrate is used as the base material 10s. The semiconductor substrate is, for example, a silicon substrate.

  In the base material 10s, an ion implantation which is an active layer formed by injecting into the well 10w a well portion 10w formed by implanting ions into the semiconductor substrate, and ions of a type different from the well 10w. 10d. The well portion 10w functions as a channel of the transistors 21, 22, 23 in the light emitting pixel 20, and the ion implantation portion 10d functions as a source / drain of the transistors 21, 22, 23 in the light emitting pixel 20 and a part of wiring. It is.

  Next, an insulating film 10a is formed to cover the surface of the base material 10s on which the ion implantation part 10d and the well part 10w are formed. The insulating film 10a functions as a gate insulating film. A conductive film such as polysilicon is formed on the insulating film 10a and patterned to form the gate electrode 22g. The gate electrode 22g is disposed so as to face the well portion 10w that functions as a channel of the second transistor 22. The gate electrodes are similarly arranged in the other first transistors 21 and third transistors 23.

  Next, a first interlayer insulating film 15 covering the gate electrode 22g is formed. Then, a contact hole that penetrates through the first interlayer insulating film 15 and reaches, for example, the drain of the first transistor 21 and the gate electrode 22g of the second transistor 22 is formed. A conductive film that covers at least the inside of the contact hole and covers the surface of the first interlayer insulating film 15 is formed. By patterning the conductive film, for example, the drain electrode 21d of the first transistor 21 and the gate of the second transistor 22 are formed. A wiring connected to the electrode 22g is formed.

  Next, a second interlayer insulating film 16 that covers various wirings on the first interlayer insulating film 15 is formed. Then, a contact hole that penetrates through the second interlayer insulating film 16 and reaches the wiring formed on the first interlayer insulating film 15 is formed. A conductive film that covers the contact hole and covers the surface of the second interlayer insulating film 16 is formed. By patterning the conductive film, for example, one electrode 24a of the storage capacitor 24, the one electrode 24a, A contact portion that electrically connects the gate electrode 22g of the second transistor 22 is formed. Further, the data line 12 is formed in the same layer as the one electrode 24a. The data line 12 is connected to the source of the first transistor 21 by a wiring not shown in FIG.

  Next, a dielectric layer (not shown in FIG. 4) covering at least one electrode 24a is formed. Further, the other electrode 24b of the storage capacitor 24 is formed at a position facing the one electrode 24a with the dielectric layer interposed therebetween. Thereby, the storage capacitor 24 having a dielectric layer between the pair of electrodes 24a and 24b is formed.

  Next, a third interlayer insulating film 17 that covers the data line 12 and the storage capacitor 24 is formed. A contact hole that penetrates through the third interlayer insulating film 17 and reaches, for example, the other electrode 24b of the storage capacitor 24 and the wiring formed on the second interlayer insulating film 16 is formed. A conductive film that covers at least the inside of the contact hole and covers the surface of the third interlayer insulating film 17 is formed. By patterning the conductive film, a contact for connecting the power line 14 and the power line 14 to the other electrode 24b is formed. Part is formed.

FIG. 6 is a schematic plan view showing the arrangement of the power supply lines. In the present embodiment, the power supply line 14 is formed using a metal such as Al (aluminum) or Ag (silver), or an alloy of these metals, which has both light reflectivity and conductivity. Further, as shown in FIG. 6, the power supply line 14 has an opening 14a and an opening 14b. The rectangular opening 14a in plan view extends in the Y direction corresponding to the boundary between the light emitting pixel 20B and the light emitting pixel 20G adjacent in the X direction and between the light emitting pixel 20G and the light emitting pixel 20R. Is formed. That is, the opening 14a is formed in a portion overlapping the concave portion 28a as the step structure described above. Similarly, the rectangular opening 14b in plan view is formed in a portion overlapping the contact portions 31Bc, 31Gc, 31Rc of the light emitting pixels 20B, 20G, 20R. Further, the power supply line 14 is formed so as to form a plane that faces the pixel electrodes 31B, 31G, and 31R and extends over the display region E in which the light emitting pixels 20B, 20G, and 20R are provided. Portions of the power supply line 14 facing the pixel electrodes 31B, 31G, and 31R function as a reflective layer.
Note that the power supply line 14 may be formed using a conductive material, and a reflective layer may be provided between the power supply line 14 and the pixel electrodes 31B, 31G, and 31R. The reflective layer may be provided in common or independently for each of the pixel electrodes 31B, 31G, and 31R.

  Here, a cross-sectional structure in the Y direction of the light emitting pixel 20 (light emitting pixel 20G) will be described with reference to FIG. As shown in FIG. 5, the base portion 10 s is provided with a well portion 10 w shared by the second transistor 22 and the third transistor 23. Three wells 10w are provided with three ion implantation portions 10d. Of the three ion implanters 10d, the ion implanter 10d located at the center functions as a drain 22d (23d) shared by the second transistor 22 and the third transistor 23. An insulating film 10a is provided to cover the well portion 10w. Then, a conductive film such as polysilicon is formed so as to cover the insulating film 10a, and the gate electrode 22g of the second transistor 22 and the gate of the third transistor 23 are formed on the insulating film 10a by patterning the conductive film. An electrode 23g is formed. Each of the gate electrodes 22g and 23g is disposed so as to face a portion functioning as a channel in the well portion 10w between the central-side ion implantation portion 10d and the end-side ion implantation portion 10d.

Next, the gate electrode 22g of the second transistor 22 is connected to one of the storage capacitors 24 provided on the second interlayer insulating film 16 by a contact hole penetrating the first interlayer insulating film 15 and the second interlayer insulating film 16. Are connected to the electrode 24a. The source electrode 22 s of the second transistor 22 is connected to the power supply line 14 provided on the third interlayer insulating film 17 through a contact hole that penetrates the second interlayer insulating film 16 and the third interlayer insulating film 17.
The gate electrode 23 g of the third transistor 23 is connected to the lighting control line 13 provided on the first interlayer insulating film 15 by a contact hole penetrating the first interlayer insulating film 15. On the first interlayer insulating film 15, the scanning line 11 is provided in addition to the lighting control line 13. The scanning line 11 is connected to the gate of the first transistor 21 via a contact hole not shown in FIG.
The source electrode 23 s of the third transistor 23 includes an insulating layer 28 (third insulating layer) formed by a contact hole that penetrates the second interlayer insulating film 16 and the third interlayer insulating film 17 and a contact hole 107 that penetrates the insulating layer 28. It is connected to the wiring 106 provided on the layer 27). The wiring 106 is provided corresponding to the contact portion 31Gc of the light emitting pixel 20G, and the wiring 106 and the pixel electrode 31G are in contact with each other at the contact portion 31Gc so that electrical connection is achieved.

  The electrical connection between each of the pixel electrodes 31B and 31R of the light emitting pixels 20B and 20R and the corresponding source electrode 23s of the third transistor 23 is performed through the contact portion 31Bc and the contact portion 31Rc as in the light emitting pixel 20G. (See FIG. 3).

  The organic EL element 30 is provided on the power supply line 14 that functions as a reflective layer. In addition, an optical resonance structure that can extract light having different resonance wavelengths for each of the light emitting pixels 20B, 20G, and 20R is constructed on the power supply line. As described above, the power supply line 14 is formed so as to cover the surface of the third interlayer insulating film 17 over the display region E in which the light emitting pixels 20B, 20G, and 20R are provided in a plan view. Further, the power supply line 14 is patterned so as to remove a portion overlapping the concave portion 28a as a step structure and a portion overlapping the contact portions 31Bc, 31Gc, and 31Rc. Accordingly, the unevenness due to the configuration of the pixel circuit provided in the lower layer than the power supply line 14 has a structure that hardly affects the optical resonance structure provided in the upper layer than the power supply line 14.

  Since the optical resonance structure provided above the power supply line 14 corresponds to a characteristic part of the present invention, hereinafter, as a method for manufacturing the electro-optical device according to the present embodiment, a specific description will be given with reference to FIGS. explain. FIG. 7 is a flowchart showing the method for manufacturing the organic EL device of the first embodiment, and FIGS. 8A to 8F are schematic cross-sectional views showing the method for manufacturing the organic EL device of the first embodiment. 8 corresponds to a schematic cross-sectional view in the X direction of the light emitting pixels 20B, 20G, and 20R in FIG. 4, and illustrates pixel circuits and wirings provided below the power supply line 14 in the base material 10s. Is omitted.

<Method of manufacturing electro-optical device>
As shown in FIG. 7, the manufacturing method of the organic EL device 100 as the electro-optical device of the present embodiment includes an insulating layer forming step (step S1), an opening / recess forming step (step S2), and a pixel electrode forming step. It includes a step (step S3), a fourth insulating layer forming step (step S4), a functional layer forming step (step S5), and a counter electrode forming step (step S6). The opening / recess forming step corresponds to the insulating layer etching step in the present invention.

In step S1 of FIG. 7, the first insulating layer 25 is formed so as to cover the power supply line 14 as shown in FIG. Subsequently, a second insulating layer 26 and a third insulating layer 27 are stacked on the first insulating layer 25. In this embodiment, silicon nitride (SiN) is used as an insulating material for forming the first insulating layer 25. Silicon oxide (SiO ₂ ) is used as an insulating material for forming the second insulating layer 26 and the third insulating layer 27. As described above, the different insulating materials are used in order to give an etching selectivity to the first insulating layer 25 in the subsequent patterning of the second insulating layer 26 and the third insulating layer 27. is there. The stacked first insulating layer 25, second insulating layer 26, and third insulating layer 27 are collectively referred to as an insulating layer 28. Then, the process proceeds to step S2. Before forming the first insulating layer 25, the power supply line 14 is patterned so that the opening 14a is opened at a portion corresponding to the boundary between the adjacent light emitting pixels 20B, 20G, and 20R.

  Next, in step S2 of FIG. 7, first, as shown in FIG. 8B, a photosensitive resist layer covering the insulating layer 28 is formed, and a resist pattern 81 is formed by exposure and development. The resist pattern 81 has an opening 81a opened above the power supply line 14 corresponding to the light emitting pixel 20B and the light emitting pixel 20G, and an opening 81b opened in a boundary portion corresponding to the adjacent light emitting pixels 20 in the X direction. It is formed. The portion of the third insulating layer 27 located above the power supply line 14 corresponding to the light emitting pixel 20R is covered with a photosensitive resist layer. Then, the third insulating layer 27 exposed in the opening 81a and the opening 81b is partially etched, and as shown in FIG. 8C, the pixel electrode 31B of the light emitting pixel 20B and the pixel of the light emitting pixel 20G in plan view. The electrode 31G forms an opening 27c in which each electrode is disposed later. In addition, an opening 27 b is formed between the light emitting pixels 20. When viewed from the normal direction with respect to the surface of the insulating layer 28 formed on the base material 10s, as shown in FIG. 3, an opening 27a is formed that opens between the light emitting pixel 20B and the light emitting pixel 20G. The opening 27a formed in the third insulating layer 27 includes an opening 27c formed corresponding to each of the light emitting pixels 20B and 20G, and an opening 27b formed between the light emitting pixels 20B, 20G, and 20R. This is an example of the first opening of the present invention.

Subsequently, as shown in FIG. 8D, a photosensitive resist layer covering the insulating layer 28 is formed, and a resist pattern 82 is formed by exposure and development. In the resist pattern 82, an opening 82a that exposes the opening 27c formed corresponding to the light emitting pixel 20B of the third insulating layer 27 is formed. Further, an opening 82b that exposes the opening 27b of the third insulating layer 27 is formed. The opening 27c formed corresponding to the light emitting pixel 20G and the portion of the third insulating layer 27 located above the power supply line 14 corresponding to the light emitting pixel 20R are covered with a photosensitive resist layer. Then, the second insulating layer 26 exposed in the opening 82a and the opening 82b is partially etched, and as shown in FIG. 8E, the pixel electrode 31B of the light emitting pixel 20B is disposed later in plan view. Opening 26c is formed. The opening 26c is an example of the second opening of the present invention. Further, a recess 28a penetrating the second insulating layer 26 and the third insulating layer 27 is formed between the light emitting pixels 20B, 20G, and 20R adjacent in the X direction. A portion including the opening 26c and the recess 28a formed in the second insulating layer 26 corresponds to the opening 26a shown in FIG. As an etching method of the second insulating layer 26 and the third insulating layer 27 formed using silicon oxide, for example, a dry etching method using a processing gas containing fluorine such as CF ₄ or C ₂ F ₈ is used. preferable. Then, the process proceeds to step S3.

In step S3 of FIG. 7, as shown in FIG. 8 (f), a transparent conductive film that covers the openings 26c and 27c and the recess 28a and covers the third insulating layer 27 is formed and patterned. The pixel electrode 31B is formed on the first insulating layer 25 in the opening 26c, the pixel electrode 31G is formed on the second insulating layer 26 in the opening 27c, and the pixel electrode 31R is formed on the third insulating layer 27. . The transparent conductive film is, for example, an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. The film thickness of the pixel electrodes 31B, 31G, and 31R is approximately 100 nm. Accordingly, the first insulating layer 25 exists between the power supply line 14 and the pixel electrode 31B, and the first insulating layer 25 and the second insulating layer 26 exist between the power supply line 14 and the pixel electrode 31G. The first insulating layer 25, the second insulating layer 26, and the third insulating layer 27 exist between the power supply line 14 and the pixel electrode 31R. Hereinafter, this is referred to as an insulating layer 28 regardless of the number of insulating layers disposed between the power supply line 14 and the pixel electrode 31. When the average film thickness of the first insulating layer 25 is d1, the average film thickness of the second insulating layer 26 is d2, and the average film thickness of the third insulating layer 27 is d3, it is between the pixel electrodes 31B, 31G, and 31R. The thickness of the insulating layer 28 is d1, and a step corresponding to a value obtained by adding d3 to d2 occurs between the pixel electrodes 31B, 31G, and 31R.
Then, in step S4 of FIG. 7, as shown in FIG. 8F, a fourth insulating layer 29 that covers the pixel electrodes 31B, 31G, and 31R and the recess 28a is formed. The fourth insulating layer 29 is formed using, for example, silicon oxide (SiO ₂ ). Then, the fourth insulating layer 29 is partially etched to define regions where the functional layer 32 and the pixel electrodes 31B, 31G, and 31R that are formed thereafter are in contact with each other, and the pixel electrodes 31B, 31G, and 31R. Openings 29B, 29G, and 29R are formed to open (see FIGS. 3 and 4). The film thickness of the fourth insulating layer 29 is approximately 60 nm. For the etching of the fourth insulating layer 29, it is preferable to use a dry etching method similarly to the third insulating layer 27. Then, the process proceeds to step S5.

In step S5 of FIG. 7, the functional layer 32 is formed so as to fill the openings 29B, 29G, and 29R over the display region E in which the pixel electrodes 31B, 31G, and 31R are disposed (see FIG. 4).
The functional layer 32 includes a light emitting layer in which an organic semiconductor material is used as a light emitting material. For example, a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially stacked from the pixel electrode 31 side. And an electron injection layer. The configuration of the functional layer 32 is not particularly limited, and a known configuration can be applied. For example, the functional layer 32 includes a light emitting layer that can obtain B (blue), G (green), and R (red) emission colors to achieve white emission, or B (blue) and orange emission colors. It is also possible to realize pseudo white light emission including the light emitting layer from which is obtained. Further, the light emitting layer is not limited to be provided in common to each of the light emitting pixels 20B, 20G, and 20R, and the functional layer 32 can obtain light emission colors corresponding to each of the light emitting pixels 20B, 20G, and 20R. A light emitting layer may be included. Further, for the purpose of improving the light emission efficiency, an intermediate layer that assists or prevents the movement of holes and electrons as carriers injected into the light emitting layer may be included.
A method for forming each layer constituting the functional layer 32 is not particularly limited, and for example, a vapor phase process such as a vacuum deposition method or a liquid phase process such as an inkjet method can be used. Alternatively, the functional layer 32 may be formed by combining both a gas phase process and a liquid phase process. Then, the process proceeds to step S6.

  In step S <b> 6 of FIG. 7, the counter electrode 33, which is a common cathode, is formed so as to cover the functional layer 32 over at least the display region E. In the present embodiment, the counter electrode 33 is formed by controlling the film thickness using, for example, an alloy containing Ag (MgAg or the like) so as to have light reflectivity and light transmissivity. The counter electrode 33 is preferably formed using a vapor phase process such as a vacuum evaporation method in consideration of damage to the functional layer 32 due to moisture, heat, or the like. Thereby, the organic EL element 30 is formed for each of the light emitting pixels 20B, 20G, and 20R (see FIG. 4).

  Next, the sealing layer 40 that covers the plurality of organic EL elements 30 formed in the display region E is formed. In the present embodiment, the sealing layer 40 includes a first sealing film 41 that covers the surface of the counter electrode 33, a buffer layer 42, and a second sealing film 43 that covers the buffer layer 42.

  The first sealing film 41 has a gas barrier property that is difficult to permeate a gas such as moisture and oxygen, and transparency, for example, an inorganic material such as a metal oxide such as silicon oxide, silicon nitride, silicon oxynitride, or titanium oxide. Form with compound. As a forming method, it is preferable to use a vapor phase process capable of forming a dense film at a low temperature. For example, a high-density plasma film forming method such as a plasma CVD method or an ECR plasma sputtering method, a vacuum evaporation method, an ion plating method, or the like. The law can be mentioned. The film thickness of the first sealing film 41 is approximately 200 nm to 400 nm.

  The surface of the first sealing film 41 is uneven due to the influence of a structure such as the organic EL element 30 provided in the lower layer. In the present embodiment, in order to prevent a decrease in the sealing function of the second sealing film 43 due to the unevenness or adhesion of foreign matters, at least the display region E is covered on the surface of the first sealing film 41, A buffer layer 42 is formed that relaxes and flattens at least the unevenness in the display region E.

  The buffer layer 42 is an organic resin layer formed by, for example, using a solution in which a transparent organic resin is dissolved in a solvent, applying the solution by a printing method or a spin coating method, and drying the solution. Examples of the organic resin include an epoxy resin. The thickness of the first sealing film 41 is preferably 1 μm to 5 μm because the unevenness on the surface of the first sealing film 41 is alleviated and the foreign matter attached to the first sealing film 41 is covered and flattened. A buffer layer 42 having a thickness of about 3 μm was formed using an epoxy resin. The buffer layer 42 is preferably formed so as to cover at least the functional layer 32 in plan view and so as to cover the counter electrode 33. By forming the buffer layer 42 so as to cover at least the functional layer 32, unevenness at the end of the functional layer 32 can be reduced. In addition to the display area E, the buffer layer 42 may be formed so as to cover at least a part of the peripheral circuit (the data line driving circuit 101 and the pair of scanning line driving circuits 102) on the display area E side ( (See FIG. 1).

  Next, a second sealing film 43 that covers the buffer layer 42 is formed. Similar to the first sealing film 41, the second sealing film 43 is formed using an inorganic compound that has both transparency and gas barrier properties and is excellent in water resistance and heat resistance. Examples of the inorganic compound include silicon oxide, silicon nitride, and silicon oxynitride. The second sealing film 43 can be formed using the same method as the first sealing film 41. The film thickness of the second sealing film 43 is preferably in the range of 200 nm to 700 nm, and more preferably in the range of 300 nm to 400 nm so that cracks do not occur during film formation. Thereby, at least in the display region E, the sealing layer 40 in which the first sealing film 41 and the second sealing film 43 are stacked with the buffer layer 42 interposed therebetween is completed (see FIGS. 4 and 5). If the buffer layer 42 of the sealing layer 40 is formed so as to cover the counter electrode 33, the end portion of the counter electrode 33 is covered with the first sealing film 41 and the second sealing film 43 directly laminated thereon. be able to.

  In a region between the peripheral circuit (the data line driving circuit 101 and the pair of scanning line driving circuits 102) and the end face of the element substrate 10, the first sealing film 41 and the second sealing film 43 are stacked in contact with each other. Yes. On the first side portion side of the element substrate 10, an opening penetrating the first sealing film 41 and the second sealing film 43 is provided, and the external connection terminal 103 is located in the opening (see FIG. 1). .

Next, as shown in FIGS. 4 and 5, the color filter 50 is formed on the sealing layer 40. The color filter 50 includes filter layers 50B, 50G, and 50R corresponding to the light emitting pixels 20B, 20G, and 20R. Each of the filter layers 50B, 50G, and 50R exposes a photosensitive resin layer obtained by applying and drying a solution containing a photosensitive resin material in which a coloring material such as a dye or pigment is dissolved or dispersed. -It is formed by developing. Therefore, when the three color filter layers 50B, 50G, and 50R are formed, at least three exposures and developments are performed. In FIG. 4, the filter layers 50B, 50G, and 50R are shown to have the same film thickness, but actually, when light emitted from the organic EL element 30 passes through the filter layers 50B, 50G, and 50R. In addition, the film thicknesses of the filter layers 50B, 50G, and 50R are adjusted within a range of 1.0 μm to 2.0 μm so that appropriate optical characteristics such as chromaticity and white balance can be obtained.
The filter layers 50B, 50G, and 50R are exposed and developed so as to overlap with the corresponding pixel electrodes 31B, 31G, and 31R in plan view. Further, the boundary between adjacent filter layers may be located between the pixel electrodes, and may be exposed and developed so that a part of the other filter layer overlaps one filter layer.

  The element substrate 10 including the pixel circuit, the organic EL element 30, the sealing layer 40, and the color filter 50 formed on the base material 10s is sealed via a resin layer 60 having both adhesiveness and transparency. 70 (see FIGS. 4 and 5). For the resin layer 60, for example, a thermosetting or photo-curing epoxy resin material can be used. After the resin material is applied to the element substrate 10, the sealing substrate 70 is pressed against the element substrate 10 to spread the resin material within a predetermined range and then be cured. Thereby, the organic EL device 100 is completed.

In the present embodiment, the light emitted from the organic EL element 30 is transmitted through the color filter 50, so that a desired emission color can be obtained for each of the light emitting pixels 20B, 20G, and 20R. In addition, an optical resonance structure is constructed between the power supply line 14 functioning as a reflective layer and the counter electrode 33 for each of the light emitting pixels 20B, 20G, and 20R, and resonance corresponding to the respective emission colors of B, G, and R. Light emission with enhanced brightness at the wavelength is obtained.
The resonance wavelength for each of the light emitting pixels 20B, 20G, and 20R is determined by an optical distance (also referred to as an optical path length) between the power supply line 14 serving as a reflective layer and the counter electrode 33.
Specifically, the optical distance from the reflection layer to the counter electrode 33 is D, the phase shift in reflection at the reflection layer is φL, the phase shift in reflection at the counter electrode 33 is φU, and the peak wavelength of the standing wave is When λ and the integer are m, the optical distance D has a structure satisfying the following mathematical formula (1).
D = {(2πm + φL + φU) / 4π} λ (1)
The optical distance D in the optical resonance structure of the light emitting pixels 20B, 20G, and 20R increases in the order of B, G, and R, and the thickness of the insulating layer 28 disposed between the power supply line 14 and the pixel electrode 31 is increased. It is adjusted by making it different. Specifically, the first insulating layer 25 exists between the power supply line 14 and the pixel electrode 31B, and the first insulating layer 25 and the second insulating layer 26 exist between the power supply line 14 and the pixel electrode 31G. And the first insulating layer 25, the second insulating layer 26, and the third insulating layer 27 exist between the power supply line 14 and the pixel electrode 31R, so that the optical distance D becomes the light emitting pixels 20B, 20G, Different for each 20R. The optical distance of the insulating layer 28 can be represented by the product of the film thickness (t) and the refractive index (n) of the insulating layer 28 through which light is transmitted.
For example, the luminance peak wavelength (resonance wavelength) in the light emitting pixel 20B is set to 470 nm. Similarly, the luminance peak wavelength (resonance wavelength) in the light emitting pixel 20G is set to 540 nm, and the luminance peak wavelength (resonance wavelength) in the light emitting pixel 20R is set to 610 nm.
In order to realize the optical distance D matched to the peak wavelength, for example, the film thickness of the pixel electrodes 31B, 31G, and 31R made of a transparent conductive film such as ITO is set to about 100 nm as described above, and the functional layer 32 When the film thickness is approximately 110 nm and m = 1 in the above formula (1) and the film thickness of the insulating layer 28 between the reflective layer and the counter electrode 33 is calculated, the light-emitting pixel 20B has a thickness of 50 nm and the light-emitting pixel 20G has a thickness of 115 nm. In the light emitting pixel 20R, a value of 170 nm is obtained. Therefore, the thickness range of the first insulating layer 25 made of silicon nitride (SiN) is set to 40 nm to 100 nm, the thickness range of the second insulating layer 26 made of silicon oxide (SiO ₂ ) is set to 40 nm to 50 nm, and oxidation is performed. The film thickness range of the third insulating layer 27 made of silicon (SiO ₂ ) can be set to 40 nm to 70 nm.

  In addition, in order to implement | achieve the said optical distance D matched with the said peak wavelength accurately, the film thickness of the insulating layer 28 which adjusts the said optical distance D for every light emitting pixel 20 is the 1st layer which comprises the insulating layer 28. Refractive index of each of the first insulating layer 25, the second insulating layer 26, and the third insulating layer 27, the film thickness and refractive index of the pixel electrode 31 and the functional layer 32, the film thickness of the power supply line 14 and the counter electrode 33 as a reflective layer And the refractive index and extinction coefficient are set. Further, the refractive index of the layer through which light is transmitted depends on the wavelength of the transmitted light.

  From the viewpoint of reducing the leakage current between the organic EL elements 30B, 30G, and 30R by forming a step structure (recess 28a) between the pixel electrodes 31B, 31G, and 31R, the pixel electrodes 31B, 31G, and 31R. It is preferable that the step in the step structure (recess 28a) is larger than the film thickness of the charge transport layer (hole injection layer or hole injection / transport layer) formed first. The step on the first insulating layer 25 of the recess 28a in this embodiment corresponds to a value obtained by adding the average film thickness d3 of the third insulating layer 27 to the average film thickness d2 of the second insulating layer 26. 120 nm. On the other hand, the thickness of the functional layer 32 is 110 nm as described above, and the thickness of the hole injection layer is about 50 nm. Therefore, the step of the recess 28a is larger than the film thickness of the hole injection layer.

The effects of the first embodiment are as follows.
(1) According to the organic EL device 100 and the manufacturing method thereof, in the light emitting pixels 20B, 20G, and 20R adjacent in the X direction, the recesses 28a are formed between the pixel electrodes 31B, 31G, and 31R. The recess 28a partially etches the second insulating layer 26 and the third insulating layer 27 in the insulating layer 28 formed between the power supply line 14 functioning as a reflective layer and the pixel electrodes 31B, 31G, 31R. It is formed by. Accordingly, a step having a value obtained by adding the average film thickness d3 of the third insulating layer 27 to the average film thickness d2 of the second insulating layer 26 occurs between the pixel electrodes 31B, 31G, and 31R adjacent in the X direction. Therefore, the leakage current between the organic EL elements 30B, 30G, and 30R can be reduced as compared with the case where a step corresponding to the value of the average film thickness d2 or the average film thickness d3 occurs.
In addition, a first insulating layer 25 is disposed between the power supply line 14 functioning as a reflective layer of the light emitting pixel 20B and the pixel electrode 31B, and a first insulating layer 25 is disposed between the power supply line 14 of the light emitting pixel 20G and the pixel electrode 31G. A first insulating layer 25 and a second insulating layer 26 are disposed, and a first insulating layer 25, a second insulating layer 26, and a third insulating layer 27 are disposed between the power supply line 14 of the light emitting pixel 20R and the pixel electrode 31R. ing. According to such an optical resonance structure, when the first insulating layer 25, the second insulating layer 26, and the third insulating layer 27 are formed, if the respective film thicknesses are controlled within a predetermined range, the organic EL element 30B , 30G, and 30R, light having a desired peak wavelength can be extracted. Therefore, in the optical resonance structure for each of the light emitting pixels 20B, 20G, and 20R, compared to the case where an optical distance adjustment layer that etches the light-transmitting film in stages to change the optical distance for each light emitting pixel is formed or formed. The optical distance can be adjusted accurately. That is, it is possible to provide or manufacture the organic EL device 100 that has the desired optical characteristics in each of the light emitting pixels 20B, 20G, and 20R, reduces the leakage current, and provides excellent display quality.
(2) The light emitting pixels 20B, 20G, and 20R are rectangular in plan view, and the recess 28a extends in the longitudinal direction between the pixel electrodes 31B, 31G, and 31R adjacent in the short direction (X direction). Is formed. Leakage current is likely to occur in the short direction (X direction) on the long sides of the pixel electrodes 31B, 31G, and 31R and the distance between the pixel electrodes 31 is narrow, so that the leakage current can be effectively reduced.
(3) The power supply line 14 has an opening 14a in which a corresponding portion is removed between the pixel electrodes 31B, 31G, and 31R adjacent in the X direction. That is, the power supply line 14 that functions as a reflective layer is not disposed below the recess 28 a of the insulating layer 28. As a result, a leakage current is generated between the organic EL elements 30B, 30G, and 30R, and the power supply line 14 that functions as a reflective layer is disposed even if unintended light emission occurs between the light emitting pixels 20B, 20G, and 20R. Therefore, unintended light emission can be made inconspicuous.

(Second Embodiment)
<Electro-optical device>
Next, an organic EL device as an electro-optical device according to the second embodiment will be described with reference to FIGS. FIG. 9 is a schematic plan view showing the configuration of the light emitting pixel in the organic EL device of the second embodiment, and FIG. 10 is a schematic cross-sectional view showing the structure of the light emitting pixel in the organic EL device of the second embodiment.
The organic EL device according to the second embodiment is different from the organic EL device 100 according to the first embodiment in the step structure formed between the light emitting pixels 20B, 20G, and 20R adjacent in the X direction. is there. Therefore, the same components as those of the organic EL device 100 of the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. FIG. 10 is a schematic cross-sectional view corresponding to FIG. 4 in the first embodiment.

  As shown in FIG. 9, the organic EL device 200 as the electro-optical device of the present embodiment has light emitting pixels 20B, 20G, and 20R adjacent in the X direction. The light emitting pixels 20B, 20G, and 20R include organic EL elements 30 (30B, 30G, and 30R) that can obtain different emission colors. The organic EL element 30 includes a functional layer 32 including a light emitting layer between the pixel electrode 31 and the counter electrode 33 (see FIG. 2). Further, the organic EL device 200 employs an insulating structure having openings 29B, 29G, and 29R that define portions where the pixel electrodes 31B, 31G, and 31R are in contact with the functional layer 32. The planar shapes of the openings 29B, 29G, and 29R are rectangular shapes in which the short side direction is along the X direction and the long side direction is along the Y direction. That is, the planar shape of the light emitting pixels 20B, 20G, and 20R is rectangular.

  In the insulating structure portion between the pixel electrodes 31B, 31G, and 31R adjacent in the X direction, a pair of concave portions 28b extending in the Y direction and a convex portion 28c extending in the Y direction between the pair of concave portions 28b are also provided. And are formed. The convex portion 28c is an example of the step structure of the present invention. Next, the structure of the light emitting pixels 20B, 20G, and 20R in this embodiment will be described with reference to FIG. Since the configuration of the pixel circuit including the power supply line 14 on the base material 10s of the element substrate 10 is the same as that in the first embodiment, an insulating structure including an optical resonance structure above the power supply line 14 will be described. .

  As shown in FIG. 10, the organic EL device 200 includes an element substrate 10 on which light emitting pixels 20B, 20G, and 20R, a color filter 50, and the like are formed, and a light-transmitting sealing substrate 70. The element substrate 10 and the sealing substrate 70 are bonded together by a resin layer 60 having both adhesiveness and transparency. The color filter 50 has filter layers 50B, 50G, and 50R corresponding to B, G, and R colors. The filter layers 50B, 50G, and 50R are arranged on the element substrate 10 so as to correspond to the light emitting pixels 20B, 20G, and 20R, respectively. The light emitted from the functional layer 32 passes through one of the corresponding filter layers 50B, 50G, and 50R and is emitted from the sealing substrate 70 side. That is, the organic EL device 200 has a top emission structure like the organic EL device 100 of the first embodiment.

  In the light emitting pixel 20B, the first insulating layer 25 exists between the power supply line 14 and the pixel electrode 31B. In the light emitting pixel 20G, the first insulating layer 25 and the second insulating layer 26 exist between the power supply line 14 and the pixel electrode 31G. In the light emitting pixel 20R, the first insulating layer 25, the second insulating layer 26, and the third insulating layer 27 exist between the power supply line 14 and the pixel electrode 31G. The first insulating layer 25 is formed so as to cover the power supply line 14 over the light emitting pixels 20B, 20G, and 20R. Thus, the optical distance in the optical resonance structure is such that the relationship of the light emitting pixel 20B <the light emitting pixel 20G <the light emitting pixel 20R so that light having a desired resonance wavelength can be extracted from each of the light emitting pixels 20B, 20G, and 20R. It is adjusted to meet.

  In addition, a projection 28c is formed on the first insulating layer 25 between the pixel electrodes 31B, 31G, and 31R adjacent in the X direction. The convex portion 28 c is formed by being sandwiched between a pair of concave portions 28 b formed by partially etching the stacked second insulating layer 26 and third insulating layer 27. In other words, there are a plurality of recesses 28b between the light emitting pixels 20B, 20G, and 20R adjacent in the X direction. A fourth insulating layer 29 that covers the recesses 28b and the protrusions 28c and covers the outer edges of the pixel electrodes 31B, 31G, and 31R to form the openings 29B, 29G, and 29R is formed.

  The configuration of the functional layer 32, the counter electrode 33, the sealing layer 40, the color filter 50, the resin layer 60, and the sealing substrate 70 formed in contact with the pixel electrodes 31B, 31G, and 31R is the organic EL of the first embodiment. It is the same as the device 100. Therefore, detailed description is omitted.

<Method of manufacturing electro-optical device>
Next, a method for manufacturing the organic EL device 200 as a method for manufacturing the electro-optical device according to the present embodiment will be described with reference to FIGS. FIG. 11 is a flowchart illustrating a method for manufacturing an organic EL device according to the second embodiment, and FIGS. 12A to 12F are schematic cross-sectional views illustrating a method for manufacturing the organic EL device according to the second embodiment. 11 corresponds to a schematic cross-sectional view along the X direction of the light emitting pixels 20B, 20G, and 20R in FIG. 10, and the pixel circuits and wirings provided below the power supply line 14 in the base material 10s. Is omitted.

  As shown in FIG. 11, the manufacturing method of the organic EL device 200 of this embodiment includes an insulating layer forming step (step S11), an opening / projection forming step (step S12), and a pixel electrode forming step (step S13). ), A fourth insulating layer forming step (step S14), a functional layer forming step (step S15), and a counter electrode forming step (step S16). The opening / projection forming process corresponds to the insulating layer etching process in the present invention.

In step S11 of FIG. 11, the first insulating layer 25 is formed so as to cover the power supply line 14 as shown in FIG. Subsequently, a second insulating layer 26 and a third insulating layer 27 are stacked on the first insulating layer 25. In the subsequent patterning of the second insulating layer 26 and the third insulating layer 27, the first insulating layer 25 is formed using silicon nitride (SiN) in order to have an etching selectivity with respect to the first insulating layer 25. Then, the second insulating layer 26 and the third insulating layer 27 are formed using silicon oxide (SiO ₂ ). The stacked first insulating layer 25, second insulating layer 26, and third insulating layer 27 are collectively referred to as an insulating layer 28. Then, the process proceeds to step S12. Before forming the first insulating layer 25, the power supply line 14 is patterned so that the opening 14a is opened at a portion corresponding to the boundary between the adjacent light emitting pixels 20B, 20G, and 20R.

  Next, in step S12 of FIG. 11, first, as shown in FIG. 12B, a photosensitive resist layer covering the insulating layer 28 is formed, and a resist pattern 83 is formed by exposure and development. The resist pattern 83 includes an opening 83a that opens above the power supply line 14 corresponding to the light emitting pixel 20B and the light emitting pixel 20G, and a pair of openings 83b that open at a boundary portion corresponding to the adjacent light emitting pixels 20 in the X direction. And are formed. The portion of the third insulating layer 27 located above the power supply line 14 corresponding to the light emitting pixel 20R is covered with a photosensitive resist layer. Then, the third insulating layer 27 exposed in the opening 83a and the opening 83b is partially etched, and as shown in FIG. 12C, the pixel electrode 31B of the light emitting pixel 20B and the pixel of the light emitting pixel 20G in plan view. The electrode 31G forms an opening 27c in which each electrode is disposed later. In addition, a pair of openings 27 b are formed between the light emitting pixels 20. When viewed from the normal line direction with respect to the surface of the insulating layer 28 formed on the base material 10s, as shown in FIG. 9, an opening 27a is formed that opens between the light emitting pixel 20B and the light emitting pixel 20G. The opening 27a formed in the third insulating layer 27 includes the opening 27c formed corresponding to the light emitting pixel 20B and the light emitting pixel 20G, between the light emitting pixel 20B and the light emitting pixel 20G, and between the light emitting pixel 20G and the light emitting pixel 20R. And a pair of openings 27b formed between the two.

Subsequently, as shown in FIG. 12D, a photosensitive resist layer covering the insulating layer 28 is formed, and a resist pattern 84 is formed by exposure and development. In the resist pattern 84, an opening 84a is formed to expose the opening 27c formed corresponding to the light emitting pixel 20B of the third insulating layer 27. In addition, an opening 84b that exposes the pair of openings 27b of the third insulating layer 27 is formed. The opening 27c formed corresponding to the light emitting pixel 20G and the portion of the third insulating layer 27 located above the power supply line 14 corresponding to the light emitting pixel 20R are covered with a photosensitive resist layer. Then, the second insulating layer 26 exposed in the openings 84a and 84b is partially etched, and as shown in FIG. 12E, the pixel electrode 31B of the light emitting pixel 20B is disposed later in plan view. Opening 26c is formed. A pair of recesses 28b penetrating the second insulating layer 26 and the third insulating layer 27 is formed between the light emitting pixels 20B, 20G, and 20R adjacent in the X direction. Thereby, convex portions 28c sandwiched between the pair of concave portions 28b are formed between the light emitting pixels 20B, 20G, and 20R adjacent in the X direction. As a method for etching the second insulating layer 26 and the third insulating layer 27 formed using silicon oxide, a processing gas containing fluorine such as CF ₄ and C ₂ F ₈ is used, as in the first embodiment. It is preferable to use the dry etching method used. Then, the process proceeds to step S13.

In step S13 of FIG. 11, as shown in FIG. 12 (f), a transparent conductive film is formed to cover the third insulating layer 27 while covering the opening 26c, the opening 27c, the concave portion 28b, and the convex portion 28c. To form a pixel electrode 31B on the first insulating layer 25 in the opening 26c, a pixel electrode 31G on the second insulating layer 26 in the opening 27c, and a pixel on the third insulating layer 27. The electrode 31R is formed. The transparent conductive film is, for example, an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. The film thickness of the pixel electrodes 31B, 31G, and 31R is approximately 100 nm. Accordingly, the first insulating layer 25 exists between the power supply line 14 and the pixel electrode 31B, and the first insulating layer 25 and the second insulating layer 26 exist between the power supply line 14 and the pixel electrode 31G. The first insulating layer 25, the second insulating layer 26, and the third insulating layer 27 exist between the power supply line 14 and the pixel electrode 31R.
Then, in step S14 of FIG. 11, as shown in FIG. 12 (f), a fourth insulating layer 29 is formed to cover the pixel electrodes 31B, 31G, 31R, the concave portion 28b, and the convex portion 28c. The fourth insulating layer 29 is formed using, for example, silicon oxide (SiO ₂ ). Then, the fourth insulating layer 29 is partially etched to define regions where the functional layer 32 and the pixel electrodes 31B, 31G, and 31R that are formed thereafter are in contact with each other, and the pixel electrodes 31B, 31G, and 31R. Openings 29B, 29G, and 29R that are opened are formed (see FIGS. 9 and 10). The film thickness of the fourth insulating layer 29 is approximately 60 nm. For the etching of the fourth insulating layer 29, it is preferable to use a dry etching method similarly to the third insulating layer 27. Then, the process proceeds to step S15.

  In step S15 of FIG. 11, the functional layer 32 is formed so as to fill the openings 29B, 29G, and 29R over the display region E in which the pixel electrodes 31B, 31G, and 31R are disposed (FIG. 10). The formation method of the functional layer 32 is the same as step S5 of the manufacturing method of the organic EL device 100 in the first embodiment. Then, the process proceeds to step S16.

  In step S <b> 16 of FIG. 11, the counter electrode 33, which is a common cathode, is formed so as to cover the functional layer 32 over at least the display region E. The formation method of the counter electrode 33 is the same as step S6 of the manufacturing method of the organic EL device 100 in the first embodiment.

  The subsequent steps of forming the sealing layer 40, forming the color filter 50, and bonding the element substrate 10 on which the color filter 50 is formed and the sealing substrate 70 through the resin layer 60 are the first embodiment described above. As explained in.

The effects of the second embodiment are as follows.
(1) According to the organic EL device 200 and the manufacturing method thereof, in the light emitting pixels 20B, 20G, and 20R adjacent in the X direction, the convex portion 28c is formed between the pixel electrodes 31B, 31G, and 31R. The protrusion 28c partially etches the second insulating layer 26 and the third insulating layer 27 in the insulating layer 28 formed between the power supply line 14 functioning as a reflective layer and the pixel electrodes 31B, 31G, 31R. It is formed by doing. Accordingly, a step having a value obtained by adding the average film thickness d3 of the third insulating layer 27 to the average film thickness d2 of the second insulating layer 26 occurs between the pixel electrodes 31B, 31G, and 31R adjacent in the X direction. Therefore, the leakage current between the organic EL elements 30B, 30G, and 30R can be reduced as compared with the case where a step corresponding to the value of the average film thickness d2 or the average film thickness d3 occurs.
In addition, a first insulating layer 25 is disposed between the power supply line 14 functioning as a reflective layer of the light emitting pixel 20B and the pixel electrode 31B, and a first insulating layer 25 is disposed between the power supply line 14 of the light emitting pixel 20G and the pixel electrode 31G. A first insulating layer 25 and a second insulating layer 26 are disposed, and a first insulating layer 25, a second insulating layer 26, and a third insulating layer 27 are disposed between the power supply line 14 of the light emitting pixel 20R and the pixel electrode 31R. ing. According to such an optical resonance structure, when the first insulating layer 25, the second insulating layer 26, and the third insulating layer 27 are formed, if the respective film thicknesses are controlled within a predetermined range, the organic EL element 30B , 30G, and 30R, light having a desired resonance wavelength can be extracted. Therefore, in the optical resonance structure for each of the light emitting pixels 20B, 20G, and 20R, compared to the case where an optical distance adjustment layer that etches the light-transmitting film in stages to change the optical distance for each light emitting pixel is formed or formed. The optical distance can be adjusted accurately. In other words, it is possible to provide or manufacture the organic EL device 200 that has desired optical characteristics in each of the light emitting pixels 20B, 20G, and 20R, reduces leakage current, and provides excellent display quality.
(2) The light emitting pixels 20B, 20G, and 20R have a rectangular shape in plan view, and the convex portion 28c extends in the longitudinal direction between the pixel electrodes 31B, 31G, and 31R adjacent in the short direction (X direction). Is formed. Leakage current is likely to occur in the short direction (X direction) on the long sides of the pixel electrodes 31B, 31G, and 31R and the distance between the pixel electrodes 31 is narrow, so that the leakage current can be effectively reduced.
(3) The power supply line 14 has an opening 14a in which a corresponding portion is removed between the pixel electrodes 31B, 31G, and 31R adjacent in the X direction. That is, the power supply line 14 that functions as a reflective layer is not disposed below the convex portion 28 c of the insulating layer 28. Thereby, even if leakage current occurs between the organic EL elements 30B, 30G, and 30R and unintentional light emission occurs between the light emitting pixels 20B, 20G, and 20R, the power supply line 14 that functions as a reflective layer is not disposed. Therefore, unintended light emission can be made inconspicuous.

(Third embodiment)
<Electronic equipment>
Next, an electronic apparatus as a third embodiment will be described with reference to FIG. FIG. 13 is a schematic diagram illustrating a head mounted display as an example of an electronic apparatus.

  As illustrated in FIG. 13, a head mounted display (HMD) 1000 as an electronic apparatus according to the present embodiment includes two display units 1001 provided corresponding to the left and right eyes. The observer M can see characters and images displayed on the display unit 1001 by wearing the head mounted display 1000 on the head like glasses. For example, if an image in consideration of parallax is displayed on the left and right display units 1001, a stereoscopic video can be viewed and enjoyed.

  The display unit 1001 includes the organic EL device 100 (or the organic EL device 200 of the second embodiment) that is the self-luminous display device of the first embodiment. Therefore, it is possible to provide a lightweight head-mounted display 1000 that can obtain desired optical characteristics, reduce leakage current between the light emitting pixels 20B, 20G, and 20R, and have excellent display quality.

The head mounted display 1000 is not limited to the configuration in which the observer M directly sees the display content of the display unit 1001, but may be configured to indirectly view the display content by a mirror or the like.
Further, the head mounted display 1000 is not limited to having the two display units 1001, and may be configured to include one display unit 1001 corresponding to either the left or right eye.

  The electronic device on which the organic EL device 100 or the organic EL device 200 is mounted is not limited to the head mounted display 1000. For example, an electronic device having a display unit such as a head-up display, an EVF (electronic viewer) of a digital camera, a portable information terminal, or a navigator can be given. Further, the present invention is not limited to the display unit, and the present invention can be applied to an illumination device and an exposure device.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. The manufacturing method of the electro-optical device and the electronic apparatus to which the electro-optical device is applied are also included in the technical scope of the present invention. Various modifications other than the above embodiment are conceivable. Hereinafter, a modification will be described.

(Modification 1) FIG. 14 is a schematic sectional view showing the structure of a light emitting pixel of an organic EL device according to a modification. FIG. 5 is a schematic cross-sectional view corresponding to FIG. 4 of the first embodiment.
As shown in FIG. 14, the organic EL device 300 of Modification 1 has a recess 28 d as a step structure between the light emitting pixels 20 </ b> B, 20 </ b> G, and 20 </ b> R adjacent in the X direction. The recess 28 d is formed through the first insulating layer 25, the second insulating layer 26, and the third insulating layer 27. Therefore, the step generated between the pixel electrodes 31B, 31G, and 31R is larger than the concave portion 28a in the organic EL device 100 of the first embodiment. That is, the leak current generated between the organic EL elements 30B, 30G, and 30R can be more effectively reduced.
As a method for forming such a recess 28d, first, the steps from Step S1 to Step S2 are completed as in the method for manufacturing the organic EL device 100 of the first embodiment. Thereafter, when forming contact portions 31Bc, 31Gc, and 31Rc (see FIG. 5) for electrically connecting the pixel electrodes 31B, 31G, and 31R to the third transistor 23, contact holes 107 that penetrate the insulating layer 28 are formed. If the first insulating layer 25 exposed in the recess 28a is removed by etching in the step of forming (see FIG. 5), the recess 28d can be formed without increasing the number of manufacturing steps.
Further, if the method for forming the recess 28d of Modification 1 is used, a pair of recesses 28d are formed between the pixel electrodes 31B, 31G, and 31R, and the projection of the second embodiment is interposed between the pair of recesses 28d. A convex part having a larger step than the part 28c can also be formed.

(Modification 2) In the second embodiment, the example of the convex portion 28c configured by being sandwiched between the pair of concave portions 28b as the step structure has been described. However, the configuration of the convex portion is not limited thereto. FIGS. 15A and 15B are schematic plan views showing a step structure of a modification. For example, as shown in FIG. 15A, an independent convex portion 28e may be provided inside a concave portion 28a provided with the pixel electrode 31B interposed therebetween. The convex portion 28e extends along the longitudinal direction (Y direction) of the concave portion 28a.
Also, for example, as shown in FIG. 15B, a plurality of island-shaped protrusions 28f may be provided inside a recess 28a provided with the pixel electrode 31B interposed therebetween. The planar shape of the convex portion 28f is not limited to a circle but may be an ellipse or a rectangle.
FIG. 15 is a schematic plan view showing a step structure of a modification corresponding to the light emitting pixel 20B provided with the organic EL element 30B, but it goes without saying that it is also applied to the other light emitting pixels 20G and 20R.

  (Modification 3) In the organic EL device 100 or the organic EL device 200, the configuration of the light emitting pixels 20B, 20G, and 20R is not limited to this. For example, the color filter 50 is not limited to being formed on the element substrate 10 side, and may be formed on the sealing substrate 70 side. Furthermore, the color filter 50 is not essential, and a configuration in which light emission of a desired color can be obtained from the organic EL element 30 in each of the light emitting pixels 20B, 20G, and 20R may be employed.

  (Modification 4) The configuration including the concave portion 28a and the convex portion 28c as a step structure between the light emitting pixels 20B, 20G, and 20R is limited to being applied to the top emission type organic EL device 100 and the organic EL device 200. Not. For example, the base material 10s of the element substrate 10 is a light transmissive quartz substrate, for example. Then, a transflective layer having a light transmitting property and a light reflecting property is disposed at a position facing the pixel electrodes 31B, 31G, 31R through the insulating layer 28, and the counter electrode 33 has a light reflecting property. . Light from the organic EL element 30 is extracted from the element substrate 10 side. That is, the step structure can be applied to a bottom emission type organic EL device.

  DESCRIPTION OF SYMBOLS 10 ... Element board | substrate as a board | substrate, 14 ... Power supply line as a reflection layer, 20B ... Light emission pixel as 1st pixel, 20G ... Light emission pixel as 2nd pixel, 20R ... Light emission pixel as 3rd pixel, 25 ... 1st insulating layer, 26 ... 2nd insulating layer, 26a ... Opening as 2nd opening, 27 ... 3rd insulating layer, 27a ... Opening as 1st opening, 28 ... Insulating layer, 28a ... As step structure Concave part, 28c ... convex part as step structure, 30, 30B, 30G, 30R ... organic EL element, 31B ... pixel electrode as first pixel electrode, 31G ... pixel electrode as second pixel electrode, 31R ... third pixel Pixel electrode as electrode, 32... Functional layer, 33. Counter electrode, 100, 150, 200, 250... Organic EL device as electro-optical device, 1000.

Claims (14)

A substrate,
A first pixel formed on the substrate;
A second pixel adjacent to the first pixel;
The first pixel includes a reflective layer having light reflectivity, a counter electrode having light reflectivity and light transmittance, an insulating layer provided between the reflective layer and the counter electrode, Including a pixel electrode and a functional layer including a light emitting layer,
The second pixel includes the reflective layer, the counter electrode, the insulating layer, the second pixel electrode, and the functional layer provided between the reflective layer and the counter electrode,
The first film thickness of the insulating layer between the reflective layer and the first pixel electrode is different from the second film thickness of the insulating layer between the reflective layer and the second pixel electrode,
An electro-optical device, wherein a step structure is formed in the insulating layer between the adjacent first pixel electrode and the second pixel electrode. Each of the first pixel electrode and the second pixel electrode is rectangular in plan view,
The step structure is formed in the insulating layer between the first pixel electrode and the second pixel electrode that are adjacent in the lateral direction,
The electro-optical device according to claim 1, wherein the step structure extends in a longitudinal direction of the first pixel electrode and the second pixel electrode. The insulating layer includes a first insulating layer, a second insulating layer, and a third insulating layer stacked in order from the reflective layer side,
3. The electro-optical device according to claim 1, wherein the step structure is a recess formed so as to penetrate at least the second insulating layer and the third insulating layer. The insulating layer includes a first insulating layer, a second insulating layer, and a third insulating layer stacked in order from the reflective layer side,
The electro-optical device according to claim 1, wherein the step structure is a convex portion formed using at least the second insulating layer and the third insulating layer. A third pixel adjacent to the second pixel;
The third pixel includes the reflective layer, the counter electrode, the insulating layer, the third pixel electrode, and the functional layer provided between the reflective layer and the counter electrode,
The insulating layer includes a first insulating layer, a second insulating layer, and a third insulating layer stacked in order from the reflective layer side,
The third pixel electrode is disposed on the third insulating layer;
The third film thickness of the insulating layer between the reflective layer and the counter electrode is different from the first film thickness and the second film thickness of the insulating layer,
5. The electro-optical device according to claim 1, wherein the step structure is formed in the insulating layer between the adjacent second pixel electrode and the third pixel electrode. 6. .   6. The electro-optical device according to claim 1, wherein the reflective layer is not provided between the substrate and the step structure on the substrate. A substrate,
A first pixel formed on the substrate;
A second pixel adjacent to the first pixel;
The first pixel includes a reflective layer having light reflectivity, a counter electrode having light reflectivity and light transmittance, an insulating layer provided between the reflective layer and the counter electrode, Including a pixel electrode and a functional layer including a light emitting layer,
The second pixel includes the reflective layer, the counter electrode, the insulating layer, the second pixel electrode, and the functional layer provided between the reflective layer and the counter electrode. A method for manufacturing an electro-optical device, comprising:
Forming the insulating layer over the first pixel and the second pixel;
The first film thickness of the insulating layer between the reflective layer and the first pixel electrode is different from the second film thickness of the insulating layer between the reflective layer and the second pixel electrode. Etching the insulating layer and etching the insulating layer between the adjacent first pixel electrode and the second pixel electrode to form a step structure;
Forming a first pixel electrode on the insulating layer having the first thickness, and forming a second pixel electrode on the insulating layer having the second thickness;
Forming the functional layer in contact with the first pixel electrode and the second pixel electrode;
And a step of forming the counter electrode covering the functional layer.   8. The step of etching the insulating layer includes etching the insulating layer between the adjacent first pixel electrode and the second pixel electrode to form a recess as the step structure. A method for manufacturing the electro-optical device according to claim 1.   The step of etching the insulating layer includes etching the insulating layer between the adjacent first pixel electrode and the second pixel electrode to form a convex portion as the step structure. A method for manufacturing the electro-optical device according to claim 7. In the step of forming the insulating layer, the first insulating layer, the second insulating layer, and the third insulating layer are stacked in order from the reflective layer side,
Etching the insulating layer, etching the third insulating layer to form a first opening at a position corresponding to the first pixel electrode and the second pixel electrode;
Etching the second insulating layer exposed in the first opening to form a second opening at a position corresponding to the first pixel electrode;
In the pixel electrode forming step, the first pixel electrode is formed on the first insulating layer in the second opening, and the second pixel electrode is formed on the second insulating layer in the first opening. The method of manufacturing an electro-optical device according to claim 7, wherein the electro-optical device is a manufacturing method. A third pixel formed on the substrate;
The third pixel includes the reflective layer, the counter electrode, the insulating layer, the third pixel electrode, and the functional layer provided between the reflective layer and the counter electrode,
In the step of etching the insulating layer, a third film thickness of the insulating layer between the reflective layer and the third pixel electrode, the first film thickness, and the second film thickness of the insulating layer. And the step of forming the step structure by etching the insulating layer and etching the insulating layer between the second pixel electrode and the third pixel electrode adjacent to each other. Item 11. The method for manufacturing an electro-optical device according to any one of Items 7 to 10. Forming the reflective layer on the substrate so as to correspond to the first pixel electrode, the second pixel electrode, and the third pixel electrode;
12. The method of manufacturing an electro-optical device according to claim 11, wherein the step of forming the reflective layer includes a step of removing the reflective layer between the substrate and the step structure.   An electronic apparatus comprising the electro-optical device according to claim 1.   An electronic apparatus comprising the electro-optical device formed using the method for manufacturing an electro-optical device according to claim 7.

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