JP2014522000A - 透明光インタポーザ - Google Patents
透明光インタポーザ Download PDFInfo
- Publication number
- JP2014522000A JP2014522000A JP2014524093A JP2014524093A JP2014522000A JP 2014522000 A JP2014522000 A JP 2014522000A JP 2014524093 A JP2014524093 A JP 2014524093A JP 2014524093 A JP2014524093 A JP 2014524093A JP 2014522000 A JP2014522000 A JP 2014522000A
- Authority
- JP
- Japan
- Prior art keywords
- oed
- optical
- interposer
- reflective surface
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 105
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000000835 fiber Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 description 32
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 15
- 238000004049 embossing Methods 0.000 description 10
- 238000001312 dry etching Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000001039 wet etching Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 7
- 238000010168 coupling process Methods 0.000 description 7
- 238000005859 coupling reaction Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001127 nanoimprint lithography Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
101 透明基板
102 第1面
103 第2面
104 反射面
105 溝
107 OED
108 光コンジット
200 インタポーザ
204 反射面
207 OED
208 光コンジット
300 インタポーザ
301 基板
304 反射面
305 溝
307a 検出器(OED)
308 光コンジット
330 第1層
331 エンボス材料層
450 インタポーザ
404 反射面
407 OED
408 光コンジット
Claims (9)
- 第1面及び第2面を有する透明基板と、
前記第1面に実装された少なくとも1個のOEDと、
前記第2面に画定された少なくとも1個の反射面及び少なくとも1個の溝と、
前記反射面により前記OEDに光結合された前記溝に配置された光コンジットと
を具備することを特徴とする光インタポーザ。 - 前記透明基板は、前記第1面を有する第1層と、前記第2面を有するエンボス加工層とを有することを特徴とする請求項1記載の光インタポーザ。
- 前記反射面が湾曲していることを特徴とする請求項2記載の光インタポーザ。
- 前記OEDはレンズを具備し、
前記反射面は平坦であることを特徴とする請求項1記載の光インタポーザ。 - 前記OEDは送信器であることを特徴とする請求項4記載の光インタポーザ。
- 前記OEDはレンズを具備し、
前記反射面は湾曲していることを特徴とする請求項1記載の光インタポーザ。 - 前記OEDは受信器であることを特徴とする請求項6記載の光インタポーザ。
- 前記光コンジットはファイバであることを特徴とする請求項1記載の光インタポーザ。
- 前記光コンジットは導波路であることを特徴とする請求項1記載の光インタポーザ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/197,004 US8818145B2 (en) | 2011-08-03 | 2011-08-03 | Optical interposer with transparent substrate |
US13/197,004 | 2011-08-03 | ||
PCT/US2012/049418 WO2013020007A1 (en) | 2011-08-03 | 2012-08-03 | Transparent optical interposer |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014522000A true JP2014522000A (ja) | 2014-08-28 |
Family
ID=46851577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014524093A Pending JP2014522000A (ja) | 2011-08-03 | 2012-08-03 | 透明光インタポーザ |
Country Status (6)
Country | Link |
---|---|
US (1) | US8818145B2 (ja) |
EP (1) | EP2739999A1 (ja) |
JP (1) | JP2014522000A (ja) |
CN (1) | CN103718076B (ja) |
TW (1) | TW201312191A (ja) |
WO (1) | WO2013020007A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020079862A (ja) * | 2018-11-13 | 2020-05-28 | 株式会社フジクラ | 光コネクタ部、光接続構造体、及び、光接続構造体の製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9529162B2 (en) | 2012-10-09 | 2016-12-27 | Corning Optical Communications LLC | Optical fiber connectors and methods of forming optical fiber connectors |
US9473239B2 (en) | 2013-08-22 | 2016-10-18 | Corning Cable Systems Llc | Systems and methods for aligning an optical interface assembly with an integrated circuit |
ES2660039T3 (es) | 2013-09-27 | 2018-03-20 | Sony Corporation | Dispositivo y método de comunicaciones |
CN103885140B (zh) * | 2014-04-15 | 2016-05-11 | 昆山柯斯美光电有限公司 | 芯片阵列与并行光纤被动耦合的光组件及其组装方法 |
EP3142811A1 (en) * | 2014-05-15 | 2017-03-22 | Nanoprecision Products, Inc. | Optical connection of optical fibers to grating couplers |
US9709748B2 (en) * | 2015-09-03 | 2017-07-18 | International Business Machines Corporation | Frontside coupled waveguide with backside optical connection using a curved spacer |
US10168494B2 (en) * | 2016-11-30 | 2019-01-01 | International Business Machines Corporation | Off-axis micro-mirror arrays for optical coupling in polymer waveguides |
CN106936048B (zh) * | 2017-01-20 | 2019-05-28 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 光学投影布线成形装置 |
CN107991743A (zh) * | 2018-01-11 | 2018-05-04 | 绍兴柯芯光电技术有限公司 | 一种集成plc平面波导型器件的光收发模块 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600741A (en) * | 1994-05-11 | 1997-02-04 | Ant Nachrichtentechnik Gmbh | Arrangement for coupling optoelectronic components and optical waveguides to one another |
JPH11344648A (ja) * | 1998-05-07 | 1999-12-14 | Trw Inc | ファイバ/導波路―鏡―レンズアラインメント装置 |
JP2001174671A (ja) * | 1999-12-16 | 2001-06-29 | Japan Aviation Electronics Industry Ltd | 光素子モジュール |
WO2005010585A1 (ja) * | 2003-07-28 | 2005-02-03 | Matsushita Electric Works, Ltd. | 光導波路モジュールの製造方法、及び光導波路モジュール |
US20080226221A1 (en) * | 2007-03-13 | 2008-09-18 | Serge Bidnyk | Integrated reflector for planar lightwave circuits |
JP2010135630A (ja) * | 2008-12-05 | 2010-06-17 | Hamamatsu Photonics Kk | 光素子モジュール及びその製造方法 |
Family Cites Families (15)
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US5018164A (en) | 1989-09-12 | 1991-05-21 | Hughes Aircraft Company | Excimer laser ablation method and apparatus for microcircuit fabrication |
US6017681A (en) * | 1992-11-09 | 2000-01-25 | Fujitsu Limited | Method of coupling optical parts and method of forming a mirror |
CN1125358C (zh) * | 1995-08-03 | 2003-10-22 | 松下电器产业株式会社 | 光学装置及光纤组件 |
JP3715425B2 (ja) * | 1998-03-06 | 2005-11-09 | ブラザー工業株式会社 | 光導波路付基板の製造方法 |
US5853960A (en) | 1998-03-18 | 1998-12-29 | Trw Inc. | Method for producing a micro optical semiconductor lens |
JP2002258081A (ja) * | 2001-02-28 | 2002-09-11 | Fujitsu Ltd | 光配線基板、光配線基板の製造方法及び多層光配線 |
US6869229B2 (en) | 2001-03-16 | 2005-03-22 | Peregrine Semiconductor Corporation | Coupled optical and optoelectronic devices, and method of making the same |
JP2003167175A (ja) * | 2001-12-04 | 2003-06-13 | Matsushita Electric Ind Co Ltd | 光実装基板及び光デバイス |
JP2003307603A (ja) | 2002-02-15 | 2003-10-31 | Omron Corp | 光学素子及び当該素子を用いた光学部品 |
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JP2004240220A (ja) * | 2003-02-06 | 2004-08-26 | Seiko Epson Corp | 光モジュール及びその製造方法、混成集積回路、混成回路基板、電子機器、光電気混載デバイス及びその製造方法 |
US7263248B2 (en) * | 2003-02-11 | 2007-08-28 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical via to pass signals through a printed circuit board |
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US8611716B2 (en) * | 2009-09-30 | 2013-12-17 | Corning Incorporated | Channeled substrates for integrated optical devices employing optical fibers |
-
2011
- 2011-08-03 US US13/197,004 patent/US8818145B2/en not_active Expired - Fee Related
-
2012
- 2012-08-03 EP EP12759288.9A patent/EP2739999A1/en not_active Withdrawn
- 2012-08-03 JP JP2014524093A patent/JP2014522000A/ja active Pending
- 2012-08-03 WO PCT/US2012/049418 patent/WO2013020007A1/en unknown
- 2012-08-03 CN CN201280038120.XA patent/CN103718076B/zh not_active Expired - Fee Related
- 2012-08-03 TW TW101127946A patent/TW201312191A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600741A (en) * | 1994-05-11 | 1997-02-04 | Ant Nachrichtentechnik Gmbh | Arrangement for coupling optoelectronic components and optical waveguides to one another |
JPH11344648A (ja) * | 1998-05-07 | 1999-12-14 | Trw Inc | ファイバ/導波路―鏡―レンズアラインメント装置 |
JP2001174671A (ja) * | 1999-12-16 | 2001-06-29 | Japan Aviation Electronics Industry Ltd | 光素子モジュール |
WO2005010585A1 (ja) * | 2003-07-28 | 2005-02-03 | Matsushita Electric Works, Ltd. | 光導波路モジュールの製造方法、及び光導波路モジュール |
US20080226221A1 (en) * | 2007-03-13 | 2008-09-18 | Serge Bidnyk | Integrated reflector for planar lightwave circuits |
JP2010135630A (ja) * | 2008-12-05 | 2010-06-17 | Hamamatsu Photonics Kk | 光素子モジュール及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020079862A (ja) * | 2018-11-13 | 2020-05-28 | 株式会社フジクラ | 光コネクタ部、光接続構造体、及び、光接続構造体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130034325A1 (en) | 2013-02-07 |
WO2013020007A1 (en) | 2013-02-07 |
CN103718076B (zh) | 2016-05-25 |
TW201312191A (zh) | 2013-03-16 |
US8818145B2 (en) | 2014-08-26 |
EP2739999A1 (en) | 2014-06-11 |
CN103718076A (zh) | 2014-04-09 |
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