JP2014507671A5 - - Google Patents
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- Publication number
- JP2014507671A5 JP2014507671A5 JP2013557828A JP2013557828A JP2014507671A5 JP 2014507671 A5 JP2014507671 A5 JP 2014507671A5 JP 2013557828 A JP2013557828 A JP 2013557828A JP 2013557828 A JP2013557828 A JP 2013557828A JP 2014507671 A5 JP2014507671 A5 JP 2014507671A5
- Authority
- JP
- Japan
- Prior art keywords
- tube
- temperature
- microwire
- primary
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005291 magnetic effect Effects 0.000 claims description 10
- 230000005417 remagnetization Effects 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 11
- 239000000919 ceramic Substances 0.000 claims 2
- 238000001514 detection method Methods 0.000 claims 2
- 230000005415 magnetization Effects 0.000 claims 2
- 230000005298 paramagnetic effect Effects 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 229920003002 synthetic resin Polymers 0.000 claims 2
- 239000000057 synthetic resin Substances 0.000 claims 2
- 239000002023 wood Substances 0.000 claims 2
- 238000004880 explosion Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000010354 integration Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161464682P | 2011-03-09 | 2011-03-09 | |
| US61/464,682 | 2011-03-09 | ||
| US13/411,767 | 2012-03-05 | ||
| US13/411,767 US9212955B2 (en) | 2011-03-09 | 2012-03-05 | Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors |
| PCT/US2012/028058 WO2012122258A2 (en) | 2011-03-09 | 2012-03-07 | Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014507671A JP2014507671A (ja) | 2014-03-27 |
| JP2014507671A5 true JP2014507671A5 (https=) | 2015-04-02 |
| JP5918278B2 JP5918278B2 (ja) | 2016-05-18 |
Family
ID=46795552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013557828A Active JP5918278B2 (ja) | 2011-03-09 | 2012-03-07 | 応力に関連した温度測定誤差を除去するように構成されたマイクロワイヤ温度センサおよびそのセンサの製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9212955B2 (https=) |
| EP (1) | EP2684014B1 (https=) |
| JP (1) | JP5918278B2 (https=) |
| CN (1) | CN103718010B (https=) |
| AU (1) | AU2012225525B2 (https=) |
| CA (1) | CA2828774C (https=) |
| ES (1) | ES2665945T3 (https=) |
| IL (1) | IL228288B (https=) |
| WO (1) | WO2012122258A2 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7385357B2 (en) | 1999-06-21 | 2008-06-10 | Access Business Group International Llc | Inductively coupled ballast circuit |
| KR101656115B1 (ko) | 2009-01-06 | 2016-09-08 | 액세스 비지니스 그룹 인터내셔날 엘엘씨 | 스마트 조리 기구 |
| JP6144620B2 (ja) | 2010-04-08 | 2017-06-07 | アクセス ビジネス グループ インターナショナル リミテッド ライアビリティ カンパニー | ＰＯＳ（ｐｏｉｎｔｏｆｓａｌｅ）誘導性システムと方法 |
| FR2988172B1 (fr) * | 2012-03-19 | 2014-12-26 | Sc2N Sa | Capteur de temperature |
| ES2555542B1 (es) * | 2014-05-27 | 2016-10-19 | Consejo Superior De Investigaciones Científicas (Csic) | Sensor embebido para la medida continua de resistencias mecánicas en estructuras de material cementicio, método de fabricación del mismo, y sistema y método de medida continua de resistencias mecánicas en estructuras de material cementicio |
| DE102018222111A1 (de) | 2018-12-18 | 2020-06-18 | Schott Ag | Ofen, insbesondere Kühlofen |
| EP4419314A4 (en) * | 2021-10-20 | 2025-11-19 | Tsi Tech Llc | IN-SITU MONITORING AND CONTROL OF INDUCTION WELDING OF THERMOPLASTIC COMPOSITES USING AMORPHIC OR NANOCRYSTALLINE MICROWIRE TEMPERATURE SENSORS AND SELF-CENTERING ANTENNA RAIL SYSTEM |
| CN117276846B (zh) * | 2023-11-02 | 2024-03-05 | 广州博远装备科技有限公司 | 一种基于形状记忆合金的自适应短波天线 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2047539C3 (de) * | 1970-09-26 | 1973-09-20 | Gesellschaft Fuer Kernforschung Mbh, 7500 Karlsruhe | Thermoelement |
| SU832505A2 (ru) * | 1979-03-05 | 1981-05-23 | Казанский Ордена Трудового Красного Зна-Мени Авиационный Институт Им.A.H.Туполева | Нановеберметр |
| JPH0575631U (ja) * | 1992-03-17 | 1993-10-15 | ティーディーケイ株式会社 | 温度センサ |
| JPH1183641A (ja) * | 1997-09-08 | 1999-03-26 | Kurabe Ind Co Ltd | ガラス封止型サーミスタ |
| JP2000146714A (ja) * | 1998-11-06 | 2000-05-26 | Oji Paper Co Ltd | 蒸解釜用温度検出器 |
| US6208253B1 (en) * | 2000-04-12 | 2001-03-27 | Massachusetts Institute Of Technology | Wireless monitoring of temperature |
| EP2021752B8 (en) * | 2006-05-09 | 2018-04-11 | TSI Technologies LLC | Magnetic element temperature sensors |
| US7794142B2 (en) | 2006-05-09 | 2010-09-14 | Tsi Technologies Llc | Magnetic element temperature sensors |
| US8258441B2 (en) | 2006-05-09 | 2012-09-04 | Tsi Technologies Llc | Magnetic element temperature sensors |
| US7736052B2 (en) | 2006-08-11 | 2010-06-15 | Beadedstream, Llc | Multipoint digital temperature acquisition system |
| US8192080B2 (en) | 2007-01-23 | 2012-06-05 | Tsi Technologies Llc | Microwire-controlled autoclave and method |
| US8033715B2 (en) * | 2007-11-08 | 2011-10-11 | Illinois Institute Of Technology | Nanoparticle based thermal history indicators |
| JP5049879B2 (ja) * | 2008-05-28 | 2012-10-17 | 株式会社デンソー | 温度センサ |
| US8286497B2 (en) | 2009-06-25 | 2012-10-16 | Tsi Technologies Llc | Strain sensor |
| US8485723B2 (en) * | 2009-08-12 | 2013-07-16 | Tsi Technologies Llc | One-time sensor device |
-
2012
- 2012-03-05 US US13/411,767 patent/US9212955B2/en active Active
- 2012-03-07 AU AU2012225525A patent/AU2012225525B2/en not_active Ceased
- 2012-03-07 CA CA2828774A patent/CA2828774C/en active Active
- 2012-03-07 JP JP2013557828A patent/JP5918278B2/ja active Active
- 2012-03-07 EP EP12754370.0A patent/EP2684014B1/en active Active
- 2012-03-07 ES ES12754370.0T patent/ES2665945T3/es active Active
- 2012-03-07 CN CN201280012248.9A patent/CN103718010B/zh active Active
- 2012-03-07 WO PCT/US2012/028058 patent/WO2012122258A2/en not_active Ceased
-
2013
- 2013-09-03 IL IL228288A patent/IL228288B/en active IP Right Grant
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