JP2014235820A5

JP2014235820A5 -

Info

Publication number: JP2014235820A5
Application number: JP2013115350A
Authority: JP
Filing date: 2013-05-31
Publication date: 2015-07-30
Anticipated expiration: 2033-05-31

Description

しかしながら、セラミック板がＬＥＤ基板と筐体の間に介在することで、ＬＥＤ基板から筐体への熱の伝達が阻害され、放熱性能が低下するという問題がある。
本発明は、上述した事情に鑑みてなされたものであり、光源の発光素子の高い放熱性能を得つつ、高い耐電圧性能を得ることができる照明器具を提供することを目的とする。 However, since the ceramic plate is interposed between the LED substrate and the housing, there is a problem that heat transfer from the LED substrate to the housing is hindered and heat dissipation performance is deteriorated.
This invention is made | formed in view of the situation mentioned above, and it aims at providing the lighting fixture which can obtain high withstand voltage performance, obtaining the high heat dissipation performance of the light emitting element of a light source.

上記目的を達成するために、本発明は、発光素子が実装された発光素子基板を有した光源と、筐体と、を備え、屋外、又は屋内を照明する照明器具において、前記発光素子基板が取り付けられ、前記発光素子基板に実装された前記発光素子の熱が伝熱される高熱伝導性材から成る基板取付部材を備え、前記筐体には、前記基板取付部材の一部を前記筐体の外に露出した状態で前記基板取付部材が係合する係合孔が設けられ、前記基板取付部材と前記筐体の係合孔との間に防水及び電気的絶縁をする絶縁パッキンが介在することを特徴とする。 To achieve the above object, the present invention includes a light source having a light emitting element substrate over which a light-emitting element is mounted, comprising a housing and, outdoor, or in luminaires for illuminating the indoor, the light emitting element substrate And a substrate mounting member made of a high thermal conductivity material to which heat of the light emitting element mounted on the light emitting element substrate is transferred. The housing includes a part of the substrate mounting member. An engagement hole for engaging the substrate mounting member in an exposed state is provided, and an insulating packing for waterproofing and electrical insulation is interposed between the substrate mounting member and the engagement hole of the housing. It is characterized by.

また本発明は、上記照明器具において、前記基板取付部材は、前記筐体の外側に前記係合孔から突出し前記発光素子基板の熱を放熱する放熱部を備えることを特徴とする。
また本発明は、上記照明器具において、複数の前記基板取付部材の放熱部を所定の円の内側を除いて当該円の円周に沿って配置したことを特徴とする。 Moreover, the present invention is characterized in that, in the above-described lighting fixture, the substrate attachment member includes a heat radiating portion that protrudes from the engagement hole and radiates heat of the light emitting element substrate outside the housing.
Moreover, the present invention is characterized in that, in the above-mentioned lighting fixture, the heat dissipating portions of the plurality of board mounting members are arranged along the circumference of the circle except for the inside of a predetermined circle.

Claims

In a lighting fixture that includes a light source having a light emitting element substrate on which a light emitting element is mounted, and a housing, and illuminates outdoors or indoors ,
The light emitting element substrate is mounted, and includes a substrate mounting member made of a high thermal conductivity material to which heat of the light emitting element mounted on the light emitting element substrate is transferred,
The housing is provided with an engagement hole with which the substrate mounting member is engaged with a part of the substrate mounting member exposed to the outside of the housing.
An illuminating device characterized in that an insulating packing for waterproofing and electrical insulation is interposed between the board mounting member and the engagement hole of the housing.

The lighting apparatus according to claim 1, wherein the board attaching member includes a heat radiating portion that protrudes from the engagement hole and radiates heat of the light emitting element substrate outside the housing.

The lighting apparatus according to claim 2, wherein the heat dissipating portions of the plurality of board mounting members are arranged along the circumference of the circle except for the inside of a predetermined circle.

4. The illumination according to claim 2 , wherein the heat dissipating unit includes a heat dissipating fin disposed outside the housing and a heat pipe that transfers heat of the light emitting element substrate to the heat dissipating fin. 5. Instruments.

The substrate mounting member includes a pipe groove through which the heat pipe passes,
The lighting device according to claim 4 , wherein a cross section of the pipe groove is matched with a shape of an outer peripheral surface after thermal deformation caused by heating the heat pipe in accordance with a surface treatment.