CA2828774C - Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors - Google Patents

Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors Download PDF

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Publication number
CA2828774C
CA2828774C CA2828774A CA2828774A CA2828774C CA 2828774 C CA2828774 C CA 2828774C CA 2828774 A CA2828774 A CA 2828774A CA 2828774 A CA2828774 A CA 2828774A CA 2828774 C CA2828774 C CA 2828774C
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Canada
Prior art keywords
microwire
temperature
primary
tube
sensor
Prior art date
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CA2828774A
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English (en)
French (fr)
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CA2828774A1 (en
Inventor
Brian L. Clothier
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TSI Technologies LLC
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TSI Technologies LLC
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Publication of CA2828774A1 publication Critical patent/CA2828774A1/en
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/36—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using magnetic elements, e.g. magnets, coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08—Protective devices, e.g. casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K15/00—Testing or calibrating of thermometers
    • G01K15/005—Calibration

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Measuring Fluid Pressure (AREA)
CA2828774A 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors Active CA2828774C (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161464682P 2011-03-09 2011-03-09
US61/464,682 2011-03-09
US13/411,767 2012-03-05
US13/411,767 US9212955B2 (en) 2011-03-09 2012-03-05 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors
PCT/US2012/028058 WO2012122258A2 (en) 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors

Publications (2)

Publication Number Publication Date
CA2828774A1 CA2828774A1 (en) 2012-09-13
CA2828774C true CA2828774C (en) 2019-04-09

Family

ID=46795552

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2828774A Active CA2828774C (en) 2011-03-09 2012-03-07 Microwire temperature sensors constructed to eliminate stress-related temperature measurement inaccuracies and method of manufacturing said sensors

Country Status (9)

Country Link
US (1) US9212955B2 (https=)
EP (1) EP2684014B1 (https=)
JP (1) JP5918278B2 (https=)
CN (1) CN103718010B (https=)
AU (1) AU2012225525B2 (https=)
CA (1) CA2828774C (https=)
ES (1) ES2665945T3 (https=)
IL (1) IL228288B (https=)
WO (1) WO2012122258A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7385357B2 (en) 1999-06-21 2008-06-10 Access Business Group International Llc Inductively coupled ballast circuit
KR101656115B1 (ko) 2009-01-06 2016-09-08 액세스 비지니스 그룹 인터내셔날 엘엘씨 스마트 조리 기구
JP6144620B2 (ja) 2010-04-08 2017-06-07 アクセス ビジネス グループ インターナショナル リミテッド ライアビリティ カンパニー ＰＯＳ（ｐｏｉｎｔｏｆｓａｌｅ）誘導性システムと方法
FR2988172B1 (fr) * 2012-03-19 2014-12-26 Sc2N Sa Capteur de temperature
ES2555542B1 (es) * 2014-05-27 2016-10-19 Consejo Superior De Investigaciones Científicas (Csic) Sensor embebido para la medida continua de resistencias mecánicas en estructuras de material cementicio, método de fabricación del mismo, y sistema y método de medida continua de resistencias mecánicas en estructuras de material cementicio
DE102018222111A1 (de) 2018-12-18 2020-06-18 Schott Ag Ofen, insbesondere Kühlofen
EP4419314A4 (en) * 2021-10-20 2025-11-19 Tsi Tech Llc IN-SITU MONITORING AND CONTROL OF INDUCTION WELDING OF THERMOPLASTIC COMPOSITES USING AMORPHIC OR NANOCRYSTALLINE MICROWIRE TEMPERATURE SENSORS AND SELF-CENTERING ANTENNA RAIL SYSTEM
CN117276846B (zh) * 2023-11-02 2024-03-05 广州博远装备科技有限公司 一种基于形状记忆合金的自适应短波天线

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2047539C3 (de) * 1970-09-26 1973-09-20 Gesellschaft Fuer Kernforschung Mbh, 7500 Karlsruhe Thermoelement
SU832505A2 (ru) * 1979-03-05 1981-05-23 Казанский Ордена Трудового Красного Зна-Мени Авиационный Институт Им.A.H.Туполева Нановеберметр
JPH0575631U (ja) * 1992-03-17 1993-10-15 ティーディーケイ株式会社 温度センサ
JPH1183641A (ja) * 1997-09-08 1999-03-26 Kurabe Ind Co Ltd ガラス封止型サーミスタ
JP2000146714A (ja) * 1998-11-06 2000-05-26 Oji Paper Co Ltd 蒸解釜用温度検出器
US6208253B1 (en) * 2000-04-12 2001-03-27 Massachusetts Institute Of Technology Wireless monitoring of temperature
EP2021752B8 (en) * 2006-05-09 2018-04-11 TSI Technologies LLC Magnetic element temperature sensors
US7794142B2 (en) 2006-05-09 2010-09-14 Tsi Technologies Llc Magnetic element temperature sensors
US8258441B2 (en) 2006-05-09 2012-09-04 Tsi Technologies Llc Magnetic element temperature sensors
US7736052B2 (en) 2006-08-11 2010-06-15 Beadedstream, Llc Multipoint digital temperature acquisition system
US8192080B2 (en) 2007-01-23 2012-06-05 Tsi Technologies Llc Microwire-controlled autoclave and method
US8033715B2 (en) * 2007-11-08 2011-10-11 Illinois Institute Of Technology Nanoparticle based thermal history indicators
JP5049879B2 (ja) * 2008-05-28 2012-10-17 株式会社デンソー 温度センサ
US8286497B2 (en) 2009-06-25 2012-10-16 Tsi Technologies Llc Strain sensor
US8485723B2 (en) * 2009-08-12 2013-07-16 Tsi Technologies Llc One-time sensor device

Also Published As

Publication number Publication date
CN103718010A (zh) 2014-04-09
CN103718010B (zh) 2016-03-16
IL228288B (en) 2018-01-31
ES2665945T3 (es) 2018-04-30
CA2828774A1 (en) 2012-09-13
JP5918278B2 (ja) 2016-05-18
US9212955B2 (en) 2015-12-15
EP2684014B1 (en) 2018-02-28
US20120230365A1 (en) 2012-09-13
EP2684014A2 (en) 2014-01-15
EP2684014A4 (en) 2015-03-04
JP2014507671A (ja) 2014-03-27
AU2012225525B2 (en) 2015-03-05
WO2012122258A3 (en) 2012-12-13
WO2012122258A2 (en) 2012-09-13
AU2012225525A1 (en) 2013-09-26

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